KR101460163B1 - Apparatus for laser beam processing - Google Patents

Abstract

The present invention relates to a machining apparatus using a laser beam. More specifically, the present invention relates to an apparatus for performing a machining process such as a cutting process with respect to a workpiece by irradiating a laser beam onto the workpiece. The machining apparatus according to an embodiment of the present invention includes: a laser beam oscillator to oscillate a laser beam; a galvanometer scanner to irradiate the laser beam, which is oscillated from the laser beam oscillator, onto the workpiece while changing a deflection angle; and a rotary table that has a hollow structure provided at the central portion thereof with a through hole, and is provided on a top surface thereof with the galvanometer scanner so that the rotary table is rotated together with the galvanometer scanner to allow the laser beam to be irradiated from the galvanometer scanner toward the workpiece through the central portion.

Description

[0001] Apparatus for laser beam processing [0002]

The present invention relates to a laser beam machining apparatus, and more particularly, to an apparatus for cutting a workpiece by irradiating a laser beam.

Lithium rechargeable batteries are widely used in mobile devices such as mobile phones and notebook computers. Recently, they have been attracting attention as large-capacity power storage systems (ESS) for renewable energy such as solar power and wind power as well as power sources for hybrid electric vehicles and robots have.

The core materials of the lithium secondary battery include a cathode material, an anode material, an electrolyte, and a separator. In the manufacturing process, the anode material and the cathode material are prepared by applying (coating) an electrode slurry to a thin foil foil, cutting the foil by a press using a die, or cutting with a laser.

Among them, the press cutting method generates burrs during processing, and the applied electrode may fall off and generate dust. Therefore, a laser cutting method which improves the press cutting method is used, and the following two methods are used as the press cutting method.

One is a method of cutting by attaching a laser cutting head to the X and Y stages. Although this method has excellent cutting quality, it can produce the desired shape by operating the X and Y stages, but the acceleration / deceleration section continues to occur, and there is a limit to high-speed cutting.

The other is to use a galvanometer scanner head to easily make patterns of various shapes, but the size of the working patterns is limited. As the size of the working pattern increases, the working field needs to be enlarged because the working range of the galvanometer scanner is limited. For this purpose, the work area can be expanded by replacing the f-theta scanning lens, but at the same time, there is a problem that the laser focusing spot size is increased. When the laser focusing spot size is increased, the quality of the cut surface is lowered.

Korean Patent Publication No. 10-2013-0012036

An object of the present invention is to provide an apparatus capable of performing laser beam machining such as cutting by irradiating a laser beam without being restricted by the shape and size of the laser beam machining pattern. Another object of the present invention is to provide a laser beam machining apparatus capable of cutting at high speed while ensuring cutting quality when cutting workpieces.

An embodiment of the present invention is a laser beam oscillator for oscillating a laser beam; A galvanometer scanner for irradiating a workpiece with a laser beam oscillated by the laser beam oscillator at a different deflection angle; A rotary table rotatable in a hollow shape having a central portion penetrating therethrough and having a galvanometer scanner provided on an upper surface of the rotary table so that the laser beam irradiated from the galvanometer scanner passes through the central portion and is directed to the workpiece, .

A laser table which is provided apart from the rotary table and outputs laser beam machining information which is control data of a rotary table and a galvanometer scanner for irradiating a workpiece with a laser beam and which controls the operation of the laser beam oscillator on / A beam machining control part; And a controller for controlling the driving of the rotary table and the galvanometer scanner in accordance with the laser beam machining information and for outputting driving state information indicating the driving state of the rotary table and the galvanometer scanner, A beam machining driver; And an information relay unit for relaying data between the laser beam machining control unit and the laser beam machining drive unit.

The laser beam machining information includes at least one of a rotation speed of the rotary table and a deflection angle which is an irradiation direction of the galvanometer scanner.

