KR101459386B1 - System for test handler and method therefor - Google Patents

System for test handler and method therefor Download PDF

Info

Publication number
KR101459386B1
KR101459386B1 KR1020130058175A KR20130058175A KR101459386B1 KR 101459386 B1 KR101459386 B1 KR 101459386B1 KR 1020130058175 A KR1020130058175 A KR 1020130058175A KR 20130058175 A KR20130058175 A KR 20130058175A KR 101459386 B1 KR101459386 B1 KR 101459386B1
Authority
KR
South Korea
Prior art keywords
blade
module
blades
test
evaluation
Prior art date
Application number
KR1020130058175A
Other languages
Korean (ko)
Inventor
신희성
Original Assignee
(주)에이젯
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by (주)에이젯 filed Critical (주)에이젯
Priority to KR1020130058175A priority Critical patent/KR101459386B1/en
Application granted granted Critical
Publication of KR101459386B1 publication Critical patent/KR101459386B1/en

Links

Images

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26—Testing of individual semiconductor devices
    • G01R31/2601—Apparatus or methods therefor
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
    • G01R31/2865—Holding devices, e.g. chucks; Handlers or transport devices
    • G01R31/2867—Handlers or transport devices, e.g. loaders, carriers, trays
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0433—Sockets for IC's or transistors
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks

Abstract

The present invention relates to a test handler system and, especially, to a test handler system which turns off a blade of a test handler by checking a defective state of the blade which supplies a semiconductor according to a test result of a semiconductor device inserted into a socket, and a method thereof. The present invention relates to a test handler system comprising: a plurality of test sockets, wherein a test of the semiconductor is executed; a front blade module having a plurality of blades for loading/unloading the semiconductor device by corresponding to each test socket; and a back blade module. The test handler system comprises: a test result input unit which receives test result data of the semiconductor device inserted into each socket by the front blade module and the back blade module; and a control unit which produces the test result data received from the test result input unit by accumulating a defective determination rate, yield, and defective determination times of the semiconductor device by each blade and turns off the blade which is beyond a predetermined acceptable level.

Description

{System for test handler and method therefor}

The present invention relates to a test handler system, and more particularly, to a test handler system and method for checking a bad state of a blade supplying a semiconductor according to a test result of a semiconductor device put in a socket, thereby turning off the blades of the test handler.

There have been many applications and disclosures in addition to Korean Unexamined Patent Publication No. 2004-0089897, 'Electrical inspection method of semiconductor devices for real-time determination of socket abnormality' and the like.

The prior art includes loading a DUT with a tester and a handler to the inspection site of a handler connected through a DUT board; Performing an electrical inspection of the DUT by operation of the tester; Collecting electrical inspection results for individual sockets of the DUT board in the tester; Storing electrical test results of individual sockets of the collected DUT boards in a storage means in the tester and accumulating them; Transmitting a part of electrical inspection results of individual sockets of the collected DUT board to a handler and processing the DUT according to an electrical inspection result received from the handler; Comparing electrical test results of individual sockets of the DUT board accumulated in the tester storage means with a reference value capable of judging whether the socket is abnormal; Determining whether the DUT board can be used for individual sockets according to the comparison; And suspending the use of a bad socket in the DUT board by transmitting the judgment result to a handler.

In general, a semiconductor test handler is used to insert a material (semiconductor element) to be inspected into a test socket by a blade, and the test is performed under pressure.

At this time, there is a problem that the normal test can not proceed due to the defects of the blades and the pressure instability. However, conventionally, the test result only determines whether or not the socket is used, So that even if the material is loaded into the normal blade, there is a problem that the socket is turned off and the performance is deteriorated or the test delay time is generated.

SUMMARY OF THE INVENTION An object of the present invention is to provide a test handler system having a blade-off function that reduces a predicted defective rate by not identifying a defective state of a blade supplying a semiconductor and supplying a semiconductor to a socket, Method.

