KR101466129B1 - High Speed Substrate Inspection Apparatus And Method Using The Same - Google Patents

Abstract

Disclosed is a high-speed substrate inspection apparatus and a high-speed substrate inspection method using the continuous light, wherein the optical processing speed is improved.
An incident optical system for separating the light reflected from the substrate into the first reflected light and the second reflected light by guiding the light to the substrate being conveyed, a light source for emitting the light, A first reflection optical system for guiding the first reflected light to the first photosensor, and a second reflection optical system for guiding the incident light incident on the substrate using the first reflected light detected by the first photosensor A focal point matching section, a second reflection optical system for guiding the second reflection light to a path different from the first reflection light, and a second optical sensor for detecting the second reflection light.

Description

Technical Field [0001] The present invention relates to a high-speed substrate inspection apparatus,

The present invention relates to a high-speed substrate inspection apparatus and a high-speed substrate inspection method using the same, and more particularly, to a high-speed substrate inspection apparatus for optically inspecting a substrate being transferred and a high-speed substrate inspection method using the same.

In order to precisely inspect the substrate for defects, it is inspected through an image enlarged with a high magnification camera. In order to photograph a part of the substrate with a high magnification camera, a clear image can be obtained since the focus is correct.

A light source may be used for the focusing operation for focusing. When the substrate is irradiated with light and an image of the light reflected from the substrate reaches the sensor, it is possible to determine whether the focal point is matched through the image of the light sensed by the sensor. When the focal points are matched, the light source is operated to photograph the substrate through the camera to obtain an enlarged image.

On the other hand, in the conventional substrate inspection apparatus, autofocusing and image capturing are performed in one camera for cost reduction and the like. At this time, a single camera is operated in Binning mode to perform focus matching, and is operated in a Full mode to perform image shooting.

When focus alignment and image capturing are performed in a single camera as described above, switching time necessary for switching from the binning mode to the full mode or switching from the full mode to the binning mode occurs, and as a result of the switching time, It is difficult to continuously use the light, and the speed of processing the detected light is delayed, so that the inspection speed of the substrate is lowered.

Korea Open Patent No. 2012-0105149 (released on September 25, 2012)

SUMMARY OF THE INVENTION An object of the present invention is to provide a high-speed substrate inspection apparatus and a high-speed substrate inspection method using the continuous light and improving the optical processing speed.

A high-speed substrate inspection apparatus according to the present invention includes a substrate for transferring a substrate, a light source for emitting light, a light source for guiding the light to the substrate being transferred, and separating light reflected from the substrate into a first reflected light and a second reflected light A first optical sensor for detecting the first reflected light, a first reflecting optical system for guiding the first reflected light to the first optical sensor, and a second reflecting optical system for guiding the first reflected light to the substrate A second reflecting optical system for guiding the second reflected light to a path different from the first reflected light, and a second optical sensor for detecting the second reflected light.

Wherein the incident optical system is disposed between the light source and the objective lens to guide the incident light to the objective lens and reflects the light reflected from the substrate to the first reflected light and the second reflected light, And an optical member for separating the light into two reflected lights.

The focus aligning portion may include a linear actuator for supporting the objective lens and adjusting a distance of the objective lens with respect to the substrate.

The linear actuator may be a voice coil motor (VCM).

Further comprising a focus alignment determiner for determining whether or not the incident light is focused on the basis of the light intensity of the first reflected light detected by the first photosensor and transmitting a signal according to the focus alignment determination result to the focus alignment determiner .

The method of inspecting a high-speed substrate according to the present invention includes the steps of: (a) a step in which a substrate is transferred by a substrate and light emitted from the light source is incident on the substrate; (b) (C) the first reflected light is guided by the first reflecting optical system to be detected by the first optical sensor, (d) the step of separating incident light incident on the substrate on the basis of the first reflected light, (E) focusing the incident light according to a result of the determination of whether or not the incident light is focused, (f) guiding the second reflected light to the second reflecting optical system to focus the second light And detecting it in the sensor.

In the step (e), a distance between the objective lens for condensing the incident light onto the substrate and the substrate may be adjusted.

In the step (d), whether or not the incident light is in focus can be determined using the light intensity of the incident light.

In the step (d), if the light intensity of the incident light is detected to be less than the allowable range of the preset value or exceed the allowable range of the preset value, it is determined that the focus alignment of the incident light is poor and a failure signal is generated.

In the step (d), if the light intensity of the incident light is detected within the allowable range of the predetermined value, it is determined that the focus alignment of the incident light is normal and a normal signal is generated.

