KR101755795B1 - Making copper nano particle and nano ink by underwater discharge - Google Patents
Making copper nano particle and nano ink by underwater discharge Download PDFInfo
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- KR101755795B1 KR101755795B1 KR1020150090262A KR20150090262A KR101755795B1 KR 101755795 B1 KR101755795 B1 KR 101755795B1 KR 1020150090262 A KR1020150090262 A KR 1020150090262A KR 20150090262 A KR20150090262 A KR 20150090262A KR 101755795 B1 KR101755795 B1 KR 101755795B1
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F9/00—Making metallic powder or suspensions thereof
- B22F9/02—Making metallic powder or suspensions thereof using physical processes
- B22F9/14—Making metallic powder or suspensions thereof using physical processes using electric discharge
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/52—Electrically conductive inks
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Abstract
The present invention provides a method for producing an ink comprising nanoparticles and nanoparticles, comprising the steps of: (S1) preparing an aqueous solution of copper precursor; Synthesizing nanoparticles by using an underwater discharge in the prepared aqueous solution (S2); Recovering the copper nanoparticles produced by underwater discharge (S3); And dispersing the recovered nanoparticles in a digital printing ink composition containing a hydrophilic organic solvent and an aqueous dispersant to synthesize a nano ink (S4).
Description
The present invention relates to a method for synthesizing nanoporous particles through plasma discharge in an aqueous solution containing a copper precursor, and a method for producing nanopowders using the synthesized particles.
Research on nanoceramic powder manufacturing technology has been carried out a lot, but nanometer metal powders have not been actively studied due to difficulty in treatment due to strong reactivity. Metal materials are unstable because the powder is unstable due to an increase in surface energy when the size of the powder is continuously decreased and the surface is continuously oxidized when stored in air.
In addition, printing electronic technology using metal nano ink is expected to lead the electronics industry by enabling the fabrication of wiring without using the existing semiconductor process and the production of electronic circuit on a flexible substrate.
Conventionally developed nanoparticle synthesis methods have focused on silver or gold. However, there is a problem that the raw material is expensive to be applied to a printing electron, and ion migration and aggregation occur. There have been reported methods of synthesizing copper nanoparticles to replace silver or gold nanoparticles. However, there are problems in that they are difficult to mass-produce because of problems of environmental pollution due to use of chemicals or high energy consumption.
On the other hand, underwater plasma discharge means a technique for generating plasma underwater by underwater electric discharge. Generally, such underwater plasma discharge is widely used for water quality improvement. It is used directly or indirectly, for example, in ship ballast water, ultrapure water production, and desalination.
The generation path of the underwater plasma varies. Underwater plasma generation due to the high voltage discharge in which the nearby electric field dissociates water molecules and ionization occurs due to the voltage applied to the electrodes inserted in the water is very large, and bubbles are formed between the two electrodes, A method of raising the temperature of the surface of the electrode up to the boiling point and forming a boundary layer (bubble) with water vapor on the surface of the electrode while discharging is performed in the bubble while flowing the electrolytic ions through the electrode in the electrolyte.
Such an underwater plasma discharge is expected to be applied to various fields of industry based on the potential of plasma, and to cope effectively in many fields.
The inventors have come to discover and discover new applications of underwater plasma discharge in accordance with the needs of this industry.
In order to solve the above problems, the present invention aims to synthesize copper nanoparticles using underwater discharge and to produce nano ink for printing electronics.
The present invention provides a method for preparing copper nanoparticles using energy generated by underwater discharge without using a chemical reducing agent in the aqueous solution with a metal precursor as a starting material.
It is an object of the present invention to mass-produce copper nanoparticles for printing electronics having a nano-size environmentally and economically at room temperature and atmospheric pressure, without using high energy such as chemicals, radiation, or electron beams.
In one aspect, the present invention provides a method comprising: preparing an aqueous solution comprising a copper precursor; And subjecting the aqueous solution to a plasma discharge.