The present invention also provides a test handler system having a blade off function for preventing a crack of a material in advance and a method thereof.

The present invention relates to a test handler system including a plurality of test sockets for testing semiconductor devices and a front blade module and a back blade module having a plurality of blades for loading / unloading semiconductor devices corresponding to respective test sockets Test result input means for receiving test result data of the semiconductor elements inserted into each socket for each of the front blade module and the back blade module; And a control means for cumulatively calculating a defect determination rate, a yield rate, and a failure determination frequency for each semiconductor device by the test result data received through the test result input means, and turning off the corresponding blade out of a predetermined allowable range .

On the other hand, a test handler method including a plurality of test sockets for testing semiconductor devices and a front blade module and a back blade module having a plurality of blades for loading / unloading semiconductor devices corresponding to respective test sockets, (a) receiving test result data of a semiconductor device inserted into each socket for each of the front blade module and the back blade module; (b) accumulating the test result data by accumulating raw data including failure rate, yield, and failure determination frequency for each semiconductor device for each blade of the front blade module and the back blade module; And (c) comparing raw data calculated for each of the blades, thereby turning off the blades that fall outside a predetermined allowable range.

As described above, according to the present invention, it is possible to detect a normal blade and an abnormal blade so that the normal blade continuously supplies the material, and the abnormal blade can be bladed off so as not to supply the material.

1 is a configuration diagram of a test handler system according to a first embodiment of the present invention,
2 is a configuration diagram of a test handler system according to a second embodiment of the present invention,
3 is a flowchart of a test handler method according to the first embodiment of the present invention,
4 is a flowchart of a test handler method according to a second embodiment of the present invention,
FIG. 5 is a flowchart of the relative evaluation of the test handler method according to the present invention,
6 is a flow chart of the absolute evaluation of the test handler method according to the present invention,
7 is a sequential evaluation flowchart of a test handler method according to the present invention.

Hereinafter, the present invention will be described in detail with reference to exemplary drawings attached hereto.

1 is a configuration diagram of a test handler system according to the present invention.

As shown in Fig. 1, the semiconductor device includes a plurality of test sockets for testing semiconductor devices, and a front blade module and a back blade module having a plurality of blades for loading / unloading semiconductor devices corresponding to respective test sockets In the test handler system, as shown in FIG. 1, the test handler system according to the present invention includes a test result input means 100 and a control means 200.

First, the Front Contactor (Blade) module and the Back Contactor (Blade) module repeatedly insert (contact) the material into the test socket. For example, if the front blade module is testing the material by contacting the material to the test socket, the backbone module picks up the material from the shuttle and waits for the test to be ready.

Here, the front blade module and the back blade module are composed of individual 16 blades.

The test result input means 100 receives the test result data of the semiconductor devices inserted into each socket for each of the front blade module and the back blade module.

The control means 200 accumulates the test result data received through the test result input means for each of the blades in accordance with the failure rate, the yield rate and the number of failure judgments for each semiconductor device to turn off the corresponding blades out of the preset allowable range .

As shown in FIG. 2, the control means 200 according to the present embodiment is configured to compare and analyze the test result data of the inserted semiconductor devices for each of the blades.

The control means 200 includes a relative evaluation unit 210, an absolute evaluation unit 220, and a continuous evaluation unit 230.

The relative evaluation unit 210 performs a relative evaluation for each of the blades after completing the test for a total of 16 blades, thereby turning off the blades that are less than the predetermined reference value. The relative evaluation unit 210 includes a relative evaluation module 211, a relative evaluation off setting module 212, and a relative evaluation control module 213.

The relative evaluation module 211 is configured to cumulatively calculate a failure determination rate, a yield rate, and a failure determination count for each blade after completion of testing a total of 16 blades, And the relative evaluation control module 213 controls the corresponding blade, which is set off when the material is inserted into the shuttle, not to load the material.

