KR101551280B1 - A pressure sensor module - Google Patents

Abstract

The pressure sensor module and the pressure sensor module packaging method according to the present invention can reduce manufacturing cost by simplifying the manufacturing process because the constituent parts of the pressure sensor module are greatly reduced, The work efficiency is improved because the operation is simplified because the operation is simple by injecting the epoxy. Similarly, since the sensor portion of the lower PCB and the sensor element of the sensor module base are disposed on the same plane, the bonding operation is simplified, Since the connection part is formed to have a vertical height, it is easy to manufacture and the connection pin of the lower part can be soldered, so that it can be stably operated even in an environment with many vibrations because it has a structure to be secured.

Description

Pressure sensor module and pressure sensor module -

The present invention relates to a pressure sensor module and a method of packaging a pressure sensor module. More specifically, a change value output from a sensor element formed on an upper end of a pressure receiving portion receiving pressure of a sensor module base is transmitted to a lower PCB by wire bonding The components of the pressure sensor module for outputting the transmitted signals to the outside are greatly reduced, which simplifies the manufacturing process and lowers the manufacturing cost. In addition, the fixing operation of the lower PCB to the sensor module base is simplified by simply injecting the epoxy Since the sensor part of the lower PCB and the sensor element of the sensor module base are arranged on the same plane, the bonding operation is simplified and the working efficiency is improved. Also, Is highly structured so that it is easy to manufacture The present invention relates to a method of packaging a pressure sensor module and a pressure sensor module, which can be stably operated even in an environment with high vibration, because the lower connection pin can be soldered.

Generally, the pressure sensor module includes an electronic circuit board (PCB) for converting a physical deformation due to applied pressure into an electrical signal, a structure of a pressure receiving part which is received when a pressure is applied from the outside, And an external housing.

Since the lower electronic circuit board (PCB) 102 can not be connected to the pressure receiving portion 101 of the sensor module base 100 as shown in FIGS. 1A, 1B and 1C, And the lower PCB 102 is fixed to the upper end of the support table 103 through the soldered joint 104 and the sensor 101 of the pressure receiving portion 101 having different planes as shown in Fig. The sensor 101a and the sensor portion 102a of the lower PCB 2 are hardly connected using the bonding wire 105 and the connection pin 106a is fixed to the signal transmission groove 102b of the lower PCB 2 Two connection portions 106 are separately inserted and fixed, and an upper PCB 107 is inserted thereinto to connect signals of sensor elements.

Therefore, since the bracket 103 is necessarily used and the solder joint 104 is necessarily required to fix the lower PCB 102 on the bracket 103, a time-consuming fixing operation is necessarily required, And the productivity is lowered and the manufacturing cost is increased. In addition, it becomes a cause of unstable operation in a vibration environment.

The parts of the soldering joint of the above process are welded to fix the sensor module base and the support base, and the quality is deteriorated due to the thermal effect of the welding. In the case of the dust and foreign substances generated at the welding, There is a problem in that there is a possibility of defective parts process later.

In this conventional structure, since the starting point and the ending point for bonding the bonding wire 105 are different from each other by a certain height, and the bonding process must be performed through the lower PCB 2, There was a problem that took a lot of time.

In the case where the connecting part 106 divided into two parts is formed by three pins and divided into two parts in the related art, when the connecting part 106 is divided into two parts, It is necessary to pay close attention to the assembly in the shape where the lower surface is widened, so that the working time is lengthened and the productivity is lowered.

In addition, although the connection pin 106a is used as a signal output means for outputting a signal to the outside, if a process is added according to the number of the individual connection pins, soldering at the upper part of the connection pin is impossible, The soldering work is performed on the parts, and the structure is uncomfortable. Since the workability is low and the soldering process takes a long time, the work efficiency is lowered.

An object of the present invention is to solve the above-mentioned problems, and it is an object of the present invention to provide a sensor module package for connecting a change value output from a sensor element formed in a pressure-receiving end with pressure to a lower PCB by wire bonding, In order to increase the epoxy bonding strength, an epoxy bonding hole is formed on the lower PCB in order to integrate the support supporter and the lower PCB so that the epoxy can be adhered to the sensor pressure receiving portion by the epoxy bonding process without welding process. And to provide a pressure sensor module and a pressure sensor module packaging method capable of simplifying an installation structure between a lower PCB and an attached sensor pressure receiving portion.

