TW201920021A - Cutting device for glass substrate, cutting method, program, and storage medium - Google Patents

Abstract

Provided is a device that cuts a glass substrate by projecting light, and projects the light efficiently onto a location on the glass substrate where a cut line is to be formed. A cutting device 100 for a glass substrate G is provided with a light projecting device 1 and a light scanning device 3. The light projecting device 1 outputs cutting light L that cuts the glass substrate G. The light scanning device 3 moves a spot S of the cutting light L back and forth along the cutting direction of the glass substrate G. The light scanning device 3 limits the range in which the spot S of the cutting light L moves back and forth to a non-cut region, which is a region of the glass substrate G where no cut line C crack has been formed yet.

Description

Cutting device for glass substrate

The present invention relates to a cutting device for a glass substrate.

A cutting device is known that generates a cutting line by scanning laser light in a cutting direction of a glass substrate and cuts the glass substrate with respect to the cutting line (for example, Patent Document 1). With this device, it is possible to cut a relatively large glass substrate at a relatively high speed. [Prior Art Literature] [Patent Literature]

[Patent Document 1] Japanese Unexamined Patent Publication No. 4-224091

[Problems to be solved by the invention]

In the above device, when the glass substrate is cut, only the laser light is reciprocated on the glass substrate, and no other control related to the laser light irradiated onto the glass substrate is performed. For example, in the above-mentioned device, the scanning range of the laser light on the glass substrate does not change whether or not a cutting line is formed on the glass substrate. As a result, the laser light is continuously irradiated wastefully even at a portion where a cutting line has been formed even if sufficient laser light is irradiated.

An object of the present invention is to efficiently irradiate light to a portion where a cutting line of a glass substrate is to be formed in a device for cutting a glass substrate by irradiating light. [Technical means to solve the problem]

Hereinafter, a plurality of aspects will be described as a means for solving the problem. These aspects can be arbitrarily combined as required. A cutting device for a glass substrate according to an aspect of the present invention includes a light generating device and a light scanning device. The light generating device outputs cut light that cuts the glass substrate. The light scanning device is a device that reciprocates the light spot of the cut light in the cut direction of the glass substrate. The light scanning device limits the reciprocating range of the light spot of the cut light to the uncut area where the cut line of the glass substrate is not formed.

In the above-mentioned glass substrate cutting device, the light scanning device restricts the range of the reciprocating movement of the light spot of the cutting light for cutting the glass substrate on the glass substrate to the uncut portion where the cutting line of the glass substrate is not formed. Off zone. Thereby, the cutting light can be irradiated only to the area where the cutting line of the glass substrate should be formed. As a result, it is possible to efficiently irradiate the cutting light generated from the light generating device to the area where the cutting line of the glass substrate should be formed without wasting the energy of the cutting light.

The glass substrate cutting device may further include a lens device. The lens device adjusts the size of the light spot of the cut light on the glass substrate. Thereby, it is possible to efficiently irradiate the cutting light having the optimum energy density capable of efficiently forming the cutting line toward the region where the cutting line of the glass substrate should be formed.

The lens device can also change the size of the light spot of the cut light on the glass substrate according to the length of the uncut area in the cut direction. Thereby, it is possible to efficiently irradiate the cutting light having the optimum energy density capable of efficiently forming the cutting line toward the region where the cutting line of the glass substrate should be formed.

The lens device can increase the size of the light spot of the cutting light as the length of the uncut area becomes shorter in the cutting direction, thereby suppressing the cutting light from moving toward the cutting direction with an excessive energy density. Irradiate the uncut area with a shortened length.

The glass substrate cutting device may further include a light correction device. The light correction device moves the light spot of the cut light in a correction direction perpendicular to the cut direction. Thereby, by moving the light spot of the cutting light away from the cutting direction toward the correction direction, the light spot of the cutting light can be reciprocated in the appropriate cutting direction. [Effect of the invention]

It is possible to efficiently irradiate the cutting light generated from the light generating device to the area where the cutting line of the glass substrate should be formed without wasting the energy of the cutting light.

