KR101400157B1 - Apparatus, system and method for treating substrate - Google Patents

Abstract

The present invention relates to a substrate processing apparatus, a substrate processing apparatus and a substrate processing method, and more particularly, a substrate processing apparatus of a cluster structure, a substrate processing apparatus, and a substrate processing method using the same. According to one aspect of the present invention, there is provided a substrate processing apparatus comprising: a load port on which a container accommodating a substrate is mounted; A plurality of process modules for processing the substrate; A transfer module, disposed between the load port and the process module, for transferring the substrate between the process module and the container; And a buffer chamber disposed between the process modules adjacent to each other and providing a space in which the substrate is transported between adjacent process modules.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a substrate processing apparatus, a substrate processing apparatus,

The present invention relates to a substrate processing apparatus, a substrate processing apparatus, and a substrate processing method, and more particularly, to a substrate processing apparatus having a cluster structure, a substrate processing apparatus, and a substrate processing method using the same.

Semiconductor devices are manufactured by forming a circuit pattern on a substrate such as a silicon wafer through various processes including photolithography. These processes are performed in a chamber designed to perform the process, and thus the fabrication of the semiconductor device is carried out by repeating the process of bringing the substrate into the chamber and carrying out the process, and bringing the substrate into another chamber for another process.

In recent years, with the miniaturization of semiconductor devices, semiconductor devices have been manufactured through more complicated processes than before, and accordingly, the time required for transporting the substrates between the chambers during the total manufacturing time of the semiconductor devices is gradually increased have.

In this trend, studies on lay-out of a semiconductor manufacturing facility which can reduce the unnecessary transportation process and process the process continuously have been actively carried out in order to improve the substrate throughput of the substrate.

An object of the present invention is to provide a substrate processing apparatus, a substrate processing apparatus, and a substrate processing method that minimize the transfer of an unnecessary substrate.

The problems to be solved by the present invention are not limited to the above-mentioned problems, and the problems not mentioned can be clearly understood by those skilled in the art from the description and the accompanying drawings will be.

The present invention provides a substrate processing apparatus.

According to one aspect of the present invention, there is provided a substrate processing apparatus comprising: a load port on which a container accommodating a substrate is mounted; A plurality of process modules for processing the substrate; A transfer module, disposed between the load port and the process module, for transferring the substrate between the process module and the container; And a buffer chamber disposed between the process modules adjacent to each other and providing a space in which the substrate is transported between adjacent process modules.

Wherein the load port, the transfer module, and the process module are sequentially disposed along a first direction, and the plurality of process modules are arranged in a first direction perpendicular to the first direction, As shown in FIG.

The process module includes a transfer chamber for transferring the substrate between chambers disposed therearound, a process chamber disposed around the transfer chamber for performing a process for the substrate, and a transfer chamber for transferring the transfer chamber between the transfer module and the transfer chamber And a buffer chamber disposed between the transfer chambers of the process modules adjacent to each other.

The buffer chamber may provide a buffer space in which the substrate transferred between the adjacent process modules temporarily remains.

The buffer chamber may include a housing, a support member installed in the housing, and a rotating member rotating the substrate placed on the support member.

The buffer chamber may include a housing, a support member installed in the housing, a support member on which the substrate is placed, and a plasma supplier for supplying plasma to the housing.

The buffer chamber may include a plurality of housings vertically stacked.

The present invention provides a substrate processing facility.

An aspect of the substrate processing apparatus according to the present invention is a substrate processing apparatus including a load port on which a container accommodating a substrate is mounted, a process module for processing the substrate, and a process chamber disposed between the load port and the process module, A plurality of substrate processing apparatuses including a transfer module for transferring the substrate; And a first buffer chamber disposed between the adjacent substrate processing apparatuses and providing a space for transporting the substrate between the adjacent substrate processing apparatuses, A transfer chamber for transferring a substrate, a process chamber disposed around the transfer chamber for performing a process on the substrate, and a load lock chamber disposed between the transfer module and the transfer chamber, The chamber may be disposed between transfer chambers of the adjacent substrate processing apparatuses.

The load port, the transfer module, and the process module may be sequentially arranged along a first direction, and the plurality of substrate processing apparatuses may be arranged in a line in a second direction perpendicular to the first direction.

The first buffer chamber may provide a buffer space in which the substrate transferred between the adjacent substrate processing apparatuses temporarily remains.

The first buffer chamber may include a housing, a support member installed in the housing, and a rotating member for rotating the substrate placed on the support member.

The first buffer chamber may include a housing, a support member installed in the housing, a support member on which the substrate is placed, and a plasma supplier for supplying plasma to the housing, and may perform a plasma process.

The first buffer chamber may include a plurality of housings vertically stacked.

Wherein the substrate processing apparatus includes a plurality of process modules included in the substrate processing apparatus, the substrate processing apparatus being disposed between process modules adjacent to each other and belonging to the same substrate processing apparatus, And a second buffer chamber for providing a second buffer chamber.

The process module includes a transfer chamber for transferring the substrate between chambers disposed therearound, a process chamber disposed around the transfer chamber for performing a process for the substrate, and a transfer chamber for transferring the transfer chamber between the transfer module and the transfer chamber And the second buffer chamber may be disposed between the process modules adjacent to each other.

The present invention can provide a substrate processing method.

One aspect of the substrate processing method according to the present invention is a substrate processing apparatus including: a load port on which a container containing a substrate is mounted; A transfer module for withdrawing the substrate from the container; A plurality of process modules arranged in a line on one side of the transfer module; And a buffer chamber disposed between adjacent process modules, the method comprising: transferring the substrate from the container to a first one of the plurality of process modules; The first process module performing a process; And transporting the substrate from the first process module to a first buffer chamber disposed between the first process module and a second process module adjacent to the first process module; Transporting the substrate from the first buffer chamber directly to the second process module; And performing a process of the second process module.

