KR101618362B1 - Film insert molding apparatus applied injection-compression molding and the method thereof - Google Patents

Abstract

The present invention relates to a film insert molding die to which injection compression molding is applied so as to improve the retention of an emboss pattern when performing insert molding on a plastic product using a film on which a three-dimensional emboss pattern is printed, and a method thereof As a result,
The film insert forming mold includes a fixed side mold comprising an upper plate and a core; And a lower plate having a recessed portion into which a core is inserted, wherein a hot runner manifold having a nozzle and a valve gate is formed in the stationary side mold,
It improves appearance characteristics such as soft touch feeling, high gloss and scratch resistance of a plastic product having a three-dimensional emboss pattern.

Description

TECHNICAL FIELD [0001] The present invention relates to a film insert molding apparatus and injection molding method,

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a film insert molding using a film on which a three-dimensional emboss pattern is printed, and more particularly, To a film insert molding apparatus to which injection compression molding is applied and a method thereof.

Recently, the film insert molding method which integrates a plastic product having a three-dimensional curved surface shape with a film by further developing the IMD (In-Mold Decoration) method is attracting attention as a new plastic decoration technique.

Film insert molding is an innovative way to produce 3D decorative parts for a wide range of injection molded plastic products. The film insert molding process can be roughly classified into four steps such as printing, vacuum molding, trimming and injection molding. A printing process is performed to print shapes, characters, patterns, and the like composed of various colors on the surface of the film, and then a three-dimensional curved surface shape corresponding to the skin layer of the product is formed by vacuum molding in which heat and vacuum are applied to the film. Trimming is carried out to cut unnecessary portions of the film, and after the film is inserted into the mold, injection molding is performed to inject the molten resin, thereby molding the plastic product integrated with the film.

Since the film insert molding is performed in a smaller number of processes than conventional decoration methods such as painting, plating and water pressure transfer in the related art, time and cost for manufacturing can be remarkably reduced. In addition, since the film insert molding process does not include a painting factory, it reduces the emission of organic compounds such as VOC. However, in the film insert molding process, various defects such as wrinkles of the film, incomplete joining of the film and the resin, warping and non-uniform shrinkage occur.

Conventional studies on such a film insert molding are as follows.

Leong et al. (Ref. 1) investigated the effect of injection molding conditions on the mechanical and morphological characteristics of a film insert molded disc. The bonding properties between the polypropylene film and the substrate were determined by the barrel temperature, In the case of the US.

Baek et al. (Ref. 2) reported that the flexural deformation of film insert-molded specimens decreases with increasing injection speed, and is not affected by holding pressure holding time.

Kim et al. (Ref. 3) reported that specimens formed by insert molding using a non-heat-treated film underwent bending deformation toward the opposite side of the film. Chen et al. (7) investigated the effect of the film on the temperature field in the injection molding process. The heat transfer delay of the film caused the temperature difference between the mold-resin and the film-resin. And the temperature difference is increased.

Recently, the surface of a plastic product is required to have not only a high-quality appearance such as high gloss and scratch resistance but also a soft touch feeling.

However, the film insert molding has not yet been applied to a print film having a three-dimensional embossed pattern shape. This is because, due to the high cavity pressure generated in the injection molding process, the three-dimensional emboss patterns printed on the film surface are severely pressed and the pattern shape is not maintained properly.

Miura (Ref. 4) has developed a three-dimensional overlay (TOM) method based on a separately manufactured vacuum mold and equipment, which applies compressed air pressure to attach a printed film to the surface of an injection molded product. This method has the advantage of using a low pressure to maintain the three-dimensional pattern shape printed on the film surface and to realize a tactile product surface. However, the injection molding and the work of attaching the film were separated, and there was a problem of applying most of the adhesive.

<References>

References 1: Leong, YW, Yamaguchi, S., Mizoguchi, M., Hamada, H., Ishiaku, US and Tsujii, T., 2004, "The Effect of Molding Conditions on Mechanical and Morphological Properties of the Interface of Film insert injection molded polypropylene-film / polypropylene matrix, "Polym. Eng. Sci., Vol. 44, No. 12, pp. 2327-2334.

REFERENCES 2: Baek, SJ, Kim, SY, Lee, SH, Youn, JR and Lee, SH, 2008, "Effect of Processing Conditions on Film Inserts on Molded Parts," Fiber. Polym., Vol. 9, No. 6, pp. 747-754.

