KR101756658B1 - Light source module and method of manufacturing the same - Google Patents

Light source module and method of manufacturing the same Download PDF

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Publication number
KR101756658B1
KR101756658B1 KR1020100124011A KR20100124011A KR101756658B1 KR 101756658 B1 KR101756658 B1 KR 101756658B1 KR 1020100124011 A KR1020100124011 A KR 1020100124011A KR 20100124011 A KR20100124011 A KR 20100124011A KR 101756658 B1 KR101756658 B1 KR 101756658B1
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KR
South Korea
Prior art keywords
self
source module
light source
scattering
light emitting
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KR1020100124011A
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Korean (ko)
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KR20120063017A (en
Inventor
조민수
김부진
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엘지디스플레이 주식회사
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Priority to KR1020100124011A priority Critical patent/KR101756658B1/en
Publication of KR20120063017A publication Critical patent/KR20120063017A/en
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Publication of KR101756658B1 publication Critical patent/KR101756658B1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45139—Silver (Ag) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/49105—Connecting at different heights
    • H01L2224/49107—Connecting at different heights on the semiconductor or solid-state body

Abstract

The present invention provides a light source module capable of improving light efficiency and a manufacturing method thereof.
A method of manufacturing a light source module according to the present invention includes: mounting a light emitting chip on a top surface of a lead frame; Sealing the mounted light emitting chip using a sealing part; And forming a scattering pattern on the encapsulation part or in a self-assembled colloid protruding higher than the surface of the encapsulation part in the encapsulation part.

Description

TECHNICAL FIELD [0001] The present invention relates to a light source module,

The present invention relates to a light source module capable of improving light efficiency and a manufacturing method thereof.

BACKGROUND ART [0002] Conventional light emitting diodes (LEDs) are a type of semiconductors used to convert electrical signals into light using the characteristics of compound semiconductors. Such a light emitting diode has many merits such as high luminous efficiency, long life, low power consumption, and environment friendliness, so that the technology field of using light emitting diodes is increasing. The light emitting chip having the light emitting diode is mounted on a metal lead frame or a printed circuit board, and the light emitting module is formed by sealing the light emitting chip through the sealing portion.

Conventionally, the upper surface of the sealing portion is formed flat or concave. When the top surface of the encapsulation portion is formed flat, the light extraction efficiency due to the total internal reflection caused by the refractive index of the encapsulation portion becomes low. When the top surface of the encapsulation part is concave, the amount of light escaping from the encapsulation part is reduced, and the angle of incidence of the light source module is widened, thereby lowering the light efficiency.

In order to solve the above problems, the present invention provides a light source module capable of improving light efficiency and a manufacturing method thereof.

According to an aspect of the present invention, there is provided a method of manufacturing a light source module including: mounting a light emitting chip on a metal lead; Sealing the mounted light emitting chip using a sealing part; And forming a scattering pattern on the encapsulation part or in a self-assembled colloid protruding higher than the surface of the encapsulation part in the encapsulation part.

The first embodiment of the step of forming the scattering pattern may include a step of curing the encapsulation part and then spraying a scattering solution on the encapsulation part or immersing the dispersion solution in a spraying method; And forming a scattering pattern in which the solvent in the scattering solution is volatilized through a drying process to protrude above the surface of the sealing portion on the sealing portion.

The second embodiment of the step of forming the scattering pattern may include spraying the scattering solution on the sealing portion before curing the sealing portion or immersing the scattering solution through a precipitation method; And curing the encapsulation solution and the encapsulation part to form the scattering pattern protruding higher than the surface of the encapsulation part in the encapsulation part.

The self-assembling colloid is made of silica, which is composed of 30 to 50 wt% of self-assembled colloid having a diameter of several tens nm to several 탆, 50 to 69 wt% of a solvent, and 0.001 to 1 wt% (SiO 2 ) is used as a solvent, and water is used as a solvent. Examples of additives include chlorides such as NaCl, titratable alkalis such as Na 2 O, sulfates such as Na 2 SO 4 , ) Or a mixture thereof is used.

According to another aspect of the present invention, there is provided a method of manufacturing a light source module, including: mounting a light emitting chip on a metal lead; Sealing the mounted light emitting chip using a sealing part; And forming a groove-shaped scattering pattern by desorbing the self-assembled colloid adsorbed on the surface of the sealing portion.

