KR101628777B1

KR101628777B1 - A plastic injection mold and method for manufacturing polymer substrate

Info

Publication number: KR101628777B1
Application number: KR1020130147266A
Authority: KR
Inventors: 이태재; 김병일; 배남호; 이문근; 이석재; 김봉석; 이상훈
Original assignee: 티엔에스(주); 한국과학기술원
Priority date: 2013-11-29
Filing date: 2013-11-29
Publication date: 2016-06-16
Also published as: KR20150063206A

Abstract

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a mold for injection molding and injection molding of a polymer substrate using the same, and more particularly to a mold for injection molding of a mold substrate, such as a silicon wafer, a quartz substrate or a glass substrate, The present invention relates to a method of manufacturing a polymer substrate having a smooth surface by using an injection mold equipped with the mold core, and a polymer substrate using the method. Accordingly, the present invention provides a mold comprising: a plate-shaped mold core; A buffer member padded on one surface of the plate-shaped mold core; A plate mold cavity; A mold plate for mounting the plate-shaped mold core; And a mold plate for mounting the plate-shaped mold cavity, wherein the plate-shaped mold core and the plate-shaped mold cavity are made of a silicon wafer (Si wafer), a quartz substrate, And a glass substrate are applied to the injection mold and the polymer substrate to which the injection mold is applied. When the polymer substrate is manufactured by applying the mold core using the silicon wafer (Si wafer), the quartz substrate and the glass substrate of the present invention, It is possible to simplify the injection process and reduce the cost by eliminating the need to manufacture a separate metal stamp through a method of directly patterning and injecting the mold core onto the mold core even when manufacturing the patterned polymer substrate .

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to an injection mold and a polymer substrate manufacturing method for manufacturing a polymer substrate,

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a mold for injection molding and injection molding of a polymer substrate using the same, and more particularly to a mold for injection molding of a mold substrate, such as a silicon wafer, a quartz substrate or a glass substrate, The present invention relates to a method of manufacturing a polymer substrate having a smooth surface by using an injection mold equipped with the mold core, and a polymer substrate using the method.

In general, plastic injection molding is a method of molding a plastic material in a cavity formed between two molds which are closed to form a product. The injection molding machine includes an injection unit and a clamping unit Unit).

The injection apparatus has a cylinder, and the solid plastic particles transferred into the cylinder are melted and transferred to the front of the cylinder. When the transfer is finished, the plastic solution transferred to the cylinder is passed through the nozzle at a high pressure to enter the mold.

A mold used for injection molding is divided into a fixed side mold attached to a fixing plate of a mold clamping device and a movable side mold attached to a moving plate of a mold clamping device. When these two molds are engaged with each other to form a cavity And the molten resin is filled therein, and the plastic is hardened by the temperature of the mold, thereby making the plastic product.

On the other hand, among the plastic products made by the plastic injection mold having the injection pressure-resistant cushioning structure, the lengths of the upper and lower curved surfaces are different with respect to the through hole at the central portion where the cathode ray tube is located like the front case of the television receiver.

When the length of the bent portion of the product is different, the bending length of the cavity formed in the mold is varied, and when the molten resin is injected into the cavity, a temporal gap is generated between the two cavities having different lengths .

In general, a plastic injection mold having an injection pressure-resistant cushioning structure is divided into a fixed-side mold and a movable-side mold, and a cavity, which is a space forming the shape of a product inside the mold, .

In order to fix the stationary-side mold and the movable-side mold, a stepped portion is formed on the outer periphery of the stationary-side mold and the movable-side mold by a combination of a fixing groove and a fixing jaw. A slide block having a slidable engagement structure and a locking block are provided to separate the molded product from the mold.

On the other hand, a plastic injection mold having an injection pressure-resistant cushioning structure is used for a plastic product having different lengths of curved surfaces on the upper and lower sides with respect to a through hole at the center where a cathode ray tube is located, as in the case of a front- .

