KR101580817B1 - Apparatus and Method for supplying molding resin - Google Patents

Apparatus and Method for supplying molding resin Download PDF

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Publication number
KR101580817B1
KR101580817B1 KR1020140052503A KR20140052503A KR101580817B1 KR 101580817 B1 KR101580817 B1 KR 101580817B1 KR 1020140052503 A KR1020140052503 A KR 1020140052503A KR 20140052503 A KR20140052503 A KR 20140052503A KR 101580817 B1 KR101580817 B1 KR 101580817B1
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South Korea
Prior art keywords
molding resin
molding
unit
discharge
discharged
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KR1020140052503A
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Korean (ko)
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KR20150125323A (en
Inventor
모준범
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세메스 주식회사
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Publication of KR20150125323A publication Critical patent/KR20150125323A/en
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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Processing And Handling Of Plastics And Other Materials For Molding In General (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)

Abstract

The molding resin supply device and method are characterized by comprising a molding resin which is formed to have a granular shape and which has a hopper structure inclined toward the lower end and has a discharge part capable of discharging the molding resin one by one at the lower end, A storage unit having an opening / closing unit that can be opened / closed; A tray which is disposed at a lower portion of the discharge unit and conveys the molding resin to a molding unit for molding the electronic part using the molding resin while receiving the molding resin discharged through the discharge unit; And a control unit for controlling the number of granules of the molding resin to be discharged to the tray through the discharge unit to be discharged only by a predetermined number.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to an apparatus and a method for supplying a molding resin, and more particularly, to a molding resin supply apparatus and method for supplying a molding resin having a granular shape for molding a substrate on which electronic components such as semiconductor chips are mounted .

BACKGROUND ART In general, a semiconductor manufacturing process includes a bonding process for attaching electronic components such as semiconductor chips separated from a wafer to a package substrate such as a lead frame or a printed circuit board, And a molding process for forming an outer shape of the package by using a molding resin.

The molding process is a process of protecting the electronic component and the metal wire from the external environment such as impact, heat, moisture, and sealing with the molding resin so that the electrical connection of the metal wire is maintained. The molding resin mainly includes a thermosetting resin, and examples of the thermosetting resin include an epoxy molding compound (EMC).

An example of the molding process is disclosed in Korean Patent Registration No. 10-0615904 (hereinafter referred to as "cited document").

In the molding process disclosed in the cited document, the molding resin is used as a tablet rather than as a powder. That is, in the cited document, a molding resin in a tablet state in a cylindrical solid state is used.

Here, in the molding process using the molding resin in the tablet state, the molding resin in the tablet state needs to be changed according to the sizes of the electronic parts and the substrate for molding. This is because the weight of the molding resin in the tablet state must be varied depending on the size, weight, etc. of the electronic parts and the substrate for the molding.

Therefore, in the case of the molding process disclosed in the cited document, the weight of the molding resin in the tablet state must be changed according to the size and weight of the electronic parts and the substrate for the molding, . In addition, since the molding resin in the tablet state is formed in the solid state of the cylindrical shape, there is a problem that a state of breakage may occur during transportation.

It is an object of the present invention to provide a method of manufacturing a molding resin which can supply a predetermined amount of molding resin even when the size and weight of an electronic part and a substrate for molding are changed and there is no need to replace the molding resin, And a method for supplying the molding resin.

According to an aspect of the present invention, there is provided a molding resin supply apparatus including a molding resin formed to have a granular shape, a hopper structure inclined toward a lower end of the molding resin, A receiving part having a discharging part capable of discharging the molding resin one by one and an opening and closing part capable of opening and closing the discharging part; A tray which is disposed at a lower portion of the discharge unit and conveys the molding resin to a molding unit for molding the electronic part using the molding resin while receiving the molding resin discharged through the discharge unit; And a control unit for controlling the number of granules of the molding resin to be discharged to the tray through the discharge unit to be discharged only by a predetermined number.

In the molding resin supply apparatus according to an embodiment of the present invention, the molding resin may be formed to have a granular shape having the same weight.

In the molding resin supply device according to an embodiment of the present invention, the tray is provided with a plurality of pockets for receiving the molding resin so as to have a series structure, and the pockets are disposed at a lower portion of the discharge portion so as to reciprocate linearly .

In the molding resin supply device according to an embodiment of the present invention, the controller may include a confirmation unit that can confirm the number of granules of the molding resin discharged to the tray through the discharge unit, and a determination unit that determines the number of granules The discharge unit may be closed by the opening / closing unit.

