KR101577686B1 - adhesive resin for dicing die-bonding film, attach film for dicing die-bonding film including the same and dicing die-bonding film including the same - Google Patents

Abstract

The present invention relates to an adhesive resin for a dicing die-bonding film, an adhesive film for a dicing die-bonding film comprising the same, and a dicing die-bonding film. The adhesive resin, the adhesive film, and the dicing die-bonding film of the present invention show excellent reliability such as thermal resistance, moisture resistance, and reflow crack resistance.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to an adhesive resin for a dicing die-bonding film, an adhesive film for the dicing die-bonding film and a dicing die- -bonding film including the same}

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an adhesive resin for a dicing die bonding film, an adhesive film for a dicing die bonding film comprising the adhesive resin, and a dicing die bonding film comprising the adhesive resin. More specifically, the present invention relates to a heat resistant, moisture absorbing and reflow crack resistance ), An adhesive film for a dicing die bonding film comprising the adhesive resin, and a dicing die bonding film comprising the adhesive resin for a dicing die bonding film.

2. Description of the Related Art [0002] In recent years, a multi chip package (MCP) method for stacking a plurality of semiconductor chips on a semiconductor substrate has been adopted in accordance with the highly integrated and highly functional semiconductor memory, starting from a flash memory mounted on a mobile phone or a mobile terminal. In the MCP system, a film-like adhesive is used instead of the conventional liquid epoxy paste for bonding the semiconductor chip and the semiconductor substrate.

On the other hand, the method of using the film-like adhesive includes a film single piece bonding method and a wafer back side bonding method.

In the film single component bonding method, an adhesive on a film is cut or punched to be processed into a single piece to be adhered to a semiconductor substrate, a chip is picked up from a wafer and die-bonded thereon, A semiconductor device is obtained through bonding and molding processes.

In the wafer back-surface bonding method, a film-like adhesive is attached to the back surface of the wafer, and a dicing tape having an adhesive layer is further attached to the opposite surface of the adhesive not adhered to the back surface of the wafer to separate the wafer into individual chips Then, the chip is picked up and die-bonded to the semiconductor substrate, and then the semiconductor device is obtained through the wire bonding and molding processes.

More specifically, the process of assembling the semiconductor package using the wafer backside bonding method is as follows: attaching a semiconductor adhesive film to the back surface of the wafer at 50 ° C to 80 ° C, dicing the wafer into individual chips, And the semiconductor substrate is laminated at a high temperature condition through a dicing bonding process. In order to fix the stacked chips, a pre-cure process is performed at 125 ° C to 175 ° C for a certain period of time, and the laminated semiconductor device is finally subjected to an EMC molding process. The PMC (post mold cure) process is performed at 175 ° C for 1-2 hours in order to cure the molded EMC resin and the laminated adhesive film. When the semiconductor device thus manufactured is mounted on a printed board, it is mounted by a method such as infrared reflow soldering or the like. Such a mounting method heats the entire package at 200 ° C to 260 ° C, so that when moisture is present inside the adhesive film used for chip stacking, package cracking (hereinafter referred to as "reflow crack") occurs due to vaporization of moisture .

Korean Patent Application No. 1082448 in the prior art discloses an adhesive resin composition and a dicing die-bonding film using the adhesive resin composition.

Therefore, there is a strong demand for the development of an adhesive film for semiconductors having excellent reliability such as heat resistance, moisture absorption resistance and reflow crack resistance in semiconductor devices.

SUMMARY OF THE INVENTION The present invention has been conceived to solve the problems as described above, and an object of the present invention is to provide an adhesive resin for a dicing die bonding film excellent in reliability such as heat resistance, moisture absorption resistance and reflow crack resistance, An adhesive film for a dicing die bonding film comprising the same, and a dicing die bonding film.

In order to solve the above-mentioned problems, the present invention provides an adhesive resin for a dicing die-bonding film, which comprises a polyfunctional epoxy resin, an active ester curing resin and a thermoplastic resin.

According to a preferred embodiment of the present invention, the active ester-based cured resin of the adhesive resin for a dicing die-bonding film of the present invention comprises at least one compound selected from the group consisting of a compound represented by the following formula (1) and a compound represented by the following formula .

[Chemical Formula 1]

Wherein R ₁ is selected from the group consisting of -H, a C ₁ -C ₁₀ alkyl group, a C ₃ -C ₁₀ cycloalkyl group, a C ₆ -C ₁₀ aryl group, Or an aralkyl group of C ₇ to C ₁₀ and R ₂ may be a C ₁ to C ₁₀ alkyl group, a C ₆ to C ₁₀ aryl group or a C ₇ to C ₁₀ And X may be a rational number satisfying 1? X? 10,

(2)

,

,

,

일 수 있고, R₄는 벤젠기(Benzene group), C₁ ~ C₁₀의 알킬기(alkyl group), C₆ ~ C₁₀의 아릴기(aryl group) 또는 C₇ ~ C₁₀의 알랄킬기(aralkyl group) 또는 C₁ ~ C₁₀의 알켄닐기이며, n은 1 ≤ n ≤ 10을 만족하는 유리수일 수 있다. In Formula 2, R ₃ is a benzene group, a C ₁ to C ₁₀ alkyl group, a C ₃ to C ₁₀ cycloalkyl group, a C ₆ to C ₁₀ aryl group (aryl group),

,

,

,

And R ₄ is a benzene group, a C ₁ to C ₁₀ alkyl group, a C ₆ to C ₁₀ aryl group or a C ₇ to C ₁₀ aralkyl group ) Or a C ₁ to C ₁₀ alkenyl group, and n may be a rational number satisfying 1? N? 10.

According to another preferred embodiment of the present invention, the active ester-based curing resin of the adhesive resin for a dicing die-bonding film of the present invention may have an average equivalent weight of ester groups of 130 to 300 g / eq.

According to another preferred embodiment of the present invention, the thermoplastic resin of the adhesive resin for a dicing die-bonding film of the present invention is an acrylic copolymer resin, a polyamide resin, a polyimide resin, a polyamideimide resin, A polyimide resin, a polyimide resin, a phenoxy resin, a butadiene resin, and an acrylonitrile butadiene copolymer resin.