Therefore, when the molten resin is injected into the cavity through the injection port and the gate of the mold, the cavity is divided into a cavity having a long length and a cavity having a short length such as a bent surface of a product having a different length from each other , A time gap is formed between the cavity portion and the cavity end to fill the molten resin with the resin.

Accordingly, even when the molten resin is completely filled in the end portion of the cavity, the injection process for filling the molten resin in the cavity continues, so that the injected molten resin is injected into the inside of the cavity The force is applied to the upper mold and the core in opposite directions and the force is concentrated on the fixing jaw portion of the step portion for fixing the mold to each other or the connecting portion between the slide block and the locking block, That is, cracks are generated.

KOKAI Publication No. 2000-0009059 discloses an injection mold for an optical disk substrate which comprises a movable side mold plate and a fixed side mold plate for forming a substrate molding cavity for optical disc therebetween by a cavity ring, Wherein an inclined surface is formed in the substrate forming cavity so that the width of the substrate gradually narrows from the inner circumferential portion to the outer circumferential portion. In another aspect of the present invention, the inner surface of the mirror surface of the movable-side template or the inner surface of the mirror-side surface of the fixed-side template is inclined to be inclined from the inner peripheral portion toward the outer peripheral portion so that the width gradually narrows from the inner peripheral portion to the outer peripheral portion of the cavity And an injection mold for an optical disc substrate. However, in the present invention, a polymer substrate is manufactured by applying a mold core to which a silicon wafer (Si wafer), a quartz substrate, and a glass substrate are applied. Due to a shock absorbing effect and a mold-clamping force dispersing effect by the buffer member during the mold- It is possible to prevent the mold core from breaking and to manufacture the patterned polymer substrate by directly patterning and injecting the mold core to omit the production of a separate metal stamp to simplify the injection process and reduce the cost There is a difference from the above-mentioned invention.

According to the polymer substrate to which the conventional injection mold is applied, in order to manufacture a product having a smooth surface such as a glass surface, a lapping process for finely grinding the surface of the injection mold has been additionally performed. In order to manufacture a patterned polymer substrate, a patterned injection mold is formed by machining, discharge machining, chemical etching, or the like, or a desired structure is formed on the surface of a silicon wafer by using a semiconductor process, After the mold is fabricated, a somewhat cumbersome method of applying Ni stamp to the mold base of the injection mold with the die core by the Ni seed coating and electroplating method has been applied. As an alternative to the Ni stamp, if a silicon wafer, a quartz substrate, or a glass substrate is directly attached to a mold core of an injection mold, an output of a smooth surface can be obtained without a separate process, The stamp making procedure and cost can be reduced. However, since the silicon wafer, the quartz substrate, or the glass substrate is very vulnerable to external impact, the silicon wafer or the glass substrate may be intensively impacted to a specific region during the injection molding process during the injection molding process, .

Accordingly,

A plate-shaped mold core;

A buffer member padded on one surface of the plate-shaped mold core;

A plate mold cavity;

A mold plate for mounting the plate-shaped mold core;

A mold plate which faces the mold plate for mounting the plate-shaped mold core, and which mounts the plate mold cavity;

And,

Wherein the plate-shaped mold core and the plate-shaped mold cavity are made of a silicon wafer, a quartz substrate, and a glass substrate, and an injection mold for manufacturing the polymer substrate and a polymer substrate injected thereinto.

When the polymer substrate is manufactured by applying the mold core using the silicon wafer (Si wafer), the quartz substrate and the glass substrate of the present invention, It is possible to simplify the injection process and reduce the cost by eliminating the need to manufacture a separate metal stamp through a method of directly patterning and injecting the mold core onto the mold core even when manufacturing the patterned polymer substrate .

