KR101711737B1 - Detecting device for printed circuit board - Google Patents

Detecting device for printed circuit board Download PDF

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Publication number
KR101711737B1
KR101711737B1 KR1020150085939A KR20150085939A KR101711737B1 KR 101711737 B1 KR101711737 B1 KR 101711737B1 KR 1020150085939 A KR1020150085939 A KR 1020150085939A KR 20150085939 A KR20150085939 A KR 20150085939A KR 101711737 B1 KR101711737 B1 KR 101711737B1
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KR
South Korea
Prior art keywords
substrate
inspection
frame
unit
information
Prior art date
Application number
KR1020150085939A
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Korean (ko)
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KR20160149350A (en
Inventor
서승환
김지훈
위상옥
김대영
서재수
이칠성
조장환
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서승환
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Application filed by 서승환 filed Critical 서승환
Priority to KR1020150085939A priority Critical patent/KR101711737B1/en
Publication of KR20160149350A publication Critical patent/KR20160149350A/en
Application granted granted Critical
Publication of KR101711737B1 publication Critical patent/KR101711737B1/en

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
    • G01R31/2806—Apparatus therefor, e.g. test stations, drivers, analysers, conveyors
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
    • G01R31/2806—Apparatus therefor, e.g. test stations, drivers, analysers, conveyors
    • G01R31/2808—Holding, conveying or contacting devices, e.g. test adapters, edge connectors, extender boards
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2893—Handling, conveying or loading, e.g. belts, boats, vacuum fingers

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Testing Of Short-Circuits, Discontinuities, Leakage, Or Incorrect Line Connections (AREA)
  • Supply And Installment Of Electrical Components (AREA)

Abstract

A substrate inspection apparatus according to the present invention is a substrate inspection apparatus for inspecting both sides of a substrate, comprising: a body having a space formed therein; A discrimination unit installed at one side of the main body, for discriminating the substrate information by recognizing the substrate; And a second frame which is spaced apart from the first frame and moves in a width direction of the substrate in correspondence with the substrate information, the frame portion supporting the substrate, An inspection module which is moved in the width direction of the substrate in correspondence to the substrate information and is in contact with the substrate and inspects the substrate; an inspection module installed between the first frame part and the second frame part, And transfer means for transferring the substrate in the longitudinal direction of the frame portion.
According to the substrate inspecting apparatus of the present invention, the inspection module can be varied according to the model of various substrates, and the inspection pins contacting with the substrate can be commonly used to accommodate various substrate models. This can reduce the replacement time of the inspection pin and reduce the manufacturing cost and maintenance cost of the inspection module, which must be manufactured according to the model of the substrate. In addition, inspection modules are stacked so that a plurality of substrates can be inspected at the same time, thereby ensuring an occupied space, resulting in high space utilization efficiency. In addition, the substrate can be automatically transferred using the transfer means and the elevation portion, so that the productivity of the work can be improved.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an apparatus for inspecting a substrate, and more particularly, to an apparatus for inspecting a voltage, a current, a resistance, etc. by contacting a printed circuit board such as a PBA (Printed Board Assembly) substrate.

2. Description of the Related Art In general, a printed circuit board is manufactured by arranging electronic components such as chips, resistors, and wires on a substrate, completing the circuit assembly, and then examining the electrical integrity of the circuit such as voltage, current, and resistance. For this inspection, a test point (Test Point) is formed on the substrate.

The inspection process as described above is performed in the substrate inspection apparatus. The substrate inspection apparatus is provided with a pin block for selectively contacting a test point formed on an assembled circuit board. A current is made to flow through the pin block to the circuit board to detect whether the defect is defective or not.

Korean Patent Laid-Open No. 10-2014-0080166 discloses a technique related to the above-described conventional substrate inspection apparatus.

However, since the position and size of the substrate inspection apparatus according to the related art vary depending on the size and type of the printed circuit board, it is necessary to replace the pin block with an appropriate pin block. Further, it is inconvenient to additionally prepare facilities of the inspection apparatus according to the type of the pin block.

On the other hand, in order to inspect a plurality of substrates, the substrates must be manually arranged in the inspection apparatus and each of them must be connected to the inspection apparatus, thereby wasting time and manpower. In addition, as described above, an accident caused by carelessness can be caused by manual installation.

SUMMARY OF THE INVENTION The present invention has been made in order to solve the above problems, and it is an object of the present invention to provide a method and apparatus for inspecting models of various substrates through a single inspection apparatus, And an object of the present invention is to provide a substrate inspection apparatus with improved utilization efficiency.