The substrate processing method may further include a step in which the transport module transports the substrate from the second process module to the container.

The substrate processing method comprising: transporting the substrate from the second process module to a second buffer chamber disposed between the second process module and a third process module adjacent to the second process module; Transporting the substrate from the second buffer chamber directly to the third process module; And performing the process of the third process module.

Another aspect of the substrate processing method according to the present invention includes a load port on which a container containing a substrate is mounted, a transfer module for withdrawing the substrate from the container, and a process module disposed on one side of the transfer module, A plurality of substrate processing apparatuses arranged; And a buffer chamber disposed between the substrate processing apparatuses adjacent to each other, the substrate processing apparatus comprising: a first substrate processing apparatus for withdrawing the substrate from the vessel; The first substrate processing apparatus performing a processing process; Transporting the substrate from the first substrate processing apparatus to a first buffer chamber disposed between the first substrate processing apparatus and a second substrate processing apparatus adjacent thereto; Transporting the substrate from the first buffer chamber directly to the second substrate processing apparatus; And performing the process of the second substrate processing apparatus.

The substrate processing method may further include the step of the second substrate processing apparatus housing the substrate into the container.

The substrate processing method comprising the steps of: transporting the substrate from the second substrate processing apparatus to a second buffer chamber disposed between the second substrate processing apparatus and a third substrate processing apparatus adjacent to the second substrate processing apparatus; Transporting the substrate from the second buffer chamber directly to the third substrate processing apparatus; And the third substrate processing apparatus performing the processing step.

One aspect and another aspect of the substrate processing method according to the present invention may further include: the buffer chamber rotating the substrate.

One aspect and another aspect of the substrate processing method according to the present invention may further include the step of the buffer chamber performing a subsequent process or a preceding process of the process.

The process performed by the buffer chamber may be a process for removing foreign substances remaining on the substrate, which are generated in the process.

According to the present invention, the substrate can be transported directly between the process modules through the buffer chamber, thereby shortening the transport path of the substrate and improving the process efficiency.

According to the present invention, the substrate can be transferred between the substrate processing apparatuses directly through the buffer chamber without passing through an external transfer apparatus such as overhead transfer (OHT) between the substrate processing apparatuses, The process efficiency is improved.

According to the present invention, a buffer chamber utilized as a space for transporting a substrate can also effectively perform a footprint by performing a process in a transporting process, and as a result, the substrate throughput is improved.

According to the present invention, a process can be continuously performed by performing a preceding or following process of a process performed in a process chamber in a buffer chamber utilized as a space for transferring a substrate.

According to the present invention, the substrate can be cleaned by a plasma process in the buffer chamber to remove foreign substances generated in a previous process, so that the substrate can be directly supplied to a subsequent process.

The effects of the present invention are not limited to the above-mentioned effects, and the effects not mentioned can be clearly understood by those skilled in the art from the present specification and attached drawings.

1 is a plan view of one embodiment of a substrate processing apparatus.
2 is a plan view of another embodiment of the substrate processing apparatus.
3 is a cross-sectional view of the load lock chamber of FIG. 1 in the AA direction.
4 is a cross-sectional view of the load lock chamber of Fig. 1 in the BB direction.
5 is a cross-sectional view of one embodiment of the buffer chamber of FIG.
6 is a cross-sectional view of another embodiment of the buffer chamber of FIG.
Figure 7 is a cross-sectional view of another embodiment of the buffer chamber of Figure 1;
Figure 8 is a top view of one embodiment of a substrate processing facility.
Figure 9 is a top view of another embodiment of a substrate processing facility.
10 is a plan view of another embodiment of a substrate processing facility.
11 is a flowchart of one embodiment of a substrate processing method.
Figs. 12 and 13 are operation diagrams of the substrate processing method of Fig.
14 is a flowchart of another embodiment of the substrate processing method.

The terms and accompanying drawings used herein are for the purpose of illustrating the present invention easily, and the present invention is not limited by the terms and drawings.

The detailed description of known techniques which are not closely related to the idea of the present invention among the techniques used in the present invention will be omitted.

Hereinafter, a substrate processing apparatus 1000 according to the present invention will be described.

The substrate processing apparatus 1000 according to the present invention can perform a process on the substrate S. Here, the process may include all the steps necessary for manufacturing a semiconductor device, a flat panel display (FPD), and other objects in which a circuit is formed on a thin film. In addition, the substrate S may also include all of the semiconductor devices, flat panel displays, and other substrates used in the fabrication of thin film circuit-formed objects. For example, the substrate S may be a variety of wafers including silicon wafers, organic substrates, glass substrates, and the like.

Hereinafter, one embodiment of the substrate processing apparatus 1000 will be described.

1 is a plan view of one embodiment of a substrate processing apparatus 1000. As shown in FIG.

Referring to FIG. 1, a substrate processing apparatus 1000 includes a load port 1110, a transfer module 1100, a plurality of process modules 1200, and a buffer chamber 2000. In the load port 1110, a container C in which the substrate S is accommodated is placed. The transport module 1100 transports the substrate S between the container C placed in the load port 1110 and the process module 1200. Process module 1200 processes substrate S. The buffer chamber 2000 is disposed between the process modules 1200 adjacent to each other to provide a space in which the substrates S are transported between the process modules 1200.

The container C is mounted on the load port 1110. The container C can be carried from the outside and loaded into the load port 1110 or unloaded from the load port 1110 and can be transported out. For example, the container C may be transported between the substrate processing apparatuses 1000 by a transporting means such as overhead transfer. Here, the conveyance of the substrate S may be performed by an operator or other conveying means such as an automatic guided vehicle, a rail guided vehicle or the like instead of the overhead transfer.

A container S is accommodated in the container C. The container C may be a front opening unified pod (FOUP). The front open integral pod can accommodate generally 25 substrates S therein. The inside of the container C can be sealed so that the substrate S inside the container C can be prevented from being contaminated.