The molding resin supply device according to an embodiment of the present invention may further include an adjustment unit that adjusts the size of the discharge unit according to the size of the molding resin.

According to an aspect of the present invention, there is provided a method for supplying a molding resin, the method including the steps of: discharging one molding resin having a granular shape; And stopping the discharge of the molding resin when the number of granules of the molding resin is discharged only by a predetermined number.

In the molding resin supply method according to an embodiment of the present invention, the molding resin may be formed to have a granular shape having the same weight.

As described above, in the molding resin feeding apparatus and method of the present invention, the molding resin formed to have a granular shape can be discharged and supplied one by one. Accordingly, in the present invention, molding resin is formed so as to have a granular shape having the same weight, and by discharging and supplying the molding resin one by one, only when the number of granules is controlled, the molding resin is quantitatively determined even if the size and weight of the electronic parts and substrate for molding are changed. It is not necessary to replace the molding resin.

Therefore, when the molding resin feeding apparatus and method of the present invention is applied to the manufacture of a semiconductor package, it is possible to omit the step of replacing the molding resin, thereby improving the productivity through faster manufacturing.

In addition, as described above, since the molding resin injection device and method of the present invention use granular molding resin, it is possible to prevent the molding resin from being broken during transportation. Therefore, As a result, it is expected that the reliability of manufacturing the semiconductor package can be improved.

FIG. 1 is a schematic view showing a molding resin supply apparatus according to an embodiment of the present invention.
Fig. 2 is a view for more specifically explaining the receiving portion of Fig. 1. Fig.
3 is a schematic view showing an adjusting unit provided in the molding resin supply apparatus of FIG.

While the present invention has been described in connection with certain exemplary embodiments, it is obvious to those skilled in the art that various changes and modifications may be made therein without departing from the spirit and scope of the invention. It is to be understood, however, that the invention is not intended to be limited to the particular forms disclosed, but on the contrary, is intended to cover all modifications, equivalents, and alternatives falling within the spirit and scope of the invention. Like reference numerals are used for like elements in describing each drawing. The terms first, second, etc. may be used to describe various components, but the components should not be limited by the terms. The terms are used only for the purpose of distinguishing one component from another. The terminology used in this application is used only to describe a specific embodiment and is not intended to limit the invention. The singular expressions include plural expressions unless the context clearly dictates otherwise. In the present application, the term "comprises" or "comprising ", etc. is intended to specify that there is a stated feature, figure, step, operation, component, But do not preclude the presence or addition of one or more other features, integers, steps, operations, components, parts, or combinations thereof.

Unless defined otherwise, all terms used herein, including technical or scientific terms, have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. Terms such as those defined in commonly used dictionaries are to be interpreted as having a meaning consistent with the contextual meaning of the related art and are to be interpreted as either ideal or overly formal in the sense of the present application Do not.

FIG. 1 is a schematic view showing a molding resin supply apparatus according to an embodiment of the present invention.

Referring to FIG. 1, the molding resin supply apparatus 100 of the present invention can be used in a molding process of an electronic component using a molding resin, and may be connected to a molding unit (not shown). Here, the molding resin used in the molding process may be a thermosetting resin, and examples of the thermosetting resin include an epoxy molding compound (EMC).

Particularly, in the molding resin feeding apparatus and method of the present invention, a molding resin 10 having a granular shape can be used. At this time, the molding resin 10 formed to have the granular shape may have the same weight. That is, the molding resin 10 formed to have the granular shape may be formed to have a weight of 1 g or all of 2 g. Here, the weight of the molding resin 10 formed to have the granular shape can be arbitrarily set by the operator in consideration of the size and weight of the electronic parts to be molded and the packaging substrate.

The molding resin supply device 100 according to the present invention may include a housing part 12, a tray 16, a controller 20, and the like.

The receiving part 12 is a member for receiving the molding resin 10 formed to have the granular shape and may have a hopper structure inclined toward the lower end. And a discharge unit 14 capable of discharging the molding resin 10 one by one may be provided at the lower end. Accordingly, the molding resin supply device 100 of the present invention may have a structure capable of discharging the molding resin 10 accommodated in the housing part 12 one by one through the discharge part 14. [ Particularly, since the molding resin supply device 100 of the present invention is required to discharge the molding resin 10 one by one, the size of the discharge portion 14 is changed according to the size of the granules formed of the molding resin 10 As will be described later.

Fig. 2 is a view for more specifically explaining the receiving portion of Fig. 1. Fig.

