KR101459000B1 - Scrubber apparatus - Google Patents

Abstract

A scrubber device according to the present invention can remove moisture from gas to be dehumidified, which is exhausted from a scrubber module through a filter module, allow partial filter tanks of the filter module to continuously perform dehumidification, and allow a drying module to dry a dehumidifying agent in case that the dehumidification efficiency of the filter module is lowered.

Description

The present invention relates to a scrubber apparatus,

The present invention relates to a scrubber device, and more particularly, to a scrubber device capable of removing moisture through a filter module.

The gas scrubber is divided into a wetting method and a burning method.

The wetting type scrubber is a structure that cleans and cools the exhaust gas using water. The wetting type scrubber has a relatively simple structure, and is easy to manufacture and has a large capacity. However, the water-insoluble gas can not be treated, There is a problem that it is inadequate for the treatment of an exhaust gas containing a hydrogen group.

A burning type scrubber has a structure in which a burner such as a hydrogen burner is directly burnt by allowing a gas to pass through it, or indirectly burned by forming a high-temperature chamber using a heat source and allowing exhaust gas to pass therethrough. Such a burning type scrubber has an excellent effect in the treatment of flammable gas, but is unsuitable for the treatment of gas which is not well burned.

On the other hand, in a reaction process using a pyrogenic gas such as hydrogen and a gas such as silane (SiH4), for example, a semiconductor manufacturing process is performed at a high temperature higher than room temperature, in processing the exhaust gas, It is necessary to cool down.

Accordingly, in the semiconductor manufacturing process, a mixed gas scrubber combining a wetting type scrubber and a burning type scrubber is used.

The mixed gas scrubber as described above has a structure in which the exhaust gas is firstly burned in the combustion chamber to remove the ignitable gas and the explosive gas, and then the secondary gas is contained in the water tank to dissolve the water-soluble toxic gas in water.

The process gas used in the semiconductor manufacturing facility is exhausted to the exhaust line by a pump. The process gas is toxic, corrosive, explosive, and highly inflammable, and there are many processes for discharging toxic gas during the process of producing semiconductor devices . For example, gases such as SiH4, SiH2, NO, AsH3, PH3, NH3, N2O, and SiH2Cl2 used in a chemical vapor deposition (CVD) process, an ion implantation process, an etching process, Are used. The gases that are processed and discharged contain various kinds of toxic substances. These toxic gases are not only harmful to the human body but also have flammability and corrosiveness, which can cause accidents such as fire.

In addition, since this toxic gas is released into the atmosphere, it causes severe environmental pollution. Therefore, it is subjected to a purification process in a filtration apparatus before the gas is released into the atmosphere.

Especially, the gas discharged from the chemical vapor deposition process contains a large amount of ammonium chloride, and the ammonium chloride has a property of solidifying at a low temperature. Therefore, although it exists in the gas phase inside the chemical vapor deposition equipment, it coagulates due to the temperature drop when passing through the piping, and is deposited in the form of powder on the inner side of the pipe or inside the vacuum pump, and the deposited powder causes an abnormality in the exhaust system .

Korean Patent No. 10-0742336 Korean Registration Number 10-0452950 Korean Registration Number 10-0325197 Korean Registration Number 10-0307808

An object of the present invention is to provide a scrubber device capable of absorbing moisture through a filter module.

The present invention provides a scrubber apparatus for removing toxic substances contained in a process gas, the scrubber apparatus comprising: a scrubber module (300) for removing toxic substances contained in the process gas; And a filter module (400) for removing moisture contained in the dehumidified gas during a process of sucking and exhausting the dehumidified gas discharged from the scrubber module, wherein the filter module (400) is filled with a dehumidifying agent A plurality of filter tanks (410, 420) for passing moisture through the dehumidifying gas to remove moisture; An exhaust pipe 250 connecting the filter tanks 410 and 420 and the wetting module 200 to supply exhaust gas; And a discharge pipe (450) through which moisture dehumidified gas is discharged by the filter tanks (410, 420).

