KR101787197B1 - Fluid process dealing device - Google Patents

Fluid process dealing device Download PDF

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KR101787197B1
KR101787197B1 KR1020150132689A KR20150132689A KR101787197B1 KR 101787197 B1 KR101787197 B1 KR 101787197B1 KR 1020150132689 A KR1020150132689 A KR 1020150132689A KR 20150132689 A KR20150132689 A KR 20150132689A KR 101787197 B1 KR101787197 B1 KR 101787197B1
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collecting
plate
liquid
ring
collection
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KR20160090733A (en
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추안-창 펭
마오-린 리우
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사이언테크 코포레이션
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
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Abstract

The fluid processing apparatus includes a base, a rotating motor, a substrate fixing part, a collecting part, and a liquid supplying part. The collecting section includes a collecting exchange module, an ascending and descending module and a bottom collecting plate, wherein the collecting exchange module includes a plurality of collecting rings and is installed in order radially, and the ascending and descending module includes a plurality of lifting devices, The bottom collecting plate is installed under the collecting ring module and has a plurality of liquid discharging ports and at least one gas discharging port. The fluid processing apparatus can simplify the structural design and prevent contamination of each other between different fluids.

Figure R1020150132689

Description

[0001] FLUID PROCESS DEALING DEVICE [0002]

The present disclosure relates to a fluid processing apparatus, and more particularly, to a fluid processing apparatus that prevents contamination of one another with respect to each other.

(Such as chemical or deionized water) supplied to the surface of a substrate by a substrate processing system during the manufacturing process of the substrate, such as a semiconductor wafer, a solar energy substrate, a display glass substrate, and an LED substrate, However, in the processing system of the substrate, the processing liquid used as the liquid processing apparatus must be subjected to subsequent processing such as collection, liquid discharge, and recovery.

A conventional substrate processing system generally includes a substrate fixing part, a rotating part, a liquid supplying part and a collecting part, wherein the substrate fixing part is installed in the rotation part and the rotation part can lead to rotation of the substrate fixing part, And the liquid supply part is installed in the substrate fixing part to load a substrate supply processing solution (for example, HCl) of the substrate fixing part, and the collecting part surrounds the outside of the rotation part and the substrate fixing part.

Among them, the collecting part includes a plurality of collection rings, and the plurality of collecting rings necessarily perform the lifting operation using the driving of the external lifting mechanism, and when the different liquid collecting is performed, And can be discharged to the liquid discharge pipe in the downward direction of each collection ring in accordance with the guide of the collection ring. However, the external elevator system necessarily leads to each collection ring by an additional leather belt, screw, motor, etc., resulting in complicated structure and high cost. In addition, there is a possibility of contamination among the collection rings.

Thus, it is currently the most important goal to provide a fluid processing apparatus that prevents contamination of one another with each other.

The present invention provides a fluid processing apparatus, wherein a plurality of collection rings can be independently lifted and lowered to simplify the design of the apparatus. Preferably, the unoccupied collecting rings can be blocked to prevent contamination of each other between the different fluids.

A fluid processing process of an embodiment of the present invention is applied to a processing process of a substrate, and the processing unit includes a substrate, a rotating motor, a substrate fixing unit, a collecting unit, and a liquid supplying unit. The rotary motor is installed on the base. The substrate fixing part is installed in a rotary motor, and the substrate fixing part includes a loading platform and a fixing device. The loading platform is used to load the substrate and fix the substrate using a fixing window; The collecting part is installed on the base and surrounds the substrate fixing part. The collecting part includes a collecting ring module, an elevating module and a bottom collecting plate, the collecting ring module including a plurality of collecting rings and sequentially radially installed, the elevating module including a plurality of racks, And the bottom collecting plate is installed below the collecting ring module and the bottom of the bottom collecting plate includes a plurality of liquid discharging ports and at least one gas discharging port do. The liquid supply portion is installed on the base and supplies the processing liquid to the substrate.

BRIEF DESCRIPTION OF THE DRAWINGS The above and other objects, features and advantages of the present invention will become more apparent from the following detailed description of the present invention when taken in conjunction with the accompanying drawings.

