KR101599674B1 - Device and method for plugging holes - Google Patents

Abstract

The present invention relates to a hole plugging apparatus and a hole plugging method, and more particularly, to a hole plugging apparatus including a work basket for supplying ink for hole plugging; And a magnetic field applying unit located above and below the hole plugging unit and applying a magnetic field to the hole plugging unit; And a hole plugging method using the same. The present invention can provide a hole plugging apparatus and a hole plugging method that can easily remove bubbles during a hole plugging process and improve the reliability of a product.

Description

TECHNICAL FIELD [0001] The present invention relates to a hole plugging apparatus and a hole plugging method.

The present invention relates to a hole plugging apparatus and a hole plugging method using the same.

Due to the development of electronic technology, printed circuit boards (PCBs) have also become denser, making the boards more buildable and thicker and thinner. As a result, the size and thickness of the printed circuit board are reduced, while the number of through-via holes or via hole portions (hereinafter referred to as " hole portions " .

The through hole is a hole formed for electrical connection between the layers, and is formed on the substrate during the manufacturing process of the printed circuit board. Plated through-holes in the inner walls of the through holes are referred to as through-hole vias.

Also, the inside of the plated through hole may be filled with an insulating material, or the resist ink may be printed over the hole several times to block the through hole. A hole filling method is a method of filling a hole with a filler material, and printing is performed several times so that a hole copper foil is not exposed with a resist ink. This is called a tenting method.

Since the ink used in the hole plugging method has a certain viscosity, a void is generated when the ink is filled into the hole. Voids in the filler material must be removed to reduce the reliability of the printed circuit board and cause defects. The reliability of the ink applied to the substrate is a very important factor that determines the quality of the package substrate. When the inside of the hole is not completely filled with ink and bubbles are generated, the bubbles in the inside of the hole expand due to heat, and the copper foil inside the hole is exposed. In addition, when the conventional screen printing method is used in the hole plugging method, it is possible to generate a void or a crack in case of not printing one time, which may affect the reliability of the printed circuit board.

SUMMARY OF THE INVENTION The present invention has been made in order to solve the above-mentioned problems, and it is an object of the present invention to provide an ink jet printer which can prevent ink from being filled in a hole by using an electromagnetic force during hole- And a hole plugging method using the same.

According to one aspect of the present invention,

A hole plugging portion including a working basket for supplying ink for hole plugging; And a magnetic field applying unit located above and below the hole plugging unit and applying a magnetic field to the hole plugging unit; To the hole plugging device.

According to an embodiment of the present invention, the magnetic field application unit may include a permanent magnet, a solenoid, or a magnetic field generator including the two.

According to an embodiment of the present invention, the magnetic field application unit may apply a magnetic field of 0.1 T to 10 T intensity.

According to an embodiment of the present invention, a substrate transfer device that can be moved up and down in the work basket may be included.

According to one embodiment of the present invention, the hole plugging ink flows along the direction of the applied magnetic field, and the hole plugging ink may include an epoxy resin and an inorganic additive.

According to one embodiment of the present invention, the epoxy resin includes an epoxy resin containing a mesogen group, and the inorganic additive may include a magnetic filler.

According to one embodiment of the present invention, the epoxy resin includes an epoxy resin having two or more epoxy groups in one molecule; Alicyclic epoxy resins; Or both.

According to one embodiment of the present invention, the magnetic filler may include at least one selected from the group consisting of nickel, iron, iron oxide, cobalt, ferrite and rare earth metals.

According to an embodiment of the present invention, the ferrite is at least one selected from the group consisting of Co, Ni, Mg, Zn, Ni, Mn, Ti, Zr, Ge, Be, Li, Wherein the rare earth metal includes at least one selected from the group consisting of La, Ce, Pr, Nd, Pm, Sm, Eu, Gd, Tb, Dy, Ho, Er, Tm, Yb and Lu. can do.

