CN108747000B - Multifunctional laser precision machining equipment - Google Patents
Multifunctional laser precision machining equipment Download PDFInfo
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- CN108747000B CN108747000B CN201810610941.5A CN201810610941A CN108747000B CN 108747000 B CN108747000 B CN 108747000B CN 201810610941 A CN201810610941 A CN 201810610941A CN 108747000 B CN108747000 B CN 108747000B
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- total reflection
- reflection mirror
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/0643—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising mirrors
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/03—Observing, e.g. monitoring, the workpiece
- B23K26/032—Observing, e.g. monitoring, the workpiece using optical means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
- B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
- B23K26/0624—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses using ultrashort pulses, i.e. pulses of 1ns or less
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- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Laser Beam Processing (AREA)
Abstract
According to the embodiment of the invention, the multifunctional laser precision machining equipment comprises: a laser; a beam expander; an attenuator; a first total reflection mirror; a second total reflection mirror; a third total reflection mirror; rotating the reflector; a fourth total reflection mirror; a scanning galvanometer module; a fifth total reflection mirror; a first camera; detecting the probe on line; a sixth total reflection mirror; a light beam regulation module; a seventh total reflection mirror; a second camera; a third camera; a displacement platform; wherein the rotary mirror is switchable between a position in which the laser beam is reflected toward the fourth total mirror and a position in which the laser beam is reflected toward the sixth total mirror. According to the multifunctional laser precision machining equipment provided by the embodiment of the invention, the cutting and trimming processes can be carried out independently or sequentially according to the machining requirements of the device; the cutting can be carried out first and then the trimming can be carried out, and the trimming can be carried out first and then the cutting can be carried out.
Description
Technical Field
The invention relates to a multifunctional laser precision machining device, in particular to a multifunctional laser precision machining device capable of realizing cutting and trimming.
Background
With the rapid development of science and technology, people put higher requirements on the size, precision, performance and stability of devices, especially in the semiconductor, photoelectron and optical communication industries. The laser processing is a new technology, the high-quality processing requirement of devices is effectively met, and the characteristics of high energy density, small spot size and non-contact of laser are utilized, so that the cutting, welding, cleaning, trimming and the like of various precise devices are realized.
For laser precision cutting, in the prior art, a pulse laser is mainly used as a processing source, and most of the pulse laser uses nanosecond laser and picosecond laser. On one hand, nanosecond and picosecond laser products are relatively mature, and on the other hand, the femtosecond laser with shorter pulse width is expensive. However, because the pulse widths of nanosecond laser and picosecond laser are often larger than 10 picoseconds, obvious heat effect exists in the processing process, and the problems that the product quality and the qualified rate are influenced by thermal deformation, thermal cracks and the like are easily generated. Meanwhile, the long pulse width also causes the peak power of the laser pulse to be low, and the single cutting depth is small on the premise of ensuring the cutting quality.
For laser trimming, different lasers and trimming methods are selected according to trimming objects and precision requirements. In the semiconductor industry, especially in the field of mems manufacturing, since the trimming precision is required to be in the order of micrometers or micrograms, a femtosecond laser is generally used as a processing source, and a high-precision mobile platform is applied to positioning and processing devices. However, the prior art has the problem of low efficiency, namely, after each time of trimming, the trimming result needs to be observed and detected off line, and the time is consumed for secondary trimming and positioning.
Disclosure of Invention
The present invention is directed to solving, at least to some extent, one of the technical problems in the related art.
To this end, an object of the present invention is to provide a multifunctional laser precision machining apparatus.
According to the embodiment of the invention, the multifunctional laser precision machining equipment comprises:
a laser;
the beam expander is arranged right to the laser;
the attenuator is arranged right to the beam expander;
the first total reflection mirror is arranged right to the attenuator;
the second total reflection mirror is arranged right below the first total reflection mirror;
the third total reflection mirror is arranged at the positive left of the second total reflection mirror;
the rotating reflector is arranged right below the third total reflection mirror;
the fourth total reflection mirror is arranged right to the rotary reflection mirror;
the scanning galvanometer module is arranged right below the fourth total reflection mirror;
the fifth total reflection mirror is arranged right left of the scanning galvanometer module and positioned on the right side of the rotary reflecting mirror;
the first camera is arranged right above the fifth total reflection mirror;
the online detection probe is arranged right below the fifth total reflection mirror;
the sixth total reflection mirror is arranged right left of the rotary reflection mirror;
the light beam regulation and control module is arranged right below the sixth total reflection mirror;
the seventh full-reflecting mirror is arranged right to the light beam regulating and controlling module and positioned on the left side of the rotary reflecting mirror;
the second camera is arranged right above the seventh full-reflecting mirror;
the third camera is arranged right below the rotary reflector;
the displacement platform is arranged below the on-line detection probe, the seventh total reflection mirror and the third camera in a manner of moving left and right;
wherein the rotating mirror is switchable between a position to reflect the laser beam toward the fourth all-mirror and a position to reflect the laser beam toward the sixth all-mirror.