The laser beam machining controller outputs a drive steady signal indicating that the rotation of the rotary table and the deflection angle of the galvanometer scanner are normally controlled as the drive state information, The controller controls the laser beam oscillator to oscillate the laser beam.

Wherein the laser beam machining control unit rotates the rotary table in accordance with the rotation speed of the rotary table output from the laser beam machining control unit and rotates the rotary table in accordance with the deflection angle of the galvanometer scanner output from the laser beam machining control unit, And adjusts the irradiation direction of the scanner.

The information relay unit may include a laser beam machining information transmission module for transmitting the laser beam machining information output from the laser beam machining control unit to the laser beam machining driver; And a driving state information transmission module for transmitting the driving state information output from the laser beam machining driving section to the laser beam machining control section.

The laser beam machining information transmitting module includes a laser beam machining information sensor electrically connected to the laser beam machining driver and protruding from the outer periphery of the rotary table; And a laser beam machining information providing terminal which is electrically connected to the laser beam machining control part at one end and moves the other end to be disconnected or spaced from the laser beam machining information sensor.

The driving state information transmission module includes: a driving state information sensor electrically connected to the laser beam machining control unit; And a driving state information providing terminal which is electrically connected to the laser beam machining driving part at one end and protrudes from the outer periphery of the rotary table at the other end and is moved to be shorted or separated from the driving state information sensor.

A galvanometer scanner housing in which the galvanometer scanner is positioned in an inner space having an open bottom surface and a laser beam of the galvanometer scanner is irradiated through the bottom surface toward the center portion; And a guide feeder provided on an upper surface of the rotary table to allow the galvanometer scanner housing to move along the radial direction of the rotary table.

According to the embodiment of the present invention, it is possible to perform processing such as cutting a workpiece without being restricted by the shape and size of the laser beam machining pattern. Further, according to the embodiment of the present invention, the deflection angle of the galvanometer scanner is controlled separately at the same time as the rotation of the rotary table, whereby the workpiece can be processed at a high speed. In addition, according to the embodiment of the present invention, it is possible to efficiently irradiate the laser beam by providing the sensing body for determining whether the rotary table is driven and determining whether to irradiate the laser beam.

1 is a block diagram of a laser beam machining apparatus according to an embodiment of the present invention.
2 is a perspective view of a laser beam processing apparatus according to an embodiment of the present invention.
3 is a perspective view of a galvanometer scanner in a laser beam machining apparatus.
4 is a perspective view and a cross-sectional view of a rotary table according to an embodiment of the present invention.
Fig. 5 is a view showing a working area of the laser beam irradiation located on the workpiece.
6 is a view showing a state in which a laser beam irradiation path is formed according to the rotation of the rotary table according to the embodiment of the present invention.
7 is a view showing a plurality of laser beam machining information providing terminals allocated for each laser beam machining information according to an embodiment of the present invention.
8 is a view showing a state in which a laser beam irradiation path is formed when the galvanometer scanner housing 560 is located at the center point in the radial direction of the rotary table according to the embodiment of the present invention.
FIG. 9 is a view showing a state in which a laser beam irradiation path is formed when the galvanometer scanner housing 560 is located on the outer side in the radial direction of the rotary table according to the embodiment of the present invention.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. It will be apparent to those skilled in the art that the present invention may be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, It is provided to let you know. Wherein like reference numerals refer to like elements throughout.

In the following description, a laser beam cutting apparatus for cutting out a laser beam with respect to a workpiece will be described as an example of a laser beam machining apparatus, but it will be obvious that the present invention can be applied to various laser beam machining apparatuses other than the cutting apparatus. Hereinafter, the term "workpiece" means a workpiece to be processed by a laser beam processing apparatus.

2 is a perspective view of a laser beam machining apparatus according to an embodiment of the present invention. FIG. 3 is a sectional view of the laser beam machining apparatus shown in FIG. FIG. 4 is a perspective view and a cross-sectional view of a rotary table according to an embodiment of the present invention. FIG. 4 is a perspective view of a galvanometer scanner. FIG.

