KR101559760B1

KR101559760B1 - A SILICON INJECTION MOLD AND METHOD OF FORMING Of NANO PATTERN

Info

Publication number: KR101559760B1
Application number: KR1020150049909A
Authority: KR
Inventors: 배남호; 이경균; 이석재; 이태재
Original assignee: 한국과학기술원
Priority date: 2015-04-08
Filing date: 2015-04-08
Publication date: 2015-10-15

Abstract

One embodiment of the present invention relates to an injection mold for implementing a nano pattern on a silicon substrate and a method of manufacturing the same, and a buffer member is attached to a silicon wafer as a mold core to prevent breakage of the silicon wafer during mold closing, An injection mold capable of injection molding a film having a suitable nano pattern and an injection molding method thereof. According to an injection mold according to an embodiment of the present invention, a silicon substrate having a nano pattern can be realized, and a process of manufacturing a separate metal stamp is omitted through a method of directly patterning the silicon wafer, which is the mold core, An injection mold for nano pattern formation is provided which can simplify the process and reduce the cost.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a method of forming an injection mold and a nano-

The present invention relates to a manufacturing method of an injection mold and a method of forming a nano pattern using the same. More particularly, the present invention relates to a method of manufacturing an injection mold by using a mold such as a silicon wafer, a quartz substrate or a glass substrate, The present invention relates to an injection mold and a nano pattern forming method for manufacturing a silicon substrate, which can realize a nano pattern by using an injection mold equipped with the mold core.

In general, plastic injection molding is a method of molding a plastic material in a cavity formed between two molds which are closed to form a product. The injection molding machine includes an injection unit and a clamping unit Unit).

The injection apparatus has a cylinder, and the solid plastic particles transferred into the cylinder are melted and transferred to the front of the cylinder. When the transfer is completed, the plastic solution transferred to the cylinder is passed through the nozzle at a high pressure into the mold.

A mold used for injection molding is a fixed side mold attached to a fixing plate of a mold clamping apparatus and a movable side mold attached to a moving plate of a mold clamping apparatus. When these two molds are engraved with each other, they form a cavity having a shape of the product. The molten resin is filled in the cavity, and the plastic is solidified by the temperature of the mold, thereby making a plastic product.

KOKAI Publication No. 2000-0009059 discloses an injection mold for an optical disc substrate, which comprises a movable side mold plate and a fixed side mold plate, which are mutually combined to form a substrate molding cavity for an optical disc therebetween by a cavity ring, The present invention provides an injection mold for an optical disc substrate characterized in that the substrate molding cavity is provided with an inclined surface for gradually narrowing its width from the inner peripheral portion to the outer peripheral portion. In another aspect of the present invention, the inside of the specular surface of the movable-side template or the specular surface of the fixed-side template is inclined to be inclined from the inner circumferential portion toward the outer circumferential portion so that the width gradually narrows from the inner peripheral portion to the outer peripheral portion of the cavity And to provide an injection mold for a substrate for an optical disc. However, in the present invention, a mold core to which a silicon wafer (Si wafer) is applied is used to fabricate a silicon substrate, and the mold core is prevented from being broken due to the impact mitigation and the mold-clamping force dispersion effect by the buffer member during the mold- In addition, in the production of a nano-patterned silicon substrate, the manufacturing process of the metal stamp is omitted by a method of directly patterning and injecting the mold core, thereby simplifying the injection process and reducing the cost. It is different.

In order to solve the above problems, the present invention has been made in view of the fact that it is difficult to realize a nanopattern in a general plastic injection molding, and thus a liquid silicone with good flowability is manufactured and a nanopattern .

According to an aspect of the present invention, there is provided a mold comprising: a plate-shaped mold core; a first buffer member attached to one surface of the plate-shaped mold core; a plate-shaped mold cavity; And a mold plate for mounting the plate mold cavity, wherein the plate mold core is made of a silicon wafer having a nano pattern, crystalline quartz, or an amorphous glass substrate Provide an injection mold.

An embodiment of the present invention provides a mold clamping apparatus comprising a mold clamping apparatus including an injection mold having a movable side mold plate for mounting a plate mold core and a fixed side mold plate for mounting a plate mold cavity, And a vacuum suction pump for performing deaeration during the injection process from the mold clamping apparatus.

