KR101671855B1 - Restoration apparatus for wire tension - Google Patents

Restoration apparatus for wire tension Download PDF

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Publication number
KR101671855B1
KR101671855B1 KR1020150067372A KR20150067372A KR101671855B1 KR 101671855 B1 KR101671855 B1 KR 101671855B1 KR 1020150067372 A KR1020150067372 A KR 1020150067372A KR 20150067372 A KR20150067372 A KR 20150067372A KR 101671855 B1 KR101671855 B1 KR 101671855B1
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South Korea
Prior art keywords
wire
tension
ingot
roller portion
mounting base
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KR1020150067372A
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Korean (ko)
Inventor
노현기
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노현기
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23D—PLANING; SLOTTING; SHEARING; BROACHING; SAWING; FILING; SCRAPING; LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOT OTHERWISE PROVIDED FOR
    • B23D55/00—Sawing machines or sawing devices working with strap saw blades, characterised only by constructional features of particular parts
    • B23D55/10—Sawing machines or sawing devices working with strap saw blades, characterised only by constructional features of particular parts of devices for tensioning strap saw blades
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23D—PLANING; SLOTTING; SHEARING; BROACHING; SAWING; FILING; SCRAPING; LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOT OTHERWISE PROVIDED FOR
    • B23D57/00—Sawing machines or sawing devices not covered by one of the preceding groups B23D45/00 - B23D55/00
    • B23D57/003—Sawing machines or sawing devices working with saw wires, characterised only by constructional features of particular parts
    • B23D57/0069—Sawing machines or sawing devices working with saw wires, characterised only by constructional features of particular parts of devices for tensioning saw wires
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/799—Apparatus for disconnecting

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)

Abstract

The present invention relates to an apparatus to restore wire tension, capable of restoring the tension of a wire connected again after the wire is cut during a process to cut an object to be processed by using the wire. According to the present invention, the apparatus comprises a first and a second entering roller unit, and an auxiliary roller unit. The first and the second entering roller unit are wound and hung by a wire pulled up from an ingot side. The first entering roller unit is installed in a first installation plate and the second entering roller unit is installed in a second installation plate. The auxiliary roller unit is installed the first or second installation plate and is installed be the first and the second entering roller unit to provide tension to the wire wound and hung to the first and the second entering roller unit. The first and the second installation plate are installed to be able to move along a longitudinal direction of an ingot.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a wire tension restoring apparatus, and more particularly, to a wire tension restoring apparatus for restoring a lost tension of a wire after being broken in a process of cutting an object using a wire.

Generally, after the ingot is grown, a slicing process is performed to cut the ingot into a wafer in order to manufacture the wafer. There are various methods for thinly cutting an ingot. As a typical method, there is a wire saw method using a wire.

The wire sawing method is a method in which wires are reciprocated in accordance with the rotation of the rollers in a state that one row of wires is sequentially wound on a plurality of rollers arranged in parallel and spaced apart from each other to cut the ingot thinly, The ingot can be cut to produce a plurality of wafers at the same time, thereby improving the production yield per unit time.

Here, both ends of the wire are pulled to provide a tension for holding the wire in order to prevent the problem that the quality of the wafer is deteriorated, such as the cutting time of the ingot cutting operation and the surface of the wafer being damaged.

However, in the process of cutting the ingot by using the wire pulled tightly, the wire may be broken. As described above, if the wire is broken while the ingot is being cut, the process for cutting the ingot must be performed from the beginning again, so that the process efficiency is reduced, the ingot being cut can not be reused and the material cost is wasted. And also increases.

Therefore, in order to increase the process efficiency, to prevent the material cost from being wasted, and to reduce the manufacturing cost, the broken wire is bonded in a manner such as welding or the like, and then the tension is provided to proceed the cutting process again.

However, even if the broken wires are joined to provide the tension, there is a limit to the tension provided to the wire, the tension is not provided as much as necessary, and a smooth cutting operation can not be performed.

Korean Patent Registration No. 1051887 (Registered Jul. 20, 2011, entitled Tension Adjusting Unit of Wire-Sawing Machine and Tension Adjusting Method Using Same)

SUMMARY OF THE INVENTION Accordingly, it is an object of the present invention to solve the above-mentioned problems of the prior art, and it is an object of the present invention to provide a method of manufacturing a wire- Thereby restoring the tension of the wire so as to reduce the manufacturing cost and to manufacture the wafer with improved quality, by selectively adjusting the area of the ingot which gives up the cutting while increasing the efficiency of the ingot cutting process. Device.

