KR101786274B1 - Mask-cleaning apparatus - Google Patents

Mask-cleaning apparatus Download PDF

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Publication number
KR101786274B1
KR101786274B1 KR1020150189779A KR20150189779A KR101786274B1 KR 101786274 B1 KR101786274 B1 KR 101786274B1 KR 1020150189779 A KR1020150189779 A KR 1020150189779A KR 20150189779 A KR20150189779 A KR 20150189779A KR 101786274 B1 KR101786274 B1 KR 101786274B1
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KR
South Korea
Prior art keywords
wiper
mask
supported
wet
vertical plate
Prior art date
Application number
KR1020150189779A
Other languages
Korean (ko)
Other versions
KR20170079334A (en
Inventor
밍-쉥 첸
Original Assignee
밍-쉥 첸
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Publication date
Application filed by 밍-쉥 첸 filed Critical 밍-쉥 첸
Priority to KR1020150189779A priority Critical patent/KR101786274B1/en
Publication of KR20170079334A publication Critical patent/KR20170079334A/en
Application granted granted Critical
Publication of KR101786274B1 publication Critical patent/KR101786274B1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02043—Cleaning before device manufacture, i.e. Begin-Of-Line process
    • H01L21/02054—Cleaning before device manufacture, i.e. Begin-Of-Line process combining dry and wet cleaning steps
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02043—Cleaning before device manufacture, i.e. Begin-Of-Line process
    • H01L21/02046—Dry cleaning only
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02043—Cleaning before device manufacture, i.e. Begin-Of-Line process
    • H01L21/02052—Wet cleaning only
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/67034—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67706—Mechanical details, e.g. roller, belt

Abstract

The mask cleaner includes a frame, a wet clean mechanism supported on the frame, and a dry clean mechanism supported on the frame and positioned after the wet clean mechanism in a direction to feed the clean room wipers. The wet rinsing mechanism wipes the mask before the dry rinsing mechanism wipes the mask. Each of the wet and dry cleaning mechanisms includes a wiping module including a vertical plate, a feeder reel, a retriever reel, direction changing rollers, and a pushing roller. The wiping module of the wet cleaning mechanism includes a sprayer mechanism adapted to spray a cleaning liquid to a portion of the clean room wipers on the pushing roller.

Description

Mask-cleaning apparatus

The present invention relates to the cleaning of masks, and more particularly to a fast and effective apparatus for cleaning the surface of a mask to increase the yield of a semiconductor manufacturing process.

Typically, the operator cleans the surface of the mask by hand. The operator puts the mask in a holder and flushes the surface of the mask using a cleaning liquid such as acetone, ethanol and deionized water, and uses a brush to brush the surface of the mask, ≪ / RTI > The step of using a rinsing liquid to flush the surface of the mask and the step of using the brush to brush the surface of the mask may be repeated several times as necessary. Next, the operator flushes the surface of the mask with the rinsing liquid once before finally drying the surface of the mask. This cleaning process is for cleaning the surface of the mask with impurities and sediments. However, this cleaning process may cause an operator to be excessively exposed to a cleaning liquid based on an organic solvent which is dangerous to human health.

To solve the problem, various automatic mask cleaning apparatuses have been developed. Although the exposure of the rinsing liquid to humans has been reduced, a large amount of rinsing liquid based on organic solvents is still used in automatic mask cleaners. Thus, there is still the problem of contamination due to control of the cleaning fluid and use of the cleaning fluid. Also, such cleaning is not effective because the cleaning is based on flushing.

Accordingly, the present invention is directed to eliminating or at least alleviating the problems encountered in the prior art.

SUMMARY OF THE INVENTION

It is an object of the present invention to provide a method of cleaning a surface of a mask through wiping without using a large amount of cleaning liquid based on an organic solvent, which is quick, efficient, safe, environmentally friendly, Device.

It is another object of the present invention to provide an apparatus for washing and dry cleaning (dry cleaning) a mask for cleaning particles or contaminated masks without leaving a water stain.