The load port 1110 may be disposed adjacent to the transfer module 1100. For example, three load ports 1110 may be arranged in a row along a first direction X on one side of the housing 1120 of the transport module 1100, as shown in FIG. Of course, the arrangement and number of load ports 1110 may be different.

The transfer module 1100 transfers the substrate S between the container C and the process module 1200. The transfer module 1100 may be disposed between the load port 1110 and the process module 1200 to carry the substrate S thereon. The transfer module 1100 may include a housing 1120, a transfer robot 1130, and a transfer rail 1140.

The housing 1120 forms an outer wall of the transfer module 1100 and isolates the inner space of the transfer module 1100 from the outside. The housing 1120 may be provided in a rectangular parallelepiped shape. Of course, the shape of the housing 1120 can be appropriately changed as needed.

The housing 1120 is disposed between the load port 1110 and the process module 1200. Accordingly, one side of the housing 1120 is connected to the load port 1110, and the other side is connected to the process module 1200.

An opening for exchanging the container C mounted on the load port 1110 with the substrate S is formed at the one side of the housing 1120 connected to the load port 1110 and a door for opening and closing the opening is provided . The other side of the housing 1120 connected to the process module 1200 is connected to the load lock chamber 1210 of the process module 1200.

A fan filter (not shown) may be installed on the upper surface of the housing 1120 to rectify the air flowing into the housing 1120. Thus, the air rectified in the inner space of the housing 1120 flows vertically downward, so that the interior of the housing 1120 can be kept clean.

The transfer robot 1130 directly holds the substrate S and transfers it between the container C and the process module 1200. The transfer robot 1130 exchanges the container C and the substrate S through one side of the housing 1120 and transfers the substrate S to the processing module 1200 through the load lock chamber 1210 connected to the other side of the housing 1120, (S) can be exchanged.

The transfer robot 1130 is installed inside the housing 1120 and can move along the transfer rail 1140. Here, the conveying rail 1140 can provide a moving path of the conveying robot 1130. The transfer rail 1140 may be disposed in the housing 1120 along the first direction X. [ It is needless to say that the transferring rail 1140 is not limited to the above example and that the transferring rail 1140 is arranged in the other direction or the transferring rail 1140 is omitted and the transferring robot 1130 is disposed at the inner central portion of the housing 1120 Or may be fixedly installed.

Such a transfer robot 1130 may have a base, a body, an arm, and a hand. The base is installed on the conveying rail 1140 and can move along the conveying rail 1140. The body is coupled to the base and can move along the vertical direction on the base or rotate about the vertical direction. The arm is mounted on the body and can move forward and backward. A hand may be provided at one end of the arm to hold or place the substrate S. The arm may be one or a plurality of arms, and the arms are stacked on the body in the vertical direction, and can be operated individually.

The transfer robot 1130 moves the base along the transfer rail 1140 and controls the position of the hand in accordance with the operation of the body and the arm and the hand draws the substrate S from the container C, (S) from the process module 1200 and store it in the container (C). On the other hand, the container C can be mounted in the sealed state in the load port 1110, and a container opener for opening and closing the container C can be provided inside the housing 1120. When the container C is opened by the container opener, the transfer robot 1130 will be able to hold the substrate S accommodated therein.

The process module 1200 performs a process of processing the substrate S. The process modules 1200 may be provided in a plurality in the substrate processing apparatus 1000 and each of the process modules 1200 may be arranged in a line in the first direction X on the other side of the transfer module 1100 .

1 illustrates that the substrate processing apparatus 1000 has two process modules 1200, the number of process modules 1200 included in the substrate processing apparatus 1000 may be different.

2 is a plan view of another embodiment of the substrate processing apparatus 1000. Fig. Referring to FIG. 2, the substrate processing apparatus 1000 may be provided with three or more processing modules 1200.

Each process module 1200 includes a load lock chamber 1210, a transfer chamber 1220, and a process chamber 1230. Here, the load port 1110, the transfer module 1100, the load lock chamber 1210, and the transfer chamber 1220 are sequentially arranged in a second direction Y perpendicular to the first direction X, As shown in FIG. The load lock chamber 1210 is disposed on the other side of the transfer module 1100 and provides a space for exchanging the substrate S between the transfer module 1100 and the process module 1200. The transfer chamber 1220 transports the substrate S between the chambers disposed therearound. The process chamber 1230 is disposed around the transfer chamber 1220 to perform the process.

The load lock chamber 1210 is disposed between the transfer module 1100 and the transfer chamber 1220 to provide a space for exchanging the substrate S between the transfer module 1100 and the transfer chamber 1220. The load lock chambers 1210 of the plurality of process modules 1200 may be arranged in a line along the first direction X on the other side of the transfer module 1100. In addition, one process module 1200 may include a plurality of load lock chambers 1210 arranged vertically stacked on one another.

3 is a cross-sectional view taken along the A-A direction of the load lock chamber 1210 of FIG. 1, and FIG. 4 is a cross-sectional view taken along the B-B direction of the load lock chamber 1210 of FIG.

3 and 4, the load lock chamber 1210 may include a housing 1211, a support slot 1212, and a pressure-reducing member 1213.

The housing 1211 forms an outer wall of the load lock chamber 1210 and isolates the inner space from the outside. The substrate S exchanged between the transfer module 1100 and the transfer chamber 1220 may temporarily remain inside the housing 1211. [

One side of the housing 1211 is connected to the other side of the transfer module 1100 and the other side of the housing 1211 is connected to the transfer chamber 1220. One side and the other side of the housing 1211 are provided with openings through which the substrate S enters and exits, respectively, and doors for opening and closing the openings are provided.

