KR101672428B1 - Terminal - Google Patents

Abstract

The terminal is started. A terminal of the present invention includes at least one element; A connector selectively coupled to another device to provide a data exchange path between the at least one device and another device; And a thermal conduction frame for transferring the heat generated by at least one of the elements to the connector, the one side and the other side being in contact with at least one element and the connector. According to the present invention, the elements inside the terminal and the connector coupled to the device are connected to each other through the heat conductive frame, so that the heat generated in the element can be effectively dissipated to other devices through the connector.

Description

Terminal {TERMINAL}

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a terminal, and more particularly, to a terminal capable of effectively dissipating heat generated in a device through another connector by connecting a device inside the terminal and a connector coupled to the device via a heat- .

Generally, a wireless communication system is a multiple access system capable of supporting communication with multiple users by sharing available system resources (bandwidth, transmission power, etc.).

Examples of the multiple access system include a CDMA (Code Division Multiple Access) system, a FDMA (Frequency Division Multiple Access) system, a TDMA (Time Division Multiple Access) system, an OFDMA (Orthogonal Frequency Division Multiple Access) system, Carrier Frequency Division Multiple Access (CDMA) systems.

It is necessary to control an uplink transmit power in a wireless communication system. This is to adjust the magnitude of the received signal at the base station to an appropriate level. If the transmission power is too weak in the uplink transmission, the base station can not receive the transmission signal of the terminal. Conversely, if the transmission power is too strong, the transmission signal of the terminal can interfere with the transmission signal of the other terminal and increase the battery consumption of the terminal. By controlling the uplink transmission power and maintaining the size of the received signal at an appropriate level, it is possible to prevent unnecessary power consumption in the terminal and to improve the transmission efficiency by adaptively determining the data rate or the like.

Therefore, it is required to develop various technologies for efficiently controlling uplink transmission power in a wireless communication system.

The present invention relates to a terminal capable of effectively transmitting heat generated in a device to another device through a connector by connecting a device inside the terminal and a connector coupled to the device through a heat conductive frame.

According to an embodiment of the present invention, there is provided a terminal including at least one element; A connector selectively coupled to another device to provide a data exchange path between the at least one device and the other device; And a thermal conduction frame, one side and the other side contacting the at least one element and the connector, for transferring heat generated in the at least one element to the connector.

According to another aspect of the present invention, there is provided a terminal comprising: at least one element; A connector selectively coupled to another device to provide a data exchange path between the at least one device and the other device; And a thermal conduction frame for transferring heat generated at the at least one element to the connector, the thermal conduction frame having one side abutting the connector and the other side adjacent the at least one element.

The terminal according to the present invention has an effect that the heat generated in the device can be effectively dissipated to other devices through the connector by connecting the device inside the terminal and the connector coupled to the device through the heat conductive frame.

1 is a diagram illustrating a wireless communication system.
2 is a diagram illustrating a structure of a radio frame in 3GPP LTE.
3 is a diagram illustrating an example of communication channels corresponding to the physical layer of 3GPP LTE.
4 is a block diagram of a terminal according to an embodiment of the present invention.
5 is a perspective view of the terminal of Fig.
6 is an exploded perspective view of the terminal of Fig.
FIG. 7 is a view showing a shape in which a heat conducting frame is defective in a first PCB of a terminal of FIG. 5; FIG.
FIG. 8 is a side view of the terminal of FIG. 5 in which portions except the upper and lower cases are coupled.
Figure 9 is an enlarged view of the USB connector portion of Figure 8;
Figure 10 is a top view of Figure 4 terminal coupled to another device.
11 is a graph showing a temperature gradient in a terminal and another device.
FIG. 12 is a graph showing the effect of the terminal of FIG. 4;
13 and 14 are use state diagrams of the terminal of Fig.
15 is an exploded perspective view of a terminal according to another embodiment of the present invention.
FIG. 16 is a side view of the terminal shown in FIG. 15 in which portions except the upper and lower cases are coupled.
17 is an exploded perspective view of a terminal according to another embodiment of the present invention.
18 is an exploded perspective view of a terminal according to another embodiment of the present invention.
19 is an exploded perspective view of a terminal according to another embodiment of the present invention.
FIG. 20 is a bottom view of the USB connector portion of the terminal of FIG. 19;