And a drying module for supplying the hot gas to at least one of the filter tanks 410 and 420 to dry the dehumidifying agent when the dehumidifying efficiency of the filter tanks 410 and 420 is lowered.

The drying module includes a compressor 460 for compressing air and supplying the compressed air to at least one of the plurality of filter tanks 410 and 420; An air heater 470 disposed between the compressor 460 and the filter tanks 410 and 420 to heat the air supplied from the compressor 460 with hot gas; First and second air supply pipes 482 and 484 connecting the air heater 470 and the filter tanks 410 and 420 to supply the hot gas to the filter tanks 410 and 420; And second and third exhaust valves 415 and 425 which are respectively disposed in the filter tanks 410 and 420 and discharge the air inside the filter tanks 410 and 420 when the hot gas is supplied can do.

The scrubber device according to the present invention can remove moisture from the dehumidifying gas discharged from the scrubber module through the filter module. When the dehumidifying efficiency of the filter module is lowered, some filter tanks are continuously dehumidified, It is possible to dry the dehumidifying agent through the drying module.

The scrubber device according to the present invention has the effect of semi-permanently dehumidifying because some of the plurality of filter tanks are continuously dehumidified and some filter tanks are recovered to be reusable through the drying module have.

1 is a schematic view of a scrubber apparatus according to an embodiment of the present invention;
FIG. 2 is a schematic view showing a scrubber apparatus according to another embodiment of the present invention
Figure 3 is a front view of the remover of Figure 2,
4 is a cross-sectional view of the drop ring shown in Fig. 3
Fig. 5 is a partially cutaway perspective view of the drop ring shown in Fig.
Figure 6 is a perspective view of the remover shown in Figure 2;
Fig. 7 is an exploded perspective view of Fig.
8 is a perspective view of the cooling block shown in Fig.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, the present invention will be described in detail with reference to the accompanying drawings.

In the following description of the present invention, a detailed description of known functions and configurations incorporated herein will be omitted when it may make the subject matter of the present invention rather unclear. Even if the terms are the same, it is to be noted that when the portions to be displayed differ, the reference signs do not coincide.

It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory and are intended to provide further explanation of the invention as claimed.

The terms first, second, etc. in this specification may be used to describe various elements, but the elements should not be limited by the terms. The terms are used only for the purpose of distinguishing one component from another. For example, without departing from the scope of the present invention, the first component may be referred to as a second component, and similarly, the second component may also be referred to as a first component. And / or < / RTI > includes any combination of a plurality of related listed items or any of a plurality of related listed items.

The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. The singular expressions include plural expressions unless the context clearly dictates otherwise.

Unless defined otherwise, all terms used herein, including technical or scientific terms, have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. Terms such as those defined in commonly used dictionaries should be interpreted as having a meaning consistent with the meaning in the context of the relevant art and are to be interpreted in an ideal or overly formal sense unless explicitly defined in the present application Do not.

Also, when a part is referred to as "including " an element, it does not exclude other elements unless specifically stated otherwise.

1 is a configuration diagram of a scrubber apparatus according to an embodiment of the present invention.

As shown in the drawings, the scrubber apparatus according to the present invention may be of any type, wet type or mixed type. In the present embodiment, a mixed gas scrubber apparatus is taken as an example. However, Do not.

The scrubber apparatus according to the present embodiment includes a combustion module 100 for burning a process gas emitted from a semiconductor, LCD, and LED manufacturing process, a wetting module 200 for wetly removing the exhaust gas burned in the combustion module 100 (Hereinafter, referred to as "dehumidifying target gas"), and then removing moisture contained in the dehumidifying target gas in a process of sucking and exhausting the exhaust gas discharged from the scrubber module Filter module (400).

The combustion module 100 and the wetting module 200 are general structures used in a mixed gas scrubber apparatus, and therefore, detailed description thereof will be omitted.