According to another aspect of the present invention,

Preparing a substrate on which a hole is formed; Forming a mask layer on the upper and lower surfaces of the substrate; Attaching the substrate on which the mask layer is formed to a substrate transfer apparatus; Filling ink in the working basket; Transferring the attached substrate to fill the ink into the hole; Removing bubbles from the filled ink; And curing the filled ink; Wherein the filling step comprises applying a magnetic field in a first direction in the magnetic field generator to flow the ink into the hole.

According to an embodiment of the present invention, removing the bubbles from the filled ink may be carried out by transferring the attached substrate and taking it out of the ink filled in the working basket.

According to an embodiment of the present invention, the step of removing bubbles from the filled ink may include the steps of alternately moving the magnetic field in the first direction, the second direction opposite to the first direction, And the filled ink can flow along the direction of the magnetic field.

According to one embodiment of the present invention, the curing step may be performed at a temperature of 80 占 폚 or more for a time of 30 minutes or more.

According to an embodiment of the present invention, the substrate may be a printed circuit board.

According to one embodiment of the present invention, prior to the step of curing the filled ink, filling the ink into the hole; And removing the bubbles from the filled ink may be repeated several times.

The present invention not only fills in holes for hole plugging in holes using electromagnetic force but also removes voids or cracks from filled ink, thereby improving the ability to cope with high viscosity inks during the hole plugging process, Thereby extending the lifetime of the electronic product and improving the performance.

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1A is a cross-sectional view of a hall plugging apparatus according to an embodiment of the present invention.
Figure 1B illustrates an exemplary arrangement of an epoxy resin and an inorganic filler by an external magnetic field, in accordance with one embodiment of the present invention.
Figure 1C illustrates, by way of example, a cross-sectional view of a printed circuit board, in accordance with one embodiment of the present invention.
2 illustrates an exemplary process flow diagram of a method of hole plugging according to the present invention, in accordance with an embodiment of the present invention.
3 is a cross-sectional view illustrating a hole plugging method using the hole plugging apparatus according to an embodiment of the present invention.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. In the following description of the present invention, detailed description of known functions and configurations incorporated herein will be omitted when it may make the subject matter of the present invention rather unclear. Also, terminologies used herein are terms used to properly represent preferred embodiments of the present invention, which may vary depending on the user, intent of the operator, or custom in the field to which the present invention belongs. Therefore, the definitions of these terms should be based on the contents throughout this specification. Like reference symbols in the drawings denote like elements.

The present invention relates to a hole plugging apparatus, which can improve the reliability of a product by filling holes with electromagnetic force and removing voids in the holes.

The hole plugging apparatus will be described in detail with reference to FIG. 1A. 1A is a cross-sectional view illustrating a Hall plugging apparatus according to an embodiment of the present invention. Referring to FIG. 1A, the apparatus includes a Hall plugging unit 10 and a magnetic field applying unit 20).

The hole plugging portion 10 is for plugging the ink composition in the hole, and according to an embodiment of the present invention, referring to FIG. 1A, the hole plugging portion 10 includes a working basket 11, (12) and a monitoring sensor (13).

The work basket (11) is a dispenser for supplying ink for hole plugging, and may be a work space in which the ink filling process is performed by bringing the substrate for hole plugging into contact with the ink for hole plugging. The hole plugging ink flows along the direction of the applied magnetic field, and may include an epoxy resin and an inorganic filler.

The epoxy resin can control the adhesive force between the copper foil and the ink during the hole plugging operation, the polishing force at the time of curing, the flow rate in the hole, and provide excellent thermal conductivity.

The epoxy resin may be contained in an amount of 5 to 50 parts by weight, preferably 10 to 30 parts by weight, based on 100 parts by weight of the hole plugging ink of the present invention. If the content of the epoxy resin is less than 5 parts by weight, the printing property required in the hole plugging operation of the thin film printed circuit board may be lowered or it may be difficult to obtain a low thermal expansion coefficient. If the content is more than 50 parts by weight, Which is not preferable.