A method of manufacturing a silicon substrate using an injection mold according to an embodiment of the present invention includes the steps of: (1) preparing an injection mold including a plate-shaped mold core having a silicon wafer having a nano pattern; (2) (S20) of moving the side molds toward the fixed side molds to bring the first cushioning members of the mold cores into contact with the mold cavities; and 3) molding the liquid silicone rubber in the mold cores separated by the cushioning members, (S30) injecting the molten resin into a space between the cavities to perform an injection process and cooling the molten resin; and 4) a mold opening step (S40) in which the movable mold template moves in a direction opposite to the fixed mold template,

5) attaching a silicon substrate between the mold core and the mold cavity (S50). [5] The method of manufacturing a silicon substrate using an injection mold according to claim 1,

A method of forming a nano pattern using an injection mold according to an embodiment of the present invention includes the steps of: (a) forming a nano pattern on a plate-shaped mold core (S110); (b) (C) a mold closing step (S130) in which the movable side mold plate moves toward the fixed side mold plate so that the cushioning member of the mold core abuts against the mold cavity; and (d) a liquid silicone rubber (S140) of injecting and cooling the mold cavity into the space between the mold core and the mold cavity spaced apart by the buffer member; and (e) a mold opening step (S150) in which the movable mold template moves in a direction opposite to the fixed mold template, . &Lt; / RTI >

According to an embodiment of the present invention, a nano pattern can be realized on a silicon substrate by using liquid silicon having good flowability. At least one of copper (Cu), aluminum (Al), and nickel (Ni) is sandwiched as a soft metal as a buffer member between the silicon wafer used for the injection mold and the mold core and the mold cavity, Can be mitigated.

It should be understood that the effects of the present invention are not limited to the above effects and include all effects that can be deduced from the detailed description of the present invention or the configuration of the invention described in the claims.

1 is a schematic view of a conventional method of manufacturing a nickel stamp.
2 is a front view of a mold core and a buffer member according to an embodiment of the present invention.
3 is a perspective view of a moving side template according to an embodiment of the present invention.
4 is a view schematically showing the principle of mold closing of a mold cavity in which a first buffer member is poured and a second buffer member is poured according to an embodiment of the present invention.
5 is a view showing a liquid silicon injection apparatus according to an embodiment of the present invention.
Fig. 6 is a schematic view showing the shapes (indicated by A in Fig. 5) of the movable side mold plate and the fixed side mold plate constituting the mold clamping apparatus according to the embodiment of the present invention.
FIGS. 7 and 8 are photographs showing shapes of an injection molded article using a silicon wafer stamp and a liquid silicone injector according to an embodiment of the present invention. FIG.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, the present invention will be described with reference to the accompanying drawings. The present invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. In order to clearly illustrate the present invention, parts not related to the description are omitted, and similar parts are denoted by like reference characters throughout the specification.

Throughout the specification, when a part is referred to as being "connected" to another part, it includes not only "directly connected" but also "indirectly connected" . Also, when an element is referred to as "comprising ", it means that it can include other elements, not excluding other elements unless specifically stated otherwise.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.

An injection mold for manufacturing a silicon substrate according to an embodiment of the present invention includes a plate-like mold core 10, a cushioning member 15 padded on one surface of the plate-like mold core 10, And a mold plate for mounting the plate mold cavity 20 facing the mold cavity 20 of the plate mold 10 and the mold plate for mounting the plate mold die 10, A silicon wafer (silicon wafer) formed thereon may be used.

FIG. 1 is a flow chart showing a manufacturing process of a nickel stamp for a conventional injection mold.

1, a desired structure is formed on the surface of a silicon wafer (Si wafer) to produce a silicon master mold, followed by Ni seed coating and electrolytic plating to mount a Ni stamp on the mold base of the injection mold as a mold core. Methods have been applied.

2 is a front view of the mold core and the buffer member of the present invention.

Referring to FIG. 2, the outer surface of the first cushioning member 15 has the same shape as the outer surface of the mold core 10. It can be said that the size is the same as that of the mold core 10. The mold core 10 may include a silicon wafer. In addition, examples of the mold core 10 that can be applied include crystalline quartz or amorphous glass.