It is another object of the present invention to provide a pressure sensor module and a method of packaging a pressure sensor module in which manufacturing is facilitated by providing a single connection unit by integrating several pins for extending an output signal.

According to an aspect of the present invention, there is provided a sensor module comprising: a sensor module base having a water pressure portion formed on an upper portion thereof, a sensor module base formed with a sensor element at a center of the water pressure portion and having a protruded water pressure portion, A lower PCB having an insertion hole to be inserted therein and provided with a sensor portion disposed at the same height as the sensor element of the pressure receiving portion and having an epoxy bonding hole formed at the edge thereof and a signal transmission groove formed therein; And a connection pin formed in the signal transmission groove of the PCB is soldered and fixed to the lower PCB by being vertically protruded and connected to the signal transmission groove of the PCB, And an upper PCB inserted and fixed to the pin .

According to another aspect of the present invention, there is provided a method of manufacturing a sensor module, comprising the steps of: preparing a sensor module base having a water pressure portion formed on an upper portion thereof, a sensor element formed on a central portion of the water pressure portion and having a protruded water pressure portion, A step of inserting and assembling a lower PCB having a sensor portion disposed at the same height as the device, an epoxy bonding hole formed at an edge thereof and a signal transfer groove inserted into the pressure receiving portion of the sensor module base, A step of fixing the lower PCB to the sensor module base by injecting epoxy, connecting the sensor elements of the sensor module base arranged on the same plane with the sensor part of the lower PCB by connecting wires, Inserting the lower connection pin into the signal transmission groove of the lower PCB to fix the connection portion; And fixing the upper PCB on the upper connecting pin protruded to the upper portion of the upper PCB.

The pressure sensor module and the pressure sensor module packaging method according to the present invention can reduce manufacturing cost by simplifying the manufacturing process because the constituent parts of the pressure sensor module are greatly reduced, Since the operation of the sensor is simple, the operation efficiency is improved. In addition, since the sensor part of the lower PCB and the sensor element of the sensor module base are arranged on the same plane, bonding operation is simplified, And since the connecting portion is manufactured as a single body and the structure is formed so as to have a high height, it is possible to manufacture easily, and the lower connecting pin can be soldered, so that the structure can be secured and fixed. will be.

1A, 1B and 1C are a perspective view, an exploded perspective view and a partially enlarged perspective view of a conventional pressure bonding module for wire bonding and signal connection,
2A, 2B and 2C are a perspective view, an exploded perspective view and a partially enlarged perspective view of a pressure sensor module according to an embodiment of the present invention.
3A and 3B are an exploded perspective view and a front view of a sensor module base and a lower PCB according to an embodiment of the present invention.
4 is a perspective view illustrating an assembled state of a lower PCB and a connection portion according to an embodiment of the present invention.
5 is an exploded perspective view of a pressure sensor module according to an embodiment of the present invention,

2 and 3, the pressure sensor module A according to an embodiment of the present invention includes a pressure receiving portion 11 formed at an upper portion thereof and a sensor element 12 at the center of the pressure receiving portion 11. [ A sensor module base 1 having a pressure receiving portion 11 protruded so as to form a pressure receiving portion 11 and a stepped step portion 13 for joining on the side surface of the pressure receiving portion 11; The sensor part 22 is provided at the same height as the sensor element 12 of the pressure receiving part 1 and the epoxy bonding hole 23 is formed at the edge of the sensor part 12 A lower PCB 2 with a signal transmission groove 24 formed thereon and a sensor wire 22 connected to a sensor wire 22 of the sensor PCB 12 and a sensor wire 22 of the lower PCB 2, A lower connection pin 41 inserted into the signal transmission groove 24 of the lower PCB 2 is protruded downward and is soldered to the lower PCB 2 and is integrally formed with a synthetic resin The coupled (4), a signaling groove 51 is formed to an upper PCB (5) is inserted fixed to the upper connecting pins (42) of the connection (4).

The sensor module base 1 is made of stainless steel and the inside of the pressure receiving portion 11 is an empty space. When the pressure receiving portion 11 is deformed, (12) recognizes it, converts it into a converted electronic resistance value, and transmits it to the upper PCB (5) via the lower PCB (2). Such a structure is well known and will not be described in detail. The height of the upper surface of the pressure receiving portion 11 is equal to the height of the upper surface of the lower PCB 2 when the lower PCB 2 is assembled. Therefore, as shown in FIG. 2C, 2 and the sensor element 12 of the pressure receiving portion 11 are arranged on the same plane so that the bonding operation of the connecting wire 3 can be performed very easily.