1. First Embodiment (1) Cutting device The overall configuration of a cutting device 100 for a glass substrate G according to an embodiment of the present invention will be described below with reference to FIG. 1. Fig. 1 is a plan view of a cutting device according to a first embodiment. The cutting device 100 irradiates light having a specific spot size in the cutting direction of the glass substrate G (hereinafter referred to as cutting light L), and forms a cutting line C on the glass substrate G in the cutting direction. Cracked device. The glass substrate G is cut by the crack of the cutting line C.

Examples of the glass substrate G include soda glass and alkali-free glass used in displays and instrument panels, but the type is not limited to this. The glass substrate G is transferred by the substrate transfer device 10 while being cut by the cutting device 100. Therefore, when the cutting device 100 of this embodiment cuts the glass substrate G, it moves in the same direction as the conveyance direction of the glass substrate G, and moves at the same speed as the conveyance speed of the glass substrate G. The conveyance direction of the glass substrate G is, for example, the negative direction of the y-axis in FIG. 1 (the direction below the paper surface in FIG. 1).

In this embodiment, the cutting direction of the glass substrate G is a direction parallel to the x-axis direction as shown in FIG. 1. That is, the cutting device 100 according to this embodiment is applied to, for example, cross-cutting (cutting in the width direction of the glass substrate G) of the glass substrate G manufactured by downflow.

The cutting device 100 includes a light generating device 1, a light scanning device 3, a lens device 5, and a light correction device 7, and the light generation device 1 is irradiated onto the glass substrate G through the lens device 5, the light scanning device 3, and the light correction device 7. The generated cutting light L forms a light spot S of the cutting light L on the surface of the glass substrate G, and moves the light spot S of the cutting light L in the cutting direction of the glass substrate G.

The cutting device 100 includes a light generating device 1. The light generating device 1 is a device that generates the above-mentioned cut-off light L. As the light generating device 1, for example, a light source capable of outputting the cutting light L having a degree of energy capable of forming a crack on the glass substrate G that can cut the cutting line C of the glass substrate G can be used. Examples of such a light source include a CO ₂ laser oscillator.

The cutting device 100 includes a light scanning device 3. The light scanning device 3 reciprocates the light spot S of the cut light L output from the light generating device 1 in the cut direction. The light scanning device 3 of this embodiment is a device having a reflecting mirror that reflects the cut-off light L, and a rotating mechanism that rotates the reflecting mirror about the z-axis. The rotation mechanism is, for example, a motor having an output rotation shaft connected to an axis extending from the mirror in the z-axis direction. An example of such a device is a galvanometer scanner.

The above-mentioned light scanning device 3 is provided on the light path that cuts off the light L. Therefore, as shown in FIG. 1, the cut light L is reflected by the mirror of the light scanning device 3. The light scanning device 3 can change the incident angle of the cut light L toward the mirror by rotating the above-mentioned mirror around the z-axis (that is, the reflection angle of the cut light at the mirror), and can be determined by the incident angle. A position on the glass substrate G irradiates a light spot S of the cut light L.

Specifically, for example, as shown in FIG. 2A, if the mirror of the light scanning device 3 is rotated right around the z-axis, the incident angle of the cut light L toward the mirror (that is, the cut light L is at the The reflection angle of the mirror is increased. Thereby, the cut-off light L is made incident on the negative direction of the x-axis of the mirror of the light correction device 7 (the left direction of the paper surface in FIG. 2A).

When the cut-off light L is incident toward the negative direction side of the x-axis of the mirror of the light correction device, the cut-off light L is reflected by the mirror toward the negative direction side of the x-axis as shown in FIG. 2A. As a result, the light spot S of the cut light L reaches the negative direction side of the x-axis on the glass substrate G. FIG. 2A is a diagram showing an example of a moving method of cutting light of the light scanning device.

