KR101483160B1 - device with three-dimensional measurement and Supplementary means of dispensing for Solder paste. - Google Patents

Abstract

The present invention relates to an apparatus which includes a supplementary dispensing means and a three-dimensional measurement means for solder paste coated on a printed circuit board and, more specifically, to an apparatus to convert an abnormal substrate into a substrate of good quality by including a three-dimensional measurement means of solder paste and a dispensing means, which supplements the solder paste at a part which is necessary for the supplement of the solder paste, in one united body. The present invention greatly reduces a failure rate and increases a through rate in a printing process, which are generated in an electronic component assembling process by a simple investment at a low cost. The present invention remarkably reduces the composition cost and simplifies the composition by forming the measurement means and the dispensing means in one united body and sharing a movement means of X-Y-Z direction. The present invention also guarantees the quality of a supplementary dispensing work by measuring supplementary points, which are supplemented by a dispenser, in three dimensions.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a device for three-dimensional measurement of a solder paste applied to a printed circuit board and a dispensing means for replenishment.

The present invention relates to a field of applying a solder paste by screen printing or dispensing in a process of assembling a printed circuit board and inspecting the applied solder paste.

In detail, a three-dimensional measurement (position, area, height, volume, shape) means of a solder paste of points coated on a printed circuit board with a screen printing or a dispensing device, And a dispensing means for replenishing the solder paste to the point where this occurs

In the process of assembling electronic components on a printed circuit board, a medium such as a solder paste is applied to form electrical contacts on the components and the substrate.

The solder paste application process is mainly performed by a screen printing technique and partially by a dispensing technique.

Since the coating process proceeds from the tip in the entire assembly process, the quality of the coating greatly affects the entire process.

On the other hand, most of the coating defects are cases where the solder paste is not applied at all or the coating amount is insufficient.

For this reason, there has been a tendency to introduce a three-dimensional measuring apparatus at the production site to detect the coating failure and analyze the cause of the defect to eliminate the cause of the defect.

On the other hand, methods for estimating the causes of defects and delivering them to the dispensing apparatuses or operators in real time in a more active and intelligent manner are also used.

Of course, the mobilization of these techniques can significantly reduce the frequency of failures, but nevertheless, uncontrollable failures occur.

The methods to be taken in the event of failure are: 1) cleaning and re-use, 2) offline repair or repair using an operator tool, and 3) disposal.

The first and second methods have a high probability of occurrence of secondary failure, and the third method has a large loss due to material disposal.

FIG. 1 is a conventional technique for defect detection, which relates to a device for irradiating a three-dimensional object with a sheet beam and receiving reflected light of the irradiated sheet beam and performing three-dimensional measurement on the solder paste.

1, which is disclosed in Korean Patent Registration No. 0422987 filed and registered by the applicant of the present invention, a three-dimensional image data acquisition sensor 100, that is, an inspection apparatus, generates a sheet beam, A sheet beam generator 10 for irradiating the sheet bundle 200 with an image, and an image processor 20.

The sheet beam generator 10 generates light of a laser or other focused line shape having a sufficient intensity to image the cross-sectional shape (profile) of the object 200 to acquire three-dimensional image data, (Not shown).

The sheet beam generator 10 includes a light source such as a laser, a focusing lens, a cylindrical lens, and a focusing lens.

The image processing unit 20 includes an image lens and a two-dimensional image sensor. The image processing unit 20 receives reflected light 22 of a sheet beam 12 irradiated on the object 200, Dimensional image data.

That is, the two-dimensional image sensor is positioned at a predetermined distance and angle with respect to the sheet beam generator 10, and the image sensor is disposed in the sheet beam generator 10, So as to generate two-dimensional image data.

The distance and angle of the image sensor with respect to the sheet beam generator 10 are controlled by an administrator managing (using) the three-dimensional image data acquisition sensor 100 according to the width and height of the object 200.

In addition, the image processing unit 20 can designate an operation region of the image sensor according to a target object 200 to acquire three-dimensional image data.

However, the above-mentioned prior art has only a three-dimensional measuring means. When the amount of the applied solder paste is insufficient or not applied, the product has to be discarded badly or a separate calibrating operation must be carried out from the outside of the equipment and then reapplied .

Naturally, additional costs and time have been added to dispose of the defective substrate, correct it, and reuse it.

