KR101705583B1 - 패턴이 형성된 플렉서블 투명전극의 제조방법 - Google Patents
패턴이 형성된 플렉서블 투명전극의 제조방법 Download PDFInfo
- Publication number
- KR101705583B1 KR101705583B1 KR1020160161345A KR20160161345A KR101705583B1 KR 101705583 B1 KR101705583 B1 KR 101705583B1 KR 1020160161345 A KR1020160161345 A KR 1020160161345A KR 20160161345 A KR20160161345 A KR 20160161345A KR 101705583 B1 KR101705583 B1 KR 101705583B1
- Authority
- KR
- South Korea
- Prior art keywords
- resin
- substrate
- metal
- transparent electrode
- polymer
- Prior art date
Links
- 238000004519 manufacturing process Methods 0.000 title abstract description 22
- 229910052751 metal Inorganic materials 0.000 claims abstract description 192
- 239000002184 metal Substances 0.000 claims abstract description 192
- 239000002070 nanowire Substances 0.000 claims abstract description 150
- 239000002952 polymeric resin Substances 0.000 claims abstract description 88
- 238000000034 method Methods 0.000 claims abstract description 81
- 229920003002 synthetic resin Polymers 0.000 claims abstract description 68
- 238000011282 treatment Methods 0.000 claims abstract description 43
- 238000010884 ion-beam technique Methods 0.000 claims abstract description 18
- 238000010894 electron beam technology Methods 0.000 claims abstract description 15
- 239000000853 adhesive Substances 0.000 claims abstract description 14
- 230000001070 adhesive effect Effects 0.000 claims abstract description 14
- 239000000758 substrate Substances 0.000 claims description 146
- 239000010410 layer Substances 0.000 claims description 116
- 229920001600 hydrophobic polymer Polymers 0.000 claims description 75
- 229920006254 polymer film Polymers 0.000 claims description 35
- 229920000642 polymer Polymers 0.000 claims description 33
- 238000000576 coating method Methods 0.000 claims description 27
- 239000011248 coating agent Substances 0.000 claims description 26
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical group [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 22
- 229920005989 resin Polymers 0.000 claims description 22
- 239000011347 resin Substances 0.000 claims description 22
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 17
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 claims description 15
- 238000004528 spin coating Methods 0.000 claims description 15
- 239000011247 coating layer Substances 0.000 claims description 13
- 239000011521 glass Substances 0.000 claims description 12
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 9
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 claims description 9
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 9
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 9
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims description 9
- 229910052710 silicon Inorganic materials 0.000 claims description 9
- 239000010703 silicon Substances 0.000 claims description 9
- 238000001723 curing Methods 0.000 claims description 8
- 239000007789 gas Substances 0.000 claims description 7
- 239000010949 copper Substances 0.000 claims description 6
- 239000010931 gold Substances 0.000 claims description 6
- 239000002904 solvent Substances 0.000 claims description 6
- 229920001477 hydrophilic polymer Polymers 0.000 claims description 5
- 229920001721 polyimide Polymers 0.000 claims description 5
- 229930182556 Polyacetal Natural products 0.000 claims description 4
- 238000001035 drying Methods 0.000 claims description 4
- 229920001225 polyester resin Polymers 0.000 claims description 4
- 239000004645 polyester resin Substances 0.000 claims description 4
- 229920006324 polyoxymethylene Polymers 0.000 claims description 4
- 239000008213 purified water Substances 0.000 claims description 4
- OAYXUHPQHDHDDZ-UHFFFAOYSA-N 2-(2-butoxyethoxy)ethanol Chemical compound CCCCOCCOCCO OAYXUHPQHDHDDZ-UHFFFAOYSA-N 0.000 claims description 3
