KR101650761B1 - Flexible Substrate Chemical Vapor Deposition System - Google Patents

Flexible Substrate Chemical Vapor Deposition System Download PDF

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Publication number
KR101650761B1
KR101650761B1 KR1020150044402A KR20150044402A KR101650761B1 KR 101650761 B1 KR101650761 B1 KR 101650761B1 KR 1020150044402 A KR1020150044402 A KR 1020150044402A KR 20150044402 A KR20150044402 A KR 20150044402A KR 101650761 B1 KR101650761 B1 KR 101650761B1
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KR
South Korea
Prior art keywords
cooling
flexible substrate
cooling block
substrate
block
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KR1020150044402A
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Korean (ko)
Inventor
이재호
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주식회사 선익시스템
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Priority to KR1020150044402A priority Critical patent/KR101650761B1/en
Priority to PCT/KR2015/009509 priority patent/WO2016159460A1/en
Application granted granted Critical
Publication of KR101650761B1 publication Critical patent/KR101650761B1/en

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    • H01L21/205—
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02365—Forming inorganic semiconducting materials on a substrate
    • H01L21/02367—Substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02365—Forming inorganic semiconducting materials on a substrate
    • H01L21/02612—Formation types
    • H01L21/02617—Deposition types
    • H01L21/0262—Reduction or decomposition of gaseous compounds, e.g. CVD
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/324—Thermal treatment for modifying the properties of semiconductor bodies, e.g. annealing, sintering

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physical Vapour Deposition (AREA)

Abstract

The present invention relates to a flexible substrate chemical vapor deposition system comprising a vaporization source, a vacuum chamber, a substrate providing device and a substrate cooling device. The vaporization source vaporizes a deposition material to be deposited to a flexible substrate. The vacuum chamber has the vaporization source positioned inside and provides a space for depositing the deposition material. The substrate providing device is included in the vacuum chamber and provides a flexible substrate, to which the deposition material is deposited. The substrate cooling device is positioned on one side of the flexible substrate to reduce heat of the flexible substrate. The substrate cooling device comprises a cooling block and a cooling block moving means. The cooling block is in contact with one side surface of the flexible substrate to cool the flexible substrate. The cooling block moving means moves the cooling block together with the flexible substrate while maintaining a state where the cooling block is in contact with the one side surface of the flexible substrate. The cooling block is continuously cooled in a state that the cooling block is in contact with the flexible substrate to increase cooling efficiency, and the entire flexible substrate is uniformly cooled, thereby restricting damage to the substrate due to non-uniform cooling.

Description

[0001] Flexible Substrate Chemical Vapor Deposition System [

The present invention relates to a chemical vapor deposition system capable of performing chemical vapor deposition on a flexible substrate, and more particularly, to a chemical vapor deposition system capable of preventing damage to a substrate during a process of cooling a substrate heated during a vapor deposition process for a flexible substrate To a flexible substrate chemical vapor deposition system.

BACKGROUND OF THE INVENTION [0002] Recent semiconductor devices or display devices are manufactured through various manufacturing processes including a deposition process. When the substrate is heated by the various manufacturing processes and becomes hot, the substrate is cooled to a room temperature in the middle, and then transferred to the next process chamber or the manufacturing process is completed.

Many techniques have been proposed to reduce the time required for the overall manufacturing process by shortening the cooling time since it takes a long time for the high-temperature flexible substrate to cool naturally to a normal temperature level.

Among these conventional technologies are Korean Patent Laid-Open No. 10-2014-0143589 entitled "Flexible WOLED Display and Rolled-Roll Deposition for Production of Thin Film for Flexible OLED Lighting," hereinafter referred to as Prior Art 1).

According to Prior Art 1, a technique is disclosed in which a metal belt is cooled to cool a flexible substrate, and a cooled metal belt is brought into contact with a lower surface of the flexible substrate to cool the flexible substrate.

However, according to the prior art 1, since the temperature of the metal belt rises while the cooled metal belt is in contact with the flexible substrate and is cooled by thermal conduction, the metal belt also has a temperature The cooling efficiency was inevitably lowered. Therefore, it is difficult to uniformly cool the substrate uniformly and it is difficult to shorten the cooling time.

