KR101466477B1 - Light emitting device menufacturing method - Google Patents

Abstract

A light emitting device in which side light emission is emphasized is disclosed. The light emitting device includes a light emitting chip and a light transmitting optical structure disposed to cover at least a part or all of the light emitting surface of the light emitting chip and having a depression at an upper surface portion of the light emitting chip, . Such a light-emitting device can be obtained by disposing a reflector on the light-emitting chip and curing the light-curing material by using light emitted from the light-emitting chip after covering the light-emitting surface of the light-emitting chip.

Description

TECHNICAL FIELD [0001] The present invention relates to a light emitting device manufacturing method,

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a light emitting device, and more particularly, to a light emitting device having a side-enhanced light emitting pattern, a manufacturing method thereof, and a light source device employing the same.

Semiconductor light emitting devices including light emitting diodes (LEDs) are among the most efficient light sources with many advantages. Semiconductor light emitting devices such as LEDs have low power / high efficiency, long lifetime, and can emit various colors. Because of this, LEDs are replacing traditional traditional light source devices such as incandescent or fluorescent lamps in various fields.

An LED includes a plurality of semiconductor layers and is typically a photoelectric conversion semiconductor device having a junction structure of an n-type semiconductor layer and a p-type semiconductor layer, and emits energy generated when electrons and holes recombine.

A light source device employing such an LED is used in a package form, and an element for guiding a light emitting direction is used in the package. In particular, a light source device employing LEDs has lenses of various structures in order to emit light having directivity in a lateral direction or a lateral direction.

1 is a view schematically showing a light source device employing a conventional LED.

As shown in Fig. 1, a conventional side-enhanced light source device includes a base 2, a chip 1, a protective member 3, and a lens 4. The protective member 3 and the lens 4 are coupled with the chip 1 mounted at the center of the base 2 and the lens 4 has a conical penetration at the central portion, Thereby refracting the light in the lateral direction. The protective member 3 and the lens 4 are bonded to the base 2 using an adhesive or the like.

However, in the conventional light source device, a plurality of components must be manufactured separately. In addition, it is necessary to carry out a complicated process of bonding the separately provided components using an adhesive or the like. As a result, such a conventional light source device is inevitably subject to a large manufacturing cost.

Korean Patent Publication No. 10-2006-0074937

SUMMARY OF THE INVENTION The present invention provides a light emitting device having a light emitting pattern in which side light emission is emphasized.

The present invention provides a light emitting device having an optical structure for inducing a light emission pattern in which side light emission is emphasized, wherein the optical structure precisely matches light emission characteristics of the chip.

The present invention provides a light source device employing the above-described improved light emitting device.

The present invention provides a light emitting device comprising: a light emitting chip; And a light-transmissive optical structure disposed so as to cover at least a part of the light-emitting surface of the light-emitting chip and having a depressed portion in an upper surface portion, wherein the optical structure is cured by light emitted from the light-emitting chip.

The depressed portion is formed substantially at a central portion in the upper surface portion of the optical structure.

The optical structure may have a radially symmetric structure.

The depressed portion may have a circular shape in a flat section and a curved surface in a bottom portion.

Another example of the optical structure may have a symmetrical structure in terms of front or side view.

In this case, the shape of the flat section may be substantially linear. The longitudinal direction of the depressed portion is parallel to any side of the upper surface of the light emitting chip and the longitudinal direction of the depressed portion is parallel to the short side when the upper surface of the light emitting chip includes a relatively long side and a short side.

The optical structure may contain a fluorescent material or a light scattering material.

Alternatively, the optical structure may include a fluorescent material layer or a light-scattering layer formed on the surface.

The invention also provides a light source device comprising: a circuit board; And a plurality of the above-described light emitting devices mounted on the substrate.

Each of the plurality of light emitting devices has a flat cross-sectional shape of the depression substantially linear, and the plurality of light emitting devices are arranged in a line so that the linear depression is substantially straight.

And a light-transmissive case accommodating the substrate and the plurality of light-emitting devices.

