KR101535090B1 - Apparatus for cleaning substrate - Google Patents

Abstract

For achieving the purpose, the present invention, an apparatus for cleaning a substrate includes a lower housing which includes a holding part which has the concave center part of an upper side to arrange a substrate, at least one cleaning water inlet which is formed in a step part which is concave on one side of the holding part, and at least one cleaning water outlet on the other side of the holding part; and an upper housing which closes the upper side of the lower hosing.

Description

[0001] APPARATUS FOR CLEANING SUBSTRATE [0002]

The present invention relates to a substrate cleaning unit with improved structure.

2. Description of the Related Art In recent years, various electronic devices have been downsized, and a substrate mounted on an electronic device and various devices mounted on the substrate are rapidly being miniaturized.

In accordance with this trend, a technique of mounting devices on a substrate lightly is being developed. Specifically, surface mounting and hybrid mounting from an insertion mounting are developed in accordance with a method of mounting an element on a substrate. In addition, a SMT (Surface Mounting Technology) method using a ball grid array (BGA) Flip chip bonding method and the like are used.

Here, a flux is used as a medium when laser drilling is performed on a printed circuit board or an epoxy mold compound, or when the surface of a device is mounted. Also, in a process of manufacturing a flip chip, a multi chip package, or a laminated package, a chip on which a bump is formed is picked up to apply a flux, and a substrate is aligned with a pad to perform a reflow process Assembly is completed.

The flux used for mounting on such a substrate is formed by organic / inorganic or water-soluble / oil soluble such as alcohol, surfactant, water, solvent and the like and increases the fluidity of the solder ball paste and makes useless impurities into slag form .

However, the flux remaining after the process does not contribute to the improvement of the bonding reliability, and the corrosion and the conductivity are strong, so that the bump and / or the substrate are corroded or the electrical reliability is lowered. In the underfill process and the epoxy mold process, (Void) can be generated.

In recent years, no cleaning flux has been developed and used, but underfill process must be performed to ensure reliability when the size of the solder ball is 300 μm or less. In this case, if the flux remains around the bumps, It can not be wrapped and reliability can be degraded.

That is, in the substrate process using the flux, the removal of the remaining flux after the process plays an important role in securing the reliability of the product. In order to remove such residual flux, it is currently being dipped in high-temperature washing water for a long time to remove residual flux, or it is washed with a centrifugal separator such as a washing machine. However, it takes a long time to remove the flux, have.

Therefore, at present, a method of cleaning the substrate in the same manner as in FIG. 1 is widely used.

Fig. 1 is a schematic view of a conventional cleaning apparatus, and Fig. 2 is a side cross-sectional view of a multiple flip chip package.

Referring to Figure 1, a conventional cleaning apparatus places a processed substrate on a die or conveyor and sprays water at high pressure to clean the processed substrate.

However, such a conventional cleaning apparatus using high-pressure water has a problem that the processed substrate may be impacted by the high-pressure jet water and may be detached or damaged from the die or conveyor during cleaning.

Also, since the high-temperature and high-pressure spraying apparatus requires a large amount of washing water, a large-capacity pump and a large-capacity heater are required, which requires a large amount of electric power in using the washing apparatus.

2, not only a single-layer flip chip but also a multi-layer flip-chip package 1b have been developed. In the case of the present multi-layer flip chip package 1b, . In the case of a multiple flip chip package having such a fine gap, it is impossible to remove foreign matter or flux between fine gaps as a conventional cleaning apparatus. This is because the washing water can not naturally flow into or out of the micro gap formed between 10 and 30 mu m.

SUMMARY OF THE INVENTION It is an object of the present invention to provide a substrate cleaning unit capable of precisely removing foreign matter or residual flux remaining on a substrate.

It is another object of the present invention to provide a substrate cleaning unit capable of realizing the above-mentioned effects with low power.