Referring to FIG. 2, the storage unit 12 may include an opening / closing unit 26 that can open / close the discharge unit 14. By using the opening and closing part 26, the housing part 12 can control the number of the molding resin 10, which is formed to have the granular shape, through the discharge part 14, to be discharged. That is, in the present invention, the molding resin 10 accommodated in the accommodating portion 12 is discharged through the discharge portion 14, and the discharge of the molding resin 10 is stopped through the opening and closing portion 26 It can be done.

The opening and closing part 26 is formed in a structure in which the discharge part 14 is opened or closed by a linear reciprocating motion of a sliding type or is hinged to the lower end of the storage part 12, As shown in Fig. The open / close operation of the opening / closing unit 26 can be achieved by a moving member connected to the opening / closing unit 26, and examples of the moving member include a motor and a cylinder.

As described above, the molding resin supply apparatus 100 of the present invention accommodates the molding resin 10 formed to have the granular shape and has a hopper structure inclined toward the lower end, while the molding resin 10 (12) capable of discharging the discharging part (14) one by one and an opening and closing part (26) capable of opening and closing the discharging part (14).

Referring again to FIG. 1, the tray 16 may be disposed at a lower portion of the discharge portion 14. The tray 16 may receive the molding resin 10 discharged through the discharge unit 14. [ In addition, the tray 16 is provided to convey the molding resin to a molding part for molding an electronic part by using the molding resin 10. That is, the tray 16 accommodates the molding resin 10 discharged through the discharge part 14, and the molding resin 10 is molded into a molding part for molding an electronic part using the molding resin 10, As shown in FIG.

The tray 16 may be provided with a pocket 18 for receiving the molding resin 10 therein. At this time, the plurality of pockets 18 may have a series structure. In particular, when a plurality of pockets 18 are provided in the tray 16 so as to have a series structure, the tray 16 is provided with a plurality of pockets 18, I need to exercise. This is because the pockets 18 filled with the molding resin 10 should move to the molding part and the empty pockets 18 not filled with the molding resin 10 should be positioned below the pouring part 14 Because. Therefore, in the present invention, the tray 16 is connected to a moving member for linearly reciprocating the pockets 18 so that the pockets 18 having the plurality of series structures can be continuously positioned below the discharging unit 14 . Examples of the moving member include a linear motor, a cylinder, and the like, which are capable of stepping.

The molding resin supply device 100 of the present invention is arranged in the lower part of the discharge part 14 and accommodates the molding resin 10 discharged through the discharge part 14, And a tray 16 for conveying the molding resin 10 to the molding part for molding an electronic part by using the molding resin 10 and the tray 16, (18) are arranged to have a series structure, and the pockets (18) are disposed at a lower portion of the discharge portion (14) so as to reciprocate linearly.

The control unit 20 is provided to control the number of granules of the molding resin 10 discharged through the discharge unit 14 to the tray 16. That is, the controller 20 controls the number of granules of the molding resin 10 discharged to the tray 16 to be discharged only by a predetermined number.

Accordingly, the molding resin supply device 100 of the present invention can supply the molding resin 10 in a predetermined amount to the molding part by having the control part 20. This is because the number of grains of the molding resin 10 can be controlled by using the controller 20 based on the weight of the electronic component, the size of the electronic component, and the like.

For example, when each of the granules of the molding resin 10 is composed of 1 g and 4 g of the molding resin required for the molding process is required, the control section 20 discharges only four granules of the molding resin 10 So that the molding resin 10 can be supplied to the molding part in a predetermined amount.

In addition, the molding resin supply device 100 of the present invention does not need to replace the molding resin 10 when the weight, size, etc. of the electronic component in which the molding process is performed is changed. That is, when each of the granules of the molding resin 10 is composed of 1 g and the supply amount of the molding resin 10 for molding the electronic component is changed to 5 g, the controller 20 controls the molding resin 10, The molding resin 10 can be supplied in a predetermined amount to the molding part.

As described above, the molding resin supply device 100 of the present invention can supply a predetermined amount of the molding resin 10 even if the size and weight of the electronic parts and the substrate for molding are changed, There is no need to replace the battery.

In the present invention, the control unit 20 may include an identification unit 22 and an instruction unit 24.

The confirmation unit 22 is a member that can confirm the number of granules of the molding resin 10 discharged to the tray 16 through the discharge unit 14 and can be provided with a sensor capable of mainly performing a counting function have. The instruction unit 24 is a member for instructing to close the discharge unit 14 by the opening and closing unit 26 when the number of granules of the molding resin 10 is discharged by a predetermined number through the discharge unit 14 , A control circuit which can mainly control the machine, and the like.