The present invention provides a method of manufacturing a light emitting device, comprising: placing a reflector on a light emitting chip; Placing a light-transmissive photo-curable material to cover the light-emitting chip and the reflector; Partially curing the photo-curable material by applying power to the light emitting chip to emit light; And removing an uncured portion of the photo-curable material.

The reflector is disposed at a central portion of the upper surface of the light emitting chip.

The reflector is disposed at a predetermined distance from the upper surface of the light emitting chip.

The reflector may be spherical or hemispherical and may have a curved surface facing the upper surface of the light emitting chip.

The reflector is linearly arranged in parallel to any side of the light emitting chip, and is disposed in parallel with the short side when the light emitting chip has a rectangular upper surface having a long side and a short side.

And removing the reflector that is performed before or after the step of removing the uncured portion.

According to the present invention, there is provided a light emitting device and a light source device in which side light emission is emphasized. The light emitting device of the present invention has a simple overall structure because the optical structure is integrally attached to the light emitting chip. Furthermore, since the optical structure for inducing the side luminescence is cured by the light emission of the chip, a customized structure in which more accurate side luminescence induction is achieved in the light emitting chip is obtained. Such a light emitting device can be used as a lighting device by arranging in a heat.

1 is a view schematically showing a light source device employing a conventional LED.
2 is a perspective view illustrating a light emitting device according to a first embodiment of the present invention.
3A to 3C are cross-sectional views taken along line A-A 'of a lateral light emitting device according to a first embodiment of the present invention, wherein FIGS. 3A and 3B show an example of a vertical light emitting chip, FIG. 3C shows an example of a horizontal light emitting chip to be.
4 is a graph showing a light emission pattern of the light emitting device of the present invention.
5 is a perspective view illustrating a light emitting device according to a second embodiment of the present invention.
FIGS. 6A and 6B are cross-sectional views of the light-emitting device of FIG. 5, FIG. 6A is a cross-sectional view taken along line B-B ', and FIG.
7A to 7E are cross-sectional views illustrating a method of manufacturing the light emitting device of the present invention.
8 is a schematic view illustrating a main process of a method of manufacturing a light emitting device according to a first embodiment of the present invention.
9 is a schematic view illustrating a main process of a method of manufacturing a light emitting device according to a second embodiment of the present invention.
10 is a flow chart for explaining the manufacturing method of the light emitting device of the present invention.
11A to 11D are diagrams showing examples of the light source apparatus of the present invention.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. In the following description of the embodiments of the present invention, a detailed description of known functions and configurations incorporated herein will be omitted when it may make the subject matter of the present invention rather unclear.

2 is a perspective view illustrating a light emitting device according to a first embodiment of the present invention. FIGS. 3A to 3C are cross-sectional views of a light emitting device according to a first embodiment of the present invention taken along the line A-A ', wherein FIGS. 3A and 3B are examples of vertical light emitting chips, and FIG. 3C is an example of a horizontal light emitting chip . 4 is a graph showing a light emission pattern of the light emitting device of the present invention.

A light emitting device 10 according to a first embodiment of the present invention includes a light emitting chip 110 and a light emitting chip 110. The light emitting device 10 includes a light emitting chip 110, And an optical structure 120. The optical structure 120 preferably has a depressed portion 1211, so that substantial lateral light emission is achieved. The refraction concentrated portion is formed around the depression portion 1211 by the depression portion 1211, and the refraction concentrated portion of the light emitting device 10 according to the first embodiment has a radially symmetrical shape.

Here, the substantially lateral light emission includes light emission in the horizontal direction from the light emitting chip in the horizontal direction and vertical direction, and the light emitted from the light emitting chip is reflected by the optical structure 120, . This substantial lateral light emission is induced by the refraction of the optical structure 120 having the recessed portion 1211 and the refraction concentrated portion formed therearound.

Preferably, the optical structure 120 comprises a transparent layer 121 formed of a photo-curable material. The transparent layer 121 corresponds to a portion of the photo-curable material that is cured by light emission of the light emitting chip 110 in the manufacturing process. As described later, the depressed portion 1211 is formed by the reflector R1 used in the manufacturing process. In the first embodiment, the reflector R1 is substantially hemispherical or spherical, so that the bottom portion of the depression 1211 has a substantially hemispherical shape.

