KR101487096B1 - Appratus for transferring a wafer - Google Patents

Appratus for transferring a wafer Download PDF

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Publication number
KR101487096B1
KR101487096B1 KR20130087234A KR20130087234A KR101487096B1 KR 101487096 B1 KR101487096 B1 KR 101487096B1 KR 20130087234 A KR20130087234 A KR 20130087234A KR 20130087234 A KR20130087234 A KR 20130087234A KR 101487096 B1 KR101487096 B1 KR 101487096B1
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South Korea
Prior art keywords
wafer
transfer
defective
unit
transferred
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KR20130087234A
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Korean (ko)
Inventor
오소연
박정훈
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주식회사 엘지실트론
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Priority to KR20130087234A priority Critical patent/KR101487096B1/en
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67271—Sorting devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67706—Mechanical details, e.g. roller, belt
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67718—Changing orientation of the substrate, e.g. from a horizontal position to a vertical position

Abstract

The present invention relates to a wafer transfer apparatus, and more particularly, A sensor unit capable of sensing whether there is a defect in the transferred wafer; A controller for determining whether the wafer is defective based on information measured by the sensor unit; And a wafer classifying unit for selectively classifying wafers transferred by the transfer unit under the control of the control unit. And a control unit.
According to the present invention, by automatically inspecting the wafers and sorting the defective wafers during the transfer of the wafers, it is possible to reduce the labor cost and prevent the unnecessary processes of the defective wafers, thereby increasing the production amount and reducing the cost.

Figure R1020130087234

Description

[0001] Appratus for transferring wafer [0002]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a wafer transfer apparatus, and more particularly, to a wafer transfer apparatus for inspecting and sorting defective wafers during wafer transfer.

Currently, widely used silicon wafers (monocrystalline silicon thin plates made of polycrystalline silicon (Si) as a raw material) are used in a cutting process for cutting an ingot into a wafer form, a lapping process lapping process, an etching process for removing or alleviating damage caused by mechanical polishing, and a cleaning process for cleaning the completed wafer.

In the cutting step, unnecessary portions are removed and the ingot formed in a cylindrical shape is sliced into a single wafer using a wire saw such as a piano wire or a high-tension wire in a state immersed in pure water.

At this time, a plurality of wafers separated into a single sheet in the ingot state are laminated to each other, and thus the stacked wafers are separated into a sheet, and the wafer is transferred for the next process.

However, a defective wafer may be generated in a previous process including slicing of the wafer, and the process may proceed without removing the defective wafer, thus causing a problem of unnecessary waste.

In addition, the price of silicon raw material has been raised due to global lack of crystal silicon supply over the past three years. As a method for solving the shortage of supply of a silicon wafer for a solar cell, a silicon wafer is cut and used so as to have a thickness of 100 microns or less.

The area of the wafer is gradually increasing to reduce the overall production cost, and a 450 mm size will be commercialized in the future.

However, wafers that are thinner and larger in area are more difficult to handle in the production process, which leads to increased yields, especially in high-speed, automated manufacturing processes.
Hereinafter, the prior art publication number related to the present invention is attached. KR public number 10-2010-0076125, KR public number 10-2011-0062827

SUMMARY OF THE INVENTION The present invention is directed to a wafer transfer apparatus for inspecting and sorting defective wafers when transferring wafers.

The wafer transfer apparatus of this embodiment includes a transfer unit for transferring a wafer; A sensor unit capable of sensing whether there is a defect in the transferred wafer; A controller for determining whether the wafer is defective based on information measured by the sensor unit; And a wafer classifying unit for selectively classifying wafers transferred by the transfer unit under the control of the control unit. And a control unit.

According to the embodiment of the present invention, there is an advantage that the defective wafer can be sorted or removed before the wafer is automatically inspected during the transfer of a single wafer and various processes are performed on the wafer. It is possible to reduce the case where the defective wafer is subjected to an additional process.

Particularly, in the trend of increasing the number of defective wafers by increasing the diameter of the wafer to a diameter of 300 mm or more and thinning the thickness, it is possible to classify defective wafers in real time by the process line before the wafer processing process And there is an advantage that the problem of the wafer process can be detected early.