The above objects, features and advantages of the present invention will become more apparent from the following detailed description taken in conjunction with the accompanying drawings. It is to be understood, however, that the invention is not limited to the disclosed embodiments, but, on the contrary, is intended to cover various modifications and similarities. Like reference numerals designate like elements throughout the specification. In the following description, well-known functions or constructions are not described in detail since they would obscure the invention in unnecessary detail. Further, numerals (e.g., first, second, etc.) used in the description process of this specification are only an identifier for distinguishing one component from another component

Hereinafter, a mobile terminal related to the present invention will be described in detail with reference to the drawings. The suffix "module" and " part "for the components used in the following description are given or mixed in consideration of ease of specification, and do not have their own meaning or role.

Embodiments described below may be applied to a CDMA (Code Division Multiple Access), a Frequency Division Multiple Access (FDMA), a Time Division Multiple Access (TDMA), an Orthogonal Division Multiple Access (OFDMA), a Single Carrier Frequency Division Multiple Access (SC- And the like.

CDMA may be implemented in radio technology such as Universal Terrestrial Radio Access (UTRA) or CDMA2000. The TDMA may be implemented in a wireless technology such as Global System for Mobile communications (GSM) / General Packet Radio Service (GPRS) / Enhanced Data Rates for GSM Evolution (EDGE). OFDMA may be implemented in wireless technologies such as IEEE 802.11 (Wi-Fi), IEEE 806.11 (WiMAX), IEEE 802.20, and Evolved UTRA (E-UTRA). UTRA is part of the Universal Mobile Telecommunications System (UMTS). The 3rd Generation Partnership Project (3GPP) and Long Term Evolution (LTE) are part of E-UMTS (Evolved UMTS) using E-UTRA, employing OFDMA in the downlink and SC-FDMA in the uplink. LTE-A (Advanced) is the evolution of 3GPP LTE.

For clarity of explanation, 3GPP LTE / LTE-A is mainly described, but it is clear that the technical idea of the present invention is not limited thereto.

1 shows a wireless communication system.

The wireless communication system 10 includes at least one base station (BS) 11. Each base station 11 provides a communication service to a specific geographical area (generally called a cell) 15a, 15b, 15c. The cell may again be divided into multiple regions (referred to as sectors). One base station may include more than one cell.

A mobile station (MS) 100 may be fixed or mobile and may be a user equipment (UE), a user terminal (UT), a subscriber station (SS), a wireless device, , A wireless modem, a handheld device, an access terminal (AT), and the like.

The base station 11 generally refers to a fixed station that communicates with the terminal 100 and includes an evolved-NodeB (eNB), a base transceiver system (BTS), an access point, an access network ), And the like.

Hereinafter, downlink (DL) means communication from the base station 11 to the terminal 100, and uplink (UL) means communication from the terminal 100 to the base station 11.

In the downlink, the transmitter may be part of the base station, and the receiver may be part of the terminal. In the uplink, the transmitter may be part of the terminal, and the receiver may be part of the base station.

2 shows a structure of a radio frame in 3GPP LTE.

A radio frame is composed of 10 subframes, and one subframe is composed of two slots. The time taken for one subframe to be transmitted is referred to as a transmission time interval (TTI). For example, the length of one subframe may be 1 ms and the length of one slot may be 0.5 ms.

One slot includes a plurality of Orthogonal Frequency Division Multiplexing (OFDM) symbols in a time domain and a plurality of resource blocks (RBs) in a frequency domain. The OFDM symbol is used to represent one symbol period because 3GPP LTE uses OFDMA in the downlink and may be referred to as an SC-FDMA symbol or a symbol period according to the multiple access scheme. The RB includes a plurality of consecutive subcarriers in one slot in a resource allocation unit.

The structure of the radio frame shown in FIG. 2 is merely an example, and the number of subframes included in a radio frame, the number of slots included in a subframe, and the number of OFDM symbols included in a slot can be variously changed.

3 shows an example of communication channels corresponding to the physical layer of 3GPP LTE. The uplink channel used in 3GPP LTE includes a Physical Random Access Channel (PRACH) for random access, a Physical Uplink Control Channel (PUCCH) for control information transmission, A Physical Uplink Shared Channel (PUSCH), and the like.