Kim, SW, 2008, "Molded Geometry and Viscoelastic Behavior of Film Insert Molded Parts," Journal of Applied Physics, Vol. J. Appl. Polym., Vol. 111, No. 2, pp. 642-650.

Reference 4: Miura, T., 2009, "The Development and Progress of the Three-Dimensional Overlay Method (TOM)," J. Imaging Soc. Japan, Vol. 48, No. 4, pp. 277-284.

SUMMARY OF THE INVENTION Accordingly, the present invention has been made keeping in mind the above problems occurring in the prior art, and an object of the present invention is to provide a method of manufacturing a three-dimensional emboss pattern, It is an object of the present invention to provide a film insert molding apparatus to which compression molding is applied and a method therefor.

In order to accomplish the above object, the present invention provides a film insert molding apparatus using injection compression molding, which comprises an upper plate and a core, and is formed with a nozzle passing through the upper plate and the core and a valve gate for injecting injection- A fixed side mold in which a spring is formed to enable the compression of the mold and the hot runner manifold; And a lower plate having a cavity in which a core is inserted, the film having a three-dimensional emboss pattern can be inserted into the fixed side or movable side mold, And controls the compression stroke of the movable mold to have a value that minimizes an integration value of the cavity pressure over time.
Wherein a plurality of linear upper cooling channels are formed in the stationary side mold, a pressure sensor and a temperature sensor are mounted along the groove of the mold, and a lower cooling channel having a baffle is formed in the lower plate. Applied film insert molding apparatus.

delete

delete

delete

delete

delete

delete

delete

delete

In order to achieve the above-mentioned object, a film insert molding method using injection compression molding comprises a top plate and a core, in which a plurality of linear upper cooling channels are formed, and a nozzle through the upper plate and the core, A fixed side mold having a manifold formed therein and having a pressure sensor and a temperature sensor mounted along the mold groove; And a movable mold having a lower plate on which a lower cooling channel having a baffle is formed and a cavity on which the core is inserted is formed and a movable mold having a baffle on which a printed pattern is formed, A printing process for printing; A vacuum molding process in which heat and vacuum are applied to the film to form a three-dimensional curved surface shape corresponding to the skin layer; A trimming process for cutting unnecessary portions of the film; And an injection compression molding process for inserting and compressing the molten resin into the mold after inserting the film into the mold, the injection compression molding process comprising the steps of: injecting the resin into the mold by an injection molding process; Resin injection process; And a resin compression step of compressing the partially filled cavity by compressing the movable mold to a value such that a compression stroke minimizes an integral value of the cavity pressure with time.
The resin compression process is characterized in that the compression stroke is in the range of 0.2 to 0.6 mm.

delete

delete

delete

delete

delete

delete

delete

delete

The present invention having the above-described structure allows the molten resin to be injected into the mold cavity at a low injection pressure by setting the thickness of the mold cavity to be slightly larger than the average thickness of the product before the injection step, The thickness of the cavity is reduced to the final product thickness by performing the resin compression while closing the movable mold and the injection compression molding of the present invention can reduce the injection pressure and the residual stress as compared with the injection molding of the prior art , Thereby providing an effect of improving the embossed pattern height of the film insert forming surface.

Accordingly, the present invention provides an effect of improving the three-dimensional feeling and the soft touch feeling of the surface of the plastic product by improving the retention of the embossed pattern during insert molding of the film on which the three-dimensional emboss pattern is printed.

1 is a cross-sectional view of a film insert molding apparatus 10 according to an embodiment of the present invention.
2 is a plan view of the movable-side cavity 220. Fig.
3 is a photograph of the stationary-side mold 100 and the movable-side mold 200. Fig.
Fig. 4 is a view showing the maximum value of the cavity pressure according to the compression stroke and the integral value with time of the cavity pressure. Fig.
5 is a diagram showing the cavity pressure transition at various sensor positions during film insert injection compression molding at a compression speed of 0.25 mm / sec.
Figure 6 shows the surface profile of the embossed pattern measured at the location of each pressure sensor after injection compression molding under various compression strokes;
Figure 7 shows the height of the embossed pattern at various sensor positions as a function of compression stroke;
8 is a graph showing the integration of the cavity pressure over time at various sensor positions as a function of the maximum cavity pressure and the compression rate.
9 is a graph showing the variation of the cavity pressure at various sensor positions during film insert injection compression molding under a compression stroke of 0.8 mm.
FIGS. 10 and 11 are graphs showing changes in the height of the embossed pattern at each pressure sensor position according to the compression speed measured after injection compression molding. FIG.
12 is a graph showing the comparison of the surface profile of the emboss pattern by the injection compression molding of the present invention and the conventional injection molding.
13 is a graph showing the retention of the embossed pattern height by injection molding and injection compression molding.
Fig. 14 is a flowchart showing a processing procedure of a film insert molding method to which the injection compression molding of the present invention is applied. Fig.