On the other hand, as shown in FIG. 2B, if the mirror of the light scanning device 3 is rotated left about the z-axis, the incident angle of the cut light L toward the mirror becomes small. Thereby, the cut-off light L is incident toward the positive direction of the x-axis of the mirror of the light correction device 7 (the right direction of the paper surface in FIG. 2A).

The cut-off light L is incident on the x-axis positive direction side of the mirror of the light correction device, and the cut-off light L is reflected by the mirror toward the x-axis positive direction side as shown in FIG. 2B. As a result, the light spot S of the cut light L reaches the positive direction side of the x-axis on the glass substrate G. FIG. 2B is a diagram showing another example of a moving method of cutting light of the light scanning device.

By using the above-mentioned principle, by rotating the mirror of the optical scanning device 3 right and left at a high speed within a specific angle range around the z-axis, the light spot S of the cut light L can be on the glass substrate G. The reciprocating trajectory (Fig. 1) of the cutting light along the cutting direction reciprocates at high speed.

The cutting device 100 includes a lens device 5. The lens device 5 is a device that adjusts the focal position of the cut light L on the glass substrate G side, and forms a light spot S of the cut light L on the glass substrate G. Specifically, the lens device 5 includes a first lens 51 and a second lens 53.

The first lens 51 is a lens that enlarges the diameter of the cut light L output from the light generating device 1. As shown in FIG. 1, the light generating device 1 of this embodiment outputs cut-off light L in the x-axis direction. Therefore, the first lens 51 can move in the x-axis direction in which the cut-off light L is transmitted. The first lens 51 is, for example, a diverging lens. The second lens 53 is the cut light L incident through the first lens 51 and focuses the focal point of the cut light L at a specific position on the optical path opposite to the first lens 51.

The lens device 5 having the first lens 51 and the second lens 53 described above specifically changes the position of the first lens 51 in the x-axis direction, and causes the cut light L focused by the first lens 51 to change. The focus position is changed, thereby changing the focus position of the cut light L located on the opposite side from the second lens 53 and the first lens 51.

For example, in FIG. 1, the first lens 51 is moved in the negative direction of the x-axis to bring the first lens 51 closer to the second lens 53, so that the focal position of the cut light L focused by the first lens 51 is closer to the second The lens 53 can thereby focus the focal point of the cut-off light L on a position farther away from the optical path than the second lens 53 and the first lens 51.

On the other hand, the first lens 51 is moved in the positive direction of the x-axis to move the first lens 51 away from the second lens 53 so that the focal position of the cut light L focused by the first lens 51 is far away from the second lens 53. Thereby, the focal point of the cut-off light L can be focused at a position closer to the optical path on the opposite side from the second lens 53 and the first lens 51.

As shown in FIG. 3, for example, the optical path length of the cutting light L in the x-axis direction from the lens device 5 to the surface of the glass substrate G is toward the glass substrate G in the z-axis direction (height direction) from the optical scanning device 3. When the vertical line is drawn, the intersection of the vertical line and the glass substrate G is the smallest at the position in the x-axis direction. The closer to the end of the glass substrate G in the x-axis direction, the longer the optical path length of the cut light L in the x-axis direction. FIG. 3 is a diagram schematically showing a change in the optical path length of the cut light L in the x-axis direction, and the light correction device 7 is omitted for convenience of explanation.

As a result, for example, if the focal position of the cutting light L is adjusted so that the size of the light spot S of the cutting light L on the surface of the glass substrate G is optimal when the optical path length is minimized, When L reaches other positions on the glass substrate G, the focal position is not the position where the light spot S of the optimal size is formed at the other positions on the glass substrate G.

Therefore, in this embodiment, the controller 9 (to be described later) adjusts the focal position of the cut light L by moving the first lens 51 in accordance with the position of the light spot S of the cut light L on the glass substrate G. Thereby, regardless of the position of the light spot S of the cut light L on the glass substrate G, the size of the light spot S of the cut light L on the glass substrate G can always be set to the optimum.