The transparent layer 121 of the optical structure 120 may be used as a photo-curable material as described above, and may be applied without any particular limitation as long as it is a material that can be used as an optical lens and has photo-curable properties. Preferably, the material of the transparent layer 121 may be an acrylic type, a silicon type, an epoxy type, a polyimide type, or a polycarbonate type resin.

Preferably, as shown in FIG. 3A, the transparent layer 121 may further contain a fluorescent material or a light scattering material therein.

Alternatively, as shown in FIG. 3B, the optical structure 120 may further include a fluorescent material layer 122 or a light-scattering layer stacked on the transparent layer 121.

3A and 3B correspond to a vertical type light emitting chip, and in FIG. 3C, a horizontal type light emitting chip. In the case of the horizontal type light emitting chip, the transparent layer 121 of the optical structure 120 is wrapped to the side of the light emitting chip 110 because there is light emitted from the side surface of the chip.

FIG. 4 is a graph showing a light emission pattern for the light emitting device of the present invention, and it is seen that the light emitting device has a side emphasis type light pattern.

5 is a perspective view illustrating a light emitting device according to a second embodiment of the present invention. FIGS. 6A and 6B are cross-sectional views of the light-emitting device of FIG. 5, FIG. 6A is a cross-sectional view taken along line B-B ', and FIG.

The light emitting device 20 according to the second embodiment of the present invention includes a recessed portion 2211 formed in the transparent layer 221 of the optical structure 220 and a concave portion 2211 formed therein, And the other remaining elements are similar or identical to the first embodiment.

The light emitting device 20 according to the second embodiment includes the light emitting chip 210 and the light transmitting optical structure 220 disposed on the light emitting chip 210 so as to cover at least a part or all of the light emitting surface 211, . The optical structure 220 preferably has both symmetrical refraction concentrated portions formed by the depressed portion 2211 and the depressed portion 2211, thereby achieving substantially lateral light emission.

The light emitting device 20 according to the second embodiment may have a linear shape with a predetermined length of the recessed portion 1211 as shown in the figure. This corresponds to the shape of the reflector R2 used in the manufacturing process, and corresponds to the case where the reflector R2 has a rod shape.

The light emitting device 20 according to the second embodiment may also include a transparent layer 221 and the transparent layer 221 may further contain a fluorescent material or a light scattering material as in the first embodiment. Further, a fluorescent material layer (not shown) or a light scattering material layer (not shown) may be further formed on the surface of the transparent layer 221.

The materials constituting each constituent element of the second embodiment are also the same as or similar to those of the first embodiment, and a description thereof is omitted here.

Hereinafter, a method of manufacturing the light emitting device of the present invention will be described in detail with reference to FIGS. 7A to 7E. For reference, in the manufacturing method described below, the light emitting device 10 according to the first embodiment will be described as an example.

First, the reflector R1 is disposed on the light emitting chip 110 as shown in FIG. 7A (step 101). Preferably, the reflector R1 is disposed at a position spaced from the upper surface of the light emitting chip 110 by a predetermined distance. This can be realized, for example, by bonding the reflector Rl to the upper surface of the light emitting chip 110 using the same material as the transparent layer 121, which will be described later, using the adhesive member 131. [ Alternatively, the reflector R1 may be attached to the upper support (not shown).

Preferably, in the case of the light emitting device 10 according to the first embodiment, a spherical or hemispherical reflector R1 may be used. In this case, the reflector R1 is positioned at the center of the upper surface of the light emitting chip 110 as described above.

8, when a spherical or hemispherical reflector R1 is disposed on the light emitting chip 110 as shown in (a) to (c) Respectively. 8 (d) and 8 (e), which are sectional views along the x-axis and the y-axis, respectively, the resultant optical structure 120 is obtained with the radiation symmetric type centering around the depression 1211.