According to an aspect of the present invention, there is provided a substrate inspection apparatus for inspecting both sides of a substrate, the substrate inspection apparatus comprising: a body having a space formed therein; A discrimination unit installed at one side of the main body, for discriminating the substrate information by recognizing the substrate; And a second frame which is spaced apart from the first frame and moves in a width direction of the substrate in correspondence with the substrate information, the frame portion supporting the substrate, An inspection module which is moved in the width direction of the substrate in correspondence to the substrate information and is in contact with the substrate and inspects the substrate; an inspection module installed between the first frame part and the second frame part, And transfer means for transferring the substrate in the longitudinal direction of the frame portion.

The discrimination unit includes a seating unit on which the substrate is placed and which conveys the substrate to the inspection unit, a discriminator provided on the seating unit for discriminating the substrate by moving in the X and Y directions, . ≪ / RTI >

The conveying means may be a pair of conveyor belts provided respectively in the first frame and the second frame, and may be provided between the first frame and the second frame, and may be conveyed in the longitudinal direction of the frame portion And a stopper cylinder for controlling the position of the substrate.

In addition, the inspection module may include a plurality of inspection pins protruding downward on one surface of the inspection module, the inspection pins contacting the substrate.

In addition, a plurality of the inspection units may be stacked up and down inside the main body.

The substrate inspecting apparatus may further include a lift unit installed in the main body and installed on one side of the inspection unit and selectively moving the substrate transferred by the determination unit up and down to the inspection unit.

According to the substrate inspection apparatus of the present invention,

The inspection module is variable in correspondence with the model of the various boards, and the inspection pins contacting with the boards are commonly used to accommodate various board models. This can reduce the replacement time of the inspection pin and reduce the manufacturing cost and maintenance cost of the inspection module, which must be manufactured according to the model of the substrate.

In addition, inspection modules are stacked so that a plurality of substrates can be inspected at the same time, thereby ensuring an occupied space, resulting in high space utilization efficiency.

In addition, the substrate can be automatically transferred using the transfer means and the elevation portion, so that the productivity of the work can be improved.

1 is a cross-sectional view of a substrate inspection apparatus according to an embodiment of the present invention,
FIG. 2 is a perspective view showing an inspection unit of the substrate inspection apparatus shown in FIG. 1,
3 is a plan view showing the inspection unit shown in Fig.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. Prior to this, terms and words used in the present specification and claims should not be construed as limited to ordinary or dictionary terms, and the inventor should appropriately interpret the concepts of the terms appropriately The present invention should be construed in accordance with the meaning and concept consistent with the technical idea of the present invention.

Therefore, the embodiments described in the present specification and the configurations shown in the drawings are merely the most preferred embodiments of the present invention, and not all of the technical ideas of the present invention are described. Therefore, at the time of the present application, It should be understood that variations can be made.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.

1 to 3, the apparatus for inspecting a substrate 10 according to an embodiment of the present invention is an apparatus for inspecting whether or not an electric defect such as a voltage, a current, A determination unit 200, and an inspection unit 300. [ Here, the substrate P may be a printed circuit board (PCB) and a printed board (PBA) substrate, but this is illustrative and can be applied to other types of substrates. In addition, a test point (Test Point) is preferably formed at both ends of the substrate (P) to inspect the substrate (P).

First, the main body 100 has a space formed therein. An apparatus such as an NG buffer (not shown) in which a defective substrate P is inspected after inspecting the substrate P may be further provided in the body 100 and a conveying device may be further provided. However, this is irrelevant to the gist of the present invention, and a detailed description thereof will be omitted here.

The discrimination unit 200 recognizes the substrate P and discriminates the substrate information, and is installed on one side of the main body 100. For this, the determination unit 200 includes a seating unit 210 and a recognizer 220.

The mounting part 210 has the upper surface thereof on which the substrate P is mounted and is supported at a position for discriminating the type of the substrate P. [ And transfers the substrate P to the inspection unit 300 to be described later. The seating part 210 is preferably composed of a belt for supporting both ends of the substrate P and may be transferred to the inspection part 300 through the belt. The belt can support both ends of the substrate P so that the components, wiring, and electronic chips installed on the upper side and the lower side of the substrate P can be safely transported to the inspection unit 300 without interfering with the outside.

The recognizer 220 is provided to discriminate the type of the substrate P and is spaced apart from the seating part 210. The recognizer 220 moves in the X-Y direction to scan a barcode printed on the substrate P. [ Thereby recognizing the type of the substrate P and discriminating the substrate information. As described above, it is preferable that the barcode of the substrate P be scanned and recognized. However, the barcode may be recognized by recognizing the shape through a vision, for example.