The cutting device 100 includes a light correction device 7. The light correction device 7 is a device having a reflecting mirror for reflecting the cut light L, and a rotating mechanism for rotating the reflecting mirror about the x-axis. The above-mentioned rotating mechanism is, for example, a motor having an output rotating shaft connected to an axis extending from the mirror in the x-axis direction. As such a device, for example, a galvanometer scanner can be used.

As shown in FIG. 1, the light correction device 7 is arranged in the x-axis direction at the same position as the arrangement position in the x-axis direction of the light scanning device 3. Moreover, it is arrange | positioned in the z-axis direction (height direction) at substantially the same position as the optical scanning device 3. On the other hand, it is arranged at a predetermined distance from the optical scanning device 3 in the y-axis direction. As shown in FIG. 4, the mirror of the light correction device 7 is inclined at a specific angle so that the normal of the reflection surface faces the negative direction (downward direction) of the z-axis direction. Fig. 4 is a side view when the cutting device is viewed from the x-axis direction.

The light correction device 7 configured in this way reflects the cut light L incident from the light scanning device 3 by a reflector, and causes the light spot S of the cut light L to reach the glass substrate G.

The mirror of the light correction device 7 is rotatable around the x-axis. Therefore, by changing the rotation angle of the mirror about the x-axis, the light correction device 7 can move the light spot S of the cut light L in the y-axis direction. In this embodiment, the y-axis direction is perpendicular to the x-axis direction, which is the cutting direction of the glass substrate G. Hereinafter, the y-axis direction of this embodiment is referred to as a "correction direction".

Specifically, for example, when the rotation angle of the mirror of the light correction device 7 is changed from the angle shown in FIG. 4 to the right, as shown in FIG. 5A, the incident angle of the cut light L toward the mirror is changed. Big. As a result, the light spot S of the cut-off light L moves from the position shown in FIG. 4 to the negative direction of the y-axis (the left direction of the paper surface in FIG. 5A). FIG. 5A is a diagram showing an example of the movement of cut-off light by the light correction device.

On the other hand, when the rotation angle of the mirror of the light correction device 7 is changed from the angle shown in FIG. 4 to the left, as shown in FIG. 5B, the incident angle of the cut light L toward the mirror becomes smaller. As a result, the light spot S of the cut light L moves from the position shown in FIG. 4 toward the positive direction of the y-axis (the right direction on the paper surface in FIG. 5B). FIG. 5B is a diagram showing another example of the movement of the cut-off light by the light correction device.

The cutting device 100 includes a controller 9. The controller 9 has a processor (for example, a CPU), a memory device (for example, ROM, RAM, HDD, SSD, etc.), and various interfaces (for example, A / D converter, D / A converter, communication interface, etc.) Computer system. The controller 9 performs various control operations by executing programs stored in the memory (corresponding to a part or all of the memory area of the memory device).

The controller 9 may be constituted by a single processor, or may be constituted by a plurality of processors that are independent for each control.

The controller 9 can control the light generating device 1, the light scanning device 3, the first lens 51 of the lens device 5, and the light correction device 7. The controller 9 may also control the movement of the substrate transfer device 10 and the cutting device 100.

Although not shown, a sensor and a switch for detecting the status of each device, and an information input device are connected to the controller 9. Also, although not shown, a sensor and / or a camera may be connected to the controller 9 to detect the crack length of the cutting line C formed on the glass substrate G.

With the above-mentioned configuration, the cutting device 100 can move the light point S of the cutting light L generated from the light generating device 1 in three directions of the x-axis, the y-axis, and the z-axis. That is, the cutting device 100 can reach the desired position on the glass substrate G with a desired size of the light spot S of the cutting light L that forms a crack on the cutting line C on the glass substrate G.

(2) Operation of the cutting device The operation of the cutting device 100 when cutting the glass substrate G transferred by the substrate transfer device 10 will be described below. First, at the end of the cutting direction (x-axis direction) of the glass substrate G, a crack called "initial crack", which is formed by the cutting light L and forms the cutting start point of the glass substrate G, is formed. This initial crack is physically formed using a cutter such as a diamond cutter or a ceramic cutter.