In order to attain the above object, the present invention provides a washing machine, comprising: a washing water inflow hole formed in the step portion, the washing water inflow hole being formed at a center portion of an upper side thereof with a concave portion, A lower housing including a wash water discharge hole; And an upper housing closing the upper side of the lower housing.

Here, a stepped portion formed concavely at one side of the mounting portion may be included, and the washing water inflow hole may be formed in the stepped portion.

Here, the lower housing may be integrally formed.

The upper housing may further include a sealing member disposed between the lower housing and the upper housing.

Here, the lower housing may be formed with a seating groove on which the sealing member is seated.

The side wall may further include guide grooves formed at least one of the side walls, and the upper housing may further include guide protrusions formed corresponding to the guide grooves.

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The apparatus may further include a lower tool detachably mounted on the mounting portion and having an upper surface corresponding to the substrate to be disposed.

At least one mounting protrusion is formed on the lower side of the lower tool, and a mounting groove corresponding to the mounting protrusion may be formed on the mounting portion.

At least one pair of clamping grooves may be formed on opposite sides of the lower tool.

Here, the washing water nozzle may further include a washing water nozzle coupled to the washing water inflow hole to introduce washing chemicals or washing water.

The apparatus may further include an air nozzle coupled to the through hole to introduce air.

The apparatus may further include an upper frame having an area corresponding to the mounting portion and the stepped portion and detachably mounted on a lower surface of the upper housing.

Here, the buffer member may be disposed on the lower side of the upper frame.

The apparatus may further include an actuator for opening and closing the upper housing and the lower housing.

Here,

A driving shaft which is fastened to the lower housing at one end and is guided by the upper housing to move the upper housing upward and downward; And a pneumatic cylinder coupled to the drive shaft and the upper housing to move the upper housing upward and downward.

Because of the structural characteristics of the inner space generated when the upper housing and the lower housing are coupled with each other, it is possible to clean the micro space between the multi-layer substrates that can not be cleaned by the conventional high pressure injection method or the immersion method.

Further, the present invention has the effect of reducing the washing time, washing water usage amount, and power consumption rate.

1 schematically shows a conventional cleaning device;
2 is a side cross-sectional view of a multiple flip chip package;
3 is a schematic side cross-sectional view of a substrate cleaning unit according to an embodiment of the present invention.
4 is a perspective view of a lower housing according to an embodiment of the present invention.
5 is a top view and side view of a lower tool in accordance with an embodiment of the present invention.
FIG. 6 is a schematic view showing a use state of a substrate cleaning unit according to an embodiment of the present invention; FIG.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

Unless defined otherwise, all terms used herein are the same as the generic meanings of the terms understood by those of ordinary skill in the art, and where the terms used herein contradict the general meaning of the term, they shall be as defined herein.

It is to be understood, however, that the invention is not limited to the disclosed embodiments, but, on the contrary, is intended to cover various modifications and equivalent arrangements included within the spirit and scope of the appended claims.

In addition, in the embodiment of the present invention, semiconductor devices mounted on a substrate are mounted as flip chip as an example of an electronic component mounted on a substrate. However, the present invention is not limited to this example, For example, a BGA (Ball Grid Array) type or an MCEP (Molded Core Embedded Package) type device. That is, in the present invention, the substrate may include all types of substrates currently available.

FIG. 3 is a schematic side cross-sectional view of a substrate cleaning unit according to an embodiment of the present invention, FIG. 4 is a perspective view of a lower housing according to an embodiment of the present invention, Fig.

Referring to FIG. 3, the embodiment may include a lower housing 110 and an upper housing 120. Further, the embodiment may further include the sealing member 130, and may further include the actuator 140.

4, the lower housing 110 may be formed with a concave portion 111 at a center of the upper side thereof to accommodate the substrate 1, and may be concave at one side of the mounting portion 111 The step portion 112 may be further formed.

As shown in FIG. 4, the shape of the upper surface of the lower housing 110 has a stepped shape as it goes from the mounting portion 111 to the step portion 112. Alternatively, when the step portion 112 is not formed, the upper housing 110 may have a concave shape and a parallel shape.