Hereinafter, the present invention will be described in more detail with reference to the accompanying drawings showing embodiments of the present invention.

In the following description of the present invention, detailed description of known functions and configurations incorporated herein will be omitted when it may make the subject matter of the present invention rather unclear.

Embodiments in accordance with the concepts of the present invention can make various changes and have various forms, so that specific embodiments are illustrated in the drawings and described in detail in this specification or application. It should be understood, however, that it is not intended to limit the embodiments according to the concepts of the present invention to the particular forms of disclosure, but includes all modifications, equivalents, and alternatives falling within the spirit and scope of the present invention.

It is to be understood that when an element is referred to as being "connected" or "connected" to another element, it may be directly connected or connected to the other element, . On the other hand, when an element is referred to as being "directly connected" or "directly connected" to another element, it should be understood that there are no other elements in between. Other expressions that describe the relationship between components, such as "between" and "between" or "neighboring to" and "directly adjacent to" should be interpreted as well.

The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. The singular expressions include plural expressions unless the context clearly dictates otherwise. In this specification, the terms "comprises &quot;,or" having &quot;, or the like, specify that there is a stated feature, number, step, operation, , Steps, operations, components, parts, or combinations thereof, as a matter of principle.

2 is a plan view of the movable cavity 220 and FIG. 3 is a plan view of the fixed side mold 100 and the movable side mold 200. FIG. .

As shown in FIGS. 1 to 3, the film insert molding apparatus 10 includes a stationary-side mold 100 and a movable-side mold 200.

The stationary-side mold 100 includes a top plate 110 and a core 150. The stationary-side mold 100 includes a nozzle 123 for injecting molten resin into the cavity 220 through the upper plate 110 and the core 150, A hot runner manifold 120 having a valve gate 125 is formed. The valve gate 125 is configured to prevent reverse flow of the resin in the compression step after primary injection of the resin, and finally to extract only the molded product.

The one hot runner manifold 120 is formed in the stationary mold 100, which is a flat mold, in order to consider the back flow effect of the molten resin by the cavity pressure in the compression step. The opening and shielding of the valve gate 125 is controlled by the position of the screw of the injection molding machine. A temperature control system having six channels is applied to maintain a constant melt temperature within the hot runner manifold 120.

The movable mold 200 includes a lower cavity plate 210 and a movable cavity 220 having grooves into which the core 150 is slidably inserted. The fixed-side mold 100 and the movable-side mold 200 are supported so as to be restored by the spring 115. In Fig. 1, CS represents a compression stroke (CS).

In this case, the film insert molding apparatus 10 shown in FIG. 1 has a partially opened structure with a specific compression stroke, and the movable cavity 220 is formed so as not to leak the resin in a partially opened state up to 10 mm for injection .

The fixed side mold 100 and the movable side mold 200 are formed with cooling channels in order to reduce warpage deformation due to uneven temperature distribution of the product during the injection molding cooling step. Specifically, the upper plate 110 is provided with a pair of cooling channels 102 for maintaining a uniform temperature. A lower cooling channel 202 having a plurality of baffles 201 is formed to maintain a uniform temperature of the lower plate 210 and the lower plate 210.

In the embodiment of the present invention, the diameter of the upper cooling channel 102 is 10 mm, and the number of the baffles 201 is 6.

In the fixed-side mold 100, three pressure sensors P1 to P3 and two temperature sensors T1 and T2 are mounted along the mold groove.

The thickness between the cavity 220 and the core 150 is set larger than the average thickness of the product.

The compression stroke of the movable mold 200 is set to a value that minimizes the integral value of the pressure of the cavity 130 with time and has a value within a range of 0.2 to 0.6 mm. Further, the toggle speed of the injection molding machine is variously set according to the compression speed.

The film insert molding apparatus 10 having the above-described structure performs primary injection in a state in which the mold is opened by a certain distance as in a compression stroke (CS) interval, and then the mold can be compressed.