In addition, the initial crack can also be formed by concentratingly irradiating the light spot S of the cutting light L having an increased energy density toward the initial crack side of the end in the cutting direction of the glass substrate G to be formed. Specifically, for example, the controller 9 adjusts the position of the first lens 51 so that the cutting light L is focused near the end of the glass substrate G before the crack of the formal cutting line C is formed, and thereafter, The light scanning device 3 is controlled so that the light spot S of the cut light L reciprocates within a narrow range in the x-axis direction near the end portion of the glass substrate G, or stops at the end portion of the glass substrate G.

After the initial crack is formed at the end of the glass substrate G, the light spot of the cutting light L is moved from the end where the initial crack is formed to a reciprocating trajectory parallel to the cutting direction (x-axis direction) to The opposite end portion reciprocates to heat the glass substrate G, which causes thermal stress on the glass substrate G to cause cracks to extend from the initial cracks, and forms cracks on the glass substrate G at the cutting line C.

When the light spot S of the cutting light L is reciprocated in the cutting direction, as the crack of the cutting line C is formed, the light of the cutting light L is reduced within a range where the crack of the cutting line C is not formed. Range of reciprocating movement of point S. The range of the reciprocating movement of the light point S of the cutting light L can be determined by detecting the range of the crack that has formed the cutting line C. The extension speed of the crack of the cutting line C can also be measured in advance in the experiment. Based on this measurement As a result, the cutting device 100 is operated by gradually reducing the reciprocating range of the light spot S of the cutting light L.

Specifically, the controller 9 grasps the length of the crack of the cutting line C currently formed on the glass substrate G. The length of the crack of the cutting line C can be grasped in the following manner. For example, after the glass substrate G in the process of forming the crack of the cutting line C is captured by a camera or the like, the cutting is identified by image recognition or the like. The crack of the line C is measured, and the length of the crack of the cut line C is measured by image processing or the like.

In other embodiments, the controller 9 may use, for example, a light sensor based on the intensity of the light passing through the crack (the portion where the glass substrate G does not exist) passing through the cutting line C and the intensity of the light passing through the glass substrate G. Different, but grasp the length of the crack of the cutting line C.

In another embodiment, for example, the formation process of the cutting line C of the cutting device 100 can be grasped in advance by simulation or experiments in advance, and the elapsed time and cutting time from the start of the formation of the crack of the cutting line C can be calculated. The relationship between the cracks of the line C (the spreading speed of the cracks) is determined by the controller 9 based on the elapsed time since the light point S that started to cut off the light L reciprocates (ie, the spreading speed of the cracks) Calculate the length of the cracks in the cutting line C formed.

After grasping the current length of the crack of the formed cutting line C, the controller 9 determines a range in which the light point S of the cutting light L reciprocates on the reciprocating trajectory. The controller 9 determines the x-axis coordinate value from the end portion of the glass substrate G on which the initial crack side is not formed to the x-axis coordinate value of the end portion where the cut line C has been formed as the cut light L The range in which the light spot S reciprocates in the cutting direction (x-axis direction). That is, the controller 9 uses the range of the reciprocating movement of the light spot S of the cut light L as a range of the glass substrate G where the cut line C is not formed (referred to as an uncut area).

The x-coordinate value of the cracked end of the formed cutting line C can be, for example, the x-coordinate value of the initial cracked side forming the glass substrate G and the current length of the cracked cut line C calculated above. The difference is calculated.

In other embodiments, the range in which the light spot S of the cutting light L is reciprocated may be overlapped with a part of the crack of the cutting line C that has been formed. That is, the controller 9 can make the range of the light spot S of the cut light L reciprocating slightly wider than the length of the uncut area in the x-axis direction. Thereby, the cutting light L can be reliably irradiated to the uncut area where the crack of the cutting line C is not formed.