In order to attain the above object, a wire tension restoring apparatus according to the present invention is a wire tension restoring apparatus for restoring the tension of a wire that has been cut after an ingot is cut off, An entry roller portion, and a second entry roller portion; A first mounting table provided with the first entry roller portion and movably installed along the longitudinal direction of the ingot; A second mounting table provided with the second entry roller portion and movably installed along the longitudinal direction of the ingot; And a tension roller which is provided on the first mounting table or the second mounting table and which is disposed between the first entry roller section and the second entry roller section and which is wound around the first entry roller section and the second entry roller section An auxiliary roller portion for providing the auxiliary roller portion; And a linear driving unit for moving the first mounting table and the second mounting table along the longitudinal direction of the ingot, wherein a distance between the first mounting table and the second mounting table is determined by the linear driving unit, So that the length of the region of the ingot which abandons the cut can be adjusted.

delete

In the wire tension restoring device according to the present invention, more specifically, a tension measuring sensor for measuring a tension of the wire; And a first feeding part for reciprocating the tension measuring sensor between a passing position where the wire passes and a leaving position that is away from the passing position, wherein the tension measuring device measures the tension of the wire after cutting the ingot, The tension measuring sensor is moved to the passing position to measure the tension of the wire, and after the tension of the wire is measured, the tension measuring sensor is moved to the releasing position.

In the wire tension restoring device according to the present invention, the auxiliary roller portion may include a second conveying portion for reciprocating the auxiliary roller in which the wire is wound and wound in a direction of tensioning the wire or in a direction of loosening the wire, .

In the wire tension restoration apparatus according to the present invention, more specifically, a frame in which the first mounting base and the second mounting base are installed; And an anti-vibration unit installed at a lower portion of the frame for preventing vibration of the first mounting base and the second mounting base.

In the wire tension restoring device according to the present invention, the vibration preventing part may include a vacuum adsorption pad which can be attached to the ground in a vacuum state; A guide portion for vertically moving the vacuum adsorption pad with respect to the frame; And an air suction line connected to the vacuum adsorption pad and sucking air inside the vacuum adsorption pad to form a vacuum inside the vacuum adsorption pad.

According to the wire tension restoration apparatus of the present invention, it is possible to reduce the waste of the ingot and to reduce the manufacturing cost of the wafer.

In addition, according to the wire tension restoration apparatus of the present invention, the length of the region to give up cutting in the ingot can be selectively adjusted, and the ingot that is wastefully wasted can be saved.

In addition, according to the wire tension restoration apparatus of the present invention, it is possible to compare the tensile strength of a wire that has been broken and then to a wire that has been re-bonded, so that the strength of a wire for cutting an ingot can be adjusted according to a measured tension.

Further, according to the wire tension restoration apparatus of the present invention, a wafer with improved quality can be manufactured.

1 is a perspective view illustrating a wire tension restoring device according to an embodiment of the present invention,
FIG. 2 is a view showing a state in which a wire is wound around a roller after being broken in a wire tension restoring device according to an embodiment of the present invention,
Figs. 3 and 4 are views showing a first mounting table and a second mounting table which are moved toward a region of the ingot in which the cutting is abandoned in the wire tension restoring device of Fig. 1,
FIGS. 5 and 6 are diagrams showing regions in the wire tension restoring apparatus of FIG. 1 that give up cutting among the ingots which are changed in accordance with the movement of the first mounting table and the second mounting table,
FIG. 7 is a view showing a tension measuring sensor in the wire tension restoring device of FIG. 1,
FIG. 8 is a view showing a vibration preventing unit for preventing vibration generated in the first mounting table and the second mounting table in the wire tension restoring device of FIG. 1;

Hereinafter, embodiments according to the wire tension restoration apparatus according to the present invention will be described in detail with reference to the drawings.

FIG. 1 is a perspective view illustrating a wire tension restoring apparatus according to an embodiment of the present invention. FIG. 2 is a view showing a state in which a wire after being broken in a wire tension restoring apparatus according to an embodiment of the present invention is wound around a roller Figs. 3 and 4 are views showing a first mounting table and a second mounting table which are moved toward a region to give up cutting in ingots in the wire tension restoring device of Fig. 1, and Figs. 5 and 6 are diagrams Fig. 7 is a view showing a tension sensor in the wire tension restoring device shown in Fig. 1; Fig. 7 is a view showing a tension sensor in the wire tension restoring device of Fig. 1 And FIG. 8 is a view illustrating a vibration preventing unit for preventing vibrations generated in the first mounting table and the second mounting table in the wire tension restoring device of FIG.