In the film insert molding apparatus 10 having the above-described configuration, as the surface of the core 150 slides, the cavity 220 connected to the lower plate 210 transmits pressure. The return motion is performed by four springs 115 provided on the upper plate 110. [

Experimental Example

A 180-ton electric injection molding machine (e-max180) manufactured by Engel and an ABS resin having a glass transition temperature of 116.2 DEG C were used for the injection molding experiment using the film insert molding apparatus 10 having the above-described configuration.

The applied film for the applied molding is a 0.5 mm thick ABS and PUR thin film. And printed using a UV curable ink to form an embossed pattern on the thin film surface. The screen printing coating used 200meshes / inch of polyester and the embossed pattern was made of 40㎛ high.

The cavity pressure was monitored using PRIAMUS equipment to determine the optimal conditions for the film insert injection molding. Experiments were carried out for the injection compression molding process according to the changes of the compression stroke and the toggle speed and the process conditions to minimize the cavity pressure were derived.

Finally, to measure the embossed height of the molded part, a surface profiler, ET-3000i model manufactured by Kosaka Laboratory of Japan, was used. ABS (LG Chemical HF-380) resin was used for injection molding, and the melt flow index was 35 g / 10 min.

2, the structure of the cavity 220 for the experiment of the present invention is configured to produce a flat plate product having a uniform thickness of 3 mm with a length of 250 mm and lateral lengths of 40 mm and 80 mm, respectively. Three cavity pressure sensors P1 to P3 and two temperature sensors T1 and T2 are mounted on the core 150 at the same height. The positions of the pressure sensors P1 to P3 and the temperature sensors T1 and T2 are as shown in FIG. The position of the valve gate 125 is set to meet the flow balance by CAE analysis. The diameter of the valve gate 125 is 0.3 mm and is connected to a boss having a length of 9.95 mm.

The process during filling the cavity is the same as the injection molding of the prior art. The amount of the molten resin in the cavity before compression is limited to have the same volume as the volume of the product. The wall of the movable mold 200 compresses the molten resin partially injected into the cavity 220 in advance. Injection compression molding experiments are carried out under different pressure conditions, including compression stroke and compression speed, to investigate the effect of compression stroke and compression speed on the height of the embossed pattern.

For changing the compression speed, the toggle speed is set in the injection compression molding machine. The actual compression rate is obtained using the mold compression time measured during the injection compression molding experiment with a compression stroke and a constant tokle speed. At this time, the mold compression speed increases as the compression stroke increases under a constant tokle speed.

Cavity pressures under various compression strokes and toggle speeds are recorded by a PC based data acquisition system with a charge amplifier and an A / D converter.

Molding conditions applied to the experiment were a melting temperature of 220 占 폚, a fixed side mold 100 and a movable side mold 200 temperature of 67 占 폚 and 62 占 폚, respectively, and an injection speed of 30 mm / sec.

During injection compression molding of various compression strokes under a constant compression rate of 0.25 mm / sec, the cavity pressure was measured at the position of the pressure sensor of FIG.

FIG. 4 shows the maximum value of the cavity pressure according to the compression stroke and the integral value with time of the cavity pressure.

As the compression stroke increases, the maximum cavity pressure decreases. When the compression stroke exceeds 0.8 mm, the maximum cavity pressure increases again. This is the result of two opposing factors. That is, as the compression stroke increases, the heat transfer to the molten resin during filling decreases with the cavity gap that thickens as the opening of the mold increases. The decrease in the temperature drop appears as a relatively low pressure. Alternatively, as the compression length increases, the retention of the mold increases to compress more polymer melt, thereby increasing the cavity pressure. Accordingly, the cavity pressure has a minimum value at a compression stroke of 0.8 mm.

Also, the integrated value of the cavity pressure over time represents the minimum at a compression stroke between 0.2 and 0.5 mm. Therefore, the integral value of the cavity pressure is set to a value between 0.2 and 0.6 mm.

Figure 5 is a plot of cavity pressure variation at various sensor locations during film insert injection compression molding at a compression rate of 0.25 mm / sec.

In Fig. 5 (a), the compression stroke is 0.5 mm, and the graph (b) is 0.8 mm in compression stroke.

As described above, the maximum value in the case of the compression stroke of 0.8 mm is smaller than the maximum value in the case of the compression stroke of 0.5 mm. However, in the case of a compression stroke of 0.8 mm, since the pressure lasts for a long time, the integrated value of the cavity pressure during the whole time becomes larger as compared with the case where the compression stroke is 0.5 mm.

 After cutting the molded plate at each pressure sensor position after the molding process, the surface profile of the embossed pattern at each pressure sensor position was measured.