A side linear portion 11a is formed on a side surface of the pressure receiving portion 11 of the sensor module base 1 and a stepped step portion 13 is formed on a lower side surface of the sensor module base 1, The first end surface 13a of the lower PCB 2 is in contact with the bottom surface of the lower PCB 2 and the second end surface 13b at a lower position is formed with a space corresponding to the height, The epoxy injected through the epoxy bonding hole 23 of the lower PCB 2 is filled and hardened so that the sensor module base 1 and the lower PCB 2 are fixed.

3A and 3B, the lower PCB 2 is formed with an insertion hole 21 inserted into the pressure receiving portion 11 at a central portion thereof. Through the insertion hole 21, the lower PCB 2 2 are inserted and fixed in the sensor module base 1. The insertion hole 21 is formed in a shape fitting to the side linear portion 11a of the pressure receiving portion 11 and a part of the inner circular straight portion 21a is formed so that the lower PCB 2 is not rotated, As shown in Fig.

A sensor unit 22 is installed on one side edge of the lower PCB 2 to bond the sensor element 12 of the pressure receiving unit 11 and an epoxy bonding hole 23 is formed on both sides of the bottom PCB 2, The signal transmission grooves 24 are formed at both side edges of the signal transmission groove 24 so that the information transmitted by the lower PCB 2 is transmitted to the upper PCB 5 It becomes possible.

The upper surface on which the signal transmission groove 24 of the lower PCB 2 is formed and the lower connection pin 41 of the connection portion 4 are soldered and fixed to the soldering portion 43 for secure fixing of the connection portion 4 So that the connection portion 4 can be securely fixed even in an environment where vibration is generated.

The connection part 4 of the present invention is configured such that the conventional connection part 106 is composed of two divided parts and two divided parts having three pins are used. And the connection part 4 is formed by once assembling in accordance with the product, so that it is possible to reliably assemble the space and structure of the parts and reduce the number of assemblies.

In the case where the connecting part 106 divided into two parts is formed by three pins and divided into two parts in the related art, when the connecting part 106 is divided into two parts, It is necessary to pay close attention to the assembling of the connecting part 106. Therefore, in the present invention, the conventional connecting part 106 divided into two parts is formed as one connecting part 4 so as to be integrally formed.

The connection unit 4 maintains a predetermined gap between the lower PCB 2 and the upper PCB 5 while transmitting a signal from the lower PCB 2 to the upper PCB 5, The connection unit main body 40 is formed of synthetic resin and includes a pair of spaced extension portions 40a extending downward from the lower end of the connection unit main body 40 and a lower connection pin portion 40a extending outwardly of the spaced extension portion 40a. 41 are formed on the upper part of the frame and the upper connection pin 42 is formed on the upper part and the vertical connection pin 41 and the upper and lower connection pins 41,

The upper PCB 5 has signal transmission grooves 51 formed inside the opposite side edges of the upper PCB 5 so that the upper connection pin 42 of the connection part 4 is inserted to transmit a signal, And a signal transmitting portion 52 for transmitting the signal to the spring 6 is formed.

The pressure sensor module A according to an embodiment of the present invention having such a configuration includes a water pressure portion formed on an upper portion thereof, a sensor element formed on the center of the water pressure portion, and a protruded water pressure portion, And a lower PCB having a signal transmission groove formed on an edge thereof with a pressure receiving portion of the sensor module base, wherein the sensor module has a sensor portion having the same height as the sensor element of the pressure receiving portion, Inserting epoxy into the epoxy bonding hole of the lower PCB to fix the lower PCB to the sensor module base, and inserting the sensor module base and sensor Bonding the lower connecting pin to the upper PCB by connecting the lower connecting pin to the lower PCB, And No. fixing the connection portion by inserting the transmission groove, the pressure sensor module through the step of fixing the upper PCB to the upper connection pinsang projected to the upper portion of the connection part is assembled. In addition to the above steps, a step of securely fixing the lower connection pin inserted into the signal transmission groove of the lower PCB and the lower PCB by soldering may be additionally constituted.

