KR101499960B1 - Camera module package and method of valuable the same - Google Patents

Camera module package and method of valuable the same Download PDF

Info

Publication number
KR101499960B1
KR101499960B1 KR1020080080955A KR20080080955A KR101499960B1 KR 101499960 B1 KR101499960 B1 KR 101499960B1 KR 1020080080955 A KR1020080080955 A KR 1020080080955A KR 20080080955 A KR20080080955 A KR 20080080955A KR 101499960 B1 KR101499960 B1 KR 101499960B1
Authority
KR
South Korea
Prior art keywords
substrate
cube
lens
lens holder
heat
Prior art date
Application number
KR1020080080955A
Other languages
Korean (ko)
Other versions
KR20100022327A (en
Inventor
이진욱
Original Assignee
엘지이노텍 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 엘지이노텍 주식회사 filed Critical 엘지이노텍 주식회사
Priority to KR1020080080955A priority Critical patent/KR101499960B1/en
Publication of KR20100022327A publication Critical patent/KR20100022327A/en
Application granted granted Critical
Publication of KR101499960B1 publication Critical patent/KR101499960B1/en

Links

Images

Classifications

    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04NPICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N5/00Details of television systems
    • H04N5/222Studio circuitry; Studio devices; Studio equipment ; Cameras comprising an electronic image sensor, e.g. digital cameras, video cameras, TV cameras, video cameras, camcorders, webcams, camera modules for embedding in other devices, e.g. mobile phones, computers or vehicles
    • H04N5/225Television cameras ; Cameras comprising an electronic image sensor, e.g. digital cameras, video cameras, camcorders, webcams, camera modules specially adapted for being embedded in other devices, e.g. mobile phones, computers or vehicles
    • H04N5/2251Constructional details
    • H04N5/2254Mounting of optical parts, e.g. lenses, shutters, filters or optical parts peculiar to the presence or use of an electronic image sensor
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04NPICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N5/00Details of television systems
    • H04N5/222Studio circuitry; Studio devices; Studio equipment ; Cameras comprising an electronic image sensor, e.g. digital cameras, video cameras, TV cameras, video cameras, camcorders, webcams, camera modules for embedding in other devices, e.g. mobile phones, computers or vehicles
    • H04N5/225Television cameras ; Cameras comprising an electronic image sensor, e.g. digital cameras, video cameras, camcorders, webcams, camera modules specially adapted for being embedded in other devices, e.g. mobile phones, computers or vehicles
    • H04N5/2251Constructional details
    • H04N5/2253Mounting of pick-up device, electronic image sensor, deviation or focusing coils
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04Soldering or other types of metallurgic bonding
    • H05K2203/043Reflowing of solder coated conductors, not during connection of components, e.g. reflowing solder paste
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04Soldering or other types of metallurgic bonding
    • H05K2203/049Wire bonding

Abstract

A camera module package according to an embodiment of the present invention includes a lens module including a lens assembly including a plurality of lenses and a lens holder to which the lens assembly is coupled, A cube substrate having an upper surface on which an image sensor for converting an image signal into an electrical signal is mounted by wire bonding and a lower surface on which a surface mounting pad is formed and a cube substrate, Wherein the lens holder is mounted on the cube substrate with a heat resistant tape attached to the opening and the heat resistant tape is removed and the lens assembly is coupled after the cube substrate is mounted on the main substrate. Accordingly, it is possible to prevent damage to the lens and the image sensor in a high-temperature reflow process. Further, when mounting a cube substrate, a plurality of devices, a digital microphone, and the like on the main substrate, Since there is no process, the digital microphone can be prevented from being damaged.
Camera module, cube board, surface mount, heat-resistant tape

Description

Camera module package and method of the same

An embodiment of the present invention relates to a camera module package and a method of processing the same.

Currently, camera modules are installed in the manufacture of automobiles, endoscopes, webcams, etc. including IT devices such as mobile communication terminals, PDAs, MP3 players, etc. Such camera modules are developed centering on high- Small size and thinning are progressing.

In general, camera module manufacturing methods include COF (Chip On Film), COB (Chip On Board), and CSP (Chip Scale Package) )to be.

The COB method is similar to the existing semiconductor production line, but the productivity is high. However, since the space between the image sensor and the substrate must be electrically connected via the wire, an additional space is required, which causes a disadvantage that the size of the camera module as a whole increases. In addition, in the case of a camera module used in a webcam mounted on a notebook or a monitor, a digital microphone is attached to a camera module used in a webcam and a problem of an increase in a PCB price, and a digital microphone is damaged by a cleaning operation in a COB process .

