KR101689475B1 - Electromagnetic wave absorber film, and method of fabricating of the same - Google Patents

Electromagnetic wave absorber film, and method of fabricating of the same Download PDF

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Publication number
KR101689475B1
KR101689475B1 KR1020150100874A KR20150100874A KR101689475B1 KR 101689475 B1 KR101689475 B1 KR 101689475B1 KR 1020150100874 A KR1020150100874 A KR 1020150100874A KR 20150100874 A KR20150100874 A KR 20150100874A KR 101689475 B1 KR101689475 B1 KR 101689475B1
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KR
South Korea
Prior art keywords
plate
coating layer
electromagnetic wave
base film
shaped structures
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KR1020150100874A
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Korean (ko)
Inventor
윤재원
표정석
김락원
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(주)휴켐
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q17/00—Devices for absorbing waves radiated from an antenna; Combinations of such devices with active antenna elements or systems
    • H01Q17/002—Devices for absorbing waves radiated from an antenna; Combinations of such devices with active antenna elements or systems using short elongated elements as dissipative material, e.g. metallic threads or flake-like particles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
    • B32B5/16—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by features of a layer formed of particles, e.g. chips, powder or granules
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials
    • H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
    • H05K9/0083—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising electro-conductive non-fibrous particles embedded in an electrically insulating supporting structure, e.g. powder, flakes, whiskers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials
    • H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
    • H05K9/0088—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising a plurality of shielding layers; combining different shielding material structure

Abstract

Provided is a manufacturing method of an electromagnetic wave absorbing film. The manufacturing method of the electromagnetic wave absorbing film comprises the following steps of: preparing nano-soft magnetism plate shaped structures having magnetic metal; mixing the plate shaped structures with a binder to manufacture a source; coating the source on a base film wherein the source includes the plate shaped structures to form a coating layer; and applying a magnetic field to the base film on which the coating layer is formed to align the plate shaped structures in the coating layer in one direction.

Description

TECHNICAL FIELD [0001] The present invention relates to an electromagnetic wave absorber film,

The present invention relates to an electromagnetic wave absorbing film and a method of manufacturing the same, and more particularly to an electromagnetic wave absorbing film in which plate-shaped structures are arranged in one direction using a magnetic field and a method of manufacturing the same.

2. Description of the Related Art Recently, various digital electronic devices such as PCs, portable terminals, portable media players and the like have been widely used. Accordingly, there is a problem that an electromagnetic wave generated in an electronic device affects another electronic device through a space, or affects another electronic device through a wire or a PCB to cause a malfunction.

Such electromagnetic disturbances are manifested in various ways ranging from malfunctions of computers to accidental incidents of factories, and furthermore, research results that have a negative impact on the human body have been announced, thus raising concerns and concern about health. In addition, in the advanced countries, the electromagnetic wave absorption and shielding technology for various electronic appliances is emerging as the core technology field of the electronic industry, while strengthening the regulations on electromagnetic interference and preparing countermeasures.

Accordingly, various techniques for electromagnetic wave absorption and shielding have been developed. For example, Korean Patent Registration No. 10-0995563 (Application No. 10-2010-0041847, filed by Inox Co., Ltd.) has been applied to an electric wave shielding electric wire which is excellent in adhesive force, heat resistance, electric conductivity and bendability, A conductive adhesive film is disclosed.

Korean Patent Registration Bulletin 10-0995563

SUMMARY OF THE INVENTION The present invention provides a highly reliable electromagnetic wave absorbing film and a method of manufacturing the same.

It is another object of the present invention to provide an electromagnetic wave absorbing film having improved electromagnetic wave absorption characteristics and a method of manufacturing the same.

Another aspect of the present invention is to provide a method of manufacturing an electromagnetic wave absorbing film for arranging plate-shaped structures in a simplified manner.

Another object of the present invention is to provide an electromagnetic wave absorbing film in which plate-like structures including a magnetic metal are aligned and a method of manufacturing the same.

The technical problem to be solved by the present invention is not limited to the above.

In order to solve the above technical problems, the present invention provides a method of manufacturing an electromagnetic wave absorbing film.

According to one embodiment, the method of manufacturing an electromagnetic wave absorbing film includes the steps of preparing nano soft magnetic platelets including a magnetic metal, mixing the plate structures with a binder to prepare a source Coating the source including the plate-shaped structures on a base film to form a coating layer; and applying a magnetic field to the base film on which the coating layer is formed to form the plate- And aligning them in one direction.

According to one embodiment, the step of applying a magnetic field to the base film on which the coating layer is formed may include placing an electromagnet or a permanent magnet on at least one of the upper surface and the lower surface of the base film .

According to one embodiment, the plate structure may include an oblique to the lower surface of the base film.