The high-speed substrate inspection apparatus and the high-speed substrate inspection method using the same according to the present invention have an effect of improving the speed of inspection of the substrate because the use of continuous light and the processing speed of light are improved.

1 is a block diagram schematically showing a high-speed substrate inspection apparatus according to the present embodiment.
2 is a flowchart showing a method of inspecting a high-speed substrate according to the present embodiment.
3 is an operation diagram illustrating a state in which light is incident on a substrate in the high-speed substrate inspection apparatus according to the present embodiment.
4 is an operation diagram illustrating a state in which first reflected light is detected and focus matching is performed in the high-speed substrate inspection apparatus according to the present embodiment.
5 is an operation diagram illustrating a state in which a second reflected light is detected in the high-speed substrate inspection apparatus according to the present embodiment.

The terms and words used in the present specification and claims should not be construed as limited to ordinary or dictionary terms and the inventor may appropriately define the concept of the term in order to best describe its invention It should be construed as meaning and concept consistent with the technical idea of the present invention. Therefore, the embodiments described in the present specification and the configurations shown in the drawings are only examples of the present invention, and are not intended to represent all of the technical ideas of the present invention, so that various equivalents and modifications may be made thereto .

1 is a block diagram schematically showing a high-speed substrate inspection apparatus according to the present embodiment.

Referring to FIG. 1, a high-speed substrate inspection apparatus (hereinafter, referred to as 'substrate inspection apparatus') 100 according to the present embodiment may include a substrate transfer unit 110. The substrate transfer unit 110 transfers the substrate 10 to be inspected. The substrate transfer unit 110 may be a roller conveyor system, a belt conveyor system, an air conveyor system, or the like.

A light source 120 may be disposed above the substrate transfer section 110. The light source 120 emits light. The light source 120 may be a plurality of light sources arranged in a direction crossing the direction in which the substrate 10 is conveyed and may be a slit light source for irradiating linear light in a direction crossing the direction in which the substrate 10 is conveyed .

The substrate inspection apparatus 100 may include an incident optical system 130 for guiding light incident on the substrate 10 (hereinafter referred to as 'incident light IL'). The incident optical system 130 may include a first optical member 131, a second optical member 132, and an objective lens 133. The first optical member 131 and the second optical member 132 may use optical members capable of transmitting a part of light and reflecting the others or selectively reflecting or transmitting light according to the polarization of light or the wavelength of light have. As the first optical member 131 and the second optical member 132, a prism, a beam splitter, a half wave plate, a quarter wave plate, or the like may be used.

The first optical member 131 guides the incident light IL to the second optical member 132. The second optical member 132 guides the incident light IL guided by the first optical member 131 to the objective lens 133. The objective lens 133 condenses the incident light IL onto the substrate 10.

The incident light IL incident on the substrate 10 is reflected by the substrate 10 and is incident on the second optical member 132 through the objective lens 133 again. The second optical member 132 separates the light reflected from the substrate 10 into the first reflected light RL1 and the second reflected light RL2.

The substrate inspection apparatus 100 may include a first reflective optical system 140 and a second reflective optical system 150 for guiding the first reflected light RL1 and the second reflected light RL2 in different paths. A first optical sensor 160 for detecting the first reflected light RL1 is disposed in the path of the first reflected light RL1 guided by the first reflecting optical system 140, A second optical sensor 170 for detecting the second reflected light RL2 may be disposed in the path of the second reflected light RL2.

The first reflection optical system 140 may include a reflection mirror 141 and a first tube lens 142. The first reflected light RL1 can be reflected by the second optical member 132 and transmitted through the first optical member 131. [ The reflection mirror 141 is disposed in the path of the first reflected light RL1 transmitted through the first optical member 131 to guide the first reflected light RL1 to the first optical sensor 160. [ The first tube lens 142 is disposed between the reflection mirror 141 and the first photosensor 160 to enlarge the first reflected light RL1 so that the first reflected light RL1 can be easily detected, (160).

The second reflecting optical system 150 guides the second reflected light RL2 to the second photosensor 170. [ The second reflecting optical system 150 may include a second tube lens 151. The second reflected light RL2 separated from the first reflected light RL1 can pass through the second optical member 132. [ The second tube lens 151 is disposed between the second optical member 132 and the second optical sensor 170 to enlarge the second reflected light RL2 so as to facilitate detection of the second reflected light, 170).

