KR101699949B1 - Electromagnetic wave absorber and heat dissipation film, and method of fabricating of the same - Google Patents

Electromagnetic wave absorber and heat dissipation film, and method of fabricating of the same Download PDF

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Publication number
KR101699949B1
KR101699949B1 KR1020150100898A KR20150100898A KR101699949B1 KR 101699949 B1 KR101699949 B1 KR 101699949B1 KR 1020150100898 A KR1020150100898 A KR 1020150100898A KR 20150100898 A KR20150100898 A KR 20150100898A KR 101699949 B1 KR101699949 B1 KR 101699949B1
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KR
South Korea
Prior art keywords
metal structure
electromagnetic wave
heat
heat dissipation
metal
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KR1020150100898A
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Korean (ko)
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윤재원
표정석
김락원
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(주)휴켐
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q17/00—Devices for absorbing waves radiated from an antenna; Combinations of such devices with active antenna elements or systems
    • H01Q17/002—Devices for absorbing waves radiated from an antenna; Combinations of such devices with active antenna elements or systems using short elongated elements as dissipative material, e.g. metallic threads or flake-like particles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
    • B32B5/16—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by features of a layer formed of particles, e.g. chips, powder or granules
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
    • H05K7/20445—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff
    • H05K7/20472—Sheet interfaces
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials
    • H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
    • H05K9/0083—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising electro-conductive non-fibrous particles embedded in an electrically insulating supporting structure, e.g. powder, flakes, whiskers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials
    • H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
    • H05K9/0088—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising a plurality of shielding layers; combining different shielding material structure

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electromagnetism (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Wood Science & Technology (AREA)
  • Thermal Sciences (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)

Abstract

A method of manufacturing an electromagnetic wave absorption and heat radiation composite film is provided. The method for manufacturing an electromagnetic wave absorbing and heat radiation composite film includes the steps of preparing a soft magnetic metal structure in which a heat dissipation material and a plurality of nanoparticles are aggregated, wetting the metal structure and the heat dissipation material in a solvent, Mixing the metal structure and the heat dissipation material with a binder to produce a source, and providing the source on the base film to form a coating layer.

Description

TECHNICAL FIELD The present invention relates to an electromagnetic wave absorber and heat dissipation composite film,

TECHNICAL FIELD The present invention relates to a composite film for absorbing and radiating electromagnetic waves and a method of manufacturing the same, and more particularly, to an electromagnetic wave absorbing and heat-radiating composite film including a heat radiation material and a nano soft magnetic metal structure, and a manufacturing method thereof.

2. Description of the Related Art Recently, various digital electronic devices such as PCs, portable terminals, portable media players and the like have been widely used. Accordingly, there is a problem that an electromagnetic wave generated in an electronic device affects another electronic device through a space, or affects another electronic device through a wire or a PCB to cause a malfunction.

Such electromagnetic disturbances are manifested in various ways ranging from malfunctions of computers to accidental incidents of factories, and furthermore, research results that have a negative impact on the human body have been announced, thus raising concerns and concern about health. In addition, in the advanced countries, the electromagnetic wave absorption technology for various electronic products is emerging as the core technology field of the electronic industry, in contradiction with the regulations strengthening the electromagnetic wave disturbance and preparation of measures.

On the other hand, as the degree of integration of chips is increased due to downsizing and high performance of electronic devices, heat generated in electronic devices can be increased. Accordingly, in addition to the above-described electromagnetic interference problem, there is a need for research and development of a technique for efficiently discharging heat generated in an electronic device to the outside.

SUMMARY OF THE INVENTION The present invention provides a highly reliable electromagnetic wave absorbing and heat-dissipating composite film, and a manufacturing method thereof.

Another technical problem to be solved by the present invention is to provide an electromagnetic wave absorbing and heat-radiating composite film with improved electromagnetic wave absorptivity and heat radiation characteristics, and a manufacturing method thereof.