In addition to the above steps, the lower connection pin inserted into the signal transmission groove of the lower PCB and the lower PCB are securely fixed by soldering, and a structure for performing electrical transmission is manufactured. In the bottom PCB soldering, the inside mold is structured to have a stable height. In the case of soldering, it is structured so that the soldering iron can be put on the side surface, so that the solderability is easily designed.

The pressure sensor module and the pressure sensor module packaging method according to the present invention reduce the number of components of the pressure sensor module, simplify manufacturing and reduce manufacturing cost, Since the operation is simple with the injection of epoxy, the work is simplified, and the work efficiency is improved. In addition, since the sensor portion of the lower PCB and the sensor element of the sensor module base are arranged on the same plane, the bonding operation is simplified, Since the connection structure is formed in a vertical structure with a high connection efficiency, it is easy to manufacture and the lower connection pin can be soldered, so that it can be stably operated even in an environment with many vibrations because it has a secure and fixed structure.

The pressure sensor module and the pressure sensor module packaging method according to the present invention can be repeatedly performed in the same manner in the manufacturing industry of a general pressure sensor module and it is possible to repeatedly manufacture the same product. .

1. Sensor module base 2. Lower PCB 3. Connecting wire
4. Connections 5. Top PCB

Claims (4)

In the pressure sensor module (A)
The pressure sensor module A includes a circular pressure receiving portion 11 having a pressure receiving portion 11 formed at an upper portion thereof and protruding to form a sensor element 12 at a center of the pressure receiving portion 11, A side rectilinear section 11a is formed on the side surface of the pressure receiving section 11 to prevent rotation of the lower PCB 2 inserted therein and a stepped step portion 13 for bonding is formed on the lower side of the pressure receiving section 11. [ A module base 1,
An insertion hole 21 to be inserted into the pressure receiving portion 11 of the sensor module base 1 is formed and an inner diameter straight portion 21a is formed in a part of the insertion hole 21, A lower PCB 2 provided with a sensor portion 22 arranged at the same height as the sensor element 12 of the sensor element 12 and having an epoxy bonding hole 23 formed at the edge thereof and a signal transmission groove 24 formed therein,
A connection wire 3 connecting the sensor element 12 of the sensor module base 1 and the sensor portion 22 of the lower PCB 2 in the same plane,
A metal lower connection pin 41 inserted into the signal transmission groove 24 of the lower PCB 2 is protruded downward and soldered to the lower PCB 2, A connecting portion 4 having a single connecting body 40 protruding from the upper connecting pin 42 and the other portion formed of synthetic resin and adjacent to the lower connecting pin 41 such that the separated extending portion 40a extends downward )Wow,
And an upper PCB 5 formed with a signal transmission groove 51 and inserted and fixed to the upper connection pin 42 of the connection portion 4,
The stepped stitch portion 13 of the sensor module base 1 and the lower PCB 2 are cured by bonding the epoxy injected through the epoxy bonding hole 23 to the stepped step portion 13, Sensor module
delete delete In a pressure sensor module packaging method,
The pressure sensor module packaging method includes: a water pressure portion formed on an upper portion; a water pressure portion having a sensor element attached to the center of the water pressure portion; and a side linear portion formed on a side surface of the water pressure portion to prevent rotation of the lower PCB, A step of disposing a sensor module base on a side surface of a lower portion of the sensor module,
An inserting hole to be inserted into the pressure receiving portion of the sensor module base is formed, an inner diameter straight portion is formed in a part of the inserting hole, a sensor portion arranged at the same height as the sensor element of the pressure receiving portion is provided, an epoxy bonding hole is formed at the edge, A lower PCB having a transfer groove formed therein is inserted and assembled into a pressure receiving portion of the sensor module base;
Injecting epoxy into the epoxy bonding hole of the lower PCB to fix the lower PCB to the sensor module base;
Bonding the sensor element of the sensor module base and the sensor portion of the lower PCB arranged in the same plane with a connection wire,
Inserting a lower connecting pin out of connection pins projecting upward and downward into a signal transmission groove of the lower PCB to fix the connection part;
Fixing the upper PCB on the upper connecting pin protruded to the upper portion of the connecting portion,
And fixing the lower connection pin inserted into the signal transmission groove of the lower PCB and the lower PCB by soldering.

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