SUMMARY OF THE INVENTION An object of the present invention is to provide a flexible substrate chemical vapor deposition system capable of continuously cooling a flexible substrate more rapidly and uniformly while a deposition material is deposited.

According to an aspect of the present invention, there is provided a flexible substrate chemical vapor deposition system including: an evaporation source for evaporating a deposition material to be deposited on a flexible substrate; A vacuum chamber for containing the evaporation source and providing a space for depositing the evaporation material; A substrate supply device provided in the vacuum chamber, the substrate supply device providing the flexible substrate on which the deposition material is to be deposited; And a substrate cooling device provided on one side of the flexible substrate for cooling the heat of the flexible substrate, wherein the substrate cooling device includes: a cooling block for cooling the flexible substrate in contact with one side surface of the flexible substrate; And a cooling block moving means for moving the cooling block such that the cooling block is in contact with one side surface of the flexible substrate and moves together with the flexible substrate. May be included as one feature.

Here, the cooling block moving means of the substrate cooling apparatus includes a cooling chain which is coupled with the cooling block to support the cooling block, and moves together with the cooling block; And a rotation roller for allowing the cooling chain to circulate so that the cooling block can move.

Here, the cooling block moving means of the substrate cooling apparatus may include: a cooling belt that is coupled with the cooling block to support the cooling block, and moves together with the cooling block; And a rotation roller for allowing the cooling chain to circulate so that the cooling block can move.

Here, a plurality of the cooling blocks may be provided, and at least one of the cooling blocks may contact one side surface of the substrate.

Further, each of the plurality of cooling blocks may further include a cooling device for cooling the cooling block.

Further, the substrate cooling apparatus may further include a coolant supply device for supplying coolant to each of the plurality of cooling blocks.

Here, the substrate supply apparatus may include: a supply roller for supplying the flexible substrate to a deposition position where deposition of the deposition material is performed; A recovery roller for recovering the flexible substrate on which the deposition material is deposited; And a direction roller disposed between the supply roller and the collection roller to assist the flexible substrate to be continuously supplied to the deposition position to pass through the deposition position; May be another feature of the present invention.

The controller may further include a controller configured to control the cooling block to move at a speed equivalent to that of the flexible substrate in contact with one side surface of the flexible substrate.

A support belt for supporting the cooling block at a lower side of the cooling block so that the cooling block moving means coupled to the cooling block does not have a load due to the load of the cooling block; May be further included.

Further, the support belt may be characterized in that it circulates at a speed equivalent to the moving speed of the cooling block in contact with the lower side of the cooling block.

In the flexible substrate chemical vapor deposition system according to the present invention, since the cooling block can be cooled by heat conduction in contact with one surface of the flexible substrate, the cooling time can be further shortened, thereby reducing the production process time.

Since the cooling block is continuously cooled even in the state of being in contact with the flexible substrate, the cooling efficiency can be continuously maintained, and even cooling over the entire substrate can be suppressed.

In addition, since the flexible substrate moves at the same speed as the flexible substrate, no damage is caused to one surface of the flexible substrate, thereby improving the production efficiency.

1 and 2 are cross-sectional views schematically showing a cross-sectional view of a flexible substrate chemical vapor deposition system according to an embodiment of the present invention.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

1 is a schematic cross-sectional view of a flexible substrate chemical vapor deposition system according to an embodiment of the present invention.

1, a flexible substrate chemical vapor deposition system according to an embodiment of the present invention includes an evaporation source 100, a vacuum chamber 10, a substrate supply device 210, 220, 230, 240, (300).

The evaporation source (100) evaporates the evaporation material to be deposited on the surface of the flexible substrate (20). The evaporation source 100 basically includes a crucible having an evaporation material therein and a heater (not shown) for supplying heat to evaporate the evaporation material. At least one evaporation nozzle (not shown) is formed in the crucible. The evaporation material evaporates through the evaporation nozzle and flows to the flexible substrate 20 side. In FIG. 1, the evaporation source 100 is schematically illustrated.

The vacuum chamber 10 includes an evaporation source 100 and provides a space isolated from the outside so that a process of depositing a deposition material on the flexible substrate 20 can be performed. The inside of the vacuum chamber 10 is in a vacuum state, and a deposition process is performed in vacuum. The vacuum chamber 10 is provided with a vacuum pump (not shown) for providing a vacuum state.