To achieve this object, the mask cleaner comprises a frame, a wet cleaning mechanism supported on the frame, and a clean-room wiper supported on the frame and supplying a clean-room wiper Lt; RTI ID = 0.0 > a < / RTI > wet cleaning mechanism. The wet rinsing mechanism wipes the mask before the dry rinsing mechanism wipes the mask. Each of the wet and dry cleaning mechanisms includes a wiping module including a vertical plate, a feeder reel, a retriever reel, redirecting rollers, and a pushing roller. . The reels and rollers are supported on the frame. The feeder reel is adapted to bear the end of the clean room wiper. The retriever reel is adapted to bear the other end of the clean room wiper. The direction changing rollers are positioned between the feeder reel and the retriever reel and are adapted to guide the clean room wiper to the upper portion of the wiping module. The pushing roller is adapted to push a portion of the cleanroom wiper over an adjacent portion of the cleanroom wiper so that the cleanroom wiper is ready for wiping. The wiping module of the wet scrubbing mechanism further includes a sprayer mechanism adapted to spray the scrubbing liquid onto the portion of the clean room wiper on the pushing roller.

Other objects, advantages and features of the present invention will become apparent from the following detailed description with reference to the accompanying drawings.

BRIEF DESCRIPTION OF THE DRAWINGS The present invention will be described through the detailed description of the preferred embodiments with reference to the drawings.
1 is a perspective view of a mask cleaning apparatus according to a preferred embodiment of the present invention;
Figure 2 is a perspective view of the wet cleaning mechanism and the dry cleaning mechanism of the mask cleaning apparatus shown in Figure 1;
Figure 3 is a perspective view of the wiping module of each of the wet and dry cleaning mechanisms shown in Figure 2;
Figure 4 is a front view of the wiping module shown in Figure 3;
Figure 5 is a partial view of the wiping module shown in Figure 4; And
6 is a side view of the mask wiped by a clean room wiper operated by the wiping module shown in Fig.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

Referring to Figure 1, the surface of the mask 90 and, more specifically, the two opposing surfaces 96 of the protective film of the mask 90 are cleaned by wiping in accordance with a preferred embodiment of the present invention The device is present. The above-described mask cleaner may be provided on the frame 1. Above the frame 1 is also provided an optical inspector 2 for checking the mask 90 before and after the mask 90 is cleaned by the mask cleaner. On one side of the frame 1, there is a pair of tracks 10 on which the mask carrier 20 slides. On the other side of the frame 1 there is a track 15 to and from which the mask-clamping module 30 slides to the optical checker 2. The mask clamping module 30 includes a clamp 35 for supporting the mask 90 by an edge while exposing the bottom surface 96 to the mask cleaner. The clamp 35 may be as described in Taiwan Patent No. M465658.

The mask cleaning apparatus includes a wet cleaning mechanism 5A and a dry cleaning mechanism 5B. Each of the wet cleaning mechanism 5A and the dry cleaning mechanism 5B is supported on a platform 18 provided on the frame 1. The mask clamping module 30 is used to clean the mask 90 by supporting the mask 90 and moving the mask 90 relative to the wet and dry cleaning mechanisms 5A and 5B to remove the mask 90 from the mask 90 Wipe off water stains.

The wet and dry cleaning mechanisms 5A and 5B will be described in detail with reference to FIGS. 2, 3 and 4. FIG. Each of the wet and dry cleaning mechanisms 5A and 5B includes a wiping module (not shown) adapted to operate on a corresponding platform 18 provided on the frame 1 and to operate a cleanroom wiper 80 in the form of a strip 50). Each of the wiping modules 50 is adapted to wipe the bottom surface 96 of the protective film 95 of the mask 90 as shown in Figs. For purposes of simplicity, the following description will only illustrate the platform 18 corresponding to one of the wiping modules 50.