A support slot 1212 is formed in the inner wall of the housing 1211. The support slots 1212 may be provided in the shape of a pair of spaced apart plates to support the edge of the substrate S. [ The transfer robot 1130 of the transfer module 1100 or the transfer robot 1222 of the transfer chamber 1220 moves vertically along the spaced space between both plates to place the substrate S in the support slot 1212 The substrate S can be picked up from the support slot 1212.

Such support slots 1212 may be one or more. The plurality of support slots 1212 may be formed on the inner wall of the housing 1211 so as to be vertically spaced from each other.

The pressure-reducing member 1213 can decompress the inside of the housing 1211. [ The pressure reducing member 1213 may include a pressure reducing pump and a pump line. Here, the decompression pump generates negative pressure using an external power source, and the pump line connects the decompression pump and the housing 1211, so that the air in the housing 1211 can be sucked in accordance with the negative pressure generated in the decompression pump.

Generally, the interior of the transfer module 1100 is atmospheric, while the interior of the chambers of the process module 1200 may be maintained at a sub-atmospheric pressure, for example vacuum, to provide conditions suitable for performing the process, The load lock chamber 1210 can prevent air from flowing into the processing module 1200 during transportation of the substrate S therebetween.

The load lock chamber 1210 closes the housing 1211 when the substrate S is carried from the transfer module 1100 and makes the inside of the vacuum chamber 1213 into a vacuum state by the pressure reducing member 1213. Then the other side of the housing 1211 To provide a transfer chamber (1220) with a substrate (S). With this procedure, the internal pressure of the process module 1200 can be maintained at the vacuum pressure.

The transfer chamber 1220 transports the substrate S between the chambers disposed around the transfer chamber 1220. A load lock chamber 1210, a process chamber 1230, and a buffer chamber 2000 may be disposed around the transfer chamber 1220. Specifically, the load lock chamber 1210 is disposed between the transfer chamber 1220 and the transfer module 1100, and the buffer chamber 2000 is disposed between the transfer chambers 1220 of the plurality of process modules 1200 And the process chamber 1230 may be disposed around other transfer chambers 1220. [

The transfer chamber 1220 has a housing 1221 and a carrying robot 1222.

The housing 1221 forms the outer wall of the transfer chamber 1220. The chambers 1210, 1230, and 2000 disposed around the transfer chamber 1220 are connected to the housing 1221.

The transfer robot 1222 is fixed to the center of the housing 1221 and transfers the substrate S between the chambers 1210, 1230 and 2000 around the transfer chamber 1220. The transfer robot 1222 has a base, a body, an arm, and a hand. The transfer robot 1222 is similar in construction to the transfer robot 1130 except that the base is fixed to the center of the transfer chamber 1220.

The process chamber 1230 performs the process. Representative examples of the process performed in the process chamber 1230 include an etching process, a peeling process, an ashing process, a strip process, and a deposition process. Of course, this is not a limitation of the process performed by the process chamber 1230 as described above.

Each process module 1200 may include one or more process chambers 1230. The plurality of process chambers 1230 may be disposed around the transfer chamber 1220 to receive the substrate S through the transfer robot 1222. Here, the plurality of process chambers 1230 belonging to the same process module 1200 can all perform the same process. In addition, the process chambers 1230 belonging to different process modules 1200 can perform processes different from each other. Of course, in some cases, the process chambers 1230 of the same process module 1200 perform different processes, or conversely, the process chambers 1230 belonging to different process modules 1200 may perform the same process.

The process chamber 1230 may include a known configuration provided for the process, depending on the process each is performing.

The buffer chamber 2000 is disposed between process modules 1200 adjacent to each other. Specifically, the transfer chamber 1220 of the one process module 1200, the buffer chamber 2000, and the transfer chamber 1220 of the other process module 1200 may be sequentially disposed along the first direction X . The buffer chamber 2000 thus arranged provides a space in which the substrate S is transported between the processing modules 1200. That is, the substrate S may be processed in one processing module 1200 and then transferred directly to another processing module 1200 through the buffer chamber 2000. Generally, in order to transport the substrate S from one process module 1200 to another process module 1200, it must pass through the transfer module 1100. If it is possible to move directly through the buffer chamber 2000, S can be removed.

The buffer chamber 2000 may serve merely as a passageway for transporting the substrate S or may serve as a passageway and perform a process on the substrate S. [

5 is a cross-sectional view of one embodiment of the buffer chamber 2000 of FIG.

Referring to FIG. 5, one embodiment of the buffer chamber 2000 may simply serve as a path for transporting the substrate S.

The buffer chamber 2000 includes a housing 2100 and a support member 2200 and may further optionally include a rotary member 2300 and a pressure-reducing member 2400.

The housing 2100 forms the outer wall of the buffer chamber 2000 and is disposed between the housings 1221 of the transfer chamber 1220 of the process module 1200 adjacent to each other. On one side and the other side of the housing are formed openings through which the substrate S enters and exits, respectively, and doors for opening and closing the openings are provided.

The support member 2200 supports the substrate S. The support member 2200 is installed at the center of the housing 2100. The upper surface of the support member 2200 is provided in a shape similar to that of the substrate S and may be provided equal to or larger than the area of the substrate S. [ The support member 2200 may also include a lift pin to move the substrate S up and down so that the transfer robot 1222 can easily hold the substrate S. [ In some cases, the support member 2200 may be provided similar to the support slot 1212 of the load lock chamber 1210.

The rotating member 2300 rotates the substrate S that is seated on the supporting member 2200. It is necessary to align the direction of the substrate S when the substrate S is exchanged between the processing modules 1200. The rotating member 2300 can align the substrate S by rotating the substrate S . The rotary member 2300 may be formed of a rotary motor and a rotary shaft. The rotary motor generates a rotary force, and the rotary shaft is connected to the rotary motor and the support member 2200 to rotate the support member 2200 So that the substrate S placed on the substrate S can be rotated.