BRIEF DESCRIPTION OF THE DRAWINGS Figure 1 shows a schematic cross-sectional view of the internal structure of a collection section of a fluid processing apparatus according to an embodiment of the present invention.
2 shows a schematic cross-sectional view of the internal structure of a collection portion of a fluid processing apparatus according to an embodiment of the present invention.
3 shows a schematic cross-sectional view of the operating state inside the collection section when adding the treatment liquid to the substrate in the fluid processing apparatus according to an embodiment of the present invention.
Fig. 4 shows a schematic cross-sectional view of the operating state inside the collection section when adding the treatment liquid to the substrate in the fluid processing apparatus according to an embodiment of the present invention.
Fig. 5 shows a schematic cross-sectional view of the operating state inside the collection section when adding the treatment liquid to the substrate in the fluid processing apparatus according to an embodiment of the present invention.
Figure 6 shows a schematic cross-sectional view of the operating state inside the collection section when adding the treatment liquid to the substrate in the fluid processing apparatus according to one embodiment of the present invention.

The embodiments of the present invention will be described in detail below with reference to the accompanying drawings. In addition to the above detailed description, the present invention can be widely practiced in other embodiments, and all changes, substitutions, modifications, and variations of any of the above embodiments are included in the scope of the present invention and are based on the claims. Although the reader of the specification has provided many specific details to enable a relatively complete understanding of the present invention, the present invention may still be practiced on the premise of omitting some or all of the specific details. In addition, all known steps or elements are not described in detail in order to avoid forming unnecessary limitations in the present invention. In the drawings, the same or similar elements are denoted by the same or similar reference numerals. It should be noted that the drawings are merely exemplary in nature and do not represent the actual dimensions or quantities of the elements, and some of the details may not be fully drawn in order to simplify the drawings.

1 and 2, there is shown a schematic cross-sectional view (1) of the internal structure of a collection portion of a fluid processing apparatus according to an embodiment of the present invention, and Fig. 2 is a cross- (2) of the internal structure of the collecting portion of the fluid processing apparatus according to the present invention. The fluid processing apparatus of the present invention is applied to the processing of the substrate W and the fluid processing apparatus includes the base 10, the rotary motor 20, the substrate fixing unit 30, the collecting unit 40, And a liquid supply part 50. [ Note that, in this embodiment, the appearance of the collecting portion 40 of the fluid processing apparatus is generally cylindrical, and the internal rotating motor 20 drives the substrate fixing portion 30 to rotate about the axis Z, The left and right sides of the axis Z are radial sectional views in which the center line of the collecting portion 40 is different from each other and the special structure of the collecting portion 40 is moved to the same plane By clearly showing the uniform cross section, the technical content of the present invention will be explained by the section of this type one step further.

The rotary motor 20 is installed on the base 10.

The substrate fixing unit 30 is installed in the rotary motor 20 and the substrate fixing unit 30 includes a loading platform 31 and a fixing device 32. The loading platform 31 loads the substrate W And fixes the substrate W using the fixing device 32. [ For example, the fixing device 32 may be a vacuum device, the fixing device 32 may adsorb and fix the substrate W by using a vacuum device, and form a negative pressure on the back surface of the substrate W by a vacuum device, (W) can be adsorbed

The collecting part 40 is installed on the base 10 and surrounds the substrate fixing part 30 and the collecting part 40 includes a collecting exchange module 41, an elevating module 42 and a bottom collecting plate 43 do. The collecting exchange module 41 includes a plurality of collecting rings and is arranged radially in order to form an annular gas passage between adjacent collecting rings. The elevating and lowering module 42 includes a plurality of lifting devices, And the lower collecting part 43 is installed below the collecting exchange module 41 and the lower collecting part 43 is connected to the lower collecting part 43. [ The bottom portion includes a plurality of liquid outlets (431) and at least one gas outlets (432).

The liquid supply part 50 may add different process liquids to the substrate W. [ Since the liquid supply portion 50 can be realized in the conventional manner, a detailed description of the liquid supply portion 50 is omitted. The liquid supply section 50 may include a plurality of pipelines and may be separately added and cleaned separately to avoid cross contamination during the process.

The fluid processing apparatus of the present invention connects the external gas discharging device (not shown) to the gas discharging port 432 of the lower collecting plate 43 of the collecting part 40 so that the external gas discharging device is connected to the lower collecting plate 43 And the cross sectional area of the annular gas passage formed between the equal collecting rings in the collecting exchange module 41 is so small that the gas located around the substrate W The entire annular gas passage is caused to flow to the bottom collecting plate 43 and the gas flow range around the substrate W is uniformly generated in the direction of the gas outlet 432 along the annular gas passage formed between the equally- Thereby achieving the effect of uniformly discharging the gas.