The molding resin supply apparatus 100 of the present invention confirms the number of granules of the molding resin 10 discharged to the tray 16 through the mold of the discharge unit 14 using the check unit 22 And the discharge unit 14 is closed using the instruction unit 24 to stop the discharge of the molding resin 10 so that the molding resin 10 can be supplied to the tray 16 only by a predetermined number will be.

The molding resin supply device 100 of the present invention is controlled such that the number of granules of the molding resin 10 discharged through the discharge unit 14 to the tray 16 is discharged only by a predetermined number And a control unit 20 for controlling the operation of the apparatus.

In addition, the controller 20 may be provided to control the movement of the tray 16. That is, the controller 20 may control the linear reciprocating motion of the tray 16. When the molding resin 10 is discharged and filled in the pockets 18 of the tray 16 by a predetermined number of times through the discharge unit 14 by the checking unit 22, The discharge unit 14 is closed by the instruction unit 24 through the opening and closing unit 26 and the empty pocket 18 of the tray 16 is positioned below the discharge unit 14, 16 to control the linear reciprocating motion of the rotor.

The molding resin supply device 100 of the present invention may omit the opening and closing operation of the opening and closing part 26 when the control part 20 appropriately controls the speed of the tray 16 in accordance with the linear reciprocating motion . That is, when the discharge speed at which the molding resin 10 is discharged through the discharge portion 26 and the speed of the linear reciprocating motion of the tray 16 are linked with each other, the opening and closing operation of the opening and closing portion 26 may be omitted It is. At this time, when the molding resin supply device 100 is continuously used, the discharge portion 14 can be kept open at all times.

For example, the speed at which the grains of the molding resin 10 are discharged to the tray 16 through the discharge unit 14 is referred to as a first speed, and the speed of the linear reciprocating motion of the tray 16 is referred to as a first speed The molding resin 10 is discharged and filled in the pockets 18 of the tray 16 by a predetermined number of times through the discharging unit 14 and at the same time the tray 16 Can be made to reciprocate the tray 16 at the second speed so that the empty pocket 18 of the tray 16 is positioned below the discharge unit 14. [

In the molding resin supply device 100 of the present invention, it can be understood that the molding resin 10 is discharged through the discharge portion 14 by free fall. Although not shown, the molding resin supply device 100 of the present invention may further include a vibration member capable of vibrating the accommodating portion 12 so that the molding resin 10 is more easily discharged from the discharge portion 14 .

3 is a schematic view showing an adjusting unit provided in the molding resin supply apparatus of FIG.

3, the molding resin supply device 100 of the present invention further includes an adjustment unit 28 that can adjust the size of the discharge unit 14 according to the size of the molding resin 10 .

That is, when the molding resin supply apparatus 100 of the present invention is used, the size of the molding resin 10 may be changed. In this case, it is necessary to replace the housing part 12 having the discharge part 14 suitable for the size of the molding resin 10, but when the adjusting part 28 is provided, the adjusting part 28 is used So that it is not necessary to replace the accommodating portion 12 by adjusting the size of the discharging portion 14.

Here, if the end of the discharge portion 14 has a circular structure, the control portion 28 may be provided to adjust the diameter of the circular portion. That is, the control unit 28 is provided to adjust the diameter of the discharge unit 14 to have a first diameter, a second diameter, and the like.

As described above, since the molding resin supply device 100 according to the present invention can discharge and supply the molding resin 10 formed in a granular form one by one, the size, weight, etc. of the electronic parts and the substrate for molding It is possible to supply a predetermined amount of the molding resin 10, and there is no need to replace the molding resin 10. In addition, since the molding resin 10 can be used in the form of granules, it is possible to prevent the molding resin 10 from being broken during transportation.

Hereinafter, the molding resin supplying method of the present invention will be described.

The method of supplying molding resin according to the present invention is a method of supplying molding resin 10, which is formed to have a granular shape, one by one, and when the number of granules of the molding resin 10 is discharged only by a set number, To stop the discharge of.

The molding resin supply method using the molding resin supply apparatus 100 of the present invention is as follows.

The molding resin 10 formed to have a granular shape is accommodated in the accommodating portion 12. At this time, the molding resin 10 formed to have the granular shape may have the same weight. Particularly, in the present invention, the molding resin 10 each having a weight of 1 g can be used.

In addition, the tray 16 is disposed below the receiving part 12. That is, the pockets 18 of the tray 16 are positioned below the discharge unit 14. At this time, the tray 16 may be provided to perform a linear reciprocating motion.