The pressure-reducing member 2400 can decompress the interior of the housing 2100. The pressure reducing member 2400 may reduce the pressure inside the housing 2100 so that the processing module 1200 having the high internal pressure of the processing module 1200 It is possible to prevent air from flowing into the process module 1200 having a low internal pressure. The configuration of the pressure-reducing member 2400 may be similar to that of the pressure-reducing member 1213 of the load lock chamber 1210, so that detailed description thereof will be omitted.

On the other hand, when the internal pressures of the process modules 1200 are equal to each other, the pressure reducing member 2400 may be omitted in the buffer chamber 2000. Since the housing 2100 does not need to be hermetically closed, Can be omitted.

6 is a cross-sectional view of another embodiment of the buffer chamber 2000 of FIG.

The buffer chamber 2000 may serve as a path between the process modules 1200 and perform a process on the substrate S. [ Here, the process performed by the buffer chamber 2000 may be a pre-process or a post-process of the process performed in the process chamber 1230. Hereinafter, the buffer chamber 2000 performs a cleaning process, in particular, a cleaning process using plasma. However, the process performed by the buffer chamber 2000 may be varied, and is not limited to the above example. When the buffer chamber 2000 is thus processed, more processing chambers 1230 for performing other processes in place of the process chambers 1230 for performing the processes performed in the buffer chambers 2000 are arranged in the same footprint And space efficiency is improved.

6, another embodiment of the buffer chamber 2000 may include a housing 2100, a support member 2200, a heating member 2500, and a plasma feeder 2600.

Since the housing 2100 and the support member 2200 have been described in the embodiment of the buffer chamber 2000, a detailed description thereof will be omitted.

The heating member 2500 can heat the substrate S that is seated on the support member 2200. [ For example, the heating member 2500 may be a heater or a hot gas line formed at one side of the housing 2100 embedded in the outer wall of the housing 2100 or the support member 2200 to supply the hot gas to the housing 2100 Lt; / RTI > When the substrate S is heated by the heating member 2500, the foreign substance remaining on the substrate S can be removed from the substrate S. Here, the foreign matter may be generated in the process preceding the process chamber 1230.

The plasma feeder 2600 may provide plasma within the housing 2100. The buffer chamber 2000 can perform the plasma process using this plasma. For example, the buffer chamber 2000 may perform a plasma ashing process or a plasma cleaning process. However, the buffer chamber 2000 may perform another process instead of the plasma process. In this case, the plasma supply device 2600 may be changed to another configuration. For example, when the process is performed using a chemical or a gas, a chemical feeder or a gas feeder may be installed in the housing 2100 instead of the plasma feeder 2600.

The plasma feeder 2600 may include a plasma source 2610, a feed tube 2620, and a showerhead 2630.

The plasma source 2610 generates a plasma. For example, the plasma source 2610 may be a remote plasma generator, a capacitively coupled plasma generator (CCP), or an inductively coupled plasma generator (ICP).

Among these, the remote plasma generator is located outside the housing 2100, and can generate plasma using gas supplied from a gas supply source (not shown). The supply pipe 2620 supplies the generated plasma to the inside of the housing 2100. The showerhead 2630 is installed at one end of the supply pipe 2620 and the plasma supplied through the supply pipe 2620 may be injected into the housing 2100 through the showerhead 2630.

In the case of a capacitively coupled plasma generator or an inductively coupled plasma generator, a plasma source may be installed inside the housing 2100 or on the outer wall of the housing 2100. In this case, the supply pipe 2620 receives gas from an external gas supply source (not shown) and supplies the gas to the inside of the housing 2100, and the plasma source 2610 can generate plasma using the gas.

7 is a cross-sectional view of another embodiment of the buffer chamber 2000 of FIG.

In the above description, the buffer chamber 2000 is realized as a single housing 2100. However, the buffer chamber 2000 may be provided in a structure in which a plurality of housings are stacked. When the buffer chamber 2000 is stacked as described above, more buffer chambers 2000 can be disposed in the same footprint, and space efficiency can be improved.

Referring to FIG. 7, the buffer chamber 2000 may include a plurality of housings 2100. The plurality of housings 2100 may each have an arrangement of any one of the embodiments of the buffer chamber 2000 or the buffer chamber 2000 described above.

For example, the buffer chamber 2000 may include an upper housing 2100a and a lower housing 2100b, which are stacked on top of each other. Here, only the supporting member 2200b and the rotating member 2300 are provided in the lower housing 2100b so as to perform a function of simply providing a path for moving the substrate S between the processing modules 1200 or aligning the substrate S. [ Lt; / RTI > The upper housing 2100a may also include a support member 2200a, a heating member 2500 and a plasma feeder 2600 to provide a path of movement and to perform the process.

Of course, in some cases, the upper housing 2100a and the lower housing 2100b may both function as passages, or both may serve as a passageway and perform a process. Further, the number of the housings 2100 to be laminated may be three or more It is possible.

Hereinafter, a substrate processing apparatus 100 according to the present invention will be described.

The substrate processing apparatus 100 according to the present invention may include a plurality of substrate processing apparatuses 1000 and a buffer chamber 2000. Here, the substrate processing apparatus 1000 can perform different processes.

Hereinafter, one embodiment of the substrate processing apparatus 100 will be described.

8 is a plan view of one embodiment of the substrate processing facility 100. FIG.

8, in an embodiment of the substrate processing apparatus 100, a plurality of substrate processing apparatuses 1000 are arranged in a first direction X and a buffer chamber 2000 is arranged in a plurality of substrate processing apparatuses 1000 disposed adjacent to each other. Accordingly, one substrate processing apparatus 1000, the buffer chamber 2000, and the other substrate processing apparatus 1000 are sequentially disposed along the first direction X. [

In each substrate processing apparatus 1000, a load port 1110, a transfer module 1100, and a plurality of process modules 1200 are arranged in a second direction Y, and one process of the substrate processing apparatus 1000 The transfer chamber 1220 of the module 1200, the buffer chamber 2000 and the transfer chamber 1220 of the other process module 1200 are arranged in the first direction X. [ Since the substrate processing apparatus 1000 has already been described above, a detailed description thereof will be omitted.

