KR101434284B1 - Composition of stripper for photoresist - Google Patents

Abstract

The present invention relates to a photoresist stripping fluid composition, which provides a photoresist stripping fluid composition containing, as polar solvents, selectively mixed amines and solketal so as to improve the detachment from photoresist and the corrosion inhibition for both copper and aluminium.

Description

COMPOSITION OF STRIPPER FOR PHOTORESIST [0002]

The present invention relates to a photoresist stripping liquid composition, and more particularly, to a photoresist stripping liquid composition which selectively uses specific amines and is used as a polar solvent to form a photoresist stripping liquid ≪ / RTI >

In an integrated circuit of a semiconductor device or a microcircuit manufacturing process of a flat panel display device, a photoresist is uniformly coated on a conductive metal film or an insulating film formed on a substrate, selectively exposed, and developed to form a photoresist pattern.

Here, the conductive metal film is aluminum or an aluminum alloy, copper or a copper alloy, and the insulating film is a silicon oxide film or a silicon nitride film. Subsequently, the conductive metal film or the insulating film is etched by wet or dry using the patterned photoresist film as a mask to transfer the fine circuit pattern to the lower layer of the photoresist, and then the unnecessary photoresist layer is removed by a photoresist stripper composition The process proceeds to the removal process.

Japanese Patent Laid-Open Publication No. 51-72503 discloses a resist removing composition comprising an alkyl benzene sulfonic acid having 10 to 20 carbon atoms and a non-halogenated aromatic hydrocarbon having a boiling point of 150 캜 or higher.

Japanese Patent Laid-Open Publication No. Sho 57-84456 discloses a composition for removing a resist containing dimethyl sulfoxide or diethyl sulfoxide and an organic sulfone compound.

Also, U.S. Patent No. 4,256,294 discloses a composition for removing resist comprising alkylarylsulfonic acid, a hydrophilic aromatic sulfonic acid having 6 to 9 carbon atoms, and a non-halogenated aromatic hydrocarbon having a boiling point of 150 ° C or higher.

However, conventional compositions for removing resist have a problem that corrosion of conductive metal films such as aluminum, copper, and copper alloy is severe and it is difficult to use due to environmental pollution problem due to strong toxicity.

In order to solve the above problems, there have been proposed techniques for preparing a photoresist stripper composition by mixing a water-soluble alkanolamine as an essential component with various organic solvents.

For example, Korean Patent Publication No. 2010-0125109 and Korean Patent Publication No. 2005-0001811 disclose compositions for removing a resist containing primary, secondary, and tertiary amines such as monoethanolamine, diethanolamine, and triethanolamine .

The composition for removing the photoresist sheet used in these patents is a photoresist strip process of a lithographic process in the process of manufacturing a TFT LCD. In order to maximize the stripper capability, a mixture of amines, polar organic solvents and water A release liquid composition is used.

However, the cleaning agents of hydroxides and amines contained in such a peeling liquid composition contribute greatly to peeling ability, but still cause corrosion of Al and Cu wiring films.

In order to minimize such corrosion problems, the stripper composition for Al and Cu wiring uses a selective metal corrosion inhibitor to minimize the corrosion of the wiring film. However, the corrosion inhibitor has a high reactivity with Al and Cu, It shows the property of remaining in the film, which causes the deterioration of the electric characteristics of the device and the defect rate. In general, azole and catechol corrosion inhibitors are known as environmental pollutants affecting the human body, so that there is a growing demand for minimizing the degree of use.

Accordingly, the present inventor has developed a photoresist peeling solution having stable photoresist peeling performance and corrosion inhibition performance even when water is volatilized while using a strong alkaline amine.

DISCLOSURE OF THE INVENTION The present invention has been made to solve the above problems, and it is an object of the present invention to provide a process for producing a polyurethane foam, which comprises using solketol as an organic solvent and selectively using two or more kinds of primary, secondary, and tertiary amines, And a peeling liquid composition capable of maintaining the peeling ability at the maximum while minimizing corrosion of metal wiring films such as Al and Cu.