Referring to FIGS. 1 to 8, the wire tension restoring device according to the present embodiment restores the lost tension of a wire that is broken after cutting in the process of cutting an object using a wire, A tension roller 140 and a vibration preventing part 150. The first pressing roller 110, the second entering roller part 120, the auxiliary roller part 130, the tension measuring sensor 140,

The first entry roller unit 110 is installed on the first mounting base A and the wire W pulled from the ingot 10 side is wound around the first mounting base A. The second entry roller unit 120 is installed on the second mounting base B and a wire W pulled from the ingot 10 side is wound around the second mounting base B.

Referring to FIG. 2, the wire W of the present embodiment is a wire W connected again to a broken wire while cutting the ingot 10 using a wire wound around the cutting roller 20, It is preferable that the roller unit 110 and the second entry roller unit 120 have sufficient length to be sufficiently wound around the roller unit 110 and the second entry roller unit 120.

In this embodiment, the first mounting base A and the second mounting base B are movably installed along the longitudinal direction of the ingot 10.

3, it can be seen that when the wire is cut in the right region of the ingot 10, the first mounting base A and the second mounting base B move toward the right region of the ingot 10, It can be seen that the first mounting base A and the second mounting base B are navigated to the left region of the ingot 10 when the wire is broken in the left region of the ingot 10.

Since the apparatus for cutting the ingot 10 and the ingot 10 is fixed, after the broken wires are joined, the wire W is brought to the first mounting base A and the second mounting base B, The first entry roller unit 120 and the second entry roller unit 120, respectively.

A considerable amount of the wire W will be wasted if the wire W is brought from the apparatus for cutting the ingot 10 and the ingot 10 to the first mounting base A and the second mounting base B . As a result, when the wire W is wasted, the area a of the ingot 10 which abandons the cut is also increased, and the ingot 10 is wasted by that area. Therefore, the first and second mounting tables A and B are moved toward the region a to which the cutting is to be stopped among the fixed ingots 10, and the wire W is moved to the first entry roller portion 110 And wound around the second entry roller portion 120.

By moving the first mounting base A and the second mounting base B toward the region a of the ingot 10 which abandons the cutting, the waste of the ingot 10 can be reduced, and the manufacturing cost of the wafer can be reduced have.

Referring to FIG. 1, the first mounting base A and the second mounting base B can be moved along a guide rail GR by a linear driving unit within a frame F, and the linear driving unit can be a linear motor .

In this embodiment, the ingot 10 is made by heating a high-purity polycrystalline silicon to a temperature of about 1400 degrees to form a melt, adding a monocrystalline silicon seed to the melt, and pulling the monocrystalline ingot to have a seed of the same orientation , And are grown in a square pillar shape. The ingot 10 is cut into a predetermined thickness by the wire W and made into a wafer.

In this embodiment, the interval between the first mounting base A and the second mounting base B is set so that the lengths a1 and a2 of the region of the ingot 10 that abandons the cut can be adjusted, Respectively.

Referring to FIG. 5, the first mounting table A and the second mounting table B are moved so as to be close to each other in order to reduce the length a1 of the area of the ingot 10 which abandons cutting. As the distance between the first mounting base A and the second mounting base B approaches, the length a1 of the region of the ingot 10 which abandons the cutting is reduced.

Referring to FIG. 6, the first mounting table A and the second mounting table B are moved away from each other in order to increase the length a2 of the area of the ingot 10 which abandons the cutting. As the distance between the first mounting base A and the second mounting base B increases, the length a2 of the region of the ingot 10 which abandons the cutting is increased.

The first mounting base A and the second mounting base B are independently adjustable along the longitudinal direction of the ingot 10 so that the lengths a1 and a2 of the region of the ingot 10 which abandons the cut So that the ingot 10, which is wastefully wasted, can be saved.

The auxiliary roller unit 130 is installed on the first mounting base A or the second mounting base B and is disposed between the first entering roller unit 110 and the second entering roller unit 120, Thereby providing a tension to the wire W wound around the first entry roller portion 110 and the second entry roller portion 120.

Since it is difficult to provide a sufficient tension to cut the ingot 10 only by the first entering roller portion 110 and the second entering roller portion 120, the auxiliary roller portion 130 is provided to provide tension.