For example, the air pressure supplied to the pneumatic cylinder of the blade in which the abnormality occurs may be blocked to be turned off.

The absolute evaluation unit 220 performs a test for a set number of times (e.g., blade 10EA) or more and then evaluates the yield. The absolute evaluation unit 220 includes an absolute evaluation module 221, an absolute evaluation off setting module 222, and an absolute evaluation control module 223.

The absolute evaluation module 221 is configured to perform an absolute evaluation by accumulating and calculating a failure determination rate, a yield, and a failure determination count for each blade after performing a test that is equal to or more than the set number of times. The absolute evaluation control module 223 is configured to control the corresponding blade, which is set off when the material is inserted into the shuttle, not to load the material.

That is, if the blade 10EA is set to the set number of times, the absolute evaluation unit 220 contacts 10 times to check the yield (%) and turn off the corresponding blade with a predetermined reference yield value.

This is because the frequency of occurrence of blade off is high when it is determined after a small contact. Therefore, it is necessary to set the setting value appropriately (for example, when the blade off is determined by one test, if the failure occurs, 0% The setting value must be set)

The consecutive evaluation unit 230 has a configuration in which if a failure occurs continuously in the corresponding blade and the number of failure occurrence is higher than the set value, the blade is turned off. The continuous evaluation unit 230 includes a continuous evaluation module 231, a continuous evaluation off setting module 232, and a continuous evaluation control module 233.

The continuous evaluation module 231 is configured to cumulatively calculate the defective determination rate, the yield rate, and the defective determination number for each blade and to count the number of defective determination times. The continuous evaluation off setting module 232, The continuous evaluation control module 233 is configured to control the corresponding blade, which is set off when the material is inserted into the shuttle, not to load the material.

Here, the continuous evaluation unit 230 is configured to turn off the blades when the defective blades are continuously generated.

A test handler system having a blade off function according to an embodiment of the present invention is a configuration for confirming a state of a blade (detection of abnormality) after completion of a test and determining a material input to a shuttle.

The determination of whether there is an abnormality (Blade Off) is as follows.

First, the front blade module and the back blade module are constituted by individual 16 blades, and the reference value of the blade off is set to (%), and the blades below the reference% are turned off.

The test handler system having the blade off function according to the present embodiment divides the test handler system into a relative evaluation and an absolute evaluation mode to check each blade status and turn off the corresponding blade. And a continuous evaluation mode in which the blades are turned off when the number of failures of the corresponding blades is more than the set number of times.

In the relative evaluation mode, 16 blades of each of the front blade modules and the back blade modules are input to the test results, and the failure determination rate, yield, and failure determination counts are cumulatively calculated for each blade, and the relative evaluation results are obtained. When the value of the blade is set to off, the corresponding blade set off when the material is input to the shuttle controls the loading of the material.

The absolute evaluation mode is a configuration for evaluating the yield after performing the test more than the set number of times. The absolute evaluation mode receives the test results that are equal to or higher than the set value for the number of times and accumulates the failure determination rate, yield, The corresponding blade of which the predetermined reference yield value is not set is set to be off so that the corresponding blade set off when the material is put into the shuttle controls not to load the material.

In the continuous evaluation mode, the test result is received, and when the number of defective judgments is higher than a set value as a result of cumulative calculation of the defective determination rate, yield, and defective determination count for each blade, the corresponding blade is set to off, So as not to load the material.

Here, in controlling the corresponding blade that is set to be off so as not to load the material, for example, the air pressure supplied to the pneumatic cylinder of the blade in which the abnormality occurs may be blocked to be turned off.

For reference, the blade sucks the semiconductor element through the air pressure supplied to the pneumatic cylinder, sends out the compressed air, places it down on the socket to be tested, and presses it through the pressurizing means, so a detailed description thereof will be omitted.

Meanwhile, the test handler system having the blade off function according to another embodiment of the present invention includes the identification means 300 in the test result input means 100 and the control means 200 described above.

