KR101671855B1 - Restoration apparatus for wire tension - Google Patents
Restoration apparatus for wire tension Download PDFInfo
- Publication number
- KR101671855B1 KR101671855B1 KR1020150067372A KR20150067372A KR101671855B1 KR 101671855 B1 KR101671855 B1 KR 101671855B1 KR 1020150067372 A KR1020150067372 A KR 1020150067372A KR 20150067372 A KR20150067372 A KR 20150067372A KR 101671855 B1 KR101671855 B1 KR 101671855B1
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- KR
- South Korea
- Prior art keywords
- wire
- tension
- ingot
- roller portion
- mounting base
- Prior art date
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23D—PLANING; SLOTTING; SHEARING; BROACHING; SAWING; FILING; SCRAPING; LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOT OTHERWISE PROVIDED FOR
- B23D55/00—Sawing machines or sawing devices working with strap saw blades, characterised only by constructional features of particular parts
- B23D55/10—Sawing machines or sawing devices working with strap saw blades, characterised only by constructional features of particular parts of devices for tensioning strap saw blades
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23D—PLANING; SLOTTING; SHEARING; BROACHING; SAWING; FILING; SCRAPING; LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOT OTHERWISE PROVIDED FOR
- B23D57/00—Sawing machines or sawing devices not covered by one of the preceding groups B23D45/00 - B23D55/00
- B23D57/003—Sawing machines or sawing devices working with saw wires, characterised only by constructional features of particular parts
- B23D57/0069—Sawing machines or sawing devices working with saw wires, characterised only by constructional features of particular parts of devices for tensioning saw wires
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/799—Apparatus for disconnecting
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
Description
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a wire tension restoring apparatus, and more particularly, to a wire tension restoring apparatus for restoring a lost tension of a wire after being broken in a process of cutting an object using a wire.
Generally, after the ingot is grown, a slicing process is performed to cut the ingot into a wafer in order to manufacture the wafer. There are various methods for thinly cutting an ingot. As a typical method, there is a wire saw method using a wire.
The wire sawing method is a method in which wires are reciprocated in accordance with the rotation of the rollers in a state that one row of wires is sequentially wound on a plurality of rollers arranged in parallel and spaced apart from each other to cut the ingot thinly, The ingot can be cut to produce a plurality of wafers at the same time, thereby improving the production yield per unit time.
Here, both ends of the wire are pulled to provide a tension for holding the wire in order to prevent the problem that the quality of the wafer is deteriorated, such as the cutting time of the ingot cutting operation and the surface of the wafer being damaged.
However, in the process of cutting the ingot by using the wire pulled tightly, the wire may be broken. As described above, if the wire is broken while the ingot is being cut, the process for cutting the ingot must be performed from the beginning again, so that the process efficiency is reduced, the ingot being cut can not be reused and the material cost is wasted. And also increases.
Therefore, in order to increase the process efficiency, to prevent the material cost from being wasted, and to reduce the manufacturing cost, the broken wire is bonded in a manner such as welding or the like, and then the tension is provided to proceed the cutting process again.
However, even if the broken wires are joined to provide the tension, there is a limit to the tension provided to the wire, the tension is not provided as much as necessary, and a smooth cutting operation can not be performed.
SUMMARY OF THE INVENTION Accordingly, it is an object of the present invention to solve the above-mentioned problems of the prior art, and it is an object of the present invention to provide a method of manufacturing a wire- Thereby restoring the tension of the wire so as to reduce the manufacturing cost and to manufacture the wafer with improved quality, by selectively adjusting the area of the ingot which gives up the cutting while increasing the efficiency of the ingot cutting process. Device.
