KR101510818B1 - Loop antenna and manufacturing method of the same - Google Patents

Loop antenna and manufacturing method of the same Download PDF

Info

Publication number
KR101510818B1
KR101510818B1 KR20140080079A KR20140080079A KR101510818B1 KR 101510818 B1 KR101510818 B1 KR 101510818B1 KR 20140080079 A KR20140080079 A KR 20140080079A KR 20140080079 A KR20140080079 A KR 20140080079A KR 101510818 B1 KR101510818 B1 KR 101510818B1
Authority
KR
South Korea
Prior art keywords
loop
jumper
pattern
terminal
terminal portion
Prior art date
Application number
KR20140080079A
Other languages
Korean (ko)
Inventor
김영헌
윤민호
Original Assignee
김영헌
윤민호
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 김영헌, 윤민호 filed Critical 김영헌
Priority to KR20140080079A priority Critical patent/KR101510818B1/en
Application granted granted Critical
Publication of KR101510818B1 publication Critical patent/KR101510818B1/en

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/24—Supports; Mounting means by structural association with other equipment or articles with receiving set
    • H01Q1/241—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM
    • H01Q1/242—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM specially adapted for hand-held use
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
    • H01Q1/38—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/40—Radiating elements coated with or embedded in protective material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q7/00—Loop antennas with a substantially uniform current distribution around the loop and having a directional radiation pattern in a plane perpendicular to the plane of the loop

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)

Abstract

The present invention relates to a loop antenna and a method for manufacturing the same. The loop antenna comprises: a loop unit which is made of a conductive material and includes a loop pattern, a first terminal unit, and a second terminal unit extended from an external end of the loop pattern on the same layer; a jumper unit which is bonded to one surface of the loop unit to electrically connect the internal end of the loop pattern and the first terminal unit; and first and second coverlays which are respectively attached to one surface and the other surface of the loop unit to protect the loop unit, thereby being manufactured through simplified manufacturing processes without using raw materials of a copper clad laminate (CCL) type and reducing the thickness of the loop antenna compared to an existing loop antenna.

Description

TECHNICAL FIELD [0001] The present invention relates to a loop antenna,

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a loop antenna manufactured using a printed circuit board manufacturing process and a manufacturing method thereof.

A loop antenna is a component installed in a portable terminal and a battery for communicating with an external device, and is generally manufactured in the form of a substrate using a printed circuit board manufacturing process.

FIG. 1 is a plan view of a loop antenna of a general type, and FIG. 2 is a sectional view taken along a line II-II in FIG.

1 and 2, the loop antenna has a configuration including a loop pattern 10, first and second terminal portions 21 and 22, a jumper 30, and the like.

The loop pattern 10 has a structure in which the conductive pattern forms a loop shape and is electrically connected to the first and second terminal portions 21 and 22 for power supply. The first terminal portion 21 is electrically connected to the inner end portion of the loop pattern 10 through the jumper 30 and the second terminal portion 22 has a structure extending from the outer end portion of the loop pattern 10.

The loop pattern 10 and the first and second terminal portions 21 and 22 are formed on one side of the substrate 60 and the jumper 30 is formed on the other side of the substrate 60. [ This is a structure for preventing interference with other portions of the loop pattern 10 when connecting the first terminal portion 21 and the inner end portions of the loop pattern 10.

The jumper 30 has a structure in which a bridge is connected between the first terminal portion 21 and an inner end portion of the loop pattern 10. Such a bridge connection is formed by connecting the via hole 41 or 42 to the substrate 60, And plating the inner walls of the via holes 41 and 42.

In general, the first and second terminal portions 21 and 22 are also formed with upper and lower circuit conduction structures through the copper plating structure with respect to the via holes 51 and 52. Through the soldering, the first and second terminal portions 21 and 22 And is connected to the main board 80. The reason for forming such a double-sided circuit structure is that the circuit of the main board 80 is connected to the circuit on the lower side of the board 60, so the upper and lower circuits of the board 60 must be made conductive for connection with the upper circuit.

On both sides of the substrate 60, the cover patterns 71, 72, and 72 for protecting the conductive patterns, that is, the roof pattern 10, the first and second terminal portions 21 and 22 and the jumper 30, a coverlay is attached. 1, the illustration of the cover rails 71 and 72 is omitted for convenience of explanation.

The loop antenna is generally manufactured through a process of drilling and copper plating a raw material in the form of a double-sided copper-clad laminate (CCL) having copper foil on both sides and then patterning the copper foil to form a double-sided circuit.