Here, the scrubber module is for removing harmful substances included in the process gas, and the process gas is used for a chemical vapor deposition (CVD) process, an ion implantation process, an etching process, a diffusion process, etc. Such as SiH4, SiH2, NO, AsH3, PH3, NH3, N2O, SiH2Cl2 and HF, and can be driven by various mechanisms such as burning type, wetting type, heating type and plasma type.

The filter module 400 includes a plurality of filter tanks 410 and 420 for removing the moisture by passing the dehumidifying gas and the filter tanks 410 and 420 and the wetting module 200, And a discharge pipe 450 through which moisture dehumidified gas is discharged by the filter tanks 410 and 420.

When the dehumidification efficiency of the filter tank is lowered, hot hot gas may be supplied to the filter tanks 410 and 420 to restore the dehumidification efficiency by drying the dehumidifier, And a drying module for drying the drying chamber 420 is further installed.

In the present embodiment, the filter tank is composed of two first and second filter tanks 410 and 420, and may be composed of three or more, unlike the present embodiment, and a dehumidifying agent And various materials such as silica gel and activated carbon may be used as the dehumidifying agent.

Here, at least one of the filter tanks 410 and 420 is dehumidified by supplying dehumidification gas, and when the dehumidification efficiency is lowered, the drying module performs drying on the tank.

In this embodiment, the drying module is configured to selectively dry the filter tanks 410 and 420.

The drying module includes a compressor 460 for compressing air and supplying the compressed air to at least one of the plurality of filter tanks 410 and 420 and a compressor 460 disposed between the compressor 460 and the filter tanks 410 and 420 An air heater 470 for heating the air supplied from the compressor 460 with hot gas and the air heater 470 and the filter tanks 410 and 420 to connect the hot gas to the filter tank 410 First and second air supply pipes 482 and 484 for supplying the hot gas to the filter tanks 410 and 420 when the hot gas is supplied to the filter tanks 410 and 420, And first and second exhaust valves 415 and 425 for exhausting the internal air to the outside.

The first and second air supply pipes 482 and 484 are connected to supply hot gas to the suction side of the filter tanks 410 and 420 and the first and second exhaust valves 415 and 425 are connected to the filter And is disposed on the discharge side of the tank 410 (420).

When the first and second air supply pipes 482 and 484 are disposed on the discharge side of the filter tanks 410 and 420 and supply hot gas to the suction side, the flow path of the filter tank 410 is formed in a reverse direction The flow path of the filter tank 410 can be closed due to the powder or the like.

The first and second exhaust valves 415 and 425 are configured to discharge the hot gas while the first and second discharge valves 452 and 454 are closed and the first and second exhaust valves 415 and 415 The first and second discharge valves 452 and 454 corresponding to the first and second filter tanks 410 and 420 are opened and the discharge tube 450 is opened through the discharge tube 450 Hot gas may be discharged.

In the present embodiment, the gas discharged from the first and second exhaust valves 415 and 425 is recovered to the combustion module 100, and the recovered gas is re-combusted in the combustion module 100, Can be removed.

The air heater 470 is used to heat the gas supplied from the compressor 460 to a predetermined temperature. Various structures can be used. In the present embodiment, the air heater 470 is heated while passing air through the heating wire.

The structure of the air heater 470 may be variously implemented, and the spirit of the present invention is not limited by the structure of the air heater 470.

Since the compressor 460 is a general technique to those skilled in the art, a detailed description thereof will be omitted.

The hot gas used in this embodiment is nitrogen at 50 ° C to 250 ° C.

In order to supply the dehumidifying gas supplied from the wetting module 200 to at least one of the first and second filter tanks 410 and 420, The first and second suction valves 442 and 444 and the first and second discharge valves 452 and 454 are disposed on the suction side discharge side.

In this embodiment, the exhaust pipe 250 is provided with a selection valve 440 capable of selectively supplying a dehumidification gas to at least one of the first and second filter tanks 410 and 420.