Embodiments of the present invention provide a method of preventing damage to a digital microphone caused by a cleaning operation by preventing a lens and an image sensor from being damaged during a process using a camera module capable of surface mounting without a separate electrical connection means on a main board, A camera module package and a method of processing the same are provided.

A camera module package according to an embodiment of the present invention includes a lens module including a lens assembly including a plurality of lenses and a lens holder to which the lens assembly is coupled, A cube substrate having an upper surface on which an image sensor for converting an image signal into an electrical signal is mounted by wire bonding and a lower surface on which a surface mounting pad is formed and a cube substrate, Wherein the lens holder is mounted on the cube substrate with a heat resistant tape attached to the opening and the heat resistant tape is removed and the lens assembly is coupled after the cube substrate is mounted on the main substrate.

At this time, the lens module includes an IR filter for filtering infrared light, and at least one element is mounted on the cube substrate. The cube substrate and the main substrate may be a printed circuit board or a ceramic substrate. The lens holder may be injection molded of a material having high heat resistance. The lens assembly may be a plurality of lenses made of plastic .

A camera module package processing method according to an embodiment of the present invention includes a first step of attaching an image sensor on a cube substrate and then die bonding and wire bonding, A second step of mounting a lens holder having a heat resistant tape on a cube substrate mounted on a main substrate, a step of attaching the cube substrate and a plurality of elements and a digital microphone on the main substrate, And a fourth step of fastening the lens assembly after removing the heat-resistant tape attached to the lens holder.

At least one element is mounted on a cube substrate before the first step and then passed through a reflow. The cube substrate and the main substrate are coated with a solder, It is preferable that each component is soldered after printing. In addition, in the first and second steps, a cleaning process is performed to remove foreign substances, etc., a surface mounting pad for bonding with the main substrate is formed on the lower surface of the cube substrate, The assembly is preferably made of a plurality of lenses made of a plastic material.

A camera module package according to an embodiment of the present invention includes a lens holder having a heat resistant tape attached thereto and an image sensor, and soldering a cube substrate having a surface mounting pad formed thereon to a main substrate Thereafter, the lens and image sensor are prevented from being damaged in a high-temperature reflow process by removing the heat-resistant tape and fastening the lens assembly.

In addition, since there is no separate cleaning process when mounting a cube substrate, a plurality of elements, a digital microphone, and the like on the main substrate, damage to the digital microphone is prevented.

Hereinafter, a camera module package according to an embodiment of the present invention and a method of processing the same will be described in detail with reference to the accompanying drawings.

1 is a view showing a configuration of a camera module package according to an embodiment of the present invention.

1, a camera module package according to an embodiment of the present invention includes a lens module 105 having a lens assembly 111 composed of a plurality of lenses, a lens holder 107 to which the lens assembly is coupled, An upper surface on which the lens holder 107 is mounted and on which an image sensor 103 for converting light incident through the lens module 105 into an electrical signal is mounted by wire bonding and a surface mounting pad 102 is formed And a main board 113 on which a plurality of elements are mounted. The lens holder 107 is mounted on the cube substrate 101 and the cube substrate 101, After the tape 109 is attached to the cube substrate 101 and the cube substrate 101 is mounted on the main substrate 113, the heat resistant tape 109 is removed and the lens assembly 111 is coupled .

At this time, the lens module 105 includes an IR filter (not shown) for filtering infrared light, and at least one element is mounted on the cube substrate 101. The cube substrate 101 and the main substrate 113 are made of a printed circuit board or a ceramic substrate and the lens holder 107 is made of a highly heat resistant material capable of withstanding a heating temperature of about 250 ° It is preferable to use a molded product.

An image sensor 103 is wire-bonded to the upper surface of the cube substrate 101 to convert light incident from the lens into an electrical signal. and a surface mounting pad 102 is formed on the main substrate 113 on which the solder cream is printed so that a cube can be attached to the cube coupling part 115 on the main substrate 113. [ After the substrate 101 is placed and passed through a reflow, the solder joint is fixed to the solder joint by the melting of the solder cream without electrical connection means.

In addition, a lens holder 107 is attached to the upper surface of the cube substrate 101, and it is preferable to fix the lens holder 107 by using epoxy or the like. A heat resistant tape 109 is attached to the opening of the lens holder 107. The cube substrate 101 is mounted on the main board 113 and the ripple for soldering bonding the surface mounting pad 102 To prevent damage to the image sensor due to heat during low pass and to prevent foreign substances from penetrating into the holder during the process.