Such a manufacturing method suffers from a cost burden due to the use of raw materials in the form of a double-sided copper-clad laminate (CCL), and drilling and copper plating are indispensable. In addition, there is a burden for ensuring reliability according to the degree of smoothness of the cross section of the hole after the copper plating and drilling, and the cover rails 71 and 72 are additionally attached to both sides of the substrate 60 and copper plating is performed on the circuit surface in the hole copper plating There is a problem that the thickness of the loop antenna increases accordingly.

Patent Registration No. 10-0903373 (Jun. 10, 2009)

SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned problems, and it is an object of the present invention to provide a loop antenna which can be manufactured through a simplified manufacturing process without using a raw material in the form of a double-sided copper clad laminate (CCL) .

According to another aspect of the present invention, there is provided a loop structure including a loop portion having a loop pattern, a first terminal portion, and a second terminal portion extending from an outer end of the loop pattern, A jumper portion for electrically connecting the inner end portion of the loop pattern to the first terminal portion, and first and second coverlay portions respectively attached to one surface and the other surface of the loop portion to protect the loop portion.

According to the loop antenna related to the present invention, the jumper portion includes an insulation layer having first and second jump holes formed at a connection portion between the loop pattern and the first terminal portion, and an insulation layer formed inside the first and second jump holes, And a connection pattern formed on one surface of the insulating layer and connected to the conductors of the first and second jump holes.

According to the loop antenna related to the present invention, the ends of the first and second terminal portions may be exposed to the outside of the first and second cover rails to be electrically connected to other electric circuits. The end portions of the first and second terminal portions may be formed with through holes for penetrating the solder paste when soldered to other electric circuits.

According to the loop antenna related to the present invention, the first coverlay may be configured to cover an area excluding the position of the jumper part.

The present invention also includes a step of manufacturing the jumper part and the structure in which the loop part is attached to the second coverlay using a photolithography process, and attaching the jumper part and the first coverlay to the loop part A method of manufacturing a loop antenna is disclosed.

According to the method of manufacturing a loop antenna according to the present invention, the jumper part can be attached to the loop part by thermocompression bonding.

According to the method of manufacturing a loop antenna according to the present invention, the manufacturing step of the structure in which the loop portion is attached to the second coverlay includes the steps of: attaching a first copper foil to the first carrier film; Forming the loop portion, and transferring the loop portion to the second coverlay and removing the first carrier film.

According to the method of manufacturing a loop antenna according to the present invention, the step of manufacturing the jumper includes: attaching a second copper foil to a second carrier film; bonding the second copper foil to the insulating film having the first and second jump holes Forming a connection pattern connecting the first and second jump holes by patterning the second copper foil; forming a connection pattern connecting the first and second jump holes with the first and second jump holes, Filling the paste or bonding the conductive material.

According to another aspect of the present invention, there is provided a liquid crystal display device including a first loop pattern, a first terminal portion, a first loop portion having a second terminal portion extending from an outer end portion of the first loop pattern, A second loop part having a fourth terminal part extending from an outer end of the second loop pattern and having an upper layer formed on the lower layer and an inner end part electrically connected to the third terminal part of the second loop pattern electrically, A second jumper provided on the upper layer for electrically connecting an inner end of the first loop pattern to the first terminal portion and a second jumper provided between the upper layer and the lower layer, And an insulating layer provided between the first loop portion and the second jumper and between the second loop portion and the first jumper.

According to the present invention, since the drilling process and the via hole plating process for forming a via hole are not necessary, the manufacturing process can be simplified, the quality problems that can occur in each process can be solved, and the double-sided copper- So that the production cost can be reduced.

In addition, the loop antenna can be formed as a single layer except for the portion where the jumper portion is located, thereby reducing the thickness of the entire antenna compared to the conventional art.

1 is a plan view of a loop antenna in a general form;
Fig. 2 is a cross-sectional view taken along the line II-II in Fig. 1; Fig.
3 is a plan view of a loop antenna according to an embodiment of the present invention;
4 is a cross-sectional view taken along the line IV-IV in FIG. 3;
5 to 7 are views showing a method of manufacturing a loop antenna according to an embodiment of the present invention,

Hereinafter, a loop antenna and a manufacturing method thereof according to the present invention will be described in detail with reference to the drawings.

FIG. 3 is a plan view of a loop antenna according to an embodiment of the present invention, and FIG. 4 is a cross-sectional view taken along line IV-IV of FIG.