Hereinafter, the operation of the scrubber apparatus according to the present embodiment will be described in detail with reference to the drawings.

The dehumidifying gas passing through the combustion module 100 and the wetting module 200 may be supplied to at least one of the first and second filter tanks 410 and 420 by the selection valve 440 .

When the dehumidifying target gas is supplied only to the first filter tank 410, the first suction valve 442 and the first discharge valve 452 are opened, and the second suction valve 444 and the second discharge valve The valve 454 remains closed.

When the dehumidifying target gas is supplied to the first filter tank 410 through the first suction valve 442, the moisture is removed through the desiccant filled in the first filter tank 410, and then the first discharge valve 452 And then discharged to the discharge pipe 450.

Here, the second filter tank 420 is in a standby state.

When the dehumidifying agent of the first filter tank 410 absorbs moisture sufficiently to lower the dehumidifying efficiency, the operation of the first filter tank 410 is stopped and the dehumidification target gas is supplied to the second filter tank 420 And dehumidification is performed.

Here, when dehumidification is performed through the second filter tank 420, the drying module supplies hot gas to the first filter tank 410 to dry the dehumidifying agent.

The drying module supplies the hot gas generated by the compressor 460 and the air heater 470 to the first filter tank 410 to dry the dehumidifier packed therein, The hot gas supplied to the first filter tank 410 is discharged to the outside through the first exhaust valve 415 provided in the first filter tank 410.

As described above, the scrubber device according to the present embodiment can perform dehumidification using all or a part of a plurality of filter tanks.

Further, in the scrubber apparatus according to the present embodiment, when the dehumidification efficiency is lowered, some of the filter tanks are dehumidified and some of the dehumidifiers are dried through the drying module. Therefore, There is an effect that the dehumidification can be performed permanently.

Particularly, the scrubber device according to the present embodiment can add the filter tank in parallel even when a dehumidifying target gas containing a large amount of moisture is supplied due to a change in the manufacturing process of a semiconductor or the like, It has a structure that can be.

FIG. 3 is a front view showing the remover of FIG. 2, FIG. 4 is a sectional view showing the drop ring shown in FIG. 3, and FIG. 6 is a perspective view of the remover shown in Fig. 2, Fig. 7 is an exploded perspective view of Fig. 6, Fig. 8 is a perspective view of the cooling block shown in Fig. 7, to be.

As shown in the figure, the scrubber apparatus according to the present embodiment is further provided with a remover 500 for removing harmful substances between the wetting module 200 and the filter module 400.

Thus, the scrubber device according to the present embodiment is configured to remove the harmful substances contained in the dehumidifying gas through the remover 500, and then remove the moisture of the dehumidifying gas again through the filter module.

The remover 500 includes a dehumidifying housing 10 having a plurality of cooling fins 15 therein, a thermoelectric element 20 attached to the dehumidifying housing 10 to cool the cooling fin 15, An inlet pipe 30 for guiding a gas to be dehumidified into the dehumidifying housing 10 and a discharge pipe 40 for discharging the gas cooled and dehumidified through the dehumidifying housing 10.

The dehumidifying housing 10 includes a dehumidifying space 12 in which a dehumidifying space 11 is formed and a cooling fin 15 formed in the dehumidifying housing 10 so that the cooling fin 15 is disposed inside the dehumidifying space 11. And a cooling block (14) coupled to the dehumidifying body (12).

The dehumidifying housing 10 is formed of aluminum or copper having high thermal conductivity.

One side and the other side of the dehumidifying body 12 are formed to be open, and the cooling block 14 is engaged to close one side and the other side which are opened.

The cooling fins 15 protrude from the cooling block 14 and the cooling fins 15 protrude from the both sides of the dehumidifying body 12 into the dehumidifying space 11.

A lower portion of the dehumidifying body 12 has an inlet hole 10a through which a dehumidifying gas flows and an outlet hole 10b through which a dehumidified gas is discharged.