The epoxy resin may include an epoxy resin containing a mesogen group. 1B illustrates an exemplary arrangement of an epoxy resin and an inorganic filler by an external magnetic field according to an embodiment of the present invention. Referring to FIG. 1B, The major axis of the mesogenic period can be arranged in the resin depending on the application direction of the magnetic field when the external magnetic field is applied. When the orientation direction of the mesogens is aligned with the heat transfer direction, a structure that does not disturb the heat transfer of the phonons is formed, and heat transfer by the phonons is performed well, so that the thermal conductivity and heat resistance of the ink for hole plugging are improved .

The epoxy resin containing the mesogen group is a crystalline epoxy resin and is an epoxy resin containing a rigid structure such as biphenyl, phenylbenzoate, naphthalene, etc. For example, the epoxy resin containing 4, 4'-biphenol ether diglycidyl ether.

[Chemical Formula 1]

The epoxy resin may further include a liquid epoxy resin, preferably an epoxy resin having two or more epoxy groups in one molecule; Alicyclic epoxy resins; Or a mixture of the two.

The above-mentioned epoxy resin having two or more epoxy groups in the molecule and the alicyclic epoxy resin have a mixing ratio of 1: 0 to less than 1: 1 (w / w), preferably 1: 0.01 to 1: 0.8, May be included at a mixing ratio of 1: 0.01 to 1: 0.5 (w / w), more preferably 1: 0.2 to 1: 0.4 (w / w). If included in the mixing ratio, an appropriate thermal expansion coefficient can be provided.

The above-mentioned epoxy resin having two or more epoxy groups in the molecule is preferably selected from the group consisting of a bisphenol A type epoxy resin having two epoxy groups in one molecule, a bisphenol F type epoxy resin, a phenol type novolak epoxy resin and a novolak epoxy resin Or more.

For example, the bisphenol A may be a compound represented by the following formula (2).

(2)

The phenolic novolak epoxy resin may be a compound represented by the general formula (3).

(3)

(Wherein n is 0 to 30).

The novolak epoxy resin may be a compound represented by the general formula (4).

[Chemical Formula 4]

(Wherein n is 0 to 30).

Wherein the alicyclic epoxy resin is at least one selected from the group consisting of diepoxide epoxy resins of cycloaliphatic esters of dicarboxylic acids, vinylcyclohexene dioxide epoxy resins, diglycidyl ether or polyglycidyl ether epoxy resins of alicyclic polyols, 3-epoxycyclopentyl) ether epoxy resin, and preferably has a high glass transition temperature and a high viscosity. In order to increase the content of the filler, bis (2,3-epoxy Cyclopentyl) ether epoxy resin.

The inorganic filler can alleviate stress caused by curing shrinkage of the hole plugging ink, or can control the linear expansion coefficient and improve the heat releasing ability. The inorganic filler may be contained in an amount of 50 to 80 parts by weight, and preferably 60 to 70 parts by weight based on 100 parts by weight of the ink for hole plugging. If the content of the inorganic filler is less than 30 parts by weight, thermal expansion of the cured product may be excessively increased or it may be difficult to obtain sufficient abrasiveness and adhesion after curing of the ink composition. If the content of the inorganic filler is 80 parts by weight or more, Anger can be difficult.

The inorganic filler may include a magnetic filler including magnetic particles that react with the magnetic field to improve the thermal conductivity. The magnetic filler can improve the heat conduction path in the resin by arranging the inorganic filler particles in a predetermined direction in response to the magnetic field. Referring to FIG. 1B, since the magnetic particles in the resin are magnetized in a predetermined direction by the external magnetic field, the direction of magnetic flux of the external magnetic field is arranged, so that the heat transfer ability can be increased by aligning the direction of the particles and the heat transfer direction.

