KR101488618B1 - Selective soldering apparatus for printed circuit board - Google Patents

Abstract

The present invention relates to a soldering apparatus for a printed circuit board. The soldering apparatus includes a jig which allows a PCB having components to be mounted on an upper side and allows a soldering region between the components and the PCB to be exposed to a lower side, a storage bath which stores molten solder, a gripper which includes a first function which moves by the transmission of power from the outside and bines the jig in a moving process, and a second function which moves the jig to allow the soldering region to be dipped in the storage bath, and a support unit which pressurizes the components without moving the component in a dipping process.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a soldering apparatus for a printed circuit board,

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a soldering apparatus for a printed circuit board, and more particularly, to a soldering apparatus for a printed circuit board that performs local soldering for mounting components on a printed circuit board.

A printed circuit board is a thin plate on which electronic components such as an integrated circuit, a resistor or a switch are soldered, and a process in which parts are soldered to such a printed circuit board is called soldering.

Soldering refers to a process in which a component is mounted on a printed circuit board, that is, a leg of the component is inserted into a through hole formed in a printed circuit board and then soldered using solder, that is, solder. As a method, for example, flow soldering or reflow soldering is used.

Flow soldering is a method in which a printed circuit board is dipped in molten solder and cured, or a method in which a melted solder is embedded in a printed circuit board conveyed by a conveyor, And reflow soldering is performed by printing cream solder on a printed circuit board and then heating in an oven to dissolve the solder and cure.

Meanwhile, in the above-described soldering method for dipping the printed circuit board into the melted solder and then hardening the printed circuit board, the buoyancy acts in the process of dipping the printed circuit board on the melted solder, (Floating). In this case, there is a problem that the leg of the component is soldered in a state that the leg of the component is not completely inserted into the printed circuit board, thereby causing defective product.

The conventional soldering method of a printed circuit board also provides a structure for preventing the leg of the component from being separated from the through hole of the printed circuit board in order to solve this problem.

As a specific example of such a structure, there is a following patent document. In the following Patent Document, a bent portion bent in a leg of a component inserted into a through hole of a printed circuit board is formed so that the bent portion is caught below the through hole of the printed circuit board So that the mounted component to the printed circuit board does not deviate from its mounting position despite the action of buoyancy.

However, according to this conventional structure, there is a problem in that a bent portion is required to be formed for each leg of the component, and since legs of the component are formed of very thin fine lines in some cases, the legs are broken in the process of forming the bent portions , It may result in defective parts themselves.

Patent Document: Korean Patent No. 10-0359080

According to one aspect of the present invention, there is provided a soldering apparatus for a printed circuit board that can automate a process of mounting components on a printed circuit board to solder them, In order to provide a soldering apparatus for a printed circuit board in which a component mounted on a printed circuit board can be held at a predetermined position even if buoyancy due to molten solder acts on the printed circuit board in a process of dipping the printed circuit board on the printed circuit board. will be.

A soldering apparatus for a printed circuit board according to an exemplary embodiment of the present invention includes a jig for mounting a printed circuit board on which components are mounted and exposed in a soldering region between the component and the printed circuit board in a downward direction, A first function of transferring power from the outside to bind the jig in a moving process and a second function of moving the jig so that the soldering area is dipped into the storage tank, A gripper for performing the function of containing the liquid, and a supporting means for pressing the component to prevent the component from flowing in the dipping process.

In the soldering apparatus of the printed circuit board according to the embodiment of the present invention, the support means may be provided at one side of the gripper facing the component.

In the soldering apparatus for a printed circuit board according to an embodiment of the present invention, the supporting means may include a plate fixed to one side of the gripper, and a push pin protruding from the plate in the direction of the component .

In the soldering apparatus for a printed circuit board according to an embodiment of the present invention, the end portion of the push pin contacting the component may be made of a resilient material.

In the soldering apparatus for a printed circuit board according to an embodiment of the present invention, the push pin includes a hollow first body having one end fixed to the plate and the other end opened, a coil spring And a second body that can be elastically retracted or drawn out from the first body by the coil spring while one end is inserted into the other open end of the first body.

In the soldering apparatus for a printed circuit board according to an embodiment of the present invention, the other end of the second body contacting the component may be made of a resilient material.

The features and advantages of the present invention will become more apparent from the following detailed description based on the accompanying drawings.

According to the present invention, the printed circuit board and the components can be supported by the support means during the gripper's first function, that is, during the process of binding the jig, and even if the buoyancy acts during the second function, It is possible to maintain the position while being stably supported without floating. As a result, problems such as defective soldering due to lifting of the component do not occur.

1 is a schematic view showing a soldering apparatus for a printed circuit board according to an embodiment of the present invention;
Fig. 2 is a schematic view showing a printed circuit board mounted on the jig shown in Fig. 1. Fig.
Fig. 3 is a schematic view showing a state where the jig is engaged with the gripper shown in Fig. 1. Fig.
4 is a schematic view showing a state in which a component mounted on a printed circuit board is supported by a push pin;
5 is a cross-sectional view showing a specific example of the push pin shown in Fig.