,

,

,

및

의 단량체로 구성된 아크릴 공중합체 수지를 포함하고, 상기 아크릴 공중합체 수지는 40만 ~ 120만의 중량평균 분자량 및 -12℃ ~ 32℃의 유리전이 온도를 만족할 수 있다.According to another preferred embodiment of the present invention, the thermoplastic resin of the adhesive resin for a dicing die-bonding film of the present invention comprises

,

,

,

And

, And the acrylic copolymer resin can satisfy a weight average molecular weight of 400,000 to 1,200,000 and a glass transition temperature of -12 占 폚 to 32 占 폚.

According to another preferred embodiment of the present invention, the polyfunctional epoxy resin of the adhesive resin for a dicing die-bonding film of the present invention comprises at least one or more of a bisphenol-based epoxy resin and a cresol novolak-based epoxy resin .

According to another preferred embodiment of the present invention, the adhesive resin for a dicing die bonding film of the present invention further comprises an inorganic filler, a curing accelerator and a silane coupling agent, and the inorganic filler is selected from the group consisting of silica, clay, gypsum, calcium carbonate, Barium oxide, alumina oxide, barium oxide, silicon carbide, and silicon nitride, wherein the curing accelerator comprises an imidazole-based curing accelerator or a tertiary amine-based curing accelerator, wherein the silane coupling agent is a mercaptosilane coupling agent , An aminosilane coupling agent, an epoxy silane coupling agent, a ureido silane coupling agent, an isocyanate silane coupling agent, a vinyl silane coupling agent, an acryl silane coupling agent and a ketimine silane coupling agent.

According to another preferred embodiment of the present invention, the curing density of the adhesive resin for the dicing die bonding film of the present invention may be 50 to 95%.

According to another preferred embodiment of the present invention, the adhesive resin for a dicing die-bonding film of the present invention comprises 32.0 to 59.0 parts by weight of a polyfunctional epoxy resin and 10.0 to 37.0 parts by weight of an active ester- Section.

The present invention provides an adhesive film for a dicing die-bonding film, which comprises the above-mentioned adhesive resin for a dicing die-bonding film.

According to one preferred embodiment of the present invention, when the average thickness of the adhesive film for a dicing die bonding film of the present invention is 800 μm, the moisture absorption rate may be 0.5% or less when measured according to the following formula (1).

[Equation 1]

In the above equation 1, W 1 is a weight measured after curing for 2 hours, a specimen cutting the adhesive film to a size of 50mm × 50mm (width × length) at 175 ℃ drying oven, W 2 is the specimen Was measured after standing for 24 hours in a constant temperature and humidity chamber at 85 ° C and 85% relative humidity.

According to another preferred embodiment of the present invention, the adhesive film for a dicing die bonding film of the present invention has a dielectric constant of 3.15 or less in a 1 GHz region measured using an impedance measuring device when the average thickness is 100 m have.

According to another preferred embodiment of the present invention, when the average thickness of the adhesive film for a dicing die bonding film of the present invention is 20 탆, the rate of area change upon measurement according to the following formula (2) may be 5% or less.

&Quot; (2) "

In the formula (2), M is an adhesive film having a thickness of 20 mu m laminated at 60 DEG C on a cover glass of 50 mm x 50 mm x 130 m (width x length x thickness) And Z is an area of the specimen produced by pressing at 120 DEG C and 1.0 kgf pressure for 1 second on a die bonding machine and Z is a moisture absorption treatment of the specimen at 85 DEG C and 85% relative humidity for 48 hours, Lt; 0 > C for 30 seconds.

Further, in order to solve the above problems, the present invention provides a dicing die-bonding film in which a base layer, a pressure-sensitive adhesive layer and an adhesive layer are sequentially laminated, wherein the adhesive layer comprises the adhesive resin for a dicing die- The present invention also provides a dicing die-bonding film.

The adhesive resin for a dicing die-bonding film of the present invention, the adhesive film for a dicing die-bonding film and the dicing die-bonding film containing the same have excellent reliability such as heat resistance, moisture absorption resistance and reflow crack resistance .

1 is a cross-sectional view of a dicing die-bonding film according to a preferred embodiment of the present invention.
Fig. 2 is a view showing a water tank used in the heat resistance measurement experiment example of the present invention. Fig.

Hereinafter, the present invention will be described in more detail.

As described above, there is an urgent need to develop an adhesive film for semiconductors having excellent reliability such as heat resistance, moisture absorption resistance and reflow crack resistance in a semiconductor device.

Accordingly, the present invention has been made to solve the above-mentioned problems through an adhesive resin for a dicing die-bonding film, which comprises a polyfunctional epoxy resin, an active ester curing resin and a thermoplastic resin.

Accordingly, an adhesive resin for a dicing die bonding film excellent in reliability such as heat resistance, hygroscopicity and reflow crack resistance, an adhesive film for a dicing die bonding film containing the same, and a dicing die bonding film are provided can do.

The adhesive resin for a dicing die bonding film usable in the adhesive film for semiconductor of the present invention includes a polyfunctional epoxy resin, an active ester curable resin and a thermoplastic resin.

First, the active ester-based cured resin of the present invention will be described as follows.

The adhesive resin for a dicing die bonding film used as an insulating material in addition to conventional die bonding requires an adhesive resin for a dicing die bonding film having a lower dielectric constant for the purpose of reducing transmission loss in a high frequency band have. However, when an amine-based curing resin, a phenol-based curing resin or an acid anhydride-curing resin which has been widely used as a curing resin contained in the adhesive resin is used, the curing reaction with the epoxy- It is difficult to produce an adhesive film for a dicing die bonding film having a low dielectric constant because a hydroxy group is generated.

However, the adhesive resin for a dicing die-bonding film of the present invention does not contain the aforementioned amine-based cured resin, phenol-based cured resin and acid anhydride-cured resin, and uses an active ester-based cured resin as a cured resin, It is possible to produce an adhesive film for a dicing die-bonding film containing an adhesive resin for a dicing die-bonding film having a low dielectric constant.

The active ester-based cured resin may include a compound represented by the following formula (1).

[Chemical Formula 1]

Wherein R ₁ is selected from the group consisting of -H, a C ₁ -C ₁₀ alkyl group, a C ₃ -C ₁₀ cycloalkyl group, a C ₆ -C ₁₀ aryl group, Or a C ₇ to C ₁₀ aralkyl group and R ₂ is a C ₁ to C ₁₀ alkyl group, a C ₆ to C ₁₀ aryl group or a C ₇ to C ₁₀ alkyl And X may be a rational number satisfying 1? X? 10.