1 is a schematic view showing a method of manufacturing a nickel stamp according to a conventional method for patterning a polymer substrate.
2 is a front view of the mold core and the buffer member of the present invention.
3 is a perspective view of a mold core and a movable side mold plate provided with the buffer member of the present invention.
Fig. 4 is a perspective view of a movable side template having a mold core provided with a buffer member of the present invention; Fig.
Fig. 5 is a perspective view of a movable side template and a fixed side template with a mold core having a buffer member of the present invention and a mold cavity; Fig.
6 is a flowchart of a method for manufacturing a polymer substrate using an injection mold according to the present invention.

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a mold for injection molding and injection molding of a polymer substrate using the same, and more particularly to a mold for injection molding of a mold substrate, such as a silicon wafer, a quartz substrate or a glass substrate, The present invention relates to a method of manufacturing a polymer substrate having a smooth surface by using an injection mold equipped with the mold core, and a polymer substrate using the method. BRIEF DESCRIPTION OF THE DRAWINGS Fig.

According to the polymer substrate to which the conventional injection mold is applied, in order to manufacture a product having a smooth surface such as a glass surface, a lapping process for finely grinding the surface of the injection mold has been additionally performed. In addition, in order to manufacture a patterned polymer substrate, an injection mold that is patterned by a method such as machining, electrical discharge machining, chemical etching, or the like can be manufactured, or a silicon wafer (Si wafer) , A silicon master mold is fabricated, and a rather cumbersome method of applying Ni stamp to the mold base of the injection mold by the Ni seed coating and electrolytic plating method has been applied. As an alternative to replacing the Ni stamp, a silicon wafer (quartz wafer), a quartz substrate, or a glass substrate may be directly attached to the mold core of the injection mold, thereby reducing the manufacturing procedure and cost of the Ni stamp. However, since the silicon wafer, the quartz substrate or the glass substrate is very vulnerable to external impact, the silicon wafer or the glass substrate is intensively impacted to a specific region during the injection molding process.

Accordingly, the present invention, as shown in Figs. 2 to 5,

A plate-shaped mold core 10;

A buffer member 15 padded on one surface of the plate-shaped mold core 10;

A plate-like mold cavity 20;

A mold plate for mounting the plate-shaped mold core 10;

A template which faces the template for mounting the plate-shaped mold core 10 and attaches the plate-shaped mold cavity 20;

And,

The present invention provides an injection mold for manufacturing a polymer substrate, characterized in that the plate core mold 10 and the plate-shaped mold cavity 20 are made of a silicon wafer.

As shown in FIG. 5, the plate-shaped mold cavity 20 preferably has the same shape and size as the plate-shaped mold core 10. It is also possible to provide a buffer member 25 to be attached to one surface of the plate core 10 in the same manner as the plate core 10.

It is possible to apply not only a silicon wafer but also a crystalline quartz (SiO ₂ ) substrate or an amorphous glass substrate to the plate-like mold core 10 and the plate-shaped mold cavity 20, It is preferable that one side has a length of 90-100 mm and a thickness of 700-800 um.

In the case of the plate-shaped mold core 10 and the plate-shaped mold cavity 20 to which the above-described silicon wafer is applied, a disc shape formed of single crystal silicon (Si) at the beginning of production or a square shape using a dicing machine It is preferable to cut and use it. However, it is possible to manufacture the mold core 10 and the mold cavity 20 in various shapes according to the shape of the polymer substrate to be manufactured.

As shown in FIG. 2, the outer surface of the buffer member 15 has the same shape and size as the mold core 10, and has a window shape with an opened central portion. In the injection molding process, And disperses the mold clamping force. And can prevent the molten polymer resin from leaking out between the mold core 10 and the mold cavity 20. [

When the shape of the mold core 10 is rectangular and the buffer member 15 also has a rectangular shape, as shown in FIG. 2, each of four corners, which is each corner, The shape of the chamfered surface is the round surface, the surface of the tongue, the surface of the chest, the surface of the neck, the surface of the neck, the surface of the neck, (String surface).