Here, the identification means 300 is a structure for identifying the position where the semiconductor element is inserted into the socket with each blade. The identification means 300 according to this embodiment may include the configuration of the identification information input unit 310 and the matching unit 320.

The identification information input unit 310 is configured to set a blade identification number for each position of each of the front blade module and the back blade module and to receive the socket identification number for each position of the socket into which the semiconductor device is inserted by the respective blades.

The matching unit 320 is configured to match the blade identification number and the socket identification number into which the semiconductor device is inserted into the socket by each blade.

An embodiment including the identification means 300 will be described below.

The identification means sets the blade identification number for each position of each front blade module and the back blade module, receives the socket identification number for each position of the socket into which the semiconductor device is inserted by each of the blades, And the blade identification number and the socket identification number into which the device is inserted are matched.

According to this embodiment, the test result data of the semiconductor elements injected by the blades identified by the identification means and the sockets are subjected to relative evaluation, absolute evaluation, and continuous evaluation for each identification position of each blade.

In the relative evaluation according to the present embodiment, after completing the testing of a total of 16 blades in each of the front blade module and the back blade module, the relative evaluation module 211 compares the test result data with the defective And the relative evaluation off setting module 212 sets the relative evaluation result in the relative evaluation result and the blade corresponding to the blade identification number that is less than the preset reference value to be off And the relative evaluation control module 213 controls the blade so as not to load the semiconductor element (material) to the blade identification number set to be off when the material is inserted into the shuttle.

Next, the absolute evaluation according to the present embodiment is configured to perform a yield test after performing a test above a set number of times. In the absolute evaluation module 221, a test is performed for a set number of times or more, And the absolute evaluation off setting module 222 sets the blades corresponding to the blade identification numbers that are less than the predetermined reference yield value as a result of the absolute evaluation by the absolute evaluation off setting module 222 , The absolute evaluation control module 223 performs an OFF control so that the blade does not load the semiconductor element into the blade identification number set to be off when the material is inserted into the shuttle.

In the continuous evaluation according to the present embodiment, the continuous evaluation module 231 is configured to turn off the blades corresponding to the identification numbers of which the number of defects is higher than the set value, The number of defective determination times is counted by cumulatively calculating the defective determination rate, yield, and defective determination times, and the blades corresponding to the blade identification numbers higher than the predetermined number of defective determination times are set off in the continuous evaluation off setting module 232, The evaluation control module 233 performs an OFF control so that the blade does not load the semiconductor element into the blade identification number set to be off when the material is inserted into the shuttle.

The test handler system according to the present invention may further include an alarm generating means 400 for counting the number of blades turned off through the control means and generating an alarm if the number is greater than the set number.

On the other hand, a test handler method including a plurality of test sockets for testing semiconductor devices and a front blade module and a back blade module having a plurality of blades for loading / unloading semiconductor devices corresponding to respective test sockets As follows.

First, semiconductor devices are picked up for each front blade module and back blade module and put into a test socket (S2).

Next, the semiconductor device put in each test socket is tested (S4).

Next, the test result data is inputted, and the raw data including the failure rate, yield, and the number of failure judgments for each of the front blade module and the back blade module is cumulatively calculated for relative evaluation or absolute evaluation Or continuous abnormality of the blade exceeding the predetermined allowable range is detected through continuous evaluation (S6).

Then, the corresponding blade which detects the abnormality of the blade is turned off (S8).

After the step S4, the test result data of the semiconductor devices inserted into each socket for each of the front blade module and the back blade module is inputted, and the process to be added thereafter will be described as follows.

Each blade of the front blade module and the back blade module receives and inputs an identification number for each position (S20).

Next, the socket identification number is set and input for each position of the socket into which the semiconductor device is inserted by each blade (S21).

Next, the blade identification number into which the semiconductor device is inserted into the socket is matched with the corresponding socket identification number by each of the blades (S22).