In addition, the active ester-based cured resin may include a compound represented by the following formula (2).

(2)

,

,

,

이고, R₄는 벤젠기(Benzene group), C₁ ~ C₁₀의 알킬기(alkyl group), C₆ ~ C₁₀의 아릴기(aryl group), C₇ ~ C₁₀의 알랄킬기(aralkyl group) 또는 C₁ ~ C₁₀의 알켄닐기이며, n은 1 ≤ n ≤ 10을 만족하는 유리수일 수 있다.
In Formula 2, R ₃ is a benzene group, a C ₁ to C ₁₀ alkyl group, a C ₃ to C ₁₀ cycloalkyl group, a C ₆ to C ₁₀ aryl group (aryl group),

,

,

,

And R ₄ is a benzene group, a C ₁ to C ₁₀ alkyl group, a C ₆ to C ₁₀ aryl group, a C ₇ to C ₁₀ aralkyl group, A C ₁ to C ₁₀ alkenyl group, and n may be a rational number satisfying 1? N? 10.

The active ester-based cured resin may have an average equivalent weight of ester groups of 130 to 300 g / eq, preferably 140 to 230 g / eq. if. If the average equivalent weight of the ester group is less than 130 g / eq, the viscosity of the active ester-based cured resin is low and it is difficult to prepare it as a film. If the average equivalent of the ester group exceeds 300 g / eq, There is a possibility that the stability may deteriorate or the stability may deteriorate.

On the other hand, the active ester-based curing resin is not particularly limited, and examples thereof include trade names "HPC-8000-65T" (manufactured by DIC) having an ester equivalent of 223 g / eq, an average equivalent weight of ester groups of 149 g / quot; EC-298 " (manufactured by DMI) having an average equivalent weight of 1,600 g / eq or an EC-326 (manufactured by DMI) having an ester equivalent weight of 163 g / eq.

Next, the thermoplastic resin will be described as follows.

The thermoplastic resin plays a role in improving the film formability, and the film formability refers to mechanical properties such that when the adhesive resin for a dicing die bonding film is made into a film, it tears easily, does not break, will be. If handling as a film is easy in a normal state (for example, room temperature), the film formability is good.

,

,

,

및

의 단량체로 구성된 아크릴 공중합체 수지를 포함하고, 더욱 바람직하게는

,

,

,

및

의 단량체가,

1 몰(mol)에 대하여

0.01 ~ 4.0몰, 바람직하게는 0.04 ~ 1.40 몰,

0.5 ~ 3.5몰, 바람직하게는 1.03 ~ 2.30몰,

1.00 ~ 15.00몰, 바람직하게는 6.00 ~ 9.00 몰 및

0.01 ~ 20.00몰, 바람직하게는 0.1 ~ 14.00몰로 공중합체된 아크릴 공중합체 수지를 포함할 수 있다.
The thermoplastic resin of the present invention can be used as a thermoplastic resin in the form of an acrylic copolymer resin, a polyamide resin, a polyimide resin, a polyamideimide resin, a polyester resin, a polyesterimide resin, a polyetherimide resin, a polyvinyl butyral resin, A phenoxy resin, a butadiene resin, and an acrylonitrile-butadiene copolymer resin, and preferably at least one of

,

,

,

And

Of an acrylic copolymer resin composed of a monomer of

,

,

,

And

≪ / RTI >

About 1 mole

0.01 to 4.0 mol, preferably 0.04 to 1.40 mol,

0.5 to 3.5 mol, preferably 1.03 to 2.30 mol,

1.00 to 15.00 moles, preferably 6.00 to 9.00 moles, and

May contain an acrylic copolymer resin copolymerized with 0.01 to 20.00 moles, preferably 0.1 to 14.00 moles.

The acrylic copolymer resin may include an acrylic copolymer resin having a weight average molecular weight of 400,000 to 1,200,000 and a glass transition temperature of -12 ° C to 32 ° C.

If the weight average molecular weight of the acrylic copolymer resin is less than 400,000, there is a problem that the film formability is deteriorated. If the acrylic copolymer resin exceeds 1.2000,000, the resin flowability may be deteriorated. If the glass transition temperature of the acrylic copolymer resin is lower than -12 ° C, there may be a problem in pick up characteristics. If the glass transition temperature is higher than -12 ° C, And adhesion may be deteriorated.

The acrylic copolymer resin is not particularly limited and may include, for example, a trade name "SG-P3" (manufactured by Nagase Chemtech) having a weight average molecular weight of 850,000 and a glass transition temperature of 12 ° C.

Finally, the polyfunctional epoxy resin may be a cycloaliphatic epoxy resin, a glycidyl ether type epoxy resin, a glycidyl amine type epoxy resin, a glycidyl ester type epoxy resin, a linear aliphatic epoxy Containing epoxy resin, a substituted epoxy resin, a naphthalene-based epoxy resin, and a derivative thereof, preferably a bisphenol-based epoxy resin and a cresol novolac resin in a glycidyl ether type epoxy resin And an epoxy resin.

The glycidyl ether type epoxy resin includes a glycidyl ether of a phenol and a glycidyl ether of an alcohol, and glycidyl ether of the phenol includes bisphenol A type, bisphenol B type, bisphenol AD type, bisphenol S type Phenolic novolacs such as phenol novolac epoxy, aralkylphenol novolak, terpenephenol novolak, and o-cresol novolac epoxy, such as bisphenol type epoxy such as bisphenol F type and resorcinol, And cresol novolak type epoxy resins, and these may be used singly or in combination of two or more kinds.

N, N, N ', N'-tetraglycidyl-m-xylylene diamine, 1,3, 2,4,6-tetramethylhexylamine, Triglycidyl-m-aminophenol, triglycidyl-p-aminophenol and the like having both a structure of bis (diglycidylaminomethyl) cyclohexane, glycidyl ether and glycidylamine, Two or more species can be used in combination.

The glycidyl ester type epoxy resin may be an epoxy resin made of p-hydroxybenzoic acid, polycarboxylic acid such as phthalic acid or terephthalic acid, and hydroxycarboxylic acid such as? -Hydroxynaphthoic acid, and may be used alone or in combination of two or more can do.