In this embodiment, a plurality of auxiliary roller units 130 may be provided. The first auxiliary roller unit 131, the second auxiliary roller unit 132, the third auxiliary roller unit 133, (134). Particularly, the first auxiliary roller portion 131 and the second auxiliary roller portion 132 may be fixedly installed, and the third auxiliary roller portion 131 may be fixedly installed. The auxiliary roller portion 133 and the fourth auxiliary roller portion 134 are installed to be reciprocally movable.

1, the third auxiliary roller portion 133 and the fourth auxiliary roller portion 134 are reciprocated by a second conveying portion (not shown), respectively. The second conveying portion includes a linear guide rail, a screw member, And the third auxiliary roller portion 133 and the fourth auxiliary roller portion 134 can be manually moved by rotating the screw member using the lever. Meanwhile, the third auxiliary roller portion 133 and the fourth auxiliary roller portion 134 may be moved by a linear driving unit including a motor or the like, respectively. The linear driving unit may be configured by a linear motor or the like.

In this embodiment, in order to adjust the strength of the tension, the second conveying portion is formed by tightening the third auxiliary roller portion 133 or the fourth auxiliary roller portion 134 in which the wire W is wrapped around the wire W In a direction in which the wire W is loosened. In order to increase the strength of the tension, the third auxiliary roller portion 133 or the fourth auxiliary roller portion 134 is fed in the direction of tightening the wire W, and in order to decrease the strength of the wire, The third auxiliary roller portion 133 or the fourth auxiliary roller portion 134 is fed in the direction of loosening.

The tension measuring sensor 140 measures the tension of the wire W after the ingot 10 is cut off. Here, the tension measuring sensor 140 reciprocates between the passage position P1 through which the wire W passes and the release position P2 deviating from the passage position P1.

7A, the tension measuring sensor is moved to the passing position P1 where the wire W passes in order to measure the tension of the wire W. As shown in Fig. Thereafter, the wire W is wound around the tension measuring sensor 140, and the tension of the wire W is measured

7 (b), after tension measurement of the wire W is completed, the tension measuring sensor 140 is moved to the releasing position P2 deviating from the passing position P1 through which the wire W passes, Here, the wire W is directly wound and hooked from the fourth auxiliary roller portion 134 to the second auxiliary roller portion 132.

In the present embodiment, the tension measuring sensor 140 is reciprocated by a first transferring unit (not shown), and the first transferring unit may be constituted by a linear driving unit such as a linear motor or the like, Unit.

It is possible to compare the tensile force of the wire W that has been broken after being cut off and the wire W that has been broken again by measuring the tension of the wire W that has been cut after cutting the ingot 10 using the tension measuring sensor 140 And the tensile strength of the wire W for cutting the ingot 10 can be adjusted according to the measured tension.

Further, after the tension measurement is completed, the tensile force of the wire W is unnecessarily affected by the tension measuring sensor 140 by moving the tension measuring sensor 140 from the passing position P1 to the releasing position P2 Can be avoided.

The vibration preventing portion 150 prevents vibration generated from the first mounting base A and the second mounting base B.

7, the anti-vibration unit 150 is installed below the frame F on which the first mounting base A and the second mounting base B are installed to prevent vibration, and the vacuum adsorption pad 151 A guide portion 152, and an air suction line 153. [

The vacuum adsorption pad 151 may be attached to the ground surface in a vacuum state.

The guide portion 152 moves the vacuum adsorption pad 151 in the vertical direction with respect to the frame F. The vacuum adsorption pad 151 can be attached to the ground while being moved in the vertical direction by the guide portion 152.

The air suction line 153 is connected to the vacuum adsorption pad 151 and sucks air inside the vacuum adsorption pad 151 to form a vacuum inside the vacuum adsorption pad 151. Here, the air suction line 153 is connected to an external air suction unit (not shown), and air inside the vacuum suction pad 151 is sucked by an external air suction unit.

In the present embodiment, the anti-vibration unit 150 includes the first entrance roller unit 110, the second entry roller unit 120, and the second entrance roller unit 110 in the frame F provided with the first installation base A and the second installation base B, It is possible to prevent the vibration generated from the auxiliary roller unit 130 and to prevent the vibration generated from the floor.