Specifically, in this embodiment, the collecting exchange module 41 includes a first collecting ring 411, a second collecting ring 412 and a third collecting ring 413, and the first collecting ring 411, The second collecting ring 412 and the third collecting ring 413 are arranged in a radially outward order. A first shielding plate 411d, a second shielding plate 412b, and a third shielding plate 413a are provided on the first collecting ring 411, the second collecting ring 412 and the third collecting ring 413, ). The narrowing angle of the first shielding plate 411d, the second shielding plate 412b and the third shielding plate 413a with respect to the plane on which the substrate W is placed is smaller than 90 degrees and the splash of the processing liquid is reduced. In one embodiment, the coarse angle is less than 60 degrees, 45 degrees, 30 degrees. The first collection ring 411 includes a first annular sump 411a and a second annular sump 411b and the first annular sump 411a and the second annular sump 411b are connected to a first shielding plate 411a, And is installed on the inside and the outside of the casing 411d. The second collection ring 412 includes a third annular sump 412a and a second protrusion 412c among which the third annular sump 412a is installed on the outside of the second shielding plate 412b, The second protrusion 412c extends into the second annular sump 411b along the inner surface bottom portion of the collection ring 412 and the walls of the second protrusion 412c and the second annular sump 411b extend radially The top part overlaps in the direction. The third collecting ring 413 includes a third protrusion 413b and a fourth protrusion 413c extending downward from the inner surface and the outer surface of the third shielding plate 413a, 413b extend to the inside of the third annular sump 412a and the fourth projection 413c is located outside the third annular sump 412a and the third projection 413b and the fourth projection 413c and the third annular sump 412b, The upper wall of the wall 412a overlaps in the radial direction.

It can be understood that the collection exchange module 41 can modify the design according to different requirements. Although the collecting exchange module 41 including the first collecting ring 411, the second collecting ring 412 and the third collecting ring 413 is described as an example in the above embodiment, the present invention is not limited thereto. For example, if the second collection ring 412 is omitted, the collection exchange module 41 can realize the present invention by including only the first collection ring 411 and the third collection ring 413, The third protrusion 413b of the third collection ring 413 extends into the second annular sump 411b and the fourth protrusion 413c is outside the second annular sump 411b. In the same manner, a plurality of second collection rings 412 may be provided between the first collection ring 411 and the third collection ring 413. [

Subsequently, in this embodiment, the lift module 42 includes a first liquid gas discharge cylinder 421, a second liquid gas discharge cylinder 422, and a first elevator cylinder 423. The first liquid gas discharge cylinder 421 is installed at the lower part of the second annular sump 411b of the first collecting ring 411 and the first liquid gas discharge cylinder 421 is provided at the lower part of the first pressure gas cylinder 4211, And the first hole shaft 4212 is provided in the first pressure type cylinder 4211 and the first hole shaft 4212 is disposed in the second annular sump 411b in the lower portion of the lower collecting plate 4211. [ The first pneumatic cylinder 4211 of the first liquid gas discharge cylinder 421 can control the ascending and descending of the first collecting ring 411, The processing liquid which has entered the sump 411b is concentrated on the corresponding liquid discharge port 431 by the first hole shaft 4212 and flows into the first collecting ring 411 and the second collecting ring 412 Recall. The second liquid gas discharge cylinder 422 is installed at the bottom of the third annular sump 412a of the second collecting ring 412 and the second liquid gas discharge cylinder 422 is disposed at the bottom of the second pneumatic cylinder 4221 and a second hollow shaft 4222 and the second hole shaft 4222 is installed in the second pneumatic cylinder 4221 and the second hole shaft 4222 is disposed in the third annular sump 412a to the bottom The second pneumatic cylinder 4221 of the second liquid gas discharge cylinder 422 can control the lifting and lowering of the second collecting ring 412 by connecting to the liquid discharge port 431 in the collecting plate 43, The treatment liquid which has entered the three-ring sump 412a is concentrated in the corresponding liquid discharge port 431 by the second hole shaft 4222 and is introduced into the second collecting ring 412 and the third collecting ring 413 The liquid is recovered. The first elevator cylinder 423 is connected to the third collecting ring 413 to control the ascending and descending of the third collecting ring 413.