Examples of the linear aliphatic epoxy resin include 1,4-butanediol, 1,6-hexanediol, neopentyl glycol, cyclohexanedimethanol, glycerin, trimethylolethane, , Dodecahydrobisphenol F, ethylene glycol, propylene glycol, polyethylene glycol, polypropylene glycol and the like, which may be used alone or in combination of two or more.

The naphthalene-based epoxy resin may be at least one selected from the group consisting of 1,2-diglycidyl naphthalene, 1,5-diglycidyl naphthalene, 1,6-diglycidyl naphthalene, And epoxy resins having a naphthalene skeleton such as diglycidyl naphthalene, triglycidyl naphthalene and 1,2,5,6-tetraglycidyl naphthalene. These epoxy resins may be used alone or in combination of two or more.

An epoxy resin having an epoxycyclohexane ring in the molecule obtained by oxidizing triglycidylisocyanurate and a compound having a plurality of double bonds in the molecule, and the like.

On the other hand, the adhesive resin for a dicing die-bonding film of the present invention may further include an inorganic filler, a curing accelerator, and a silane coupling agent.

The inorganic filler may be an inorganic filler usually included in an adhesive resin for a dicing die-bonding film. As a non-limiting example, the inorganic filler may be silica , Clay, gypsum, calcium carbonate, barium sulfate, alumina oxide, barium oxide, silicon carbide, and silicon nitride. Among them, silica, particularly fused silica, is suitably used.

The shape of the inorganic filler is not particularly limited, but spherical particles can be preferably used. The average particle diameter of the inorganic filler is preferably in the range of 0.01 탆 to 1.0 탆, more preferably in the range of 0.1 탆 to 0.8 탆. If the average particle diameter is less than 0.01 탆, the inorganic filler tends to flocculate, resulting in deterioration of the coating property of the adhesive film and deterioration of the adhesive film strength. When the average particle diameter exceeds 1.0 탆, It is difficult to recognize the alignment mark on the surface of the semiconductor element, so that the workability may be remarkably deteriorated. In the present invention, inorganic fillers having different average particle diameters may be used in combination.

The spherical silica is not particularly limited. For example, the spherical silica may include a trade name " SFP-30M " (manufactured by DENKI KAGAKU KOGYO CO., LTD.) Having an average particle diameter of 0.7 mu m.

Next, the curing accelerator serves to adjust the curing rate and physical properties of the cured product, and the curing accelerator used in the conventional adhesive resin for the dicing die bonding film as the curing accelerator can be used without limitation, For example, an imidazole-based curing accelerator or a tertiary amine-based curing accelerator may be included. From the viewpoint of easy control of the reaction system for adjusting the curing rate and physical properties of the cured product, Can be preferably used.

The imidazole-based curing accelerator is not particularly limited, and examples thereof include 1-cyanoethyl-2-phenylimidazole in which one position of imidazole is protected with a cyanoethyl group, and basicity with isocyanuric acid Quot; 2MA-0K " (manufactured by Shikoku Chemicals Corporation) or a product name " Cueazole 2PZ-CN " (manufactured by Shikoku Chemical Co., Ltd.).

Next, the silane coupling agent serves to further enhance the adhesion to the adherend, and silane coupling agents generally used for the adhesive resin for the dicing die-bonding film can be used without limitation. As a non-limiting example, at least one of a mercaptosilane coupling agent, an aminosilane coupling agent, an epoxy silane coupling agent, a ureidosilane coupling agent, an isocyanate silane coupling agent, a vinyl silane coupling agent, an acryl silane coupling agent and a ketimine silane coupling agent And may include at least one, and preferably, a mercaptosilane coupling agent.

The mercaptosilane coupling agent is not particularly limited and may include, for example, 3-mercaptopropyl trimethoxysilane (trade name: KBM-803, manufactured by Shinetsu).

In addition to the above-mentioned materials, the adhesive resin for a dicing die-bonding film according to the present invention may contain a pH adjusting agent, an ion scavenger, a viscosity adjusting agent, a thixotropic agent, an antioxidant, a heat stabilizer, One kind or two kinds or more of various additives such as an absorbent, a colorant, a dehydrating agent, a flame retardant, an antistatic agent, a antifungal agent, a preservative and a solvent may be added.

The pH adjuster is not particularly limited, and examples thereof include an acidic filler such as silica and an alkaline filler such as calcium carbonate. These pH adjusting agents may be used alone or in combination of two or more.

The ion trapping agent is not particularly limited as long as it can reduce the amount of ionic impurities. Examples of the ion trapping agent include aluminosilicate, titanium oxide hydrate, bismuth oxide, zirconium phosphate, titanium phosphate, hydrotalcite , Ammonium molybdophosphate, hexacyano zinc, and organic ion exchange resins. These ion capturing agents may be used alone or in combination of two or more.

Furthermore, the adhesive resin for a dicing die bonding film of the present invention may have a curing density of 50 to 95%.

If the curing density of the adhesive resin for a dicing die bonding film of the present invention is less than 50%, the reliability is deteriorated due to insufficient heat resistance. If the curing density exceeds 95%, the adhesive resin for dicing die bonding film Voids remain after the mold. Therefore, the curing density of the adhesive resin for a dicing die bonding film of the present invention can satisfy the range of 50 to 95%.

On the other hand, the adhesive resin for a dicing die bonding film of the present invention preferably contains 32.0 to 59.0 parts by weight, preferably 37.0 to 54.0 parts by weight, of a polyfunctional epoxy resin relative to 100 parts by weight of the thermoplastic resin when the curing density is 50 to 95% . If the amount of the polyfunctional epoxy resin is less than 32.0 parts by weight based on 100 parts by weight of the thermoplastic resin, the content of the thermosetting portion may be small, resulting in a problem of heat resistance. If the amount of the polyfunctional epoxy resin is more than 59.0 parts by weight, .

The adhesive resin for a dicing die-bonding film of the present invention preferably contains 10.0 to 37.0 parts by weight, preferably 15.0 to 32.0 parts by weight, of the active ester-based curing resin per 100 parts by weight of the thermoplastic resin when the curing density is 50 to 95% . If the amount of the active ester-based curing resin is less than 10.0 parts by weight based on 100 parts by weight of the thermoplastic resin, the amount of the unreacted epoxy resin may increase during the curing process, and the heat resistance may deteriorate. If the amount exceeds 37.0 parts by weight, The voids generated in the die attach may remain after the mold.