Advantageously, the multifunctional laser precision machining apparatus further comprises an optical shutter disposed between the first totally reflecting mirror and the second totally reflecting mirror.
Advantageously, the multifunctional laser precision machining equipment further comprises a power detection device, and the power detection device is arranged between the second total reflection mirror and the third total reflection mirror.
Advantageously, the first camera is a 20-fold camera.
Advantageously, the second camera is a 10 times camera.
Advantageously, the third camera is a 50 times camera.
Advantageously, the laser is a femtosecond laser, a nanosecond laser or a picosecond laser.
Additional aspects and advantages of the invention will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the invention.
Drawings
Fig. 1 is a schematic view of a multifunctional laser precision machining apparatus according to an embodiment of the present invention.
Detailed Description
Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the drawings are illustrative and intended to be illustrative of the invention and are not to be construed as limiting the invention.
A multifunctional laser precision machining apparatus according to an embodiment of the present invention will be described in detail below with reference to the accompanying drawings.
As shown in fig. 1, a multifunctional laser precision machining apparatus according to an embodiment of the present invention includes: the laser scanning device comprises a laser 101, a beam expander 102, an attenuator 103, a first total reflection mirror 104, a second total reflection mirror 105, a third total reflection mirror 106, a rotary reflection mirror 107, a fourth total reflection mirror 108, a scanning galvanometer module 109, a fifth total reflection mirror 110, a first camera 111, an online detection probe 112, a sixth total reflection mirror 113, a light beam regulation and control module 114, a seventh total reflection mirror 115, a second camera 116, a third camera 117 and a displacement platform 118.
Specifically, the laser 101 may be a femtosecond laser, a nanosecond laser, or a picosecond laser, and emits a femtosecond laser beam, a nanosecond laser beam, or a picosecond laser beam for processing.
The beam expander 102 is provided right to the laser 101, and expands and collimates the laser beam emitted from the laser.
The attenuator 103 is disposed right to the beam expander 102, and attenuates the laser beam power, i.e., controls the laser power.
The first half mirror 104 is provided right to the attenuator 103.
The second fully reflective mirror 105 is disposed directly below the first fully reflective mirror 104.
The third totally reflecting mirror 106 is arranged directly to the left of the second totally reflecting mirror 105.
The rotating mirror 107 is provided directly below the third total reflection mirror 106.
The fourth half mirror 108 is provided directly to the right of the rotating mirror 107.
The scanning galvanometer module 109 is arranged right below the fourth total reflecting mirror 108 and used for adjusting laser beam trimming parameters.
The fifth half mirror 110 is disposed right to the left of the scanning galvanometer module 109 and to the right of the rotating mirror 107.
The first camera 111 is disposed directly above the fifth all-mirror 110. Advantageously, the first camera 111 may be a 20 times camera.
The on-line detection probe 112 is disposed directly below the fifth half mirror 110.
The sixth total reflection mirror 113 is provided right to the left of the rotating mirror 107.
The light beam regulation and control module 114 is arranged right below the sixth total reflection mirror 113 and is used for regulating the cutting parameters of the laser beam.
The seventh full mirror 115 is disposed right to the beam steering module 114 and left of the rotating mirror 107.
The second camera 116 is disposed directly above the seventh fully reflective mirror 115. Advantageously, the second camera 116 may be a 10 times camera.
The third camera 117 is provided directly below the rotating mirror 107. Advantageously, the third camera 117 may be a 50 times camera.
The displacement platform 118 is arranged below the on-line detection probe 112, the seventh total reflection mirror 115 and the third camera 117 in a manner of moving left and right, so that the device can move on a two-dimensional horizontal plane.
Wherein the rotating mirror 107 is switchable between a position reflecting the laser beam towards the fourth totally reflecting mirror 108 and a position reflecting the laser beam towards the sixth totally reflecting mirror 113. In other words, the rotating mirror 107 can rotate to change the laser beam propagation direction, and the cutting/trimming function switching is realized.
According to an example of the present invention, the multifunctional laser precision machining apparatus further includes a shutter 119, and the shutter 119 is disposed between the first half mirror 104 and the second half mirror 105, and physically blocks the laser beam in the optical path to control the start and end of machining.