The washing water inlet hole 112a formed at least one side of the step portion 111 or the step portion 112 formed at one side of the receiving portion 111 and the washing water inlet hole 112b formed at the other side of the receiving portion 111 And may include one or more wash water discharge holes 111a.

The washing water inlet hole 112a may be formed as shown in FIG. 1, and the washing water nozzle may be coupled to allow the washing water to flow into the space formed when the upper housing 120 and the lower housing 110 are coupled. , The washing water flows in parallel with the upper surface of the mounting portion 111 and finally discharged through the washing water discharge hole 111a. This washing water flow can clean the substrate 1 as a flow (pressurizing) method other than the conventional spraying method.

In the embodiment, when the step portion 112 is formed, the washing water is primarily received in the step portion 112, and secondarily flows in parallel with the upper surface of the mounting portion 111, And is discharged through the discharge hole 111a. The flow of the washing water can be more effectively flowed without generating vortices when the step portion 112 is formed, so that the substrate 1 can be stably washed.

In addition, the washing water inflow hole 112a may be formed in two, unlike the one shown in the drawing. In this case, one of the washing water nozzles may be coupled to flow the washing water as described above. And the other one is connected to an air nozzle or a cleaning agent nozzle to introduce high-pressure air into the interior or to flow the cleaning agent together with the cleaning water to dry and secondarily clean the substrate 1 have.

As shown in the drawing, three washing water discharge holes 111a may be formed. However, the washing water discharge holes 111a may be formed in various shapes depending on the flow rate of the washing water flowing into the washing water inlet holes 112a.

The structural form of this embodiment does not directly spray the cleaning water for cleaning the substrate 1 onto the substrate 1 but flows the cleaning water in such a manner as to pressurize the cleaning water from one side to the other side, So that an excellent cleaning effect can be achieved. This embodiment will be described in more detail as follows.

The lower housing 110 may be integrally formed. Here, the lower housing 110 may be formed of a plastic material or a metal material, or may be formed by insert molding if it is made of a plastic material, or may be formed by a press working method or an NC milling method when it is made of a metal material. But is not limited thereto.

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The upper side of the side wall portion 113 formed by the upper side except for the mounting portion 111 and the step portion 112 is closed by the upper housing 120 to be described later so that the space for accommodating the washing water and the substrate 1 .

In order to discharge the washing water introduced by the washing water inflow hole 112a to the washing water discharge hole 111a only in the space closed by the side wall part 113 and the upper housing 120, (130).

That is, the sealing member 130 may be disposed between the side wall portion 113 and the upper housing 120. In this case, the sealing member 130 may be fixed to the side wall portion 113, And can be fixed to the upper housing 120.

In the former case, the side wall 113 may be formed with a seating groove 113a on which the sealing member 130 is seated. The seating groove 113a fixes a part of the sealing member 130 And the other side is exposed to the upper side of the side wall 113.

The sealing member 130 may be formed of an elastic material such as rubber or Teflon. The sealing member 130 prevents leakage of washing water from the coupling surface when the upper housing 120 and the lower housing 110 are coupled to each other, .

The upper housing 120 contacts the side wall 113 to close the upper side of the lower housing 110. The upper housing 120 and the lower housing 110 may be coupled with each other by bolt tightening or the like to the side wall 113 and the upper housing 120 to be coupled or the actuator 140, And can be realized by automatic tightening by a mechanical pressing force.

The embodiment further includes a guide groove 113b formed in the side wall part 113 for precise fastening of the upper housing 120 and the lower housing 110. The upper housing 120 May further include guide protrusions (not shown) formed corresponding to the guide grooves 113b.

Here, the guide groove 113b may be formed in the upper housing 120, and the guide protrusion may be formed in the side portion. The guide groove 113b and the guide protrusion (not shown) precisely guide the position of the upper housing 120 when the upper housing 120 is coupled to the lower housing 110, 100) can be improved.