An embodiment of the present invention for solving the above problems provides a photoresist stripper composition comprising a polar solvent containing (2,2-dimethyl-1,3-dioxolan-4-yl) methanol.

Preferably, the photoresist stripper solution composition of the present invention comprises a first organic solvent containing at least one of primary amines or secondary amines; And a second organic solvent containing at least one of a secondary amine and a tertiary amine, wherein the primary amine, the secondary amine and the tertiary amine are preferably in a chain form, and the first organic solvent And the second organic solvent are preferably different from each other.

The first organic solvent may be selected from the group consisting of monoethanolamine, monoisopropanolamine, diethanolamine and 2-methylamine ethanol. The second organic solvent may be selected from the group consisting of diethanolamine, propylmonoethanolamine, butyl And may be selected from the group consisting of ethanolamine, triethanolamine, monomethyldiethanolamine, dimethylethanolamine, diethylethanolamine, ethyldiethanolamine, propyldiethanolamine and butyldiethanolamine.

The polar solvent may be at least one selected from the group consisting of N-methyl-2-pyrrolidone, sulfolane, 1,2-dimethylimidazole, 1,3-dimethyl- , 4,5,6-tetrahydro-2 (1H) -pyrimidinone, and NN-dimethylpropionamide, at least one aprotic polar solvent selected from the group consisting of diethylene glycol monomethyl ether, diethylene glycol Monoethyl ether, diethylene glycol monobutyl ether, ethylene glycol butyl ether, ethylene glycol ethyl ether, ethylene glycol methyl ether, monoethyleneglycol, diethyleneglycol, triethyleneglycol, tetraethylglycol, polyethylene glycol, dipropyleneglycol monomethyl Ether, dipropylene glycol monoethyl ether, dipropylene glycol monobutyl ether, propylene glycol butyl ether, propylene glycol ethyl ether, propylene glycol methyl ether, monopropylene glycol, dipropylene glycol Butylene glycol, triethylene may further include propylene glycol, tetra-butyl glycol and polybutylene protic polar solvent is selected at least one from the group consisting of butylene glycol.

Preferably, the releasing solution composition of the present invention comprises a polyhydric alcohol having two or more hydroxyl groups, a tolyltriazole, a benzotriazole, an aminotriazole, a carboxylbenzotriazole, 1- [bis (hydroxyethyl) aminoethyl (NBT)), catechol, sorbitol, and gluconic acid, which is at least one selected from the group consisting of benzyltriazole, tolyltriazole, 1-hydroxybenzotriazole (HBT), nitrobenzotriazole .

The weight ratio of the first organic solvent to the second organic solvent is preferably 1.1: 1 to 4: 1, and the pH of the photoresist stripper composition of the present invention is 10 or more (based on 10% water solution) desirable.

Preferably, the first organic solvent is 0.1 to 10 wt%, the second organic solvent is 0.1 to 10 wt%, the aprotic polar solvent is 1 to 50 wt%, the protonic polar solvent is 10 To 70% by weight, the corrosion inhibitor may be 0 to 2% by weight, the water may be 0.1 to 70% by weight, the primary amine constituting the first organic solvent may be 0 to 4% by weight desirable.

According to the present invention, it is possible to provide a peeling liquid composition having excellent peeling performance for photoresist or general-purpose resist after dry etching by using sol-gel as an organic solvent and selectively using amines.

Further, according to the present invention, since corrosion of a metal wiring film such as aluminum and copper can be minimized without using almost no corrosion inhibitor, it can be applied to both aluminum and copper wiring, is applicable to low temperature process conditions, It is possible to provide an environmentally friendly peeling liquid composition having no environmentally harmful substance and high moisture content.

Hereinafter, the present invention will be described in detail.

The photoresist stripper composition of the present invention comprises a first organic solvent containing at least one of primary amines or secondary amines, a second organic solvent containing at least one of secondary amines and tertiary amines, And a proton-containing polar solvent.

Preferably, the release liquid composition of the present invention may further comprise an aprotic polar solvent and water, and in some cases may contain a small amount of corrosion inhibitor. At this time, it is preferable that water is 0.1 to 70% by weight of the total exfoliant composition.