Hereinafter, a soldering apparatus for a printed circuit board according to an embodiment of the present invention will be described in detail.

FIG. 1 is a schematic view showing a soldering apparatus of a printed circuit board according to an embodiment of the present invention. FIG. 2 is a schematic view showing a printed circuit board mounted on the jig shown in FIG. 1. FIG. Fig. 4 is a schematic view showing a state in which a component mounted on a printed circuit board is supported by a push pin 420, and Fig. 5 is a schematic view showing a state in which the push pin 420 shown in Fig. 4 Sectional view showing a concrete example.

As shown in the figure, a soldering apparatus for a printed circuit board according to an embodiment of the present invention includes a jig 100, a storage tank 200, a gripper 300, and a support means 400.

First, the soldering apparatus of the printed circuit board according to the present embodiment may include a device body (not shown) for supporting the component parts such as the gripper 300 described later to perform the functions. In addition to the above-described components, a power transmission means such as a motor for transmitting the power necessary for the operation of the gripper 300 may be included in the apparatus main body, and a support frame for guiding the movement of the gripper 300 may be provided. Further, a control unit for controlling the operation of the gripper 300 may be included.

The jig 100 allows the printed circuit board 10 to be seated and supported. The component 20 is mounted on one side of the printed circuit board 10, and the component 20 may be a connector to which other electric components can be electrically connected, for example. The component 20 mounted on the printed circuit board 10 can be mounted on one side of the upper surface of the printed circuit board 10 as shown in the figure. At this time, the lower part of the component 20 may be provided with a leg 21 extending downward. The leg 21 is inserted through the through hole 11 formed in the printed circuit board 10, 20 can be mounted on the printed circuit board 10. The portion of the through hole 11 through which the leg 21 penetrates is a portion where the component 20 is soldered to the printed circuit board 10. Therefore, hereinafter, the lower surface region of the printed circuit board 10 including the portion of the through hole 11 to be soldered in this way is referred to as a "soldering region ".

The printed circuit board 10 on which the component 20 is mounted is seated and supported by the jig 100. The jig 100 may be formed with a recessed portion 110 which is recessed in the thickness direction so that the printed circuit board 10 can be seated. 1, the width of the groove 110 in the left-right direction has a width corresponding to the width of the printed circuit board 10 in the left-right direction, and the width of the groove 110 in the front- The directional width is set to have a width corresponding to the front-to-rear width of the entire printed circuit board 10 and the component 20 (lateral width of the printed circuit board 10 and the entirety of the component 20 on the basis of FIG. 4) It is possible to prevent horizontal flow of the printed circuit board 10 seated on the groove 110.

The soldering area A needs to be exposed downward of the jig 100 so that the soldering operation can be performed in a state where the printed circuit board 10 is seated in the groove part 110. [ A cutout portion 111 is formed at one side of the groove portion 110 formed in the jig 100 so as to penetrate the jig 100 in the vertical direction so that the soldering region A is exposed below the jig 100 . The grooves 110 and the cutouts 111 are formed in the jig 100 so that the printed circuit board 10 is supported on the lower surface while being seated in the grooves 110 and the soldering area A is formed on the cutouts 111, And is exposed to the lower side of the jig 100 through the through-

In the reservoir 200, a solder 210 is stored in a molten state. The storage tank 200 may be disposed on the movement path of the gripper 300, which will be described later.

The gripper 300 receives power from the outside and can move while being supported by the apparatus main body. The gripper 300 can perform at least two functions in the course of moving. First, the gripper 300 may allow the jig 100 to be bound to the gripper 300 so that the jig 100 can be moved integrally with the gripper 300 (first function). And the gripper 300 can move so that the soldering area A described above can be dipped into the reservoir 200 by moving the jig 100 bound to the position of the reservoir 200 function).

The gripper 300 may perform the functions including the first function and the second function. The following example may be presented as a specific structure of the gripper 300 for performing such a function.

The gripper 300 may include a flat main body 310 and a plurality of binding bars 320 extending downward from the bottom edge of the main body 310 as shown in FIG. . The main body 310 may be provided so as to be movable up and down and left and right in the main body of the apparatus. The lower end of the binding bar 320 has a diameter smaller than that of the binding bar 320 adjacent to the upper side and the lower side in the longitudinal direction so as to be able to bind to the jig 100, The engaging groove 321 can be formed. The binding bar 320 may be coupled to the main body 310 such that the binding bar 320 can move horizontally on the lower surface of the main body 310 while the upper end is coupled to the lower edge of the main body 310. The jig 100 may be formed with an insertion hole 120 at the edge of the jig 100 as shown in FIG. 2 so that the lower end of the binding bar 320 can be inserted.