Figure 6 shows the surface profile of the embossed pattern measured at the location of each pressure sensor after injection compression molding under various compression strokes. Specifically, in FIG. 6 (a), the graph shows the position of the pressure sensor P1, the graph (b) shows the position of the pressure sensor P2, and the graph (c) shows the surface profile of each emboss pattern measured at the position of the pressure sensor P3.

As shown in Fig. 6, the height of the embossed pattern at all measurement positions showed a maximum value in the compression stroke range of 0.2 to 0.6 mm, and decreased as the compression stroke was increased. As shown in FIG. 4, the optimum compression stroke for obtaining the embossed pattern is almost the same as the minimum integral value of the cavity pressure. This indicates that the main factor affecting the embossed pattern height is the integral value of the cavity pressure over time, not the maximum cavity pressure.

Figure 7 shows the height of the embossed pattern at various sensor positions as a function of compression stroke.

7, the height of the emboss pattern at the pressure sensor P1 at the compression stroke of 0.8 mm is smaller than the height of the emboss pattern at the other pressure sensor positions. However, when the compression stroke becomes larger than 0.8 mm, The height of the embossed pattern at the position of the pressure sensor P1 was the largest. This is in contrast to the fact that in the conventional injection molding, the height of the emboss pattern at the position adjacent to the valve gate is smaller than the height of the emboss pattern at a position farther from the valve gate.

Typically, in the conventional injection molding, the cavity pressure decreased with distance from the valve gate, but as shown in the graph of FIG. 5 (b), injection compression molding exhibited different characteristics when the compression stroke was 0.8 mm or more . That is, the pressure of the cavity 220 at the position of the P3 pressure sensor remote from the valve gate became larger than that near the valve gate at the P1 pressure sensor position due to molding compression after injection of the molten resin. This may be due to the fact that the molten resin reaches the upper side of the P3 pressure sensor is faster than it reaches the opposite side by the compressive force for the higher compression stroke.

For comparison of the effect of the compression speed of the embossed pattern height, the cavity pressure was measured during injection compression molding at various compression speeds with a constant compression stroke of 0.8 mm.

8 is a graph showing the integration of the cavity pressure over time at various sensor positions as a function of the maximum cavity pressure and the compression rate.

As shown in Fig. 8, the pressure increases as the compression rate increases. It also shows an increase in the compression speed as the pressure difference between the sensor positions increases. This is because the normal force increases during the approach of the mold under a high compression rate.

Figure 9 is a graph showing the cavity pressure trend at various sensor positions during film insert injection compression molding under a compression stroke of 0.8 mm.

9, the compression rates of the graphs (a) and (b) are 0.13 mm / sec and 0.8 mm / sec, respectively.

The right axis in FIG. 8 represents the integration of the cavity pressure with time. The integral value increased with increasing compression speed, but did not increase by the maximum cavity pressure. In addition, when the compression speed is increased, the cavity pressure is increased, but the pressure is rapidly lowered as the compression time is shortened as shown in FIG. This indicates that the effect of the compression speed on the integral value of the cavity pressure is very small.

FIGS. 10 and 11 are graphs showing changes in the height of the embossed pattern at each pressure sensor position according to the compression speed measured after injection compression molding.

Although the optimal compression speed for maximizing the height of the embossed pattern is slightly different depending on the measurement position, the overall optimum value has a range of 0.09 to 0.25 mm / s. The fast compression rate appears to reduce the emboss pattern, but is less than the effect of the pressure compression stroke, as described above. That is, the compression speed does not significantly affect the height of the embossed pattern. This is because the influence of the compression speed on the integrated value of the cavity pressure over time is small as in the description of FIG.

Based on the above-described experimental results, the results of the injection compression molding of the present invention and the injection molding of the prior art are compared as follows.

In order to maximize the height of the embossed pattern, the optimum process conditions in the injection compression molding were a compression stroke of 0.5 mm and a compression speed of 0.25 mm / sec.

A conventional injection molding product is compared with a molded product produced by the injection compression molding of the present invention to which the optimum process conditions are applied.

In the conventional injection molding process conditions, the melting temperature was 220 占 폚, the temperatures of the fixed side mold and the movable side mold were 67 占 폚 and 62 占 폚, the injection speed was 30 mm / sec, the holding pressure was 45 MPa, mm.

12 is a graph showing the comparison of the surface profiles of the emboss pattern by the injection compression molding of the present invention and the conventional injection molding.