Another technical problem to be solved by the present invention is to provide an electromagnetic wave absorbing and heat-radiating composite film having a thin thickness, and a manufacturing method thereof.

The technical problem to be solved by the present invention is not limited to the above.

According to an aspect of the present invention, there is provided a method of manufacturing an electromagnetic wave absorbing and heat radiation composite film.

According to one embodiment, the method for manufacturing an electromagnetic wave absorbing and heat-radiating composite film includes the steps of preparing a soft magnetic metal structure in which a heat dissipation material and a plurality of nanoparticles are aggregated, wetting the metal structure and the heat dissipation material with a solvent ) Mixing the wetted metal structure and the heat dissipation material with a binder to produce a source, and forming the coating layer by providing the source on the base film.

According to one embodiment, the metal structure may comprise an iron alloy.

According to one embodiment, the heat dissipation material may include at least one of graphite, aluminum oxide, boron nitride, or carbon nanotubes.

According to one embodiment, the method for manufacturing a composite electromagnetic wave absorbing and heat-radiating film further includes disposing a heat diffusion layer disposed on the coating layer, wherein the heat diffusion layer is formed of aluminum, copper, or graphite And may include at least any one of them.

According to one embodiment, the metal structure in the coating layer absorbs external electromagnetic waves, and the heat radiating material in the coating layer can conduct, diffuse, and emit external heat.

In order to solve the above technical problems, the present invention provides a composite film for absorbing and radiating electromagnetic waves.

According to one embodiment, the electromagnetic wave absorbing and heat-radiating composite film includes a base film, and a coating layer disposed on the base film and including a soft magnetic metal structure in which a plurality of nanoparticles are aggregated, and a heat-radiating material .

According to an aspect of the present invention, there is provided an electronic device including an electromagnetic wave absorbing and heat dissipating composite film.

According to one embodiment, the electronic device is an electromagnetic wave absorbing and heat-radiating composite film produced according to the method for manufacturing an electromagnetic wave absorbing and heat-radiating composite film according to the above-described embodiment of the present invention, Electromagnetic wave absorption and heat radiation composite film.

According to the embodiment of the present invention, after the heat radiating material and the metal structure are wetted with the solvent, the source is prepared by mixing with the binder, and the source is coated on the base film to produce the electromagnetic wave absorbing and heat radiating composite film . As a result, the heat dissipation material and the bubbles on the surface of the metal structure can be easily removed, and at the same time, the dispersion of the heat dissipation material and the metal structure can be improved.

Accordingly, an electromagnetic wave shielding and absorbing composite film having improved electromagnetic wave shielding efficiency and electromagnetic wave absorbing efficiency and a manufacturing method thereof can be provided.

FIG. 1 is a flow chart for explaining a method of manufacturing an electromagnetic wave absorption and heat radiation composite film according to an embodiment of the present invention.
2 is a view for explaining an electromagnetic wave absorption and heat radiation composite film according to an embodiment of the present invention.
FIG. 3 is an enlarged view of FIG. 2A illustrating a first embodiment of the metal structures included in the electromagnetic wave absorption and heat radiation composite film according to the embodiment of the present invention.
FIG. 4 is an enlarged view of FIG. 2A illustrating a second embodiment of the metal structures included in the electromagnetic wave absorption and heat radiation composite film according to the embodiment of the present invention.
FIG. 5 is an enlarged view of FIG. 2A illustrating a third embodiment of the metal structures included in the electromagnetic wave absorption and heat radiation composite film according to the embodiment of the present invention.
6 is a view for explaining a modified example of the electromagnetic wave absorption and heat radiation composite film according to the embodiment of the present invention.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. However, the technical spirit of the present invention is not limited to the embodiments described herein but may be embodied in other forms. Rather, the embodiments disclosed herein are provided so that the disclosure can be thorough and complete, and will fully convey the concept of the invention to those skilled in the art.