According to one embodiment, the method of manufacturing an electromagnetic wave absorbing film may further include a step of heat treating and drying the base film on which the coating layer is formed, after the plate-shaped structures are arranged in the one direction.

In order to solve the above technical problem, the present invention provides an electromagnetic wave absorbing film.

According to one embodiment, the electromagnetic wave absorbing film includes a base film, and a coating layer disposed on the base film, the coating layer including nano soft magnetic platelets including a magnetic metal, Can be inclined with respect to the lower surface or the upper surface of the film.

According to one embodiment, the plate structures may comprise a plurality of metal structures aggregated.

In order to solve the above technical problems, the present invention provides an electronic device including an electromagnetic wave absorbing film.

According to one embodiment, the electronic device includes the electromagnetic wave absorbing film manufactured according to the method of manufacturing the electromagnetic wave absorbing film according to the embodiment of the present invention described above, or the electromagnetic wave absorbing film according to the embodiment of the present invention described above .

According to an embodiment of the present invention, a source including the plate-shaped structures is coated on a base film to form a coating layer, and a magnetic field is applied to the coating layer to arrange the plate-shaped structures in the coating layer in one direction . Accordingly, the plate-shaped structures can be stacked and aligned in one direction. Accordingly, an electromagnetic wave absorbing film having improved electromagnetic wave absorption efficiency and a manufacturing method thereof can be provided.

1 is a flowchart illustrating a method of manufacturing an electromagnetic wave absorbing film according to an embodiment of the present invention.
2 is a view for explaining a manufacturing process of an electromagnetic wave absorbing film according to an embodiment of the present invention.
3 is an enlarged view of a part of the manufacturing process of the electromagnetic wave absorbing film shown in Fig.
4 is a view for explaining a plate-like structure included in an electromagnetic wave absorbing film according to an embodiment of the present invention.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. However, the technical spirit of the present invention is not limited to the embodiments described herein but may be embodied in other forms. Rather, the embodiments disclosed herein are provided so that the disclosure can be thorough and complete, and will fully convey the concept of the invention to those skilled in the art.

In this specification, when an element is referred to as being on another element, it may be directly formed on another element, or a third element may be interposed therebetween. Further, in the drawings, the thicknesses of the films and regions are exaggerated for an effective explanation of the technical content.

Also, while the terms first, second, third, etc. in the various embodiments of the present disclosure are used to describe various components, these components should not be limited by these terms. These terms have only been used to distinguish one component from another. Thus, what is referred to as a first component in any one embodiment may be referred to as a second component in another embodiment. Each embodiment described and exemplified herein also includes its complementary embodiment. Also, in this specification, 'and / or' are used to include at least one of the front and rear components.

The singular forms "a", "an", and "the" include plural referents unless the context clearly dictates otherwise. It is also to be understood that the terms such as " comprises "or" having "are intended to specify the presence of stated features, integers, Should not be understood to exclude the presence or addition of one or more other elements, elements, or combinations thereof. Also, in this specification, the term "connection " is used to include both indirectly connecting and directly connecting a plurality of components.

In the following description of the present invention, a detailed description of known functions and configurations incorporated herein will be omitted when it may make the subject matter of the present invention rather unclear.

FIG. 1 is a flow chart for explaining a method of manufacturing an electromagnetic wave absorbing film according to an embodiment of the present invention, FIG. 2 is a view for explaining a manufacturing process of an electromagnetic wave absorbing film according to an embodiment of the present invention, FIG. 4 is a view for explaining a plate-like structure included in the electromagnetic wave-absorbing film according to the embodiment of the present invention.

Referring to FIGS. 1 to 4, a nano soft magnetic plate structure 120a including a magnetic metal is prepared (S110). The plate-shaped structure 120a may be formed of a magnetic metal. According to one embodiment, the plate-shaped structure 120a may be made of an Fe-based alloy, a Ni-based metal, a Co-based metal or a Ni-Fe-based metal (for example, a Ni content of 40 to 90% And a metal (for example, an Fe content of 30 to 90 wt%). Alternatively, according to another embodiment, the plate-shaped structure 120a may further include tungsten (W), copper (Cu), molybdenum (Mo), chromium (Cr), aluminum (Al) .

As shown in FIG. 4, the plate-shaped structure 120a may be formed by aggregating a plurality of metal structures 120b. For example, the metal structures 120b having a size of 100 nm or less may aggregate to form the plate-shaped structure 120a having a size of 100 m or less.

The method for producing the plate-shaped structure 120a includes the steps of preparing a metal oxide, pulverizing the metal oxide into a nano-sized powder, producing a magnetic metal powder by reducing the pulverized metal oxide, And subjecting the magnetic metal powder treated by the plate treatment to heat treatment to remove residual stress. The magnetic metal powder is subjected to plate-like processing, and coagulates with the pores to form the porous plate-like structure 120a. The ground metal oxide may have a size of 100 nm or less. As a result, the magnetic metal powder can easily be flattened at low energy.