The loop antenna according to the present embodiment includes a loop unit 110, a jumper unit 120, and first and second cover rails 131 and 132.

The loop section 110 includes a loop pattern 113 having a conductive pattern in a loop shape, a first terminal section 111 provided at one side of the loop pattern 113, And a terminal portion 112. Where the loop pattern 113. The first terminal portion 111 and the second terminal portion 112 are provided on the same layer.

The jumper part 120 is joined to one surface of the loop part 110 and the loop pattern 113 electrically connects the inner end part and the first terminal part 111. [ The jumper portion 120 has a structure in which an end portion of the first terminal portion 111 is bridged between an inner end portion of the loop pattern 113. In this embodiment, the jumper portion 120 is bonded to the upper surface of the loop portion 110.

The jumper portion 120 has a structure including an insulating layer 123, conductors 124 and 125, and a connecting pattern 126.

The insulating layer 120 is formed of an insulating material such as a solder resist or a bonding sheet and first and second jump holes 121 and 122 are formed in a connection portion between the loop pattern 113 and the first terminal portion 111 Respectively.

The conductors 124 and 125 are filled in the first and second jump holes 121 and 122 and adhered to the inner end portion of the loop pattern 113 and the end portion of the first terminal portion 111, respectively. As the conductors 124 and 125, a conductive paste such as solder paste and conductive ink may be used, or an adhesive material such as a conductive film may be used. As will be described later, the process is performed so that the electrical connection is simultaneously performed during the hot pressing process for attaching the first and second cover rails 131 and 132 and the jumper portion 120 using the low temperature solder paste as the conductors 124 and 125 .

The connection pattern 126 is formed on one surface of the insulating layer 121 and is connected to the conductors 124 and 125 of the first and second jump holes 121 and 122. According to the present embodiment, the connection pattern 126 is formed on the upper surface of the insulating layer 121, and the conductors 124 and 125 of the first and second jump holes 121 and 122 are formed in the loop pattern 113 and the first terminal portion 111. [

The first and second cover rails 131 and 132 are attached to one surface and the other surface of the loop portion 110, respectively. The first and second cover rails 131 and 132 are films having an insulating material such as polyimide. The first and second cover rails 131 and 132 protect the loop portion 110 and prevent the oxidation of the loop portion 110 or the electrical shorting due to contact with the external conductive material. .

In the present embodiment, the first coverlay 131 is attached to the upper surface of the loop portion 110 and the second coverlay 132 is attached to the lower surface. In this case, the second coverlay 132 is configured to cover the entire area of the loop part 110, while the first coverlay 131 is configured to cover the area except the position of the jumper part 120, 1 cover rails 131 and jumper portions 120 are positioned on the same layer. For this, the first coverlay 131 may have a structure in which a through hole corresponding to the position and shape of the jumper 120 is formed.

The end portions of the first and second terminal portions 111 and 112 may extend outwardly between the first and second cover rails 131 and 132 to be exposed to the outside. The end portions of the first and second terminal portions 111 and 112 are electrically connected to another electric circuit, for example, a circuit of the main board 80. The end portions of the first and second terminal portions 111 and 112 may be provided with through holes 113 for penetrating the solder paste 85 when soldered to other electric circuits. This structure allows the solder paste 85 to easily enter under the first and second terminal portions 111 and 112 through the through hole 113 when soldering.

The loop antenna having the above-described structure can be formed in a single layer except for the portion where the jumper 120 is located, thereby realizing a thin thickness compared to the conventional art. That is, the structure corresponding to the substrate 60 having the structure shown in FIGS. 1 and 2 is not used, and the thickness can be reduced accordingly. Further, since the copper plating is not performed on the circuit surface as in the prior art, the thickness due to the copper plating can be reduced, and the plating process for the via holes 41, 42 and 51 and the drilling process for forming the via holes 41, There is an advantage that the manufacturing process can be simplified.

Hereinafter, a method for manufacturing a loop antenna having the above-described structure will be described. 5 to 7 are views showing a method of manufacturing a loop antenna according to an embodiment of the present invention.

The loop antenna manufacturing method of the present embodiment is similar to the loop antenna manufacturing method of the first embodiment except that the loop portion 110 is attached to the second coverlay 132 (structure shown in FIG. 5 (d)) and the jumper portion 120 Structure by using a photolithograpy process, and attaching the jumper portion 120 and the first coverlay 131 to the loop portion 110. As shown in FIG.