In this specification, when an element is referred to as being on another element, it may be directly formed on another element, or a third element may be interposed therebetween. Further, in the drawings, the thicknesses of the films and regions are exaggerated for an effective explanation of the technical content.

Also, while the terms first, second, third, etc. in the various embodiments of the present disclosure are used to describe various components, these components should not be limited by these terms. These terms have only been used to distinguish one component from another. Thus, what is referred to as a first component in any one embodiment may be referred to as a second component in another embodiment. Each embodiment described and exemplified herein also includes its complementary embodiment. Also, in this specification, 'and / or' are used to include at least one of the front and rear components.

The singular forms "a", "an", and "the" include plural referents unless the context clearly dictates otherwise. It is also to be understood that the terms such as " comprises "or" having "are intended to specify the presence of stated features, integers, Should not be understood to exclude the presence or addition of one or more other elements, elements, or combinations thereof. Also, in this specification, the term "connection " is used to include both indirectly connecting and directly connecting a plurality of components.

In the following description of the present invention, a detailed description of known functions and configurations incorporated herein will be omitted when it may make the subject matter of the present invention rather unclear.

Further, in this specification, the metal structure includes not only a metal, but also a metal oxide, a metal nitride, a metal carbide and the like.

FIG. 1 is a flow chart for explaining a method of manufacturing an electromagnetic wave absorption and heat radiation composite film according to an embodiment of the present invention, FIG. 2 is a view for explaining an electromagnetic wave absorption and heat radiation composite film according to an embodiment of the present invention, 3 is an enlarged view of A of FIG. 2 for illustrating a first embodiment of metal structures included in the electromagnetic wave absorption and heat radiation composite film according to the embodiment of the present invention.

Referring to FIGS. 1 to 3, a soft magnetic metal structure 124a in which a heat radiation material 122 and a plurality of nanoparticles are aggregated is prepared (S10). For example, the heat dissipation material 122 may include at least one of graphite, aluminum oxide, boron nitride, or carbon nanotubes.

According to one embodiment, the metal structure 124 may be formed of a nano soft magnetic metal having electromagnetic wave absorption characteristics and condensed thermal energy dielectric properties. For example, the metal structure 124a may be an iron-based alloy. For example, the metal structure 124a may be an alloy containing 50 wt% or more of iron and containing silicon, aluminum, or the like. Alternatively, the metal structure 124a may further include tungsten (W), copper (Cu), molybdenum (Mo), chrome (Cr), aluminum (Al)

The metal structure 124a may have a smaller size than the heat dissipation material 122. For example, the metal structure 124 may have a size of 1/10 3 of the heat radiation material 122. Therefore, even when a small amount of the metal structure 124a is added as compared with the heat radiation material 122, electromagnetic wave absorption characteristics and heat conduction characteristics can be easily expressed.

As described above, the metal structure 124a may be in the form of particles in which a plurality of nanoparticles are aggregated. In this case, the method of manufacturing the metal structure 124a includes the steps of preparing a metal oxide, pulverizing the metal oxide to produce a metal powder, coagulating the metal powder, reducing the coagulated metal powder And coating the coagulated metal powder with an organic binder. For example, the metal oxide may be milled by a mechanical milling method (e.g., ball milling, ultrasonic milling, bead milling, or attritor). Also, for example, the metal powder can be made into spherical agglomerates using a spray drier, and can be reduced in a hydrogen or nitrogen atmosphere.

According to one embodiment, the metal structure 124a may be fabricated as described above, using different kinds of metal oxides (e.g., nickel oxide and iron oxide). In this case, the metal structure 124a may be formed of an alloy (for example, an alloy of nickel and iron).

The intermetal structure 124a and the heat radiation material 122 may be wetted to the solvent (S120). For example, the solvent may include at least one of toluene (Toluene), methyl ethyl ketone (MEK), and ethyl acetate (EA).