The wiping module 50 includes a vertical plate 51 provided on the platform 18. [ On the inner surface of the vertical plate 51, a feeder reel 52 and a retriever reel 56 are present. The feeder reel 52 is used to support one end of the clean room wiper 80 while the retriever reel 56 is used to support the other end of the clean room wiper 80. On the outer surface of the vertical plate 51, there are a first driver 520 and a second driver 560. The first driver 520 is used to rotate the feeder reel 52. The second driver 560 is used to rotate the retriever reel 56. The feeder reel 52 and the retriever reel 56 may be rotated in a direction to supply the clean room wiper 80. The feeder reel 52 and the retriever reel 56 may be rotated in different directions to retrieve the clean room wiper 80. On the vertical plate 51, there are two stretching rollers 53 and 55. The first stretching roller 53 is located near the output side of the feeder reel 52. [ The second stretching roller 55 is located near the input side of the retriever reel 56. The stretching rollers 53 and 55 smoothly supply and recover the clean room wiper 80. On the vertical plate 51 there are various direction changing rollers 541 to 544 between the feeder reel 52 and the retriever reel 56 to move the clean room wiper 80 on the wiping module 50 It should be smooth.

There is a squeezing roller set 57 between the direction changing rollers 542 and 543 near the upper edge of the vertical plate 51 of the wiping module 50. The squeeze roller set 57 includes a roller 571 operably connected to a third driver 572. On one side of the roller 571, the force exerted on the clean room wiper 80 is changed so that the cleaning liquid is uniformly distributed in the clean room wiper 80 and the excessive portion of the cleaning liquid is pushed out of the clean room wiper 80 There is an adapted squeeze roller 573. The pushing roller 59 is supported on the vertical plate 51 and is positioned behind the squeegee roller set 57 in the direction of supplying the clean room wiper 80. A lifting unit 58 is operatively connected to the pushing roller 59. Referring to FIG. 5, the pushing roller 59 selectively lifts or lowers the clean room wiper 80 before the clean room wiper 80 wipes the mask 50. The lifting unit 58 includes a cylinder 581 on the vertical plate 51. The cylinder 581 includes a roller holder 582 for supporting the pushing roller 59.

On the vertical plate 51 of the wiping module 50 there is a sprayer mechanism 60 for spraying the cleaning liquid in front of the squeegee roller set 57 in the feeding direction of the clean room wiper 80. It is not necessary to include the sprayer mechanism 60 in the wiping module 50 of the dry cleaning mechanism 5B. However, the wiping module 50 of the dry cleaning mechanism 5B may include a sprayer mechanism 60 that is not activated. The sprayer mechanism 60 includes a sprayer 61 adapted to spray a cleaning liquid to a clean room wiper 80. The sprayer mechanism 60 also includes a recycling unit 65 positioned below the set of squeeze rollers 57 and adapted to recycle the excess cleaning fluid squeezed out of the set of squeeze rollers 57 .

5, the wiping module 50 further includes two positioning clamp units 70 on a vertical plate 51 on two sides of a pushing roller 59. As shown in FIG. Each of the positioning clamp units 70 includes a positioning plate 71 under the clean room wiper 80, a pressure plate 72 on the clean room wiper 80 and a cylinder 75 operatively connected to the pressure plate 72 do. Between the positioning plate 71 and the pressure plate 72 is a positioning passage 710 having a width equal to the width of the clean room wiper 80 and a height exceeding the thickness of the clean room wiper 80. The cylinder 75 drives the presser plate 72 to press the clean room wiper 80 over the positioning plate 71 of the positioning clamp unit 70 so that the clean room wiper 80 is moved to the mask 90, the clean room wiper 80 is held in place. Further, the positioning clamp unit 70 limits the movement of the clean room wiper 80 within a small range, thereby avoiding the dislocation of the clean room wiper 80.

