CN1902031A - Methods and systems for handling workpieces in a vacuum-based semiconductor handling system - Google Patents

Abstract

Methods and systems are provided for handling materials in a vacuum-based semiconductor handling system, including methods and systems for handling materials from arm to arm in order to traverse a linear handling system.

Description

Be used for handling method and system based on the workpiece of the semiconductor processing system of vacuum

Background technology

1. technical field

The present invention relates to field of semiconductor manufacture, especially relate to and in vacuum flush system, be used for the machine that material is carried.

2. description of related art

Current semiconductor manufacturing facility has several different forms, its each all have significant disadvantage.(cluster) instrument of trooping is one group of semiconductor processes module is arranged on radiation ground around the central robot arm machine, take a large amount of spaces, the slow and structural limitations that relies on them is in a small amount of semiconductor processes module, and typically maximum is about five or six.Linear tool when providing the potential of greater flexibility and bigger speed than cluster tool, is not fit to the current foundation structure of the most current semiconductor fabrication device well; And the linear movement of the apparatus assembly in the typical vacuum environment of semiconductor manufacturing can have problems in current linear system, as the particle by the fricative unacceptable level between the assembly.The some mixed structures that have the combination of using radial processing module layout and linear arrangement.

A kind of linear system of form is used track or track, has the locomotive that can hold the part of being handled by manufacturing equipment.This car can maybe can not hold the material on the moveable arm that is assembled on the car.System is difficult to comprise the vacuum internal inner ring at other problem middle orbit molded lines, and it need use the more assembling of the sidewall between space or other structure.And, in the rail type system, must have a large amount of cars in orbit and keep output, it is being complicated, costliness and high risk aspect security of the system reliability and the material of handling.In addition, move to the processing module from car in order to make material, must be onboard with one or two arm assembling, it can make this system more complicated.Under the prerequisite that does not disconnect linear motor or track, utilize rail system to be difficult to the part of isolated vacuum system, it is very complicated and expensive technically.Because this arm has been set up the cantilever that is difficult to compensate, so if car is a mechanical float, the arm that then is assembled to the car on the guide track system can have significant deflection problem.If with the wheel on physics guide rail assembling/stranded, then car can have particle issues.

Need to overcome the inherent limitations of cluster tool, avoid the semiconductor manufacturing facility of the problem of linear tool simultaneously.

Summary of the invention

Provide at this to be used for method and system, the especially treatment system that material is carried, as vacuum flush system, its can be in very fine and close floor space (footprint) mobile wafer or other substrate.Though described method and system can be used for the semiconductor manufacturing, should be understood that, method and system described here can be used in any processing or industry that help vacuum processing material.As used in this, except context showed different modes, term manufacturing equipment, treatment system, robot treatment system, vacuum flush system, semiconductor processing system, semiconductor manufacturing facility, wafer processing process, manufacturing system etc. meant to comprise and are used to handle and all types of systems, processing and the equipment of finished parts such as semiconductor wafer or other part.

The method and system that is used in the manufacturing process parts processed is provided, has comprised a plurality of technical modules, each all is used to carry out the processing to part, and at least one 4 SCARA of chain link robot arm is used for mobile part between technical module.In an embodiment, use described method and system together with vacuum flush system.

Method and system comprises a plurality of technical modules, and each all is used for part and two robots arm tool are carried out processing, and wherein two robots arm tool comprises top arm and end arm, is used for parts processed between technical module.In an embodiment, two robot arm tool comprises two 4 relative chain link SCARA arms.

Method and system comprises that along axle with a plurality of technical modules of substantially linear structure setting be used for part is moved at least one handling implement of another technical module from a technical module, wherein handling implement comprises the robots arm.In an embodiment, described method and system comprises the vacuum fabrication tool.In an embodiment, the robots arm is single or two SCARA arms.In an embodiment, the SCARA arm is 4 chain link SCARA arms.In an embodiment, this arm is single, two or jump frogleg arm.In an embodiment, the SCARA arm has the chain link greater or less than four.

Method and system comprises the manufacturing equipment of substantially linear structure, has input and output, and wherein manufacturing equipment comprises vacuum tool and loopback instrument, and this loopback instrument is being used for part is transmitted back to input during the manufacturing process after part arrives output.In an embodiment, manufacturing equipment comprises a plurality of technical modules, wherein by robots arm's instrument mobile part between technical module.In an embodiment, robots arm's instrument is the SCARA arm tool.In an embodiment, the SCARA arm tool comprises 4 chain link SCARA arms.In an embodiment, the SCARA arm tool comprises the 4 chain link SCARA arms that two-phase is right.In an embodiment, the loopback instrument is the air loopback, and technical module is in the vacuum simultaneously.