A cube substrate 101 on which both the image sensor 103 and the lens holder 107 are mounted and a plurality of elements such as a digital microphone 117 on the main substrate 113 on which a solder cream is printed The heat resistant tape 109 adhering to the lens holder 107 is removed and the lens assembly 111 is then fastened to the lens holder 107. [ Therefore, even if a lens made of a conventional plastic material is used, it is fastened to the lens holder after the reflow process, so that damage due to heat can be prevented. At this time, the devices mounted on the cube substrate 101 and the main substrate 113 include capacitors, resistors, diodes, transistors, and the like, and other devices may be added.

2 is a flowchart illustrating a camera module package processing method according to an embodiment of the present invention.

A method of processing a camera module package according to an embodiment of the present invention includes printing a solder cream on a cube substrate (S201), placing at least one device thereon, passing through a reflow, (S203). The image sensor is mounted on the upper surface of the cube substrate to which the device is bonded and fixed and then die bonding and wire bonding are performed (S205). Then, a lens holder having a heat resistant tape attached to the opening is mounted mount and fixed on the substrate (S207).

Thereafter, a solder cream is printed on the main substrate (S209), the cube substrate, a plurality of elements and digital microphones are placed on the main substrate, and the microphones are bonded and fixed through a reflow (S211) , The heat-resistant tape attached to the opening of the lens holder is removed, and the lens assembly is tightened (S213). The above process is illustrated in FIG. 3. That is, even if a lens made of a conventional plastic material is used, it is fastened to the lens holder after the reflow process, thereby preventing damage due to heat.

At this time, it is preferable that a surface mounting pad is formed on the lower surface of the cube substrate so that bonding and fixing can be performed by soldering without a separate electrical connection means on the main substrate.

In addition, a separate cleaning operation is performed in order to remove foreign substances generated in a cube substrate process. The cleaning process is performed only during a cube substrate process, and then a cube substrate, a plurality of devices, When a digital microphone or the like is jointly fixed, it is not required to perform a separate cleaning operation, so that it is possible to prevent damage to the digital microphone due to cleaning.

The foregoing description is merely illustrative of the technical idea of the present invention, and various changes and modifications may be made by those skilled in the art without departing from the essential characteristics of the present invention. Therefore, the embodiments disclosed in the present invention are intended to illustrate rather than limit the scope of the present invention, and the scope of the technical idea of the present invention is not limited by these embodiments. The scope of protection of the present invention should be construed according to the following claims, and all technical ideas within the scope of equivalents should be construed as falling within the scope of the present invention.

1 is a view showing a configuration of a camera module package according to an embodiment of the present invention.

2 is a flowchart illustrating a camera module package processing method according to an embodiment of the present invention.

3 is a diagram illustrating a camera module package processing method according to an embodiment of the present invention.

Claims (12)

  1. A lens module including a lens assembly including a plurality of lenses and a lens holder to which the lens assembly is coupled;
    An image sensor for mounting the lens holder and converting light incident through the lens module into an electrical signal is mounted by wire bonding and a lower surface on which a surface mounting pad is formed, ) Board;
    The cube substrate, the main substrate on which a plurality of elements are mounted
    / RTI >
    Wherein the lens holder is mounted on the cube substrate with a heat-resistant tape attached to the opening, the cube substrate on which the lens holder is mounted passes through the reflow and is bonded to the main substrate, after which the heat-resistant tape is removed, And a camera module package coupled to the lens holder.
  2. The method according to claim 1,
    Wherein the lens module comprises an IR filter for filtering infrared light.
  3. The method according to claim 1,
    Wherein the cube substrate mounts at least one device.
  4. The method according to claim 1,
    Wherein the cube substrate and the main substrate are printed circuit boards or ceramic substrates.
  5. The method according to claim 1,
    Wherein the lens holder is formed by injection-molding a material having high heat resistance.
  6. The method according to claim 1,
    Wherein the lens assembly comprises a plurality of lenses made of a plastic material.
  7. A first step of placing an image sensor on a cube substrate, followed by die bonding and wire bonding;
    A second step of mounting a lens holder having a heat-resistant tape attached to an opening on a cube substrate to which the image sensor is attached;
    A third step of attaching the cube substrate, a plurality of elements and a digital microphone on the main substrate and passing through a reflow;
    A fourth step of removing the heat-resistant tape attached to the lens holder and then fastening the lens assembly to the lens holder
    The method comprising the steps of:
  8. 8. The method of claim 7, wherein before the first step
    Attaching at least one element on a cube substrate and then passing through a reflow.
  9. 8. The method of claim 7,
    And a solder is printed on the cube substrate and the main substrate, and then the respective components are soldered.
  10. 8. The method according to claim 7, wherein in the first to second steps
    And a cleaning process for removing foreign substances.
  11. 8. The method of claim 7,
    Wherein a surface mounting pad for bonding with the main substrate is formed on a lower surface of the cube substrate.
  12. 8. The method of claim 7,
    Wherein the lens assembly comprises a plurality of lenses of plastic material.
KR1020080080955A 2008-08-19 2008-08-19 Camera module package and method of valuable the same KR101499960B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020080080955A KR101499960B1 (en) 2008-08-19 2008-08-19 Camera module package and method of valuable the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020080080955A KR101499960B1 (en) 2008-08-19 2008-08-19 Camera module package and method of valuable the same