1 and 4, in order to clean the bottom surface 96 of the protective film 95 of the mask 90, the driver of the wiping modules 50 of the wet and dry cleaning mechanisms 5A and 5B The wipers 520, 560 and 572 simultaneously act to roll the clean room wiper 80 so that a portion of the clean room wiper 80 is positioned on the pushing roller 59. The pressing plate 72 and the positioning plate 71 of the positioning clamp unit 70 are opened to allow the clean room wiper 80 to smoothly move through the positioning passage 710 of the positioning plate 71. [ Simultaneously, the sprayer 61 of the sprayer mechanism 60 of the wet scrubbing mechanism 5A is activated to spray the scrubbing liquid onto the clean room wiper 80. When the clean room wiper 80 moves through the set of squeeze rollers 57, the set of squeezing rollers 57 squeeze the clean room wiper 80 so that the cleaning liquid is uniformly distributed in the clean room wiper 80. Thus, it ensures that all parts of the clean room wiper 80 contain a sufficient amount of rinse solution to effectively wipe off, and also prevents water stains from being left on the mask 90.

The clamp 35 of the mask clamping module 30 is then activated to clamp the mask 90 to cause the mask 90 to move toward the wet rinsing mechanism 5A (or dry rinsing mechanism 5B) . 4, 5 and 6, in each of the positioning clamp units 70 of the wiping module 50, the pressure plate 72 is moved toward the positioning plate 71 to move the pushing roller 59, A portion of the clean room wiper 80 on the upper side is pressed. 5, the wiping module 50 lifts the pushing roller 59 of the lifting unit 58 so that the portion of the clean room wiper 80 protrudes upward.

6, when the mask 90 reaches a position above the portion of the clean room wiper 80 on the pushing roller 59 of the wiping module 50 of the wet cleaning mechanism 5A, the clean room wiper This portion of the mask 80 wipes the bottom surface 96 of the protective film 95 of the mask 90 to remove particles, dust and stains from the bottom surface 96.

When the mask 90 reaches a position on the portion of the clean room wiper 80 on the pushing roller 59 of the wiping module 50 of the dry cleaning mechanism 5B, The cleaning liquid is wiped from the bottom surface 96 by wiping the bottom surface 96 of the protective film 95 of the cleaning film 95. [ Therefore, no water spots are left on the bottom surface 96 of the protective film 95 of the mask 90. [

A wider cleanroom wiper 80 may be used with the wiping module 50 of each of the wet and dry cleaning mechanisms 5A and 5B to clean the upper surface 96 of the glass on the mask 90.

As discussed above, in each of the wet and dry cleaning mechanisms 5A and 5B, the clean room wiper 80 directly wipes the bottom surface 96 of the mask 90. Thus quickly and effectively cleaning the bottom surface 96 with particles or dust. The efficiency and yield of subsequent manufacturing processes are high. Also, since no water spots are left on the mask 90 after the wet and dry wiping, the quality of the mask 90 is enhanced. Further, since the cleaning liquid is sprayed onto the clean room wiper 80, only a small amount of the cleaning liquid is used. Thus, the use of a mask cleaner is safe, environmentally friendly and inexpensive.

The invention has been described through the detailed description of the preferred embodiments. Skilled artisans may derive variations from the preferred embodiments without departing from the scope of the invention. Accordingly, the preferred embodiments do not limit the scope of the invention as defined in the claims.

Claims (14)