In order to attain the above object, a wire tension restoring apparatus according to the present invention is a wire tension restoring apparatus for restoring the tension of a wire that has been cut after an ingot is cut off, An entry roller portion, and a second entry roller portion; A first mounting table provided with the first entry roller portion and movably installed along the longitudinal direction of the ingot; A second mounting table provided with the second entry roller portion and movably installed along the longitudinal direction of the ingot; And a tension roller which is provided on the first mounting table or the second mounting table and which is disposed between the first entry roller section and the second entry roller section and which is wound around the first entry roller section and the second entry roller section An auxiliary roller portion for providing the auxiliary roller portion; And a linear driving unit for moving the first mounting table and the second mounting table along the longitudinal direction of the ingot, wherein a distance between the first mounting table and the second mounting table is determined by the linear driving unit, So that the length of the region of the ingot which abandons the cut can be adjusted.
delete
In the wire tension restoring device according to the present invention, more specifically, a tension measuring sensor for measuring a tension of the wire; And a first feeding part for reciprocating the tension measuring sensor between a passing position where the wire passes and a leaving position that is away from the passing position, wherein the tension measuring device measures the tension of the wire after cutting the ingot, The tension measuring sensor is moved to the passing position to measure the tension of the wire, and after the tension of the wire is measured, the tension measuring sensor is moved to the releasing position.
In the wire tension restoring device according to the present invention, the auxiliary roller portion may include a second conveying portion for reciprocating the auxiliary roller in which the wire is wound and wound in a direction of tensioning the wire or in a direction of loosening the wire, .
In the wire tension restoration apparatus according to the present invention, more specifically, a frame in which the first mounting base and the second mounting base are installed; And an anti-vibration unit installed at a lower portion of the frame for preventing vibration of the first mounting base and the second mounting base.
In the wire tension restoring device according to the present invention, the vibration preventing part may include a vacuum adsorption pad which can be attached to the ground in a vacuum state; A guide portion for vertically moving the vacuum adsorption pad with respect to the frame; And an air suction line connected to the vacuum adsorption pad and sucking air inside the vacuum adsorption pad to form a vacuum inside the vacuum adsorption pad.
According to the wire tension restoration apparatus of the present invention, it is possible to reduce the waste of the ingot and to reduce the manufacturing cost of the wafer.
In addition, according to the wire tension restoration apparatus of the present invention, the length of the region to give up cutting in the ingot can be selectively adjusted, and the ingot that is wastefully wasted can be saved.
In addition, according to the wire tension restoration apparatus of the present invention, it is possible to compare the tensile strength of a wire that has been broken and then to a wire that has been re-bonded, so that the strength of a wire for cutting an ingot can be adjusted according to a measured tension.
Further, according to the wire tension restoration apparatus of the present invention, a wafer with improved quality can be manufactured.
1 is a perspective view illustrating a wire tension restoring device according to an embodiment of the present invention,
FIG. 2 is a view showing a state in which a wire is wound around a roller after being broken in a wire tension restoring device according to an embodiment of the present invention,
Figs. 3 and 4 are views showing a first mounting table and a second mounting table which are moved toward a region of the ingot in which the cutting is abandoned in the wire tension restoring device of Fig. 1,
FIGS. 5 and 6 are diagrams showing regions in the wire tension restoring apparatus of FIG. 1 that give up cutting among the ingots which are changed in accordance with the movement of the first mounting table and the second mounting table,
FIG. 7 is a view showing a tension measuring sensor in the wire tension restoring device of FIG. 1,
FIG. 8 is a view showing a vibration preventing unit for preventing vibration generated in the first mounting table and the second mounting table in the wire tension restoring device of FIG. 1;
Hereinafter, embodiments according to the wire tension restoration apparatus according to the present invention will be described in detail with reference to the drawings.