In the injection molding using liquid silicon according to an embodiment of the present invention, a nanopattern may be formed on a silicon wafer, crystalline quartz or amorphous glass. In the case of polymer injection molding, it is considered that the injection molding is performed by heating the solid plastic to a high temperature, and the flowability is not good.

The silicon capable of forming the nanopattern may be a liquid silicone rubber. The liquid silicone rubber may include a base and a curing agent.

Silicone rubber can be categorized into two types, one for high temperature curing to be cured and a room temperature curing for curing at room temperature, depending on the curing temperature. Recently, as the liquid silicone rubber using the addition reaction has been commercialized, it has become impossible to classify silicon only by the conventional curing temperature. Accordingly, the silicone rubber can be classified into a high consistency rubber (HCR), a liquid silicone rubber (LSR) and a room temperature curable silicone rubber.

Such a liquid silicone rubber refers to a silicone rubber cured from a liquid silicone compound. Liquid silicone compounds can be made primarily from silicone polymers and dry silica. Silicone polymer and dry silica are both non-toxic and thermally stable. Such general purpose liquid silicone rubber is a two-liquid type liquid silicone rubber which can be used by mixing a base and a curing agent at a weight ratio of 1: 1. Since such a two-part liquid silicone rubber is a mixture of a base and a curing agent, it is necessary to control the flow rate of the two curing agents and the base material with a flow rate controller.

Such a liquid silicone rubber has a higher curing speed than the mirrorblazed silicone rubber, and the curing speed can be controlled by the temperature. In addition, the liquid silicone rubber is excellent in mold releasability.

Particularly, the liquid silicone rubber is advantageous for realizing the nanopattern since flowability is good.

However, despite these merits, the silicon wafer is vulnerable to impact and is broken at the mold closing stage of the silicon injection process.

Therefore, in order to compensate for such weakness, it may be necessary to pad the mold core 10 with the shock absorbing cushioning member 15.

The movable side template 30 and the fixed side template 40 may be required to injection-mold the liquid silicon as described above.

3 is a perspective view of a moving side template according to an embodiment of the present invention.

Referring to FIG. 3, a mold core 10 having a first cushioning member 15 padded thereon may be mounted on the moving side template 30. Although not shown, the mold core 10 may have a state in which a nano pattern is formed. The fine patterning of the mold core 10 may be performed by a semiconductor process such as photolithography, E-beam lithography, or laser lithography.

A mold cavity 20 in which the first buffer member 15 faces the poured mold core 10 (silicon wafer) can be prepared. The mold cavity 20 may have a shape attached to the fixed side mold plate 40.

The second buffer member 25 may be poured into the mold cavity 20. [

4 is a view schematically showing the principle of mold closing of a mold cavity in which a first buffer member is poured and a second buffer member is poured according to an embodiment of the present invention.

4, a space may be formed between the movable side mold half plate 30 and the fixed side mold half plate 40 as the movable side mold half 30 approaches the fixed side mold half 40. As shown in FIG. The space may be a mounting space for injection molding.

When the mold core 10 included in the movable side template 30 and the mold cavity 25 included in the fixed side template 40 approach the first cushioning member 15 and the second cushioning member 25 Can reach. The mold core 10 may have a quadrangular shape and the first buffer member 15 may have a chamfered shape with four corners.

The mold cavity 20 may have a rectangular shape and the second buffer member 25 may have a chamfered shape with four corners.

The first and second buffer members 15 and 25 may be at least one of copper (Cu), aluminum (Al), and nickel (Ni) as a soft metal. As shown in FIG. 4, the molten liquid silicone is prevented from leaking as the first cushioning member 15 of the mold core 10 and the second cushioning member 25 of the mold cavity 20 come into contact with each other can do.

5 is a view showing a liquid silicon injection apparatus according to an embodiment of the present invention.

5, the liquid silicon injection apparatus may include an injection apparatus 200, a mold clamping apparatus 100, a vacuum pump 400, and liquid supply apparatuses 50 and 51. [

The mold clamping apparatus 100 may include a movable side template 30 having upper and lower portions and a fixed side template 40 fixed to a lower side support plate 500. On the upper side of the moving side template 30, a nozzle 52 to which the liquid silicone rubber and the curing agent are supplied from the liquid supply devices 50 and 51 may be formed. As described above, the liquid silicone rubber may contain a base and a curing agent. The subject may include a platinum catalyst. The curing agent may include an inhibitor.