The magnetic filler may include at least one selected from the group consisting of nickel, iron, iron oxide, cobalt, ferrite, and rare earth metals, and may preferably be nickel and iron oxide capable of providing excellent magnetic properties.

Examples of the ferrite may include an oxide of Fe and at least one selected from the group consisting of Co, Ni, Mg, Zn, Mn, Ti, Zr, Ge, Be, Li, La and Cu. The rare earth metal may include at least one selected from the group consisting of La, Ce, Pr, Nd, Pm, Sm, Eu, Gd, Tb, Dy, Ho, Er, Tm, Yb, .

The inorganic filler may further include a nonmetallic filler, a thermally conductive filler, or both.

The nonmetallic filler may include at least one selected from the group consisting of silica, barium sulfate, calcium carbonate, magnesium oxide, aluminum hydroxide, magnesium hydroxide, titanium oxide, mica, talc and organic bentonite, It may be aluminum nitride and alumina which have excellent thermal conductivity for improving emission ability and excellent filling property in epoxy resin.

The thermally conductive filler may include at least one member selected from the group consisting of boron nitride, aluminum nitride, silicon nitride, alumina, and a carbon material, preferably silica and / or calcium carbonate having excellent low hygroscopicity and low volume expansion .

The non-metallic filler, the thermally conductive filler or both; And the magnetic filler may be contained in a mixing ratio of 1: 0 to less than 1: 1 (w / w), preferably 1: 0.01 to 0.8, more preferably 1: 0.04 to 0.7. When the mixing ratio is within the above range, thermal conductivity and heat resistance can be improved.

The inorganic filler may be surface-treated with at least one coating agent selected from the group consisting of saturated fatty acid, unsaturated fatty acid and aminosilane in order to increase the dispersibility in the epoxy resin and to facilitate defoaming.

Examples of the aminosilane are silane compounds having an amino functional group, for example, 3-aminopropyltrimethoxysilane, 3-aminopropyltriethoxysilane, N-2-aminoethyl- Amino-3,3-dimethylbutyltrimethoxysilane, 4-amino-3,3-dimethylbutyldimethoxymethylsilane, N-methyl- Silane, aminoisopropoxyethyltrimethoxysilane, aminoisopropoxypropyltrimethoxysilane, 4-amino-3,3-dimethylbutyltriethoxysilane, 4-amino-3,3-dimethylbutyldiethoxymethyl Silane, N-methyl-4-amino-3,3-dimethylbutyltriethoxysilane, and aminoisopropoxyethyltriethoxysilane.

As examples of the saturated fatty acid, a straight chain or branched saturated fatty acid having 8 to 22 carbon atoms, and examples of the unsaturated fatty acid may be a straight chain or branched unsaturated fatty acid having 6 to 30 carbon atoms.

The surface treatment may use 30 to 50 parts by weight of a coating agent based on 100 parts by weight of the inorganic filler. The surface treatment conditions may be appropriately selected according to the kind of the inorganic filler. For example, And the coating agent may be mixed to perform surface treatment, but the present invention is not limited thereto.

The inorganic filler may have an average particle diameter of 1 탆 to 10 탆, preferably 1 탆 to 5 탆. If the average particle diameter of the inorganic filler is less than 1 탆, the large specific surface area of the inorganic filler causes a large agglomeration action between the fillers, which may make it difficult to disperse in the epoxy resin or improve the filling amount of the filler. , Not only the filling property of the printed wiring board into the via hole is deteriorated but also the smoothness is deteriorated when the conductor layer is formed in the hole-buried portion, which is not preferable.

The ink for hole plugging according to the present invention may further comprise an epoxy curing agent, a solvent and an additive.