An inlet pipe 30 is connected to the inlet hole 10a and a discharge pipe 40 is connected to the outlet hole 10b.

The thermoelectric element 20 is coupled to the cooling block 14 and the thermoelectric element 20 cools the cooling block 14 to transfer the cool air to the cooling pin 15.

Here, since the cooling block 14 is directly cooled by the thermoelectric element 20 and then transmits cool air to the cooling fin 15, heat loss can be minimized.

The thermoelectric element is mainly composed of a thermistor, which is a device using a temperature change of electric resistance, a device using a Jecke effect, which is a phenomenon in which an electromotive force is generated by a temperature difference, And a Peltier element which is a device using a Peltier effect, which is a phenomenon occurring. A thermistor is a type of semiconductor device in which the electrical resistance varies greatly with temperature. The NTC thermistor is a type of semiconductor device in which electrical resistance is reduced by an increase in temperature, a positive temperature coefficient thermistor (PTC) positive temperature coefficient thermistor). The thermistor is made by blending molybdenum oxide, nickel oxide, cobalt oxide, and other oxides into a plurality of components, sintering it, and stabilizing the circuit and using it for heat, power, and light detection.

The Seebeck effect is a phenomenon in which both ends of two kinds of metals are connected to each other and the temperatures at the two ends are different from each other, resulting in an electromotive force. This is applied to temperature measurement using a thermocouple pair.

The Peltier effect is a phenomenon in which two kinds of metal ends are connected to each other and a current is supplied thereto, one terminal is absorbed by the current direction and the other terminal generates heat. If a semiconductor such as bismuth tellurium, which is different from the electric conduction method, is used instead of the two kinds of metals, it is possible to obtain a Peltier element having a highly efficient endothermic and exothermic action. This is because it is possible to switch the endothermic and exothermic directions according to the current direction, and the heat generation amount is adjusted according to the amount of current. Therefore, it is applied to a refrigerator having a small capacity or a precision thermostatic chamber near room temperature.

The cooling fins 15 are installed perpendicular to the cooling surfaces of the thermoelectric elements 20 and protrude from both sides of the dehumidifying body 12 into the dehumidifying space 11.

The dehumidifying target gas and the cooling fin (15) are in direct contact to cool the dehumidifying gas, and the cooled dehumidified gas is converted into condensed water on the surface of the cooling fin (15). Then, the gas from which harmful components are once again removed through the remover 500 is discharged to the discharge port.

The condensed water generated in the remover 500 dissolves or contains harmful substances, and the condensed water containing the harmful substances drops downward due to its own weight.

Further, since the condensed water and the dehumidified gas are highly corrosive noxious gas, the surface of the cooling fin 15 can be curved to minimize the corrosion even if a harmful component powder is generated.

Meanwhile, the exhaust pipe 250 connecting the remover 500 and the scrubber module passes the dehumidification gas discharged from the scrubber module to the remover 500 side.

Here, the bypass pipe is installed in the exhaust pipe 250.

The bypass piping can be used for various purposes. For example, to bypass the gas flowing into the remover 500 of the scrubber device to the combustion module 100 or the wetting module 200, and the combustion module 100 or the wetting module 200 To the inlet side of the remover 500. In this case,

In this embodiment, the bypass pipe is composed of first and second bypass pipes 501 and 502, and it is preferable that the bypass pipe is formed by forming a gradient so that the height of the side connected to the exhaust pipe 250 is low So that it is possible to prevent the condensed water from flowing back through the gradient even if the condensed water flows into the first and second bypass pipes 501 and 502.

Wherein the bypass line can be connected to an adjacent scrubber device and if the scrubber module of the device is stopped or not operating normally, the process gas can be sent to an adjacent scrubber device for processing.

The drop ring 600 is installed in the exhaust pipe 250 and prevents the condensed water dropped from the remover 500 from being moved along the surface of the pipe pipe 400 while being discharged to the lower side of the exhaust pipe 250 Thereby forming a flow path for dropping.