Publications (2)

Publication Number Publication Date
KR20100022327A KR20100022327A (en) 2010-03-02
KR101499960B1 true KR101499960B1 (en) 2015-03-06

Family

ID=42174913

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020080080955A KR101499960B1 (en) 2008-08-19 2008-08-19 Camera module package and method of valuable the same

Country Status (1)

Country Link
KR (1) KR101499960B1 (en)

Families Citing this family (31)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10757308B2 (en) 2009-03-02 2020-08-25 Flir Systems, Inc. Techniques for device attachment with dual band imaging sensor
US10169666B2 (en) 2011-06-10 2019-01-01 Flir Systems, Inc. Image-assisted remote control vehicle systems and methods
US9998697B2 (en) 2009-03-02 2018-06-12 Flir Systems, Inc. Systems and methods for monitoring vehicle occupants
US9948872B2 (en) 2009-03-02 2018-04-17 Flir Systems, Inc. Monitor and control systems and methods for occupant safety and energy efficiency of structures
US9451183B2 (en) 2009-03-02 2016-09-20 Flir Systems, Inc. Time spaced infrared image enhancement
US9900526B2 (en) 2011-06-10 2018-02-20 Flir Systems, Inc. Techniques to compensate for calibration drifts in infrared imaging devices
US9674458B2 (en) 2009-06-03 2017-06-06 Flir Systems, Inc. Smart surveillance camera systems and methods
US10051210B2 (en) 2011-06-10 2018-08-14 Flir Systems, Inc. Infrared detector array with selectable pixel binning systems and methods
US9986175B2 (en) 2009-03-02 2018-05-29 Flir Systems, Inc. Device attachment with infrared imaging sensor
US10389953B2 (en) 2011-06-10 2019-08-20 Flir Systems, Inc. Infrared imaging device having a shutter
US9843742B2 (en) 2009-03-02 2017-12-12 Flir Systems, Inc. Thermal image frame capture using de-aligned sensor array
US9756264B2 (en) 2009-03-02 2017-09-05 Flir Systems, Inc. Anomalous pixel detection
US9635285B2 (en) 2009-03-02 2017-04-25 Flir Systems, Inc. Infrared imaging enhancement with fusion
US9961277B2 (en) 2011-06-10 2018-05-01 Flir Systems, Inc. Infrared focal plane array heat spreaders
US10244190B2 (en) 2009-03-02 2019-03-26 Flir Systems, Inc. Compact multi-spectrum imaging with fusion
US9973692B2 (en) 2013-10-03 2018-05-15 Flir Systems, Inc. Situational awareness by compressed display of panoramic views
US9716843B2 (en) 2009-06-03 2017-07-25 Flir Systems, Inc. Measurement device for electrical installations and related methods
US9819880B2 (en) 2009-06-03 2017-11-14 Flir Systems, Inc. Systems and methods of suppressing sky regions in images
US10091439B2 (en) 2009-06-03 2018-10-02 Flir Systems, Inc. Imager with array of multiple infrared imaging modules
US9843743B2 (en) 2009-06-03 2017-12-12 Flir Systems, Inc. Infant monitoring systems and methods using thermal imaging
US9756262B2 (en) 2009-06-03 2017-09-05 Flir Systems, Inc. Systems and methods for monitoring power systems
US9706138B2 (en) 2010-04-23 2017-07-11 Flir Systems, Inc. Hybrid infrared sensor array having heterogeneous infrared sensors
US9848134B2 (en) 2010-04-23 2017-12-19 Flir Systems, Inc. Infrared imager with integrated metal layers
US9509924B2 (en) 2011-06-10 2016-11-29 Flir Systems, Inc. Wearable apparatus with integrated infrared imaging module
CN103748867B (en) 2011-06-10 2019-01-18 菲力尔系统公司 Low-power consumption and small form factor infrared imaging
US10079982B2 (en) 2011-06-10 2018-09-18 Flir Systems, Inc. Determination of an absolute radiometric value using blocked infrared sensors
US9143703B2 (en) 2011-06-10 2015-09-22 Flir Systems, Inc. Infrared camera calibration techniques
US9706137B2 (en) 2011-06-10 2017-07-11 Flir Systems, Inc. Electrical cabinet infrared monitor
CA2838992C (en) 2011-06-10 2018-05-01 Flir Systems, Inc. Non-uniformity correction techniques for infrared imaging devices
US9811884B2 (en) 2012-07-16 2017-11-07 Flir Systems, Inc. Methods and systems for suppressing atmospheric turbulence in images
KR102107654B1 (en) * 2012-07-30 2020-05-07 엘지이노텍 주식회사 Camera Module