The epoxy curing agent is used for curing the epoxy resin. The epoxy curing agent may be included in an amount of 5 to 50 parts by weight, preferably 10 to 40 parts by weight, based on 100 parts by weight of the hole plugging ink, If the content is less than 5 parts by weight, the curing is not carried out. If the amount is more than 50 parts by weight, the curing agent which is not crosslinked may remain excessively to deteriorate the physical properties.

The epoxy curing agent may include at least one selected from the group consisting of an acid anhydride curing agent, an imidazole curing agent, and an amine curing agent, and may preferably be an acid anhydride and an amine curing agent. More preferably, the epoxy curing agent may comprise a mixture of two or more curing agents to control the curing rate with temperature and to obtain a high glass transition temperature.

As examples of the acid anhydride-based curing agent, there may be mentioned a phthalic anhydride, a maleic anhydride, a trimellitic anhydride, a pyromellitic anhydride, a hexahydrophthalic anhydride, a tetrahydrophthalic anhydride, a methylnadic anhydride, (Methylene) hexahydrophthalic anhydride, methyltetrahydrophthalic anhydride and 5- (2,5-dioxotetrahydro) -3-methyl-3-cyclohexene-1,2-dicarboxylic anhydride. And the like.

Examples of the imidazole-based curing agent include 1-methylimidazole, 2-methylimidazole, 2-ethyl-4-methylimidazole, 2-isopropylimidazole, 2-undecylimidazole, Phenyl-imidazole, 2-phenyl-4-methylimidazole, and the like.

Examples of the amine curing agent include diethylenetriamine, triethylenetetramine, diethylaminopropylamine, mentantiamine, N-aminoethylpiperazine, meta-xylenediamine, 4,4-diaminodiphenylsulfone, di Phenyldiaminomethane, isophoronediamine, and the like.

The ink for hole plugging may further contain a residual amount of solvent, and the content of the solvent may be appropriately adjusted in order to lower the occurrence of bubbles due to the evaporation of the solvent during the viscosity control and curing of the ink for hole plugging.

The solvent may be any solvent that can minimize the influence of adhesiveness of the ink for hole plugging, glass transition temperature, and the like, without limitation, and examples thereof include methyl ethyl ketone, cyclohexanone, toluene, xylene, Propylene glycol monomethyl ether, dipropylene glycol monoethyl ether, triethylene glycol monoethyl ether, ethylene glycol, propylene glycol, octane, ethylene glycol, propylene glycol monomethyl ether, , And decane may be included.

The ink for hole plugging may further include an appropriate additive in accordance with the application field of the ink. For example, a coloring agent, a viscosity adjusting agent, a thixotropic agent, a defoaming agent (polydimethylsiloxane, modified silicone, fluorine, A filler, a stabilizer, an antioxidant, a fluorescent material, etc., and the content of the additive is not particularly limited as long as the content of the additive is the object of the present invention The present invention is not particularly limited thereto.

According to one embodiment of the present invention, the ink for hole plugging according to the present invention may have a coefficient of thermal expansion (ppm / DEG C) of less than 70, one direction at a temperature lower than Tg, more preferably less than 50 ppm /

The ink for hole plugging may have a viscosity of 200 to 200,000 Ps (25 ° C, 5 rpm, 30 seconds, rotary viscometer), preferably 700 to 150,000 Ps. If the viscosity is less than 200 ps, shape retention becomes difficult and flow-down may occur. If the viscosity exceeds 200,000 Ps, the filling property in the hole may be deteriorated.

The ink for hole plugging may have a glass transition temperature of 120 캜 or higher, preferably 130 캜 or higher, and more preferably 135 캜 or higher.

The substrate transfer device 12 is located within the working basket 11 and can attach and fix the substrate 30 for hole plugging and move the substrate 30 up and down during the hole plugging operation. The configuration of the substrate transfer device 12 can be applied without limitation as long as it is an apparatus capable of moving the substrate, and the present application is not specifically referred to.

