KR101673897B1 - Camera module package and method for manufacturing the camera module package - Google Patents

Camera module package and method for manufacturing the camera module package Download PDF

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Publication number
KR101673897B1
KR101673897B1 KR1020150176979A KR20150176979A KR101673897B1 KR 101673897 B1 KR101673897 B1 KR 101673897B1 KR 1020150176979 A KR1020150176979 A KR 1020150176979A KR 20150176979 A KR20150176979 A KR 20150176979A KR 101673897 B1 KR101673897 B1 KR 101673897B1
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KR
South Korea
Prior art keywords
substrate
pad
camera module
image sensor
module package
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KR1020150176979A
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Korean (ko)
Inventor
장창원
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장창원
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Priority to KR1020150176979A priority Critical patent/KR101673897B1/en
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Publication of KR101673897B1 publication Critical patent/KR101673897B1/en

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    • H04N5/225—
    • H04N5/2251—
    • H04N5/2253—
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N5/00—Details of television systems
    • H04N5/30—Transforming light or analogous information into electric information

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  • Engineering & Computer Science (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Transforming Light Signals Into Electric Signals (AREA)

Abstract

The present invention relates to a camera module package. The camera module package of the present invention comprises: a lens barrel having at least one lens; a housing having an internal ball at the upper part to accommodate the lens barrel; an infrared prevention filter accommodated inside of the housing to cross over incident light passing through the lens of the lens barrel; a substrate combined to the bottom of the housing, having a window to pass the incident light, passing the infrared prevention filter; and an image sensor attached to the substrate by a ultrasound bonding method to photograph the incident light passing through the window of the substrate. Therefore, the present invention can provide the camera module package capable of improving the product reliability, while preventing a disconnection between the pad of the substrate and an electrode pad by improving the flatness of the substrate, by adding dummy pads at the other part on the upper part of the substrate to make the height of the pad of the substrate higher than the other parts when pressing while making the pad of the substrate on one part of the lower part of the substrate smaller than an exposed area on the electrode pad of the image sensor.

Description

[0001] The present invention relates to a camera module package and a method of manufacturing the same,

The present invention relates to a camera module package and a method of manufacturing a camera module package. More particularly, the present invention relates to a camera module package and a camera module package manufacturing method, in which a substrate and an image sensor are directly attached by an ultrasonic bonding method, And a method of manufacturing a fingerprint recognition module.

In recent years, the rapid development of information communication technology has made it possible to improve the data communication speed and increase the data communication amount, and to mount an image pickup element such as a CCD image sensor or a CMOS image sensor in a mobile electronic apparatus such as a cellular phone or a notebook Is spread.

Generally, a method of packaging an image sensor for a camera includes a flip-chip type chip on film (COF) method, a wire bonding type chip on board (COB) method, and a chip scale package (CSP) Among them, COF packaging method and COB packaging method are widely used.

The COF system is a bump-based packaging system having an outwardly projecting joint portion. Since a space for attaching wires is not required, the package area can be reduced and the height of the barrel can be reduced.

In addition, since a thin film or a flexible printed circuit board (FPCB) is used, a reliable package that can withstand external impact is possible, and the process is relatively simple.

1 is a cross-sectional view showing a process of attaching an image sensor to a general flexible printed circuit board. A plurality of electrode pads 11 are formed on a silicon substrate Si and the height of the exposed portions of the electrode pads 11 is set to a height of a peripheral portion PR A photoresist, or the like).

A substrate side pad 21 electrically connected to the electrode pad 11 of the image sensor 10 is formed on the lower surface of the flexible printed circuit board 20, The substrate side pad 22 is formed.

In addition, the substrate side pad 21 is formed larger than the exposed area of the electrode pad 11.

An anisotropic conductive film (AFC) in which conductive particles 30 are dispersed is inserted between the image sensor 10 and the flexible printed circuit board 20 so that the conductive particles 30 are electrically connected to the electrode pad 11, And the substrate side pad 21, as shown in Fig.