According to an example of the present invention, the multifunctional laser precision machining apparatus further includes a power detection device, the power detection device 120 is disposed between the second full-reflection mirror 105 and the third full-reflection mirror 106, and the power detection device 120 includes a power meter and a beam splitter, and detects the power of the laser beam in the optical path in real time.
The working process of the multifunctional laser precision machining equipment according to the embodiment of the invention comprises the following steps:
as shown in fig. 1, a laser 101 is turned on to emit a laser beam, and the beam is expanded and collimated by a beam expander 102. The attenuator 103 is used for adjusting the power of the laser beam, so that the laser beam meets the requirements of the cutting/trimming process. The laser beam is transmitted to the rotating mirror 107 via the first totally reflecting mirror 104, the second totally reflecting mirror 105, and the third totally reflecting mirror 106. The power detection device 120 detects the power of the laser beam in the processing optical path in real time.
When the rotating mirror 107 is at the default position, the laser beam enters the trimming function light path after being reflected, and then enters the scanning galvanometer module 109, so that the surface of the device is trimmed by the set trimming pattern, the scanning speed and the filling interval. And correcting and positioning the device to be trimmed by adopting the first camera 111, and observing the trimming process in real time. The on-line detection probe 112 is in real-time contact with the device to be modified, and monitors the detection quantity such as the resonant frequency of the device until the modification result meets the processing requirement. After the trimming is finished, the displacement platform 118 is moved to a position right below the third camera 117, and the surface topography of the device is observed and shot after the focal length is adjusted.
The rotating mirror 107 rotates by 90 degrees, the laser beam enters the cutting function light path after being reflected, and then enters the light beam regulation and control module 114, so that the device is cut by the set cutting path, the set moving speed and the set cutting interlayer distance. And the second camera 116 is adopted to correct and position the workpiece to be cut and observe the cutting process in real time. After cutting, the displacement platform 118 is moved to a position right below the third camera 117, and the surface topography of the device is observed and shot after the focal length is adjusted.
In the following, taking a femtosecond laser as an example, the cutting and trimming process of the device is simply introduced:
the device is fixed on the displacement platform 118, and is corrected and positioned by the second camera 116. And setting the moving path and the moving speed of the device and the moving amount of the device in the vertical direction of the horizontal plane after single-layer cutting in the cutting process.
The femtosecond laser 101 is started to emit laser beams, the average power of the laser is 20W, the pulse width is 800fs, and the repetition frequency is 100 KHz. The laser beam is expanded and collimated by the beam expander 102, and the size of a light spot is 10 mm.
The power of the laser beam is adjusted to 5W by the attenuator 103, the rotating mirror 107 is rotated by 90 degrees, the shutter 119 is closed, the laser beam is transmitted to the rotating mirror 107 through the first total reflection mirror 104, the second total reflection mirror 105 and the third total reflection mirror 106 of the total reflection mirror, and the power detection device 120 detects the laser power in the optical path in real time to ensure the stability of the power.
The laser beam is emitted into the cutting function light path through the rotating reflector 107, enters the light beam adjusting module 114, and finally reaches the position of the device to be cut. The displacement platform 118 moves at a preset cutting path and a preset moving speed, and after each single-layer cutting, the position of the beam adjusting module 114 in the vertical direction of the horizontal plane is adjusted, so that the focal position of the laser beam meets the requirement of the distance between the cutting layers. And after the device is finally cut, opening the optical shutter 119, closing the laser beam in the light path, moving the displacement platform 118 to a laser trimming station, and positioning the device through the first camera 111 without secondary correction.
In the process of setting the trimming pattern, the scanning speed and the filling interval of the device, the on-line detection probe 112 is fixed at the position to be detected of the device, and the resonant frequency of the device is detected in real time. And adjusting the pulse width of the laser to 400fs, the repetition frequency to 10KHz, adjusting the power of the laser beam to 2W by the attenuator 5, closing the optical shutter 119, and starting trimming until the trimming detection result meets the processing requirement, namely the frequency difference fluctuation range of the driving mode and the detection mode is better than 100 Hz. After the trimming is finished, the displacement platform 118 is moved to a position right below the third camera 117, and the surface topography of the device is observed and shot after the focal length is adjusted.
The cutting and trimming processes can be carried out independently or sequentially; the cutting can be carried out firstly and then the trimming can be carried out, and the trimming can be carried out firstly and then the cutting can be carried out, which is determined according to the processing requirements of the device.