The source may be fabricated by mixing the metal structure 124 and the heat dissipation material 122 with the binder (S130). For example, the binder may be a Urethane, PE, silicone, or rubber series.

If the heat dissipation material 122 and the metal structure 124a are mixed together with the binder and then mixed with the solvent to produce a source or the heat dissipation material 122 and the metal structure 124a are mixed, When a source is manufactured by mixing the metal structure 124a with a binder and a solvent, air bubbles may remain on the surfaces of the heat dissipation material 122 and the metal structure 124a. In this case, a vacuum evacuation process is further required to remove the air bubbles on the surfaces of the heat radiation material 122 and the metal structure 124a. Further, due to the cohesive force of the heat dissipation material 122 and the metal structure 124a, it is not easy to uniformly disperse the heat dissipation material 122 and the metal structure 124a in the source.

However, as described above, according to the embodiment of the present invention, after the heat radiation material 122 and the metal structure 124a are wetted with the solvent, they are mixed with the binder so that the heat radiation material 122 And the dispersibility of the metal structure 124a are improved and the bubbles on the surfaces of the heat dissipation material 122 and the metal structure 124a can be easily removed.

The coating layer 120 may be formed by providing the source on the base film 100 (S140). The step of providing the source on the base 100 may be performed by a roll-to-roll process.

The electromagnetic wave absorbing and heat radiation composite film including the base film 100 and the coating layer 120 may be stored in a wound state. Alternatively, the electromagnetic wave absorbing and heat-radiating composite film may be attached to another functional film (for example, an electromagnetic wave shielding film or the like).

Unlike the above-described embodiment of the present invention, in order to manufacture a composite film having electromagnetic wave absorption and heat radiation characteristics at the same time, a laminated electromagnetic wave absorption film and a heat radiation film are laminated to produce a composite film having both electromagnetic wave absorption and heat radiation characteristics In this case, the thickness of the composite film is increased, and the number of process steps is increased, so that the manufacturing cost can be increased.

However, as described above, the coating layer 120 of the electromagnetic wave absorption and heat radiation composite film according to the embodiment of the present invention simultaneously includes the metal structure 124a and the heat radiation material 122 that absorb external electromagnetic waves , ≪ / RTI > one coating process. As a result, an electromagnetic wave absorbing and heat radiation composite film having a thin thickness, a simplified manufacturing process, and electromagnetic wave absorption and heat radiation characteristics at the same time, and a manufacturing method thereof can be provided.

Also, according to the embodiment of the present invention, after the heat radiation material 122 and the metal structure 124a are wetted by the solvent, they may be mixed with the binder to generate the source. As a result, the degree of dispersion of the heat dissipation material 122 and the metal structure 124a in the source is improved, and the dispersion of the heat dissipation material 122 and the metal structure 124a in the coating layer 120 The bubbles on the surface of the heat dissipation material 122 and the metal structure 124a are removed so that the filling ratio of the heat dissipation material 122 and the metal structure 124a in the coating layer 120 is Can be increased. Accordingly, an electromagnetic wave absorbing and heat-radiating composite film with improved electromagnetic wave absorptivity and heat radiation characteristics and a manufacturing method thereof can be provided.

Unlike the above, the metal structure in the coating layer 120 may be plate-shaped. Hereinafter, with reference to Fig. A second embodiment of the metal structures included in the electromagnetic wave absorption and heat radiation composite film according to the embodiment of the present invention is described.

FIG. 4 is an enlarged view of FIG. 2A illustrating a second embodiment of the metal structures included in the electromagnetic wave absorption and heat radiation composite film according to the embodiment of the present invention.