As an alternative to this, a method of disposing a coating device, an inspection device, and a solder paste dispensing device in a line may be considered as shown in FIG. 2. However, the investment cost by introducing a separate dispensing device for solder paste failure correction is large, There is a drawback that the length of the line increases, which is not a reasonable alternative.

Accordingly, in the present invention, when solder paste points having no solder paste, insufficient or having shape abnormality are found based on the result of the three-dimensional measurement process, which is the next step of the screen printer, dispensing means capable of immediately replenishing the solder paste points, The measuring means is unified as shown in FIG. 3, and the defective product is made good through the supplementary work, thereby proposing a device capable of drastically reducing the calibration time and cost.

Meanwhile, the three-dimensional measurement sensor is a means for outputting information for extracting height values or height values of specific points on the upper surface of the substrate at regular intervals.

Basically, it is non-contact type, because it should not change the shape of the solder paste during measurement.

The sensors are based on the principle of optical triangulation and moire (including phase shift method).

Korean Patent Registration No. 0422987 (March 12, 2004)

A separate solder paste dispensing device may be installed and used after the step of inspecting the applied solder paste in order to reduce problems and losses in disposal of the poorly coated substrate and reuse after cleaning as mentioned in the background of the invention, Even if it is constituted in one apparatus, if the XYZ-direction transporting means for the dispenser and the XYZ-direction transporting means for three-dimensional measurement are separately required, a large cost is incurred and the configuration of the entire apparatus becomes complicated and large.

Of course, if there is a separate X-Y-Z direction conveying means, the two operations can be performed at the same time as needed, thereby reducing the operation time.

In most cases, however, you need to know how many points you need to dispense.

In the present invention, the number of points to be supplemented is set by the user, and if defective points exceeding the set number are generated, the defective is processed without dispensing.

Accordingly, the present invention can provide a three-dimensional measuring means and a solder paste dispensing means in an integrated manner, and it is possible to share one position moving means, thereby achieving economical gain through remarkable cost reduction, simplicity of the apparatus, To be able to take it.

In addition, since the two operations are sequentially performed, there is an advantage that the controllers necessary for judging and driving the operation are commonly used.

In addition, the present invention provides a great advantage that the conventional method does not provide by confirming that the replenishing operation is performed by using the three-dimensional measuring means after the dispensing operation of the solder paste by the dispensing apparatus is completed.

Keeping the height of the dispenser end and the point at which the work is done at a constant level in replenishing solder dispensing has an absolute impact on quality.

The apparatus of the present invention simultaneously obtains the warpage information of the substrate together with the measurement of the solder paste when the initial three-dimensional measurement is performed on the coated substrate.

The bending information is transmitted to the Z axis controller when the replenishment operation is performed so that the dispenser end and the replenishment points maintain a constant height, thereby realizing high quality solder paste dispensing.

In order to achieve the object of the present invention,

An apparatus in which the three-dimensional measuring means and the replenishing means for the solder paste applied to the printed circuit board are integrated is provided with a printed circuit board 200, which is applied to the apparatus by shearing equipment,

A three-dimensional measuring means (100) for three-dimensionally measuring a solder paste applied to the printed circuit board to output deflection information of points and points required for additional dispensing of the solder paste;

And dispensing means 300 for replenishing the solder paste by using the same XYZ transfer means at the points where the additional dispensing is required, thereby solving the problems of the present invention.

The overall effect of the present invention having the above-described constitution and function is that the general effect of the apparatus in which the three-dimensional measurement means and the supplementary dispensing means are integrated with respect to the solder paste points applied to the printed circuit board is achieved by refining the defective substrate by a simple replenishment operation using a dispenser It is possible to greatly increase the production yield and significantly reduce the cost of disposing or reusing the defective substrate.

As a concrete effect, the three-dimensional measuring means and the dispensing means for supplementing are integrally implemented and share the moving means in the X, Y, and Z directions, so that the construction cost can be drastically reduced and the economical gain can be obtained, and the apparatus can be miniaturized and simplified .

In addition, from the viewpoint of the quality of the dispensing replenishing operation, it is possible to quantify the exact position of the solder paste to be supplemented by utilizing the warping information of the substrate extracted after the three-dimensional measurement.

In addition, three-dimensional measurements of the dispensing operation are performed using the same means to ensure the quality of the replenishing operation.