On the other hand, the embodiment provides a technical idea capable of cleaning not only a single package in which a plurality of substrates are formed but also other types of packages, or individual substrates in the form of a single chip.

5 is a top view and a side view of a lower tool according to an embodiment of the present invention.

5, a substrate cleaning unit 100 according to an embodiment of the present invention includes a lower tool 150 detachably mounted on the mounting portion 111 and having an upper surface corresponding to the substrate 1 to be disposed thereon .

Although the upper surface of the lower tool 150 is shown as being flat, an upper surface is formed to correspond to the substrate 1 to be disposed, and the substrate 1 can be stably fixed.

That is, since the lower tool 150 has a plurality of lower tools 150 having upper surfaces of different shapes according to the type of the substrate 1, the lower tool 150 must be mounted on the mounting portion 111, have. At least one mounting protrusion 151 is formed on the lower side of the lower tool 150 and a mounting groove 111b corresponding to the mounting protrusion 151 may be formed on the mounting portion 111 .

The mounting method of the lower tool 150 is not limited to this example, and may be realized by bolt tightening.

A step portion 114 may be formed between the mounting portion 111 and the step portion 112 to guide the lower tool 150 to be easily mounted.

At least one pair of clamping grooves 152 may be formed on opposite sides of the lower tool 150. The clamping grooves 152 may be formed on the lower tool 150, So that it can be easily clamped as a robot arm (not shown) or the like.

3, the embodiment may further include an upper tool 160 to more effectively implement the substrate cleaning unit 100 capable of cleaning substrates of different kinds.

The upper tool 160 may be detachably mounted on the lower surface of the upper housing 120 with an area corresponding to the mounting portion 111 and the step portion 112. The upper tool 160 may adjust the height of the washing water flowing space formed when the upper housing 120 and the lower housing 110 are coupled with each other, The upper tool 160 may be replaced with another tool.

The coupling between the upper tool 160 and the upper housing 120 can be realized by various methods such as a coupling method of a coupling protrusion and a coupling groove, a sliding coupling method, or a bolt coupling method.

3, the embodiment may further include a cushioning member 161 disposed on the lower side of the upper tool 161. The cushioning member 161 may be disposed on the upper side of the substrate 1 The impact that can be applied can be alleviated, and the washing reliability can be further improved. The buffer member 161 may be formed of an elastic material such as rubber, silicone, or Teflon. The buffer member 161 may be fixed to the upper tool 160 in the form of an adhesive, fusion, or the like.

Referring to FIG. 3, the embodiment may further include an actuator 140 for opening and closing the upper housing 120 and the lower housing 110.

The actuator 140 includes a drive shaft 141 coupled to the lower housing 110 at one end thereof and coupled to the upper housing 120 to guide the upper housing 120 upward and downward, And a driving unit 142 coupled to the driving shaft 141 and the upper housing 120 to move the upper housing 120 up and down.

Although the actuator 142 is illustrated as being mounted on one side of the substrate cleaning unit 100 according to the embodiment, the actuator 142 may be mounted on the opposite side One may be further provided.

The use condition of the substrate cleaning unit 100 according to this embodiment will be described as follows.

6 is a view schematically showing a use state of the substrate cleaning unit according to an embodiment of the present invention.

6, a lower tool 150 having a flip chip package or a single flip chip fixed thereto is disposed on a mounting portion 111 of the lower housing 110, and the lower tool 150 is mounted on the upper housing (not shown) by an actuator 140 120 press the upper surface of the lower housing 110 to close it.

In this case, the coupling surface of the upper housing 120 and the lower housing 110 is sealed by the sealing member 130 to maintain airtightness.