The laser beam oscillator 600 generates and emits a laser beam used for a work such as cutting of a workpiece, and a laser beam oscillator 600 is disposed such that a laser beam to be emitted is directed to the galvanometer scanner 500. The laser beam oscillator 600 may be a laser beam oscillator 600 that generates a laser beam having a desired wavelength from various wavelengths such as ultraviolet rays, visible rays, or infrared rays, depending on the type of workpiece. Therefore, the laser beam oscillator 600 according to the exemplary embodiment of the present invention can be manufactured using a combination of Nd, Yb, Cr, and Ti in a crystal such as sapphire, YAG, ceramic YAG, ceramic Y2O3, KGW, KYW, Mg2SiO4, YLF, YVO4, GdVO4, , Ho, and Er doped with a dopant may be used as the laser beam oscillator 600 having a different wavelength. Also, the type of the laser beam oscillator 600 is not limited thereto, and can be easily changed by those skilled in the art.

The galvanometer scanner irradiates a workpiece with a laser beam emitted from a laser beam oscillator 600, and deflects the workpiece at a desired angle (deflection angle) along a desired irradiation path to irradiate the workpiece.

The galvanometer scanner 500 for the angular deflection is equipped with a mirror on a rotary shaft provided to rotate only within a certain angle range. The galvanometer scanner 500 controls the path of a light beam in the equipment industry using a laser It is used as a means. The galvanometer scanner includes two mirrors 510 and 530 (hereinafter referred to as a 'galvanometer motor') and two reflecting mirrors 520 and 540 connected to the rotating shaft as shown in FIG. 3, The mirror motors 510 and 530 are controlled so that each of the reflection mirrors 520 and 540 rotates within a certain angle range. The galvanometer scanner 500 includes a reflection mirror 520 for reflecting the laser beam incident from the laser beam oscillator 600, a first galvanometer motor 510 for adjusting the tilt angle of the reflection mirror, A retroreflecting mirror 540 that reflects the beam reflected through the reflective mirror 520 back to the workpiece and a second galvanometer motor 530 that adjusts the tilt angle of the retroreflecting mirror 540 can do.

In addition, the galvanometer scanner 500 may include an expander (not shown) and a scan lens (not shown). An expander is positioned on the laser beam axis between the laser beam oscillator 600 and the galvanometer scanner 500 to adjust the diameter of the laser beam. Accordingly, the diameter of the laser beam oscillated in the laser beam oscillator 600 can be changed through the expander while changing the diameter of the laser beam. The scan lens is deflected by the galvanometer scanner 500 to receive a laser beam directed toward the workpiece, and focuses the laser beam to irradiate the workpiece. Therefore, the laser beam emitted by the galvanometer scanner 500 is focused on the workpiece surface by the scan lens 550.

The galvanometer scanner 500 may be provided in the interior space of the galvanometer scanner housing 560, which is a housing having an open bottom surface. The laser beam of the galvanometer scanner 500 emitted through the bottom surface of the galvanometer scanner housing 560 can be irradiated toward the workpiece through the penetrated central portion of the rotary table 400. The reflecting mirror 520 of the galvanometer scanner 500, the retroreflecting mirror 540, the first galvanometer motor 510 and the second galvanometer motor 520 are connected to the galvanometer scanner housing 560 And is supported by the inner wall of the galvanometer scanner housing 560. [ The galvanometer scanner housing 560 is located on the upper surface of the rotary table 400 and is coupled to and supported by the guide transfer unit 450. The galvanometer scanner housing 560 can be moved along the radial direction of the rotary table 400 by the guide transfer unit 450, which will be described later.