The buffer member 15 may be made of copper (Cu), aluminum (Al), nickel (Ni), or soft polymer such as polyethylene (PE), polypropylene (PP), polystyrene It is preferable to include at least one of at least one of polyvinyl chloride (PVC), polyphenylene ether (PPE), polyurethane, and synthetic rubber.

The mold plate for mounting the plate-shaped mold core 10 is the movable side mold plate 30 and the mold plate for mounting the plate mold cavity 20 is the fixed side mold plate 40. However, It is also possible.

A microfluidic device having a fine pattern on a smooth polymer substrate can be made of hardenable plastic and flexible PDMS (Polydimethylsiloxane) depending on the polymer material. In the early stage of development, PDMS (Polydimethylsiloxane) is manufactured on the basis of plastic, and mass production is commercialized.

When a microfluidic device to which a plastic substrate is applied is manufactured, it is preferable that a fine pattern is formed on the surface of the plate-shaped mold core 10 on which the buffer member 15 is mounted in a size of 0.001-10,000 μm. As the patterning method, A computerized numerical control (CNC) lathe machining process or a semiconductor process is applied. More preferably, a semiconductor process such as photolithography, E-beam lithography or laser lithography is applied.

The present invention further provides a method of manufacturing a polymer substrate using an injection mold, as shown in FIG. 6,

(I1) preparing an injection mold including a plate-like mold core (s1000);

II) a mold closing step (s2000) in which the movable side mold plate 30 moves toward the fixed side mold plate 40 so that the cushioning member 15 of the mold core 10 and the mold cavity 20 are in contact with each other;

III) injecting and cooling the molten polymer resin into the space between the mold core 10 and the mold cavity 20 separated by the buffer member 15 (S3000);

IV) a mold opening step (S4000) in which the movable side mold plate (30) moves toward the direction opposite to the fixed side mold plate (40);

(V5) removing the polymer substrate formed in the space between the mold core (10) and the mold cavity (s5000);

The present invention also provides a method of manufacturing a polymer substrate using an injection mold and a polymer substrate using the same.

The step (S1000) of preparing the injection mold including the mold I-shaped mold core 10,

I) preparing a plate-like mold core 10 having a buffer member 15 on one surface thereof (s1100);

Ii) a step (s1200) of mounting the other surface of the mold core 10 on which the buffer member 15 is not mounted, so as to contact a selected one of the moving side template 30 or the fixed side template 40;

Iii) mounting (s1300) the mold cavity (20) to one of the movable side template (30) or the fixed side template (40) facing the template of (ii);

The injection mold through this step is the same as the injection mold described above.

In step (s1100) of preparing the mold core 10 having i) the buffer member 15 on one surface,

The mold core 10 may be a patterned silicon wafer, a quartz substrate, or a glass substrate. The fine patterning of the mold core 10 may be performed by photolithography, electron beam lithography, , And laser lithography, but it is also possible to apply CNC (Computerized Numerical Control) lathe processing.

In the mold closing step (s2000) in which the mold II is moved toward the fixed side mold plate 40 so that the cushioning member 15 of the mold core 10 and the mold cavity 20 are in contact with each other,

The mold cavity 20 has a buffer member 25 on one surface thereof,

The cushioning member 15 of the mold core 10 and the cushioning member 25 of the mold cavity 20 abut each other.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it should be understood that various changes and modifications will be apparent to those skilled in the art. Obviously, the invention is not limited to the embodiments described above. Accordingly, the scope of protection of the present invention should be construed according to the following claims, and all technical ideas which fall within the scope of equivalence by alteration, substitution, substitution, Range. In addition, it should be clarified that some configurations of the drawings are intended to explain the configuration more clearly and are provided in an exaggerated or reduced size than the actual configuration.

10. Plate mold core
15. Buffer member
20. Plate mold cavity
25. Buffer member
30. Movable side template
40. Fixed side template

Claims

A plate-shaped mold core 10;
A buffer member 15 padded on one surface of the plate-shaped mold core 10;
A plate-like mold cavity 20;
A mold plate for mounting the plate-shaped mold core 10;
A template which faces the template for mounting the plate-shaped mold core 10 and attaches the plate-shaped mold cavity 20;
And,
Wherein the plate-like mold core (10) and the plate-like mold cavity (20) are formed by using a silicon wafer.