The third embodiment of the step of forming the scattering pattern may include spraying or scattering the scattering solution onto the encapsulation part by spraying or immersing the encapsulation part through the precipitation method before curing the encapsulation part; Curing the scattering solution and the encapsulation to adsorb the self-assembled colloid in the scattering solution to the surface of the encapsulation; And forming the groove-shaped scattering pattern by removing the adsorbed self-assembled colloid by using HF.

According to an aspect of the present invention, there is provided a light source module including: a light emitting chip; An encapsulating unit for encapsulating the light emitting chip; And a scattering pattern formed on the encapsulation part or in the encapsulation part so as to protrude higher than the surface of the encapsulation part and formed of self-assembled colloid.

According to another aspect of the present invention, there is provided a light source module including: a light emitting chip; An encapsulating unit for encapsulating the light emitting chip; And a groove-shaped scattering pattern formed by desorbing the self-assembled colloid adsorbed on the surface of the sealing portion.

Here, the self-assembled colloid is formed of silica.

In the present invention, a scattering pattern is formed on the surface of the encapsulation portion in a protruding shape or a groove shape so as to have a diameter of several tens nm to several 탆 corresponding to the light wavelength. Accordingly, the present invention increases the light extraction efficiency and the light efficiency by the scattering effect by the scattering pattern.

1 is a cross-sectional view illustrating a light source module according to a first embodiment of the present invention.
2A to 2C are cross-sectional views illustrating a method of manufacturing the light source module shown in FIG.
3 is a cross-sectional view illustrating a light source module according to a second embodiment of the present invention.
4A and 4B are cross-sectional views illustrating a method of manufacturing the light source module shown in FIG.
5 is a cross-sectional view illustrating a light source module according to a third embodiment of the present invention.
6A and 6B are cross-sectional views illustrating a method of manufacturing the light source module shown in FIG.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings and embodiments.

1 is a cross-sectional view illustrating a light source module according to a first embodiment of the present invention.

The light source module 110 shown in FIG. 1 includes a lead frame 120, a light emitting chip 112, a sealing portion 116, a metal lead portion 122, and a scattering pattern 124.

The lead frame 120 has a reflective cup 118 for receiving the light emitting chip 112. The inner side surface and the inner bottom surface of the lead frame 120 are exposed by the reflection cup 118. [ The inner side surface has an acute angle of inclination such that the line width of the reflecting cup 118 becomes wider toward the upper side. The inner bottom surface is formed to expose the metal lead portion 122 connected to the electrode terminal on the circuit board.

The light emitting chip 112 is mounted on the metal lead portion 122 exposed by the reflection cup 118 and is connected to the metal lead portion 122 via the wire 114. Accordingly, the light emitting chip 112 generates light according to a driving signal transmitted from the circuit board through the metal lead portion 122.

The metal leads 122 are electrically connected to the positive and negative electrodes of the light emitting chip 112 through the wires 114 and are electrically connected to the electrode terminals of the circuit board. Therefore, a drive signal from the circuit board is transmitted to the positive electrode and the negative electrode of the light emitting chip 112 through the metal lead portion 122. [

The sealing portion 116 is formed by filling a mixture of a transparent resin made of silicone resin and a fluorescent material in the reflection cup 118 to seal the light emitting chip 112.

The scattering pattern 124 is formed of a self-assembled colloid having a diameter of several tens nm to several mu m corresponding to the light wavelength size on the sealing portion 116, The light extraction efficiency is increased and the light efficiency is increased. Particularly, the scattering pattern 124 is formed of a material having a refractive index higher or lower than that of the sealing portion 116. For example, when the refractive index of the sealing portion 116 is 1.4 to 1.52, the scattering pattern 124 is formed of silica having a refractive index of 1.46. Such a scattering pattern 124 can reduce the directivity angle by condensing light.

2A to 2C are cross-sectional views illustrating a method of manufacturing the light source module shown in FIG.

The light emitting chip 112 is chip-bonded on the metal lead portion 122 located on the upper surface of the cleaned lead frame 120 as shown in FIG. 2A, and is first cured. Then, the light emitting chip 112 is electrically connected to the metal lead portion 122 through wire bonding using the wire 114.