First, the protonic polar solvent of the present invention will be described.

The protonic polar solvent of the present invention necessarily includes a sol-gel. In addition, the protonic polar solvent of the present invention may be at least one selected from the group consisting of diethylene glycol monomethyl ether, diethylene glycol monoethyl ether, diethylene glycol monobutyl ether, ethylene glycol butyl ether, ethylene glycol ethyl ether, ethylene glycol methyl ether, Diethylene glycol, triethylene glycol, tetraethyl glycol, polyethylene glycol, dipropylene glycol monomethyl ether, dipropylene glycol monoethyl ether, dipropylene glycol monobutyl ether, propylene glycol butyl ether, propylene glycol ethyl ether, propylene glycol methyl ether , Monopropylene glycol, dipropylene glycol, tripropylene glycol, tetrabutyl glycol, and polybutylene glycol. The polar solvent may be at least one selected from the group consisting of propylene glycol, propylene glycol, dipropylene glycol, tripropylene glycol, tetrabutyl glycol and polybutylene glycol.

Preferably, the protonic polar solvent of the present invention is selected from the group consisting of N-methyl-2-pyrrolidone, sulfolane, 1,2-dimethylimidazole, 1,3-dimethyl- -Dimethyl-3,4,5,6-tetrahydro-2 (1H) -pyrimidinone, and NN-dimethylpropionamide in the presence of at least one aprotic polar solvent.

Generally, when the polar solvent is excellent in the corrosion inhibiting ability, the photoresist solubility is poor and the photoresist solubility is excellent, the corrosion inhibiting ability is low.

Accordingly, in order to solve such a problem, the present invention uses a polar solvent containing a sol-gel as shown in Chemical Formula 1 below. By using a polar solvent including a sol-gel, it is possible not only to improve the solubility of the photoresist and to prevent the adsorption of the photoresist, but also to prevent deterioration of the corrosion inhibiting ability of the metal wiring.

≪ Formula 1 >

Solketal refers to (2,2-dimethyl-1,3-dioxolan-4-yl) methanol, also referred to as isopropylidene glycerol.

Preferably, the aprotic polar solvent is 1 to 50% by weight of the total exfoliant composition and the protonic polar solvent is 10 to 70% by weight.

Next, the amines contained in the release liquid composition of the present invention will be described. The amines of the present invention include at least one first organic solvent selected from primary amines or secondary amines and at least one second organic solvent selected from secondary amines or tertiary amines.

In the case of a water-based photoresist stripping solution which has been recently used, the peeling performance and the corrosion-preventing performance may be rapidly changed due to the volatilization of water due to continuous use, and thus most of the strong alkaline amines can not be used.

However, in order to quickly remove the denatured photoresist and the general-purpose photoresist after dry etching at a low temperature, it is necessary to use a release liquid composition containing a strong alkaline amine. Therefore, in order to use a strong alkaline amine, a primary amine or a specific secondary amine with a high pH should be selectively used.

By selectively using amines, it is possible to produce a water-based exfoliating liquid composition capable of having stable photoresist peeling performance and corrosion inhibition performance even when water is volatilized while using strong alkaline amines.

In the present invention, a first organic solvent containing at least one selected from a primary amine or a secondary amine is used for improving the peeling force. These primary amines or secondary amines are preferably in a chain form. For example, it is preferred to use primary amines such as monoethanolamine, monoisopropanolamine and the like, and secondary amines such as diethanolamine, 2-methylamine ethanol and the like. Here, the chain type includes both a straight chain type and a branched type.

In this case, it is more preferable to use secondary amines as the first organic solvent. It is preferable that the first organic solvent is 0.1 to 10% by weight of the total exfoliant composition and 0 to 4% by weight of the primary amine. If the amount of the primary amine is too large, although the peeling performance is improved, the metal corrosion inhibiting performance may be deteriorated. Therefore, it is preferable that the primary amine is 0 to 4% by weight, preferably 0 to 2% by weight, and more preferably 0 to 1% by weight.