According to the PUSCH transmission and configuration method defined by the LTE standard as well as the data transmission, the PUSCH can transmit information in which control information and data are multiplexed or information composed only of control information.

The random access information has importance as information for random access between the base station 11 and the terminal 10. [

And, the control information has importance such as the coverage balance of the uplink and the downlink and the feedback of the downlink.

The details of each of the uplink channels are well known in the art and will not be described in detail.

Hereinafter, a terminal 100 related to the present invention will be described in detail with reference to the drawings. The suffix "module" and " part "for the components used in the following description are given or mixed in consideration of ease of specification, and do not have their own meaning or role.

4 is a block diagram of a terminal according to an embodiment of the present invention.

The terminal 100 according to an embodiment of the present invention may include a wireless communication unit 110, a memory 140, a controller 160, a power supply unit 120, and an interface unit 150.

The wireless communication unit 110 may include one or more modules that enable wireless communication between the terminal 100 and the wireless communication system or between the terminal 100 and the network in which the terminal 100 is located.

The wireless communication unit 110 may support wireless communication using at least one wireless communication protocol. For example, the wireless communication unit 110 may provide wireless communication by at least one of CDMA, WCDMA, and LTE communication methods.

When the wireless communication unit 110 provides wireless communication using a plurality of different wireless communication protocols, the wireless communication function according to each wireless communication protocol may be implemented as one chip, .

The memory 140 may be a flash memory type, a hard disk type, a multimedia card micro type, a card type memory (for example, SD or XD memory) (Random Access Memory), SRAM (Static Random Access Memory), ROM (Read Only Memory), EEPROM (Electrically Erasable Programmable Read-Only Memory), PROM A disk, and / or an optical disk. The memory 140 may store a program for the operation of the control unit 160 and temporarily store input / output data (e.g., a phone book, a message, a still image, a moving picture, etc.).

The controller 160 controls the overall operation of the terminal 100. For example, data communication through the wireless communication unit 110, transmission power control of an uplink channel, and the like.

The power supply unit 120 may receive power from an external power source under the control of the controller 160 and supply power required for operation of the respective components. The apparatus for applying power to the power supply unit 120 may be another device (200 in FIG. 11). The other device (200 in FIG. 11) may be a notebook computer, a desk-tam computer, a mobile terminal, or the like. A method of supplying power to the power supply unit 120 may be a USB (Universal Serial Bus), a DC-JACK, or the like.

The interface unit 150 serves as a path for communication with all external devices connected to the terminal 100. The interface unit 150 receives data from an external device or receives power from the external device, transfers the data to each component in the terminal 100, or transmits data in the terminal 100 to an external device. For example, a wired / wireless headset port, an external charger port, a wired / wireless data port, a memory card port, a port for connecting a device having an identification module, an audio I / O port, A video input / output (I / O) port, an earphone port, and the like may be included in the interface unit 150. In the terminal 100 according to an embodiment of the present invention, the interface unit 150 may be implemented together with the power supply unit 120 described below. That is, the power supply unit 120 functions as the interface unit 150 connected to another device (200 of FIG. 11), which means that power can be supplied at the same time. In addition, the heat inside the terminal 100 may be transmitted to another device (of FIG. 10) through the interface unit 150. [

5 is a perspective view of the terminal of Fig.

The terminal 100 according to an embodiment of the present invention may include a case 106 and a USB connector 152 protruding from the front end of the case 106. [

The case 106 forms an outer shape of the terminal 100. The case 106 may serve to protect the accessories inside the terminal 100 from external impacts, temperature changes, and humidity changes. In order to protect the internal components from impact or the like, the case 106 may be made of various synthetic resins such as engineering plastics. The case 106 can be assembled by separately forming the upper case 102 and the lower case 104.

