KR101681020B1 - Excellent radiant heat coating composition and method of radiant heat device for led lamp using the same - Google Patents
Excellent radiant heat coating composition and method of radiant heat device for led lamp using the same Download PDFInfo
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- KR101681020B1 KR101681020B1 KR1020160033323A KR20160033323A KR101681020B1 KR 101681020 B1 KR101681020 B1 KR 101681020B1 KR 1020160033323 A KR1020160033323 A KR 1020160033323A KR 20160033323 A KR20160033323 A KR 20160033323A KR 101681020 B1 KR101681020 B1 KR 101681020B1
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D163/00—Coating compositions based on epoxy resins; Coating compositions based on derivatives of epoxy resins
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- C09D7/1216—
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- C09D7/1233—
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- C09D7/125—
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/85—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
- F21V29/87—Organic material, e.g. filled polymer composites; Thermo-conductive additives or coatings therefor
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2101/00—Point-like light sources
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- Life Sciences & Earth Sciences (AREA)
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- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The coating composition excellent in heat radiation performance according to the present invention comprises an organic binder including an epoxy resin and a curing agent; Wherein the epoxy resin is modified by introducing a silane functional group into the epoxy resin, and the organic binder is contained in an amount of 3 to 10 parts by weight based on 100 parts by weight of the modified epoxy resin and 100 parts by weight of the organic binder, To 10 parts by weight of an inorganic pigment; And 5 to 40 parts by weight of the heat-radiating filler based on 100 parts by weight of the organic binder.
Also, a method of manufacturing an LED lighting heat sink using the coating composition is a method of manufacturing a LED lighting heat sink using a heat dissipation fin for forming a plurality of heat dissipation fins on the outer surface by extrusion molding a plate-shaped raw material selected from a metal group such as aluminum, carbon steel, alloy steel, stainless steel, An extrusion molding step (S100); A heat sink cutting step S200 for cutting the raw material to a predetermined length after the heat sink fin extrusion molding step S100; A cutting step S300 of partially cutting the outer circumferential surface of the heat dissipating plate in accordance with the product to which the heat dissipating plate having the heat dissipating fin is applied after the heat dissipating plate cutting step S200; A coating step (S400) of coating the heat-dissipating plate, which has been partially cut, with the coating composition after the cutting step (S300); (S500) drying the coated heat sink after the coating step (S400).
Description
The present invention relates to a coating composition having excellent heat dissipation performance and a method of manufacturing a heat sink of LED lighting using the same. More specifically, the present invention relates to a coating composition having excellent heat dissipation and heat transfer characteristics, corrosion resistance to salt water impregnation and soaking, (White, gray, black, etc.), which can be applied to various applications, and can be applied not only to the heat sink mounted inside the LED lighting apparatus but also to the outer cover (housing, etc.) Technology.
Structures in contact with water are at risk of being damaged by contamination and / or corrosion. For example, the shipbuilding industry has been faced with serious problems caused by the attachment of marine organic matter to the ship's hull for a long time. The pollution of the ship 's hulls increases the operation cost of the ship and deteriorates the efficiency of the ship.
A method to overcome the problem of contamination of the structure is to use paint on the hull of the ship, which serves to prevent the structure from being corroded by water or fresh water.
However, paints commonly used in coatings of structures are toxic and copper or mercury compounds that can be dissolved in such toxic components, for example seawater, are dissolved in the water in which the structure is eroded, .
However, toxic substances in the paint coated on the structure exudate in the water in contact with the structure, causing serious environmental pollution.
In addition, as domestic high power density electronic industrial parts develop in size downsizing, structural densification and functional diversification, the heat conduction and heat dissipation problems that are caused thereby seriously affect the operation stability and reliability of high output electronic components have.
Currently, thermal control members used in electronic components generally use metal materials, but this type of material has a large mass and a large coefficient of thermal expansion, which greatly limits its widespread use as a package heat dissipation material.
Therefore, research and development of new materials that are thin, low in mass and high in thermal conductivity have important significance in lightening the weight of each part size application apparatus and in high operation efficiency.
The solvent type resin has a long curing time and a high energy consumption. The curing time is usually one hour. The curing temperature must reach 150 ° C. At the same time, the solvent type resin must be diluted with a solvent diluent. The amount of volatilization is large, resulting in a relatively large loss and constant environmental pollution.
At present, there are not many researches on heat conduction heat radiation paints at home and abroad, and they are limited to solvent type paints.
For example, Chinese Patent Application No. CN200810146607.5, which is a heat dissipation paint and its manufacturing method, uses silicon resin and organic solvent, and addition of silicon carbide, aluminum powder and zinc oxide to manufacture a heat dissipation coating used in a heat dissipation device, The patent application No. CN201010514156.3 for LED lamps uses organosilicon polyurethane as the main film forming material and beryllium oxide and aluminum nitride as the heat dissipation material. The heat dissipation coating material is used for the heat dissipation of the LED lamp.