Thereafter, the water flows into the internal space formed with the high-temperature (about 40 ° C to 80 ° C) and / or high-pressure washing water introduced from the washing water nozzle coupled to the washing water inflow hole 112a formed in the step portion 112, After the washing water is received in the stepped portion 112, the washing water is horizontally flowed forward and discharged to the washing water discharge groove 111a formed in the mounting portion 111. The flow of the washing water is expressed in the form of a fluid pressure method unlike the conventional simple high pressure spray method. Therefore, in the conventional cleaning apparatus, the pressure of the washing water is generally required to be about 8 kg / cm 2 to 10 kg / cm 2, but the embodiment is not limited to the case where the substrate is cleaned with a relatively small pressure of about 0.1 kg / cm 2 to 5 kg / It is washable.

In other words, if the step portion 112 is not formed, the washing water flowing into the substrate 1 may flow directly to the side surface or the bottom surface of the substrate 1, may flow in the oblique direction to damage the substrate 1, The substrate 1 can not be removed or the washing water can not flow through the stacked micro gaps on the substrate 1. Accordingly, the present invention is characterized in that the step portion 112 is provided at a portion where the washing water is introduced to receive the washing water that has been primarily introduced.

As described above, the embodiment capable of cleaning the substrate 1 in this manner can be applied to any type of substrate 1 as described above. In particular, the present invention can be applied to any type of substrate 1, And / or has a superior effect on the removal of flux, and has an excellent effect in comparison with the conventional high-pressure water jet cleaning apparatus in terms of cleaning time, washing water usage amount, and power consumption.

It will be apparent to those skilled in the art that various modifications and variations can be made in the present invention without departing from the spirit or scope of the invention as defined by the appended claims. Range and its equivalent range.

100: substrate cleaning unit 110: lower housing
111: mounting portion 111a: washing water discharge hole
111b: mounting groove 112:
112a: washing water inlet hole 113: side wall portion
113a: seat groove 113b: guide groove
114: step portion 120: upper housing
130: sealing member 140: actuator
141: drive shaft 142: pneumatic cylinder
150: Lower tool 151: Mounting projection
152: clamping groove 160: upper tool
161: buffer member

Claims (15)

A lower housing having at least one washing water inlet hole formed at one side of the mounting portion and at least one washing water discharge hole formed at the other side of the mounting portion;
An upper housing selectively closing the upper side of the lower housing; And
And a sealing member positioned between the upper surface of the lower housing side portion and the lower surface of the upper housing,
Wherein the mounting portion is sealed by a sealing member when the lower housing and the upper housing are engaged, and the substrate is cleaned by the washing water that flows into the mounting portion and is pressed.
The method according to claim 1,
And a stepped portion formed concavely at one side of the mounting portion, wherein the washing water inflow hole is formed in the stepped portion.
delete The method according to claim 1,
Wherein the lower housing has a seating groove on which the sealing member is seated.
The method according to claim 1,
The lower housing further includes at least one guide groove formed therein,
Wherein the upper housing further comprises guide protrusions formed corresponding to the guide grooves.
delete delete The method according to claim 1,
And a lower tool detachably mounted on the mounting portion and having an upper surface corresponding to the substrate to be disposed.
9. The method of claim 8,
At least one mounting protrusion is formed on the lower side of the lower tool,
Wherein a mounting groove corresponding to the mounting projection is formed in the mounting portion.
9. The method of claim 8,
Wherein at least one pair of clamping grooves are formed on opposite sides of the lower tool.
The method according to claim 1,
And a washing water nozzle which is fastened to the washing water inflow hole to introduce washing chemicals or washing water.
3. The method of claim 2,
Further comprising an upper tool detachably mounted on a lower surface of the upper housing with an area corresponding to the mounting portion and the stepped portion.
13. The method of claim 12,
And a buffer member disposed on a lower side of the upper tool.
The method according to claim 1,
And an actuator for opening and closing the upper housing and the lower housing.
15. The method of claim 14,
Wherein the actuator comprises:
A driving shaft which is fastened to the lower housing at one end and is guided by the upper housing to move the upper housing upward and downward; And
And a pneumatic cylinder coupled to the drive shaft and the upper housing to move the upper housing upward and downward.

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