As the first photosensor 160 and the second photosensor 170, a charge coupled device (CCD) may be used. A CCD is a sensor that converts light into electric charge to obtain an image. A CCD chip can be formed by collecting a plurality of photodiodes. The amount of electrons of the diode means the intensity of light according to the amount of light irradiated to each diode.

The first reflected light RL1 detected by the first photosensor 160 is used as focus-matching light to adjust the focus of the incident light IL. The second reflected light RL2 detected by the second photosensor 170 is used as light for acquiring a substrate image so that an image of the substrate 10 is acquired.

The focus detection unit 180 may be connected to the first optical sensor 160 and the focus detection unit 190 may be connected to the focus detection unit 180. [

The focus matching determiner 180 determines whether or not the incident light IL is focused using the first reflected light RL1 detected by the first photosensor 160. [ For example, when the light intensity of the first reflected light RL1 is detected to exceed the allowable range of the preset value or is detected to be less than the allowable range of the preset value, the focus-match determining unit 180 determines that the focus- And generates a defective signal to guide the position of the objective lens 133 to be adjusted. On the contrary, when the light intensity of the first reflected light RL1 is detected within the allowable range of the preset value, the focus-matching determining unit 180 determines that focus alignment is good and generates a normal signal.

The focus matching unit 190 adjusts the distance of the objective lens 133 with respect to the substrate 10 by receiving a bad signal or a normal signal generated from the focus matching unit 180, Ensure that the position is maintained. The focus aligning part 190 may include a linear actuator 191 that supports the objective lens 133 and adjusts the distance of the objective lens 133 with respect to the substrate 10. As the linear actuator 191, a voice coil motor (VCM) having a higher response speed than other motors may be used. Although not shown, the focus matching section 190 may include a control section for controlling the linear actuator 191 in accordance with a bad signal or a normal signal.

Hereinafter, a high-speed substrate inspection method according to the present embodiment will be described.

FIG. 2 is a flowchart illustrating a method of inspecting a high-speed substrate according to an embodiment of the present invention. FIG. 3 is an operation diagram illustrating a state in which light is incident on a substrate in the high-speed substrate inspection apparatus according to the present embodiment.

Referring to FIGS. 3 and 4, the substrate 10 is transported by the substrate transfer unit 110. The transfer of the substrate 10 can be maintained at a constant speed even while the inspection of the substrate 10 is proceeding. Accordingly, the present embodiment prevents the deterioration of the substrate inspection speed due to the operation of stopping and moving the substrate 10, thereby improving the inspection efficiency of the substrate 10.

The light source 120 emits incident light IL incident on the substrate 10. The incident light IL may be reflected by the first optical member 131 and incident on the second optical member 132. The incident light IL can be reflected by the second optical member 132 and incident on the objective lens 133. [ The incident light IL can be condensed by the objective lens 133 and incident on the substrate 10. (Step S11)

When the incident light IL is incident on the substrate as described above, light can be reflected by the substrate 10. The light reflected by the substrate 10 may be incident on the second optical member 132. At this time, the light is partially reflected by the second optical member 132, and the remaining light is transmitted and separated into the first reflected light RL1 and the second reflected light RL2. (Step S12)

4 is an operation diagram illustrating a state in which first reflected light is detected and focus matching is performed in the high-speed substrate inspection apparatus according to the present embodiment.

Referring to FIG. 4, the first reflected light RL1 reflected by the second optical member 132 can pass through the first optical member 131. FIG. The first reflected light (RL1) transmitted through the first optical member (131) is reflected by the reflecting mirror (141). The first reflected light (RL1) reflected by the reflecting mirror (141) is incident on the first tube lens (142). The first reflected light RL1 is magnified by the first tube lens and detected by the first photosensor 160. [ (Step S13)

When the first reflected light RL1 is detected by the first photosensor 160, the focus-matching determining unit 180 determines whether the incident light IL is focused on the basis of the light intensity of the first reflected light RL1 do. (Step S14)

That is, when the light intensity of the first reflected light RL1 exceeds the allowable range of the preset value or is detected to be less than the allowable range of the preset value, the focus match determiner 180 generates a defective signal. The defective signal is transmitted to the focus-matching unit 190. The focal point matching unit 190 receives the defective signal and the control unit controls the linear actuator 191 so that the separation distance of the objective lens 133 with respect to the substrate 10 is adjusted in accordance with the defective signal. (Step S15)

Conversely, when the light intensity of the first reflected light RL1 is detected within the allowable range of the preset value, the focus-matching determining unit 180 generates a normal signal. The normal signal is transmitted to the focus matching unit 190. The focus matching unit 190 receives the normal signal and the control unit controls the linear actuator 191 so that the distance of the objective lens 133 to the substrate 10 is maintained in accordance with the normal signal. (Step S16)

As described above, in this embodiment, the focal point of the incident light IL incident on the substrate 10 using the first reflected light RL1 can be adjusted.

