KR101577370B1 - 마이크로웨이브 필터 - Google Patents

마이크로웨이브 필터 Download PDF

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Publication number
KR101577370B1
KR101577370B1 KR1020127003903A KR20127003903A KR101577370B1 KR 101577370 B1 KR101577370 B1 KR 101577370B1 KR 1020127003903 A KR1020127003903 A KR 1020127003903A KR 20127003903 A KR20127003903 A KR 20127003903A KR 101577370 B1 KR101577370 B1 KR 101577370B1
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KR
South Korea
Prior art keywords
connector
ground
filter unit
ground plane
end portion
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KR1020127003903A
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English (en)
Korean (ko)
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KR20120051012A (ko
Inventor
한스-올로프 비키스
시몬 크리스티안손
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사브 에이비
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Publication of KR20120051012A publication Critical patent/KR20120051012A/ko
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/025—Impedance arrangements, e.g. impedance matching, reduction of parasitic impedance
    • H05K1/0251—Impedance arrangements, e.g. impedance matching, reduction of parasitic impedance related to vias or transitions between vias and transmission lines
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistors, capacitors or inductors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P1/00—Auxiliary devices
    • H01P1/20—Frequency-selective devices, e.g. filters
    • H01P1/201—Filters for transverse electromagnetic waves
    • H01P1/203—Strip line filters
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P1/00—Auxiliary devices
    • H01P1/20—Frequency-selective devices, e.g. filters
    • H01P1/201—Filters for transverse electromagnetic waves
    • H01P1/203—Strip line filters
    • H01P1/20327—Electromagnetic interstage coupling
    • H01P1/20354—Non-comb or non-interdigital filters
    • H01P1/20372—Hairpin resonators
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P5/00—Coupling devices of the waveguide type
    • H01P5/02—Coupling devices of the waveguide type with invariable factor of coupling
    • H01P5/022—Transitions between lines of the same kind and shape, but with different dimensions
    • H01P5/028—Transitions between lines of the same kind and shape, but with different dimensions between strip lines
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H05K1/0219—Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors
    • H05K1/0222—Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors for shielding around a single via or around a group of vias, e.g. coaxial vias or vias surrounded by a grounded via fence
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H05K1/0224—Patterned shielding planes, ground planes or power planes
    • H05K1/0227—Split or nearly split shielding or ground planes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/0239—Signal transmission by AC coupling
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09609—Via grid, i.e. two-dimensional array of vias or holes in a single plane
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/0979—Redundant conductors or connections, i.e. more than one current path between two points

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  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Control Of Motors That Do Not Use Commutators (AREA)
KR1020127003903A 2009-07-14 2009-07-14 마이크로웨이브 필터 Active KR101577370B1 (ko)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/SE2009/050899 WO2011008142A1 (en) 2009-07-14 2009-07-14 Microwave filter

Publications (2)

Publication Number Publication Date
KR20120051012A KR20120051012A (ko) 2012-05-21
KR101577370B1 true KR101577370B1 (ko) 2015-12-14

Family

ID=43449578

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020127003903A Active KR101577370B1 (ko) 2009-07-14 2009-07-14 마이크로웨이브 필터

Country Status (5)

Country Link
US (1) US20120182093A1 (enExample)
EP (1) EP2454781A4 (enExample)
KR (1) KR101577370B1 (enExample)
IN (1) IN2012DN00266A (enExample)
WO (1) WO2011008142A1 (enExample)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2977382A1 (fr) * 2011-06-29 2013-01-04 Thomson Licensing Filtre stop bande a rejection elevee et duplexeur utilisant de tels filtres
FR2999813B1 (fr) * 2012-12-14 2017-07-14 Cassidian Sas Structures de filtrage hyperfrequence
CN117199748A (zh) * 2019-02-28 2023-12-08 京瓷Avx元器件公司 高频、可表面安装的微带带通滤波器
CN112074988A (zh) 2019-04-10 2020-12-11 法国圣戈班玻璃厂 具有天线的运载工具玻璃板
EP3879624B1 (en) 2020-03-11 2022-03-23 Schleifring GmbH Stripline connections
US11373965B2 (en) 2020-07-17 2022-06-28 Northrop Grumman Systems Corporation Channelized filter using semiconductor fabrication
EP4208746A1 (en) * 2020-09-03 2023-07-12 Telefonaktiebolaget LM Ericsson (publ) Printed circuit board to printed circuit board radio frequency interface
US12004288B2 (en) * 2021-02-25 2024-06-04 Teradyne, Inc. Resonant-coupled transmission line

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007089000A (ja) 2005-09-26 2007-04-05 Alps Electric Co Ltd ストリップラインフィルタ

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE6948645U (de) * 1969-12-17 1970-05-14 Saba Gmbh Mehrkreisiges bandfilter fuer fernseh- und rundfunkempfaenger.
US3668569A (en) * 1970-05-27 1972-06-06 Hazeltine Corp Distributed-constant dispersive network
US4701727A (en) * 1984-11-28 1987-10-20 General Dynamics, Pomona Division Stripline tapped-line hairpin filter
DE4135435A1 (de) * 1991-10-26 1993-04-29 Aeg Mobile Communication Kammleitungsfilter
GB2288286A (en) * 1994-03-30 1995-10-11 Plessey Semiconductors Ltd Ball grid array arrangement
JP3406830B2 (ja) * 1998-03-06 2003-05-19 京セラ株式会社 高周波用電子装置
JP2001060802A (ja) * 1999-08-19 2001-03-06 Sony Corp 回路素子基板と半導体装置及びその製造方法
WO2001052325A1 (en) * 2000-01-13 2001-07-19 Alpha Industries, Inc. Microwave ic package with dual mode wave guide
US6617943B1 (en) * 2001-07-27 2003-09-09 Applied Micro Circuits Corporation Package substrate interconnect layout for providing bandpass/lowpass filtering
US6483404B1 (en) * 2001-08-20 2002-11-19 Xytrans, Inc. Millimeter wave filter for surface mount applications
US6700464B2 (en) * 2002-02-21 2004-03-02 Intel Corporation Low cost high speed board-to-board coaxial connector design with co-planar waveguide for PCB launch
DE10305855A1 (de) * 2003-02-13 2004-08-26 Robert Bosch Gmbh HF-Multilayer-Platine
US6791403B1 (en) * 2003-03-19 2004-09-14 Raytheon Company Miniature RF stripline linear phase filters
US7187256B2 (en) * 2004-02-19 2007-03-06 Hittite Microwave Corporation RF package
US20080100394A1 (en) * 2004-06-30 2008-05-01 Emag Technologies, Inc. Microstrip to Coplanar Waveguide Transition
US20060226928A1 (en) * 2005-04-08 2006-10-12 Henning Larry C Ball coax interconnect
US7724109B2 (en) * 2005-11-17 2010-05-25 Cts Corporation Ball grid array filter
US7405477B1 (en) * 2005-12-01 2008-07-29 Altera Corporation Ball grid array package-to-board interconnect co-design apparatus

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007089000A (ja) 2005-09-26 2007-04-05 Alps Electric Co Ltd ストリップラインフィルタ

Also Published As

Publication number Publication date
IN2012DN00266A (enExample) 2015-08-21
KR20120051012A (ko) 2012-05-21
US20120182093A1 (en) 2012-07-19
WO2011008142A1 (en) 2011-01-20
EP2454781A1 (en) 2012-05-23
EP2454781A4 (en) 2013-01-16

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