A mask cleaning apparatus comprising a frame, a wet cleaning mechanism supported on the frame, and a dry cleaning mechanism located behind the wet cleaning mechanism in a direction supported on the frame and supplying cleanroom wipers, wherein the wet and dry cleaning Each of the mechanisms,
A vertical plate supported on the frame;
A feeder reel supported on the vertical plate and adapted to support an end of the clean room wiper;
A retriever reel supported on the vertical plate and adapted to bear the other end of the clean room wiper;
Orientation rollers supported on a vertical plate between the feeder reel and the retriever reel and adapted to guide the cleanroom wipers to the upper portion of the wiping module; And
And a pushing roller supported on said vertical plate and pushing a portion of the cleanroom wiper over an adjacent portion of the cleanroom wiper so that the cleanroom wiper is ready for wiping,
Wherein the wiping module comprises a first stretching roller supported on a vertical plate near the output side of the feeder reel and a second stretching roller supported on a vertical plate near the input side of the retriever reel, Cooperate with each other to smooth the supply and recovery of cleanroom wipers,
The wiping module of the wet rinsing mechanism may further comprise a sprayer mechanism configured to spray the rinsing liquid onto a portion of the clean room wiper on the pushing roller, wherein the wet rinsing mechanism is configured such that before the dry rinsing mechanism wipes the mask, Cleaning device. The apparatus of claim 1, wherein each of the wet and dry cleaning mechanisms comprises two wiping modules adapted to wipe the mask. The apparatus of claim 1, wherein the wiping module comprises:
A first driver supported on the vertical plate and adapted to drive a feeder reel; And
And a second driver supported on said vertical plate and adapted to drive a retriever reel. delete The apparatus of claim 1, wherein the wiping module of the wet cleaning mechanism comprises a set of squeegee rollers positioned in front of the pushing rollers in the direction of supply of cleanroom wipers. The image forming apparatus according to claim 5, wherein the squeezing roller set includes:
An active roller supported on a vertical plate;
A third driver adapted to drive the roller; And
And a squeegee roller provided to change the force applied to the cleaner wiper with respect to the activating roller so as to uniformly distribute the cleaning liquid to the cleaner wiper and to squeeze the excessive portion of the cleaning liquid out of the clean room wiper. The apparatus of claim 1, wherein the wiping module comprises a lifting unit adapted to lift a pushing roller. 8. The apparatus of claim 7, wherein the lifting unit comprises:
A cylinder supported on a vertical plate; And
And a roller holder operatively connected to the cylinder and adapted to support the pushing roller. The apparatus of claim 1, wherein the wiping module further comprises two positioning clamp units supported on a vertical plate on two sides of the pushing roller. The positioning clamp unit according to claim 9, wherein the positioning clamp unit includes a positioning plate and a pressure plate positioned below the positioning plate, and a positioning passage is defined between the positioning plate and the pressure plate, and the positioning passage is provided to recover the clean room wiper Gt; 11. The apparatus of claim 10, wherein the positioning clamp unit further comprises a cylinder adapted to move the platen toward the positioning plate so that when the cleanroom wiper wipes the mask, the cleanroom wiper remains in place. 11. The apparatus of claim 10, wherein the positioning passage has a height equal to the width of the cleanroom wiper and a height exceeding the thickness of the cleanroom wiper. The apparatus of claim 1, wherein the sprayer mechanism of the wiping module of the wet scrubbing mechanism comprises a sprayer adapted to spray the scrubbing liquid onto a clean room wiper. 14. The apparatus of claim 13, wherein the sprayer mechanism of the wiping module of the wet cleaning mechanism further comprises a recycling unit located below the sprayer to recover an excess portion of the cleaning liquid squeezed out of the cleanroom wiper by the set of squeegee rollers. Mask cleaning device.
KR1020150189779A 2015-12-30 2015-12-30 Mask-cleaning apparatus KR101786274B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020150189779A KR101786274B1 (en) 2015-12-30 2015-12-30 Mask-cleaning apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020150189779A KR101786274B1 (en) 2015-12-30 2015-12-30 Mask-cleaning apparatus

Publications (2)

Publication Number Publication Date
KR20170079334A KR20170079334A (en) 2017-07-10
KR101786274B1 true KR101786274B1 (en) 2017-10-18

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KR1020150189779A KR101786274B1 (en) 2015-12-30 2015-12-30 Mask-cleaning apparatus

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102135500B1 (en) * 2018-04-26 2020-07-20 스텍 코 엘티디 Apparatus and method for cleaning substrates

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