Then, as shown in FIG. 2B, an encapsulating portion 116 is formed by filling a mixed material of a transparent resin and a fluorescent material in the reflective cup 118 in the lead frame 120, followed by secondary curing.

Then, as shown in FIG. 2C, the self-assembled colloid-containing scattering solution is sprayed onto the encapsulation portion 116 by spraying or immersed on the encapsulation portion 116 through a precipitation method. Here, the scattering solution is composed of 30 to 50 wt% of self-assembled colloid having a diameter of several tens nm to several mu m, 50 to 69 wt% of a solvent, and 0.001 to 1 wt% of an additive. Self-assembled colloidal a is utilized is silica (SiO 2), the solvent is self-assembled because the colloidal silica is water-soluble with water is used, the additive include Ti Tra table alkali such as chloride (Chloride), Na 2 O, such as NaCl (Titratable alkali), Sulfate such as Na 2 SO 4 , or a mixture thereof.

Then, the solvent in the scattering solution on the sealing portion 116 is volatilized through the drying process, so that the protruding scattering pattern 124 is formed on the sealing portion 116.

3 is a cross-sectional view illustrating a light source module according to a second embodiment of the present invention.

The light source module 110 shown in FIG. 3 has the same components as those of the light source module shown in FIG. 1, except that the scattering pattern 124 is located in the sealing portion 116. Accordingly, detailed description of the same components will be omitted.

The scattering pattern 124 is formed of a self-assembled colloid having a diameter of several tens nm to several 탆 corresponding to the wavelength of light in the encapsulating portion 116. A part of each of the scattering patterns 124 is formed in the encapsulation part 116 and the remaining part of the area is projected to the outside higher than the surface of the encapsulation part 116. The scattering effect by the scattering pattern 124 increases the light extraction efficiency and the light efficiency. Particularly, the scattering pattern 124 is formed of a material having a refractive index higher or lower than that of the sealing portion 116. For example, when the refractive index of the sealing portion 116 is 1.4 to 1.52, the scattering pattern 124 is formed of silica having a refractive index of 1.46. Such a scattering pattern 124 can reduce the directivity angle by condensing light.

4A and 4B are cross-sectional views illustrating a method of manufacturing the light source module shown in FIG.

The light emitting chip 112 is chip-bonded on the metal lead portion 122 located on the upper surface of the cleaned lead frame 120 as shown in FIG. 4A and first cured. Then, the light emitting chip 112 is electrically connected to the metal lead portion 122 through wire bonding using the wire 114. Then, an encapsulating portion 116 made of a mixed material of a transparent resin and a fluorescent material is filled in the reflective cup 118 in the lead frame 120.

Then, as shown in FIG. 4B, the scattering solution containing the self-assembled colloid is sprayed on the uncured sealing portion 116 by spraying or immersed on the sealing portion 116 through a precipitation method. Here, the scattering solution is composed of 30 to 50 wt% of self-assembled colloid having a diameter of several tens nm to several mu m, 50 to 69 wt% of a solvent, and 0.001 to 1 wt% of an additive. Self-assembled colloidal a is utilized is silica (SiO 2), the solvent is self-assembled because the colloidal silica is water-soluble with water is used, the additive include Ti Tra table alkali such as chloride (Chloride), Na 2 O, such as NaCl (Titratable alkali), Sulfate such as Na 2 SO 4 , or a mixture thereof.

The self-assembled colloid in the scattering solution is then adsorbed into the uncured softened encapsulation 116. Then, the sealing portion 116 and the scattering solution containing the self-assembled colloid adsorbed in the sealing portion are simultaneously secondarily cured. As a result, the scattering pattern 124 protruding higher than the surface of the sealing portion 116 is fixed in the sealing portion 116.

5 is a cross-sectional view illustrating a light source module according to a third embodiment of the present invention.

The light source module 110 shown in FIG. 5 has the same components as those of the light source module shown in FIG. 1, except that the scattering pattern 126 is formed in a groove in the sealing portion 116. Accordingly, detailed description of the same components will be omitted.

