KR101464477B1 - 독립 광 소스를 이용한 웨이퍼 온도 측정을 위한 방법 및 장치 - Google Patents

독립 광 소스를 이용한 웨이퍼 온도 측정을 위한 방법 및 장치 Download PDF

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Publication number
KR101464477B1
KR101464477B1 KR1020120078164A KR20120078164A KR101464477B1 KR 101464477 B1 KR101464477 B1 KR 101464477B1 KR 1020120078164 A KR1020120078164 A KR 1020120078164A KR 20120078164 A KR20120078164 A KR 20120078164A KR 101464477 B1 KR101464477 B1 KR 101464477B1
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South Korea
Prior art keywords
substrate
signal
light
wavelength
temperature
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English (en)
Korean (ko)
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KR20130027076A (ko
Inventor
자레드 아흐매드 리
지핑 리
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어플라이드 머티어리얼스, 인코포레이티드
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
    • H01L21/3065—Plasma etching; Reactive-ion etching
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
    • G01J5/0003—Radiation pyrometry, e.g. infrared or optical thermometry for sensing the radiant heat transfer of samples, e.g. emittance meter
    • G01J5/0007—Radiation pyrometry, e.g. infrared or optical thermometry for sensing the radiant heat transfer of samples, e.g. emittance meter of wafers or semiconductor substrates, e.g. using Rapid Thermal Processing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67248—Temperature monitoring
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Plasma & Fusion (AREA)
  • Drying Of Semiconductors (AREA)
  • Radiation Pyrometers (AREA)
KR1020120078164A 2011-09-06 2012-07-18 독립 광 소스를 이용한 웨이퍼 온도 측정을 위한 방법 및 장치 Expired - Fee Related KR101464477B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201161531327P 2011-09-06 2011-09-06
US61/531,327 2011-09-06

Publications (2)

Publication Number Publication Date
KR20130027076A KR20130027076A (ko) 2013-03-14
KR101464477B1 true KR101464477B1 (ko) 2014-11-24

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ID=47753466

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020120078164A Expired - Fee Related KR101464477B1 (ko) 2011-09-06 2012-07-18 독립 광 소스를 이용한 웨이퍼 온도 측정을 위한 방법 및 장치

Country Status (5)

Country Link
US (1) US20130059403A1 (enExample)
JP (1) JP2013057660A (enExample)
KR (1) KR101464477B1 (enExample)
CN (1) CN102980663A (enExample)
TW (1) TW201312673A (enExample)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11022877B2 (en) 2017-03-13 2021-06-01 Applied Materials, Inc. Etch processing system having reflective endpoint detection
CN109724712B (zh) * 2017-10-31 2021-04-30 上海微电子装备（集团）股份有限公司 温度检测装置及其制造方法和激光表面退火设备
KR102421732B1 (ko) 2018-04-20 2022-07-18 삼성전자주식회사 반도체 기판 측정 장치 및 이를 이용한 플라즈마 처리 장치
TWI849132B (zh) 2019-06-03 2024-07-21 美商應用材料股份有限公司 非接觸式的低基板溫度測量方法
US11610824B2 (en) * 2020-02-28 2023-03-21 Beijing E-Town Semiconductor Technology Co., Ltd Transmission-based temperature measurement of a workpiece in a thermal processing system
US11688616B2 (en) * 2020-07-22 2023-06-27 Applied Materials, Inc. Integrated substrate measurement system to improve manufacturing process performance
US12283503B2 (en) 2020-07-22 2025-04-22 Applied Materials, Inc. Substrate measurement subsystem
US11359972B2 (en) * 2020-09-15 2022-06-14 Applied Materials, Inc. Temperature calibration with band gap absorption method
TWI765571B (zh) * 2021-02-09 2022-05-21 華邦電子股份有限公司 熱板冷卻系統
US12235624B2 (en) 2021-12-21 2025-02-25 Applied Materials, Inc. Methods and mechanisms for adjusting process chamber parameters during substrate manufacturing
US12216455B2 (en) 2022-01-25 2025-02-04 Applied Materials, Inc. Chamber component condition estimation using substrate measurements
US12339645B2 (en) 2022-01-25 2025-06-24 Applied Materials, Inc. Estimation of chamber component conditions using substrate measurements
US12148647B2 (en) 2022-01-25 2024-11-19 Applied Materials, Inc. Integrated substrate measurement system
KR102703004B1 (ko) * 2022-04-01 2024-09-04 한국기계연구원 플라즈마 장치용 공정 모니터링 시스템
US20240363448A1 (en) * 2023-04-25 2024-10-31 Applied Materials, Inc. Measuring systems, processing systems, and related apparatus and methods, including band gap materials
KR102784412B1 (ko) * 2024-08-14 2025-03-21 (주)디바이스이엔지 가열 유닛이 장착된 기판 처리 장치
CN119310065A (zh) * 2024-11-01 2025-01-14 山东大学 基于libs的非接触式瞬态高温测量系统

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100255961B1 (ko) 1994-03-11 2000-05-01 아끼구사 나오유끼 물리량 측정방법 및 장치, 반도체 장치의 제조방법과 파장측정방법 및 장치
KR20020035333A (ko) * 2000-11-06 2002-05-11 윤종용 반도체 제조를 위한 기판의 온도를 측정하는 방법 및 장치
KR20110020943A (ko) * 2008-06-23 2011-03-03 어플라이드 머티어리얼스, 인코포레이티드 식각 프로세스에서 적외선 전송에 의한 기판 온도 측정

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2001050109A2 (en) * 2000-01-05 2001-07-12 Tokyo Electron Limited Wafer band-edge measurement using spectroscopy and a process of uniform wafer temperature control

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100255961B1 (ko) 1994-03-11 2000-05-01 아끼구사 나오유끼 물리량 측정방법 및 장치, 반도체 장치의 제조방법과 파장측정방법 및 장치
KR20020035333A (ko) * 2000-11-06 2002-05-11 윤종용 반도체 제조를 위한 기판의 온도를 측정하는 방법 및 장치
KR20110020943A (ko) * 2008-06-23 2011-03-03 어플라이드 머티어리얼스, 인코포레이티드 식각 프로세스에서 적외선 전송에 의한 기판 온도 측정

Also Published As

Publication number Publication date
TW201312673A (zh) 2013-03-16
US20130059403A1 (en) 2013-03-07
CN102980663A (zh) 2013-03-20
KR20130027076A (ko) 2013-03-14
JP2013057660A (ja) 2013-03-28

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