The USB connector 152 is a path for connecting a circuit inside the terminal 100 to another device (200 in Fig. 10). That is, this means that the element (E in FIG. 6) provided in the terminal 100 can serve as an intermediary for electrically connecting the element provided in another device (200 in FIG. 10). The USB connector 152 includes contacts according to standard specifications, and the external shape is formed of a metal material. The USB connector 152 formed of a metal material can secure a certain rigidity when connected to another device (200 of FIG. 10). In addition, the USB connector 152 according to one embodiment of the present invention can serve as a path for transmitting heat generated in the terminal 100 to another device (200 in FIG. 10). Elements (E in FIG. 6) provided inside the terminal 100 may generate heat due to an element that interferes with the flow of electrons during operation. The generated heat increases the temperature inside the terminal 100, and the heat exceeding a certain degree may obstruct the normal operation of the terminal 100. In addition, it may not satisfy the requirements of the user for the terminal 100. Therefore, effective management of the heat generated during the operation of the terminal 100 is a major factor. The terminal 100 according to the embodiment of the present invention can optimize the operating environment of the terminal 100 by effectively discharging the generated heat through the USB connector 152, as will be described later in detail.

6 is an exploded perspective view of the terminal of Fig.

As shown, the terminal 100 according to an embodiment of the present invention includes first and second PCBs S1 and S2 provided inside a case, a heat conductive frame (not shown) disposed between the first and second PCBs S1 and S2, (Not shown).

The first and second PCBs S1 and S2 may be a printed circuit board including one or more elements E, The printed circuit board may be manufactured by printing a signal line for allowing signals to be exchanged on a board and mounting various elements E on the board. Printed circuit boards are widely used in various electronic devices because they can constitute a desired circuit in a narrow space and can reduce the production cost. The first and second PCBs S1 and S2 may include various elements E to allow the terminal 100 to perform a desired operation. In the terminal 100 according to the embodiment of the present invention, the case where the first and second PCBs S1 and S2 are provided on the upper and lower sides is described, but the number and positions of the printed circuit boards are limited thereto Of course not. That is, the arrangement of the printed circuit board such as one printed circuit board, three or more printed circuit boards, and a printed circuit board disposed right and left instead of up and down may be variously modified. The element E can be mounted on the upper and lower sides of the first and second PCBs S1 and S2. That is, it means that the element E can be coupled to the first side of the first PCB S1 and the bottom side of the second PCB S2. Such a structure is intended to effectively conduct heat generated in the element E to the heat conductive frame 170 when the heat conductive frame 170 is located between the first and second PCBs S1 and S2 . However, the specific direction in which the element E is mounted may be changed during the design process. A USB connector 152 may be attached to the first printed circuit board S1.

The device E may be a variety of chips. In particular, it may be a power chip including a communication chip including a modem chip, an RF transceiver chip, and an RF receiver chip and / or a power amplifier chip (PA) and a power mangement IC (PMIC) chip. The above-mentioned communication chip and / or power supply chip may generate a large amount of heat during its operation. That is, due to the characteristics of the terminal 100 which is gradually becoming high performance, the absolute value of the electric power used by the wireless communication element as well as the weight occupied by the wireless communication element in the power used by the entire terminal 100 is also increasing. As a result, the amount of heat generated by the wireless communication device is also increasing. Accordingly, the heat generated in the wireless communication device is effectively radiated to the outside of the terminal 100, and as a result, the temperature of the entire terminal 100 can be controlled within a stable range. In addition, heat may be generated by internal resistance even in a power supply chip that performs power supply, conversion, rectification, and storage of electric power to the wireless communication device. The terminal 100 according to one embodiment of the present invention can effectively control the temperature of the entire terminal 100 within a stable range by effectively releasing the heat generated from the various elements E to the outside of the terminal 100 .

The heat conduction frame 170 may be positioned between the first and second PCBs S1 and S2. The heat conduction frame 170 may serve as a path for transmitting heat generated in the first and second PCBs S1 and S2 to the USB connector 152. [ That is, when heat is generated in the element E mounted on the first and second PCBs S1 and S2, the heat can be transferred to the heat conductive frame 170 primarily. The heat transferred to the heat conduction frame 170 can be transferred to the USB connector 152 in a secondary direction. The heat delivered to the USB connector 152 may be transmitted to the third derivative with a terminal 100 of another device (200 in FIG. 10) is coupled. The heat generated in the element E can be sequentially transferred to another device (200 in Fig. 10) via the heat conduction frame 170, so that the heat can be prevented from being trapped inside the terminal 100. [ Therefore, the temperature inside the terminal 100 can be maintained at an appropriate level. Some of the heat generated in the element E may be transferred to the first and second PCBs S1 and S2 and then transferred to the heat conductive frame 170. [

The heat conduction frame 170 may be made of a material having good thermal conductivity. For example, it may be a magnesium material, a magnesium alloy material, an aluminum material, an aluminum alloy material, a copper material, or a copper alloy material. The heat conduction frame 170 may cause a thermal gradation to occur between the device and the USB connector 152. [ The gradient of the column may mean that the temperature of the element E is the highest and the temperatures of the heat conductive frame 170 and the USB connector 152 are sequentially low. Due to the highest temperature of the element E, heat can be conducted efficiently from the element E toward the USB connector 152. The heat conduction frame 170 may include a shielding rib 174 and a coupling hook 172.