In this embodiment, the equal collection ring of the collection exchange module 41 may further include an outer shielding plate 414, the outer shielding plate 414 may be installed outside the third collection ring 413, The second lift cylinder 424 is connected to the outer shielding plate 414 to control the lifting and lowering of the outer shielding plate 414. [

The first annular sump 411a, the second annular sump 411b and the third annular sump 412a are all annular and in the cross-sectional view of the fluid processing apparatus, the left and right sides of the axis Z, The one annular sump 411a is connected to each other and the left and right second annular sump 411b of the axis Z are connected to each other and the left and right third annular sump 412a of the axis Z are also connected to each other.

Thus, the first collecting ring 411, the second collecting ring 412 and the third collecting ring 413 are connected to the first liquid gas discharge cylinder 421, the second liquid gas discharge cylinder 422 The first liquid gas discharging cylinder 421 and the second liquid gas discharging cylinder 422 can be moved up and down by the first elevating mechanism cylinder 423 and the second elevating mechanism cylinder 422. [ At the same time, the processing liquid which has become the liquid discharge pipe and enters the second annular sump 411b and the third annular sump 412a can be guided and recovered by the corresponding liquid discharge port 431, Can be collected.

In this embodiment, the first collecting ring 411 further includes a stretchable liquid discharge pipe 411c, and the stretchable liquid discharge pipe 411c is connected to the liquid discharge port 411b in the first annular sump 411a, And the first liquid gas discharge cylinder 421 is extended when the first liquid gas discharge cylinder 421 is led to the first collecting ring 411 and the first liquid gas discharge cylinder 421 is connected to the first liquid gas discharge cylinder 431. [ The processing liquid which has entered the first annular sump 411a by keeping the connection from the first annular sump 411a to the liquid discharge port 431 corresponding to the lower collecting plate 43 is reduced when leading to the lowering of the collecting ring 411, And can be concentrated and recovered to the corresponding liquid discharge port 431 by the elastic liquid discharge pipe 411c.

The gas processing system further includes a gas box 70 which is connected to the lower portion gas outlet 432 of the lower collecting plate 43 and the gas box 70 is connected to the outside And is connected between the gas discharge device and the gas discharge port 432 so that the gas uniformly descends from the fluid processing apparatus to the lower collecting plate 43 and is discharged by the gas discharge port 432 and the gas box 70. The gas box 70 is installed below the base 10 and the gas discharge pipe 71 and the waste water collector 72 are installed in the gas box 70 and the waste water collector 72 is installed in the gas box 70. [ The gas discharge pipe 71 is installed on the waste water collecting port 72 and connected to the external gas discharge device. It is used to discharge gas.

The collecting part 40 further includes a barrier module 44. The barrier module 44 is installed at the center of the collecting part 40 and also includes an upper cover 441 and a side ring 442, The upper cover 441 is provided below the loading platform 31 of the substrate fixing section 30 and has a first projection 441a extending to the upper side of the first annular sump 411a and the first projection 441a And the wall of the first annular sump 411a in the raised position overlap in the radial direction. A side ring 442 surrounds the substrate fixing portion 30 and is fixed to the upper portion of the lower portion collecting plate 43. When the substrate W rotates at a low speed, the partial treatment liquid flows between the first collecting ring 411 and the substrate fixing part 30 due to the lack of centrifugal force, and the barrier module 44 moves the first collecting ring 411, The treatment liquid entering between the fixing portions 30 is guided to the bottom collecting plate 43 and the treatment liquid is discharged to the wastewater collection port 72 by the gas outlet 432 to concentrate the wastewater into the wastewater collection slot.

In addition, in the present embodiment, the substrate fixing portion 30 further includes an elastic film 33, and the elastic film 33 surrounds the upper surface around the platform 31. When the vacuum device is operated, A negative pressure is generated in the lower portion of the substrate W and the elastic film 33 so that the upper portion of the elastic film 33 is adsorbed to the lower portion of the substrate W, The elastic film 33 prevents the process liquid from being sucked into the vacuum device by the bottom portion of the substrate W and destroying the vacuum device.

Referring to FIGS. 3-6, there is shown a cross-sectional view of a fluid processing apparatus in use according to a specific embodiment of the present invention. The substrate W is placed on the loading platform 31 of the substrate fixing section 30 and the substrate W and the substrate fixing section 30) rotates about the axis Z as the central axis.