On the other hand, when the primary or secondary amine having a high pH is selectively used as described above, the peeling force can be improved, but these amines cause a problem of causing serious corrosion of metal wiring and the like. Therefore, in order to solve this problem, it is required to add a large amount of corrosion inhibitor. Accordingly, in order to suppress the corrosiveness of the strong alkaline amine instead of the expensive and other side effect corrosion inhibitor, Which greatly suppressed corrosion.

According to one embodiment of the present invention, when a primary amine is used for photoresist stripping, secondary or tertiary amines can be used to inhibit corrosion, and a secondary amine having a high pH When used, tertiary amines can be used to inhibit corrosion. Amines used to inhibit corrosion should be determined in consideration of photoresist stripping power and type and amount of amine.

In the present invention, a second organic solvent containing at least one of a specific secondary amine or tertiary amine is used for suppressing the corrosiveness of the first organic solvent to metal wiring. The second organic solvent is preferably 0.1 to 10% by weight of the total exfoliant composition.

It is preferable that the second organic solvent is different from the first organic solvent. Secondary amines that can be used as the second amine solvent include diethanolamine, propylmonoethanolamine, butylethanolamine and the like. As tertiary amines, Triethanolamine, monomethyldiethanolamine, dimethylethanolamine, diethylethanolamine, ethyldiethanolamine, propyldiethanolamine, butyldiethanolamine, and the like.

By selectively using the first organic solvent and the second organic solvent in combination as described above, the peeling ability can be improved and the corrosion resistance of the metal wiring can be suppressed.

Preferably, at least one first organic solvent selected from secondary amines and at least one second organic solvent selected from secondary amines or tertiary amines can be used, and the first organic solvent and the second organic solvent It is preferably used in a weight ratio of 1.1: 1 to 4: 1.

In order to improve the peeling force of the photoresist, it is preferable to use a strongly alkaline amine having a high pH selectively. When the secondary and tertiary amines are used in combination, the pH range of the peeling liquid composition is 10 or more (10% Standard), preferably 10.5 or more, and more preferably 11 or more.

As described above, by selectively using amines, it is not necessary to separately add a corrosion inhibitor to the release liquid composition, or only a very small amount of corrosion inhibitor may be used.

When primary amines are used as the first organic solvent, it is preferable to add a very small amount of a corrosion inhibitor. Examples thereof include polyhydric alcohols containing two or more hydroxyl groups such as glycerin, sorbitol, xylitol, etc .; polyhydric alcohols such as tolyltriazole, , Triazoles such as carboxybenzotriazole, 1- [bis (hydroxyethyl) aminoethyl] tolyltriazole, 1-hydroxybenzotriazole (HBT), nitrobenzotriazole (NBT) Sorbitol, gluconic acid, and the like. Such a corrosion inhibitor may be composed of one or more components, and it is preferable that the corrosion inhibitor is used in an amount of 0 to 2% by weight based on the total exfoliant composition.

As described above, by using the release liquid composition in which the polar solvent containing the sol-gel and the specific amines are mixed, the photoresist can be completely peeled and dissolved and the re-adhesion of the photoresist to the surface can be minimized . In addition, since the corrosion inhibiting performance is excellent, it is not necessary to add an additional corrosion inhibitor or it is possible to suppress corrosion even if only a very small amount is added.

Accordingly, in a composition of amines, protonic solvents, aprotic polar solvents, and corrosion inhibitors used in general photoresist stripper compositions for TFT LC, a simple composition which can maximize the peeling performance by the addition of the socaretal, A photoresist stripping liquid composition for TFT LCD which can minimize the contents of Al and Cu corrosion inhibitors affecting the environment can be derived.

Hereinafter, preferred embodiments of the present invention will be described in order to facilitate understanding of the present invention. However, the following examples are for illustrative purposes only and are not intended to limit the scope of the present invention.

The meanings of the abbreviations used in the following table are referred to as the following compounds, and the release evaluation criteria and the corrosion evaluation standards are also indicated by the following criteria.