The buffer chamber 2000 may be provided in the same or similar structure as the buffer chamber 2000 disposed between the plurality of process modules 1200.

The buffer chamber 2000 disposed between the substrate processing apparatuses 1000 adjacent to each other in the substrate processing apparatus 100 is provided with a substrate processing apparatus 1200 for providing a space for transporting the substrate S between the processing modules 1200, Thereby providing a space in which the substrate S is transported. This buffer chamber 2000 is disposed between the transfer chamber 1220 of one substrate processing apparatus 1000 and the transfer chamber 1220 of another substrate processing apparatus 1000 disposed adjacent thereto. The buffer chamber 2000 is connected to the transfer chamber 1220 of one substrate processing apparatus 1000 and the transfer chamber 1220 of another substrate processing apparatus 1000 disposed adjacent thereto.

8 shows that the substrate processing apparatus 100 has two substrate processing apparatuses 1000. However, the number of the substrate processing apparatuses 1000 included in the substrate processing apparatus 100 may be different , And the configuration of the substrate processing apparatus 1000 may also be different from those described above.

9 is a plan view of another embodiment of the substrate processing facility 100. FIG.

The substrate processing apparatus 1000 provided in the substrate processing apparatus 100 necessarily includes a plurality of processing modules 1200 and a buffer chamber 2000 disposed therebetween, The present invention is not limited to the embodiment.

9, the substrate processing apparatus 1000 included in the substrate processing apparatus 100 includes a load port 1110, a transfer module 1100, and a process module 1200, The buffer chamber 2000 disposed between the modules 1200 may be omitted.

10 is a plan view of another embodiment of the substrate processing apparatus 100. Fig. Referring to FIG. 9, the substrate processing apparatus 100 may be provided with three or more substrate processing apparatuses 1000. FIG.

Hereinafter, the substrate processing apparatus 1000 and the substrate processing apparatus 100 according to the present invention will be described with reference to the substrate processing method according to the present invention.

The substrate processing method according to the present invention is not limited to the substrate processing apparatus 1000 and the substrate processing apparatus 100 described above, Device. ≪ / RTI >

Hereinafter, one embodiment of the substrate processing method will be described. One embodiment of the substrate processing method relates to a method of processing a substrate S in the substrate processing apparatus 1000. [

11 is a flowchart of one embodiment of a substrate processing method.

11, a substrate processing method includes a step S110 of transferring a substrate S from a container C to a load lock chamber 1210a of a first processing module 1200a, A step S120 of transferring the substrate S from the load lock chamber 1210a to the process chamber 1230a, a step S130 of performing the process of the process chamber 1230a of the first process module 1200a, (S140) transferring the substrate S from the process chamber 1230a of the process module 1200a to the buffer chamber 2000 and transferring the substrate S from the buffer chamber 2000 to the process chamber 1230b of the second process module 1200b A step S160 of carrying the substrate S to the processing chamber 1230b of the second processing module 1200b and a step S160 of performing the processing of the processing chamber 1230b of the second processing module 1200b Step S170 of transferring the substrate S to the load lock chamber 1210b of the first process module 1200b and step S180 of housing the substrate S in the container C. It should be noted, however, that the above-described steps do not necessarily have to be performed in accordance with the described order, and the steps described later may be performed before the steps described above, which is also true in other embodiments of the substrate processing method described later. Hereinafter, each of the above-described steps will be described.

Figs. 12 and 13 are operation diagrams of the substrate processing method of Fig.

12, the transfer module 1100 transfers the substrate S from the container C to the load lock chamber 1210a of the first process module 1200a (S110). When the container opener opens the container C, the transfer robot 1130 takes out the substrate S from the container C. [ The door of the load lock chamber 1210a opens the opening connected to the transfer module 1100 and the transfer robot 1130 places the substrate S in the support slot 1212. [ When the substrate S is carried into the load lock chamber 1210a, the housing 1211 is closed, and the pressure-sensitive member 1213 applies vacuum pressure inside. When the interior is evacuated, the opening associated with the transfer chamber 1220a of the load lock chamber 1210a is opened.

The transfer chamber 1220a transfers the substrate S from the load lock chamber 1210a of the first process module 1200a to the process chamber 1230a at step S120. When the opening of the load lock chamber 1210a is opened, the transfer robot 1222a takes out the substrate S from the load lock chamber 1210a and brings it into the process chamber 1230a.

When the substrate S is loaded, the process chamber 1230a of the first process module 1200a performs the process (S130).

When the process is completed, the transfer chamber 1220a transfers the substrate S from the process chamber 1230a of the first process module 1200a to the buffer chamber 2000 (S140). The transfer robot 1222a draws the substrate S from the process chamber 1230a and seats the substrate S on the support member 2200 when the door of the buffer chamber 2000 is opened.

When the substrate S is mounted on the support member 2200, the buffer chamber 2000 can align the substrate S (S141) or perform the process (S142). For example, the rotating member 2300 can rotate the direction of the substrate S by rotating the supporting member 2200. [ In another example, when the substrate S is mounted on the support member 2200, the plasma supplier 2600 may supply the plasma to the housing 2100 to perform the plasma process. At this time, the heating member 2500 may heat the substrate S. By performing such a plasma process, foreign matter generated on the substrate S in the process chamber 1230a can be removed.

Of course, step S141 or S142 may be omitted if the buffer chamber 2000 serves merely as a passageway, and in some cases, the buffer chamber 2000 may perform the same process as the alignment of the substrate S . Further, the buffer chamber 2000 may perform another process instead of the plasma process.