3, if the processing liquid A is set to the substrate W by the liquid supply unit 50 at the time of the processing program of the substrate W, the control unit (not shown) The first liquid circulation cylinder 411 is controlled by controlling the first liquid gas discharge cylinder 421 of the ascending and descending module 42 of the first collecting cylinder 411 and the second collecting cylinder 412 by controlling the second liquid gas discharging cylinder The third accumulating cylinder 413 is elevated by controlling the first elevating machine cylinder 423 and the outer raking plate 414 is elevated by controlling the second elevating machine cylinder 424. At this time, The second shielding plate 412b of the second collecting ring 412, the third shielding plate 413a of the third collecting ring 413 and the front part of the outer shielding plate 414 And a first opening T1 is formed between the first collecting ring 411 and the substrate W and a first opening T1 corresponds to the periphery of the substrate W . Therefore, the processing liquid A applied to the surface of the substrate W is roughed to the periphery of the substrate W by the action of the centrifugal force, and the processing liquid A and the substrate G, The processing liquid A flows into the expansion liquid discharge pipe 411c along the first annular sump 411a and flows into the first annular sump 411a through the first opening T1, And is discharged to the corresponding liquid discharge port 431. The treatment liquid A in the form of mist enters the first annular sump 411a along the base G and the treatment liquid A in the form of mist flows in the first annular sump 411a, The gas G is condensed on the wall surface of the first collecting ring 411a and flows downward along the wall surface of the first annular sump 411a to the extruding liquid discharge pipe 411c, And flows back to the lower collecting plate 43 uniformly through the gap between the first collecting ring 411 and the barrier module 44 to be concentrated again to the gas outlet 432 of the lower collecting plate 43, And reaches the separation effect of the treatment liquid (A) and the gas (G). In other words, the gas passage of the bottom collecting plate 43 is larger than the gas passage passing through the collecting ring module 41, and the gas G Is lowered in the lower collecting plate 43 and the mist liquid in the form of mist which has not condensed in the first annular sump 411a is further separated from the lower collecting plate 43 and the gas G .

As shown in Fig. 4, when the processing program of the substrate W is programmed, the liquid supply unit 50 sets the processing liquid B to the substrate W, The first liquid circulation cylinder 421 of the second liquid circulation system 42 is lowered to lower the first liquid collection cylinder 411 and the second liquid gas discharge cylinder (not shown) to control the second liquid collection cylinder 412, The elevating machine cylinder 423 is controlled to elevate the third collecting ring 413 and the second elevating machine cylinder 424 is controlled to raise the outer covering plate 414. At this time, The second shielding plate 412b of the third collecting ring 413 and the front portions of the third shielding plate 413a and the outer shielding plate 414 are aligned and aligned with each other in order, A second opening T2 is formed between the second collecting rings 412 and a second opening T2 corresponds to the periphery of the substrate W. [ Therefore, the treatment liquid B applied to the surface of the substrate W is scattered to the periphery of the substrate W by the action of the centrifugal force, and the treatment liquid B and the substrate G, 2 enters the second annular sump 411b by the opening T2 and the process liquid B flows along the second annular sump 411b to the first hole 4212 of the first liquid gas discharge cylinder 421 And is discharged to the corresponding discharge port 431 of the lower part collecting plate 43. The treatment liquid B in the form of mist enters the second annular sump 411b along the base G and the treatment liquid B in the form of mist flows in the second annular sump 411b, The gas G is condensed on the wall surface of the first collecting ring 411b and flows downward along the wall surface of the second annular sump 411b to the first hole shaft 4212, And flows uniformly over the gap between the lower end of the second collecting ring 412 and the second annular sump 411b and flows down the lower collecting plate 43 to uniformly discharge the gas outlets 432 of the lower collecting plate 43, And reaches the separation effect of the treatment liquid (B) and the gas (G).