On the other hand, the adhesive resin for a dicing die-bonding film of the present invention may contain 10 to 50 parts by weight of an inorganic filler, 1 to 10 parts by weight of a curing accelerator, and 1 to 10 parts by weight of a silane coupling agent based on 100 parts by weight of the thermoplastic resin have.

Furthermore, the present invention provides an adhesive film for a dicing die-bonding film comprising the above-described adhesive resin for a dicing die-bonding film. In other words, the present invention provides an adhesive film for a dicing die-bonding film in which the above-described adhesive resin for a dicing die-bonding film is a film.

Thus, the adhesive film for a dicing die-bonding film of the present invention can have a moisture absorption rate of 0.5% or less when measured based on the following formula (1) when the average thickness of the adhesive film is 800 m.

[Equation 1]

In the above equation 1, W 1 is a weight measured after curing for 2 hours, a specimen cutting the adhesive film to a size of 50mm × 50mm (width × length) at 175 ℃ drying oven, W 2 is the specimen Was measured after standing for 24 hours in a constant temperature and humidity chamber at 85 ° C and 85% relative humidity.

In the adhesive film for a dicing die bonding film of the present invention, when the average thickness of the adhesive film is 100 m, the dielectric constant of the 1 GHz region measured using an impedance measuring device may be 3.15 or less. Specifically, the adhesive film for a dicing die bonding film of the present invention was adhered to a specimen with a thickness of 100 mu m using a roll lamination apparatus, and then the adhesive film for a dicing die bonding film was bonded to the specimen in the range of 1 MHz to 3 GHz using an impedance measuring apparatus "E4991A" (manufactured by Ahilent) The dielectric constant of the 1 GHz region measured by continuously changing the frequency can be 3.15 or less.

In addition, the adhesive film for a dicing die-bonding film of the present invention may have an area change rate of 5% or less when measured based on the following formula (2) when the average thickness of the adhesive film is 20 탆.

&Quot; (2) "

In the formula (2), M is an adhesive film having a thickness of 20 mu m laminated at 60 DEG C on a cover glass of 50 mm x 50 mm x 130 m (width x length x thickness) And Z is an area of the specimen produced by pressing at 120 DEG C and 1.0 kgf pressure for 1 second on a die bonding machine and Z is a moisture absorption treatment of the specimen at 85 DEG C and 85% relative humidity for 48 hours, Lt; RTI ID = 0.0 > C < / RTI > for 30 seconds.

On the other hand, the present invention provides a dicing die-bonding film in which a base layer, a pressure-sensitive adhesive layer and an adhesive layer are sequentially laminated. At this time, the adhesive layer includes the adhesive resin for the dicing die-bonding film described above.

Hereinafter, the dicing die-bonding film of the present invention will be described in detail with reference to FIG.

As shown in Fig. 1, the dicing die bonding film of the present invention has a structure in which a base layer 1, a pressure-sensitive adhesive layer 2, and an adhesive layer 3 are sequentially laminated.

The base layer (1) includes a resin film excellent in heat resistance and chemical resistance, a crosslinked film obtained by crosslinking a resin constituting the resin film, or a film obtained by applying a silicone resin or the like to the surface of the resin film .

The resin constituting the resin film is not particularly limited and examples thereof include polyolefins such as polyester, polyethylene, polypropylene, polybutene and polybutadiene, vinyl chloride, ethylene-methacrylic acid copolymer, ethylene-vinyl acetate copolymer , Polyester, polyimide, polyethylene terephthalate, polyamide, polyurethane and the like can be used.

The pressure-sensitive adhesive layer (2) may include an ultraviolet curable resin film. The pressure-sensitive adhesive layer (2) may have a peeling force of 1.00 N / in or more before ultraviolet irradiation and a peeling force of 0.3 N / in or less after ultraviolet irradiation. If the peeling force of the pressure-sensitive adhesive layer 2 before ultraviolet ray irradiation is less than 1.00 N / in, there may arise a problem that chips are scattered when the wafer is diced into individual chips, and the peeling force after irradiation with ultraviolet rays is 0.3 N / in, there may occur a problem that the chip is not picked up when the chip is picked up after ultraviolet ray irradiation and die-bonded to the semiconductor substrate.

The ultraviolet curable resin film may include at least one of an acrylic acid alkyl ester copolymer, an alkyl ester crosslinking monomer, an isocyanate compound having a radical reactive carbon-carbon double bond, and a photopolymerization initiator.

The acrylic acid alkyl ester copolymer is not limited, but acrylic acid alkyl ester copolymers having a carbon number of 1 to 18, which can be obtained from (meth) acrylic acid ester monomers and (meth) acrylic acid derivatives, Methyl methacrylate, ethyl acrylate, ethyl methacrylate, propyl acrylate, propyl methacrylate, butyl acrylate, butyl methacrylate, and ethylhexyl methacrylate. Particularly, among the monomers represented by the formula CH2 = CHCOOR, 2-ethylhexyl acrylate, isooctyl acrylate, and isonyl acrylate are preferably used.

The alkyl ester crosslinking monomer may be a monomer having a carboxyl group such as carboxylethyl (meth) acrylate, carboxypentyl (meth) acrylate, itaconic acid, maleic acid, fumaric acid, and an acid such as maleic anhydride or itaconic anhydride. (Meth) acrylate such as 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, 4-hydroxybutyl (meth) acrylate, 6-hydroxyhexyl (Meth) acrylate and the like, and acrylamide, acrylonitrile and the like, and these monomer-containing monomer components may be used in combination with one or more kinds of monomers Or two or more of them may be used in combination. Particularly, a hydroxyl group-containing monomer such as hydroxyethyl acrylate is preferable in that the adhesion with the adherend and the tackiness are easy to control.

If the pressure-sensitive adhesive layer (2) of the present invention contains both the acrylic acid alkyl ester copolymer and the alkyl ester crosslinking monomer, the blending ratio thereof is preferably 5 to 40 parts by weight of the alkyl ester crosslinking monomer per 100 parts by weight of the acrylic acid alkyl ester Do.

The isocyanate compound having a radical reactive carbon-carbon double bond is selected from the group consisting of methacryloyl isocyanate, 2-methacryloyloxyethyl isocyanate, 2-acryloyloxyethyl isocyanate, m-isopropenyl- Isocyanate and isocyanate.

If the pressure sensitive adhesive layer (2) of the present invention contains an isocyanate compound having a radical reactive carbon-carbon double bond, it may contain 1 to 10 parts by weight based on 100 parts by weight of the alkyl acrylate.