Referring to FIGS. 2 and 3, the inspection unit 300 includes a frame unit 310, an inspection module 320, and a conveying unit 330 for inspecting the substrate P. Referring to FIG.

The frame unit 310 supports the substrate P transferred from the discrimination unit 200. For this, the frame unit 310 includes a first frame 311 and a second frame 312.

The first frame 311 and the second frame 312 are spaced apart from each other. The second frame 312 moves in the width direction of the substrate P corresponding to the substrate information recognized by the determination unit 200. That is, the second frame 312 is movable in the width direction of the substrate P in correspondence with the substrate information, and the distance between the second frame 312 and the first frame 311 is variable. As the second frame 312 moves, various types of substrates P can be supported. As described above, when the frame unit 310 supports the substrate P, it is preferable that the first frame 311 is fixed to be a reference point. Also, the second frame 312 may be moved to vary the distance from the first frame 311 to support the substrate P through the second frame 312. However, the first frame 311 and the second frame 312 may be moved together in the width direction of the substrate P corresponding to the substrate information recognized by the determination unit 200 .

The inspection module 320 is installed on the upper side of the frame part 310. As the second frame 312 moves in the width direction of the substrate P corresponding to the substrate information, the inspection module 320 moves together. The inspection module 320 is moved to contact the substrate P and inspects the substrate P. [ For this, the inspection module 320 is provided with an inspection pin 321.

The inspection pin 321 may protrude downward on a surface of the inspection module 320 that contacts the substrate P. [ It is preferable that a plurality of the inspection pins 321 are provided, and the inspection pins 321 are brought into contact with the substrate P to inspect the voltage, current, resistance, etc. of the substrate P. That is, the inspection pin 321 is brought into contact with the test point of the substrate P, and a current is supplied to the substrate P through the inspection pin 321 to detect and inspect the defect. Here, it is preferable that the positions of the test points are formed at both ends of the substrate P, and the test points are unified regardless of the type of the substrate P. Accordingly, the inspection pins 321 can contact the various types of substrates P in a corresponding manner. Therefore, the inspection module 320 can inspect various types of substrates P.

The transfer unit 330 transfers the substrate P in the longitudinal direction of the frame unit 310. To this end, the conveying means 330 is installed between the first frame 311 and the second frame 312. It is preferable that the conveying means 330 is a pair of conveyor belts installed in the first frame 311 and the second frame 312, respectively. So that the substrate P is seated on the upper surfaces of the pair of conveyor belts and slidably moved. That is, the transfer means 330 is installed on the first frame and the second frame, respectively, and the substrate P can be seated on the upper surface thereof. The substrate P is transferred to a position for contacting the inspection module 320 through the transfer means 330. The transfer means 330 is installed on the first frame 311 and the second frame 312 so as to support both ends of the substrate P so that the resistances provided on the upper and lower sides of the substrate P , Wiring, electronic chip, and the like are not interfered with the outside, so that the substrate P can be safely transported.

The transfer means 330 may further include a stopper cylinder 331. The stopper cylinder 331 is installed between the first frame 311 and the second frame 312. The stopper cylinder 311 controls the position of the substrate P such that the stopper cylinder 311 is positioned at a proper position where the substrate P can contact the inspection module 320 when the substrate P is transported in the longitudinal direction of the frame part 310. That is, the stopper cylinder 331 is slidable upward and the movement of the substrate P in the longitudinal direction of the frame unit 310 is restricted by the tensioned stopper cylinder 331. Whereby the position of the substrate P can be controlled. The stopper cylinder 331 does not restrict the movement of the substrate P after the inspection of the substrate P is finished and then the substrate P is retracted downward so that the substrate P can be transferred to the next process .

The inspection unit 300 may be vertically stacked in the main body 100. That is, the inspection unit 300, which is stacked in a plurality of units, can simultaneously inspect a plurality of substrates P, thereby securing an occupied space and providing the substrate inspection apparatus 10 with high production efficiency. The substrate inspection apparatus 10 may further include a lifting unit 400.