In the description of the present invention, it is to be understood that the terms "central," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," "circumferential," and the like are used in the orientations and positional relationships indicated in the drawings for convenience in describing the invention and to simplify the description, and are not intended to indicate or imply that the referenced devices or elements must have a particular orientation, be constructed and operated in a particular orientation, and are therefore not to be considered limiting of the invention.
Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless specifically defined otherwise.
In the present invention, unless otherwise expressly stated or limited, the terms "mounted," "connected," "secured," and the like are to be construed broadly and can, for example, be fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.
In the present invention, unless otherwise expressly stated or limited, the first feature "on" or "under" the second feature may be directly contacting the first and second features or indirectly contacting the first and second features through an intermediate. Also, a first feature "on," "over," and "above" a second feature may be directly or diagonally above the second feature, or may simply indicate that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature may be directly under or obliquely under the first feature, or may simply mean that the first feature is at a lesser elevation than the second feature.
In the description herein, references to the description of the term "one embodiment," "some embodiments," "an example," "a specific example," or "some examples," etc., mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above are not necessarily intended to refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, various embodiments or examples and features of different embodiments or examples described in this specification can be combined and combined by one skilled in the art without contradiction.
Although the embodiments of the present invention have been shown and described, it is understood that the embodiments are illustrative and not restrictive, and that those skilled in the art may make changes, modifications, substitutions and alterations to the embodiments without departing from the scope of the present invention.
Claims (7)
1. A multifunctional laser precision machining apparatus, characterized by comprising:
a laser;
the beam expander is arranged right to the laser;
the attenuator is arranged right to the beam expander;
the first total reflection mirror is arranged right to the attenuator;
the second total reflection mirror is arranged right below the first total reflection mirror;
the third total reflection mirror is arranged at the positive left of the second total reflection mirror;
the rotating reflector is arranged right below the third total reflection mirror;
the fourth total reflection mirror is arranged right to the rotary reflection mirror;
the scanning galvanometer module is arranged right below the fourth total reflection mirror;
the fifth total reflection mirror is arranged right left of the scanning galvanometer module and positioned on the right side of the rotary reflecting mirror;
the first camera is arranged right above the fifth total reflection mirror;
the online detection probe is arranged right below the fifth total reflection mirror;
the sixth total reflection mirror is arranged right left of the rotary reflection mirror;
the light beam regulation and control module is arranged right below the sixth total reflection mirror;
the seventh full-reflecting mirror is arranged right to the light beam regulating and controlling module and positioned on the left side of the rotary reflecting mirror;
the second camera is arranged right above the seventh full-reflecting mirror;
the third camera is arranged right below the rotary reflector;
the displacement platform is arranged below the on-line detection probe, the seventh total reflection mirror and the third camera in a manner of moving left and right;
wherein the rotating mirror is switchable between a position to reflect the laser beam toward the fourth all-mirror and a position to reflect the laser beam toward the sixth all-mirror.
2. The multifunctional laser precision machining apparatus according to claim 1, further comprising an optical shutter provided between the first totally reflecting mirror and the second totally reflecting mirror.
3. The multifunctional laser precision machining apparatus according to claim 1, further comprising a power detection device provided between the second totally reflecting mirror and the third totally reflecting mirror.
4. The multifunctional laser precision machining apparatus according to any one of claims 1 to 3, wherein the first camera is a 20-fold camera.
5. The multifunctional laser precision machining apparatus according to any one of claims 1 to 3, wherein the second camera is a 10-fold camera.
6. The multifunctional laser precision machining apparatus according to any one of claims 1 to 3, wherein the third camera is a 50-fold camera.
7. The multifunctional laser precision machining apparatus according to any one of claims 1 to 3, characterized in that the laser is a femtosecond laser, a nanosecond laser, or a picosecond laser.
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| CN110893519A (en) * | 2019-12-26 | 2020-03-20 | 深圳中科光子科技有限公司 | Double-light-source four-station laser processing equipment and processing method |
| CN113523543B (en) * | 2021-07-27 | 2023-04-25 | 北京航空航天大学 | Additive metal implant functional surface laser preparation system based on-line monitoring |
| CN114273782A (en) * | 2021-10-11 | 2022-04-05 | 重庆大学 | Laser-abrasive belt cooperative processing device and method based on incident light source transformation |
| CN114185121A (en) * | 2021-11-24 | 2022-03-15 | 四川橙科通信技术研究院有限责任公司 | Double-station femtosecond laser system for efficiently manufacturing grating |
| CN114035320A (en) * | 2022-01-10 | 2022-02-11 | 中国人民解放军63921部队 | Common-caliber wide-spectrum imaging system |
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| CN108747000A (en) | 2018-11-06 |
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