In the plasma discharge,
A method of generating an underwater plasma in which a high voltage is applied to an electrode inserted in water to dissociate or ionize water molecules around the electrode;
A method of generating an underwater plasma in which bubbles are formed between two electrodes inserted in water and an electric field is generated to discharge the inside of bubbles;
A method of raising the temperature of the surface of the electrode inserted in the water up to the boiling point to form a bubble on the surface of the electrode and discharging the bubble;
- pulse underwater plasma discharge; or
- Includes capillary plasma discharge.
The plasma discharge method may be various methods using normal AC, direct current, pulse, RF, microwave, or the like.
The pulse in-water discharge or the capillary plasma discharge may be a method in which pulse power is supplied and discharged, and the pulse supply may be performed by an apparatus including, for example, a pulse generating unit and a pulse discharging unit.
As an example, the pulse generating unit may include: a first electrode; A second electrode surrounding the first electrode with the first electrode as a virtual center axis; Capacitors electrically connected to the first electrode and the second electrode at both ends thereof and arranged in parallel to each other in a circumferential direction radially with the first electrode as a center axis; An electrical supply connected to an input of the first electrode and configured to supply electrical energy to charge the capacitors; And a switch unit connected to the output terminal of the first electrode to discharge the pulse energy accumulated in the capacitors through the output terminal. In this unit, the capacitors are stacked in a plurality of rows along the longitudinal direction of the first electrode. The second electrode may be formed in a plurality of bars spaced radially with respect to the first electrode and connected to each of the capacitors.
Wherein the pulse discharge unit comprises: a metal tip electrically connected to an output terminal of the pulse generation unit; And a dielectric tube surrounding the metal tip. Alternatively, the pulse discharger may include a metal tip electrically connected to an output terminal of the pulse generator; And a dielectric tube surrounding the metal tip and protruding from the end of the metal tip by a predetermined length.
The material of the rapid tip of the electrode is tungsten, platinum or molybdenum, and the material of the dielectric tube is alumina or teflon.
The aqueous solution may comprise an organic solvent. The aqueous solution may be water alone or a mixture of water and an organic solvent. The organic solvent may include ethylene glycol, diethylene glycol, triethylene glycol, and polyethylene glycol.
The copper precursor, cyan East (Cu (CN) 2), copper oxalate (Cu (COO) 2), copper acetate (CuCOOCu), copper carbonate (CuCO 3), cupric chloride (CuCl 2), chloride 1 copper (CuCl), copper sulfate (CuSO 4), and may be at least one selected from the group consisting of copper nitrate (Cu (NO 3) 2) .
Copper is reduced from the copper precursor by the underwater plasma discharge, and the copper particles reduced by the effect of the discharge have a weak positive charge.
The aqueous solution includes an OH scavenger, and the antioxidant may be at least one selected from the group consisting of D-mannitol, N-acetyl-cysteine and N-methyl-2-pyrrolidone. The OH scavenger suppresses the oxidation of copper atoms due to OH radicals in the aqueous solution generated during the plasma discharge.
After the plasma discharge step, a metal or ion exchange filter is immersed in the aqueous solution to collect copper nanoparticles. Positively charged copper nanoparticles adsorb to the metal or ion exchange filter and become electrically neutral.
The plasma discharge is characterized by being capable of controlling the size of the copper nanoparticles by controlling the pulse width in the case of plasma in-pulse discharge. The pulse width can be increased to enlarge the size of the produced copper particles, and the width of the produced copper particles can be made smaller by narrowing the width.
In another aspect, the present invention provides a method of making an ink comprising nanoporous particles comprising immersing copper nanoparticles adsorbed on the metal or ion exchange filter into an ink composition. When metal or ion exchange filter adsorbing copper nanoparticles is immersed in the ink composition, nanoparticles are separated naturally and dispersed in the ink composition due to the dispersing power of the nanoparticles.
The ink composition includes an organic solvent for copper oxidation inhibition, a surfactant, and a dispersant to facilitate dispersion of the nanoparticles and to inhibit contact with oxygen.
The organic solvent may be at least one selected from the group consisting of an alcohol compound, an ether compound, and a ketone compound.
The alcohol compound may be at least one selected from the group consisting of water-soluble oligomers of methanol, ethanol, isopropanol, ternary butanol, trivalent amyl alcohol, mellicolector, butoxyethanol, methoxypropanol, methoxypropoxypropanol, ethylronglytol, ethylene glycol, And propylene glycol.