Next, the test result data is accumulated (step S23). The raw data including the failure rate, the yield, and the number of failure judgments for each semiconductor device are accumulated for each identification number of each blade of the front blade module and the back blade module.

Next, the raw data are compared with each other by the identification numbers of the predetermined blades, and it is determined whether or not the blades are out of a preset allowable value for each identification number of each blade (S24).

And sending a control signal to shut off the air pressure supplied to the pneumatic cylinder of the blade corresponding to the identification number which is out of the predetermined allowable deviation range (S25).

The test handler method according to the present invention may further include counting the number of blades that have been turned off and generating an alarm if the number is greater than the set number.

That is, the test result data of the semiconductor devices inserted into each socket is input for each of the front blade module and the back blade module, and then the test result data is transmitted to the front blade module and the back blade module for each blade of the front blade module and the back blade module, The raw data including the yield and the number of defective judgments are cumulatively calculated and the raw data calculated for each blade are compared with each other to turn off the blades which are out of the predetermined allowable range and the number of off blades is counted And generating an alarm.

In step S6, the steps of relative evaluation, absolute evaluation, or continuous evaluation of the raw data calculated for each blade and detecting the abnormality of the blades out of the predetermined allowable range will be described.

It is determined whether the evaluation mode selected and input from the outside is a relative evaluation, an absolute evaluation, or a continuous evaluation (S30).

In the relative evaluation, the failure rate, the yield, and the number of failure judgments for each blade are cumulatively calculated for each of the front blades and the back blade modules (S31).

Next, as a result of the relative evaluation in the step S31, the blade of which the predetermined reference value is not set is turned off (S32).

In the absolute evaluation, the failure determination rate, the yield, and the number of failure determination times for each blade are cumulatively calculated for each blade after the test is performed for the number of times set value or more (S33).

Next, as a result of the absolute evaluation in step S33, the corresponding blade with a predetermined reference yield value is turned off (S34).

In the continuous evaluation, the defective determination rate, the yield, and the defective determination number are cumulatively calculated for each blade, and the defective determination number is counted (S35).

Next, if it is determined in step S50 that the number of defects is higher than the preset defective determination number, the corresponding blade is turned off (S36).

In step S8, the step of turning off the corresponding blade, which detects the abnormality of the blade, controls the corresponding blade, which is set off when the material is inserted into the shuttle, not to load the material.

According to the present invention, it is effective to detect a normal blade and an abnormal blade so that the normal blade continuously supplies the material, and the abnormal blade can be bladed off so as not to supply the material, thereby increasing the production amount.

100: test result input means 200: control means
210: Relative evaluation unit 211: Relative evaluation module
212: relative evaluation off setting module 213: relative evaluation control module
220: absolute evaluation unit 221: absolute evaluation module
222 Absolute evaluation off setting module 223 Absolute evaluation control module
230: continuous evaluation unit 231: continuous evaluation module
232: Continuous evaluation off setting module 233: Continuous evaluation control module
300: Identification means 310: Identification information input unit
320: matching unit 400: alarm generating means

Claims (12)