As shown in FIG. 5, when the processing liquid for the substrate W is programmed and the liquid L is supplied to the substrate W by the liquid supply unit 50, The first collecting ring 411 is lowered by controlling the first liquid discharging cylinder (not shown) of the first collecting ring 42 and the second collecting ring 412 is lowered by controlling the second liquid discharging cylinder 422, The first elevating cylinder 423 is controlled to raise the third collecting ring 413 and the second elevating cylinder 424 is controlled to lift the outer covering plate 414. At this time, The first shielding plate 411d and the front portion of the second shielding plate 412b of the second collecting ring 412 are sequentially gathered together and aligned with each other and the third shielding plate 413a of the third collecting ring 413, And the front portion of the outer shielding plate 414 are aligned and aligned with each other in order and a third opening T3 is formed between the second collection ring 412 and the third collection ring 413, T3 correspond to the periphery of the substrate W. The treatment liquid C applied to the surface of the substrate W is scattered to the periphery of the substrate W by the action of the centrifugal force and the treatment liquid C and the substrate G, 3 enters the third annular sump 412a by the opening T3 and the process liquid C flows along the third annular sump 412a to the second hole 422 of the second liquid gas discharge cylinder 422 And is discharged to the corresponding liquid discharge port 431 of the lower part collecting plate 43. The treatment liquid C in the form of mist enters the third annular sump 412a along the base G and the treatment liquid C in the form of mist flows in the third annular sump 412a, Solidified on the wall surface of the fourth annular sump 412a, and then concentrated downward along the wall surface of the third annular sump 412a to flow into the second hole shaft 4222. [ The gas G flows along the third collecting ring 413 and circulates the gap between the lower end of the third collecting ring 413 and the third annular sump 412a uniformly to the bottom of the lower collecting plate 43 And flows out to the gas outlet 432 of the lower portion collecting plate 43 to be discharged to reach the separation effect between the treatment liquid C and the gas G. [

As shown in FIG. 6, when the processing program of the substrate W is set, the liquid supply unit 50 sets the processing liquid D (generally clear water) to the substrate W, The first collecting ring 411, the second collecting ring 412 and the third collecting ring 413 are lowered by controlling the elevating module 42 of the second elevating machine cylinder 42 to control the second elevating machine cylinder 424, The first shielding plate 411d of the first collecting ring 411 and the second shielding plate 412b of the second collecting ring 412 and the third collecting ring 413 of the third collecting ring 413 The front portion of the third shielding plate 413a is sequentially gathered and aligned with each other and a fourth opening T4 is formed between the third collection ring 413 and the outer shielding plate 414 and the fourth opening T4 ) Corresponds to the periphery of the substrate W. The treatment liquid D applied to the surface of the substrate W is roughed to the periphery of the substrate W by the centrifugal force and the treatment liquid D and the substrate G, The processing liquid D flows into the bottom collecting plate 43 along the outer side clearing plate 414 to clean the bottom collecting plate 43 The treatment liquid D flows into the wastewater collection slot connected to the gas discharge port 432 again, while keeping the moisture of the bottom collecting plate 43 and preventing it from becoming a crystal by attachment of other treatment liquids. The mist-like treatment liquid D enters the lower shield plate 414 along the base G and is discharged to the gas outlet 432 of the lower collecting plate 43.

The gas carrying the mist type treatment liquid D passes through the collecting exchange module 41 and then the space of the lower collecting plate 43 is separated from the third collecting ring 413 and the outer covering plate 414, The velocity of the gas flowing from the annular gas passage to the lower collecting plate 43 becomes slower than the diameter of the annular gas passage formed between the lower portion collecting plate 43 and the lower collecting plate 43, The waste water collecting opening 72 in the lower part of the gas box 70 is filled with the waste water collected in the waste gas collecting opening 72. [ And the gas is discharged to the gas discharge pipe 71 provided above the wastewater collection port 72 so that the treatment liquid D and the gas G reach the separation effect.

Taking all of the above into account, the fluid processing apparatus of the present invention has a plurality of independent lift collecting circles, which can simplify the structure design. Preferably, the collection rings in the non-working can be blocked to prevent contamination of each other between the different fluids. In addition, when the external gas device discharges gas to the gas outlet through the collecting ring module and the gas outlet at the bottom of the collecting plate at the bottom, the gas in the collecting ring module forms an annular gas passage Thereby forming a uniform downward current to achieve a uniform gas discharge effect.

It is to be understood that the above-described embodiments are merely illustrative of the technical ideas and features of the present invention, and those of ordinary skill in the art should understand the contents of the present invention and should not limit the scope of the present invention, It is intended that all such variations and modifications as fall within the scope of the appended claims be covered thereby.

10 Base
20 Rotary Motor
30 substrate fixing section
31 Load Platform
32 Retention mechanism
33 Elastic film
40 collecting department
41 Collection Exchange Module
411 1st Collection Circle
411a first annular sump
411b 2nd type sump
411c flexible liquid discharge pipe
411d First screening plate
412 2nd collection circle
412a third annular sump
412b second shielding plate
412c Second protrusion
413 Third collection circle
413a third screen
413b Third protrusion
413c fourth protrusion
414 outer shielding plate
42 Lift Module
421 first liquid gas discharge cylinder
4211 1st pressure type cylinder
4212 1st hole shaft
422 Second liquid gas cylinder
4221 2nd pressure type cylinder
4222 2nd hole shaft
423 First elevator cylinder
424 Second elevator cylinder
43 Bottom Collecting Plate
431 liquid outlet
432 gas outlet
44 barrier module
441 Upper cover
441a First protrusion
442 Returning
50 liquid supply portion
70 gas box
71 Exhaust pipe
72 Waste water collection area
A, B, C, D Treatment liquid
G gas
T1 first opening
T2 second opening
T3 third opening
T4 fourth opening
W substrate
Z axis