1 is a schematic view showing a configuration of a wafer transfer apparatus of the present invention.
2 is a plan view of the wafer transfer apparatus according to the first embodiment of the present invention.
3 is a side view of the wafer transfer apparatus according to the first embodiment of the present invention.
4 is a plan view of the wafer transfer apparatus according to the second embodiment of the present invention.
5 is a side view showing the wafer sorting unit of the wafer transfer apparatus according to the second embodiment of the present invention before operation.
6 is a side view showing the wafer separator of the wafer transfer apparatus according to the second embodiment of the present invention after operation.

Hereinafter, the present embodiment will be described in detail with reference to the accompanying drawings. It should be understood, however, that the scope of the inventive concept of the present embodiment can be determined from the matters disclosed in the present embodiment, and the spirit of the present invention possessed by the present embodiment is not limited to the embodiments in which addition, Variations.

1 is a schematic view showing a configuration of a wafer transfer apparatus of the present invention.

Referring to FIG. 1, the wafer transfer apparatus of the present embodiment includes transfer means 10 for transferring a wafer to a subsequent wafer processing apparatus, a sensor unit 400 for checking whether or not the wafer is defective during wafer transfer, A control unit 50 that receives the state of the wafer from the unit 400 to determine whether or not the wafer is defective and controls the operation of the wafer sorting unit 500 according to the determination result; And a wafer classifying unit 500 for selectively unloading the wafer.

The wafer transfer apparatus of this embodiment is for transferring wafers cut by a device such as a wire saw to a subsequent wafer processing apparatus or storage unit using a conveyor belt or the like. In this embodiment, To a third transfer unit.

The sensor unit 400 is a means for sensing whether or not each wafer has a breakage with respect to wafers moved by a conveyor belt or the like. The sensor unit 400 judges that a part of the wafer is broken, . The determination of whether or not the wafer is defective by the sensor unit 400 can be performed by the control unit 50 connected to the sensor unit 400. In the description of the present embodiment, And the like.

In addition, the sensor unit 400 may correspond to all sensors that determine whether the wafer is defective during the transfer of the wafer. Specifically, the sensor unit 400 may be an optical image sensor, an emission image sensor, an image sensor for inspecting and imaging a wafer, a sensor for applying ultrasonic vibration to a sensor or a wafer, and a sensor for measuring vibration This may be the case. For example, when the sensor unit 400 captures an image of a wafer being transferred, it is possible to determine whether the wafer is defective by comparing the previously stored reference image with the captured image.

In addition, the sensor unit 400 may be composed of three optical image sensors. For example, in a case where the sensor unit 400 is positioned on a wafer to be transferred, only one of the three optical image sensors It can be determined that the wafer is defective. That is, in the case of a wafer having a normal shape, an image of each area of the wafer must be photographed by image sensors installed in advance. If the image of a part of the wafer is not photographed from any one of the image sensors, It is possible.

Although the optical image sensor has a disadvantage that it can not detect minute defects of the wafer, it can detect the broken wafer with high accuracy even without moving the wafer in the middle of rapid transfer of the wafer or measuring the defectiveness of the wafer There is an advantage.

The control unit 50 is connected to the sensor unit 400 and receives the state of the wafer from the sensor unit 400 to determine whether or not the wafer is defective. The controller 50 controls the operation of the wafer sorting unit 500 As shown in FIG. However, as described above, it is not always necessary to configure the separate control unit 50, and the sensor unit 400 can directly monitor the sensing and the failure.

The controller 50 controls the operation of the wafer classifying unit 500 so that unloading of the defective wafer is performed according to a result of sensing by the sensor unit 400, Can be controlled. For example, when the wafer sorting unit 500 is realized as a nozzle for spraying water (ultrapure water) at a high pressure on the wafer to be transferred, the control unit 50 controls the nozzle so that the defective wafer is jetted at a high pressure Water can be controlled to be destroyed. In this case, the control unit 50 determines whether or not the wafers classified as defective wafers are different from each other by the wafer sorting unit 500 Provide a transport path.

In addition, the controller 50 can set the degree to which the sensor unit 400 determines whether or not the wafer is defective. In addition, the controller 50 may include a display, and the display unit may indicate a defect rate, a degree of damage, and a damaged portion of the wafer.

Hereinafter, a specific configuration and a driving method of the first embodiment of the present invention will be described with reference to FIGS. 2 and 3.

2 is a plan view of the wafer transfer apparatus according to the first embodiment of the present invention.

3 is a side view of the wafer transfer apparatus according to the first embodiment of the present invention.

The first and second embodiments of the present invention can be classified according to the type of the wafer sorting part 500. The type of the wafer sorting part 500 of the first embodiment of the present invention is a spray type Splay type).