In such an exemplary gripper 300 structure, the first function described above can be performed as follows. The gripper 300 is moved downward while being positioned on the upper side of the jig 100 and the lower end of the binding bar 320 is inserted into the insertion hole 120 of the jig 100 in this process. At this time, the vertical direction width of the inner circumferential surface portion of the insertion hole 120 may be formed to be smaller than the vertical width of the above-described latching groove 321. With this configuration, The insertion hole 120 of the jig 100 is caught by the engagement groove 321 as shown in FIG. These binding bars 320 are provided at four corners of the edge of the main body 310 and the four binding bars 320 are inserted into the insertion holes 120 at four edges of the jig 100, The jig 100 moves integrally with the gripper 300 when the gripper 300 is moved.

After the first function by the gripper 300 is performed, the second function may be performed as follows. The gripper 300 moves the jig 100 so that the jig 100 is positioned on the upper side of the storage tank 200 and moves the soldering area 100 exposed downwardly of the jig 100 by moving the jig 100 downwardly A may be dipped into the solder 210 in the reservoir 200.

Meanwhile, in the process of performing the second function, the soldering region A is subjected to buoyancy by the solder 210 in a molten state. As a result, the component 20 may float, and the component 20 may not be stably mounted on the printed circuit board 10 and may be tilted.

In order to prevent this, the soldering apparatus of the printed circuit board according to the present embodiment includes the support means 400. The support means 400 may support the upper surface of the component 20 to be pressed down while the gripper 300 is performing the second function so that the mounting state of the component 20 can be maintained in spite of the buoyancy action.

The supporting means 400 may be provided on the lower side of the gripper 300 facing the upper surface of the component 20. As an example of the more specific structure, And a push pin 420 protruding from the plate 410 in the direction of the component 20.

The plate 410 may be, for example, in the form of a flat plate. The push pins 420 may be integrally formed so as to protrude downward from the plate 410, or may be formed as separate parts and coupled to the plate 410. At this time, the end of the push pin 420, which is in contact with the upper surface of the component 20, is made of a resilient material such as rubber, silicone or the like so as not to damage the component 20 and to stably support the component 20. [ Lt; / RTI >

Alternatively, the push pin 420 may include a first body 421 having a hollow shape, a coil spring 423 received in the first body 421, and a coil spring 423 inserted into the first body 421, And a second body 424 that can be drawn in or drawn out from the body 421. The first body 421 may have a hollow shape and may be fixed to the plate 410 at one end thereof (upper end with respect to the drawing). A coil spring 423 is accommodated in the first body 421. One end of the second body 424 can be inserted through the other end of the first body 421 and the second body 424 can be supported so as not to be separated from the first body 421 while being inserted . The first body 421 may be provided with a cutout hole 422 having a vertical length corresponding to the vertical movement allowable width of the second body 424 and the cutout hole 422 may be formed in the first body 421 A pinhole may be formed on the outer side of one end of the second body 424 exposed to the outside of the second body 424. One end of the second body 424 is inserted into the first body 421 and inserted into the first body 421 through the cutout hole 422 and the pin hole, . One end of the inserted second body 424 is provided with an elastic force downward by the coil spring 423 when the first body 424 is moved upward. According to the structure of the push pin 420, the second body 424 can be elastically moved up and down so that the lower end of the second body 424, which is pressed against the upper surface of the component 20, The component 20 or the printed circuit board 10 is damaged due to the elasticity of pressing the component 20 even when the jig 100 or the printed circuit board 10 itself flows up and down, So that the upper surface of the component 20 can be stably supported. The lower end of the second body 424 may be made of the above-mentioned elastic material.

The push pins 420 may be formed on the upper surface of the plate 20 facing the printed circuit board 10 so that the upper surface of the component 20 and the printed circuit board 10 are pressed downward. 410). ≪ / RTI >

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is to be understood that the invention is not limited to the disclosed embodiments, but, on the contrary, It is obvious that the modification or the modification is possible by the person.

It will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention as defined by the appended claims.

10: printed circuit board 11: through hole
20: Part 21: Leg
100: Jig 110: Groove
111: incision section 120: insertion hole
200: storage tank 210: solder
300: gripper 310: main body
320: coupling bar 321:
400: support means 410: plate
420: push pin 421: first body
422: cutting hole 423: coil spring
424: second body 425: pin member

Claims (6)

A jig which is mounted on a printed circuit board on which the component is mounted and exposes a soldering region between the component and the printed circuit board in a downward direction;
A reservoir in which molten solder is stored;
A function of moving the jig by moving the jig in a vertical direction while moving the jig by dynamically dipping the soldering area into the reservoir, Gripper performing; And
And a support means provided on a lower surface of the gripper toward an upper surface of the component to elastically press the component.
delete The method according to claim 1,
Wherein the holding means includes a plate fixed to one side of the gripper and a push pin protruding from the plate in the direction of the component.
The method of claim 3,
Wherein the push pin is made of a flexible material at an end of the push pin which is in contact with the component.
4. The pusher according to claim 3,
A first hollow body having one end fixed to the plate and the other end opened;
A coil spring received in the first body; And
And a second body that can be elastically drawn or drawn out from the first body by the coil spring while being inserted into the other open end of the first body.
The method of claim 5,
And the other end of the second body contacting the component is made of a resilient material.

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