The photopolymerization initiator has a function of decomposing free radicals which can cause an addition reaction between carbon-carbon double bond groups in the pressure-sensitive adhesive layer (2) upon irradiation with ultraviolet rays. This can lead to efficient photocuring even with a small amount of ultraviolet radiation.

The photopolymerization initiator may be any of those which are activated by irradiation with light having a wavelength of 250 to 800 nm, and they may be used alone or in combination of two or more. Benzoin methyl ether, benzoin ethyl ether, benzoin isopropyl ether, benzoin isobutyl ether, benzoin benzoic acid, benzoin methyl benzoate, benzoin dimethyl ketal, 2, At least one of 4-diethyl thioxanthone, hydroxycyclohexyl phenyl ketone, benzyl diphenyl sulfide, tetramethyl thiuram monosulfide, azobisisobutyronitrile, benzyl, dibenzyl, diacetyl and? -Chloroanthraquinone Or more species.

If the pressure-sensitive adhesive layer (2) of the present invention contains a photopolymerization initiator, it may contain 0.3 to 8 parts by weight based on 100 parts by weight of the alkyl acrylate.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is to be understood that the invention is not limited to the disclosed exemplary embodiments. It will be understood that various changes and modifications may be made without departing from the scope of the present invention. For example, each component specifically illustrated in the embodiments of the present invention can be modified and implemented. It is to be understood that all changes and modifications that come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein.

The present invention will now be described more specifically with reference to the following examples. However, the following examples should not be construed as limiting the scope of the present invention, and should be construed to facilitate understanding of the present invention.

Example

Example 1

(1) Production of adhesive layer

423 g of 2-ethylhexyl acrylate (hereinafter sometimes referred to as " 2EHA "), 2-hydroxyethyl acrylate (hereinafter referred to as " HEA " ) And 344 g of toluene were charged, and polymerization was carried out in a nitrogen stream at 61 캜 for 6 hours to obtain an acrylic copolymer A.

127 g of 2-methacryloyloxyethyl isocyanate (hereinafter referred to as " MOI ") was added to the acrylic copolymer A, and an addition reaction was carried out in an air stream at 50 DEG C for 48 hours to obtain an acrylic polymer A '.

Next, 5 g of a polyisocyanate compound (trade name: Colonate L, manufactured by Nippon Polyurethane Industry Co., Ltd.) and 5 g of a photopolymerization initiator (trade name: IRUGACURE 651, manufactured by Chiba Specialty Chemical Co., Manufactured by Ciba Specialty Chemicals) and 13 ml of ethyl acetate were added to prepare 120 ml of ultraviolet curable pressure sensitive adhesive solution.

The pressure-sensitive adhesive solution prepared above was coated on one side of a silicone-treated polyethylene terephthalate (PET) film having a thickness of 36 탆 and then heated and crosslinked at 120 캜 for 2 minutes to form an ultraviolet curable pressure-sensitive adhesive layer having a thickness of 10 탆 .

Next, a polyolefin-based film having a thickness of 100 m prepared in advance was transcribed and coated to prepare a UV-curable resin film.

(2) Production of adhesive layer

Epoxy resin 2-cresol novolac epoxy (Kukdo Chemical, YDCN-500-5P), epoxy resin 3-cresol novolac epoxy (epoxy resin) YDCN-500-90P) were mixed and prepared.

(Nagase Chemtech, SG-P3), an active ester-based curing resin (DIC, HPC-800-65T), an inorganic filler (an electrochemical 3-mercaptopropyl trimethoxysilane (Shinetsu, KBM Co., Ltd., SFP-30M, average particle diameter 0.7 μm), a curing accelerator (Shikoku Chemicals, Kyowazol 2PZ-CN) and a silane coupling agent -803) were mixed to prepare a mixed solution.

The mixed solution was prepared by mixing 11.49 parts by weight of the epoxy resin 1, 20.30 parts by weight of the epoxy resin 2, 6.51 parts by weight of the epoxy resin 3, 31.02 parts by weight of the active ester curing resin, , 2.04 parts by weight of the curing accelerator, and 2.04 parts by weight of the silane coupling agent.

The thus prepared mixed solution was coated on a polyester film subjected to a release treatment, and then the mixed solvent was dried and removed in a hot-air dryer at 140 ° C for 5 minutes to form a 20 μm thick B-stage dicing die- A film was prepared.

(3) Production of dicing die-bonding film

The adhesive layer and the adhesive layer thus prepared were attached to each other to produce a dicing die-bonding film.

Example  2 to 5 and Comparative Example  1-3

In Examples 2 to 5 and Comparative Examples 1 to 3, a dicing die-bonding film was produced in the same manner as in Example 1 above. However, as shown in Table 1 below, a polyfunctional epoxy resin, a thermoplastic resin, a curing resin, an inorganic filler, a curing accelerator, and a silane coupling agent were mixed to produce an adhesive layer.

Example
One Example
2 Example
3 Example
4 Example
5 Comparative Example
One Comparative Example
2 Comparative Example
3 Epoxy resin 1
(Parts by weight) 11.49 13.53 13.12 14.61 8.16 15.06 14.49 12.96 Epoxy resin 2
(Parts by weight) 20.30 23.90 23.18 25.81 14.42 26.61 25.60 22.89 Epoxy resin 3
(Parts by weight) 6.51 7.67 7.44 8.28 4.63 8.53 8.21 7.34 Cured resin 1
(Parts by weight) 31.02 - - - - - - - Cured resin 2
(Parts by weight) - 24.29 - - - - - - Cured resin 3
(Parts by weight) - - 25.71 - - - - - Cured resin 4
(Parts by weight) - - - 20.61 - - - - Cured resin 5
(Parts by weight) - - - - 42.24 - - - Cured resin 6
(Parts by weight) - - - - - 19.08 - - Cured resin 7
(Parts by weight) - - - - - - 21.02 - Cured resin 8
(Parts by weight) - - - - - - - 26.12 Thermoplastic resin
(Parts by weight) 100 100 100 100 100 100 100 100 Inorganic filler
(Parts by weight) 30.61 30.61 30.61 30.61 30.61 30.61 30.61 30.61 Hardening accelerator
(Parts by weight) 2.04 2.04 2.04 2.04 2.04 2.04 2.04 2.04 Silane coupling agent
(Parts by weight) 2.04 2.04 2.04 2.04 2.04 2.04 2.04 2.04