On the other hand, since the galvanometer scanner 500 adjusts the deflection angle only within a certain angle range, there is a limit of the working area as shown in FIG. Therefore, in order to allow a wider range to be processed beyond the work area of the galvanometer scanner 500, the embodiment of the present invention includes a rotary table 400, which is a rotating rotating body, The galvanometer scanner was placed on the top, resulting in an extension of the work area for the workpiece.

The rotary table 400 is a hollow motor that rotates in a structure in which a central portion is penetrated. The galvanometer scanner 500 may be provided on the upper surface of the rotary table 400 to rotate the galvanometer scanner 500 together. The rotary table 400 may have various shapes as a rotary table, as is known. For example, as shown in FIG. 4, it may have a cylindrical structure having a double wall composed of an inner rotating body 410 and an outer motor driving body 420. And a DD (Direct Drive) motor type in which a motor is directly mounted on the inner rotor without a connection belt between the inner rotating body 410 and the outer motor driving body 420. For example, the motor gear 421 is rotated by the driving force of the outer motor driving body 420 to rotate the inner gear 411 formed on the inner rotating body 410 to rotate, and as a result, the inner rotating body 410 is rotated . For reference, the inner rotating body 410 corresponds to the rotary table 400.

A galvanometer scanner 500 is provided on the upper surface of the rotary table 400 so that the galvanometer scanner 500 also rotates in accordance with the rotation of the rotary table 400. Accordingly, the rotary table 400 rotates, and the irradiation direction of the galvanometer scanner 500 passes through the center portion, and the deflection angle is adjusted and irradiated on the workpiece, thereby expanding the machining area. If there is no rotation of the rotary table 400, there is no rotation of the galvanometer scanner 500 supported by the rotary table 400, so that the deflection angle of the mirror of the galvanometer scanner 500 is simply adjusted Only a small part of the entire workpiece S is a work area as shown in Fig. 5 (a), and a path pattern of laser beam irradiation for cutting or the like can be made only in the work area . When the galvanometer scanner 500 is disposed together with the rotary table 400 and the galvanometer scanner 500 rotates in accordance with the rotation of the rotary table 400, . The work area R of the galvanometer scanner 500 is also rotated in accordance with the rotation of the rotary table 400 so that the working area R of the galvanometer scanner 500 determined according to the rotation position of the rotary table 400 R), a wide range of laser beam irradiation path patterns can be finally formed as shown in FIG. 5 (b).

Referring to FIG. 6, a description will be given of a process in which cutting is performed according to the rotation of the rotary table 400 with respect to a workpiece and the adjustment of the deflection angle of the galvanometer scanner 500. FIG.

6, the rotary table 400 rotates in the direction of the section D from the start point P0. At this time, the galvanometer scanner 500 rotates the laser beam 400 in the work area R, Is cut along the cutting path to cut the workpiece. At this time, the work area R of the galvanometer scanner 500 also moves in accordance with the rotation of the rotary table 400, so that the deflection angle of the laser beam of the galvanometer scanner 500 according to the entire cutting path is controlled do.

On the other hand, in order to form the laser beam irradiation path pattern as shown in FIG. 5 (b) according to the rotation of the rotary table 400, the rotation speed of the rotary table 400 for forming the irradiation path pattern to be formed, The deflection angle which is the irradiation direction of the scanner 500 should be controlled.

For this, a laser beam machining control unit 100, a laser beam machining driving unit 300, and an information relay unit 200 are included.

The laser beam machining control unit 100 is provided to be spaced apart from the rotary table 400 and outputs laser beam machining information which is data of the rotary table 400 and the galvanometer scanner 500 for irradiating a workpiece with a laser beam And controls the operation of the laser beam oscillator 600 on / off. The laser beam machining information includes at least one of a rotation speed of the rotary table 400 and a deflection angle which is an irradiation direction of the galvanometer scanner 500. Therefore, the laser beam machining control unit 100 generates the rotation speed of the rotary table 400 and the deflection angle of the galvanometer scanner 500, etc. in order to irradiate the workpiece with the laser beam, to provide. For example, when the rotary table 400 rotates on the workpiece as shown in FIG. 5 (b), the work area of the galvanometer scanner 500 at the upper part of the rotary table 400 also changes, The deflection angle of the laser beam irradiated by the galvanometer scanner 500 must be changed along the designed laser beam path. Therefore, in order to have a desired laser beam irradiation path to the workpiece, the rotation speed of the rotary table 400 and the deflection angle of the galvanometer scanner 500 must be related to each other. Or the like, from the pattern database in which the velocity and the deflection angle are stored in advance, or provides the generated information to the laser beam machining driver 300.