For example, the step of pulverizing the metal oxide and the step of plate-finishing the magnetic metal powder may be performed by a mechanical grinding method, specifically, ball milling, ultrasonic milling, bead milling, Lt; RTI ID = 0.0 > attritor. ≪ / RTI > Further, for example, the pulverized metal oxide may be reduced in a hydrogen or nitrogen atmosphere, and the plate-shaped magnetic metal powder may be heat-treated at 200 to 1400 ° C.

According to one embodiment, as described above, the plate-shaped structure 120a can be manufactured using different kinds of metal oxides (e.g., nickel oxide and iron oxide). In this case, the plate-shaped structure 120a may be formed of an alloy (for example, an alloy of nickel and iron).

By mixing the plate-shaped structure 120a with a binder, a source 110 can be manufactured (S120). More specifically, according to one embodiment, the step of fabricating the source 110 may include wetting the plate structure 120a with a solvent, and applying the binder to the wedged plate structure 120a. Mixing < / RTI > For example, the solvent may include at least one of toluene (Toluene), methyl ethyl ketone (MEK), and ethyl acetate (EA).

If the plate-shaped structure 120a is mixed with a binder and then mixed with a solvent to produce a source, bubbles may remain on the surface of the plate-shaped structure 120a, unlike the embodiment of the present invention described above , A vacuum evacuation process is additionally needed to remove air bubbles. Further, it is not easy to uniformly disperse the plate-shaped structure 120a in the source.

However, as described above, according to the embodiment of the present invention, after the plate-shaped structure 120a is wetted with a solvent, the dispersion is mixed with the binder so that the dispersion of the plate-shaped structure 120a in the source 110 And bubbles on the surface of the plate-shaped structure 120a can be easily removed.

The source 110 including the plate-shaped structures 120a may be coated on the base film 100 to form the coating layer 120 (S130). For example, the base film 100 may include a PET layer and a silicon (Si) release layer. A roll-to-roll process in which the base film 100 is coated by the source 110 while being moved by the rollers 200, as shown in Figure 2 .

A magnetic field may be applied to the base film 100 on which the coating layer 120 is formed so that the plate structures 120a in the coating layer 120 may be aligned in one direction in operation S140. A magnetic field may be applied to the base film 100 formed with the coating layer 120 immediately after the coating layer 120 is formed on the base film 100. [ Accordingly, the plate-shaped structures 120a in the coating layer 120 can be easily arranged in the one direction.

The step of applying a magnetic field to the base film 100 on which the coating layer 120 is formed may include placing the electromagnets 210a and 210b on the upper and lower surfaces of the base film 100 . For example, when first and second electromagnets or permanent magnets 210a and 210b are adjacent to the upper surface and the lower surface of the base film 100, respectively, the first and second electromagnets 210a , 210b may have different polarities. 2 and 3, electromagnets are adjacent to either one of the upper surface and the lower surface of the base film 100, and the plate-like structure 120a in the coating layer 120, May be arranged in one direction.

As described above, the plate structures 120a, which include the magnetic metal, are adjacent to the upper surface and the lower surface of the base film 100, and the electromagnets 210a 210b may be arranged to be stacked on each other in an oblique direction with respect to the upper surface and the lower surface of the base film 100. [ For example, a magnetic field of 1,000 to 6,000 gauss may be applied to the coating layer 120.

Unlike the embodiment of the present invention described above, when the magnetic field formed by the coating layer 120 is not applied on the base film 100, the plate-shaped structures 120a may be randomly arranged. In addition, when the plate-shaped structures 120a are arranged in one direction in a post-treatment process of pressing the base film 100 and the coating layer 120, the process cost increases and the plate-shaped structures 120a are arranged It is not easy to make the directions substantially the same.

However, according to the embodiment of the present invention, by the magnetic field, the plate-shaped structures 120a in the coating layer 120 can be arranged in the one direction, so that the particle orientation of the plate-shaped structures 120a An electromagnetic wave absorbing film having a high saturation magnetization value and a high magnetic permeability and a method of manufacturing the same can be provided.

After the plate-shaped structures 120a in the coating layer 120 are arranged in the one direction by the electromagnets 210a and 210b, the base film 100, on which the coating layer 120 is formed, 230 < / RTI > and heat treated and dried.

Thereafter, the electromagnetic wave absorbing film including the base film 100 and the coating layer 120 may be stored in a wound state. Alternatively, the electromagnetic wave absorbing film may be attached to another functional film (for example, a heat radiation film, an electromagnetic wave shielding film, or the like).