A test handler system comprising a plurality of test sockets for testing semiconductor devices and a front blade module and a back blade module having a plurality of blades for loading / unloading semiconductor devices corresponding to respective test sockets,
A test result input means for receiving test result data of semiconductor devices inserted into each socket for each of the front blade module and the back blade module; And
And a control unit for cumulatively calculating a defect determination rate, a yield rate, and a failure determination number for each semiconductor device by the test result data received through the test result input unit, and turning off the corresponding blade out of a predetermined tolerance range,
Wherein the control means comprises: a successive evaluation module for cumulatively calculating a failure determination rate, a yield, a failure determination number for each blade, and counting the number of failure determination; A consecutive evaluation off setting module for setting the corresponding blade off if the result of the successive evaluation module is higher than a predetermined number of defective determinations; And a continuous evaluation control module for controlling the corresponding blade, which is set off when the material is input into the shuttle, to prevent the material from being loaded. The method according to claim 1,
An identification information input unit which sets a blade identification number for each position of each of the front blade module and the back blade module and inputs a socket identification number for each position of the socket into which the semiconductor device is inserted by each of the blades; And
And a matching unit for matching the blade identification number and the socket identification number, into which the semiconductor element is inserted, by each of the blades, so as to identify the position where the semiconductor element is inserted into the socket by each of the blades Features a test handler system. The method according to claim 1,
The control means,
A relative evaluation module that cumulatively calculates a failure determination ratio, a yield, and a failure determination number for each of the blades and evaluates a blade that is less than a predetermined reference value;
A relative evaluation off setting module for setting the blades below the predetermined reference value as a result of the relative evaluation; And
And a relative evaluation control module for controlling the corresponding blade, which is set off when the material is inserted into the shuttle, to not load the material. The method according to claim 1,
The control means,
An absolute evaluation module for performing a test on the set number of times and cumulatively calculating a failure determination rate, a yield rate, and a failure determination number for each of the blades, thereby evaluating the blade with a predetermined reference yield value;
An absolute evaluation off setting module for setting the corresponding blade of which the predetermined reference yield value is less than the predetermined blade yield as a result of the absolute evaluation; And
And an absolute evaluation control module that controls the corresponding blade, which is set off when the material is inserted into the shuttle, to not load the material. delete The method according to claim 1,
And alarm generating means for counting the number of blades turned off through the control means and generating an alarm if the number of blades is more than the set number. A test handler method comprising a plurality of test sockets for testing semiconductor devices and a front blade module and a back blade module having a plurality of blades for loading / unloading semiconductor devices corresponding to respective test sockets,
(a) receiving test result data of a semiconductor device inserted into each socket for each of the front blade module and the back blade module;
(b) accumulating the test result data by accumulating raw data including failure rate, yield, and failure determination frequency for each semiconductor device for each blade of the front blade module and the back blade module; And
(c) comparing the raw data calculated for each of the blades, and turning off the blades that deviate from a predetermined allowable range,
The step (c) includes the steps of: (c-1 ") cumulatively calculating a failure determination rate, a yield, and a failure determination number for each of the blades and counting the number of failure determination; (c-2 ") turning off the corresponding blade when the result of the step (c-1 ") is higher than a predetermined number of defective judgments; And (c-3 '') controlling the corresponding blade set off when the material is inserted into the shuttle so as not to load the material. 8. The method of claim 7,
After the step (a)
(a-1) receiving and setting an identification number for each blade of the front blade module and the back blade module;
(a-2) setting and receiving a socket identification number for each position of a socket into which the semiconductor device is inserted by each of the blades; And
(a-3) matching the blade identification number to which the semiconductor device is inserted into the socket with each of the blades and the corresponding socket identification number. 8. The method of claim 7,
The step (c)
(c-1) evaluating blades that are less than a predetermined reference value by cumulatively calculating a failure determination rate, a yield rate, and a failure determination count for each blade after testing each blade of the front blade module and the back blade module;
(c-2) setting off a blade that is less than a preset reference value as a result of the (c-1) evaluation; And
(c-3) controlling the corresponding blade, which is set off when the material is inserted into the shuttle, not to load the material; The test handler comprising: 8. The method of claim 7,
The step (c)
(c-1 '), performing a cumulative number of defective determination ratios, yields, and defective determination ratios for each blade, and evaluating blades that are less than a predetermined reference yield value;
(c-2 ') setting off a corresponding blade whose value is less than a predetermined reference yield value as a result of the (c-1') step; And
(c-3 ') controlling the corresponding blade set off when the material is inserted into the shuttle so as not to load the material. delete 8. The method of claim 7,
After the step (c)
(d) counting the number of blades that have been turned off and generating an alarm if the number is greater than the set number.
KR1020130058175A 2013-05-23 2013-05-23 System for test handler and method therefor KR101459386B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020130058175A KR101459386B1 (en) 2013-05-23 2013-05-23 System for test handler and method therefor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020130058175A KR101459386B1 (en) 2013-05-23 2013-05-23 System for test handler and method therefor