The scattering pattern 126 is formed on the surface of the sealing portion 116 in the shape of a groove having a diameter of several tens nm to several mu m corresponding to the light wavelength. This scattering pattern 126 is formed in a groove shape by desorbing and removing the self-assembled colloid adsorbed on the surface of the sealing portion 116.

The scattering effect by the scattering pattern 126 increases the light extraction efficiency and increases the light efficiency. This groove-shaped scattering pattern 126 is advantageous for a light source module using a wide directivity angle.

6A and 6B are cross-sectional views illustrating a method of manufacturing the light source module shown in FIG.

The light emitting chip 112 is chip-bonded on the metal lead portion 122 located on the upper surface of the cleaned lead frame 120 as shown in FIG. 6A and first cured. Then, the light emitting chip 112 is electrically connected to the metal lead portion 122 through wire bonding using the wire 114. Then, an encapsulating portion 116 made of a mixed material of a transparent resin and a fluorescent material is filled in the reflective cup 118 in the lead frame 120.

Then, the self-assembled colloid-containing scattering solution is sprayed onto the uncured soft-shaped sealing portion 116 or immersed on the sealing portion 116 through a precipitation method. Here, the scattering solution is composed of 30 to 50 wt% of self-assembled colloid having a diameter of several tens nm to several mu m, 50 to 69 wt% of a solvent, and 0.001 to 1 wt% of an additive. Self-assembled colloidal a is utilized is silica (SiO 2), the solvent is self-assembled because the colloidal silica is water-soluble with water is used, the additive include Ti Tra table alkali such as chloride (Chloride), Na 2 O, such as NaCl (Titratable alkali), Sulfate such as Na 2 SO 4 , or a mixture thereof.

The self-assembled colloid in the scattering solution is then adsorbed into the uncured softened encapsulation 116. Then, the sealing portion 116 and the scattering solution containing the self-assembled colloid adsorbed in the sealing portion are simultaneously secondarily cured. Accordingly, the self-assembling colloid protruding higher than the surface of the sealing portion 116 is fixed in the sealing portion 116.

Then, as shown in FIG. 6B, the self-assembled colloid is desorbed and removed from the sealing portion 116 through the HF-based scavenger, thereby forming a groove-shaped scattering pattern 126.

It will be apparent to those skilled in the art that various modifications and variations can be made in the present invention without departing from the spirit or scope of the invention. Will be clear to those who have knowledge of.

110: light source module 112: light emitting chip
114: wire 116:
118: reflective cup 120: lead frame
122: metal lead portions 124 and 126: scattering pattern

Claims (11)

delete delete delete delete Mounting a light emitting chip on an upper surface of the lead frame;
Sealing the mounted light emitting chip using a sealing part;
And removing the self-assembled colloid adsorbed on the surface of the sealing portion to form a groove-shaped scattering pattern,
The forming of the scattering pattern may include:
Spraying a scattering solution onto the encapsulation part or immersing it through a precipitation method before curing the encapsulation part;
Curing the sacrificial solution and the encapsulation to adsorb the self-assembled colloid in the scattering solution to the surface of the encapsulation,
And removing the adsorbed self-assembled colloid using HF. delete delete delete delete delete delete
KR1020100124011A 2010-12-07 2010-12-07 Light source module and method of manufacturing the same KR101756658B1 (en)

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KR1020100124011A KR101756658B1 (en) 2010-12-07 2010-12-07 Light source module and method of manufacturing the same

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Application Number Priority Date Filing Date Title
KR1020100124011A KR101756658B1 (en) 2010-12-07 2010-12-07 Light source module and method of manufacturing the same

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KR20120063017A KR20120063017A (en) 2012-06-15
KR101756658B1 true KR101756658B1 (en) 2017-07-12

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Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6777104B2 (en) * 2018-01-31 2020-10-28 日亜化学工業株式会社 Light emitting device and its manufacturing method
KR20220144589A (en) * 2021-04-20 2022-10-27 베이징 신냉 일렉트로닉 테크놀로지 씨오.,엘티디 Led package having improved beam spread angle

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003298115A (en) * 2002-04-05 2003-10-17 Citizen Electronics Co Ltd Light emitting diode

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003298115A (en) * 2002-04-05 2003-10-17 Citizen Electronics Co Ltd Light emitting diode

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