The method according to claim 1,
Wherein the plate mold cavity (20) has a cushioning member (25) which is padded on one surface.

The method according to claim 1,
The surface of the plate-shaped mold core 10 on which the buffer member 15 is mounted is patterned in a size of 0.001-10,000 um,
Wherein the patterning step is a step of applying a photolithography process, an E-beam lithography process, a laser lithography process, or a CNC (Computerized Numerical Control) Injection mold for the manufacture of.

The method according to claim 1,
Wherein the plate-shaped mold core (10) and the plate-shaped mold cavity (20) are made of a crystalline quartz (SiO ₂ ) substrate or an amorphous glass substrate.

The method according to claim 1,
The outer surface of the cushioning member 15 has the same shape and size as the mold core 10 and has a window shape opened at the center,
Wherein the mold core (10) has a quadrangular shape, and the buffer member (15) has a shape in which four angular sections are chamfered.

The method according to claim 1,
The buffer member 15 may include at least one of copper (Cu), aluminum (Al), and nickel (Ni) as a soft metal,
Or soft polymers such as polyethylene (PE), polypropylene (PP), polystyrene (PS), polyvinyl chloride (PVC), polyphenylene ether (PPE) Polyurethane, and synthetic rubber. The injection mold for manufacturing a polymer substrate according to claim 1,

The method according to claim 1,
Wherein the mold plate for mounting the plate mold 10 is a moving side mold plate 30 and the mold plate for mounting the plate mold cavity 20 is a fixed side mold plate 40. [ Injection mold for.

A method of manufacturing a polymer substrate using an injection mold,
(I1) preparing an injection mold including a plate-like mold core (s1000);
II) a mold closing step (s2000) in which the movable side mold plate 30 moves toward the fixed side mold plate 40 so that the cushioning member 15 of the mold core 10 and the mold cavity 20 are in contact with each other;
III) injecting and cooling the molten polymer resin into the space between the mold core 10 and the mold cavity 20 separated by the buffer member 15 (S3000);
IV) a mold opening step (S4000) in which the movable side mold plate (30) moves toward the direction opposite to the fixed side mold plate (40);
(V5) removing the polymer substrate formed in the space between the mold core (10) and the mold cavity (s5000);
, &Lt; / RTI &
In the injection mold,
The plate-shaped mold core 10;
The cushioning member 15 being padded on one surface of the plate-shaped mold core 10;
The plate mold cavity 20;
A mold plate for mounting the plate-shaped mold core 10;
A template which faces the template for mounting the plate-shaped mold core 10 and attaches the plate-shaped mold cavity 20;
And,
Wherein a silicon wafer (Si afer) is applied to the plate mold (10) and the plate mold cavity (20).

9. The method of claim 8,
(I1000) preparing the injection mold including the plate mold 10,
I) preparing a plate-like mold core 10 having a buffer member 15 on one surface thereof (s1100);
Ii) a step (s1200) of mounting the other surface of the mold core 10 on which the buffer member 15 is not mounted, so as to contact a selected one of the moving side template 30 or the fixed side template 40;
Iii) mounting (s1300) the mold cavity (20) to one of the movable side template (30) or the fixed side template (40) facing the template of (ii);
Wherein the polymeric material is a polymeric material.

9. The method of claim 8,
II) In the mold closing step (s2000) in which the moving side mold plate moves toward the east mold side mold side mold plate 40 and the cushioning member 15 of the mold core 10 and the mold cavity 20 are in contact with each other,
The mold cavity 20 has a buffer member 25 on one surface thereof,
Wherein the cushioning member (15) of the mold core (10) and the cushioning member (25) of the mold cavity (20) are in contact with each other.

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