- 239000004925 Acrylic resin Substances 0.000 claims description 3
- 229920000178 Acrylic resin Polymers 0.000 claims description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 3
- 229910052782 aluminium Inorganic materials 0.000 claims description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 3
- 239000012461 cellulose resin Substances 0.000 claims description 3
- 229910052802 copper Inorganic materials 0.000 claims description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 3
- 229910052737 gold Inorganic materials 0.000 claims description 3
- 238000011416 infrared curing Methods 0.000 claims description 3
- 229910044991 metal oxide Inorganic materials 0.000 claims description 3
- 150000004706 metal oxides Chemical class 0.000 claims description 3
- 238000013008 moisture curing Methods 0.000 claims description 3
- 239000002121 nanofiber Substances 0.000 claims description 3
- 229910052759 nickel Inorganic materials 0.000 claims description 3
- 229910052697 platinum Inorganic materials 0.000 claims description 3
- 229920006122 polyamide resin Polymers 0.000 claims description 3
- 239000009719 polyimide resin Substances 0.000 claims description 3
- 229920005672 polyolefin resin Polymers 0.000 claims description 3
- 229920005749 polyurethane resin Polymers 0.000 claims description 3
- 239000010453 quartz Substances 0.000 claims description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 3
- 229920002050 silicone resin Polymers 0.000 claims description 3
- 229910052709 silver Inorganic materials 0.000 claims description 3
- 239000004332 silver Substances 0.000 claims description 3
- 229920001187 thermosetting polymer Polymers 0.000 claims description 3
- 239000010936 titanium Substances 0.000 claims description 3
- 229910052719 titanium Inorganic materials 0.000 claims description 3
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 claims description 3
- 229920002554 vinyl polymer Polymers 0.000 claims description 3
- 229920002492 poly(sulfone) Polymers 0.000 claims description 2
- 230000008569 process Effects 0.000 abstract description 25
- 238000000206 photolithography Methods 0.000 abstract description 12
- 239000000463 material Substances 0.000 abstract description 6
- 238000007641 inkjet printing Methods 0.000 abstract description 5
- 238000007646 gravure printing Methods 0.000 abstract description 4
- 238000007796 conventional method Methods 0.000 abstract description 2
- 239000012776 electronic material Substances 0.000 abstract description 2
- 239000002042 Silver nanowire Substances 0.000 description 18
- 238000009832 plasma treatment Methods 0.000 description 11
- 238000000059 patterning Methods 0.000 description 10
- 230000003746 surface roughness Effects 0.000 description 9
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 8
- 239000004926 polymethyl methacrylate Substances 0.000 description 8
- -1 polyethylene terephthalate Polymers 0.000 description 7
- 238000002834 transmittance Methods 0.000 description 7
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 6
- 230000000052 comparative effect Effects 0.000 description 5
- 230000001678 irradiating effect Effects 0.000 description 5
- 235000012431 wafers Nutrition 0.000 description 5
- CBENFWSGALASAD-UHFFFAOYSA-N Ozone Chemical compound [O-][O+]=O CBENFWSGALASAD-UHFFFAOYSA-N 0.000 description 4
- 239000007788 liquid Substances 0.000 description 4
- 230000000704 physical effect Effects 0.000 description 4
- 229920000742 Cotton Polymers 0.000 description 3
- 239000003822 epoxy resin Substances 0.000 description 3
- 238000005530 etching Methods 0.000 description 3
- 239000003960 organic solvent Substances 0.000 description 3
- 229920000647 polyepoxide Polymers 0.000 description 3