The base and the curing agent may be supplied in a weight ratio of 1: 1. A metering pump 150 may be provided between the liquid supply devices 50 and 51 and the mold clamping device 100 for controlling the flow rate of the liquid curable liquid. A vacuum pump 400 may be included to assist in degassing (venting) during the dispensing of the base and curing agent.

Particularly, in the injection molding using the liquid silicone rubber, it is very important to degas when the movable side mold half plate 30 and the fixed side mold half 40 are mold-closed.

The temperature of the liquid silicon injection process may be 150-200 deg. Side surfaces of the liquid supply devices 50 and 51 capable of supplying the liquid silicone rubber may include a chiller 170 to help cool the injection molding.

Fig. 6 is a schematic view showing the shapes (indicated by A in Fig. 5) of the movable side mold plate and the fixed side mold plate constituting the mold clamping apparatus according to the embodiment of the present invention.

Referring to FIG. 6, the mold core 10 may be mounted on the moving side template 30. The mold cavity 20 may be formed in the fixed side mold plate 40. In Fig. 6, the liquid silicone rubber and the curing agent may be supplied through the nozzle 52. The movable side template plate 30 and the fixed side template plate 40 can be brought into contact with each other in the mold closing step of the liquid silicone rubber. The degassing process using the vacuum pump 400 can proceed after the moving side template 30 and the fixed side template 40 come into contact with each other. The pores can be removed from the silicon substrate on which the nanopattern is formed through the above process.

Hereinafter, a method of manufacturing a silicon substrate using an injection mold according to an embodiment of the present invention will be described in detail.

A method of manufacturing a silicon substrate includes the steps of: (1) preparing an injection mold including a plate-shaped mold core having a silicon wafer having a nano pattern; (2) a step (S10) of moving the template to the fixed side, (S30) of injecting and cooling the liquid silicone rubber into a space between the mold core and the mold cavity separated by the buffer member, and cooling the silicon rubber in the space between the mold cavity and the mold cavity , 4) a mold opening step (S40) in which the moving side mold plate moves in a direction opposite to the fixed side mold plate, and

5) mounting the silicon substrate between the mold core and the mold cavity (S50).

The step of preparing the injection mold may include the step of forming the mold core 10 on one side of the moving side template 30. The mold core 10 may be in a state in which the first buffer member 15 is padded. The mold core 10 can be easily broken because it can include a silicon wafer. As a result of repeated experiments, it was found that breakage of the silicon wafer can be prevented only when a soft metal such as copper (Cu) is used.

Particularly in injection molding using liquid silicon, it may be important to remove pores on the silicon substrate formed through the degassing process.

The silicon substrate formed in the mold closing step S20 of the moving side template 30 and the fixed side template 40 can be cooled through the cooling device 170. [ When the formation of the silicon substrate is completed, the mold opening step S40 of the movable side template 30 and the fixed side template 40 can proceed. The step S50 may be carried out for the silicon molded article which has undergone the embossing step S40 as described above.

FIGS. 7 and 8 are photographs showing shapes of an injection molded article using a silicon wafer stamp and a liquid silicone injector according to an embodiment of the present invention. FIG.

Referring to FIG. 7, it is confirmed that a pattern having a gap of nanometers is formed. By providing the first buffer member 15 on the movable side template 30, the impact applied to the silicon wafer stamp (mold core 10) can be relieved and an injection mold having heat resistance can be provided. FIG. 8 shows an injection molding formed using an injection molding machine according to an embodiment of the present invention. 8, it can be seen that the silicon substrate according to an embodiment of the present invention can have a nano pattern.

If this process is used well, it can be generally applied to the application of nanopatterns. According to an embodiment of the present invention, there is provided a method of forming a nanopattern, comprising: (a) forming a nanopattern on a plate-shaped mold core (S110); (b) (C) a mold closing step (S130) in which the moving side mold plate moves toward the fixed side mold plate and the cushioning member of the mold core abuts against the mold cavity; and (d) (S140) of injecting and cooling the mold cavity into the space between the mold core and the mold cavity spaced apart from each other by a predetermined distance, and (e) a mold opening step (S150) in which the movable mold template moves in a direction opposite to the fixed mold template . Of course, the process described above may be used in a liquid injection molding process, but may be applied to a case having a nanopattern.