The substrate providing apparatuses 210, 220, 230, and 240 are provided in the vacuum chamber 100. And a flexible substrate 20 on which a deposition material is to be deposited. That is, the flexible substrate 20 transfers the deposition material to the deposition position, which is the position where the deposition material is deposited. Then, the flexible substrate 20 on which the evaporation material is deposited is recovered.

Unlike a normal substrate, the flexible substrate 20 has flexibility and is continuous, unlike a glass substrate. Accordingly, the flexible substrate 20 is transferred to the deposition position, and the flexible substrate 20 on which the evaporation material is deposited is recovered at the deposition position. This process can be performed until all of the flexible substrate 20 wound on the roll of the flexible substrate 20 is deposited.

This substrate supply apparatus includes a supply roller 210, a collection roller 220 and a direction roller 230,

The feeding roller 210 is in a state in which the flexible substrate 20 is wound and before the evaporation material is deposited. The flexible substrate 20 wound while rotating the feed roller 210 is released and the flexible substrate 20 unwound from the feed roller 210 is moved to the deposition position.

The collection roller 220 collects the flexible substrate 20 on which the deposition material is deposited at the deposition position. The recovery roller 220 also rotates to recover the flexible substrate 20 by winding the flexible substrate 20 thereon.

The direction rollers 230 and 240 are positioned between the supply roller 210 and the recovery roller 220 to assist the flexible substrate 20 to be continuously supplied to the deposition position to pass through the deposition position. As shown in FIG. 1, the direction rollers 230 and 240 serve as an auxiliary function for positioning the flexible substrate 20 released from the supply roller 210 so that the flexible substrate 20 can pass the deposition position.

The flexible substrate 20 is discharged from the supply roller 210 and is deposited over the deposition position by the aid of the direction rollers 230 and 240. The flexible substrate 20 after the deposition is finally transferred to the collecting roller 220 ).

The substrate cooling apparatus 300 is provided on one side of the flexible substrate 20 in the vacuum chamber 10 to cool the heat received while the evaporation material is deposited on the flexible substrate 20 provided from the substrate providing apparatuses 210, 220, do.

The substrate cooling apparatus 300 includes a cooling block 310 and cooling block moving means.

The cooling block 310 cools the flexible substrate 20 by contacting one side surface of the flexible substrate 20.

It is preferable that a plurality of such cooling blocks 310 are provided and at least one of the cooling blocks 310 is in contact with one side of the flexible substrate 20. 1 schematically shows a state in which a plurality of cooling blocks 310 are in contact with a lower surface of the flexible substrate 20. In FIG.

The cooling block 310 contacts the flexible substrate 20 to cool the flexible substrate 20. That is, it is a cooling method using a heat conduction phenomenon. It is desirable that the cooling block 310 maintains a state of low temperature that is continuously cooled for the purpose of stable cooling to the flexible substrate 20. [

A cooling device (not shown) for cooling the cooling block 310 may be provided so that the cooling block 310 can maintain the cooled low-temperature state. In this case, a cooling device is separately provided for each of the plurality of cooling blocks 310 and is built in the cooling block 310.

Alternatively, in order to maintain the cooled low-temperature state of the cooling block 310, the low-temperature refrigerant cooled from the outside is continuously supplied to each of the plurality of the cooling blocks 310, and the refrigerant There may also be a form in which a coolant supply device (not shown) is provided separately for constant recovery.

In this way, it is preferable that the cooling block 310 can continuously cool the flexible substrate 20 while maintaining a low-temperature state constantly.

The cooling block moving means 320 moves the cooling block 310 so that the cooling block moves together with the flexible substrate 20 while keeping the cooling block in contact with one side of the flexible substrate 20.

The cooling block moving means 320 may have various forms including a rotating roller 323 and a cooling chain 321, or a configuration including a rotating roller and a cooling belt . Fig. 1 schematically shows a configuration including a rotating roller 323 and a cooling chain 321. Fig.

First, the cooling chain 321 of the cooling block moving means 320 is coupled with the cooling block 310 to support the cooling block 310. And moves with the cooling block 310. Then, the rotation roller 323 rotates the cooling chain 321 so that the cooling chain 321 can circulate so that the cooling block 310 can move.