The laser beam machining control unit 100 also controls the operation of the laser beam oscillator 600 on and off. That is, the laser beam machining control unit 100 receives a drive steady signal indicating that the laser beam machining control unit 100 is normally driven according to the rotation speed of the rotary table 400 and the deflection angle of the galvanometer scanner 500, from the laser beam machining drive unit 300 The operation of the laser beam oscillator 600 is turned on so that the workpiece is irradiated with the laser beam. In addition, when the laser beam machining is completed and the workpiece is taken out, the operation of the laser beam oscillator 600 is stopped (OFF, OFF).

 The laser beam machining driving unit 300 is supported by the upper surface of the rotary table 400 and controls the driving of the rotary table 400 and the galvanometer scanner 500 according to the laser beam machining information. The laser beam machining driver 300 drives a device driver for rotating the rotary table 400 and a device driver for driving a motor for adjusting the deflection angle of the galvanometer scanner 500. The laser beam machining driving unit 300 rotates the rotary table 400 in accordance with the rotational speed of the rotary table 400 output from the laser beam machining control unit 100, And drives the motor of the galvanometer scanner 500 according to the deflection angle of the meter scanner 500 to adjust the irradiation direction of the galvanometer scanner 500.

The laser beam machining driving unit 300 outputs driving state information indicating the driving states of the rotary table 400 and the galvanometer scanner 500. This driving state information outputs a driving steady signal when the rotation of the rotary table 400 and the deflection angle of the galvanometer scanner 500 are normally controlled to a set value. That is, when the rotation speed of the rotary table 400 and the deflection angle of the galvanometer scanner 500 are driven in accordance with the values provided by the laser beam machining control section 100, And outputs it to the beam machining control unit.

Meanwhile, the information relay unit 200 relays data between the laser beam machining control unit 100 and the laser beam machining drive unit 300. That is, the laser beam machining information (the rotation angle of the rotary table 400, the deflection angle of the galvanometer scanner 500, etc.) output from the laser beam machining control unit 100 is transmitted to the laser beam machining driver 300, In contrast, the driving state information of the driving steady signal provided by the laser beam machining driving unit 300 is transmitted to the laser beam machining control unit.

The information relay unit 200 includes a laser beam machining information transmission module 210 for transmitting the laser beam machining information output from the laser beam machining control unit 100 to the laser beam machining driver 300, And a driving state information transmission module 220 for transmitting driving state information output from the laser beam machining controller 300 to the laser beam machining controller 100.

The laser beam machining information transmitting module 210 includes a laser beam machining information sensor 212 and a laser beam machining information providing terminal 211. The laser beam machining information sensor 212 is electrically connected to the laser beam machining driver 300 and transmits a signal sensed from the laser beam machining information providing terminal 211 to the laser beam machining driver 300. For this purpose, the laser beam machining information sensor 212 is formed so as to protrude from the outer periphery of the rotary table 400. One end of the laser beam machining information providing terminal 211 is electrically connected to the laser beam machining control part 100 and the other end of the laser beam machining information providing terminal 211 can be moved to be shorted or separated from the laser beam machining information sensor 212. The laser beam machining information providing terminal 211 is moved up and down so that the laser beam machining information providing terminal 211 is short-circuited to the laser beam machining information sensor 212 in the absence of rotation of the rotary table 400 in the initial setting step So that the laser beam machining information output from the laser beam machining control unit 100 is transmitted to the laser beam machining information sensor 212. [ When the transmission of the laser beam machining information is completed, the laser beam machining information providing terminal 211 is lowered to return to the original state so that the laser beam machining information providing terminal 211 is separated from the laser beam machining information sensor 212 do. So as to prevent collision with the laser beam machining information providing terminal 211 as the rotary table 400 is rotated.