In an embodiment, existence is along some input and output instruments of linear system.In an embodiment, can take to have the sanction tool of wafer based on the gripping apparatus of air and it is put in the linear system at the some place that is different from primary entry point, as the midway place of downlink.In an embodiment, gripping apparatus can remove material in the position that is different from end outlet point, as online mid point.

In an embodiment, method and system disclosed herein is a curve, that is, linear system must not be in linear structure.

In one aspect, system disclosed herein comprises a plurality of technical modules, be also referred to as technical module, each technical module all carries out more than one manufacturing to workpiece to be handled, this technical module be provided for from first technical module to the end the sequence order of technical module be located in the science and engineering part; And be configured in middle entrance between first technical module and the last process module, with give this sequence increase workpiece or therefrom the place, entrance remove workpiece from this sequence.

This workpiece can enter this sequence at place, middle entrance.This workpiece can withdraw from this sequence at place, middle entrance.This system can further comprise a plurality of in entrances, the entrance all is arranged between in a plurality of processing modules two in each.This system can further comprise loopback mechanism, this loopback mechanism with workpiece move to a plurality of in entrances first and from a plurality of second of entrance fetch workpiece.Can handle this workpiece with a plurality of processing modules selected, order group.According to the middle entrance that workpiece is increased to this sequence or from this sequence remove workpiece in the entrance at least one, can arrange that processing module is to carry out a plurality of different manufacturing process.Middle entrance can connect a plurality of different fabrication tools.Fabrication tool can be arranged to shelf space.Two fabrication tools be score when connecting by middle entrance from the time be more piece space-efficient more.Processing module can be operated workpiece under controlled environment.Controlled environment can comprise at least one in vacuum, controlled pressure, controlled temperature, controlled aeroscope or the controlled admixture of gas.

In another aspect, can comprise as the method that is used to handle workpiece described here a plurality of processing modules sequentially are set, so that workpiece is sequentially operated; Connect two processing modules via middle entrance; And workpiece is increased to this sequence in middle entrance.In another aspect, method can comprise and a plurality of processing modules sequentially is set so that workpiece is sequentially operated; Connect two processing modules via middle entrance; And remove workpiece from this sequence in middle entrance.

The substantially linear axle that method disclosed herein can be included between the load terminal and the port of export provides a plurality of processing modules based on vacuum on every side; And the load locking tool in the middle of providing, be used for element storage part to removing part based on the processing module of vacuum or from the processing module between the load terminal and the port of export between the load terminal and the port of export based on vacuum.

The system that transports that provides based on air can further be provided this method, is used for part being transported to the intermediate cycling load locking tool and planting the lotus locking tool from the centre and transport part.This method can be included in intermediate cycling load keyed end place and introduce part.This method can further comprise the part that removes at intermediate cycling load keyed end place.This method can comprise along sequential processes provides a plurality of intermediate cycling load keyed ends.In the intermediate cycling load keyed end each all is arranged between two adjacent processing modules based on vacuum.This method can comprise provides loopback mechanism, is used for part is moved to or a mobile part from a plurality of intermediate cycling load keyed ends of a plurality of intermediate cycling load keyed ends.Can by between two intermediate cycling load keyed ends, a plurality of processing modules selected, order son group handle this workpiece.Can according in these a plurality of intermediate cycling load keyed ends that workpiece are increased to this sequence at least one or remove a plurality of intermediate cycling load keyed ends of workpiece one from this sequence, processing module based on vacuum is set to carry out a plurality of different manufacturing process.This load keyed end can connect a plurality of different fabrication tools.Fabrication tool can be set come shelf space.In a plurality of fabrication tools two be score when connecting by the load keyed end from the time more piece space-efficient more.Processing module based on vacuum can be operated workpiece at controlled environment.Controlled environment can comprise at least one in vacuum, controlled pressure, controlled temperature, controlled aeroscope or the controlled admixture of gas.

System described here can comprise a plurality of processing modules that order is provided with, so that workpiece is sequentially operated; Jockey, it is used for connecting two processing modules via the entrance; And the increase device, it is used at the place, entrance workpiece being increased to this sequence.

System described here can comprise a plurality of processing modules that order is provided with, so that workpiece is sequentially operated; Jockey, it is used for connecting two processing modules via the entrance; And removing device, it is used for removing workpiece to this sequence at the place, entrance.