Referring to FIGS. 2 and 3, the wafer transfer apparatus according to the first embodiment of the present invention can be divided into first to third transfer units 100, 200, and 300 based on wafer transfer, wafer inspection, and wafer classification . In addition, the wafer transfer apparatus of the embodiment may further include a sensor unit 400 for inspecting whether or not a wafer is being transferred, and a storage unit 600 for storing wafers classified as defective.

Particularly, the wafer sorting part 500 of the first embodiment of the present invention may include one or more ultrapure water spray 500. The ultra pure water sprayer 500 discharges ultrapure water onto the upper surface of the defective wafer being conveyed by the transfer units 100, 200, and 300 from the upper side of the transfer units 100, 200, and 300 to destroy the wafer by water pressure.

The ultrapure water is purified water (H2O), which remains on the conveyor belt 120 after the spraying operation but has no effect on subsequent transferred wafers.

 In addition, the ultra pure water spray 500 may spray ultrapure water at a water pressure in the range of 0.8 to 1.5 kg / cm 2, and the size of the water pressure sprayed may vary depending on the thickness or the size of the wafer.

As described above, the conveying means of the present embodiment can be constituted by a plurality of conveying portions based on the inspection of the poorness of the wafer and the classification of the wafer judged to be defective.

For example, the transfer means of the present embodiment includes a first transfer unit 100 for transferring the wafer to a sensor unit on which the wafer is loaded and the wafer is inspected, and a check of whether the wafer is defective or not is performed And a third transfer unit 300 that can be classified separately for wafers judged to be defective.

Each of the conveying units 100, 200 and 300 includes conveyor belts 120, 220 and 320 for supporting and conveying one side of the wafer, conveyor rollers 110, 115, 210, 215, 310 and 315 rotating to move the conveyor belt, conveyor motors 140, 240 and 340 And a conveyor guide 130, 230, and 330 for supporting the conveyor belt and the conveyor rollers.

The conveyor belts included in the first to third conveyance units 100, 200, and 300 are formed of a flexible belt sheet, and are configured to surround a part of a side surface of two or more cylindrical rollers. In the first embodiment of the present invention, the first and second transfer units 100 and 200 shown in FIG. 2 may be configured by a general conveyor belt or the like, but may be constructed in a third transfer unit 300 that performs a role of sorting defective wafers The conveyor belt 320 may be composed of two or more belt sheets. At this time, it is necessary to secure a predetermined space between the belt sheets so that portions of the wafers broken between the belt sheets may fall downward. This is to prevent the wafer, which is broken by the ultra pure water spray 500, from remaining on the belt sheet.

The wafers loaded on the first transfer unit 100 are moved in the second transfer unit 200 while the wafers loaded on the first transfer unit 100 are transferred from the second transfer unit 200 to the wafers W, A check is made as to whether or not there is a defect. .

For example, at least one sensor unit 400 may be provided on the upper side of the second transfer unit 200, and the wafer may be moved to the lower side of the sensor unit 400 by the movement of the belt 220 of the second transfer unit. Can be moved.

In addition, the sensor unit 400 may include at least one image sensor, and the photographed image is transmitted to the control unit.

The wafers subjected to the transfer and defect inspection by the second transfer unit 200 are moved to the third transfer unit 300 and the wafers are selectively subjected to the wafer sorting in the third transfer unit 300. A method in which the components of the first embodiment of the present invention described above are driven will be described.

First, a sliced wafer is loaded on the conveyor belt 120 of the first transfer unit 100.

The loaded wafer is then conveyed along a conveyor belt 120 which is moved by the rotational movement of the conveyor rollers 110, 115. (The direction of wafer transfer is the direction 700 of the arrow shown in the figure.)

The wafer is inspected by the sensor unit 400 located on the upper side of the second transfer unit 200 after the wafer is moved from the first transfer unit 100 to the second transfer unit 200.

The inspection of the wafer is preferably performed during transportation in view of the production amount of the wafer, but can be temporarily stopped for precise inspection.

In the present embodiment, as described above, the three image sensors sense an image of one side of the wafer, so that even if one sensor does not sense the image, the wafer is considered to be defective. The control unit 50 determines whether or not the wafer is defective. If it is determined that the wafer currently being transported is normal, the wafer is maintained in the loaded state, and the subsequent wafer processing is performed through the third transfer unit 300 Lt; / RTI >

However, if the above result is not good, the controller 50 operates the wafer operation classifying unit 500 so that the ultra-pure water is strongly jetted toward the wafer when the wafer is positioned in the third transfer unit 300. That is, the ultra pure water spray 500 applies water pressure to crush the defective wafer during transportation.