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20040105430A (en) * 2003-06-09 2004-12-16 주식회사 대현에스티 soldering method of printed circuit board and it's adapted sticking device of heatproof tape
JP2005142442A (en) * 2003-11-07 2005-06-02 Sony Corp Printed circuit board and mounting method of surface mounted component
KR100813600B1 (en) * 2006-09-29 2008-03-17 삼성전기주식회사 Camera module and manufacturing method thereof
KR20080044927A (en) * 2006-11-17 2008-05-22 (주)케이나인 Smt type camera module for improving connection with pcb

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20040105430A (en) * 2003-06-09 2004-12-16 주식회사 대현에스티 soldering method of printed circuit board and it's adapted sticking device of heatproof tape
JP2005142442A (en) * 2003-11-07 2005-06-02 Sony Corp Printed circuit board and mounting method of surface mounted component
KR100813600B1 (en) * 2006-09-29 2008-03-17 삼성전기주식회사 Camera module and manufacturing method thereof
KR20080044927A (en) * 2006-11-17 2008-05-22 (주)케이나인 Smt type camera module for improving connection with pcb

Also Published As

Publication number Publication date
KR20100022327A (en) 2010-03-02

Similar Documents

Publication Publication Date Title
US8981511B2 (en) Multi-chip package for imaging systems
CN102782574B (en) There is camera module and the manufacture method of formed strip upside-down mounting imager mount
JP5531268B2 (en) Wafer level camera module with molded housing and manufacturing method
US8714843B2 (en) Camera module and method of manufacturing the same
JP5877595B2 (en) System and method for mounting an imaging device on a flexible substrate
US7664390B2 (en) Camera module package
KR100915134B1 (en) Image sensor camera module and method of manufacturing the same
US7872686B2 (en) Integrated lens and chip assembly for a digital camera
EP2309719B1 (en) Imaging element, imaging device, camera module and camera system
US8054370B2 (en) Wiring substrate, solid-state imaging apparatus using the same, and manufacturing method thereof
KR100704980B1 (en) Camera module package
US7259438B2 (en) Solid state imaging device and producing method thereof
EP2194835B1 (en) Image pickup apparatus and endoscope having the same
CN100431159C (en) Image pick equipment and its manufacturing method
US7329861B2 (en) Integrally packaged imaging module
US6737292B2 (en) Method of fabricating an image sensor module at the wafer level and mounting on circuit board
KR100614476B1 (en) Camera module and camera-module manufacturing method
US20140098288A1 (en) Small form factor modules using wafer level optics with bottom cavity and flip-chip assembly
US7643081B2 (en) Digital camera module with small sized image sensor chip package
EP1670238B1 (en) Camera module
US8199250B2 (en) Camera module package
US6011294A (en) Low cost CCD packaging
CN1157052C (en) Camera device and its manufacturing method, and electric equipment thereof
KR100833312B1 (en) Camera module
TWI392337B (en) Wafer based camera module and method of manufacture

Legal Events

Date Code Title Description
A201 Request for examination
E902 Notification of reason for refusal
E701 Decision to grant or registration of patent right
GRNT Written decision to grant
FPAY Annual fee payment

Payment date: 20180205

Year of fee payment: 4

FPAY Annual fee payment

Payment date: 20190213

Year of fee payment: 5

FPAY Annual fee payment

Payment date: 20200211

Year of fee payment: 6