Epoxy resin 1: Bisphenol A epoxy (Kukdo Chemical, YD-011)

Epoxy resin 2: Cresol novolak epoxy (Kukdo Chemical, YDCN-500-5P)

Epoxy resin 3: Cresol novolak epoxy (Kukdo Chemical, YDCN-500-90P)

Curing resin 1: Active ester-based curing resin (DIC, HPC-8000-65T, ester group equivalent: 223 g / eq)

Curing resin 2: Active ester-based curing resin (DMI, EC-298, ester group equivalent: 149 g / eq)

Curing resin 3: Active ester-based curing resin (DMI, EC-326, ester group equivalent: 163 g / eq)

Curing resin 4: Active ester-based curing resin (DMI, EC-234, ester group equivalent: 117 g / eq)

Curing resin 5: Active ester-based curing resin (DMI, EC-861, ester group equivalent: 430 g / eq)

Curing resin 6: phenol novolak phenol resin (DIC, TD2090, hydroxyl equivalent: 163 g / eq)

Curing resin 7: cresol novolak phenol resin (Kolon emulsion, KCE-F2100, hydroxyl equivalent weight: 120 g / eq)

Curing resin 8: Acid anhydride resin (Hitachi Chemical, HN-5500E, equivalent: 168 g / eq)

Thermoplastic resin: acrylic copolymer resin containing an epoxy group (Nagase Chemtech, SG-P3, weight average molecular weight (Mw): 850,000, glass transition temperature: 12 캜)

Inorganic filler: spherical silica (SFP-30M, average particle size: 0.7 mu m)

Curing accelerator: Imidazole-based curing accelerator (CQ-2PZ-CN, Shikoku Kasei)

Silane coupling agent: 3-mercaptopropyl trimethoxysilane (Shinetsu, KBM-803)

Experimental Example  One

The dicing die-bonding films produced in the above Examples and Comparative Examples were evaluated based on the following physical property evaluation methods, and the results are shown in Table 2.

(1) 180 degree peel strength measurement

As shown in Fig. 1, the dicing die bonding films of Examples 1 to 5 and Comparative Examples 1 to 3, in which the base layer 1, the pressure-sensitive adhesive layer 2 and the adhesive layer 3 were sequentially laminated, (# 2300 grinding processed with a DFD-840 grinding machine manufactured by DISCO Corporation) was placed on a hot plate at 60 ° C, and then a silicon wafer having a thickness of 500 μm was placed thereon. The lamination of the dicing die bonding films of Comparative Examples 1 to 3 and the backside of the wafer was performed using a roll lamination equipment under the conditions of a roll pressure of 2000 g / cm and a roll moving speed of 1 m / min to prepare specimens. The prepared specimen was allowed to stand at 23 DEG C for 30 minutes, and then the base layer (1) and the pressure-sensitive adhesive layer (2) were peeled off to measure the peel strength before ultraviolet irradiation.

The peel strength was measured after irradiation with ultraviolet light of 200 mJ / cm ² intensity in the side direction of the substrate layer 1 and then peeling off.

(2) Pickup property

A silicon wafer having a diameter of 8 inches was polished so as to have a thickness of 100 占 퐉 and then subjected to a mirror-finished wafer. Thereafter, the adhesive films for the dicing die bonding films of Examples 1 to 5 and Comparative Examples 1 to 3 and the mirror-finished wafers were subjected to roll lamination at 60 ° C and full-cut dicing (discoloration) in 9 mm x 12 mm Ltd., DFD-651 dicing machine) to prepare specimens. The prepared specimens were picked up using a die bonding machine (Shinagawa, SPA-300 Super). At this time, the pick-up property evaluation standard is as follows.

○: 100% can be picked up and the number of retries is less than 20%

△: 90 ~ 100% can be picked up and the number of retries is 20% or more

X: 90% or less pickup performance

(3) Substrate filling property

The adhesive films for dicing die bonding films of Examples 1 to 5 and Comparative Examples 1 to 3, each of which was cut into a size of 10 mm x 10 mm x 20 m (width x length x thickness), were laminated in a cover glass having a thickness of 130 mu m using a laminator at 60 DEG C , And then pressed on a printed wiring circuit board (PCB) at 120 DEG C and 10 kgf pressure for 1 second using a die bonding machine to prepare a specimen. After that, the amount of the flow of the specimen between the PCB circuit patterns was calculated using a microscope to confirm the filling property. At this time, criteria for evaluation of the substrate filling property are as follows.

○: Circuit pattern filling property 60% or more

B: Circuit pattern filling property 20 to 60%

X: circuit pattern fillability less than 20%

(4) Absorption rate

Adhesive films for dicing die bonding films of Examples 1 to 5 and Comparative Examples 1 to 3 having a thickness of 20 占 퐉 were adhered to each other with a thickness of 800 占 퐉 using a roll lamination equipment and then cut into a size of 50 mm 占 50 mm Create a sample. The specimens were cured in a 175 ° C drying oven for 2 hours and the weight ( W 1) was measured. The specimens were allowed to stand in a thermo-hygrostat at 85 ° C and 85% relative humidity for 24 hours, and the weight ( W 2) was measured. The moisture absorption rate was measured using the following equation (1).

[Equation 1]

(5) Permittivity

The adhesive films for dicing die bonding films of Examples 1 to 5 and Comparative Examples 1 to 3, each having a thickness of 20 mu m, were adhered to a thickness of 100 mu m using a roll lamination equipment, and the specimens were measured with an impedance measuring apparatus (Agilent, E4991A) , The dielectric constant of the 1 GHz region was measured by continuously changing the frequency in the range of 1 MHz to 3 GHz.

(6) Heat resistance

The adhesive films for dicing die bonding films of Examples 1 to 5 and Comparative Examples 1 to 3 cut into 10 mm x 10 mm x 20 m (width x length x thickness) were cut into a size of 50 mm x 50 mm x 130 m (width x length x thickness) Was laminated to a cover glass at 60 ° C using a laminator, and then pressed on a printed wiring circuit board (PCB) at 120 ° C under a pressure of 10 kgf for 1 second using a die bonding machine to prepare a specimen. The specimens were cured at 175 ° C. for 2 hours, immersed in a 260 ° C. bath (see FIG. 2) for 30 seconds, and the heat resistance before moisture absorption was measured through a microscope. The specimens were cured at 175 ° C for 2 hours, then allowed to stand at 85 ° C and 85% relative humidity for 48 hours, and then immersed in a 260 ° C water bath for 30 seconds to measure heat resistance after moisture absorption. At this time, the evaluation criteria of heat resistance are as follows.