 The substrate 30 may be any substrate to which the hole plugging process is applied, and may be a substrate to be applied to a printed circuit board. In accordance with one embodiment of the present invention, FIG. 1C illustrates a cross-sectional view of a printed circuit board, in accordance with an embodiment of the present invention, with reference to FIG. 1C, And a plating layer 33 is formed on the copper foil laminated film 32. The copper foil laminated film 32 is formed on at least a part of the base 31 with a hole H formed thereon. The printed circuit board may be a single layer or a multilayer printed circuit board in which a plurality of substrates are laminated. The hole H may be modified in shape, construction, manufacturing method, and the like depending on the application field of the printed circuit board. For example, a laser via hole (LVH), buried via hole (BVH) Plated Through Hole (PTH), or the like.

The sensing sensor 13 is located within the work basket 11 and can sense the height of the ink, the position of the substrate, and the like, and adjust the movement range of the substrate by the substrate transfer device 12. [

The magnetic field application unit 20 applies a magnetic field to the hole plugging ink during the hole plugging operation. According to the embodiment of the present invention, the magnetic field application unit 20 applies a magnetic field to the inside, For example, be located at the top, bottom or both of the work baskets 11. According to an embodiment of the present invention, a magnetic field applying unit 20a and a magnetic field applying unit 20b may be installed on upper and lower portions of the work basket 11 to improve the thermal conductivity of the hole plugging ink.

The magnetic field applying section 20 includes a magnetic field generating device for generating a magnetic field, and the device may include a permanent magnet, a solenoid, or both. According to an embodiment of the present invention, a coil for generating a magnetic field by applying a current may be included, and may include a single or plural solenoids 21.

The magnetic field application unit 20 can apply magnetic fields in various directions to the hole plugging ink in the working basket 11 and can apply a magnetic field in various directions to the hole plugging ink in the work basket 11, The intensity, direction, etc. of the magnetic field can be adjusted.

The magnetic field application unit 20 can apply a magnetic field of 0.1 T or more, preferably 0.1 T or more, and preferably a magnetic field of 0.1 T to 10 T or more.

The present invention relates to a hole plugging method, and the hole plugging method will be described in detail with reference to Fig. 2 and Fig.

 FIG. 2 illustrates a process flow diagram of a method of hole plugging according to an embodiment of the present invention, in accordance with an embodiment of the present invention. Referring to FIG. 2, A step S1 of preparing, a step S2 of forming a mask layer, a step S3 of attaching the substrate to the substrate transfer device; Filling the ink (S4); Filling the ink into the hole (S5); Removing the bubbles (S6); And curing the ink (S7); . ≪ / RTI >

According to an embodiment of the present invention, the hole plugging method of the present invention can be practiced using the hole plugging apparatus according to the present invention, and FIG. 3 is a perspective view of a hole plugging apparatus according to an embodiment of the present invention, FIG. 3 is a cross-sectional view of a Hall plugging method using the apparatus. In FIG. 3, the substrate 30 is a sectional view showing a portion where a hole H is formed, and the other components are not shown.

Referring to FIG. 3, a step S1 of preparing a substrate having a hole is a step of preparing a substrate 30 on which a hole H is formed, and the substrate 30 is as described above.

Step S2 of forming a mask layer is a step of forming a mask layer on the substrate 30. [ May be formed on top, bottom, or both of the substrates, and mask layers 40 and 40 'may be formed on top and bottom of the substrate, according to one embodiment of the present invention. The mask layer is for protecting the surface of the substrate except the hole H from the ink while filling the ink into the hole H. The mask layer protects the surface of the substrate except for the hole H while forming a through hole corresponding to the hole H, 30). The mask layer may be a thin film, plate, film, sheet, woven fabric or the like made of natural or synthetic fiber, ceramic, metal, polymer or the like and may be, for example, a silk screen, The mask layer may have a thickness of 0.3 mm to 4 mm, preferably 0.3 mm to 2 mm.