- 229920000139 polyethylene terephthalate Polymers 0.000 description 3
- 239000005020 polyethylene terephthalate Substances 0.000 description 3
- 230000003578 releasing effect Effects 0.000 description 3
- 238000000926 separation method Methods 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- 238000004381 surface treatment Methods 0.000 description 3
- WSSSPWUEQFSQQG-UHFFFAOYSA-N 4-methyl-1-pentene Chemical compound CC(C)CC=C WSSSPWUEQFSQQG-UHFFFAOYSA-N 0.000 description 2
- 239000004695 Polyether sulfone Substances 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 2
- 239000000443 aerosol Substances 0.000 description 2
- 238000004630 atomic force microscopy Methods 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 239000004205 dimethyl polysiloxane Substances 0.000 description 2
- KPUWHANPEXNPJT-UHFFFAOYSA-N disiloxane Chemical class [SiH3]O[SiH3] KPUWHANPEXNPJT-UHFFFAOYSA-N 0.000 description 2
- 238000009713 electroplating Methods 0.000 description 2
- 238000004299 exfoliation Methods 0.000 description 2
- 230000002209 hydrophobic effect Effects 0.000 description 2
- 238000001459 lithography Methods 0.000 description 2
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 2
- 229910052753 mercury Inorganic materials 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 229920002120 photoresistant polymer Polymers 0.000 description 2
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 description 2
- 229920006393 polyether sulfone Polymers 0.000 description 2
- 229920000307 polymer substrate Polymers 0.000 description 2
- 238000007639 printing Methods 0.000 description 2
- 238000007650 screen-printing Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 229920002379 silicone rubber Polymers 0.000 description 2
- 239000004945 silicone rubber Substances 0.000 description 2
- 239000004634 thermosetting polymer Substances 0.000 description 2
- 238000001771 vacuum deposition Methods 0.000 description 2
- ZCHGODLGROULLT-UHFFFAOYSA-N 2,2-bis(hydroxymethyl)propane-1,3-diol;propane-1,2-diol Chemical compound CC(O)CO.OCC(CO)(CO)CO ZCHGODLGROULLT-UHFFFAOYSA-N 0.000 description 1
- 229920000089 Cyclic olefin copolymer Polymers 0.000 description 1
- 239000001856 Ethyl cellulose Substances 0.000 description 1
- ZZSNKZQZMQGXPY-UHFFFAOYSA-N Ethyl cellulose Chemical compound CCOCC1OC(OC)C(OCC)C(OCC)C1OC1C(O)C(O)C(OC)C(CO)O1 ZZSNKZQZMQGXPY-UHFFFAOYSA-N 0.000 description 1
- 229920002292 Nylon 6 Polymers 0.000 description 1
- 229920002302 Nylon 6,6 Polymers 0.000 description 1
- 239000005062 Polybutadiene Substances 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- 229920001328 Polyvinylidene chloride Polymers 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000032798 delamination Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 239000012153 distilled water Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 229920001249 ethyl cellulose Polymers 0.000 description 1
- 235000019325 ethyl cellulose Nutrition 0.000 description 1
- 230000009477 glass transition Effects 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000005661 hydrophobic surface Effects 0.000 description 1
- 239000007791 liquid phase Substances 0.000 description 1
- 238000000691 measurement method Methods 0.000 description 1
- 238000000813 microcontact printing Methods 0.000 description 1
- 239000002071 nanotube Substances 0.000 description 1
- 238000007645 offset printing Methods 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 230000035699 permeability Effects 0.000 description 1
- 229920001084 poly(chloroprene) Polymers 0.000 description 1
- 229920001483 poly(ethyl methacrylate) polymer Polymers 0.000 description 1
- 229920003207 poly(ethylene-2,6-naphthalate) Polymers 0.000 description 1
- 229920002037 poly(vinyl butyral) polymer Polymers 0.000 description 1
- 229920000058 polyacrylate Polymers 0.000 description 1