For reference, the light emitting device 20 according to the second embodiment of the present invention shown in Fig. 9 will be further described. 9 is a view showing a main manufacturing process and a result of the light emitting device according to the second embodiment of the present invention. In the case of the light emitting device 20 according to the second embodiment, the reflector R2 is rod-shaped, and such a rod-shaped reflector R2 is located at the central portion of the upper surface of the chip, As shown in Fig. In this case, the optical structure 220 is symmetrically formed around the depressed portion 2211 as shown in the sectional views of D-D 'and E-E' in FIG.

In addition to the first and second embodiments described above, the reflector used to manufacture the light emitting device of the present invention may include various shapes such as spherical, polyhedral, rod-like, linear, and inverted conical shapes.

In the fabrication of the light emitting device of the present invention including the first and second embodiments, the sizes of the reflectors R1 and R2 do not exceed the sizes of the upper surfaces of the light emitting chips 110 and 210. [ The diameter, short axis or short side of the light emitting chip 110 or 210 depending on the shape of the reflector R1 or R2 depending on the shape of the reflector R1 or R2 depending on the shape of the upper surface of the light emitting chip 110 or 210 It is small and has a value greater than half of its diameter, shortening, or short side.

For example, when the upper surface of the light emitting chips 110 and 210 is substantially rectangular, the diameter, short axis, or short side of the reflectors R1 and R2 may be smaller than the short side of the upper surface of the light emitting chips 110 and 210, / 2.

Also preferably, the reflector R1 may have a light reflectance of 50% or more.

Returning to the description of the manufacturing method, as shown in Fig. 7B, the light emitting chip 110 and the reflector R1 are covered with the liquid photo-curable material 12 (step 102). The photo-curable material 12 may be a material that can be used as a lens, as described above. For example, an acrylic type, a silicone type, an epoxy type, a polyimide type, or a polycarbonate type resin may be used. As described above, the photo-curable material 12 may further contain a fluorescent material or a light scattering material.

In this state, as shown in FIG. 7C, power is applied to the light emitting chip 110 to emit light to proceed the photo-curing process of the photo-curable material 12 (step 104). By using the light emission of the light emitting chip 110 for curing the photo-curable material 12, a customized lens that precisely responds to the light emission characteristics of the chip can be formed.

Preferably, a pre-treatment step such as heat treatment (step 103) may be further performed before proceeding with the photo-curing step, and a post-treatment step such as heat treatment (step 105) may be further performed after the photo-curing step. Such pretreatment and posttreatment can contribute to enhancement of thermal stability by increasing the conversion rate and removing volatile organics and the like.

Next, uncured uncured portions in the photocurable material 12 are removed as shown in FIG. 7D (Step 106). Removal of the uncured portions may be performed using a weak alkaline solution, weak acid solution, or solvent depending on the type of the photo-curable material 12 used. At this time, the uncured portion may be removed after the reflector R1 is removed.

Then, if the reflector R1 remains unremoved after removal of the uncured site, the reflector R1 is removed (step 107).

Thereafter, a cleaning / drying or drying process (step 108) may be performed and a thermal curing process (step 109) may be further performed depending on the kind of the photocurable material, developer, and the like.

Hereinafter, a process of actually fabricating the light emitting device of the present invention is specifically described. In the removal step of the uncured parts, an example using an aqueous system developer and an example using a non-aqueous system developer were performed.

1. Example using aqueous system developer

(1) A large-area light-emitting chip of a 460-nm light-emitting LED was used, and a reflector was disposed on the central portion of the upper surface thereof.

(2) Light curing material (functional negative photoresist solution - Rohm & Haas InterVia 8021-10) was poured to make the light emitting chip and reflector completely immersed.

(3) The pre-heat treatment was performed at about 140 ° C for about 5 minutes.

(4) The photo-curing process was performed by applying power to the light emitting chip (about 20 mA, about 20 seconds)

(5) Post-heat treatment was performed at about 95 캜 for about 5 minutes.

(6) Remove uncured areas using aqueous system developer (TMAH with 2.38% developer) (takes about 5 minutes)

(7) The drying process was performed at about 130 ° C for about 30 minutes.

(8) Thermal curing was performed at about 190 캜 for about 2 hours.

2. Example using non-aqueous system developer

(1) A large-area light-emitting chip of a 460-nm light-emitting LED was used, and a reflector was disposed on the central portion of the upper surface thereof.