Referring to Fig. 4, a plate-shaped metal structure 124b is prepared, unlike that described with reference to Fig. The metal structure 124b may be formed by aggregating nano-sized plate-like structures. In this case, the method of manufacturing the metal structure 124b includes the steps of preparing a metal oxide, pulverizing the metal oxide into a nano-sized powder, reducing the ground metal oxide to produce a magnetic metal powder, Subjecting the magnetic metal powder to a plate-like treatment, and heat treating the plate-shaped magnetic metal powder to remove residual stress. As the magnetic metal powder is processed in a plate shape, it may be aggregated with the pores to form the porous metal structure 124b. The ground metal oxide may have a size of 100 nm or less. As a result, the magnetic metal powder can easily be flattened at low energy.

For example, the step of pulverizing the metal oxide and the step of plate-finishing the magnetic metal powder may be performed by a mechanical grinding method, specifically, ball milling, ultrasonic milling, bead milling, Lt; RTI ID = 0.0 > attritor. ≪ / RTI > Further, for example, the pulverized metal oxide may be reduced in a hydrogen or nitrogen atmosphere, and the plate-shaped magnetic metal powder may be heat-treated at 200 to 1400 ° C.

According to one embodiment, the metal structure 124b may be fabricated as described above, using different kinds of metal oxides (e.g., nickel oxide and iron oxide). In this case, the metal structure 124b may be formed of an alloy (for example, an alloy of nickel and iron).

Thereafter, as described with reference to Figs. 1 and 2, a source is manufactured using the heat dissipation material 122 and the metal structure 124b, and the source is coated on the base film 100 to form a plate- An electromagnetic wave absorption and heat radiation composite film having the metal structure 124b can be manufactured. As a result, the electromagnetic wave absorption efficiency of the electromagnetic wave absorption and heat radiation composite film can be improved.

In contrast to the above, the metal structure of the plate-like structure and the metal structure of the particle shape may be distributed in the coating layer 120. Hereinafter, with reference to FIG. A third embodiment of the metal structures included in the electromagnetic wave absorption and heat radiation composite film according to the embodiment of the present invention is described.

FIG. 5 is an enlarged view of FIG. 2A illustrating a third embodiment of the metal structures included in the electromagnetic wave absorption and heat radiation composite film according to the embodiment of the present invention.

Referring to Fig. 5, a metal structure 124a in the form of particles as described with reference to Fig. 1 and a metal structure 124b in the form of a plate as described with reference to Fig. 4 are prepared.

Thereafter, as described with reference to FIGS. 1 and 2, a source is fabricated using the heat dissipation material 122 and the metal structures 124a and 124b, and the source is coated on the base film 100, An electromagnetic wave absorption and heat radiation composite film having the metal structure 124a in the form of a particle and the metal structure 124b in the plate shape can be produced simultaneously. As a result, the packing ratio of the metal structures 124a and 124b in the electromagnetic wave absorption and heat radiation composite film is improved, and the electromagnetic wave absorption rate can be increased.

Unlike the above, a heat diffusion layer may be further disposed on the coating layer 120. [ Hereinafter, with reference to Fig. 6, a modified example of the electromagnetic wave absorption and heat radiation composite film according to the embodiment of the present invention will be described.

6 is a view for explaining a modified example of the electromagnetic wave absorption and heat radiation composite film according to the embodiment of the present invention.

Referring to FIG. 6, an electromagnetic wave absorption and heat dissipation composite film including a base film 100, a coating layer 120 on the base film 100, and a heat diffusion layer 130 on the coating layer 120 is provided do.

In the coating layer 120, the metal structure 124a in the form of particles is distributed as described with reference to Fig. 3, or the metal structure 124b in the form of a plate is distributed as described with reference to Fig. 4 , Or the metal structure 124a and the plate-like metal structure 124b may be distributed simultaneously, as described with reference to Fig.

The heat diffusion layer 130 may include at least one of aluminum, copper, graphite, and carbon nanotubes. The heat diffusion layer 130 may receive heat from an electronic device to which the electromagnetic wave absorption and heat dissipation composite film according to an embodiment of the present invention is attached and may transfer heat to the electromagnetic wave absorption and heat dissipation composite film have.