The heat conduction frame 170 may be bonded to the element E using a thermal grease as an adhesive material. That is, it means that the thermosensitive frame 170 can be bonded after the thermal grease is applied to the upper surface of the element E. The thermal grease is a kind of oil and the heat conductive frame 170 is brought into close contact with the element E so that the heat generated in the element E can be effectively conducted to the heat static frame 170.

The heat conduction frame 170 and the element E may not be in direct contact with each other. That is, the heat conductive frame 170 may be in close proximity to the element E in some cases. In such a case, the heat conductive frame 170 may be coupled to the first and second PCBs S1 and S2 through the coupling hook 172, which will be described in detail below. Heat generated in the element E can be transferred to the heat conductive frame 170 through convection or radiation even when the heat conductive frame 170 and the element E are close to each other.

The shielding ribs 174 may be ribs protruding from the heat conductive frame 170. That is, it means that it can be formed integrally with the heat conductive frame 170. The heat conduction frame 170 can be formed by casting or pressing various kinds of metal materials as described above. The shield ribs 174 can be formed in the course of processing the heat conductive frame 170. The protruded shielding ribs 174 are provided to divide the heat conductive frame 170 into a plurality of regions so as to prevent the electromagnetic waves generated from the elements E in one region from affecting the other elements E have. The shape and arrangement of the shielding ribs 174 may vary depending on the arrangement of the elements E mounted on the first and second PCBs S1 and S2.

The coupling hook 172 is a hook portion extending from the heat conduction frame 170 and coupled to the first and second PCBs S1 and S2. The heat conduction frame 170 may be in contact with the element E on one side and the USB connector 152 on the other side. The coupling hook 172 may be coupled to the first and second PCBs S1 and S2 so that the contact of the heat conductive frame 170 with the device E and the USB connector 152 is maintained. That is, it means that the coupling hook 172 is coupled to the first and second PCBs S1 and S2 so that the heat conductive frame 170 is brought into contact with the device E and the USB connector 152. On the other hand, the heat conduction frame 170 may be pressed and coupled to the USB connector 152, and the coupling hook 172 may be an auxiliary coupling means. The coupling hook 172 may be formed toward the lower side or the upper side. The coupling hook 172 formed in the downward direction may be coupled to the first PCB S1 and the coupling hook 172 formed in the upward direction may be coupled to the second PCB S2. The specific number and direction of the coupling hook 172 may be varied according to specific design needs.

7 is a view showing a shape in which a heat conductive frame is defective on a first PCB substrate of the terminal of FIG.

As shown in the figure, in assembling the terminal 100 according to an embodiment of the present invention, the process of coupling the heat conductive frame 170 to the first PCB S1 may proceed.

 7, the element E on the upper side of the first PCB S1 is shown as a dotted line for the convenience of understanding. However, when the heat conductive frame 170 is coupled to the first PCB S1, The various elements E may not be observed from the outside.

In the case where the heat conduction frame 170 is coupled to the first PCB S1, a coupling hook 172 extending from the heat conduction frame 170 may be used. That is, it means that the first, second, and third coupling hooks (172a in FIG. 8, 172b, and 172c in FIG. 7) extending in the downward direction in the heat conductive frame 170 can be coupled to the first PCB S1. The first, second and third coupling hooks 172a, 172b and 172c of FIG. 8 are coupled to corresponding positions of the first PCB S1 so that the coupling between the heat conductive frame 170 and the first PCB S1 is maintained. can do.