In another aspect, fabrication tool described here can comprise a series of processing modules based on vacuum that are used for parts processed; And a pair of load lock, being used for part is transported to and more than onely obtaining part based on the processing module of vacuum with from more than one processing module based on vacuum, wherein contiguous more than one processing module vertically stacked based on vacuum is provided with the load lock.

This system can further comprise the more than one robots arm who is used for parts processed.Described more than one robots arm can comprise the SCARA arm.Described more than one robots arm can comprise four chain link SCARA arms.Described more than one robots arm can comprise three chain link SCARA arms.Described more than one robots arm can comprise four chain link SCARA arms of a pair of vertically stacked.Arm is single, two or jump frogleg arm in an embodiment.This system can the difference place in treatment system comprises somely plants the lotuses lock to vertically stacked.Difference can comprise the entrance and the exit point of semiconductor processing system.Difference can comprise the intermediate point of semiconductor processing system.

Fabrication tool described here can comprise the robot assembly; Workpiece; And sensor, this sensor is used to monitor the processing of workpiece being carried out by the robot assembly.This sensor can comprise at least a in optical sensor, feeler, proximity sense, sonic sensor, capacitance sensor and the magnetic sensor.This sensor can comprise vertical proximity sense.This sensor can comprise horizontal proximity sense.This system can comprise a plurality of sensors that the diagonal angle is provided with.This system can be included in a plurality of proximity senses of a plurality of positions.This sensor can comprise the sensor that is used for detecting workpiece, robot assembly or the more than one motion of actuator arm.This system can comprise a plurality of sensors of the position that is used for definite robot assembly.This system can comprise a plurality of sensors of setting with the rearmost position of detection machine people assembly.This last position can be the temporary position between extended position or retracted position or extended position and the retracted position.This sensor can be provided for the signal in examining workpieces path.This sensor can detect the workpiece that removes the position, can stop manufacturing process in response to the signal that moves out the sensor of position from workpiece.The robots arm can move to home with going up part.The robots arm is travelling workpiece automatically.The robots arm can be at travelling workpiece under the user control.Can use sensor to prevent at least one and the collision of fabrication tool in robots arm or the workpiece.

This sensor can convey to transmitter.Transmitter can comprise wireless launcher.Wireless launcher can convey to wireless receiver from sensor with sensor signal.Wireless receiver can be connected to processor.Processor can show the position of sensor to the user.Sensor signal can show the position of sensor.This system can comprise provides the battery of energy to sensor.This system can comprise battery, and this battery provides energy to the transmitter that is coupled to sensor.Can use this sensor to train this robot assembly.Can train this robot assembly in a vacuum.This sensor can wirelessly be coupled to outside receiver, prevents to discharge the needs of vacuum to atmosphere thus, and the needs of moisture that cure out the processing module of wafer fabrication system after being exposed to atmospheric conditions.Sensor feedback can provide the position of sensor.This sensor can attach to workpiece.This sensor can be placed within the processing module of wafer fabrication system.Sensor can be used in harmful environment.The user can be based on the sensor feedback control robot assembly.Sensor can be used for robot assembly's non-collision training.Non-collision training prevents at least one the collision among workpiece or the robot assembly.This sensor can provide robot assembly's position, and this robot assembly comprises more than one robots arm.This sensor can provide the position of workpiece, and this workpiece comprises semiconductor wafer.This sensor can provide the orientation of workpiece, and this workpiece comprises semiconductor wafer.This sensor can be arranged within the processing module of wafer fabrication system.

In another aspect, can comprise as the method that is used for instrument and equipment robot wafer fabrication system described here: the robot assembly is provided; Workpiece is provided; And on robot assembly, workpiece or in the chamber of the processing module of robot assembly and workpiece at least one, sensor is set, the manufacturing process that this sensor monitoring is undertaken by the robot assembly on workpiece.Other method can comprise the robots arm who is provided for semiconductor fabrication process; And providing a plurality of sensors, this sensor to be used to monitor position in the processing module of manufacturing process, this position comprises upright position and horizontal level.

But the position of the end effector of this sensor detection machine people arm.But the position of this sensor detection machine people arm.This sensor can detect the position by the workpiece of robots arm's end effector clamping.This workpiece can be a wafer, and at least one sensor can be set to be covered by wafer when robots arm's indentation.This workpiece can be a wafer, and at least one sensor can be placed on the outside of wafer radius, so that sensor detects the forward position of wafer and the back edge of wafer during robots arm's stretching, extension and the wafer between the retracted position move.Use the detection on forward position and edge, back to determine that whether wafer is the center with robots arm's actuator.This sensor can comprise that light beam divides link sensor.At least two sensors can be each other across the vacuum chamber setting.Can sensor be set along the diagonal angle of vacuum chamber.This method can further comprise provides mirror to introduce bundle with at least one sensor in vacuum chamber.The semiconductor processes action is carried out with the image training robot arm in the position that this method can further comprise detection machine people arm.