FIG. 5 sequentially shows a process of fabricating a structure in which the loop portion 110 is attached to the second coverlay 132, which is one of the objects to be attached.

In this embodiment, a carrier film 140 having a structure in which an adhesive which is not resistant to a film such as PET is applied so as to facilitate handling of a thin copper foil is used.

The copper foil 103 is bonded to the carrier film 140 and the copper foil 103 of the carrier film 140 is patterned by a photolithography process as shown in FIG. .

Next, as shown in (c), the second coverlay 132 is placed on the loop unit 110, and the loop unit 110 is transferred to the second coverray 132. The second coverlay 132 has a structure in which an adhesive agent 132a is applied to a film such as polyimide and the loop portion 110 of the carrier film 140 is transferred to the second coverray 132 by the adhesiveness of the adhesive agent . Next, when the carrier film 140 is removed as shown in (d), one of the objects to be bonded is completed.

The copper foil may be directly adhered to the second cover layer 132 without using the carrier film 140 and then the photolithography process may be performed using the carrier film 140. In this case, It is also possible to directly form the loop portion 110 through the process.

Fig. 6 sequentially shows the process of manufacturing the jumper portion, which is another one of the objects to be bonded.

In the case of this process, the carrier film 150 may be used as in the previous case. 6A, the copper foil 105 is bonded to the carrier film 150, and the insulating layer 123 is laminated on the copper foil 105 as shown in FIG. 6B. Then, the first and second jump holes 121 and 122 ). The first and second jump holes 121 and 122 can be formed by patterning the insulating layer 123 through a photolithography process.

On the other hand, in the case of using the bonding sheet as the insulating layer 123, it is also possible to form the first and second jump holes 121 and 122 on the bonding sheet through punching of the bonding sheet without using the photolithography process. In this case, after the first and second jump holes 121 and 122 are formed by punching the bonding sheet, the bonding sheet having the first and second jump holes 121 and 122 is bonded to the copper foil 105, 123) forming process.

Next, a mask 107 (for example, a dry film) for patterning the circuit is placed on the insulating layer 123 as shown in (c), and then the connection pattern 126 is formed by patterning the copper foil 105 as shown in (d) do.

Next, as shown in (e), the first and second jump holes 121 and 122 are filled with a conductive paste or a conductive material is adhered to form conductors 124 and 125, thereby completing the remaining structure of the object to be bonded.

FIG. 7 shows a process of attaching the two structures completed in the manufacturing process shown in FIGS. 5 and 6 to each other.

According to Fig. 7, two objects to be bonded are adhered to each other by thermocompression (hot pressing). That is, the jumper portion 120 and the first coverlay 131 may be attached to the looper portion 110 by thermocompression bonding.

Particularly, when the low temperature solder paste is used as the conductors 124 and 125, when the adhesives 131a and 132a of the first and second cover rails 131 and 132 are melted during the hot pressing, the low temperature solder paste is melted and connected to the looper portion 110 . The first cover rails 131 and the jumper portions 120 can be attached to the rupturable portion 110 at the same time.

The adhesive 131 of the second coverlay 132 melts and uniformly spreads to the space under the insulating layer 123 of the jumper part 120 so that the entire area of the jumper part 120 is adhered to the rupturable part 120 And the adhesive force between the jumper portion 120 and the loop portion 110 can be improved.

In this embodiment, the thermocompression bonding is exemplified as the bonding method of the two structures manufactured by the manufacturing process as shown in FIGS. 5 and 6. However, the bonding method is not limited to this, and other methods such as a hot- It is also possible through.

As shown in FIG. 7, after bonding the two structures, the carrier film 150 is removed to complete the final finished loop antenna.

FIG. 8 is a plan view showing a loop antenna according to another embodiment of the present invention, and FIG. 9 is a view showing a configuration of each layer constituting the loop antenna of FIG. 9 (a), 9 (b) and 9 (c) show upper, lower and intermediate layers, respectively.

The loop antenna of the present embodiment includes a first loop portion 210, a second loop portion 220, a first jumper 230, a second jumper 240, and an insulating layer 250.

According to the present embodiment, the first loop unit 210 and the second loop unit 220 constitute independent circuits. For example, when the first loop unit 210 constitutes a circuit for the primary antenna, the second loop unit 220 may constitute a circuit for a secondary antenna or a circuit board for wireless charging.