The electromagnetic wave absorbing and heat-radiating composite film according to an embodiment of the present invention may be applied to various electronic devices (e.g., notebooks, TVs, smart phones, digital cameras, navigation devices, , Beam project, etc.). However, the application range of the electromagnetic wave shielding and absorption composite film according to the embodiment of the present invention is not limited to the above.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is to be understood that the scope of the present invention is not limited to the disclosed exemplary embodiments. It will also be appreciated that many modifications and variations will be apparent to those skilled in the art without departing from the scope of the invention.

100: base film
120: Coating layer
122: heat-radiating material
124a, 124b: metal structure
130: heat diffusion layer

Claims (7)

Preparing a soft magnetic metal structure having a heat dissipation material and a plurality of nanoparticles aggregated therein;
Wetting the metal structure and the heat dissipation material in a solvent;
Mixing the wetted metal structure and the heat dissipation material with a binder to produce a source; And
Providing the source on a base film to form a coating layer,
Wherein the metal structure is in the form of particles smaller than the heat dissipation material,
The step of preparing the metal structure may include:
Preparing a metal oxide;
Milling the metal oxide to produce a metal powder;
Agglomerating the metal powder;
Reducing the coagulated metal powder; And
And coating the coagulated metal powder with an organic binder to produce the metal structure.
The method according to claim 1,
Wherein the metal structure comprises an iron alloy.
The method according to claim 1,
Wherein the heat dissipation material comprises at least one of graphite, aluminum oxide, boron nitride, and carbon nanotubes.
The method according to claim 1,
Further comprising disposing a heat spreading layer disposed on the coating layer,
Wherein the heat diffusion layer comprises at least one of aluminum, copper, graphite, and carbon nanotubes.
The method according to claim 1,
Wherein the metal structure in the coating layer absorbs external electromagnetic waves,
Wherein the heat radiation material in the coating layer includes conducting, diffusing, and radiating external heat.
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KR1020150100898A 2015-07-16 2015-07-16 Electromagnetic wave absorber and heat dissipation film, and method of fabricating of the same KR101699949B1 (en)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101935831B1 (en) * 2018-01-30 2019-01-07 (주)휴켐 Composite film having property for heat conduction, electromagnetic wave absorber, and electromagnetic wave shield, method of fabricating of the same, and material for the same
KR20190061233A (en) * 2017-11-27 2019-06-05 (주)휴켐 Composite film having property for absorber of high frequency and heat emission, method of fabricating of the same, and material for the same

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KR101248385B1 (en) * 2012-09-26 2013-04-02 (주)켐스 Hybrid composition with enhanced emi shielding and heat-releasing, and ink, sheet, and composition for injection using same
WO2014058260A1 (en) * 2012-10-11 2014-04-17 주식회사 아모텍 Electromagnetic wave shielding sheet for antenna, method for manufacturing same, antenna comprising same, and battery pack for portable terminal having said antenna

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101248385B1 (en) * 2012-09-26 2013-04-02 (주)켐스 Hybrid composition with enhanced emi shielding and heat-releasing, and ink, sheet, and composition for injection using same
WO2014058260A1 (en) * 2012-10-11 2014-04-17 주식회사 아모텍 Electromagnetic wave shielding sheet for antenna, method for manufacturing same, antenna comprising same, and battery pack for portable terminal having said antenna

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20190061233A (en) * 2017-11-27 2019-06-05 (주)휴켐 Composite film having property for absorber of high frequency and heat emission, method of fabricating of the same, and material for the same
KR102021758B1 (en) * 2017-11-27 2019-09-17 (주)휴켐 Composite film having property for absorber of high frequency and heat emission, method of fabricating of the same, and material for the same
KR101935831B1 (en) * 2018-01-30 2019-01-07 (주)휴켐 Composite film having property for heat conduction, electromagnetic wave absorber, and electromagnetic wave shield, method of fabricating of the same, and material for the same

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