Therefore, the drop ring 600 forms a flow path for dropping condensed water into the exhaust pipe 250, thereby blocking the contact of the bypass pipe 500 with the condensed water, and through the bypass pipe, Can be prevented from flowing.

When there is no special structure, the condensed water generated in the remover 500 is moved along the inner wall surface of the exhaust pipe 250, and the bypass pipe connected to the exhaust pipe 250 Lt; / RTI >

The drop ring 600 according to the present embodiment is installed in the exhaust pipe 250 to block the condensed water generated in the remover 500 from flowing into the bypass pipe after being moved along the inner surface of the exhaust pipe 250 So that the condensed water moved along the inner surface of the exhaust pipe 250 is dropped into the exhaust pipe 250.

The drop ring 600 includes a drop body 604 which is in close contact with the inner surface of the exhaust pipe 250 and whose lower end is spaced apart from the inner surface of the drop pipe 600 and is located inside the exhaust pipe 250, And a drop fixing part 606 formed to be connected to the exhaust pipe 250.

The drop body 604 is formed integrally with the tight fitting portion 601 and is spaced apart from the inner side surface of the exhaust pipe 250 and has a lower end And a drop portion 602 disposed inside the exhaust pipe 250.

The drop ring 600 is formed in the shape of a ring and the upper end of the tight fitting portion 601 is disposed in close contact with the inner surface of the exhaust pipe 250. The lower end of the dropping portion 602 Is disposed inside the exhaust pipe (250).

The drop portion 602 is formed to be spaced apart from the exhaust pipe 250 to a length not to cause capillary phenomenon of the condensed water and is formed to have a sharp-pointed lower end so as to facilitate the drop of the condensed water.

Also, the drop portion 602 is formed in a circular shape having a flat cross section, and is formed to be smaller than the diameter of the tight fitting portion 601, and the diameter gradually decreases toward the lower side.

The upper end of the tight contact portion 601 is preferably formed in close contact with the inner surface of the exhaust pipe 250 so that the condensed water moved along the exhaust pipe 250 can be easily moved to the inside of the tight contact portion 601 Do.

The condensed water which has been moved downward along the exhaust pipe 250 flows downwardly from the lower end of the drop portion 602 to the inside of the tight fitting portion 601 along the tight fitting portion 601.

Therefore, the drop ring 600 can move the condensed water, which has been moved along the inner surface of the exhaust pipe 250, to the internal space of the exhaust pipe 250 to drop the condensed water into the bypass pipe, As shown in FIG.

Further, since the condensed water that has been moved along the exhaust pipe 250 is allowed to fall freely through the drop ring 600, the moving time of the condensed water can be greatly shortened, and corrosion of the exhaust pipe 250 can be prevented And the durability can be improved.

Since the condensed water contains a large amount of harmful substances that can cause corrosion or the like, a coating for preventing corrosion is applied to the surfaces of the parts that are in contact with the condensed water. Nevertheless, when the contact time with the harmful substances becomes long, This aging will increase the probability of corrosion and the replacement of the equipment.

Since the drop ring 600 according to the present embodiment freely drops the condensed water that has been moved along the surface, the contact time and length with the condensed water can be greatly reduced, thereby improving the durability of the equipment.

The exhaust pipe 250 provided with the drop ring 600 is provided with a flange 406 on the upper and lower sides and the drop fixing portion 606 is fixed to the flange 406 in close contact with each other.

In addition, a clamp 408 or bolt (not shown) or the like may be additionally provided to seal and fix the flange 406 and the drop fixing portion 606.

On the other hand, the components contacting with the process gas and the exhaust gas are coated with a nick coating to prevent corrosion.

The NIX coating (or dimer) is performed by CVD vacuum deposition. The dimers used in the nick coating include poly (Para-Xylene), poly (Chloro-Para-Xylylene), poly (Di-Chloro-Para-Xylylene) ) And poly (tetrafluoro- [2,2] para-Xylylene), and the like. In addition, the thickness of the knock coating layer (or the knuck coating layer) formed by the knuck coating may be in the range of about 1 mu m to 70 mu m.