FIG. 1 is a perspective view illustrating a wire tension restoring apparatus according to an embodiment of the present invention. FIG. 2 is a view showing a state in which a wire after being broken in a wire tension restoring apparatus according to an embodiment of the present invention is wound around a roller Figs. 3 and 4 are views showing a first mounting table and a second mounting table which are moved toward a region to give up cutting in ingots in the wire tension restoring device of Fig. 1, and Figs. 5 and 6 are diagrams Fig. 7 is a view showing a tension sensor in the wire tension restoring device shown in Fig. 1; Fig. 7 is a view showing a tension sensor in the wire tension restoring device of Fig. 1 And FIG. 8 is a view illustrating a vibration preventing unit for preventing vibrations generated in the first mounting table and the second mounting table in the wire tension restoring device of FIG.
Referring to FIGS. 1 to 8, the wire tension restoring device according to the present embodiment restores the lost tension of a wire that is broken after cutting in the process of cutting an object using a wire, A
The first
Referring to FIG. 2, the wire W of the present embodiment is a wire W connected again to a broken wire while cutting the
In this embodiment, the first mounting base A and the second mounting base B are movably installed along the longitudinal direction of the
3, it can be seen that when the wire is cut in the right region of the
Since the apparatus for cutting the
A considerable amount of the wire W will be wasted if the wire W is brought from the apparatus for cutting the
By moving the first mounting base A and the second mounting base B toward the region a of the
Referring to FIG. 1, the first mounting base A and the second mounting base B can be moved along a guide rail GR by a linear driving unit within a frame F, and the linear driving unit can be a linear motor .
In this embodiment, the
In this embodiment, the interval between the first mounting base A and the second mounting base B is set so that the lengths a1 and a2 of the region of the
Referring to FIG. 5, the first mounting table A and the second mounting table B are moved so as to be close to each other in order to reduce the length a1 of the area of the
Referring to FIG. 6, the first mounting table A and the second mounting table B are moved away from each other in order to increase the length a2 of the area of the
The first mounting base A and the second mounting base B are independently adjustable along the longitudinal direction of the
The
Since it is difficult to provide a sufficient tension to cut the
In this embodiment, a plurality of
1, the third
In this embodiment, in order to adjust the strength of the tension, the second conveying portion is formed by tightening the third
The
7A, the tension measuring sensor is moved to the passing position P1 where the wire W passes in order to measure the tension of the wire W. As shown in Fig. Thereafter, the wire W is wound around the
7 (b), after tension measurement of the wire W is completed, the
In the present embodiment, the
It is possible to compare the tensile force of the wire W that has been broken after being cut off and the wire W that has been broken again by measuring the tension of the wire W that has been cut after cutting the
Further, after the tension measurement is completed, the tensile force of the wire W is unnecessarily affected by the
The vibration preventing portion 150 prevents vibration generated from the first mounting base A and the second mounting base B.
7, the anti-vibration unit 150 is installed below the frame F on which the first mounting base A and the second mounting base B are installed to prevent vibration, and the vacuum adsorption pad 151 A
The
The
The
In the present embodiment, the anti-vibration unit 150 includes the first
It is possible to manufacture the wafer with improved quality by preventing vibration generated from the first mounting base A and the second mounting base B by using the vibration preventing portion 150. [
The wire tension restoring apparatus configured as described above can reduce the waste of the ingot by reducing the manufacturing cost of the wafer by moving the first mounting table and the second mounting table toward the region where the cutting is to be discontinued among the ingots .
Further, in the wire tension restoring apparatus configured as described above, since the first mounting base and the second mounting base are independently adjustable along the longitudinal direction of the ingot, the length of the region to give up the cutting of the ingot can be selectively adjusted Therefore, it is possible to save the ingot which is wastefully wasted.
Further, in the wire tension restoring apparatus configured as described above, the tension of the wire bonded after being broken after cutting the ingot is measured by using a tension measuring sensor, and the tension of the wire after being broken is compared with that of the wire bonded again. And the tensile strength of the wire for cutting the ingot can be adjusted according to the measured tensile force.
In addition, the wire tension restoring device configured as described above can prevent the vibration generated from the first mounting base and the second mounting base by using the vibration preventing portion, thereby obtaining the effect of manufacturing a wafer with improved quality.