In one aspect, processing method disclosed herein can comprise provides the workpiece with sensor, and this sensor is used to detect the condition that approaches workpiece; With workpiece setting in treatment system; And, receive data from sensor in order to detect about handle the condition of workpiece by treatment system.

Workpiece can be a semiconductor wafer.Workpiece can be configured to the shape of semiconductor wafer.This sensor can be at least one in proximity sense, capacitance sensor, optical pickocff, thermometer, pressure sensor, chemical sensor, radiation detector and the magnetic sensor.This method can comprise from the sensor emission rf data.This method can comprise from sensor and sends data to treatment system.This method can comprise the proximity that detects workpiece and components of processing systems.This method can comprise the data image training robot arm in semiconductor processes that is used to the autobiography sensor.This treatment system can be a semiconductor processing system.

In another aspect, system described here can comprise treatment system; Be arranged on the workpiece in the treatment system; And the sensor that is connected to workpiece, this sensor detects the condition of contiguous workpiece, and this sensor provides the signal relevant with this condition.

This workpiece can be a semiconductor wafer.Can be with the shape configuration workpiece of semiconductor wafer.This sensor can be at least one in proximity sense, capacitance sensor, optical pickocff, thermometer, pressure sensor, chemical sensor, radiation detector and the magnetic sensor.This system can comprise the transmitter that is used for from the sensor emission rf data.This workpiece can have the data connection to treatment system.This sensor can detect the proximity of workpiece and components of processing systems.But the image training robot arm carries out semiconductor processes with the data that are used to the self-sensing device.This treatment system can be a semiconductor processing system.

In one aspect, system described here can comprise the robot assembly in the vacuum that is arranged in the chamber that remains in vacuum manufacturing process; And being used to the more than one driver that encourages the robot assembly to move, described more than one driver comprises the motor driver hardware of vacuum outside.

Motor driver hardware can comprise more than one electric wire.Motor driver hardware can comprise more than one encoder.This motor driver hardware can comprise more than one signal LED.Motor drive hardware can comprise more than one pick-up.Motor driver hardware can comprise more than one bearing.Motor driver hardware can comprise more than one magnet.As utilize lip packing or ferrofluid seal, the salable vacuum of motor driver hardware.The assembly that can have minimum exhaust.The vavuum pump that provides fast vacuum to descend can be provided in this system.Under the prerequisite that does not discharge the vacuum in the processing module, can be by inserting the serviceability that motor driver hardware improves motor driver hardware.Motor driver hardware can comprise the robot driver.Motor driver hardware can be in the processing module outside.Motor driver hardware can be set there to be minimal surface in a vacuum.Can use minimum material to minimize exhaust.Can provide faster at vacuum outer setting motor driver hardware and to find time.This system can comprise at least one driver cavities that is used for the robot assembly.Vacuum can remain in the driver cavities.The volume of this driver cavities can be little.

Can comprise the driver chuck in the system based on the semiconductor processing system driven machine people of vacuum as described here being used for, it provides the driving shaft of rotary driving force to robot; With the rotatory sealing unit, the driver chuck of rotatory sealing unit sealed vacuum outside wherein, shaft drive axis setting simultaneously is in a vacuum.

The driver chuck can comprise a pair of driver chuck, and each all has integrated encoder, bearing and magnet.The rotatory sealing unit can be rotatory sealing unit concentric, multiaxis.This rotatory sealing unit can use lip packing.This rotatory sealing unit can use ferromagnetic sealing.The driver chuck movably and can instead be coupled to shaft drive axis.

In one aspect, method described here can comprise the robot assembly is arranged in the vacuum in the chamber that remains in vacuum manufacturing process; More than one driver is set, is used to be activated at the robot assembly's of vacuum outside motion, described more than one driver comprises motor driver hardware; And the robot assembly is coupled to more than one driver via interface based on vacuum.

Motor driver hardware can comprise more than one electric wire, the encoder more than, more than one signal LED, more than one pick-up, more than one bearing and/or more than one magnet.As utilize lip packing or ferromagnetic sealing, the salable vacuum of motor driver hardware.The assembly that can have minimum exhaust.Vavuum pump can comprise provides fast vacuum to find time.Under the prerequisite that does not discharge the vacuum in the processing module, can be by inserting the serviceability that motor driver hardware improves motor driver hardware.Motor driver hardware can comprise the robot driver.Motor driver hardware can be in the processing module outside.Motor driver hardware can be set there to be minimal surface in a vacuum.Can use minimum material to obtain minimum exhaust.Can find time to provide faster at vacuum outer setting motor driver hardware.This method can comprise at least one driver cavities that is used for the robot assembly.Vacuum can remain in the driver cavities.The volume in this chamber can be little.