Such a heat radiating paint consumes a large amount of organic solvent in the course of forming a film by heating, which not only consumes energy but also pollutes the environment and lowers production efficiency, and may be limited to electronic parts which can not be heated have.
In the process for producing a high temperature halogen-free flame-retardant ultraviolet curable solder resist ink in Chinese Patent Application No. 201110165349.7, an ultraviolet curable solder resist ink is mainly composed of an epoxy acrylate type photosensitive resin, a photoinitiator, an epoxy resin, a curing agent, a filler, These solder resist inks have characteristics of high temperature resistance, high flame retardance, high hardness, and no halogen, and are mainly applied to lead-free soldering and lead-free HASL (hot air leveling) processes of printed circuit boards. However, The use of the color paste deteriorates the compatibility with the inorganic heat conduction filler, and the demand for the particle size of the inorganic heat conduction material is very high, which must reach the nanometer level, and the heat conduction material having excellent performance can not be obtained.
KR Patent Publication 10-1011114 B1
KR Patent Registration No. 10-1161834 B1
KR Patent Registration No. 10-1514404 B1
SUMMARY OF THE INVENTION It is an object of the present invention to solve the above problems of the prior art.
Specifically, the heat generated from the heat source is transferred to the heat sink to dissipate heat, and a heat radiating coating is applied to the surface of the heat sink so that the heat transferred to the heat sink can be rapidly discharged to the air. will be.
The present invention also relates to a coating composition comprising inorganic pigments capable of giving hue to various colors of a heat radiation coating composition coated on a heat sink, and inorganic particles having excellent thermal emissivity and thermal conductivity.
To achieve these and other advantages and in accordance with the purpose of the present invention, as embodied and broadly described herein, a coating composition having excellent heat dissipation performance comprises an epoxy resin and an organic binder including a curing agent, wherein the epoxy resin is modified by introducing a silane functional group into the epoxy resin, Wherein the binder contains 3 to 10 parts by weight of a curing agent based on 100 parts by weight of the modified epoxy resin, and 1 to 10 parts by weight of the binder is contained in 100 parts by weight of the organic binder; And 5 to 40 parts by weight of the heat-radiating filler based on 100 parts by weight of the organic binder.
Also, a method of manufacturing an LED lighting heat sink using the coating composition is a method of manufacturing a LED lighting heat sink using a heat dissipation fin for forming a plurality of heat dissipation fins on the outer surface by extrusion molding a plate-shaped raw material selected from a metal group such as aluminum, carbon steel, alloy steel, stainless steel, An extrusion molding step (S100); A heat sink cutting step S200 for cutting the raw material to a predetermined length after the heat sink fin extrusion molding step S100; A cutting step S300 of partially cutting the outer circumferential surface of the heat dissipating plate in accordance with the product to which the heat dissipating plate having the heat dissipating fin is applied after the heat dissipating plate cutting step S200; A coating step (S400) of coating the heat-dissipating plate, which has been partially cut, with the coating composition after the cutting step (S300); (S500) drying the coated heat sink after the coating step (S400).
As described above, the present invention can improve the heat radiation performance of the coating agent by including inorganic pigments and heat-radiating fillers, which are inorganic particles having excellent thermal emissivity and thermal conductivity, in addition to organic binders and curing agents contained in basic coating agents. It is possible to provide a coating composition which is capable of expressing colors of white, black and gray, and which is excellent in heat radiation performance applicable to the outer cover of LED lighting in addition to the heat sink of LED lighting.
BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is an illustration showing the composition of a coating composition having excellent heat radiation performance according to an embodiment of the present invention; FIG.
2 is a flowchart of a method of manufacturing a heat sink of an LED lighting using a coating composition having excellent heat radiation performance according to an embodiment of the present invention;
Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings, but the present invention is not limited by the scope of the present invention.
1, a coating composition excellent in heat radiation performance according to the present invention comprises an organic binder including an epoxy resin and a curing agent; Wherein the epoxy resin is modified by introducing a silane functional group into the epoxy resin, and the organic binder is contained in an amount of 3 to 10 parts by weight based on 100 parts by weight of the modified epoxy resin and 100 parts by weight of the organic binder, To 10 parts by weight of an inorganic pigment; And 5 to 40 parts by weight of the heat-radiating filler based on 100 parts by weight of the organic binder.
Specifically, the inorganic pigment is an inorganic particle having excellent thermal emissivity and thermal conductivity. The black pigment for expressing black is a pigment component using black of carbon black by using carbon black powder, The white pigment of titanium dioxide powder is used for the white pigment, and each of the carbon black and titanium dioxide is excellent in thermal emissivity and thermal conductivity. Therefore, when such an inorganic pigment is diluted in the above coating composition, Lt; / RTI >
Further, in addition to black and white, it is possible to express the gray color by diluting the carbon black and the titanium dioxide, so that the colors of black, white and gray can be realized by using it.