Then, the electrode pad 11 and the substrate side pad 21 are electrically connected to each other by a pressing force and a heat source provided by a thermocompression bonding head (ACF tool) by a flip chip bonding method.

When the image sensor 10 and the flexible printed circuit board 20 are bonded to each other, the flexible printed circuit board 20 is bonded to the ACF tool by another substrate side pad 22 formed on the upper surface of the flexible printed circuit board 20 There is a problem that disconnection occurs in the electrode pad 11 and the substrate side pad 21 as the provided pressing force is not constant.

SUMMARY OF THE INVENTION The present invention has been made in order to solve the above problems, and it is an object of the present invention to provide a method of manufacturing a semiconductor device, in which a substrate side pad formed at a lower portion of a substrate is formed smaller than an exposed area of an electrode pad of an image sensor, A dummy pad is added to the upper portion of the substrate to increase the flatness of the flexible printed circuit board.

According to an aspect of the present invention, there is provided a camera module package comprising: a lens barrel having at least one lens; a housing having an inner hole formed therein for receiving the lens barrel; An infrared cutoff filter provided inside the housing so as to be perpendicular to the incident light incident on the infrared cutoff filter, a substrate having a window for passing incident light passing through the infrared cutoff filter and coupled to the lower portion of the housing, There is provided a camera module package including an image sensor attached to the substrate by an ultrasonic bonding method for imaging.

In the image sensor, a plurality of electrode pads are formed on a surface of the substrate bonded to the bottom of the substrate, and bumps are formed on the electrode pads.

The dummy pad is formed on a side opposite to a position where the substrate side pad is formed, and the area of the dummy pad is smaller than the area of the substrate side pad Area of the camera module package.

The camera module package is characterized in that the pad on the substrate is formed to be smaller than or equal to the exposed area of the bump.

The camera module package is characterized in that the bump is made of gold (Ag), silver (Au), copper (Cu), or a conductive metal, and is formed of a stud-shaped bump.

Also, the substrate may be a flexible printed circuit board (FPCB), a printed circuit board (PCB), or a glass substrate.

A method of manufacturing a camera module package, the method comprising: providing a substrate having a window for passing incident light, a substrate pad on a lower portion thereof in contact with a bump of the image sensor, and a dummy pad on the substrate pad; Attaching the image sensor having the bump formed thereon to electrically connect the infrared sensor to an upper surface of a position corresponding to a window of the substrate; A method of manufacturing a camera module package, the method comprising: coupling a lens barrel having at least one lens in an inner cavity formed in an upper portion thereof to a housing; and attaching a substrate including the image sensor and the infrared cut filter to a lower portion of the housing Method is provided.

The bump of the image sensor is directly bonded to the substrate side pad of the substrate by an ultrasonic bonding method, and the substrate side pad is formed to be equal to or smaller than the exposed area of the bump And the first and second electrodes are electrically connected to each other.

According to the present invention, the substrate-side pad formed on one side of the lower surface of the substrate is formed to be smaller than the exposed area of the electrode pad of the image sensor, and the height of the substrate-side pad is higher than the other area on the upper side A dummy pad may be added to improve the flatness of the substrate to prevent disconnection of the electrode pad and the substrate side pad, thereby improving the reliability of the camera module package.

1 is a cross-sectional view showing a process of attaching a general substrate and an image sensor.
2 is a cross-sectional view illustrating a camera module package according to the present invention.
3 is an exemplary view showing a process of attaching the image sensor and the substrate according to the present invention.
4 is a detailed view for explaining a substrate and an image sensor according to the present invention.

Brief Description of the Drawings The advantages and features of the present invention, and how to accomplish them, will be apparent from the following detailed description taken in conjunction with the accompanying drawings. The present invention may, however, be embodied in many different forms and should not be construed as being limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete and will fully convey the concept of the invention to those skilled in the art. To fully inform the scope of the invention. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, the present invention will be described in detail with reference to the accompanying drawings.