The transfer chamber 1220b of the second process module 1200b transfers the substrate S from the buffer chamber 2000 to the process chamber 1230b of the second process module 1200b at step S150. The transfer chamber 1220b can take the substrate S from the buffer chamber 2000 and bring it into the process chamber 1230b of the second process module 1200b. Here, the second process module 1200b is a process module 1200 adjacent to the first process module 1200a and the buffer chamber 2000.

When the substrate S is loaded, the process chamber 1230b of the second process module 1200b performs the process (S160). Here, the process performed by the process chamber 1230b may be a process different from the process performed in the process chamber 1230a of the first process module 1200a. In the case where the cleaning process is performed using the plasma or the like in the buffer chamber 2000, the substrate S is carried in a state in which the foreign substances are removed from the substrate S, so that the process can be efficiently performed.

The transfer chamber 1220b transports the substrate S from the process chamber 1230b of the second process module 1200b to the load lock chamber 1210b of the second process module 1200b at step S170, ) Draws the substrate S from the load lock chamber 1210b and stores the substrate S in the container C (S180). In this way, the substrate S passes through the first process module 1200a, the buffer chamber 2000, and the second process module 1200b, respectively, and each chamber can process the substrate S.

In the absence of the buffer chamber 2000, the substrate S is returned from the first process module 1200a to the transfer module 1100 through the load lock chamber 1210a, Since the substrate S is transported to the second process module 1200b via the second process module 1210b according to the present invention, the process of transporting the unnecessary substrate S is omitted, thereby shortening the processing time of the substrate S. As a result, The throughput can be improved.

Here, in some cases, the substrate S may be returned to the first process module 1200a through the buffer chamber 2000 after the process is completed in the second process module 1200b (S160) (S170a ). The first process module 1200a may perform the process again on the substrate S (S180a).

13, a third process module 1200c is sequentially disposed on the first process module 1200a and the second process module 1200b along the first direction X to the substrate processing apparatus 1000, The substrate S is returned to the transfer module 1100 after the process is completed in the process chamber 1230b of the second process module 1200b (S160). Instead of returning the substrate S to the transfer module 1100, the second process module 1200b The substrate S may be transferred to the third process module 1200c through the buffer chamber 2000 located between the third process module 1200c and the third process module 1200c in step S170b. The substrate S is moved to the process chamber 1230c of the third process module 1200c without passing through the transfer module 1100 in step S180b and the third process module 1200c is moved on the substrate S, (Step S190b).

Hereinafter, another embodiment of the substrate processing method will be described. Another embodiment of the substrate processing method relates to a method of processing the substrate S in the substrate processing facility 100. [

14 is a flowchart of another embodiment of the substrate processing method.

14, the substrate processing method includes a step S210 of processing the substrate S by the first substrate processing apparatus 1000a, a step S302 of processing the substrate S from the first substrate processing apparatus 1000a to the buffer chamber 2000, (S230) in which the substrate S is transferred from the buffer chamber 2000 to the second substrate processing apparatus 1000b, and the second substrate processing apparatus 1000b processes the substrate S (Step S240). Each step will be described below.

When the container C is placed on the load port 1110 of the first substrate processing apparatus 1000a from the external transfer apparatus, the first substrate processing apparatus 1000a processes the substrate S (S210). More specifically, in the first substrate processing apparatus 1000a, the transfer module 1100 takes out the substrate S and transfers it to the process module 1200. The process chamber 1230 of the process module 1200 transfers the substrate S ) Can be performed. Upon completion of the process, the transfer chamber 1220 withdraws the substrate S from the process module 1200. If there are a plurality of process modules 1200 in the first substrate processing apparatus 1000, the substrate S is transferred between the process chambers 1230 through the buffer chamber 2000 according to an embodiment of the substrate processing method described above. The substrate S can be processed.

When the substrate S is completely processed in the first substrate processing apparatus 1000a, the substrate S is transferred from the first substrate processing apparatus 1000a to the buffer chamber 2000 (S220). The transfer chamber 1220 of the first substrate processing apparatus 1000a draws the substrate S from the process chamber 1230 of the first substrate processing apparatus 1000a and transfers the substrate S to the buffer chamber 2000. [ .

When the substrate S is loaded into the buffer chamber 2000, the buffer chamber 2000 can selectively align the substrate S or perform a process. Of course, in the absence of such a function in the buffer chamber 2000, the buffer chamber 2000 may simply function as a passage connecting the substrate processing apparatuses 1000. When the internal atmospheric pressure differs between the substrate processing apparatuses 1000, the buffer chamber 2000 may perform a decompression function like the load lock chamber 1210.

The substrate S is transferred from the buffer chamber 2000 to the second substrate processing apparatus 1000b (S230). The transfer chamber 1220 of the second substrate processing apparatus 1000b can draw the substrate S from the buffer chamber 2000 and carry the substrate S to the second substrate processing apparatus 1000b.

The second substrate processing apparatus 1000b processes the substrate S (S240). The transfer chamber 1220 of the second substrate processing apparatus 1000b transports the substrate S to the process chamber 1230 of the second substrate processing apparatus 1000 and the process chamber 1230 transfers the substrate S ) Can be performed. The transfer chamber 1220 of the second substrate processing apparatus 1000b transports the substrate S to the load lock chamber 1210 of the second substrate processing apparatus 1000b, 2 transferring module 1100 of the substrate processing apparatus 1000b draws the substrate S from the load lock chamber 1210 and transfers the substrate S to the container C mounted on the load port 1110 of the second substrate processing apparatus 1000b And the substrate S is accommodated.

On the other hand, when the substrate processing apparatus 100 has a third substrate processing apparatus 1000c connected to the second substrate processing apparatus 1000b through a buffer chamber 2000 located between the second substrate processing apparatus 1000b and the second substrate processing apparatus 1000b, The substrate S is placed between the second substrate processing apparatus 1000b and the third substrate processing apparatus 1000c after the process in the apparatus 1000b is performed and the substrate S is stored in the container C The substrate S may be processed by the third substrate processing apparatus 1000c by being transferred to the third substrate processing apparatus 1000c through the buffer chamber 2000 (S250).