The pulverized wafer is freely lowered between the sheets of the belt 320 of the conveyor belt 320 or between the conveyor guides 330 and the belt sheet 320 and is unloaded to the storage unit 600, Can be sorted from the wafer transfer device.

Hereinafter, a configuration and a driving method of a wafer transfer apparatus according to a second embodiment of the present invention will be described with reference to FIGS. 4 to 6. FIG.

4 is a plan view of the wafer transfer apparatus according to the second embodiment of the present invention.

5 is a side view showing the state before the operation of the wafer sorting unit 500 of the wafer transfer apparatus according to the second embodiment of the present invention.

6 is a side view showing a state after operation of the wafer sorting unit 500 of the wafer transfer apparatus according to the second embodiment of the present invention.

In the second embodiment of the present invention, the type of the wafer sorting part 500 is a type of the conveying part moving device 500.

4 to 6, duplicated elements of the above-described components and operation method will be omitted.

Referring to FIGS. 4 to 6, the wafer transfer apparatus of the second embodiment of the present invention can be divided into first to third transfer units based on the inspection of the transferred wafer and the classification of the defective wafer. Unlike the first embodiment, the first transfer unit 100 for confirming whether or not the transferred wafer is defective after the wafer is loaded, a second transfer unit 100 for selectively changing the transfer path when the transferred wafer is defective, (200), and a third transfer part (300) for transferring the normal wafer so that the normal wafer is transferred to the subsequent device.

4 and 5 show a hydraulic cylinder as a means for selectively changing the wafer transfer path in the second transfer part 200. By this hydraulic cylinder, the second transfer part can be downward at a predetermined angle, The wafer is sorted. However, although a hydraulic cylinder is shown as an example for changing the conveying path of the conveying unit, it is also possible to provide a separate conveying route in advance to constitute a belt rotated on the same horizontal line. In addition, It will be possible.

The hydraulic cylinder includes a cylinder body 510 providing hydraulic pressure, a plunger 520 linearly moving by hydraulic pressure, and a plunger 520 connected to the lower support 201 of the second transfer part 200 while being moved together with the plunger 520. [ And a connecting portion 530 coupled thereto.

A motor 240 for generating a rotational force and a main roller 250 for receiving a rotational force transmitted from the motor 240 may be disposed on the lower support 201 of the second transfer unit 200. Particularly, the second conveyance unit 200 is a means for providing a separate conveyance path to the wafer conveyed along the belt 220. In operation of the hydraulic cylinder, the belt 220 of the second conveyance unit 200 also moves downward As shown in Fig. For this purpose, one of the rollers for conveying the belt 220 of the second conveyance unit 200 needs to be a rotary shaft.

The cylinder body 510 and the plunger 520 constituting the hydraulic cylinder are arranged to be inclined at a predetermined angle with respect to the lower support portion 201 of the second transfer portion 200, Lt; / RTI >

2, the first conveyor roller 210 located on the left side of the conveying rollers 210 and 220 connected to the belt 220 in the second conveying unit 200 is configured to be a rotation axis thereof. This is because the connecting portion 530 of the hydraulic cylinder is coupled to the lower supporting portion 201 in the downward direction of the second conveyor roller 215.

Accordingly, when the hydraulic cylinder is driven, the plunger 520 and the connecting portion 530 move toward the cylinder body 510. In this case, the lower supporting portion 201 coupled to the connecting portion 530 also moves downward Since the first conveyor roller 210 forms a rotation center, the belt 220 and the conveyor guide 230 descend downward. Although not shown, the rotation axis of the first conveyor roller 210 may be fixed and rotated in a separate member so that the first conveyor roller 210 forms a rotation center.

When the belt 220 is rotated downwardly in accordance with the driving of the hydraulic cylinder, the wafer transferred along the belt 220 of the second transfer unit 200 is changed in the transfer path, (600).

A method in which the components of the second embodiment of the present invention described above are driven will be described.

First, a sliced wafer is loaded on the conveyor belt 120 of the first transfer unit 100.