Next, the heat-dissipating filler is composed of inorganic particles having excellent thermal emissivity and thermal conductivity, and examples thereof include graphite powder, silica (SiO 2), aluminum oxide (Al 2 O 3), aluminum hydroxide (Al ), Boron nitride (BN), and titanium dioxide (TiO2). Like the above-mentioned inorganic pigment, it is composed of inorganic particles having excellent thermal emissivity and thermal conductivity. When diluted in the coating composition, .
Next, the modified epoxy resin is not particularly limited as long as it is usually contained in a coating agent, but is preferably bisphenol A, bisphenol F, bisphenol B, bisphenol AD, bisphenol S and resorcinol And more preferably at least one of the group consisting of bisphenol A and / or bisphenol F.
The modified epoxy resin is modified by introducing a silane functional group into the epoxy resin. The silane functional group is not particularly limited as long as it is used for modification of the epoxy resin, but is preferably SinH2n + 2, where n is 1? N? May be a positive integer.
Next, the curing agent is not particularly limited as long as it is usually included in the coating agent, but preferably is at least one member selected from the group consisting of diethylenetriamine, triethylenetetramine, metaphenylenediamine, diaminodiphenylmethane, diaminodiphenylsulfone, azo A phenol novolak resin, a phenol aralkyl resin, an anhydrous phthalic acid, anhydrous maleic acid, anhydrous hexahydrophthalic acid, anhydrous pyromellitic acid, dicyandiamide, imidazole, BF3- An amine complex, and a guanidine derivative, and more preferably, dicyandiamide.
The mixing ratio of the modified epoxy resin and the curing agent is not particularly limited as long as it is usually applicable to a coating agent, but preferably 3 to 10 parts by weight of a curing agent may be added to 100 parts by weight of the modified epoxy resin.
Next, a method of manufacturing an LED lighting heat sink using the coating composition is to form a plurality of heat dissipation fins on the outer surface by extrusion molding a plate-shaped raw material selected from a metal group such as aluminum, carbon steel, alloy steel, stainless steel, A heat sink fin extrusion molding step (S100); A heat sink cutting step S200 for cutting the raw material to a predetermined length after the heat sink fin extrusion molding step S100; A cutting step S300 of partially cutting the outer circumferential surface of the heat dissipating plate in accordance with the product to which the heat dissipating plate having the heat dissipating fin is applied after the heat dissipating plate cutting step S200; A coating step (S400) of coating the heat-dissipating plate, which has been partially cut, with the coating composition after the cutting step (S300); (S500) drying the coated heat sink after the coating step (S400).
Specifically, a heat radiating fin extrusion molding step is performed through extrusion molding of a raw material which is a metal plate selected from the group of metals such as aluminum, carbon steel, alloy steel, stainless steel and nickel to form a plurality of radiating fins on the outer surface. The heat dissipation fins are formed in a vertically upright manner so as to oppose to the plate heat dissipating plates to widen the contact area with the outside air of the heat dissipating plates to maximize the heat dissipation performance. Shape, or a shape of a column such as a cone, a cylinder, or a polygonal column.
Next, after the heat radiating fin extrusion molding step, the raw material having the heat radiating fin is cut to a predetermined length through a heat sink cutting step (S200), and the cut molding is finished similarly to the size of a product to be used. The heat sink having the same shape as that of the finished product is manufactured through a cutting step (S300) in which the outer heat sink is partially cut in accordance with the product to which the heat sink is to be applied.
Thereafter, a coating step (S400) for coating the coating composition according to the present invention is performed. The coating step may be a coating method selected from among air spray coating, dipping coating and spin coating , And the coating method may be applied by a single application or a mixed application depending on the required environment.
In the case of the coating step (S400) and the drying step (S500), not only the one-time coating but also the one-time coating may be used. In this case, By alternately performing the coating step (S400) and the drying step (S500) alternately, it is possible to prevent peeling or cracking due to the formation of a single coating layer by forming the coating layer in multiple stages.
Also, in the drying step (S500), it may be hot air drying or high temperature drying by heating. Through this heat treatment, bonding between the respective coating layers can be strengthened and a firm coating layer can be secured.
While the present invention has been described with reference to exemplary embodiments, it is to be understood that the invention is not limited to the disclosed exemplary embodiments.