After calculating the x-coordinate values at both ends of the range where the light point S of the cut-off light L is reciprocated, the controller 9 calculates the rotation angle range of the mirror of the optical scanning device 3 according to the x-coordinate values at the two ends, and The optical scanning device 3 outputs a control signal that rotates the mirror forward and backward within the rotation angle range. Thereby, the light spot S of the cutting light L is reciprocated in the cutting direction in the uncut area.

Repeatedly grasp the length of the crack of the cutting line C, determine the reciprocating range of the light point S of the cutting light L, and change the reciprocating range of the light point S of the cutting light L until the turtle of the cutting line C The crack is spread over substantially the entire area of the glass substrate G in the x-axis direction (width direction).

Thereby, as shown in (1) to (4) of FIG. 6, as the crack of the cutting line C is formed, the controller 9 can change the reciprocating range of the light point S of the cutting light L from L1 toward L4 (L1> L2> L3> L4) is reduced. That is, the reciprocating range of the cutting light L on the glass substrate G can be limited to only the uncut area. As a result, it is possible to efficiently irradiate the cutting light L generated from the light generating device 1 to a region where the crack of the cutting line C of the glass substrate G should be formed without wasting the energy of the cutting light L. FIG. 6 is a diagram schematically showing a method of irradiating cutting light to a glass substrate of the cutting device according to the first embodiment.

In this embodiment, the controller 9 causes the mirror of the light scanning device 3 to rotate at a constant rotation speed, so that the light spot S of the cut light L is reciprocated at a constant speed on the glass substrate G. Therefore, by reducing the reciprocating range of the light spot S of the cutting light L as the crack of the cutting line C is formed, the specific position of the light spot S of the cutting light L in the uncut area can be increased. The frequency of passage. That is, the narrower the uncut region, the higher the energy density L can be irradiated to the surface of the glass substrate G with the cutting light.

The narrower the uncut region, the higher the energy density can be irradiated with the cutting light L toward the surface of the glass substrate G. Therefore, the cutting device 100 of this embodiment can realize the elapsed time after the cutting of the glass substrate G is started. The longer the crack propagation speed of the cutting line C is increased. As a result, the glass substrate G can be cut in a shorter time as compared with the case where the cutting light is irradiated to the entire area in the width direction of the glass substrate even if a crack of the cutting line C is formed.

However, when the cutting light L is irradiated with an excessive energy density toward the uncut area, the glass substrate G may be damaged unintentionally due to the excessive energy. Therefore, in the cutting device 100 of the present embodiment, the controller 9 makes the size of the light spot S of the cutting light L on the glass substrate G according to the length of the uncut area in the cutting direction (x-axis direction). The changed manner moves the first lens 51.

Specifically, as shown in (1) to (4) of FIG. 6, the controller 9 makes the size of the light spot S of the cut-off light L constant regardless of the position of the light spot S in the x-axis direction. And adjust the first lens in such a way that the length of the uncut area in the cutting direction becomes shorter from L1 to L4, and the size of the light spot S of the cutting light L increases from S1 to S4 (S1 <S2 <S3 <S4) 51 的 位置。 51 position. This prevents the cutting light L from being irradiated to the uncut area where the length of the cutting direction becomes short with an excessive energy density, and prevents the glass substrate G from being damaged unintentionally.

2. Second Embodiment In the light correction device 7 included in the cutting device 100 according to the first embodiment described above, in the step of cutting the glass substrate G, only the light spot S of the cutting light L reaches the glass substrate G. surface. However, as described in the first embodiment, the light correction device 7 may move the light spot S of the cutting light L in the y-axis direction perpendicular to the direction (cutting direction) in which the cracks on the cutting line C are formed.