1 is a configuration diagram showing a conventional three-dimensional measurement apparatus.
FIG. 2 is an example of a method for arranging a separate inspecting device and solder paste dispensing equipment in a line, as one method for correcting a defective circuit board.
3 is a configuration diagram of an apparatus in which a three-dimensional measuring means and a dispensing means for supplementing are integrated, according to an embodiment of the present invention.
4 is an overall configuration diagram including a position moving means and a controller of a device in which the three-dimensional measuring means and the replenishing dispensing means are integrated according to an embodiment of the present invention.
FIG. 5 is a diagram showing the operation steps of a device in which the three-dimensional measurement means and the supplementary dispensing means are integrated according to an embodiment of the present invention.
FIG. 6 is an exemplary view illustrating the height of a dispenser and a solder paste to be replenished on a printed circuit board of a device in which a three-dimensional measurement means and a supplementary dispensing means are integrated according to an embodiment of the present invention.
7A is an exemplary view of a solder paste and an unwired solder that are detected through a three-dimensional measurement means in a device in which a three-dimensional measurement means and a supplemental dispensing means are integrated, according to an embodiment of the present invention,
FIG. 7B is an exemplary view of a solder paste in which solder paste replenish dispensing is completed through the replenishing dispensing means; FIG.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, embodiments of an apparatus in which a three-dimensional measuring means and a dispensing means are integrated with solder paste points applied to a printed circuit board according to the present invention will be described in detail.

An operation outline of the apparatus of the present invention is shown in Fig. The solder paste is applied to the printed circuit board 200 in the front end equipment (process) and the substrate is input to the apparatus of the present invention (S510)

The solder paste points (all or a part of the solder paste points) are measured by an apparatus in which the three-dimensional measuring means and the supplemental solder paste dispensing means are integrated as shown in FIG. 4 (S520)

As shown in FIG. 4, the three-dimensional measuring means and the replenishing dispensing means are provided on one side of the same X-Y-Z conveying means.

Here, three-dimensional measurement refers to the position, height, area, volume, and shape of screen-printed points.

Based on the measurement data, defective points that can be corrected by the replenishment of the solder paste are identified and it is determined whether the correction is possible by supplementation (S530)

Since the time required for the replenishment is too long, it may cause a disruption to production. Therefore, the number of replenishment points and the total time required for the replenishment are limited (S540)

If a defect that can not be corrected is detected as a supplement, the substrate is defective (S590)

If it is judged to be worth supplementing, the end portion of the dispenser for dispensing is transferred to the optimum position of each defective point by the same X-Y-Z transfer means to perform the dispensing work (S550)

At this time, the height of the end of the dispenser uses the deflection information of the substrate derived from the three-dimensional measurement process of the substrate.

Particularly, the replenishing dispenser 300 is preferably provided with a solder paste syringe 310, a valve / regulator for supplying a constant pneumatic pressure to the syringe, a pump (piezo and pneumatic driven) 320 ), And the components of the nozzle 330. Each part utilizes the same host controller 410 used for three-dimensional measurement.

When the replenishing operation is completed, it is judged by the same X-Y-Z conveying means as the three-dimensional measuring sensor whether the replenishment correcting operation is correct (S560)

If the calibration operation is correct, it is sent to the equipment (component mounting) of the next process. (S580) If not, the process is retried up to the set number of times (S570)

Conventionally, there has been proposed a method which can be integrally constructed. In the proposed structure, both the application means, the measurement means, and the calibration means can be a single apparatus, or the inspection means and the correction means can be constituted as one apparatus .

However, no concrete examples have been presented, and such examples are lacking in specificity for actual field use, and many additional research and development are required.

Accordingly, the present invention intends to provide a practical and concrete structure that can be used in industry by integrating the three-dimensional measuring means and the replenishing means as well as the operating principle.

Meanwhile, the three-dimensional measuring means position shifting means is provided. The position shifting means of the replenishing dispensing means uses the position shifting means of the inspection apparatus.

In particular, the height between the dispenser and the substrate during operation of the position shifting means can be set to a constant value, preferably 0.1 mm to 1 mm.

This is because the deflection of the substrate is known through the three-dimensional inspection and the nozzle height of the dispenser is automatically controlled according to the deflection of the substrate.

Figure 6 is an exemplary view in which the replenishing dispenser maintains a constant height from the points to be replenished dispensing using the warping information of the substrate, in accordance with one embodiment of the present invention.