The area of the laser beam machining information sensor 212 which abuts the laser beam machining information providing terminal 211 is shifted to the stepped portion of the laser beam machining information providing terminal 211 in order to minimize the collision with the laser beam machining information providing terminal 211 as the rotary table 400 is rotated. Grooves. The laser beam machining information providing terminal 211 can be inserted into the stepped groove of the laser beam machining information sensor 212 when the laser beam machining information providing terminal 211 is moved up and short-circuited. Therefore, even if the rotary table 400 rotates, the laser beam machining information providing terminal 211 may not collide with the laser beam machining information sensor 212.

One end of the laser beam machining information providing terminal 211 is electrically connected to the laser beam machining controller 100 and the other end of the laser beam machining information providing terminal 211 is moved so as to be short-circuited or spaced apart from the laser beam machining information sensor 212. The driving means can be implemented variously. For example, the laser beam machining information providing terminal 211 may be implemented as a solenoid to extend the solenoid which is the laser beam machining information providing terminal 211 so as to be short-circuited to the laser beam machining information sensor 212, And the solenoid may be reduced so as to be spaced apart from the information sensor 212.

On the other hand, the laser beam machining information providing terminal 211 transmits data on the laser beam machining information to the laser beam machining control part 100 through a serial communication method such as RS232. The rotation speed of the rotary table 400 and the deflection angle of the galvanometer scanner 500 can be transmitted as different data in accordance with the laser beam irradiation patterns such as the first pattern, the second pattern and the third pattern.

The laser beam irradiation pattern of the first pattern, the second pattern, the third pattern, etc. may be transmitted instead of the specific values of the rotation speed of the rotary table 400 and the deflection angle of the galvanometer scanner 500. The laser beam machining driving unit 300 can drive the rotational speed of the rotary table 400 assigned thereto and the deflection angle of the galvanometer scanner 500 according to the transmitted laser beam irradiation pattern. FIG. 7 is a view showing a state where a plurality of laser beam machining information providing terminals 211 are formed, and is an illustration showing an example in which three laser beam machining information providing terminals 211 are formed. The laser beam machining information providing terminal 211 is allocated for each laser beam machining information as shown in FIG. 7 and provided in a plurality of (211a, 211b, 211c). The laser beam machining control unit 100 selects a specific laser beam machining information providing terminal among the plurality of laser beam machining information providing terminals 211a, 211b and 211c according to the laser beam machining information to be machined, May be shorted to the beam machining information sensor (212). The first terminal 211a for providing the laser beam machining information means to irradiate the laser beam in the first pattern and the second terminal 211b for providing the laser beam machining information means to irradiate the laser beam in the second pattern And the laser beam machining information providing third terminal 211c means to irradiate the laser beam in the third pattern. Therefore, the laser beam machining control unit 100 moves up the laser beam machining information providing terminal indicating the corresponding pattern among the three laser beam machining information providing terminals 211a, 211b and 211c according to the pattern to be irradiated with the laser beam, And can be short-circuited and sensed by the processing information sensor 212. [

The driving state information transmission module 220 of the information relay unit 200 transmits the driving state information output from the laser beam machining driving unit 300 to the laser beam machining control unit 100. The driving state information transmission module 220 can also transmit the driving state information to the laser beam machining control part 100 through the same sensing method as the laser beam machining information transmission module 210. [ And a driving state information sensor 221 electrically connected to the laser beam machining control unit 100 for this purpose. A drive status information providing terminal (not shown) which is electrically connected to the laser beam machining and driving part 300 and whose other end is protruded from the outer periphery of the rotary table 400 and is moved to be shorted or separated from the drive status information sensor 221 222). The driving state information sensing method of the driving state information transmission module 220 is the same as the driving method of the laser beam machining information transmission module 210,