The molding resin 10 is then discharged through the discharge portion 14 into the pockets 18 of the tray 16. At this time, the molding resin 10 is discharged one by one. Here, the size of the discharge portion 10 is adjusted by the regulating portion 28 to match the size of the molding resin 10 having a weight of 1 g. In the present invention, 4 g of the molding resin 10 is required in the molding process for molding the electronic component.

Thus, the molding resin 10 is set to be discharged four times through the discharge part 14 into the pockets 18 of the tray 16. Therefore, the control unit 20 confirms that four molding resins 10 are discharged using the check unit 20.

When the molding resin 10 is confirmed to be ejected four times into the pockets 18 of the tray 16 using the confirmation unit 22, the instruction unit 24 of the control unit 20 controls the opening / (26) closes the discharge portion (16) by commanding the discharge portion (26) to close the discharge portion (14). Therefore, the molding resin 10 can be stopped without being discharged any more.

The tray 16 is linearly reciprocated such that the empty pockets 18 of the tray 16 are positioned below the discharging unit 14. [

And then discharging the molding resin 10 to the empty pocket 18 of the tray 16 by opening the discharge unit 14 by using the instruction unit 24.

Therefore, in the method of supplying molding resin according to the present invention, even if the size and weight of the electronic parts and the substrate for molding are changed by discharging and supplying the molding resin 10 one by one, a predetermined amount of the molding resin 10 can be supplied , And the molding resin 10 need not be replaced.

As described above, in the present invention, even if the size and weight of the electronic parts and the substrate for molding are changed, a predetermined amount of molding resin can be supplied. Moreover, since there is no need to replace the molding resin, As a result, it is possible to secure a product competitiveness according to the manufacture of the semiconductor package.

In addition, since the molding resin in the form of granules is used in the present invention, it is possible to prevent the molding resin from being broken at the time of transfer, and to improve the reliability by stabilizing the molding resin during transportation. As a result, It is possible to secure an improvement in reliability according to the present invention.

It will be apparent to those skilled in the art that various modifications and variations can be made in the present invention without departing from the spirit or scope of the present invention as defined by the following claims. It can be understood that it is possible.

10: molding resin 12; A storage section
14: discharge part 16: tray
18: Pocket 20: Control
22: confirmation unit 24:
26: opening and closing part 28:
100: Molding resin feeding device

Claims (7)

A discharge part having a hopper structure inclined toward the lower end and capable of discharging the molding resin one by one at the lower end and having a circular structure in cross section, A storage unit having an opening / closing unit capable of opening / closing the discharge unit;
A tray which is disposed at a lower portion of the discharge unit and conveys the molding resin to a molding unit for molding the electronic part using the molding resin while receiving the molding resin discharged through the discharge unit;
A control unit for controlling the number of granules of the molding resin to be discharged to the tray through the discharge unit to be discharged only by a predetermined number; And
And a control unit adjusting the diameter of the circular structure of the discharge unit to adjust the size of the diameter of the discharge unit according to the size of the molding resin, and even when the size of the molding resin is changed, And the size of the discharge portion is adjusted by using the regulating portion so that the molding resin can be continuously discharged one by one even if the storing portion is the same. The molding resin supply apparatus according to claim 1, wherein the molding resin is formed to have a granular shape having the same weight. The molding resin supply apparatus as claimed in claim 1, wherein the tray is provided with a plurality of pockets for receiving the molding resin so as to have a series structure, and the pockets are disposed at a lower portion of the discharge section so as to reciprocate linearly. The apparatus according to claim 1, wherein the control unit comprises: a confirmation unit that can confirm the number of granules of the molding resin discharged to the tray through the discharge unit; and a control unit that, when the number of particles of the molding resin is discharged, And an instruction section for instructing to close the discharge section. delete delete delete
KR1020140052503A 2014-04-30 2014-04-30 Apparatus and Method for supplying molding resin KR101580817B1 (en)

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KR1020140052503A KR101580817B1 (en) 2014-04-30 2014-04-30 Apparatus and Method for supplying molding resin

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KR101580817B1 true KR101580817B1 (en) 2015-12-29

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Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101332312B1 (en) * 2012-10-16 2013-11-22 한국기계연구원 A quantitative powder supplying apparatus

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3068418B2 (en) * 1994-08-31 2000-07-24 日本電気株式会社 Method of supplying resin material to resin mold
JP3950521B2 (en) * 1997-09-04 2007-08-01 アピックヤマダ株式会社 Resin charging device and resin sealing device provided with the resin charging device

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101332312B1 (en) * 2012-10-16 2013-11-22 한국기계연구원 A quantitative powder supplying apparatus

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