The rotation of the rotation roller 323 causes the cooling chain 321 to rotate and move within a predetermined range. Herein, the predetermined period may be a period in which deposition of the evaporation material is performed on the surface of the flexible substrate 20.

The cooling block 310 is also rotated together with the cooling chain 321 while the cooling chain 321 is circulatingly rotated by the rotating roller 323. Thus, at least one cooling block 310 is caused to circulate along with the cooling chain 321.

Here, at least one cooling block 310 contacts the lower surface while the evaporation material is deposited on the upper surface of the flexible substrate 20. During the movement of the flexible substrate 20, the cooling block 310 moves together while maintaining the state of being in contact with the flexible substrate 20.

Here, the cooling block 310 is moved by the cooling chain and the rotating roller 321 at the same speed as the moving speed of the flexible substrate 20. The two substrates move at the same speed in a state where the flexible substrate 20 and the cooling block 310 are in contact with each other, so that the lower surface of the flexible substrate 20 is not damaged.

The case where the cooling block moving means 320 includes the cooling chain 321 and the rotating roller 323 is also the same as the case including the cooling belt and the rotating roller as the cooling block moving means. There is a difference in that the cooling chain 321 rotates in a gear-like manner while being engaged with the rotating roller 323, but the cooling belt rotates using a force pushed against the outer peripheral surface of the rotating roller. Basically, (310) can be circulated and rotated, so that repetitive description will be omitted.

The cooling block moving means 320 coupled to the cooling block 310 is provided at a lower side of the cooling block 310 with a cooling block 310 so that a load due to the load of the cooling block is not applied to the cooling block moving means 320, It is also preferable that the support belt 410 supports the belt 310. FIG. 2 is a cross-sectional view schematically showing a mode in which a support belt and a support belt circulation roller are further included in a flexible substrate chemical vapor deposition system according to an embodiment of the present invention. It is also desirable for the support belt 410 to support the cooling block 310 as referenced in FIG.

Here, it is preferable that the support belt 410 rotates at a speed equivalent to the moving speed of the cooling block 310 in contact with the lower side of the cooling block 310. To this end, it is preferable that a support belt circulation roller 420 for circulating and rotating the support belt 410 is provided.

When the support belt 410 rotates at a speed equivalent to that of the cooling block 310 in a state in which the support belt 410 is in contact with the lower side of the cooling block 310, the outer surface of the cooling block 310 is not damaged, It is possible to reduce the possibility of indirect damage. In addition, it is preferable that the cooling block 310 can be circulated and rotated stably without stress.

A control unit (not shown) may be further included in the flexible substrate chemical vapor deposition system according to the present invention to control or adjust the moving speed of the flexible substrate 20 and the moving speed of the cooling block 310 to be equal.

As described above, in the flexible substrate chemical vapor deposition system according to the present invention, since the cooling block can be cooled by thermal conduction in contact with one surface of the flexible substrate, the cooling time can be further shortened, There are advantages to be able to. Also, the cooling block can be continuously cooled even in the state of being in contact with the flexible substrate, so that the cooling efficiency can be improved. Furthermore, since the cooling block is uniformly cooled throughout the substrate, damage to the substrate due to uneven cooling can be suppressed. Further, since the flexible substrate moves at the same speed as the flexible substrate, there is no damage to one surface of the flexible substrate, which is advantageous in increasing the production efficiency.

While the present invention has been described in connection with what is presently considered to be practical exemplary embodiments, it is to be understood that the invention is not limited to the disclosed embodiments, but, on the contrary, It is to be understood that the scope of the present invention is to be construed as being limited only by the embodiments, and the scope of the present invention should be understood as the following claims and their equivalents.