In the cutting device 100, when the mirror of the light scanning device 3 is rotated forward and backward in a specific angle range, and / or the position of the first lens 51 is adjusted, the light spot S of the cutting light L is on the glass substrate G. When reciprocating in the cutting direction, the light spot S of the cutting light L may deviate from the original reciprocating trajectory as shown in FIG. 7. Specifically, the reciprocating trajectory of the light point S of the cut-off light L is shifted from the original reciprocating trajectory in the y-axis direction. FIG. 7 is a diagram showing an example of the trajectory of the light spot S of the cut light on the glass substrate which deviates from the original reciprocating trajectory.

The reason for the deviation of the trajectory is the installation conditions and structural errors of the light scanning device 3 and / or the lens device 5, which are eliminated or difficult only by adjusting the light scanning device 3 and / or the lens device 5, or It takes more time to adjust.

Therefore, in the second embodiment, in the cutting step of the glass substrate G by the controller 9, based on the offset amount of the actual trajectory when the original reciprocating trajectory and the light spot S of the cutting light L are reciprocated, The light spot S of the cut-off light L is moved in the correction direction, and the above-mentioned offset of the trajectory is corrected.

Specifically, the deviation of the locus of the light spot S of the cut-off light L is corrected as follows. First, for example, after the angle of the mirror of the light correction device 7 is fixed, the mirror of the light scanning device 3 is rotated forward and backward within a specific angle range, and the position of the first lens 51 is adjusted to cut off the light L. The light spot S actually moves back and forth in the cutting direction to grasp the offset between the trajectory when the cutting light L does not move in the y-axis direction and the original reciprocating movement trajectory.

As described above, after grasping the shift amount of the light point S of the cutting light L in the y-axis direction, the x-coordinate value of the light point S of the cutting light L and the light point of the cutting light L of each x-coordinate value are determined. The relationship of the shift amount of S in the y-axis direction is calculated in advance as a function of the x-coordinate value, for example.

After calculating the above-mentioned relationship, the controller 9 uses the function of the current x-coordinate of the light point S of the cutting light L and the above-mentioned function to calculate the current position during the reciprocating movement of the cutting light L in order to cut the glass substrate G. The amount of shift in the y-axis direction of the light spot S of the cut light L at the x-coordinate value.

Thereafter, the controller 9 causes the light spot S of the cut light L to reciprocate while rotating the mirror of the light correction device 7 by an angle corresponding to the calculated offset in the y-axis direction, so that The light spot S of the cutting light L is moved in the y-axis direction, and the light spot S of the cutting light L can be reciprocated on the original reciprocating trajectory as shown in FIG. 8. FIG. 8 is a diagram schematically showing an example of a method of correcting the reciprocating trajectory of cut-off light.

As described above, in the second embodiment, the trajectory of the light spot S of the cut-off light L due to the installation conditions and structural errors of the optical scanning device 3 and / or the lens device 5 can be corrected in the y-axis direction. Of the offset. As a result, without adjusting the optical scanning device 3 and / or the lens device 5, the light spot S of the cut light L can be reciprocated in a proper cutting direction.

3. Common aspects of the embodiments The above-mentioned first and second embodiments have the following structures and functions in common. The cutting device 100 (an example of a cutting device) of the glass substrate G (an example of a glass substrate) of the first and second embodiments includes a light generating device 1 (an example of a light generating device) and a light scanning device 3 ( An example of an optical scanning device). The light generating device 1 outputs cut light L (an example of cut light) that cuts the glass substrate G. The optical scanning device 3 is a device that reciprocates the light spot S of the cut light L (an example of the light spot of the cut light) in the cutting direction of the glass substrate G. The optical scanning device 3 limits the range of the reciprocating movement of the light spot S of the cut light L to an uncut area where a crack (a example of the cut line C) of the cut line C of the glass substrate G is not formed.

In the cutting device 100, the light scanning device 3 limits the range of the reciprocating movement of the light spot S of the cutting light L on the glass substrate G to the cutting line C of the glass substrate G to the turtle of the cutting line C of the glass substrate G. Uncut areas that are not formed. Thereby, the cutting light L can be irradiated only to the area where the crack of the cutting line C of the glass substrate G should be formed. As a result, the cutting light L generated from the light generating device 1 can be efficiently irradiated to a region where the crack of the cutting line C of the glass substrate G should be formed without wasting the energy of the cutting light L.