On the other hand, the galvanometer scanner 500 is located inside the galvanometer scanner housing 560. The galvanometer scanner housing 560 places the galvanometer scanner 500 in an internal space having an open bottom surface and the laser beam of the galvanometer scanner 500 is guided through the bottom surface . The galvanometer scanner housing 560 is supported by the upper surface of the rotary table 400. The galvanometer scanner housing 560 is moved along the radial location of the rotary table 400 It can be different.

8 (a), when the galvanometer scanner housing 560 is located near the center point of the diameter of the rotary table 400, as shown in Fig. 8 (a), the galvanometer scanner housing 560 The turning radius of the housing 560 becomes small, and consequently, the area of the laser beam irradiation path becomes small. 9 (a), when the galvanometer scanner housing 560 is located close to the outer side (outer peripheral side) of the diameter of the rotary table 400, as shown in Fig. 9 (b) The turning radius of the galvanometer scanner housing 560 becomes larger, resulting in a larger laser beam irradiation path area.

As described above, the guide conveyance unit 450 is provided to allow the galvanometer scanner housing 560 to move in the radial direction of the rotary table 400. The guide transfer unit 450 is provided on the upper surface of the rotary table 400 so that the galvanometer scanner housing 560 is movable along the radial direction of the rotary table 400. For example, the guide feeder 450 may include a rail and a feed motor to allow the galvanometer scanner housing 560 to move along the rails.

The laser beam machining control unit 100 determines movement information of the galvanometer scanner 500 so as to be adjacent to the outer circumferential direction (outer side) of the rotary table 400 as the machining area for the workpiece becomes larger, The moving information of the galvanometer scanner 500 can be determined so as to face the center of the rotary table 400 (toward the inside). This galvanometer scanner 500 movement information indicating which position of the galvanometer scanner housing 560 is to be moved in the radial direction of the rotary table 400 is determined based on the rotation speed of the rotary table 400, May be included in the laser beam machining information indicating the deflection angle of the meter scanner 500 and may be transmitted to the laser beam machining driver 300.

By implementing the laser beam machining apparatus to which the rotary table 400 and the galvanometer scanner 500 are applied as described above, the present invention irradiates the laser beam without being restricted by the size of the operation pattern, It is possible to provide a laser beam machining apparatus capable of performing laser beam machining. Further, according to the present invention, the rotation of the motor and the laser beam irradiation control can be separately performed by implementing the laser irradiation means separately from the motor for driving the rotating body. The present invention also provides a sensing body for determining whether the rotating body is driven and determining whether to irradiate the laser beam, so that the laser beam can be efficiently irradiated.

Although the present invention has been described with reference to the accompanying drawings and the preferred embodiments described above, the present invention is not limited thereto but is limited by the following claims. Accordingly, those skilled in the art will appreciate that various modifications and changes may be made thereto without departing from the spirit of the following claims.

100: laser beam machining control part 200: information relay part
210: laser beam machining information transmission module
211: laser beam machining information providing terminal
212: laser beam machining information sensor
220: Driving status information transmission module
221: drive state information sensor
222: drive status information providing terminal
300: laser beam machining driving part
400: Rotary table 500: Galvanometer scanner
600: laser beam oscillator

Claims (13)