- 229920002239 polyacrylonitrile Polymers 0.000 description 1
- 229920002857 polybutadiene Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 239000011112 polyethylene naphthalate Substances 0.000 description 1
- 239000002861 polymer material Substances 0.000 description 1
- 229920000098 polyolefin Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 229920002689 polyvinyl acetate Polymers 0.000 description 1
- 239000011118 polyvinyl acetate Substances 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 239000005033 polyvinylidene chloride Substances 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
- 238000010301 surface-oxidation reaction Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0224—Electrodes
- H01L31/022466—Electrodes made of transparent conductive layers, e.g. TCO, ITO layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0216—Coatings
- H01L31/02161—Coatings for devices characterised by at least one potential jump barrier or surface barrier
- H01L31/02167—Coatings for devices characterised by at least one potential jump barrier or surface barrier for solar cells
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0236—Special surface textures
- H01L31/02366—Special surface textures of the substrate or of a layer on the substrate, e.g. textured ITO/glass substrate or superstrate, textured polymer layer on glass substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/0248—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies
- H01L31/036—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by their crystalline structure or particular orientation of the crystalline planes
- H01L31/0392—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by their crystalline structure or particular orientation of the crystalline planes including thin films deposited on metallic or insulating substrates ; characterised by specific substrate materials or substrate features or by the presence of intermediate layers, e.g. barrier layers, on the substrate
- H01L31/03926—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by their crystalline structure or particular orientation of the crystalline planes including thin films deposited on metallic or insulating substrates ; characterised by specific substrate materials or substrate features or by the presence of intermediate layers, e.g. barrier layers, on the substrate comprising a flexible substrate
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electromagnetism (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Sustainable Energy (AREA)
- Laminated Bodies (AREA)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020160161345A KR101705583B1 (ko) | 2016-11-30 | 2016-11-30 | 패턴이 형성된 플렉서블 투명전극의 제조방법 |
PCT/KR2017/001680 WO2018101540A1 (fr) | 2016-11-30 | 2017-02-16 | Procédé de fabrication d'une électrode transparente souple ayant un motif |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020160161345A KR101705583B1 (ko) | 2016-11-30 | 2016-11-30 | 패턴이 형성된 플렉서블 투명전극의 제조방법 |
Publications (1)
Publication Number | Publication Date |
---|---|
KR101705583B1 true KR101705583B1 (ko) | 2017-02-13 |
Family
ID=58155981
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020160161345A KR101705583B1 (ko) | 2016-11-30 | 2016-11-30 | 패턴이 형성된 플렉서블 투명전극의 제조방법 |
Country Status (2)
Country | Link |
---|---|
KR (1) | KR101705583B1 (fr) |
WO (1) | WO2018101540A1 (fr) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20190020527A (ko) | 2017-08-21 | 2019-03-04 | 금오공과대학교 산학협력단 | 패턴이 형성된 플렉서블 투명전극의 제조방법 |
JP2022539623A (ja) * | 2019-05-13 | 2022-09-13 | 京東方科技集團股▲ふん▼有限公司 | 発光デバイス及びその製造方法 |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN114678173A (zh) * | 2022-04-06 | 2022-06-28 | 重庆工程职业技术学院 | 银纳米线在粗糙衬底上的图案化方法、以及具有银纳米线图案的柔性导电材料和应用 |