The step S3 of attaching the substrate to the substrate transfer apparatus is a step of attaching the substrate 30 on which the mask layer is formed to the substrate transfer apparatus 12 of the hole plugging apparatus.

The step S4 of filling the ink is a step of filling the ink 50 for hole plugging in the working basket 11. [ The ink 50 for hole plugging is as mentioned above.

 The step S5 of filling the ink into the hole moves the substrate 30 attached to the substrate transfer device 12 downward so as to come into contact with the ink 50 for hole plugging, (50). According to one embodiment of the present invention, step S5 may fill the ink 50 by applying a magnetic field to the ink 50 for hole plugging by flowing it into the hole H. The magnetic field application unit 20a is operated in step S5 and an external magnetic field is applied in the first direction, for example, in the upper direction of the hole H to flow the ink 50 into the hole H, H). ≪ / RTI >

The step S5 can adjust the time and temperature according to the depth of the hole, the type of the substrate, the viscosity of the ink, etc., and is preferably 20 to 60 DEG C, more preferably 20 to 40 DEG C for 0.5 to 20 minutes , Preferably from 1 minute to 5 minutes.

The magnetic field applied in step S5 may be applied at 0.1 T or more, preferably 0.1 T to 10 T, more preferably 4 T to 7 T,

According to one embodiment of the present invention, the filling step S5 of the ink may be repeated several times, for example, 1-50 times, preferably 2-30 times, more preferably 3-10 times Can be.

The step of removing bubbles (S6) is a step of removing bubbles in the holes and the filled ink 50 'in step S5. According to one embodiment of the present invention, in step S6, after the substrate 30 is lifted up and taken out from the ink 50 filled in the working basket 11, a magnetic field is applied to the ink 50 ' It is possible to remove the air bubbles in the holes and in the ink 50 '. For example, air bubbles can be removed in voids or filled voids caused by burrs or smears occurring in the inner copper plated portion of the holes.

 Referring to FIG. 3, in step S6, the magnetic field application unit 20b is operated and the magnetic field is applied in a second direction that is different from the first direction, for example, the lower direction of the hole H Bubbles can be removed. In particular, the first direction and the second direction may be perpendicular to each other.

According to an embodiment of the present invention, the direction of the magnetic field may be randomly changed in step S6, or the direction of the magnetic field may be repeatedly changed in a predetermined pattern according to a predetermined time and / or order. For example, a magnetic field can alternately be applied in a first direction, a second direction opposite to the first direction, or both directions.

Since the magnetic field is applied in the second direction, which is different from the direction of the magnetic field applied in step S5, or the magnetic field is changed in various directions in step S6, the vertical movement of the composition in the hole (H) It is possible to remove voids or cracks in the bubbles and the ink inside the holes H, thereby preventing lowering of the thermal conductivity and improving the reliability of the product.

Step S6 may remove bubbles for 10 minutes or less, preferably 0.5 to 5 minutes, more preferably 0.5 to 3 minutes. The magnetic field applied in step S6 may be applied at 0.1 T or more, preferably 0.1 T to 10 T, more preferably 4 T to 7 T,

According to one embodiment of the present invention, the step of removing bubbles (S6) may be repeated several times, for example, 1-50 times, preferably 2-30 times, more preferably 3-10 times .

According to an embodiment of the present invention, the filling step S5 of ink and the step S6 of removing air bubbles may be repeated several times as described above, (S6) may be repeated several times.

The curing step S7 is a step of curing the ink 50 'from which air bubbles have been removed in step S7. In step S7, since the in-resin mesogens and the magnetic particles in the resin are aligned in a predetermined direction by the application of the external magnetic field in step S6, the ink 50 'is cured, and therefore, And the thermal conductivity can be improved.

According to one embodiment of the present invention, step S7 may be performed while applying a magnetic field and may be performed by applying a magnetic field in the same or similar direction to the external magnetic field application direction of step S6, for example, .