4. Other Embodiments A plurality of embodiments of the present invention have been described above, but the present invention is not limited to the above embodiments, and various changes can be made without departing from the gist of the invention. In particular, a plurality of embodiments and modifications described in this specification can be arbitrarily combined as required. (A) If the lens device 5 can change the focal position of the cut-off light L, it can also be comprised by one lens. As the lens that can change the focal position (focus distance) of light as described above, for example, an electronic focus variable lens whose focal distance can be changed by changing the curvature of the lens by an electric signal or the like can be used.

(B) In the first and second embodiments described above, in addition to the glass substrate G being moved in the y-axis direction by the substrate transfer device 10, the cutting device 100 is also moved in the y-axis direction. However, it is not limited to this. For example, when the glass substrate G can be cut by irradiation with the cutting light L for a short time (for example, when the width dimension of the glass substrate G is small and the glass substrate G has a slower conveying speed) Etc.), the light correction device 7 may move the light spot S of the cut light L in the y-peripheral direction as the glass substrate G is conveyed in the y-axis direction. This eliminates the need to move the cutting device 100 in the y-axis direction. [Industrial availability]

The invention can be widely applied to a cutting device for a glass substrate.

1‧‧‧light generating device

3‧‧‧ light scanning device

5‧‧‧ lens device

7‧‧‧ light correction device

9‧‧‧ Controller

10‧‧‧ transport device

51‧‧‧1st lens

53‧‧‧ 2nd lens

100‧‧‧ cutting device

C‧‧‧cut line

G‧‧‧ glass substrate

L‧‧‧ Cut off light

L1 ~ L4‧‧‧‧Reciprocating range

S‧‧‧light spot

S1 ~ S4‧‧‧ Light spot size

Fig. 1 is a plan view of a cutting device according to a first embodiment. FIG. 2A is a diagram showing an example of a moving method of cutting light of the light scanning device. FIG. 2B is a diagram showing another example of a moving method of cutting light of the light scanning device. FIG. 3 is a diagram schematically showing a state in which the optical path length of the cut light L in the x-axis direction is changed. Fig. 4 is a side view when the cutting device is viewed from the x-axis direction. FIG. 5A is a diagram showing an example of the movement of cut-off light by the light correction device. FIG. 5B is a diagram showing another example of the movement of the cut-off light by the light correction device. FIGS. 6 (1) to 6 (4) are diagrams schematically showing a method of irradiating cutting light to a glass substrate in the cutting device of the first embodiment. FIG. 7 is a diagram showing an example of the trajectory of the cut light on the glass substrate which deviates from the original reciprocating trajectory. FIG. 8 is a diagram schematically showing an example of a method of correcting the reciprocating trajectory of cut-off light.

Claims (6)

A cutting device for a glass substrate includes: a light generating device that outputs cutting light that cuts the glass substrate; and a light scanning device that reciprocates the light spot of the cutting light in the cutting direction of the glass substrate The moving device limits the range of the reciprocating movement of the light spot of the cutting light to an uncut area where the cutting line of the glass substrate is not formed. For example, the cutting device for a glass substrate according to claim 1, further comprising a lens device for adjusting the size of the light spot of the cutting light on the glass substrate. The cutting device of the glass substrate according to claim 2, wherein the lens device changes the size of the light spot of the cutting light on the glass substrate according to the length of the uncut area in the cutting direction. The cutting device of the glass substrate according to claim 2, wherein the lens device increases the size of the light spot of the cutting light as the length of the uncut area in the cutting direction becomes shorter. The cutting device of the glass substrate according to claim 3, wherein the lens device increases the size of the light spot of the cutting light as the length of the uncut area in the cutting direction becomes shorter. The cutting device for a glass substrate according to any one of claims 1 to 5, further comprising a light correction device for moving a light point of the cutting light in a correction direction perpendicular to the cutting direction.