10: Vacuum chamber 20: Flexible substrate
100: evaporation source 210: feed roller
220: collection roller 230, 240: direction roller
300: substrate cooling apparatus 310: cooling block
320: cooling chain 410: support belt
420: Support Belt Circulation Roller

Claims (10)

An evaporation source for evaporating a deposition material to be deposited on a flexible substrate;
A vacuum chamber for containing the evaporation source and providing a space for depositing the evaporation material;
A substrate supply device provided in the vacuum chamber, the substrate supply device providing the flexible substrate on which the deposition material is to be deposited; And
And a substrate cooling device provided on one side of the flexible substrate for cooling the heat of the flexible substrate,
The substrate cooling apparatus includes:
A cooling block for cooling the flexible substrate in contact with one side surface of the flexible substrate; And
A cooling block moving means for moving the cooling block to move together with the flexible substrate while keeping the cooling block in contact with one side surface of the flexible substrate; Wherein the flexible substrate chemical vapor deposition system comprises a flexible substrate chemical vapor deposition system. The method according to claim 1,
Wherein the cooling block moving means of the substrate cooling apparatus includes:
A cooling chain in engagement with the cooling block to support the cooling block and move with the cooling block; And
And a rotating roller for allowing the cooling chain to circulate so that the cooling block can be moved. The method according to claim 1,
Wherein the cooling block moving means of the substrate cooling apparatus includes:
A cooling belt in engagement with the cooling block to support the cooling block and move with the cooling block; And
And a rotation roller for allowing the cooling belt to circulate so that the cooling block can be moved. The method according to claim 1,
Wherein a plurality of cooling blocks are provided, and at least one of the cooling blocks is in contact with one side surface of the substrate. 5. The method of claim 4,
In each of the plurality of cooling blocks,
And a cooling device for cooling the cooling block is incorporated in the flexible substrate chemical vapor deposition system. 5. The method of claim 4,
The substrate cooling apparatus includes:
And a coolant supply device for supplying coolant to each of the plurality of cooling blocks. The method according to claim 1,
The substrate supply apparatus includes:
A supply roller for supplying the flexible substrate to a deposition position where vapor deposition of the evaporation material is performed;
A recovery roller for recovering the flexible substrate on which the deposition material is deposited; And
A direction roller positioned between the supply roller and the collection roller to assist the flexible substrate to be continuously supplied to the deposition position and pass through the deposition position; Wherein the substrate is a silicon substrate. The method according to claim 1,
Further comprising a controller for controlling the cooling block to move at a speed equivalent to that of the flexible substrate in contact with one side surface of the flexible substrate. The method according to claim 1,
A support belt for supporting the cooling block at a lower side of the cooling block so that the cooling block moving means coupled to the cooling block does not have a load due to the load of the cooling block; Further comprising the step of: depositing a flexible substrate chemical vapor deposition system on the flexible substrate. 10. The method of claim 9,
The support belt
Wherein the cooling block is rotated at a speed equivalent to the moving speed of the cooling block in contact with the lower side of the cooling block.
KR1020150044402A 2015-03-30 2015-03-30 Flexible Substrate Chemical Vapor Deposition System KR101650761B1 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
KR1020150044402A KR101650761B1 (en) 2015-03-30 2015-03-30 Flexible Substrate Chemical Vapor Deposition System
PCT/KR2015/009509 WO2016159460A1 (en) 2015-03-30 2015-09-10 Flexible substrate chemical vapor deposition system

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KR1020150044402A KR101650761B1 (en) 2015-03-30 2015-03-30 Flexible Substrate Chemical Vapor Deposition System

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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4369531B2 (en) * 2008-02-20 2009-11-25 パナソニック株式会社 Thin film forming apparatus and thin film forming method
KR100952172B1 (en) * 2008-03-28 2010-04-09 안우영 Patten sputtering apparatus for direct patten forming and method for circuit forming of flexible printed circuit board
KR20100094553A (en) * 2007-12-05 2010-08-26 파나소닉 주식회사 Thin film forming apparatus and thin film forming method
JP4657385B2 (en) * 2009-04-22 2011-03-23 パナソニック株式会社 Thin film forming apparatus and thin film forming method

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20100094553A (en) * 2007-12-05 2010-08-26 파나소닉 주식회사 Thin film forming apparatus and thin film forming method
JP4369531B2 (en) * 2008-02-20 2009-11-25 パナソニック株式会社 Thin film forming apparatus and thin film forming method
KR100952172B1 (en) * 2008-03-28 2010-04-09 안우영 Patten sputtering apparatus for direct patten forming and method for circuit forming of flexible printed circuit board
JP4657385B2 (en) * 2009-04-22 2011-03-23 パナソニック株式会社 Thin film forming apparatus and thin film forming method

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