It is possible to manufacture the wafer with improved quality by preventing vibration generated from the first mounting base A and the second mounting base B by using the vibration preventing portion 150. [

The wire tension restoring apparatus configured as described above can reduce the waste of the ingot by reducing the manufacturing cost of the wafer by moving the first mounting table and the second mounting table toward the region where the cutting is to be discontinued among the ingots .

Further, in the wire tension restoring apparatus configured as described above, since the first mounting base and the second mounting base are independently adjustable along the longitudinal direction of the ingot, the length of the region to give up the cutting of the ingot can be selectively adjusted Therefore, it is possible to save the ingot which is wastefully wasted.

Further, in the wire tension restoring apparatus configured as described above, the tension of the wire bonded after being broken after cutting the ingot is measured by using a tension measuring sensor, and the tension of the wire after being broken is compared with that of the wire bonded again. And the tensile strength of the wire for cutting the ingot can be adjusted according to the measured tensile force.

In addition, the wire tension restoring device configured as described above can prevent the vibration generated from the first mounting base and the second mounting base by using the vibration preventing portion, thereby obtaining the effect of manufacturing a wafer with improved quality.

The scope of the present invention is not limited to the above-described embodiments and modifications, but can be implemented in various embodiments within the scope of the appended claims. It will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the present invention as defined by the appended claims.

10: Ingot
W: Wire
F: frame
A: First installation
B: Second installation
110: first entry roller section
120: second entry roller section
130:
140: Tension measuring sensor
150:

Claims (6)

A wire tension restoring device for restoring the tension of a wire which has been cut after cutting an ingot,
A first entry roller portion around which a wire pulled from the ingot side is wound and hooked, a second entry roller portion;
A first mounting table provided with the first entry roller portion and movably installed along the longitudinal direction of the ingot;
A second mounting table provided with the second entry roller portion and movably installed along the longitudinal direction of the ingot;
And a tension roller which is provided on the first mounting table or the second mounting table and which is disposed between the first entry roller portion and the second entry roller portion so as to tension the wire wound around the first entry roller portion and the second entry roller portion An auxiliary roller portion for providing the auxiliary roller portion; And
And a linear driving unit for moving the first mounting table and the second mounting table along the longitudinal direction of the ingot,
And the distance between the first mounting base and the second mounting base is adjusted along the longitudinal direction of the ingot by the rectilinear driving unit so as to adjust the length of the region for giving up the cutting of the ingot. Device. delete The method according to claim 1,
A tension measuring sensor for measuring a tension of the wire; And
And a first conveying unit reciprocating the tension measuring sensor between a passing position where the wire passes and a releasing position deviating from the passing position,
The tension measuring sensor is moved to the passing position to measure the tension of the wire so as to measure the tension of the wire bonded after cutting the ingot, and after measuring the tension of the wire, And the wire tension restoration device is moved to the release position. The method according to claim 1,
The auxiliary roller unit
And a second conveying portion for reciprocating the auxiliary roller in which the wire is wound and held in a direction of tensioning the wire or in a direction of loosening the wire. The method according to claim 1,
A frame on which the first mounting base and the second mounting base are installed; And
And an anti-vibration unit installed at a lower portion of the frame to prevent vibration of the first mounting base and the second mounting base. 6. The method of claim 5,
The vibration-
A vacuum adsorption pad which can be attached to the ground in a vacuum state;
A guide portion for vertically moving the vacuum adsorption pad with respect to the frame; And
And an air suction line connected to the vacuum adsorption pad and sucking air inside the vacuum adsorption pad to form a vacuum inside the vacuum adsorption pad.
KR1020150067372A 2015-05-14 2015-05-14 Restoration apparatus for wire tension KR101671855B1 (en)

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Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101038181B1 (en) * 2011-01-21 2011-06-01 오성엘에스티(주) The ingot inserting device for wire saw system
KR101051887B1 (en) 2011-01-31 2011-07-26 오성엘에스티(주) Apparatus of tension control for system of wire saw and method thereof
KR20140091908A (en) * 2013-01-14 2014-07-23 주식회사 엘지실트론 Tension control apparatus and wire saw with it

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101038181B1 (en) * 2011-01-21 2011-06-01 오성엘에스티(주) The ingot inserting device for wire saw system
KR101051887B1 (en) 2011-01-31 2011-07-26 오성엘에스티(주) Apparatus of tension control for system of wire saw and method thereof
KR20140091908A (en) * 2013-01-14 2014-07-23 주식회사 엘지실트론 Tension control apparatus and wire saw with it

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