According to the present invention, in order to transport the substrate S between the substrate processing apparatuses 1000 in the substrate processing apparatus 100, a process module of each substrate processing apparatus 1000, Since the substrate S is directly moved from the substrate processing apparatus 1200 to the process module 1200 of the other substrate processing apparatus 1000, the substrate S can be continuously processed, thereby increasing the process efficiency.

The above-described embodiments of the present invention are described in order to facilitate understanding of the present invention to those skilled in the art, so the present invention is not limited to the above embodiments.

Therefore, it is to be understood that the present invention may be embodied in many other specific forms without departing from the spirit or essential characteristics thereof. For example, the present invention may be embodied in other specific forms without departing from the spirit or essential characteristics thereof. All of the modifications are included.

In addition, the scope of protection of the present invention should be construed according to the following claims, and all inventions within the scope of the claims should be construed as being included in the scope of the present invention.

100: substrate processing equipment
1000: substrate processing apparatus 1100: transfer module 1110: load port
1210: load lock chamber 1220: transfer chamber 1230: process chamber
2000: buffer chamber
2100: housing 2200: support member 2300: rotating member
2400: pressure reducing member 2500: heating member 2600: plasma feeder
S: substrate C: container

Claims (24)

A load port on which a container accommodating a substrate is mounted;
A plurality of process modules for processing the substrate;
A transfer module, disposed between the load port and the process module, for transferring the substrate between the process module and the container;
And a buffer chamber disposed between the process modules adjacent to each other and providing a space in which the substrate is transported between adjacent process modules,
Wherein the buffer chamber includes an upper housing and a lower housing which are stacked up and down,
Wherein the upper housing comprises:
A support member installed in the upper housing, on which the substrate is placed, and
And a plasma supplier for supplying plasma to the upper housing,
The lower housing comprises:
A support member installed in the lower housing, on which the substrate is placed, and
And a rotating member for rotating the substrate placed on the supporting member and the supporting member
/ RTI > The method according to claim 1,
Wherein the load port, the transfer module, and the process module are sequentially disposed along a first direction (X)
The plurality of process modules are arranged in a line on one side of the transfer module along a second direction perpendicular to the first direction (X) when viewed from above
/ RTI > 3. The method of claim 2,
The process module includes a transfer chamber for transferring the substrate between chambers disposed therearound, a process chamber disposed around the transfer chamber for performing a process for the substrate, and a transfer chamber for transferring the transfer chamber between the transfer module and the transfer chamber And a load lock chamber disposed in the load lock chamber,
The buffer chamber is disposed between the transfer chambers of the process modules adjacent to each other
/ RTI > 4. The method according to any one of claims 1 to 3,
Wherein the buffer chamber provides a buffer space in which the substrate transferred between the adjacent process modules temporarily remains
/ RTI > 5. The method of claim 4,
The buffer chamber includes a housing, a rotating member installed in the housing and rotating the substrate placed on the supporting member and the supporting member on which the substrate is placed
/ RTI > delete delete A load port on which a container for holding a substrate is mounted; a process module for processing the substrate; and a transfer module, disposed between the load port and the process module, for transferring the substrate between the process container and the process module A substrate processing apparatus; And
And a first buffer chamber disposed between the adjacent substrate processing apparatuses and providing a space in which the substrate is transported between the adjacent substrate processing apparatuses,
The process module includes a transfer chamber for transferring the substrate between chambers disposed therearound, a process chamber disposed around the transfer chamber for performing a process for the substrate, and a transfer chamber for transferring the transfer chamber between the transfer module and the transfer chamber And a load lock chamber disposed in the load lock chamber,
Wherein the first buffer chamber includes an upper housing and a lower housing disposed between the transfer chambers of the adjacent substrate processing apparatuses and stacked up and down,
Wherein the upper housing comprises:
A support member installed in the upper housing, on which the substrate is placed, and
And a plasma supplier for supplying plasma to the upper housing,
The lower housing comprises:
A support member installed in the lower housing, on which the substrate is placed, and
And a rotating member for rotating the substrate placed on the supporting member and the supporting member
Substrate processing equipment. 9. The method of claim 8,
Wherein the load port, the transfer module, and the process module are sequentially disposed along a first direction (X)
The plurality of substrate processing apparatuses are arranged in a line in a second direction perpendicular to the first direction (X)
Substrate processing equipment. 10. The method of claim 9,
Wherein the first buffer chamber provides a buffer space in which substrates transferred between the adjacent substrate processing apparatuses temporarily stay
Substrate processing equipment. 11. The method of claim 10,
The first buffer chamber includes a housing, a rotary member installed in the housing, for rotating the substrate placed on the support member and the support member on which the substrate is placed
Substrate processing equipment. delete 10. The method according to claim 8 or 9,
The first buffer chamber may include a plurality of housings stacked vertically
Substrate processing equipment. 9. The method of claim 8,
Wherein the process modules included in the substrate processing apparatus are plural,
The substrate processing apparatus further comprises a second buffer chamber belonging to the same substrate processing apparatus and disposed between the adjacent processing modules and providing a space in which the substrate is transported between the adjacent processing modules
Substrate processing equipment. 15. The method of claim 14,
The process module includes a transfer chamber for transferring the substrate between chambers disposed therearound, a process chamber disposed around the transfer chamber for performing a process for the substrate, and a transfer chamber for transferring the transfer chamber between the transfer module and the transfer chamber And a load lock chamber disposed in the load lock chamber,
The second buffer chamber is disposed between the adjacent process modules
Substrate processing equipment. delete delete delete delete delete delete delete delete delete

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