※ Abbreviation Meaning

NMP: N-methyl-2-pyrrolidone

BDG: diethylene glycol monobutyl ether

MEG: Monoethylene glycol

DIW: Deionized water

TT: tolyltriazole

MEA: monoethanolamine, MIPA: monoisopropanolamine, DEA: diethanolamine, MMEA: 2-methylaminoethanol, TEA: triethanolamine, MDEA: monomethyldiethanolamine

※ Peeling evaluation standard

⊚: Excellent peeling performance, ∘: Good peeling performance

△: poor peeling performance, Х: poor peeling performance

※ Corrosion inhibition performance evaluation standard

?: Excellent corrosion inhibition performance,?: Good corrosion inhibition

△: No corrosion inhibition performance, Х: No corrosion inhibition performance

< Example  1>

Table 1 shows the evaluation results of copper (Cu) and aluminum (Al) corrosion inhibiting performance and photoresist peeling performance according to composition ratios of primary amine, secondary amine and tertiary amine.

[Table 1]

As can be seen from Table 1, the corrosion inhibiting performance against copper and aluminum and the photoresist stripping performance may vary depending on the type and amount (weight) of the amine used.

The compositions 1-1 and 1-2 using a strong alkali primary amine alone showed excellent photoresist peeling performance but showed almost no copper and aluminum corrosion inhibition performance. The compositions 1-3 , 1-4, it can be seen that the corrosion inhibiting ability is not good or very little depending on the type of amine. In addition, the compositions 1-5 and 1-6 using the tertiary amine alone show good corrosion inhibiting performance but poor peeling performance.

In the case of compositions 1-7, 1-8, 1-9, 1-10 using a mixture of primary amine and secondary amine, there is almost no inhibition of aluminum corrosion inhibition, and copper corrosion inhibition The performance and the peeling performance are different.

In the case of compositions 1-11, 1-12, 1-13 and 1-14 in which primary amines and tertiary amines were used in combination, there was also almost no aluminum corrosion inhibition performance, and copper corrosion inhibition The performance and the peeling performance are different.

Mixing of Primary Amines to be Used When the amount of secondary or tertiary amines used is the same as that of the primary amine, the peeling performance is relatively poor. However, when the amount of primary amines is larger, . As a result, it can be seen that the primary amine having strong alkali activity contributes greatly to the peeling performance.

On the other hand, compositions 1-15, 1-16, 1-17 and 1-18 using both primary, secondary and tertiary carbides still have almost no corrosion inhibiting performance against aluminum, and when using them in the same amount, It can be seen that it is bad.

However, in the case of compositions 1-19, 1-20, 1-21, and 1-22 in which a secondary amine and a tertiary amine are mixed, it can be seen that the corrosion inhibiting ability is excellent both in copper and in aluminum. It can be seen that the peeling performance varies depending on the type and amount of the tertiary amine and the tertiary amine.

< Example  2>

In Example 2, the performance of the metal corrosion inhibiting performance and the photoresist peeling performance were evaluated when using sol-gel instead of MEG together with BDG as a polar solvent together with the type and amount of amine. The evaluation results are shown in Table 3 below.

[Table 2]

As can be seen from the above Table 2, the composition 2-1 is the same as the composition 1-3 in Table 1, except that a solketal is used instead of MEG.

As can be seen in Table 1, the composition 1-3 did not exhibit satisfactory corrosion inhibition performance against copper and aluminum, but also had poor peeling performance. However, as shown in Table 2, It can be seen that the photoresist peeling performance is improved by using the sol-gel.

In addition, the compositions 1-4 of Table 1 and 2-2 of Table 2 were only used differently for the polar solvent, and it can be confirmed that the use of the soleketal improves the aluminum corrosion inhibition performance.

Likewise, when the primary amine and the secondary amine are used in combination (compositions 2-3 and 2-4) and the primary amine and the tertiary amine are used in combination (compositions 2-5 and 2-6), a polar solvent It can be seen that the use of the sole ketal improves the aluminum corrosion inhibition performance and the peeling performance. Particularly, the compositions 2-3 to 2-6 exhibit the best peeling performance.