CN115064618B (zh) * | 2022-08-17 | 2022-11-29 | 苏州晶台光电有限公司 | 一种cob模组封装方法 |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101112058B1 (ko) * | 2010-12-31 | 2012-02-24 | 한국생산기술연구원 | 원자층 형성 공정의 선택적 증착으로 투명전극이 제조된 채널 구조의 태양전지 제조방법 |
KR101161301B1 (ko) | 2012-05-21 | 2012-07-04 | 한국기계연구원 | 플라즈마를 이용한 금속 배선이 함몰된 유연 기판의 제조방법 및 이에 따라 제조되는 유연 기판 |
KR101191865B1 (ko) | 2011-04-20 | 2012-10-16 | 한국기계연구원 | 금속 배선이 함몰된 유연 기판의 제조방법 및 이에 따라 제조되는 유연 기판 |
KR101263194B1 (ko) * | 2012-05-23 | 2013-05-10 | 주식회사 한국엔티켐 | 금속 나노구조체와 전도성 고분자로 이루어진 복수개의 혼합 도전층을 포함하는 투명 전도성 박막 및 이의 제조방법. |
KR20160130017A (ko) * | 2015-04-30 | 2016-11-10 | 성균관대학교산학협력단 | 투명전극의 제조방법 및 이로부터 제조된 투명전극 |
KR101685069B1 (ko) * | 2016-04-01 | 2016-12-09 | 금오공과대학교 산학협력단 | 패턴이 형성된 플렉서블 투명전극의 제조방법 |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4775204B2 (ja) * | 2006-09-20 | 2011-09-21 | 凸版印刷株式会社 | 導電性パターンの形成方法、配線板の製造方法及び配線板 |
-
2016
- 2016-11-30 KR KR1020160161345A patent/KR101705583B1/ko active IP Right Grant
-
2017
- 2017-02-16 WO PCT/KR2017/001680 patent/WO2018101540A1/fr active Application Filing
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101112058B1 (ko) * | 2010-12-31 | 2012-02-24 | 한국생산기술연구원 | 원자층 형성 공정의 선택적 증착으로 투명전극이 제조된 채널 구조의 태양전지 제조방법 |
KR101191865B1 (ko) | 2011-04-20 | 2012-10-16 | 한국기계연구원 | 금속 배선이 함몰된 유연 기판의 제조방법 및 이에 따라 제조되는 유연 기판 |
KR101161301B1 (ko) | 2012-05-21 | 2012-07-04 | 한국기계연구원 | 플라즈마를 이용한 금속 배선이 함몰된 유연 기판의 제조방법 및 이에 따라 제조되는 유연 기판 |
KR101263194B1 (ko) * | 2012-05-23 | 2013-05-10 | 주식회사 한국엔티켐 | 금속 나노구조체와 전도성 고분자로 이루어진 복수개의 혼합 도전층을 포함하는 투명 전도성 박막 및 이의 제조방법. |
KR20160130017A (ko) * | 2015-04-30 | 2016-11-10 | 성균관대학교산학협력단 | 투명전극의 제조방법 및 이로부터 제조된 투명전극 |
KR101685069B1 (ko) * | 2016-04-01 | 2016-12-09 | 금오공과대학교 산학협력단 | 패턴이 형성된 플렉서블 투명전극의 제조방법 |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20190020527A (ko) | 2017-08-21 | 2019-03-04 | 금오공과대학교 산학협력단 | 패턴이 형성된 플렉서블 투명전극의 제조방법 |
JP2022539623A (ja) * | 2019-05-13 | 2022-09-13 | 京東方科技集團股▲ふん▼有限公司 | 発光デバイス及びその製造方法 |
Also Published As
Publication number | Publication date |
---|---|
WO2018101540A1 (fr) | 2018-06-07 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
KR101685069B1 (ko) | 패턴이 형성된 플렉서블 투명전극의 제조방법 | |
KR101919767B1 (ko) | 투명전극의 제조방법 | |
KR101705583B1 (ko) | 패턴이 형성된 플렉서블 투명전극의 제조방법 | |
US20150216057A1 (en) | Method for manufacturing flexible-embedded electrode film using heat-pressure welding transcription | |
US8012667B2 (en) | Soft mold and method of fabricating the same | |
US20080047930A1 (en) | Method to form a pattern of functional material on a substrate | |
KR100843552B1 (ko) | 나노 임프린트 공정을 이용한 나노 전극선 제조 방법 | |
KR102005262B1 (ko) | 패턴이 형성된 플렉서블 투명전극의 제조방법 | |
EP2715778A1 (fr) | Procédé de transfert de films minces | |
JP2010525961A (ja) | スタンプの表面を処理することにより、基板上に機能材料のパターンを形成する方法 | |
JP2010522101A (ja) | 表面改質材を有するスタンプを用いて基板上に機能材料のパターンを形成する方法 | |
KR101565835B1 (ko) | 복제 몰드 제조 방법 및 이를 이용한 미세 구조 및 그 활용. | |
KR101907581B1 (ko) | 초박막 건식 접착 반사 방지 투명전극의 제조방법 | |
KR101291727B1 (ko) | 임프린트 레진의 제조방법 및 임프린팅 방법 | |
KR101932584B1 (ko) | 구조 일체형 플렉서블 투명전극 및 이의 제조방법 | |
KR101873206B1 (ko) | 패턴이 형성된 플렉서블 투명전극의 제조방법 | |
WO2015016532A1 (fr) | Procédé pour fabriquer un film d'électrode intégrée flexible en utilisant une transcription de soudage sous pression à chaud | |
KR101573052B1 (ko) | 나노 물질 패턴의 제조방법 | |
KR101937370B1 (ko) | 투명 전도성 건식 접착 필름 및 이의 제조방법 | |
KR20230157257A (ko) | 도전볼을 포함하는 이방전도성 탄성소재 및 이의 제조방법 | |
KR20160000563A (ko) | 나노 물질 패턴의 제조방법 | |
KR102464438B1 (ko) | 연신성 acf, 이의 제조방법, 이를 포함하는 계면 접합 부재 및 소자 | |
KR101588287B1 (ko) | 나노 물질 패턴의 제조방법 | |
KR102234305B1 (ko) | 양면에 일체화된 요철구조를 갖는 금속 나노와이어 함침형 투명전극 및 이의 제조방법 | |
CN111099576A (zh) | 一种图案化碳纳米管阵列柔性复合薄膜的制备方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
N231 | Notification of change of applicant | ||
E701 | Decision to grant or registration of patent right | ||
GRNT | Written decision to grant |