The reference numeral 'd' in FIG. 6 denotes a distance between the dispensing point and the dispenser

Actually, the substrate is bent in a precise sense, and the dispenser and the substrate or the viscous body to be supplemented must be kept constant in height according to the degree of warping, so that the replenishment can be appropriately performed.

6, it can be seen that the dispenser moves from the first position 630 to the second position 620, and the distance d between the dispenser and the dispensing point is the same.

It is also the same when moving to the third position 640. The first position 630 does not require modification, the second position 620 is an example of non-payment, and the third position 640 is an example of depletion.

In the present invention, preferably, the height setting value is set in a range of 0.1 mm to 1 mm, but a constant distance is always maintained.

For example, if it is set to 0.3 mm, the distance between the dispenser and the viscous body to be modified is kept at 0.3 mm in consideration of the bending state.

On the other hand, the degree of bending of the substrate can be utilized because the data is already obtained when the three-dimensional measuring means is operated and inspected.

FIG. 7A is an exemplary view of a solder paste and an unwired solder paste detected through a three-dimensional measurement means in an apparatus in which a three-dimensional measurement means and a supplementary dispensing means are integrated according to an embodiment of the present invention, and FIG. Fig. 5 is an example of solder paste in which solder paste dispensing is completed.

According to the embodiment of FIG. 7A, the already-applied solder paste is error-registered and evaluated as being insufficient due to insufficiency 710, non-payment 720,

At this time, as shown in Fig. 7B, supplemental correction is performed by applying a deficiency fraction.

The reference numeral 730 of the supplementary solder paste is shown.

It will be understood by those skilled in the art that the present invention may be embodied in other specific forms without departing from the spirit or essential characteristics thereof. It is to be understood, therefore, that the embodiments described above are to be considered in all respects as illustrative and not restrictive. The scope of the present invention is defined by the appended claims rather than the detailed description and all changes or modifications derived from the meaning and scope of the claims and their equivalents are to be construed as being included within the scope of the present invention do.

100: Three-dimensional measuring means
200: substrate
300: dispensing means for replenishment

Claims (9)

In an apparatus in which a three-dimensional measuring means and a dispensing means for replenishment are integrated,
A substrate 200 onto which a viscous body is injected;
A three-dimensional measuring means (100) for inspecting whether solder paste sprayed on the substrate is poured or desorbed and is defective;
And dispenser means (300) for replenishing solder paste to compensate defects by further supplementing the solder paste to the substrate if the result of the measurement means is defective,
If the number of errors after the entire inspection exceeds the unfixable error value, the substrate is discharged without performing an operation to correct the error,
Wherein the height of the dispenser is controlled automatically according to the amount of deflection of the substrate measured through the three-dimensional inspection, and dispensing is performed while maintaining a constant height from the points to be dispensed.
delete delete delete delete delete delete In an apparatus in which a three-dimensional measuring means and a dispensing means for replenishment are integrated,
A substrate 200 onto which a viscous body is injected;
A three-dimensional measuring means (100) for inspecting whether solder paste sprayed on the substrate is poured or desorbed and is defective;
And dispenser means (300) for replenishing solder paste to compensate defects by further supplementing the solder paste to the substrate if the result of the measurement means is defective,
After the solder paste replenishment for correcting the error is performed, the reinspection is carried out. The reinspection is performed not only for the entire board inspection but also for the part where the dispensing is performed for correcting the error,
Wherein the height of the dispenser is controlled automatically according to the amount of deflection of the substrate measured through the three-dimensional inspection, and dispensing is performed while maintaining a constant height from the points to be dispensed.
In an apparatus in which a three-dimensional measuring means and a dispensing means for replenishment are integrated,
A substrate 200 onto which a viscous body is injected;
A three-dimensional measuring means (100) for inspecting whether solder paste sprayed on the substrate is poured or desorbed and is defective;
And dispenser means (300) for replenishing solder paste to compensate defects by further supplementing the solder paste to the substrate if the result of the measurement means is defective,
After the solder paste replenishment to correct the error, the reinspection is performed, and the reinspection is performed only under the allow reinspection setting value,
Wherein the height of the dispenser is controlled automatically according to the amount of deflection of the substrate measured through the three-dimensional inspection, and dispensing is performed while maintaining a constant height from the points to be dispensed.

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