Where the solid dimer is placed in a vaporizer (not shown) and the pressure is adjusted to a predetermined level (e.g., about 1 Torr) and heated to a predetermined temperature (e.g., 170 ° C to 200 ° C) , The solid-state dimer is vaporized and dimer gas is generated. Then, the vaporized dimer gas is decomposed into monomers by passing through a pyrolysis (not shown) maintained at 650 ° C to 700 ° C and a pressure of 0.5 Torr. Thereafter, the thermally decomposed monomer is deposited (or laminated / condensed) on the surface of the object in the CVD chamber controlled at a room temperature to a pressure of 10 mTorr to 100 mTorr to form a nick coating layer (or a Knicks coating / / Nix coating film) is formed.

Since the coating of the nicks polymer (or the paraline polymer) is carried out at room temperature or vacuum, deformation of the base material due to thermal stress can be prevented and the fine unevenness can be uniformly coated on the side surface of the base material without pinholes. In addition, the nitric coating can improve chemical resistance, heat resistance, water resistance, and the like.

The non-metallic material may be glass, ceramic, acrylic, Teflon, PVC, or the like. The metallic material may be aluminum, stainless steel For example.

As described above, the scrubber device according to the present embodiment can easily remove harmful substances through the remover 500 even if the exhaust gas contains harmful material powder, and can remove moisture from the dehumidified gas from which harmful substances have been removed There is an effect.

Also, in the present embodiment, the moisture of the dehumidification gas can be removed through the remover 500 and the filter module 400.

In the present embodiment, the drop ring 600 is installed in the mixed-type gas scrubber apparatus. However, it may be installed in the No. 1 type scrubber apparatus or the wetting type scrubber apparatus.

Since the remaining configuration is the same as that of the first embodiment, the detailed description will be omitted.

While the present invention has been described in connection with what is presently considered to be practical exemplary embodiments, it is to be understood that the invention is not limited to the disclosed embodiments, but, on the contrary, It is to be understood that the invention may be embodied in other specific forms without departing from the spirit or essential characteristics thereof. It is therefore to be understood that the above-described embodiments are illustrative in all aspects and not restrictive.

100: combustion module 200: wetting module
300: scrubber module 400: filter module
500: Remover 600: Drop ring

Claims (3)

A scrubber apparatus for removing harmful substances contained in a process gas,
A scrubber module 300 for removing harmful substances included in the process gas;
And a filter module (400) for removing moisture contained in the dehumidified gas in the course of sucking and passing the dehumidified gas discharged from the scrubber module,
The filter module (400)
A plurality of filter tanks (410) (420) filled with a dehumidifying agent therein and passing moisture through the dehumidifying gas to remove moisture; An exhaust pipe 250 connecting the filter tanks 410 and 420 and the wetting module 200 to supply exhaust gas; And a discharge pipe (450) through which dehumidified gas from which moisture is removed by the filter tanks (410, 420) is discharged,
Further comprising a drying module for supplying hot gas to at least one of the filter tanks (410, 420) to dry the dehumidifying agent when the dehumidifying efficiency of the filter tanks (410, 420) is lowered.
delete The method according to claim 1,
The drying module
A compressor (460) for compressing the air and supplying the compressed air to at least one of the plurality of filter tanks (410, 420);
An air heater 470 disposed between the compressor 460 and the filter tanks 410 and 420 to heat the air supplied from the compressor 460 with hot gas;
First and second air supply pipes 482 and 484 connecting the air heater 470 and the filter tanks 410 and 420 to supply the hot gas to the filter tanks 410 and 420;
And second and third exhaust valves 415 and 425 which are respectively disposed in the filter tanks 410 and 420 and discharge the air inside the filter tanks 410 and 420 when the hot gas is supplied .

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