Then, the conveyor motor 140 of the first conveyance unit 100 transmits the power to rotate the conveyor rollers 110 and 115. The conveyor belt 120 is moved by the rotation of the conveyor rollers 110 and 115 indirectly, and the wafer is conveyed along the conveyor belt 120. For reference, an arrow 700 indicates the direction in which the wafer is conveyed.

In particular, before the wafer is transferred to the second transfer unit 200, the wafer is inspected for defects by the sensor unit 400 located on the upper side of the first transfer unit 100.

After the inspection of the wafer by the sensor unit 400, if the inspection result is normal, the wafer is maintained in the loaded state, and then the wafer is conveyed along the second conveyance unit 200 and the third conveyance unit 300, . That is, the hydraulic cylinder of the second transfer unit 200 is not driven and forms a transfer path for transferring the wafer to the third transfer unit 300.

However, when it is determined that the wafer moved along the first transfer unit 100 by the sensor unit 400 and the control unit is defective, the control unit starts the operation of the hydraulic cylinder to change the transfer path of the second transfer unit .

That is, as described above, the operation of the hydraulic cylinder causes the belt 220 and the conveyor guide 230 to rotate clockwise about the first conveyor roller 210 of the second conveyance unit 200 by a predetermined angle.

As a result, the wafer judged to be defective is transferred toward the housing part 600 and then housed in the housing part 600. [

At this time, during the rotation of the belt 220 of the second transfer part 200, in order to avoid the collision of the subsequently transferred wafer during the removal of the wafer judged to be defective, The operations of the transfer unit 100 and the third transfer unit 300 may be temporarily stopped.

With the wafer transfer apparatus of the present embodiment as described above, it is possible to selectively sort or remove defective wafers which do not need to be subjected to a subsequent process, such as when the wafer size of the target is not maintained or a part thereof is broken, This has the advantage of reducing the production cost.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is to be understood that the invention is not limited to the disclosed embodiments, but, on the contrary, is intended to cover various modifications and equivalent arrangements included within the spirit and scope of the appended claims.

50:
100: first conveyance section
200: Second transfer part
300: Third transfer part
400:
500: wafer sorting section
600:

Claims (9)

Conveying means including first, second and third conveying portions along a direction in which the wafer is conveyed to convey the wafer;
A sensor unit disposed above the second transfer unit for sensing an image of the transferred wafer and sensing whether the transferred wafer is defective;
A controller for comparing an image measured by the sensor unit and an image of a normal wafer to determine whether the wafer is defective; And
In order to selectively sort the wafer transferred by the transfer means in the middle of transfer according to the control of the control unit, Lt; / RTI >
The wafer sorting portion includes an ultra pure water spray disposed on the third transfer portion,
Wherein the ultra pure water sprayer discharges ultra pure water to the transferred wafer to destroy the defective wafer when the control unit determines that the transferred wafer is defective. The method according to claim 1,
Wherein the third conveying portion includes at least two belt sheets spaced apart at a predetermined interval. 3. The method of claim 2,
Further comprising a wafer receiving portion disposed below the third transfer portion to receive the destroyed wafer debris falling between the belt sheets of the third transfer portion. The method according to claim 1,
Wherein the ultra pure water is purified water (H2O), and the ultra pure water spray is sprayed with ultrapure water at a water pressure in the range of 0.8 to 1.5 kg / cm < 2 >. delete delete delete delete delete
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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20210074459A (en) * 2019-12-11 2021-06-22 (주)이시스코스메틱 Mask pack sheet continuous packaging device

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6311533U (en) * 1986-07-07 1988-01-26
JP2011052967A (en) * 2009-08-31 2011-03-17 Rayresearch Corp Silicon wafer inspection device
JP2012119526A (en) * 2010-12-01 2012-06-21 Takatori Corp Substrate transport device
JP2012254876A (en) * 2011-06-10 2012-12-27 Sharp Corp Substrate sorter

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6311533U (en) * 1986-07-07 1988-01-26
JP2011052967A (en) * 2009-08-31 2011-03-17 Rayresearch Corp Silicon wafer inspection device
JP2012119526A (en) * 2010-12-01 2012-06-21 Takatori Corp Substrate transport device
JP2012254876A (en) * 2011-06-10 2012-12-27 Sharp Corp Substrate sorter

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20210074459A (en) * 2019-12-11 2021-06-22 (주)이시스코스메틱 Mask pack sheet continuous packaging device
KR102370143B1 (en) * 2019-12-11 2022-03-07 (주)이시스코스메틱 Mask pack sheet continuous packaging device

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