As shown in Fig. 12, the height of the emboss pattern of the injection compression molding at all the measurement positions was larger than the height of the emboss pattern of the conventional injection molding.

The maintenance rate of the height of the embossed pattern is defined as a percentage of the root mean square (RMS) of the initial input height. The RMS is calculated using the peak values of the surface profile of the embossed pattern measured after molding.

13 is a graph showing the retention ratios of the embossed patterns by injection molding and injection compression molding.

The average value of the embossed pattern height retention ratio of the conventional injection molding is 45.4%, while it is 68.5% in the case of the injection compression molding of the present invention. As expected, the retention of the emboss pattern increased as the distance from the gate increased as the cavity pressure distribution decreased as the distance from the gate increased in the conventional injection molding. However, injection compression molding was uniform over the entire area. Particularly, the maintenance rate of the emboss pattern is remarkably improved by the addition of the compression process after the partial melting and filling of the cavity.

As in the experiment, the average emboss pattern retention ratio of the present invention was 45.4% in the case of the conventional injection molding, but 68.5% in the case of the injection compression molding, and the emboss pattern retention ratio was improved. In addition, in the case of the film insert molding method using the injection compression molding of the present invention, the height of the embossed pattern according to the position was maintained more uniform as compared with the conventional injection molding. As a result, the film insert molding method of the present invention, to which injection compression molding is applied, improves appearance characteristics such as soft touch feeling, high gloss and scratch resistance of a plastic product having a three-dimensional emboss pattern.

Fig. 14 is a flowchart showing a processing procedure of the film insert molding method to which the injection compression molding of the present invention is applied.

As shown in FIG. 14, the above-described film insert molding method includes a printing process S10, a vacuum forming process S20, a trimming process S30, and an injection compression molding process S40.

The printing process S10 prints an emboss pattern on the film surface.

In the vacuum forming process (S20), heat and vacuum are applied to the film to form a three-dimensional curved surface shape corresponding to the skin layer.

The trimming process (S30) is a process of cutting unnecessary portions of the film.

The injection compression molding process S40 is a process of inserting a film into a mold, injecting the molten resin into the mold, and performing compression.

Here, the injection compression molding step S40 includes a resin injection step S41 for injecting the resin into the mold by an injection molding process, a resin compression process for performing resin compression while closing the partially filled cavity, (S43).

The resin compression process (S43) is set so that the compression stroke is a value that minimizes the integral value with time of the cavity pressure within a range of 0.2 to 0.6 mm.

10: Film insert molding apparatus 100: Fixed side mold
102. 202: cooling channel 110: upper plate
115: spring 120: hot runner manifold
123: nozzle 125: valve gate
150: Core 220: Cavity (movable side cavity)
200: movable mold 210: lower plate

Claims (8)

A hot runner manifold formed of a valve gate and a nozzle penetrating through the upper plate and the core for injecting the injection compression molded resin, and a fixed side mold having a spring formed therein for mold compression; And
And a movable plate provided with a lower plate having a cavity in which a concave groove into which the core is inserted is formed,
Wherein a mold having a three-dimensional embossed pattern can be inserted into the fixed side or movable side mold, the mold is injected in an open state, and a compression stroke of the movable side mold is set to a minimum value And the injection molding is performed so as to have a value that is equal to or larger than a predetermined value.
The method according to claim 1,
A plurality of linear upper cooling channels are formed in the stationary side mold, a pressure sensor and a temperature sensor are mounted along the groove,
And a lower cooling channel having a baffle is formed on the lower plate.
delete delete delete A hot runner manifold is formed in which a nozzle passing through the upper plate and the core and a valve gate are formed, and a pressure sensor and a temperature sensor are mounted along the mold groove Fixed side mold; And a movable plate having a lower plate on which a lower cooling channel having a baffle is formed and a cavity on which the core is inserted is formed,
A printing process of printing a printing pattern on the film surface; A vacuum molding process in which heat and vacuum are applied to the film to form a three-dimensional curved surface shape corresponding to the skin layer; A trimming process for cutting unnecessary portions of the film; And an injection compression molding step of inserting the film into the mold and then injecting and compressing the molten resin into the mold,
In the injection compression molding process,
A resin injection process for injecting resin into a mold by an injection molding process; And
And a resin compression step of compressing the partially filled cavity by compressing the movable mold to a value at which the compression stroke minimizes the integral value of the cavity pressure over time, The method comprising: delete delete

Images