The fourth and fifth coupling hooks 172d and 172e may be coupled to the second PCB S2. When the fourth and fifth coupling hooks 172d and 172e are coupled, the second PCB S2 can be brought into close contact with the heat conductive frame 170 with a predetermined coupling force or more. When the second PCB S2 is brought into close contact with the heat conductive frame 170, the element E mounted on the lower end of the second PCB S2 can be brought into close contact with the heat conductive frame 170. [ The heat generated from the element E mounted on the lower end of the second PCB S2 is naturally transferred to the heat conductive frame 170 when the element E mounted on the lower end of the second PCB S2 is brought into close contact with the heat conductive frame 170. [ Lt; / RTI >

FIG. 8 is a side view of the terminal of FIG. 5 in which portions except the upper and lower cases are coupled.

As shown, the terminal 100 according to one embodiment of the present invention may include a heat conduction frame 170 coupled between the first and second PCBs S1 and S2.

The first, fifth and sixth elements E4 to E6 mounted on the lower side of the first PCB 1 and the first, second and third elements E1 to E3 mounted on the upper side of the first PCB S1 are connected to the heat conductive frame 170 And the upper and lower surfaces thereof, respectively. In the case of the element E whose surface is not flat as shown in the contact surface between the second and fifth elements E2 and E5 and the heat conductive frame 170, 170 and the other portion may not contact the heat conductive frame 170. [ Further, as described above, the whole of the element E may not directly contact the heat conductive frame 170.

The first to sixth coupling hooks 172a to 172e are coupled to the first and second PCBs S1 and S2 so that the first to sixth elements E1 to E6 can be more closely attached to the heat conductive frame 170 have.

Figure 9 is an enlarged view of the USB connector portion of Figure 8;

The heat generated in the first and fourth elements E1 and E4 can be transmitted to the USB connector 152 through the heat conductive frame 170. [

The heat generated in the first and fourth elements E1 and E4 can be conducted in the heat conduction frame 170 and the first and second PCBs S1 and S2. However, the heat conducted in the direction of the first and second PCBs S1 and S2 having a low thermal conductivity may be relatively small.

Conducted heat can be sequentially conducted toward the USB connector 152 side having a relatively low temperature. Specifically, the heat generated in the first element E1 can be conducted on the heat conduction frame 170 and then transferred to the USB connector 152 on the first coupling hook 172a. Further, the heat generated in the second element E2 can be conducted in the direction of the heat conduction frame 170 and the fourth coupling hook 172d. Although only the first and fourth elements E1 and E4 are illustrated in FIG. 9, the heat generated by the other element E is conducted to the USB connector 152 along the heat conductive frame 170. FIG.

Figure 10 is a top view of Figure 4 terminal coupled to another device.

As shown in the figure, the terminal 100 according to an embodiment of the present invention can transmit heat to another combined device 200.

The USB connector 152 of the terminal 100 can receive heat through the heat conduction frame (170 in FIG. 8). The USB connector 152, which receives the heat, can transfer heat to the other device 200. The terminal 100 according to an exemplary embodiment of the present invention may be a device that relays wireless communication. Therefore, the terminal 100 according to an embodiment of the present invention can be operated by being supplied with power from another device 200, coupled to another device 200 requiring wireless communication. For example, the USB connector 152 may be coupled to the USB port 252 of the other device 200. When the USB connector 125 is coupled to the USB port 252, the terminal 100 receives power and control signals from another device 200 having the USB port 252 formed therein, The signal can be transmitted to the other device 200.

The other device 200 may have a larger heat capacity than the terminal 100. [ That is, the size of the other device 200 may be larger than that of the terminal 100, and the area of the frame 206 for maintaining the rigidity of the other device 200 may be large. In addition, the density of the elements for generating heat in the other device 200 may be lower than that in the terminal 100. Therefore, the overall temperature of the other device 200 may be lower than that of the terminal 100. [ In particular, the side end of the other device 200 may be lower than the center of the other device 200. Accordingly, the heat transferred to the USB connector 152 of the terminal 100 can be easily conducted to the frame 206 of the other device 200 or the like. This is also explained by the fact that since the gradient of heat is generated between the terminal 100 and the other device 200, the heat is moved to eliminate the gradient of the heat. The larger the gradient of the heat between the terminal 100 and the other device 200, the larger the total amount of heat transmitted. For example, when the temperature of the other device 200 is 30 degrees, if the temperature of the terminal 100 is increased from 50 degrees to 70 degrees, the gradient of the heat increases. When the gradient of the heat, which is the temperature difference, becomes large, the amount of heat to be transmitted becomes large. Conversely, when the temperature of the terminal 100 is reduced from 70 degrees to 50 degrees, the gradient of heat is reduced, and the amount of heat is reduced by the allodyne. The amount of heat transmitted by the relative temperature difference between the terminal 100 and the other device 200 is controlled so that the temperature of the terminal 100 can be maintained in an appropriate range.