Also, it can be seen that the compositions 2-7 and 2-8 using a secondary amine and a tertiary amine as a solvent and using a solvent as a polar solvent improved the peeling performance as compared with the case where MEG was used as a polar solvent.

As a result, it can be confirmed that the addition of solketal to the peeling composition improves the corrosion inhibiting performance and the peeling performance for the metal.

< Example  3>

Table 3 shows the evaluation results of aluminum and copper corrosion inhibition performance with or without addition of the salketal when the peeling performance according to the composition ratio of amines was the best.

[Table 3]

It can be seen that the composition when the peeling performance is the best according to the composition ratio of amines in Table 2 is Composition 2-3, 2-4, 2-5, 2-6 and 2-8, and in Table 3, The characteristics were evaluated by dividing the case where the composition ratio of the best amines was maintained while the case where the sol -

As shown in Table 3, when the sol-ketal was used as a polar solvent and when it was not used, the corrosion inhibition performance of the metal was examined. The compositions 3-1, 3-2, 3-3, 3-4 and 3- (Composition 2-3, 2-4, 2-5, 2-6, 2-7 and 2-8) compared to the composition (Composition 2-3, 2-7 and 2-8) It can be confirmed that the corrosion inhibiting performance is improved.

Further, even when a secondary amine and a tertiary amine are used in combination, it can be confirmed that the corrosion inhibiting performance is improved when the solvent is used as a polar solvent.

As can be seen from Table 3, when the sol-ketal was used in combination with a polar solvent and a secondary amine and a tertiary amine (compositions 2-7 and 2-8), the corrosion resistance to copper and aluminum Suppression performance is also good. At this time, it is preferable that the weight ratio of the secondary amine to the tertiary amine is in the range of 1.1: 1 to 4: 1, preferably 2: 1 to 3: 1, more preferably 2: Good. When the total content of amines is fixed to a specific content, the peeling performance is relatively decreased when the weight ratio of the secondary amine and the tertiary amine is less than 2: 1, and when the weight ratio is more than 2: 1, have.

< Example  4>

The evaluation results of the aluminum / copper corrosion inhibiting performance and the photoresist peeling performance according to the soaketal content ratio are shown in Table 4 below.

[Table 4]

As can be seen in Table 4, when the amounts of the secondary amine, the tertiary amine, the nonionic polar solvent NMP and the DIW were kept the same, and when the quantitative polar solvent was used in an amount of 44% by weight based on the peeling liquid composition, When the composition ratio of the solvent is different, the metal corrosion inhibiting performance and the photoresist peeling performance are different.

For example, when 24% by weight of BDG and 20% by weight of sol-gel are used as an aprotic polar solvent as in Composition 4-1, it has been found that the peeling performance and the aluminum corrosion inhibition performance are the most excellent and the corrosion inhibition performance against copper is also good have.

Further, when comparing the composition 2-8 with the composition 4-1, it can be seen that the aluminum corrosion inhibition performance is improved as the amount of the sarkelet is increased. However, when 30 wt% of the sol-gel is used, the peeling performance is deteriorated as compared with 20 wt%. However, it can be seen that the copper corrosion inhibiting performance is rather improved in this case.

On the other hand, in the case of composition 4-3, in which the amount of sorketal is significantly higher than that of BDG, the corrosion inhibition performance against copper and aluminum is the best, but the photoresist peeling performance is lowered. Conversely, 4-4 shows that although the peeling performance is excellent, the aluminum corrosion inhibition performance is not so good.

Therefore, it can be seen that by controlling the amount of the sarkelet, the peeling performance and the metal corrosion inhibiting performance can be adjusted appropriately.

< Example  5>

The results of evaluating aluminum / copper corrosion inhibition performance by using the corrosion inhibitor are shown in Table 5 below.

[Table 5]

As can be seen from the above Table 5, the composition 4-1 using a salketalane without using an expensive corrosion inhibitor such as TT (tolyltriazole) and the compositions 5-1, 5-2, 5 -3, and 5-4, it can be seen that the use of the sol-calc is superior to the corrosion inhibition of both copper and aluminum.