The ether compound may be at least one compound selected from ethylene glycol monomethyl ether, ethylene glycol dimethyl ether, propylene glycol dimethyl ether, and glycerol ether.
The ketone compound may be at least one compound selected from acetone and methyl ethyl ketone dioxane.
The surfactant may be at least one selected from polyoxyethylene olefin amine ether, polyoxyethylene lauryl ether, polyoxyethylene stearyl ether, and polyoxyethylene oleylpolyethylene glycol distearate.
The dispersing agent may be at least one selected from polydimethylsilane, alkylester polyol ester ammonium salt and alkyl acrylate alkyl ammonium salt.
According to another aspect of the present invention, there is provided a water treatment apparatus comprising: a first aqueous solution containing portion; A discharge unit fluidly connected to the first aqueous solution storage unit and having a width smaller than a width in the transverse direction of the first storage unit; A second aqueous solution accommodating portion fluidly connected to the discharge portion and located on the opposite side of the first accommodating portion and having a width larger than a width in the transverse direction of the discharge portion; An aqueous solution that sequentially flows through the first aqueous solution storage portion, the discharge portion, and the second aqueous solution storage portion and includes a copper precursor; And a pair of electrodes applied to two opposite surfaces of the discharge unit.
In another aspect, the present invention includes a venturi nozzle-type copper synthesis system in which at least two venturi nozzle-type copper synthesis apparatuses of claim 17 are connected in series in parallel to the flow direction of the aqueous solution.
The method for synthesizing copper nanoparticles of the present invention has an effect of not requiring a chemical reducing agent.
The present invention is to provide a new use of an underwater plasma method.
The present invention can mass-produce copper nanoparticles for printing electronics that are environmentally friendly and economically nano-sized at room temperature and atmospheric pressure, without using high energy such as chemicals, radiation, or electron beams.
Figure 1 is a flow chart illustrating the method of the present invention.
2 is a diagram illustrating a detailed configuration of a pulse circuit unit according to an embodiment of the present invention.
3 is a diagram showing a detailed configuration of a half-wave rectifying circuit unit 108 according to an embodiment of the present invention.
4 is a view showing a
5 is a view showing a
FIG. 6 is a photograph showing an aqueous solution of copper nanoparticles synthesized through the present invention. FIG.
7 is a photograph of copper nanoparticles synthesized using an underwater discharge.
FIG. 8 shows the EDX analysis results of the copper nanoparticles synthesized in FIG.
9 is a photograph showing an aqueous solution of copper nanoparticles synthesized through the present invention.
10 is a photograph showing the concentration of the copper nanoparticles synthesized by the discharge time.
11 is a TEM photograph of the synthesized copper nanoparticles.
12 is a view illustrating a venturi nozzle type copper synthesizing apparatus.
13 is a diagram illustrating a copper synthesis system in which a venturi nozzle type copper synthesis apparatus is connected in series.
14 is a configuration diagram showing a configuration of a pulse power supply unit according to an embodiment of the present invention.
15 is a plan view showing the arrangement of the capacitors of FIG.
FIG. 16 is a plan view showing another embodiment of the second electrode in FIG. 2. FIG.
17 is a configuration diagram showing a configuration of a pulse power supply apparatus according to an embodiment of the present invention.
FIG. 18 is a configuration diagram showing a configuration of a pulse power supply apparatus according to another embodiment of the second electrode of FIG. 4; FIG.
19 is a graph showing the particle size according to the pulse width.
Figure 1 is a flow chart illustrating the method of the present invention. A method of manufacturing an ink comprising nanoparticles and nanoparticles of the present invention comprises the steps of: (S1) preparing an aqueous solution of copper precursor; Synthesizing nanoparticles by using an underwater discharge in the prepared aqueous solution (S2); Recovering the copper nanoparticles produced by underwater discharge (S3); And dispersing the recovered nanoparticles in a digital printing ink composition containing a hydrophilic organic solvent and an aqueous dispersant to synthesize a nano ink (S4).