2 is a cross-sectional view illustrating a camera module package according to the present invention. 3 is an exemplary view showing a process of attaching the image sensor and the substrate according to the present invention. 4 is a detailed view for explaining a substrate and an image sensor according to the present invention.

2 and 4, the camera module package 100 includes a housing 110, a lens barrel 120, an infrared cut filter 130, a substrate 140, and an image sensor 150.

The lens barrel 120 has a hollow cylindrical shape in which at least one lens is arranged along the incident light and has an inner space of a predetermined size, and a plurality of lenses arranged in the lens barrel 120 have a predetermined size gap A spacer may be provided.

A male screw portion 122 is formed on an outer surface of the lens barrel 120 and an incidence hole is formed in an upper end of the lens barrel 120 to fix a lens accommodated in the lens barrel 120.

The lens barrel 120 is accommodated in the housing 110 by forming a female screw 121 on the inner circumferential surface of the inner hole so as to be screwed with the male screw 122 of the lens barrel 120.

An infrared cutoff filter 130 is provided inside the housing 110 so as to be perpendicular to the incident light passing through the lens barrel 120. The infrared cutoff filter 130 passes through the lens of the lens barrel 120 It blocks infrared rays from one incident light.

The substrate 140 has a rectangular window window 141 having a predetermined size for passing the incident light passing through the infrared cut filter 130 and has an opening at one end and an image at the other end through a display means And a connector (not shown) is provided to be electrically connected to the display means so as to be realized.

The substrate 140 may be a flexible printed circuit board (FPCB), a printed circuit board (PCB), or a glass substrate.

Also, the center of the window window 141 is bonded to the lower surface of the housing 110 via an adhesive so as to be positioned on the same vertical axis as the incident light.

The image sensor 150 is attached to the substrate 140 and the image sensor 150 by an ultrasonic bonding method so as to pick up incident light passing through a window window 141 of the substrate 140.

The image sensor 150 includes a pixel region (not shown) in which incident light having passed through the window window 141 of the substrate 140 is imaged, a signal for processing an electrical signal for an image captured in the pixel region, And a processing area (not shown).

That is, a plurality of electrode pads 151 are formed in the signal processing area of the substrate 140, and the electrode pads 151 are formed with bumps (not shown) corresponding to the substrate side pads 142 152 are formed.

 The electrode pad 151 is deposited on the signal processing region of the image sensor 150 to form the bump 152 and the photoresist PR is applied except for the portion where the bump 152 is to be formed, A portion corresponding to the electrode pad 151 is exposed and a portion not corresponding to the electrode pad 151 is covered with the photoresist.

The bump 152 is made of gold (Ag), silver (Au), copper (Cu), or a conductive material, and is preferably formed of a stud-like bump.

A circuit pattern (not shown) is formed on both sides of the substrate 140 at a position spaced apart from the window window 141 by a predetermined distance. The circuit pattern is electrically connected to the bump 152, A substrate side pad 142 is formed below the substrate 140 and the substrate side pad 142 is formed to be smaller than or equal to the exposed area of the bump 152.

A dummy pad 143 is formed on the substrate 140 at a position opposite to the side where the substrate side pad 142 is formed in order to heighten the height of the substrate side pad 142 at the time of pressing.

The area of the dummy pad 143 is equal to or greater than the area of the substrate side pad 142 and the dummy pad 143 is formed on the top surface of the substrate 140, It is possible to improve the disconnection defects of the image sensor 150 and the substrate 140. FIG.

A method of manufacturing the camera module 100 having the above-described configuration will be described with reference to Figs. 2 to 4. Fig.

A window window 141 for passing incident light is formed and a substrate side pad 142 which is in contact with the bumps 152 of the image sensor 150 is formed in a lower portion and a substrate 140).

The image sensor 150 on which the bump 152 is formed is attached so as to be electrically connected to the substrate 140.

The method of attaching the image sensor 150 to the substrate 140 includes contacting the substrate side pad 142 exposed at the bottom of the substrate 140 and the bumps 152 in correspondence with each other, The substrate side pad 142 and the bump 152 are electrically connected to each other by an ultrasonic bonding method.