In addition, when using both Solketal and TT as in Composition 5-5, even when only a very small amount of TT is used, it can be confirmed that the corrosion inhibition performance against copper and aluminum is excellent and the photoresist stripping performance is also excellent.

Accordingly, when the release liquid composition containing the sol-gel is used, it is not necessary to separately use an expensive corrosion inhibitor or even if only a very small amount of the corrosion inhibitor is used, the metal corrosion inhibition performance can be improved and the peeling performance can be improved .

While the present invention has been described with reference to exemplary embodiments, it is to be understood that the invention is not limited to the disclosed exemplary embodiments. Accordingly, the embodiments disclosed herein are intended to be illustrative rather than limiting, and the spirit and scope of the present invention are not limited by these embodiments. The scope of protection of the present invention should be construed according to the following claims, and all the techniques within the scope of the same should be construed as being included in the scope of the present invention.

Claims (11)

(2,2-dimethyl-1,3-dioxolan-4-yl) methanol; And
An organic solvent composed of a secondary amine and a tertiary amine,
Wherein the weight ratio of the secondary amine to the tertiary amine is 1.1: 1 to 4: 1. The method according to claim 1,
Wherein the photoresist stripping liquid composition further comprises a corrosion inhibitor in an amount of 0.01% by weight or less based on the total weight. 3. The method according to claim 1 or 2,
Wherein the (2,2-dimethyl-1,3-dioxolan-4-yl) methanol is 5-40 wt% based on the total weight of the composition. 3. The method according to claim 1 or 2,
wherein the pH is 10 or more (based on 10% water solution). 3. The method according to claim 1 or 2,
Wherein the weight ratio of the secondary amine to the tertiary amine is 2: 1. 3. The method according to claim 1 or 2,
(2, 2-dimethyl-1,3-dioxolan-4-yl) methanol is 20% by weight based on the total weight of the composition, the secondary amine is 4 wt%, the tertiary amines are 2 wt% Wherein the photoresist stripper liquid composition is a photoresist stripper liquid composition. 3. The method according to claim 1 or 2,
Wherein the secondary amines and the tertiary amines are in a chain type. 3. The method according to claim 1 or 2,
Wherein the secondary amine is at least one selected from the group consisting of diethanolamine, 2-methylamine ethanol, propyl-monoethanolamine and butylethanolamine,
Wherein the tertiary amine is at least one selected from the group consisting of triethanolamine, monomethyldiethanolamine, dimethylethanolamine, diethylethanolamine, ethyldiethanolamine, propyldiethanolamine and butyldiethanolamine. Resist stripper composition. 9. The method of claim 8,
Wherein said secondary amine is diethanolamine or 2-methylaminoethanol,
Wherein the tertiary amine is triethanol amine or monomethyl diethanol amine. 3. The method according to claim 1 or 2,
The polar solvent includes,
Methyl-2-pyrrolidone, sulfolane, 1,2-dimethylimidazole, 1,3-dimethyl-2-imidazolidinone, 1,3-dimethyl- (1H) -pyrimidinone, and N, N-dimethylpropionamide, and at least one non-polar polar solvent selected from the group consisting of tetrahydro-
Diethylene glycol monomethyl ether, diethylene glycol monobutyl ether, ethylene glycol butyl ether, ethylene glycol ethyl ether, ethylene glycol methyl ether, monoethylene glycol, diethylene glycol, triethylene glycol, tetraethyl Examples of the organic solvent include glycol, polyethylene glycol, dipropylene glycol monomethyl ether, dipropylene glycol monoethyl ether, dipropylene glycol monobutyl ether, propylene glycol butyl ether, propylene glycol ethyl ether, propylene glycol methyl ether, monopropylene glycol, dipropylene glycol, Propyleneglycol, tetrabutylglycol, and polybutyleneglycol. 10. The photoresist stripper composition according to claim 1, wherein the photopolymerization initiator is at least one selected from the group consisting of propylene glycol, tetrabutyl glycol, and polybutylene glycol. delete