Publications (1)

Publication Number Publication Date
KR101459386B1 true KR101459386B1 (en) 2014-11-10

Family

ID=52287411

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020130058175A KR101459386B1 (en) 2013-05-23 2013-05-23 System for test handler and method therefor

Country Status (1)

Country Link
KR (1) KR101459386B1 (en)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08101251A (en) * 1994-09-30 1996-04-16 Ando Electric Co Ltd Ic tester/ic handler system
JPH08150583A (en) * 1994-11-29 1996-06-11 Ando Electric Co Ltd Automatic handler with ic transferring device
KR20020077598A (en) * 2001-04-02 2002-10-12 미래산업 주식회사 Method for auto socket off of Test handler
KR20050087301A (en) * 2004-02-26 2005-08-31 (주)티에스이 Socket managing system and test system having the socket managing system

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08101251A (en) * 1994-09-30 1996-04-16 Ando Electric Co Ltd Ic tester/ic handler system
JPH08150583A (en) * 1994-11-29 1996-06-11 Ando Electric Co Ltd Automatic handler with ic transferring device
KR20020077598A (en) * 2001-04-02 2002-10-12 미래산업 주식회사 Method for auto socket off of Test handler
KR20050087301A (en) * 2004-02-26 2005-08-31 (주)티에스이 Socket managing system and test system having the socket managing system

Similar Documents

Publication Publication Date Title
KR100493058B1 (en) Electrical testing method for semiconductor package detectable a socket defects by realtime operation
CN103997313B (en) Exponentially weighted moving average (EWMA) wave filter with adjustable weighting factor
US10222075B2 (en) Air-conditioning system and transmission relaying apparatus thereof
CN103367103B (en) Production of semiconductor products method and system
US20070164763A1 (en) Method for detecting abnormality of probe card
CN105203941B (en) The method of inspection of wafer sort special pattern and probe card defect
TW201743388A (en) Method and system for remotely monitoring wafer testing equipment
KR101735508B1 (en) Wiring tester and test method of Industrial and automotive wire harness
US11598738B2 (en) Apparatus and method for detecting defective component using infrared camera
CN111766836A (en) Smart manufacturing method and system
KR101459386B1 (en) System for test handler and method therefor
US8751183B2 (en) Tester having system maintenance compliance tool
KR102091943B1 (en) Equipment for testing pcb board assembly
KR20140131605A (en) System for testing integrity of burn-in boards for various burn-in tests
JP5451183B2 (en) Electrical test system and electrical test method
KR101526522B1 (en) Index Equipment for Inspection of Module for Movable Electronic Machine
JP5507165B2 (en) Inspection device and pass / fail judgment device
JP5306575B2 (en) Electronic device testing apparatus and electronic device testing method
KR101483952B1 (en) Wire harness inspection method
JP5467601B2 (en) Battery test apparatus, battery test method, and battery test program
KR100865857B1 (en) Apparatus and method for testing a semiconductor device
CN111293049B (en) Semiconductor device process control method and control system thereof
JP2015184239A (en) Ic test method and ic test device
CN113083704B (en) PLC-based capacitance sorting method, controller and system
CN112379186B (en) Capacitance testing device

Legal Events

Date Code Title Description
E701 Decision to grant or registration of patent right
GRNT Written decision to grant
FPAY Annual fee payment

Payment date: 20171103

Year of fee payment: 4

FPAY Annual fee payment

Payment date: 20181105

Year of fee payment: 5

FPAY Annual fee payment

Payment date: 20191031

Year of fee payment: 6