[Underwater plasma Discharge System for Discharging]
The pulsed power supply system as one embodiment of the underwater plasma discharge of the present invention includes a power supply unit, a voltage amplification unit, a pulse circuit unit, and a pulse discharge unit. A detailed description of this is found in Korean Patent Application No. 10-2011-0056077, which is incorporated herein by reference in its entirety.
1. Half wave rectification Supplier
As an example, the underwater discharge electrode of the present invention, for example, a capillary electrode system, can be subjected to half wave rectification. The system includes a power supply, a voltage amplifying part, a half wave rectifying circuit part, and a capillary discharging part. A detailed description of this is found in Korean Patent Application No. 10-2011-0056077, which is incorporated herein by reference in its entirety.
3 is a diagram showing a detailed configuration of a half-wave rectifying circuit unit 108 according to an embodiment of the present invention. As shown, the half-wave rectifying circuit part 108 according to an embodiment of the present invention includes at least one half-
The half-
The structure of the half-
2. Pulse
As an example of the pulse power generation of the present invention, the detailed configuration of the pulse circuit portion can be referred to Fig. As shown, the pulse circuit portion according to an embodiment of the present invention includes at least one high voltage
Each of the high voltage
The AC power input to the high voltage
The high-voltage
3.
As another example of the pulse power supply system, FIGS. 14 and 15 are referred to. The pulse
The
The
The
It is preferable that the grounding portion of the
The
Accordingly, since the pulse
Further, the
The
The
The pulse
In addition, the
16 illustrates another embodiment of the
As described above, the pulse
Hereinafter, a pulse power supply apparatus according to an embodiment of the present invention will be described.
17, a pulse
14, the detailed description thereof will be omitted. In the configuration of FIG. 17, the same reference numerals as those of FIG. 14 denote the same components . Hereinafter, a description will be given focusing mainly on the configuration that is generally similar to that shown in FIG.
The
The
The
In addition, although the
In the pulse
Here, the
Further, the pulse
FIG. 5 is a diagram showing a pulse power supply 1500b showing another embodiment of the
In the meantime, although the pulse power supply device 1500b has been described in the case where both the
As described above, the pulse
According to the above description, the pulse
4. Discharge electrode
4 is a view showing a
The
The
5 is a view showing a
The
The
The plasma discharge in the
The intensity of the Joule heat due to the surface discharge inside the
After that | Vp | continues to increase, the micro bubble bursts and breaks into several bubbles. When the fine bubbles are completely formed inside the
350 ml of DI water was prepared in a water tank as shown in FIG. 6, and a solution of dissolved CuCl 2 and CuCl was prepared. Ethanol was added to each water bath. This solution was initially a solution in which black and pale blue precipitates were not visually recognized, as can be seen in the before photograph of FIG. 6.
The pulse discharge system and the pulse electrode described above were prepared. The
The solution was placed in a water bath so that the pulse electrode and the ground electrode were located inside, and a pulse voltage was applied to the solution. The discharge time was 10 minutes, and the applied voltage was 160 kV p- p .
The sediment was confirmed as shown in the after photograph of FIG.
A metal plate was immersed in this solution to adsorb the precipitated particles, which was confirmed by SEM photographs, and it was confirmed that nanosized particles as shown in FIG. 7 were obtained. Also, as shown in FIG. 8, it is confirmed that the particles synthesized through EDX analysis are copper particles.
An aqueous solution containing CuCl dissolved in an organic solvent (ethanol) was prepared, and the aqueous solution was discharged underwater by using a pulse discharge system as in Experimental Example 1. As can be seen from the photograph of FIG. 9, the synthesis of copper nanoparticles was confirmed.
The concentration of the copper nanoparticles synthesized by the discharge time can be confirmed as shown in FIG.
The synthesized aqueous solution OH scavenger was added and the adsorption of copper nanoparticles was induced using a metal plate (iron plate). As shown in FIG. 11, copper nanoparticles synthesized through TEM analysis can be confirmed.
Experiments were conducted to confirm the change of particle size according to the pulse width. 350 ml of DI water was prepared in a water bath and CuCl 2 was added to prepare a dissolved aqueous solution. The change in particle size was measured while varying the pulse width using the pulse apparatus of the present invention. The results are shown in Fig. It was confirmed that the particle size increases with increasing pulse width.