(2) Light curing material (functional negative photoresist solution - micro resist technology company Ormocomp) was poured so that the light emitting chip and the reflector were completely immersed.

(3) The pre-heat treatment was performed at about 80 캜 for about 4 minutes.

(4) The photo-curing process was performed by applying power to the light emitting chip (about 20 mA, about 20 seconds)

(5) Post-heat treatment was performed at about 80 캜 for about 4 minutes.

(6) The unhardened area was removed using an aqueous system developer (developer OrmoDev) (takes about 3 minutes).

(7) cleaning procedure (IPA, 1 minute).

(8) The drying process was performed at about 85 ° C for about 1 hour.

The light emitting devices 10 and 20 described above can be fabricated from the light source device 30 as described below.

11A to 11D are diagrams showing examples of light source devices employing the light emitting device of the present invention described above. The illustrated light source device employs the light emitting device 20 according to the second embodiment described above.

The light source device 30 of the present invention includes a substrate 310 and a plurality of light emitting devices 20 arranged on the substrate 310 as shown in FIGS. 11A and 11B. 11B is a view in the longitudinal direction of FIG. 11A. As shown in FIG. 11C, the substrate 310 may be a substrate on which a circuit is printed, and preferably a heat dissipating member 311 may be disposed.

In this state, a driving unit 312 including a power supply unit and a driving circuit unit may be attached to the rear surface of the substrate 310 as shown in FIG. 11C.

Also, as shown in FIG. 11B, the substrate 310 in which the light-emitting devices 20 are arrayed and mounted in the tubular light-transmissive case 313 may be accommodated in a form similar to a fluorescent lamp.

The light source device 30 described above can be used as a large linear light source device such as a fluorescent lamp in which the light emitting devices 20 are fabricated using the rod-shaped reflector R2. At this time, preferably, each of the light emitting devices 20 may be arranged in a row so that the linear depressed portions 2211 formed by the rod-shaped reflectors R2 are arranged in substantially the same direction as the arrangement direction of the devices. The refraction concentrated portions of the respective light emitting devices 20 are arranged on both sides in the arrangement direction of the devices.

In the illustrated light source device 30, the arrangement direction of the light emitting devices 20 is linear, but it can be realized in a curved arrangement direction as well as a linear shape. In this case, if the case 313 is employed, it may also have the same shape as the arrangement direction of the device 20. [

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is to be understood that the invention is not limited to the disclosed exemplary embodiments.

10, 20: light-emitting device 12: photo-curable material
30: Light source device 110, 210: Light emitting chip
111, 211: light emitting surface 120, 220: optical structure
121, 221: transparent layer 122: fluorescent material layer
131: Adhesive member 1211, 2211: Depressed area
310: substrate 311: radiation member
312: drive device 313: case
R1, R2: reflector

Claims (18)

delete delete delete delete delete delete delete delete delete delete delete delete A light emitting device manufacturing method comprising:
Disposing a reflector on the light emitting chip;
Placing a light-transmissive photo-curable material to cover the light-emitting chip and the reflector;
Partially curing the photo-curable material by applying power to the light emitting chip to emit light; And
And removing an uncured portion of the photo-curable material,
And removing the reflector before or after the step of removing the uncured portions.
A method of manufacturing a light emitting device.
14. The method of claim 13,
And the reflector is disposed at a central portion of the upper surface of the light emitting chip.
A method of manufacturing a light emitting device.
15. The method of claim 14,
And the reflector is disposed at a predetermined distance from the upper surface of the light emitting chip.
A method of manufacturing a light emitting device.
16. The method of claim 15,
Wherein the reflector has a spherical or hemispherical shape and a portion facing the upper surface of the light emitting chip is a curved surface.
A method of manufacturing a light emitting device.
16. The method of claim 15,
Wherein the reflector is linearly arranged in parallel with any side of the light emitting chip,
Wherein the light emitting chip is disposed in parallel with the short side when the light emitting chip has a rectangular upper surface having a long side and a short side.
A method of manufacturing a light emitting device.
delete

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