According to an embodiment of the present invention, the source 110 including the plate-shaped structures 120a is coated on the base film 100 to form the coating layer 120, And the base film 100 are applied with a magnetic field so that the plate-shaped structures 120a in the coating layer 120 can be easily stacked and arranged in one direction. As a result, the electromagnetic wave absorbing film in which the saturation magnetization value and the magnetic permeability are improved and the electromagnetic wave absorption rate is improved and a manufacturing method thereof can be provided.

Also, according to the embodiment of the present invention, after the plate-shaped structures 120a are wetted by the solvent, the source 100 may be produced by mixing with the binder. As a result, the degree of dispersion of the plate-shaped structures 120a in the source 100 can be improved, the degree of dispersion of the plate-shaped structures 120a in the coating layer 120 can be improved, The bubbles on the surface of the coating layer 120a may be removed and the filling rate of the plate-shaped structure 120a in the coating layer 120 may be increased. Accordingly, an electromagnetic wave absorbing film with improved electromagnetic wave absorption rate and a manufacturing method thereof can be provided.

The electromagnetic wave absorbing film according to the embodiment of the present invention can be applied to a TV, a notebook, a smart phone, a PCB circuit of a digital camera, an FPCB cable, a main chip, a camera barrel module, a speaker module, Antenna, WPC antenna), a display liquid crystal module, a solid state charger, and the like.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is to be understood that the scope of the present invention is not limited to the disclosed exemplary embodiments. It will also be appreciated that many modifications and variations will be apparent to those skilled in the art without departing from the scope of the invention.

100: base film
110: source
120: Coating layer
120a: Plate structure
120b: metal structure
200: Rollers
210a, 210b: electromagnet
230: chamber

Claims (7)

Preparing nano soft magnetic plate structures including a magnetic metal;
Mixing the plate structures with a binder to produce a source;
Coating the source including the plate-shaped structures on a base film to form a coating layer; And
Applying a magnetic field to the base film on which the coating layer is formed to align the plate-shaped structures in the coating layer in one direction,
The step of preparing the plate-
Preparing a metal oxide;
Pulverizing the metal oxide into a nano-sized powder;
Reducing the milled metal oxide to produce a magnetic metal powder;
Subjecting the magnetic metal powder to a plate-like treatment and coagulating with the pores; And
And heat treating the plate-shaped magnetic metal powder to produce the plate-shaped structures,
The step of fabricating the source includes:
Wetting the plate structures with a solvent; And
And mixing the wetted plate-shaped structures with the binder.
The method according to claim 1,
Applying a magnetic field to the base film on which the coating layer is formed,
Wherein an electromagnet or a permanent magnet is disposed adjacent to at least one of an upper surface and a lower surface of the base film.
The method according to claim 1,
Wherein the plate structure is oblique with respect to a lower surface of the base film.
The method according to claim 1,
Further comprising the step of heat treating and drying the base film on which the coating layer is formed after the plate-shaped structures are arranged in the one direction.
delete delete An electronic device comprising an electromagnetic wave absorbing film produced by the method for manufacturing an electromagnetic wave absorbing film according to any one of claims 1 to 4.
KR1020150100874A 2015-07-16 2015-07-16 Electromagnetic wave absorber film, and method of fabricating of the same KR101689475B1 (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112909554A (en) * 2021-02-22 2021-06-04 成都天马微电子有限公司 Antenna and manufacturing method thereof

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005109174A (en) * 2003-09-30 2005-04-21 Hitachi Cable Ltd Wave absorber and manufacturing method therefor
JP2009094298A (en) * 2007-10-09 2009-04-30 Sony Chemical & Information Device Corp Manufacturing method of magnetic sheet and magnetic sheet
JP2010050254A (en) * 2008-08-21 2010-03-04 Alps Electric Co Ltd Manufacturing method of magnetic sheet, magnetic sheet, and manufacturing apparatus of magnetic sheet
KR100995563B1 (en) 2010-05-04 2010-11-19 주식회사 이녹스 Electrical conductive adhesive film for emi shielding

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005109174A (en) * 2003-09-30 2005-04-21 Hitachi Cable Ltd Wave absorber and manufacturing method therefor
JP2009094298A (en) * 2007-10-09 2009-04-30 Sony Chemical & Information Device Corp Manufacturing method of magnetic sheet and magnetic sheet
JP2010050254A (en) * 2008-08-21 2010-03-04 Alps Electric Co Ltd Manufacturing method of magnetic sheet, magnetic sheet, and manufacturing apparatus of magnetic sheet
KR100995563B1 (en) 2010-05-04 2010-11-19 주식회사 이녹스 Electrical conductive adhesive film for emi shielding

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112909554A (en) * 2021-02-22 2021-06-04 成都天马微电子有限公司 Antenna and manufacturing method thereof

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