The curing is thermosetting. The curing temperature and the curing time can be appropriately selected. For example, the cured product can be obtained by heating at 80 ° C or more for 30 minutes or longer to thermoset.

The magnetic field applied in step S7 may be applied with a strength of 0.1 T to 10 T, preferably 4 T to 7 T.

The manufacturing method of the present invention may further include a process used for manufacturing a conventional printed circuit board, for example, the method may include separating the hole plugging device and the substrate (S8), removing the mask layer Step S9, and the like (not shown), and the present invention is not limited thereto.

The step (S8) of separating the hole plugging device from the substrate is a step of detaching the substrate 30 from the substrate transfer device 12. [

The step of removing the mask layer (S9) is a step of removing the mask layer (40) from the substrate (30), and an appropriate method can be used depending on the components of the mask layer (50)

10: Hall plugging part
11: Operation baskets
12: substrate transfer device
13: Sensing sensor
20: magnetic field application section
30: substrate
40, 40 ': mask layer
50, 50 ': Ink for hole plugging

Claims (15)

A hole plugging portion including a working basket for supplying ink for hole plugging; And
And a magnetic field applying unit located above and below the hole plugging unit and applying a magnetic field to the hole plugging unit,
The hole plugging ink flows along the direction of the applied magnetic field,
Wherein the hole plugging ink comprises an epoxy resin and an inorganic additive,
The epoxy resin includes an epoxy resin containing a mesogen group; An epoxy resin having two or more epoxy groups in one molecule; And an alicyclic epoxy resin,
The epoxy resin having at least two epoxy groups in the molecule and the alicyclic epoxy resin are contained at a mixing ratio of 1: 0.01 to 1: 0.8,
Wherein the inorganic additive is at least one selected from the group consisting of nickel, iron, iron oxide, cobalt, ferrite and rare earth metals.
Hall plugging device.
The method according to claim 1,
Wherein the magnetic field applying section includes a magnetic field generating device including a permanent magnet, a solenoid, or both.
The method according to claim 1,
Wherein the magnetic field application unit applies a magnetic field of 0.1 T to 10 T intensity.
The method according to claim 1,
Wherein the hole plugging portion includes a substrate transfer device movable up and down in the work basket.
delete delete delete delete The method according to claim 1,
Wherein the ferrite comprises an oxide of at least one selected from the group consisting of Co, Ni, Mg, Zn, Mn, Ti, Zr, Ge, Be, Li,
Wherein the rare earth metal comprises at least one selected from the group consisting of La, Ce, Pr, Nd, Pm, Sm, Eu, Gd, Tb, Dy, Ho, Er, Tm, Yb,
Hall plugging device.
Preparing a substrate on which a hole is formed;
Forming a mask layer on the upper and lower surfaces of the substrate;
Attaching the substrate on which the mask layer is formed to a substrate transfer apparatus;
Filling ink in the working basket;
Transferring the attached substrate to contact the filled ink with the substrate, and filling the ink into the hole;
Transferring the attached substrate after the filling step to remove bubbles from the filled ink by applying a magnetic field to the ink filled in the hole after separating the filled ink and the substrate; And
Curing the filled ink;
Lt; / RTI >
The filling step is to apply a magnetic field in a first direction in the magnetic field generator to cause the ink to flow into the hole,
Wherein the step of removing bubbles from the filled ink alternately applies a magnetic field in a first direction, a second direction opposite to the first direction, or both directions in the magnetic field application portion, And the air bubbles are removed by flowing along the direction of the magnetic field,
Hole plugging method.
delete delete 11. The method of claim 10,
Wherein the curing step is performed at a temperature of 80 DEG C or more for a time of 30 minutes or more.
11. The method of claim 10,
Wherein the substrate is a printed circuit board.
11. The method of claim 10,
Before the step of curing the filled ink,
Filling the ink into the hole; And removing the bubbles from the filled ink is repeated several times.

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