11 is a graph showing a temperature gradient in a terminal and another device.

As shown, there may be a temperature gradient between the terminal 100 and the other device 200.

The x-axis of the graph represents the right-handedness from the element E to the other device 200, and the y-axis represents the temperature. Specifically, the section A is the element E, the section B is the heat conduction frame 170, and the section C is the USB connector 152. Also, the D section is another device 200. As shown in the figure, the temperatures of the sections A to D may be the highest in the section A, and may be sequentially lowered and the lowest in the section D. Therefore, a temperature gradient in the negative direction may occur up to the D section from the A section.

By the second law of thermodynamics, heat flows from a high temperature to a low temperature. Thus, heat can be conducted along the temperature gradient from section A to section D. The terminal 100 according to an embodiment of the present invention can smoothly generate heat by providing the heat conductive frame 170 between the element E and the USB connector 152. [

FIG. 12 is a graph showing the effect of the terminal of FIG. 4;

In the case where the heat conduction frame 170 is not present, the temperature inside the terminal 100 may rapidly rise to the fifth temperature T5 and then equilibrate. That is, since the heat generated in the element E can not be transmitted to the outside of the terminal 100, the temperature inside the terminal 100 is formed to be high.

In the case where the heat conduction frame 170 is present, the temperature inside the terminal 100 may slowly rise to the sixth temperature T6 and then equilibrate. That is, the temperature of the inside of the terminal 100 is slowly increased due to the heat generated in the element E being diverted to the outside of the terminal 100 via the heat conduction frame 170. Further, since the heat is continuously diffused, it means that the inside of the terminal 100 can reach a thermal equilibrium state at a relatively low temperature.

13 and 14 are use state diagrams of the terminal of Fig.

As shown, the terminal 100 according to an embodiment of the present invention can be coupled to various other devices 200. [

As shown in FIG. 13, the terminal 100 may be coupled to the notebook computer 200, and the terminal 100 may be coupled to the desktop computer 200, as shown in FIG. That is, it means that the terminal 100 can be coupled to various devices that need to relay the communication.

As shown, the size of another device 200 may be relatively large compared to the terminal 100. The heat capacity of the other device 200 is larger than that of the terminal 100 so that the heat of the terminal 100 can be effectively conducted to the other device 200. [

15 is an exploded perspective view of a terminal according to another embodiment of the present invention.

The terminal 100 according to another embodiment of the present invention includes a first thermal conductive frame 170 positioned between the first and second PCBs S1 and S2 and a second thermal conductive frame 170 positioned between the first and second PCBs S1 and S2 And the second and third heat conductive frames 170a and 170b positioned on the upper and lower sides of the first and second heat conductive frames 170a and 170b.

The terminal 100 according to another embodiment of the present invention can use the first, second, and third heat conduction frames 170, 170a, and 170b of metal material that can effectively transmit heat, ) Can be more effectively dispersed.

FIG. 16 is a side view of the terminal shown in FIG. 15 in which portions except the upper and lower cases are coupled.

The heat generated in the first to fourth elements E1 to E4 mounted on the first and second PCBs S1 and S2 is transmitted through the first, second and third heat conduction frames 170, 170a and 170b, Lt; / RTI > to the USB connector 152 via the USB connector.

17 is an exploded perspective view of a terminal according to another embodiment of the present invention.

The terminal 100 according to another embodiment of the present invention includes a first PCB 102 and a second PCB 102 which are provided between the upper case 102 and the second PCB S2 and between the lower case 104 and the first PCB S1, 1, 2 insulators (I1, I2).

The first and second insulators I1 and I2 are provided inside the case 106 to prevent heat from being discharged in the direction of the case 106. [ When the heat is not emitted toward the case 106, heat generated in the element E can be accumulated inside the terminal 100. [ When the heat is accumulated in the terminal 100, the heat gradient between the terminal 100 and the other device 200 may be larger. Therefore, the heat transfer from the terminal 100 to the other device 200 can be further activated.