The ascending and descending unit 400 is installed in the main body 100 and connected to the determining unit 200 to transfer the substrate P to the inspection unit 300. Here, it is preferable that a plurality of the inspection units 300 are stacked, and the elevation unit 400 is connected to one side of the inspection unit 300. The ascending and descending unit 400 ascends and descends the substrate P transferred from the determining unit 200 and selectively transfers the substrate P to the inspection unit 300. When the elevating part 400 transfers the substrate P, the inspection part 300 which is not inspected of the substrate P among the stacked inspection parts 300 is discriminated, In the direction of the arrow. Here, it is possible to convey the inspection unit 300 sequentially from the upper side to the lower side, for example, from the lower side to the upper side. That is, the elevation part 400 can automatically adjust the conveyance height corresponding to the position of the inspection part 300 to be conveyed, and the productivity of the work can be improved through the above-described automation process.

According to the substrate inspection apparatus 10 of the present invention as described above, the inspection module 320 is varied in correspondence with the model of the various substrates P, and the inspection pins 321 which are in contact with the substrate P are shared To accommodate various substrate (P) models. This can reduce the replacement time of the inspection pins 321 and reduce the manufacturing cost and the maintenance cost of the inspection module 320 that must be manufactured according to the model of the substrate.

In addition, the inspection module 320 is stacked so that a plurality of substrates P can be inspected at the same time, thereby occupying an occupied space.

In addition, the substrate P can be automatically transferred using the transfer unit 330 and the elevation unit 400, thereby improving work productivity.

While the present invention has been described with reference to exemplary embodiments, it is to be understood that the invention is not limited to the disclosed exemplary embodiments, but, on the contrary, is intended to cover various modifications and equivalent arrangements included within the spirit and scope of the appended claims. Accordingly, the true scope of the present invention should be determined by the technical idea of the appended claims.

10: Substrate testing apparatus 100:
200: discrimination unit 210: seat part
220: recognizer 300:
310: frame part 311: first frame
312: second frame 320: inspection module
321: Test pin 330: Feeding means 331: Stopper cylinder 400:
P: substrate

Claims (7)

A substrate inspection apparatus for inspecting both sides of a substrate,
A body having a space formed therein;
A discrimination unit installed at one side of the main body, for discriminating the substrate information by recognizing the substrate; And
And a second frame that is spaced apart from the first frame and moves in the width direction of the substrate in correspondence with the substrate information,
An inspection module installed on the frame part and moving in the width direction of the substrate in correspondence with the substrate information to make contact with the substrate and inspect the substrate,
And a conveying unit that is provided between the first frame and the second frame and conveys the substrate conveyed by the discriminating unit in the longitudinal direction of the frame unit,
Wherein,
A mounting portion on which the substrate is mounted to support both ends of the substrate, and which transfers the substrate to the inspection portion;
And a recognizer for recognizing the type of the substrate, wherein the recognizer recognizes the substrate by moving in the X and Y directions,
The inspection module comprises:
Wherein a plurality of inspection pins protruding downward are provided on one surface of the substrate in contact with the substrate, and the inspection pins are brought into contact with the substrate. delete The method according to claim 1,
The conveying means
And a pair of conveyor belts provided respectively in the first frame and the second frame. The method according to claim 1,
The conveying means
And a stopper cylinder provided between the first frame and the second frame for controlling the position of the substrate to be transported in the longitudinal direction of the frame portion. delete The method of claim 1, 3, or 4,
Wherein,
And a plurality of upper and lower substrates are stacked in the main body. The method of claim 6,
Further comprising a lift unit installed in the main body and installed at one side of the inspection unit for selectively lifting and lowering the substrate transferred by the determination unit and transferring the substrate to the inspection unit.
KR1020150085939A 2015-06-17 2015-06-17 Detecting device for printed circuit board KR101711737B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020150085939A KR101711737B1 (en) 2015-06-17 2015-06-17 Detecting device for printed circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020150085939A KR101711737B1 (en) 2015-06-17 2015-06-17 Detecting device for printed circuit board

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KR20160149350A KR20160149350A (en) 2016-12-28
KR101711737B1 true KR101711737B1 (en) 2017-03-14

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112676199B (en) * 2021-01-21 2024-10-18 东莞市聚明电子科技有限公司 Full-automatic test equipment for PCB (printed circuit board)
KR102660298B1 (en) * 2023-02-27 2024-04-25 주식회사 두성테크 Apparatus for inspecting a printed board assembly

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100691321B1 (en) * 2004-06-18 2007-03-12 삼성전자주식회사 Manufactured Goods Test System
KR20080005795A (en) * 2006-07-10 2008-01-15 삼성전기주식회사 Warpage sorting device and method for inspecting the warpage of the boards using the same
KR200463519Y1 (en) * 2010-11-04 2012-11-08 에스엔티코리아 주식회사 Device for inspecting printed circuited board

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