A silicon wafer, crystalline quartz, or glass can be used as the mold core 10 that can be applied to the method of forming such a nano pattern.

It will be understood by those skilled in the art that the foregoing description of the present invention is for illustrative purposes only and that those of ordinary skill in the art can readily understand that various changes and modifications may be made without departing from the spirit or essential characteristics of the present invention. will be. It is therefore to be understood that the above-described embodiments are illustrative in all aspects and not restrictive. For example, each component described as a single entity may be distributed and implemented, and components described as being distributed may also be implemented in a combined form.

The scope of the present invention is defined by the appended claims, and all changes or modifications derived from the meaning and scope of the claims and their equivalents should be construed as being included within the scope of the present invention.

10: mold core 15: first buffer member
20: plate-shaped mold cavity 25: second buffer member
30: moving side template 40: fixed side template
50, 51: liquid supply device 52: nozzle
100: mold clamping apparatus 150: metering pump
170: Cooling device 200: Injection device
400: Vacuum pump 500: Support plate
600: Door

Claims

An injection mold for manufacturing a silicon substrate,
A plate-shaped mold core;
A first buffer member padded on one surface of the plate-shaped mold core;
A plate mold cavity; And
A mold plate which faces the mold plate for mounting the plate-shaped mold core, and which mounts the plate mold cavity;
/ RTI >
Wherein the plate-shaped mold core comprises a silicon wafer having a nano pattern, crystalline quartz, or an amorphous glass substrate.

The method according to claim 1,
Wherein the buffer member comprises at least one of copper (Cu), aluminum (Al), and nickel (Ni) as a soft metal.

The method according to claim 1,
Wherein the plate mold cavity further comprises a second buffer member padded on one surface of the mold cavity.

In the liquid silicone injection molding apparatus,
A mold clamping device including an injection mold having a movable side mold plate for mounting a plate mold core and a fixed side mold plate for mounting a plate mold cavity;
A liquid supply device for supplying the liquid silicone rubber to the moving side template; And
And a vacuum suction pump for performing degassing in the injection process from the mold clamping apparatus,
Wherein the plate-like mold core has a cushioning member padded on one surface thereof.

5. The method of claim 4,
Wherein the liquid silicone comprises a base and a curing agent.

6. The method of claim 5,
Characterized in that the subject comprises a platinum catalyst.

delete

5. The method of claim 4,
Wherein the buffer member comprises at least one of copper (Cu), aluminum (Al), and nickel (Ni) as a soft metal.

A manufacturing method of a silicon substrate using an injection mold,
1) preparing an injection mold including a plate-like mold core having a silicon wafer having a nano pattern (S10);
2) a mold closing step (S20) in which the movable side mold plate moves toward the fixed side mold plate and the first buffer member of the mold core abuts against the mold cavity;
3) injecting the liquid silicone rubber into a space between the mold core and the mold cavity separated by the buffer member to perform an injection process and cooling (S30);
4) a mold opening step (S40) in which the moving side mold plate moves in a direction opposite to the fixed side mold plate; And
5) mounting the silicon substrate between the mold core and the mold cavity (S50).

10. The method of claim 9,
In the injection step,
Wherein the temperature of the silicon substrate is in the range of 150 to 200 占 폚.

10. The method of claim 9,
Wherein the outer surface of the buffer member is in the shape of a window having the same shape as that of the mold core and a central portion thereof opened.

12. The method of claim 11,
Wherein the mold core has a quadrangular shape, and the first buffer member has a chamfered shape at four corners.

In a method of forming a nano pattern using silicon injection molding,
(a) forming a nano pattern on a plate-shaped mold core (S110);
(b) attaching a buffer member to the mold core having the nano pattern (S120);
(c) a mold closing step (S130) in which the movable side mold plate moves toward the fixed side mold plate and the buffering member of the mold core abuts against the mold cavity;
(d) injecting and cooling the liquid silicone rubber into a space between the mold core and the mold cavity separated by the buffer member (S140); And
(e) a mold opening step (S150) in which the moving side mold plate moves in a direction opposite to the fixed side mold plate.

14. The method of claim 13,
Wherein the mold core comprises a silicon wafer, glass or crystalline quartz.