The first loop unit 210 includes a first loop pattern 213, a first terminal unit 211 and a second terminal unit 212 extending from an outer end of the first loop pattern 213. The first loop pattern 213, the first terminal portion 211, and the second terminal portion 212 are provided on the lower layer as the same layer.

The second loop portion 220 includes a second loop pattern 223, a third terminal portion 221 and a fourth terminal portion 222 extending from an outer end of the second loop pattern 223. The second loop pattern 223, the third terminal portion 221, and the fourth terminal portion 222 are provided on the upper layer as the same layer.

The first jumper 230 is provided on the lower layer and on the same layer as the first loop 210 and has a function of electrically connecting the inner end of the second loop pattern 223 to the third terminal 221 .

The second jumper 233 is provided on the upper layer and on the same layer as the second loop 220 and has a function of electrically connecting the inner end of the first loop pattern 213 to the first terminal 211 .

The insulating layer 250 is an insulating material (for example, a solder resist, a bonding sheet, or the like) and is provided between the upper layer and the lower layer. The insulating layer 250 functions as an intermediate layer to electrically isolate the first loop portion 210 and the second loop portion 220 from each other.

The insulating layer 250 is provided with a conductive part 260 for connecting between the first loop part 210 and the second jumper 240 and between the second loop part 220 and the first jumper 230 . The conductor portion 260 includes a first conductor 261 for connecting the third terminal portion 221 to one end of the first jumper 120 and a first conductor 261 for connecting the inner end of the second loop pattern 223 and the first jumper 230 A third conductor 263 for connecting one end of the first terminal portion 211 to one end of the second jumper 240 and a second conductor 263 for connecting the other end of the first loop portion 213 And a fourth conductor 264 for connecting the inner end of the second jumper 240 to the other end of the second jumper 240.

The coverlay may be adhered to the outer surface of the upper layer and the coverlay similarly to the previous embodiment.

According to the loop antenna of the present embodiment, the loop antenna having two circuits having different functions can be realized in the form of a substrate having an integral structure with a slim thickness.

The loop antenna of this embodiment may have a method of manufacturing a structure corresponding to each layer similar to the manufacturing process of the foregoing embodiment, and then bonding these structures through a process such as thermocompression bonding.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is to be understood that the invention is not limited to the disclosed exemplary embodiments, Various modifications may be made by those skilled in the art.

Claims (10)

A loop portion of a conductive material having a loop pattern, a first terminal portion, and a second terminal portion extending from an outer end of the loop pattern on the same layer;
A jumper which is joined to one surface of the loop portion and electrically connects the inner end portion of the loop pattern to the first terminal portion; And
And first and second cover rails attached to one surface and the other surface of the loop portion to protect the loop portion,
The jumper portion
An insulating layer having first and second jump holes formed at a connection portion between the loop pattern and the first terminal portion;
A conductor provided inside the first and second jump holes and bonded to the loop pattern and the first terminal portion; And
And a connection pattern formed on one surface of the insulating layer and connected to the conductors of the first and second jump holes. delete The method according to claim 1,
The end portions of the first and second terminal portions are exposed to the outside of the first and second cover rails to be electrically connected to other electric circuits,
And a through hole for penetrating the solder paste is formed at an end portion of the first and second terminal portions when soldered to another electric circuit. The method according to claim 1,
Wherein the first cover layer covers an area excluding the position of the jumper part. A loop portion of a conductive material having a loop pattern, a first terminal portion, and a second terminal portion extending from an outer end of the loop pattern; A jumper which is joined to one surface of the loop portion and electrically connects the inner end portion of the loop pattern to the first terminal portion; And a first cover layer and a second cover layer attached to one surface and the other surface of the loop portion to protect the loop portion,
Fabricating the jumper portion and the structure having the loop portion attached to the second coverlay using a photolithography process; And
Attaching the jumper portion and the first coverlay to the loop portion,
Wherein the jumper portion is attached to the loop portion by thermocompression bonding. delete 6. The method of claim 5,
The manufacturing step of the structure in which the loop portion is attached to the second coverlay,
Bonding the first copper foil to the first carrier film;
Patterning the first copper foil to form the loop portion; And
And transferring the loop portion to the second coverlay and removing the first carrier film. 6. The method of claim 5,
Wherein the step of manufacturing the jumper portion comprises:
Bonding a second copper foil to the second carrier film;
Depositing an insulating layer on the second copper foil and patterning the insulating layer to form first and second jump holes;
Forming a connection pattern connecting the first and second jump holes by patterning the second copper foil; And
And filling the first and second jump holes with a conductive paste or bonding a conductive material to the first and second jump holes. A first loop portion including a first loop pattern, a first terminal portion, and a second terminal portion extending from an outer end of the first loop pattern;
A second loop portion having a third terminal portion and a fourth terminal portion extending from an outer end of the second loop pattern in an upper layer;
A first jumper provided on the lower layer for electrically connecting an inner end portion of the second loop pattern to the third terminal portion;
A second jumper provided on the upper layer for electrically connecting the inner end of the first loop pattern to the first terminal portion; And
And an insulating layer provided between the upper and lower layers and including a conductive portion for connecting the first loop portion and the second jumper and between the second loop portion and the first jumper. 10. The semiconductor device according to claim 9,
A first conductor for connecting the third terminal portion to one end of the first jumper;
A second conductor for connecting the inner end of the second loop pattern to the other end of the first jumper;
A third conductor for connecting one end of the first terminal portion and the second jumper; And
And a fourth conductor for connecting the inner end of the first loop pattern and the other end of the second jumper.
KR20140080079A 2014-06-27 2014-06-27 Loop antenna and manufacturing method of the same KR101510818B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR20140080079A KR101510818B1 (en) 2014-06-27 2014-06-27 Loop antenna and manufacturing method of the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR20140080079A KR101510818B1 (en) 2014-06-27 2014-06-27 Loop antenna and manufacturing method of the same