Since the temperature of the outside of the case 106 can be lowered due to the provision of the first and second insulators I1 and I2, the user holding the case 106 can feel that the temperature of the terminal 100 is not high . Therefore, it can contribute to the improvement of the sensitivity quality.

18 is an exploded perspective view of a terminal according to another embodiment of the present invention.

As shown, the terminal 100 according to another embodiment of the present invention may have various shapes of the first and second insulators I1 and I2.

The first and second insulators I1 and I2 may correspond to only a part of the inside of the upper case 102 and the lower case 104, That is, it means that it is possible to insulate only the element E having a particularly large amount of heat, or insulate only the portion corresponding to the position held by the user. By selectively inserting only the necessary positions, the production cost can be expected to be reduced.

FIG. 19 is an exploded perspective view of a terminal according to another embodiment of the present invention, and FIG. 20 is a bottom view of a USB connector portion of the terminal of FIG.

As shown in these figures, in the terminal 100 according to another embodiment of the present invention, the USB connector 152 can be coupled to the upper side of the first PCB S1.

The first PCB (S1) may be provided with a plurality of coupling holes (153) to which the ribs extending from the USB connector (152) can be coupled. The USB connector 152 can be coupled to the first PCB S1 by inserting a rib extending from the USB connector 152 into the engagement hole 153 at the upper end of the first PCB S1. As shown, the USB connector 152 can be coupled to the first PCB S1 through various methods.

It will be apparent to those skilled in the art that various modifications and variations can be made in the present invention without departing from the spirit and scope of the invention. Accordingly, such modifications or variations are intended to fall within the scope of the appended claims.

100: terminal 110:
120: power supply unit 140: memory
150: interface unit 160:
200: another device

Claims (23)

case;
A first element and a second element for generating heat;
A connector coupled to another device to provide a data exchange path between the first device and the other device;
At least a portion of the first element, at least a portion of the second element, and the connector, disposed between the first element and the second element, A thermal conduction frame for transferring heat to the connector; And
And at least one plate insulator provided inside the case to prevent heat generated in the first device and the second device from being transmitted to the case. The method according to claim 1,
A first substrate on which the first element is mounted; And
And a second substrate on which the second element is mounted,
Wherein the first substrate and the second substrate are made of a metal,
And wherein the terminal is coupled to the heat-conductive frame. 3. The method of claim 2,
The heat-
And is disposed between the first substrate and the second substrate. The method of claim 3,
Wherein the first element comprises:
And is mounted toward the heat conductive frame. The method of claim 3,
Further comprising a shielding rib protruding from a surface of the heat conductive frame to correspond to the first element and preventing diffusion of electromagnetic waves generated in the first element. 3. The method of claim 2,
The heat-
A first heat conductive frame formed in a plate shape and disposed between the first substrate and the second substrate; And
And a second heat conductive frame formed in a plate shape and disposed between at least one of the first substrate and the second substrate and the first heat conductive frame. 3. The method of claim 2,
Wherein at least one of the first substrate and the second substrate comprises:
Wherein the heat conductive frame is coupled to the heat conductive frame through at least one coupling hook extending from the heat conductive frame. delete The method according to claim 1,
Wherein one surface of the heat-
And is pressed onto at least one surface of the connector. The method according to claim 1,
Wherein the connector comprises:
And transmits the heat transferred from the heat conductive frame to the other device. The method according to claim 1,
The heat-
Wherein a thermal gradient is formed between the first element and the second element and the connector. The method according to claim 1,
The heat-
Wherein the terminal is formed of any one of aluminum, an alloy including aluminum, copper, and an alloy including copper. The method according to claim 1,
The connector is a USB connector,
Wherein the USB connector is coupled to a USB port of the another device. The method according to claim 1,
Wherein the first element and the second element are arranged in a matrix,
A communication chip including a modem chip, an RF transceiver chip and an RF receiver chip, and a power chip including a power amplifier chip and a PMIC chip. The method according to claim 1,
The first element, the second element, and the heat conductive frame,
Are bonded to each other by an adhesive material including a thermal grease.
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