○: The bubble formation and interfacial peeling area is 5% or less of the specimen area

?: Bubble formation and interface delamination area are 5% to 30%

X: 30% or more of bubble formation and interface delamination area

Example
One Example
2 Example
3 Example
4 180 ° Peel Strength
(N / inch) Ultraviolet ray dictionary 2.10 2.08 2.15 2.75 After UV irradiation 0.16 0.17 0.18 0.23 Pickup ○ ○ ○ △ Substrate filling property ○ ○ ○ ○ Moisture absorption rate (%) 0.39 0.47 0.45 0.47 Dielectric constant (1 GHz) 3.01 3.07 3.05 3.06 Heat resistance
Before moisture absorption ○ ○ ○ ○ After moisture absorption ○ ○ ○ ○ Example
5 Comparative Example
One Comparative Example
2 Comparative Example
3 180 ° Peel Strength
(N / inch) Ultraviolet ray dictionary 2.12 2.01 2.21 2.35 After UV irradiation 0.16 0.16 0.19 0.21 Pickup ○ ○ ○ △ Substrate filling property ○ ○ ○ ○ Moisture absorption rate (%) 0.38 1.25 1.42 1.98 Dielectric constant (1 GHz) 2.98 3.34 3.32 3.35 Heat resistance
Before moisture absorption ○ ○ ○ △ After moisture absorption ○ △ △ X

Referring to Table 2, it can be seen that the dicing die-bonding film produced in the Example is superior in pick-up property, substrate sticking property, and heat resistance, compared with the dicing die film produced in Comparative Example.

On the other hand, it was confirmed that the dicing die-bonding films produced in Examples 1 to 3 had better pick-up properties and 180-degree peel strength than the dicing die-bonding films produced in Example 4, It was confirmed that the substrate filling property was superior to the die bonding film.

While the present invention has been described in connection with what is presently considered to be practical exemplary embodiments, it is to be understood that the invention is not limited to the disclosed embodiments, but, on the contrary, Do.

Claims (14)

delete 32.0 to 59.0 parts by weight of a polyfunctional epoxy resin and 10.0 to 37.0 parts by weight of an active ester-based cured resin, based on 100 parts by weight of a thermoplastic resin,
The active ester-based cured resin includes a compound having a repeating unit represented by the following formula (2)
The active ester-based curing resin preferably has an ester equivalent of 130 to 300 g / eq,
Wherein the polyfunctional epoxy resin includes at least two or more kinds of bisphenol-based epoxy resins and cresol novolak-based epoxy resins,
The thermoplastic resin

,

,

,

And

Of an acrylic copolymer resin obtained by copolymerizing monomers of
The acrylic copolymer resin has a weight average molecular weight of 400,000 to 1,200,000,
Wherein the adhesive resin for a dicing die-bonding film has a curing density of 50% to 95%;
(2)

In Formula 2, R < ₃ >

,

,

,

And R ₄ is a benzene group, a C ₁ to C ₁₀ alkyl group, a C ₆ to C ₁₀ aryl group or a C ₇ to C ₁₀ aralkyl group, or A C ₁ to C ₁₀ alkenyl group, and n is a rational number satisfying 1? N? 10.

delete delete 3. The method of claim 2,
The thermoplastic resin

For one mole,

0.01 to 4.0 moles,

0.5 to 3.5 moles,

1.0 to 15.0 moles and

0.01 to 20 moles of an acrylic copolymer resin,
Wherein the acrylic copolymer resin satisfies a glass transition temperature of -12 占 폚 to 32 占 폚.
delete 3. The method of claim 2,
An inorganic filler, a hardening accelerator, and a silane coupling agent,
Wherein the inorganic filler comprises at least one of silica, clay, gypsum, calcium carbonate, barium sulfate, alumina oxide, barium oxide, silicon carbide and silicon nitride,
Wherein the curing accelerator comprises an imidazole-based curing accelerator or a tertiary amine-based curing accelerator,
The silane coupling agent may be at least one of a mercaptosilane coupling agent, an aminosilane coupling agent, an epoxy silane coupling agent, a ureidosilane coupling agent, an isocyanate silane coupling agent, a vinyl silane coupling agent, an acryl silane coupling agent and a ketimine silane coupling agent And the adhesive resin for a dicing die-bonding film.
delete delete An adhesive resin for a dicing die-bonding film according to any one of claims 2, 5 and 7,
When the average thickness of the adhesive film is 800 占 퐉, the moisture absorption rate is 0.45 to 0.5% by weight based on the following formula (1)
An adhesive film for a dicing die-bonding film characterized in that a dielectric constant in a 1 GHz region measured using an impedance measuring device is 3.05 to 3.15 when an average thickness of the adhesive film is 100 m;
[Equation 1]

In the above equation 1, W 1 is a weight measured after curing for 2 hours, a specimen cutting the adhesive film to a size of 50mm × 50mm (width × length) at 175 ℃ drying oven, W 2 is the specimen Was measured after standing for 24 hours in a constant temperature and humidity chamber at 85 ° C and 85% relative humidity.
delete delete 11. The method of claim 10,
An adhesive film for a dicing die-bonding film characterized in that when the average thickness of the adhesive film is 20 占 퐉, the rate of area change when measured based on the following formula (2) is 5% or less;
&Quot; (2) "

In the formula (2), M is an adhesive film having a thickness of 20 mu m laminated at 60 DEG C on a cover glass of 50 mm x 50 mm x 130 m (width x length x thickness) And Z is an area of the specimen produced by pressing at 120 DEG C and 1.0 kgf pressure for 1 second on a die bonding machine and Z is a moisture absorption treatment of the specimen at 85 DEG C and 85% relative humidity for 48 hours, Lt; 0 > C for 30 seconds.
A dicing die-bonding film in which a base layer, a pressure-sensitive adhesive layer, and an adhesive layer are sequentially laminated,
Wherein the adhesive layer comprises an adhesive resin for a dicing die-bonding film according to any one of claims 2, 5 and 7.

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