Publications (1)

Publication Number Publication Date
KR101510818B1 true KR101510818B1 (en) 2015-04-10

Family

ID=53034109

Family Applications (1)

Application Number Title Priority Date Filing Date
KR20140080079A KR101510818B1 (en) 2014-06-27 2014-06-27 Loop antenna and manufacturing method of the same

Country Status (1)

Country Link
KR (1) KR101510818B1 (en)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20090043077A (en) * 2007-10-29 2009-05-06 강승오 Antenna for radio frequency identification and method of manufacturing the same
KR20130051862A (en) * 2012-01-30 2013-05-21 주식회사 엔엔피 Metal card and fabricating method the same

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20090043077A (en) * 2007-10-29 2009-05-06 강승오 Antenna for radio frequency identification and method of manufacturing the same
KR20130051862A (en) * 2012-01-30 2013-05-21 주식회사 엔엔피 Metal card and fabricating method the same

Similar Documents

Publication Publication Date Title
US8677612B2 (en) Method for manufacturing flex-rigid wiring board
US20150114690A1 (en) Flex-rigid wiring board and method for manufacturing flex-rigid wiring board
US9024203B2 (en) Embedded printed circuit board and method for manufacturing same
US10219367B2 (en) Multilayer resin substrate, and method of manufacturing multilayer resin substrate
US9480173B2 (en) Flex-rigid wiring board and method for manufacturing flex-rigid wiring board
KR100903373B1 (en) Loop Antenna And Manufacturing Method Of The Same
TWI606769B (en) Method for manufacturing rigid-flexible printed circuit board
EP2965596B1 (en) The invention relates to a method for producing a printed circuit board with multilayer sub-areas in sections
US6745463B1 (en) Manufacturing method of rigid flexible printed circuit board
TWI586232B (en) Printed circuit board and method of manufacturing the same
KR101905879B1 (en) The printed circuit board and the method for manufacturing the same
TW201228511A (en) Method for manufacturing multilayer printed circuit board
JP2012009478A (en) Connection structure, and electronic apparatus
KR101510818B1 (en) Loop antenna and manufacturing method of the same
KR20130055990A (en) Rigid-flexible printed circuit board and method for manufacturing the same
KR101485058B1 (en) Loop antenna and manufacturing method of the same
US20140353017A1 (en) Printed wiring board and method for manufacturing the same
JP2012230954A (en) Printed wiring board and printed wiring board manufacturing method
KR20160105092A (en) Loop antenna and manufacturing method of the same
WO2019198241A1 (en) Method for manufacturing board with embedded components, and board with embedded components
JP2009289789A (en) Printed wiring board with built-in component and its manufacturing method
JP6387226B2 (en) Composite board
CN114391304B (en) Board-to-board connection structure and manufacturing method thereof
TWI401010B (en) Method for manufacturing rigid-flexible printed circuit board
JP2011199103A (en) Wiring board and method of manufacturing the same

Legal Events

Date Code Title Description
E701 Decision to grant or registration of patent right
LAPS Lapse due to unpaid annual fee