Claims (16)

1. A fluid processing apparatus used in a substrate processing process,
base;
A rotary motor installed on the base;
A substrate fixing part provided on the rotation motor;
A collector installed in the base and surrounding the substrate fixing part; And
A liquid supply portion provided on the base and supplying a treatment liquid to the substrate,
Lt; / RTI >
Wherein the substrate fixing part includes a loading platform and a fixing device, wherein the loading platform holds the substrate and fixes the substrate using the fixing device,
Wherein the collecting section comprises a collecting exchange module, a lift module, a barrier module and a bottom collecting plate, the collecting exchange module comprising a plurality of collecting rings and arranged radially in order;
Wherein the lifting and lowering module includes a plurality of lifting and lowering devices and is connected to the plurality of collecting rings, respectively, to independently ascend or descend the ascending or descending positions of the collecting rings;
The barrier module being installed at the center of the collecting part and including an upper cover, the upper cover being installed below the platform of the substrate fixing part;
Wherein the bottom collection plate is installed below the collection ring module and the bottom of the bottom collection plate includes a plurality of liquid outlets and at least one gas outlets;
Wherein said barrier module is configured to cause said collecting exchange module and said collecting exchange module to communicate with said collecting exchange module when said substrate rotates at a low speed and lacks centrifugal force to flow a portion of said process liquid to said bottom collecting plate, Wherein a portion of the treatment liquid is used to guide a part of the treatment liquid between the substrate fixing unit and the treatment fluid and flows between the collection ring module and the substrate fixing unit.
The method according to claim 1,
Wherein the collection exchange module comprises a first collection ring, a third collection ring and an outer shielding plate,
Wherein the first collection ring, the third collection ring, and the outer shielding plate are arranged outward in a radial order, and the first cover plate and the third cover plate, Wherein the first shielding plate, the third shielding plate, and the front portions of the outer shielding plate in the raised position are gathered together, and the first shielding plate and the front portion of the third shielding plate at the falling position Wherein the fluid processing system is assembled together.
3. The method of claim 2,
Wherein the first shielding plate, the third shielding plate, and the outer shielding plate have a narrow angle of less than 90 degrees with respect to a plane in which the substrate is placed.
3. The method of claim 2,
The first collection ring
The first annular sump and the second annular sump
Lt; / RTI >
Wherein the first annular sump and the second annular sump are installed inside and outside the first shielding plate, respectively.
5. The method of claim 4,
The first collection ring
Stretchable liquid discharge pipe
Further comprising:
Wherein the expansion and contraction liquid outlet pipe connects the liquid outlet of the bottom collection plate at a first annular sump.
5. The method of claim 4,
Wherein the barrier module comprises a side ring and the upper cover has a first projection extending over the first annular sump and the first projection is in radial direction with the wall of the first annular sump in the raised position, And the side ring surrounds the substrate fixing part and is provided on the bottom part collecting plate.
5. The method of claim 4,
Wherein the third collection ring includes a third projection and a fourth projection extending downward along an inner surface and an outer surface of the third shielding plate, respectively,
Wherein the third projection extends into the second annular sump and the third projection and the fourth projection overlap radially with the walls of the second annular sump.
8. The method of claim 7,
The elevating module includes:
The first liquid gas discharge cylinder and the first elevator cylinder
Lt; / RTI >
Wherein the lifting module is connected to the third collection ring,
The first liquid gas discharge cylinder is installed at the bottom of the second annular sump of the first collecting ring,
Wherein the first liquid gas discharge cylinder comprises:
The first pneumatic cylinder and the first hol shaft
/ RTI >
Wherein the first holographic shaft is installed in the first pneumatic cylinder and the first holographic shaft connects the liquid outlet in the bottom collecting plate at the second annular sump.
9. The method of claim 8,
The elevating module includes:
And a second elevator cylinder connected to the outside cover plate
Further comprising:
9. The method of claim 8,
Wherein the collecting-
A second collecting ring disposed between the first collecting ring and the third collecting ring,
Further comprising:
Wherein the second collection ring has a second shielding plate extending upwardly and is gathered together at a front portion of the first shielding plate, the second shielding plate, the third shielding plate and the outer shielding plate in the raised position, The second shielding plate, and the third shielding plate of the fluid treatment apparatus.
11. The method of claim 10,
The second collection ring
The third annular sump and the second projection
Lt; / RTI >
Wherein the third annular sump is installed on the outside of the second closure plate and the second protrusion of the second collection ring extends down into the second annular sump along the inner surface of the second closure plate, The second projection of the second collection ring overlaps the top of the second annular sump in a radial direction and the third projection of the third collection ring extends into the third annular sump, 3 protrusion overlaps the top of the third annular sump in a radial direction.
12. The method of claim 11,
The elevating module includes:
And a second liquid gas discharge cylinder provided at a lower portion of the third annular sump of the second collecting ring
Lt; / RTI >
The second liquid gas discharge cylinder
The second pneumatic cylinder and the second hole shaft
/ RTI >
Wherein said second hollow shaft is mounted in said second pneumatic cylinder and said second hollow shaft connects said liquid outlet between said collection plate of said base at said third annular sump.
3. The method of claim 2,
Wherein an inner surface of the outer closure plate extends to the bottom collection plate.
The method according to claim 1,
A gas box connected to the gas outlet of the bottom collecting plate,
Further comprising:
15. The method of claim 14,
Wherein the gas passage of the bottom collection plate is larger than the gas passage through the collection ring module.
The method according to claim 1,
Wherein the fixing device is a vacuum device and the substrate fixing part further comprises an elastic film, the elastic film is installed so as to surround the upper surface of the platform, so that when the vacuum device is operated, To be adsorbed to the fluid.
KR1020150132689A 2015-01-22 2015-09-18 Fluid process dealing device KR101787197B1 (en)