A laser beam oscillator for oscillating a laser beam;
A galvanometer scanner for irradiating a workpiece with a laser beam oscillated by the laser beam oscillator at a different deflection angle;
A rotary table rotatable in a hollow shape having a central portion penetrating therethrough and having a galvanometer scanner on an upper surface thereof and turning the laser beam irradiated from the galvanometer scanner through the central portion to face the workpiece;
A rotary table for irradiating a workpiece with a laser beam and laser beam machining information which is control data of a galvanometer scanner are provided so as to be spaced apart from the rotary table so as to control the operation of the laser beam oscillator, A machining control section;
And a controller for controlling the driving of the rotary table and the galvanometer scanner in accordance with the laser beam machining information and for outputting driving state information indicating the driving state of the rotary table and the galvanometer scanner, A beam machining driver;
And an information relay unit for relaying data between the laser beam machining control unit and the laser beam machining drive unit,
The information relaying unit,
A laser beam machining information transmitting module for transmitting the laser beam machining information outputted from the laser beam machining controller to the laser beam machining driver;
A driving state information transmission module for transmitting the driving state information output from the laser beam machining driving section to the laser beam machining control section;
And a laser beam processing unit for processing the laser beam.
delete The laser beam machining apparatus according to claim 1, wherein the laser beam machining information includes at least one of a rotation speed of the rotary table and a deflection angle which is an irradiation direction of the galvanometer scanner.
The method of claim 3,
Wherein the laser beam machining driver outputs a drive steady signal indicating that the rotation of the rotary table and the deflection angle of the galvanometer scanner are normally controlled as the drive state information, And controls the laser beam oscillator to oscillate by driving the laser beam oscillator.
4. The laser beam machining apparatus according to claim 3,
The rotary table is rotated according to the rotation speed of the rotary table output from the laser beam machining control unit and the irradiation direction of the galvanometer scanner is adjusted in accordance with the deflection angle of the galvanometer scanner output from the laser beam machining control unit Wherein the laser beam is a laser beam.
delete The laser beam machining information transmitting module according to claim 1,
A laser beam machining information sensor electrically connected to the laser beam machining driver and protruding from the outer periphery of the rotary table;
A laser beam machining information providing terminal which is electrically connected to the laser beam machining control part at one end and moves the other end to be shorted or spaced from the laser beam machining information sensor;
And a laser beam processing unit for processing the laser beam.
The laser processing apparatus according to claim 7, wherein the laser beam machining information providing terminal is provided for each of the laser beam machining information, and the laser beam machining control section provides the laser beam machining information assigned in accordance with the laser beam machining information to be machined Terminal is short-circuited to the laser beam machining information sensor.
The laser beam machining information providing terminal according to claim 7, wherein a region of the laser beam machining information sensor abutting the laser beam machining information providing terminal is formed as a step groove, and the laser beam machining information providing terminal is inserted into the step groove when the laser beam machining information providing terminal is short- Processing equipment.
The apparatus of claim 1,
A driving state information sensor electrically connected to the laser beam machining control unit;
A driving state information providing terminal which is electrically connected to the laser beam machining driving part at one end and protrudes from the outer periphery of the rotary table at the other end and is moved so as to be short-circuited or spaced apart from the driving state information sensor;
And a laser beam processing unit for processing the laser beam.
The method according to claim 1,
A galvanometer scanner housing in which the galvanometer scanner is positioned in an internal space having an open bottom surface and a laser beam of the galvanometer scanner is irradiated through the bottom surface toward the center portion;
A guide feeder provided on an upper surface of the rotary table to allow the galvanometer scanner housing to move along the radial direction of the rotary table;
And a laser beam processing unit for processing the laser beam.
12. The laser beam machining apparatus according to claim 11, wherein the laser beam machining information includes galvanometer scanner movement information indicating at which position the galvanometer scanner housing is to be moved in the radial direction of the rotary table.
The galvanometer scanner according to claim 12, wherein the laser beam machining control section determines the galvanometer scanner movement information so as to be adjacent to the outer circumferential direction of the rotary table as the machining area for the workpiece increases, and as the machining area for the workpiece becomes smaller And determines the galvanometer scanner movement information so as to face the center point of the rotary table.

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