The present invention provides a copper synthesis apparatus and a copper synthesis system capable of performing efficient nanoporous synthesis through underwater discharge. The copper synthesis apparatus of the present invention has a venturi tube shape. 12 is referred to. The apparatus includes a first aqueous
When a voltage is applied to the electrodes located on two surfaces of the discharge unit from the
The first aqueous solution containing portion may be a cylindrical tube. And contains an aqueous solution containing a copper precursor therein. The aqueous solution is configured to flow into a discharging portion that is fluidly connected to one longitudinal side of the first aqueous solution accommodating portion.
The discharge part may be a cylindrical tube. And the discharge portion is connected to the first aqueous solution accommodating portion and the second aqueous solution accommodating portion so as to fluidly communicate with both sides in the longitudinal direction. And the discharger is configured to receive the aqueous solution from the first aqueous solution storage portion and to discharge the aqueous solution into the second aqueous solution storage portion. The discharge unit includes a pair of electrodes facing the side surface, and a voltage is applied to the two electrodes such that underwater discharge occurs in the discharge unit. 12 and 13, the longitudinal direction means the longitudinal direction of the cylinder and the flow direction of the aqueous solution, and the transverse direction means the vertical direction of the longitudinal direction.
The second aqueous solution receiving portion may be a cylindrical tube. And is connected at one side in the longitudinal direction of the discharge part and at the opposite side of the first aqueous solution containing part in fluid communication with the discharge part. The aqueous solution treated underwater is introduced into the second aqueous solution storage portion from the discharge portion and accommodates the synthesized nanoporous particles.
The present invention provides a venturi nozzle type copper synthesis system in which two or more venturi nozzle type copper synthesis apparatuses are connected in series in parallel to the flow direction of the aqueous solution, as illustrated in FIG.
It is possible to increase the efficiency of copper synthesis by constructing underwater discharge in a narrow space of the shape of a venturi tube, and it is possible to increase the efficiency of the synthesis by making the circulation process and the continuous process possible.
Claims (21)
A cylindrical second electrode surrounding the first electrode with the first electrode as a virtual center axis;
Capacitors electrically connected to the outer surface of the first electrode and the inner surface of the second electrode at both ends thereof and arranged in parallel to each other along the circumferential direction radially with the first electrode as a center axis;
An electrical supply connected to an input of the first electrode and configured to supply electrical energy to charge the capacitors; And
And a switch unit connected to an output terminal of the first electrode to discharge pulse energy accumulated in the capacitors through the output terminal.
Pulsed power supply means for underwater pulsed copper discharge or copper nanoparticle underwater synthesis by capillary plasma discharge.
Wherein the capacitors are stacked in a plurality of rows along the longitudinal direction of the first electrode,
Pulsed power supply means for underwater pulsed copper discharge or copper nanoparticle underwater synthesis by capillary plasma discharge.
A discharge unit fluidly connected to the first aqueous solution storage unit and having a width smaller than a width in a lateral direction of the first aqueous solution storage unit;
A second aqueous solution accommodating portion fluidly connected to the discharge portion and located on the opposite side of the first aqueous solution accommodating portion and having a width larger than a width in the transverse direction of the discharge portion;
An aqueous solution that sequentially flows through the first aqueous solution storage portion, the discharge portion, and the second aqueous solution storage portion and includes a copper precursor;
And a pair of electrodes which are applied to two opposing surfaces of the discharge portion,
Venturi Nozzle Copper Nanoparticles Underwater Synthesis Device
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KR101808745B1 (en) * | 2016-05-24 | 2017-12-14 | 주식회사 엔팩 | Preparing method and appratus for metal nanoparticle |
CN111378402B (en) * | 2020-04-10 | 2021-01-12 | 山东宝龙达实业集团有限公司 | Preparation method and application of hydroxyl scavenging agent |
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KR101192252B1 (en) * | 2010-05-12 | 2012-10-17 | 한화케미칼 주식회사 | Aqueous Copper nano ink |
KR101280445B1 (en) * | 2011-06-10 | 2013-07-01 | 한국기초과학지원연구원 | Underwater discharge apparatus for purifying water |
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