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Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10707099B2 (en) 2013-08-12 2020-07-07 Veeco Instruments Inc. Collection chamber apparatus to separate multiple fluids during the semiconductor wafer processing cycle
TWI559990B (en) * 2015-11-06 2016-12-01 Grand Plastic Technology Corp Liquid collection apparatus for spin etcher
CN106711060B (en) * 2015-11-16 2019-07-26 弘塑科技股份有限公司 The fluid collection device of spin etch cleaning machine
CN107093567B (en) * 2016-02-18 2019-08-06 顶程国际股份有限公司 Annular liquid collection device
JP6513048B2 (en) * 2016-03-28 2019-05-15 東京エレクトロン株式会社 Liquid processing device
TWI646575B (en) * 2016-07-27 2019-01-01 辛耘企業股份有限公司 Fluid processing device
TWI645913B (en) * 2016-11-10 2019-01-01 辛耘企業股份有限公司 Liquid processing device
TWI665019B (en) * 2017-02-15 2019-07-11 辛耘企業股份有限公司 Substrate processing device
WO2018200398A1 (en) 2017-04-25 2018-11-01 Veeco Precision Surface Processing Llc Semiconductor wafer processing chamber
CN109701943A (en) * 2019-01-22 2019-05-03 上海提牛机电设备有限公司 A kind of wafer cleaning basin
CN112382594A (en) * 2020-11-30 2021-02-19 冠礼控制科技（上海）有限公司 Liquid drainage cylinder
CN114951193B (en) * 2022-07-29 2023-05-09 常州捷佳创精密机械有限公司 Wafer cleaning equipment and liquid supply method

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001267278A (en) * 2000-03-16 2001-09-28 Mimasu Semiconductor Industry Co Ltd Wafer-surface treating apparatus with waste-liquid recovering mechanism
JP2003257925A (en) * 2002-03-05 2003-09-12 Shibaura Mechatronics Corp Spinning treatment apparatus and method therefor
JP2008091717A (en) * 2006-10-03 2008-04-17 Dainippon Screen Mfg Co Ltd Substrate processing apparatus

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001267278A (en) * 2000-03-16 2001-09-28 Mimasu Semiconductor Industry Co Ltd Wafer-surface treating apparatus with waste-liquid recovering mechanism
JP2003257925A (en) * 2002-03-05 2003-09-12 Shibaura Mechatronics Corp Spinning treatment apparatus and method therefor
JP2008091717A (en) * 2006-10-03 2008-04-17 Dainippon Screen Mfg Co Ltd Substrate processing apparatus

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