The scope of the present invention is not limited to the above-described embodiments and modifications, but can be implemented in various embodiments within the scope of the appended claims. It will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the present invention as defined by the appended claims.
10: Ingot
W: Wire
F: frame
A: First installation
B: Second installation
110: first entry roller section
120: second entry roller section
130:
140: Tension measuring sensor
150:
Claims (6)
A first entry roller portion around which a wire pulled from the ingot side is wound and hooked, a second entry roller portion;
A first mounting table provided with the first entry roller portion and movably installed along the longitudinal direction of the ingot;
A second mounting table provided with the second entry roller portion and movably installed along the longitudinal direction of the ingot;
And a tension roller which is provided on the first mounting table or the second mounting table and which is disposed between the first entry roller portion and the second entry roller portion so as to tension the wire wound around the first entry roller portion and the second entry roller portion An auxiliary roller portion for providing the auxiliary roller portion; And
And a linear driving unit for moving the first mounting table and the second mounting table along the longitudinal direction of the ingot,
And the distance between the first mounting base and the second mounting base is adjusted along the longitudinal direction of the ingot by the rectilinear driving unit so as to adjust the length of the region for giving up the cutting of the ingot. Device.
A tension measuring sensor for measuring a tension of the wire; And
And a first conveying unit reciprocating the tension measuring sensor between a passing position where the wire passes and a releasing position deviating from the passing position,
The tension measuring sensor is moved to the passing position to measure the tension of the wire so as to measure the tension of the wire bonded after cutting the ingot, and after measuring the tension of the wire, And the wire tension restoration device is moved to the release position.
The auxiliary roller unit
And a second conveying portion for reciprocating the auxiliary roller in which the wire is wound and held in a direction of tensioning the wire or in a direction of loosening the wire.
A frame on which the first mounting base and the second mounting base are installed; And
And an anti-vibration unit installed at a lower portion of the frame to prevent vibration of the first mounting base and the second mounting base.
The vibration-
A vacuum adsorption pad which can be attached to the ground in a vacuum state;
A guide portion for vertically moving the vacuum adsorption pad with respect to the frame; And
And an air suction line connected to the vacuum adsorption pad and sucking air inside the vacuum adsorption pad to form a vacuum inside the vacuum adsorption pad.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020150067372A KR101671855B1 (en) | 2015-05-14 | 2015-05-14 | Restoration apparatus for wire tension |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020150067372A KR101671855B1 (en) | 2015-05-14 | 2015-05-14 | Restoration apparatus for wire tension |
Publications (1)
Publication Number | Publication Date |
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KR101671855B1 true KR101671855B1 (en) | 2016-11-03 |
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KR1020150067372A KR101671855B1 (en) | 2015-05-14 | 2015-05-14 | Restoration apparatus for wire tension |
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Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101038181B1 (en) * | 2011-01-21 | 2011-06-01 | 오성엘에스티(주) | The ingot inserting device for wire saw system |
KR101051887B1 (en) | 2011-01-31 | 2011-07-26 | 오성엘에스티(주) | Apparatus of tension control for system of wire saw and method thereof |
KR20140091908A (en) * | 2013-01-14 | 2014-07-23 | 주식회사 엘지실트론 | Tension control apparatus and wire saw with it |
-
2015
- 2015-05-14 KR KR1020150067372A patent/KR101671855B1/en active Search and Examination
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101038181B1 (en) * | 2011-01-21 | 2011-06-01 | 오성엘에스티(주) | The ingot inserting device for wire saw system |
KR101051887B1 (en) | 2011-01-31 | 2011-07-26 | 오성엘에스티(주) | Apparatus of tension control for system of wire saw and method thereof |
KR20140091908A (en) * | 2013-01-14 | 2014-07-23 | 주식회사 엘지실트론 | Tension control apparatus and wire saw with it |
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