Claims (10)
An organic binder including an epoxy resin and a curing agent,
The epoxy resin is obtained by modifying an epoxy resin by introducing a silane functional group,
Wherein the organic binder is contained in an amount of 3 to 10 parts by weight based on 100 parts by weight of the epoxy resin,
1 to 10 parts by weight based on 100 parts by weight of the organic binder;
And 5 to 40 parts by weight based on 100 parts by weight of the organic binder,
The epoxy resin is at least one selected from the group consisting of bisphenol A, bisphenol F, bisphenol B, bisphenol AD, bisphenol S and resorcinol,
The curing agent is selected from the group consisting of diethylenetriamine, triethylenetetramine, metaphenylenediamine, diaminodiphenylmethane, diaminodiphenylsulfone, azomethylphenol, phenol novolac resin, orthocresol novolac resin, naphthol novolak resin, At least one member selected from the group consisting of phenol aralkyl resins, phenol aralkyl resins, phthalic anhydride, maleic anhydride, hexahydrophthalic anhydride, pyromellitic anhydride, dicyandiamide, imidazole, BF3- amine complexes and guanidine derivatives,
Wherein the black pigment for expressing black is a carbon black powder, the white pigment for expressing white is a titanium dioxide powder, the gray pigment for expressing gray is a mixture of the carbon black and titanium dioxide,
The heat-radiating filler may be selected from one of graphite powder, silica (SiO2), aluminum oxide (Al2O3), aluminum hydroxide (Al (OH) 3), boron nitride (BN), titanium dioxide ,
The epoxy resin is modified by introducing a silane functional group into an epoxy resin. The silane functional group is defined by the formula SinH2n + 2, and n is an integer satisfying 1? N? 5. As a result,
(S100) for forming a plurality of radiating fins on the outer surface by extrusion molding a plate-shaped raw material selected from the group consisting of aluminum, carbon steel, alloy steel, stainless steel and nickel;
A heat sink cutting step S200 for cutting the raw material to a predetermined length after the heat sink fin extrusion molding step S100;
A cutting step S300 of partially cutting the outer circumferential surface of the heat dissipating plate in accordance with the product to which the heat dissipating plate having the heat dissipating fin is applied after the heat dissipating plate cutting step S200;
A coating step (S400) of coating the heat-dissipating plate, which has been partially cut, with the coating composition after the cutting step (S300);
(S500) drying the coated heat sink after the coating step (S400)
The coating step (S400) uses a coating method selected from among air spray coating, dipping coating and spin coating,
In the drying step (S500), hot drying by hot air or heating,
The heat radiating fins formed by the heat radiating fin extrusion molding step (S100) are vertically upright facing the heat radiating plate. The heat radiating fins are vertically erected so as to face the heat radiating plate Shape, a shape of a column such as a cone or a cylinder, or a polygonal column,
Wherein the step of coating (S400) and the step of drying (S500) are alternately repeated to form a coating layer in a multi-stage so as to prevent peeling or cracking due to formation of a single coating layer.
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| Application Number | Priority Date | Filing Date | Title |
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| KR1020160033323A KR101681020B1 (en) | 2016-03-21 | 2016-03-21 | Excellent radiant heat coating composition and method of radiant heat device for led lamp using the same |
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| KR1020160033323A KR101681020B1 (en) | 2016-03-21 | 2016-03-21 | Excellent radiant heat coating composition and method of radiant heat device for led lamp using the same |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101856666B1 (en) * | 2018-02-05 | 2018-05-10 | 현상우 | Heatsink for LED and fabrication method thereof |
| CN109538994A (en) * | 2018-11-19 | 2019-03-29 | 安徽蓝锐电子科技有限公司 | A kind of LED daylight lamp of good heat dissipation effect |
| KR20190033440A (en) | 2018-09-14 | 2019-03-29 | 주식회사 케이알이엠에스 | Energy-saving lighting system with self-diagnosis function, security funcition and thermal radiation coating agent |
| WO2020139034A1 (en) * | 2018-12-27 | 2020-07-02 | 문규식 | Heat sink, for vehicular lamp, having improved heat dissipation performance and method for producing same |
| KR102353949B1 (en) * | 2021-05-03 | 2022-01-20 | 주식회사 이노루체 | Light for Tunnel |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101856666B1 (en) * | 2018-02-05 | 2018-05-10 | 현상우 | Heatsink for LED and fabrication method thereof |
| KR20190033440A (en) | 2018-09-14 | 2019-03-29 | 주식회사 케이알이엠에스 | Energy-saving lighting system with self-diagnosis function, security funcition and thermal radiation coating agent |
| CN109538994A (en) * | 2018-11-19 | 2019-03-29 | 安徽蓝锐电子科技有限公司 | A kind of LED daylight lamp of good heat dissipation effect |
| WO2020139034A1 (en) * | 2018-12-27 | 2020-07-02 | 문규식 | Heat sink, for vehicular lamp, having improved heat dissipation performance and method for producing same |
| KR102353949B1 (en) * | 2021-05-03 | 2022-01-20 | 주식회사 이노루체 | Light for Tunnel |
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