5 is an operation diagram illustrating a state in which a second reflected light is detected in the high-speed substrate inspection apparatus according to the present embodiment.

5, the second reflected light RL2 transmitted through the second optical member 132 is reflected by the second tube lens 151 to the second optical sensor 170 . In this way, the second reflected light RL2 is detected by the second photosensor 170, and an image of the substrate 10 is obtained. At this time, since the incident light IL has already undergone the focus matching using the first reflected light RL1, a clear focused image of the substrate 10 can be obtained. (Step S17)

The image of the substrate 10 thus obtained is displayed on a display device (not shown), and the coordinate values of the substrate 10 can be stored in a storage device (not shown). The images corresponding to the respective coordinates of the substrate 10 stored in the storage device (not shown) can be subsequently used in the substrate review apparatus.

The embodiments of the present invention described above and shown in the drawings should not be construed as limiting the technical idea of the present invention. The scope of protection of the present invention is limited only by the matters described in the claims, and those skilled in the art will be able to modify the technical idea of the present invention in various forms. Accordingly, such improvements and modifications will fall within the scope of the present invention as long as they are obvious to those skilled in the art.

10: substrate 100: high speed substrate inspection device
110: substrate transferring unit 120: light source
130: incidence optical system 131: first optical member
132: second optical member 133: objective lens
140: first reflecting optical system 141: reflecting mirror
142: first tube lens 150: second reflection optical system
151: second tube lens 160: first optical sensor
170: first optical sensor 180: focus-
190: focal point matching portion 191: linear actuator

Claims (10)

A substrate transferring unit for transferring the substrate;
A light source for emitting light;
An incident optical system for guiding the light to the substrate being transported and separating light reflected from the substrate into first reflected light and second reflected light;
A first optical sensor for detecting the first reflected light;
A first reflection optical system for guiding the first reflected light to the first optical sensor;
A focus aligning unit for adjusting a focus of incident light incident on the substrate using the first reflected light detected by the first photosensor;
A second reflection optical system for guiding the second reflection light in a path different from the first reflection light;
And a second photosensor provided separately from the first photosensor and disposed in an optical path of the second reflected light to detect the second reflected light. The optical system according to claim 1, wherein the incident optical system
An objective lens for converging the incident light on the substrate;
And an optical member disposed between the light source and the objective lens and guiding the incident light to the objective lens and separating light reflected from the substrate into the first reflected light and the second reflected light, Substrate inspection apparatus. 3. The apparatus of claim 2, wherein the focus-
And a linear actuator for supporting the objective lens and adjusting a distance of the objective lens with respect to the substrate. 4. The linear actuator according to claim 3, wherein the linear actuator
Wherein the VCM is a voice coil motor (VCM). The method according to claim 1,
And a focus alignment determiner for determining whether or not the incident light is focused on the basis of the light intensity of the first reflected light detected by the first photosensor and delivering a signal according to the focus alignment result to the focus aligner Wherein the high-speed substrate inspection apparatus comprises: (a) a step in which a substrate is transferred by a substrate and light emitted from the light source is incident on the substrate;
(b) separating the light reflected from the substrate into a first reflected light and a second reflected light;
(c) the first reflected light is guided to the first reflecting optical system and detected by the first optical sensor;
(d) determining whether focus alignment of the incident light incident on the substrate is based on the first reflected light;
(e) performing focus alignment of the incident light according to a result of determining whether or not the incident light is focused, and
(f) detecting the second reflected light guided to the second reflecting optical system to a second photosensor provided separately from the first photosensor and disposed in the optical path of the second reflected light; and / RTI > 7. The method of claim 6, wherein in the step (e), a distance between the objective lens for focusing the incident light onto the substrate and the substrate is adjusted. 7. The method of claim 6, wherein the step (d) comprises determining whether the incident light is in focus or not using the light intensity of the incident light. The method as claimed in claim 8, wherein, in the step (d), if the light intensity of the incident light is detected to be less than the allowable range of the preset value or exceed the allowable range of the predetermined value, And a signal is generated. The method according to claim 8, wherein, in the step (d), when the light intensity of the incident light is detected within the allowable range of the preset value, it is determined that the focus matching of the incident light is normal and a normal signal is generated .

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