In other words, a transverse vibration is generated by the vibrator 40 and frictional energy is generated on the contact surface between the substrate 140 and the image sensor 150, thereby fusing between the bump 152 and the substrate side pad 142, And are electrically connected to each other. ('41' is an ultrasonic transmission bar and '42' is a pedestal).

When the ultrasonic bonding method is used, the heat is not generated more than when the conventional anisotropic conductive film (ACF) is used, so there is a lot of room for improvement of the process and the cost is reduced because the anisotropic conductive film is not used.

The infrared cut-off filter 130 is attached to the upper surface of the substrate 140 at a position corresponding to the window window 141 with an adhesive.

Also, a lens barrel 120 having at least one lens in an inner hole formed in the upper portion thereof is screwed to the housing 110.

The camera module package 100 is manufactured by attaching the substrate 140 including the image sensor 150 and the IR cut filter 130 to the lower portion of the housing 110 through an adhesive.

It will be understood by those skilled in the art that the present invention may be embodied in other specific forms without departing from the spirit or essential characteristics thereof. It is therefore to be understood that the above-described embodiments are illustrative in all aspects and not restrictive. The scope of the present invention is defined by the appended claims rather than the foregoing detailed description, and all changes or modifications derived from the meaning and range of the claims and the equivalents thereof are included in the scope of the present invention Should be interpreted.

100: camera module package 110: housing
111: female thread portion 120: lens barrel
121: cap 122: male screw part
130: Infrared cut filter 20, 140:
141: window window 21, 22, 142: substrate side pad
143: dummy pad 10, 150: image sensor
11, 151: electrode pad 152: bump

Claims (8)

In a camera module package,
A lens barrel having at least one lens; A housing having an inner hole formed therein for receiving the lens barrel; An infrared cut filter provided inside the housing so as to be orthogonal to incident light passing through a lens of the lens barrel; A substrate having a window for passing incident light passing through the infrared cut-off filter and coupled to a lower portion of the housing; And an image sensor attached to the substrate by an ultrasonic bonding method to capture incident light passing through a window of the substrate; Lt; / RTI >
In the image sensor, a plurality of electrode pads are formed on a surface of the substrate bonded to the bottom of the substrate, bumps are formed on the electrode pads,
A dummy pad is formed on a lower portion of the substrate and a dummy pad is formed on an upper portion of the substrate. The dummy pad is formed on the opposite side of the substrate-side pad in order to heighten the height of the substrate- Wherein the area of the dummy pad is greater than or equal to the area of the pad on the substrate,
The substrate side pad is formed to be smaller than or equal to the exposed area of the bump,
Wherein the substrate is one of a flexible printed circuit board (FPCB), a printed circuit board (PCB), and a glass substrate.
delete delete delete The method according to claim 1,
Wherein the bump is made of gold (Ag), silver (Au), copper (Cu), or a conductive metal, and is formed of a stud-shaped bump. delete delete delete
KR1020150176979A 2015-12-11 2015-12-11 Camera module package and method for manufacturing the camera module package KR101673897B1 (en)

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Application Number Priority Date Filing Date Title
KR1020150176979A KR101673897B1 (en) 2015-12-11 2015-12-11 Camera module package and method for manufacturing the camera module package

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KR1020160144430A Division KR20170069913A (en) 2016-11-01 2016-11-01 Camera module package and method for manufacturing the camera module package

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Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100674852B1 (en) * 2005-11-22 2007-01-25 삼성전기주식회사 A camera module package
JP5660263B1 (en) * 2013-04-26 2015-01-28 株式会社村田製作所 Electronic component, method for manufacturing electronic component, and circuit board

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100674852B1 (en) * 2005-11-22 2007-01-25 삼성전기주식회사 A camera module package
JP5660263B1 (en) * 2013-04-26 2015-01-28 株式会社村田製作所 Electronic component, method for manufacturing electronic component, and circuit board

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