System described here can comprise the robot assembly, and it is arranged in the vacuum of the chamber that remains in vacuum manufacturing process; The more than one assembly of the motor driver hardware of vacuum outside; And coupling device, it is used for the more than one assembly of motor driver hardware is coupled to the robot assembly.

Semi-conductor manufacturing system disclosed herein can comprise the loading stage of a plurality of vertically stacked; And the processing module of a plurality of vertically stacked.

The processing load platform of the vertically stacked more than four can be provided.A supply in the loading stage of a plurality of vertically stacked comprises the more than one manufacturing process in the processing module of a plurality of vertically stacked.Can load second in the loading stage of a plurality of vertically stacked, simultaneously a supply system fabrication technique in the loading stage of a plurality of vertically stacked.The loading that can adjust a plurality of vertically stacked loading modules is with minimizing latency.The processing module that a plurality of vertically stacked can be set is to reduce the floor space of system.At least one robot can insert any in the vertically stacked loading stage.This system can comprise the outlet platform of a plurality of vertically stacked.

At least one robot assembly can insert any in the vertically stacked outlet platform.At least one robot assembly can insert the vertically stacked processing module more than.At least one robot assembly can insert more than the adjacent processing module of one level.This system can be included at least one grain-clamping table between the adjacent processing module of two levels.This system can comprise the middle portable station of more than one vertically stacked.This system can comprise at least one robot assembly that can insert more than portable station in the vertically stacked.Workpiece can pass a plurality of different path movement of adjacent processing module.The processing module of a plurality of vertically stacked can comprise more than one processing module based on vacuum.This system can comprise be arranged on the entrance of semiconductor fabrication process or exit point in the load lock of at least one contiguous a plurality of vertically stacked.The processing module of a plurality of vertically stacked can substantially linear the structure setting.This system can be included in the more than one robots arm of travelling workpiece between the processing module of a plurality of vertically stacked.This system can comprise at least one in top robots arm's group and the end robots arm group.Among the more than one robots arm at least one can vertically move with one bottom reason module in one top processing module in the processing module that inserts a plurality of vertically stacked and a plurality of vertically stacked processing module.At least one comprised vertically stacked in a plurality of vertically stacked processing modules more than two processing module.

Disclosed herein is a kind of method that is used in semiconductor fabrication process set handling module, comprising: a plurality of processing modules are provided; In a plurality of processing modules at least two are set, so that their levels are adjacent; And at least two in a plurality of processing modules are set so that they are vertically adjacent.

Vertically stacked more than four loading stage can be provided.A supply in the loading stage of a plurality of vertically stacked comprises the more than one manufacturing process in the processing module of a plurality of vertically stacked.Can load second in the loading stage of a plurality of vertically stacked, simultaneously a supply system fabrication technique in the loading stage of a plurality of vertically stacked.The loading that can adjust a plurality of vertically stacked loading modules is with minimizing latency.The processing module that a plurality of vertically stacked can be set reduces the floor space of system.At least one robot assembly can insert any in a plurality of vertically stacked loading stages.This method can comprise provides the outlet of a plurality of vertically stacked platform.At least one robot assembly can insert any in the vertically stacked outlet platform.At least one robot assembly can insert the processing module more than a vertically stacked.At least one robot assembly can insert more than the adjacent processing module of one level.

This method can comprise and is provided at two at least one grain-clamping tables between the adjacent processing module of level.This method can comprise the middle portable station that more than one vertically stacked is provided.At least one robot assembly can insert the middle portable station more than one vertically stacked.Workpiece can pass a plurality of different path movement of adjacent processing module.The processing module of a plurality of vertically stacked can comprise more than one processing module based on vacuum.This method can comprise provide be arranged on the entrance of semiconductor fabrication process or exit point in the load lock of at least one contiguous a plurality of vertically stacked.The processing module of a plurality of vertically stacked can substantially linear the structure setting.This method can be included in the more than one robots arm of travelling workpiece between the processing module of a plurality of vertically stacked.More than one robots arm can comprise at least one in top robots arm's group and the end robots arm group.Among the more than one robots arm at least one can vertically move the bottom reason module to insert in a plurality of vertically stacked processing modules in one top processing module and a plurality of vertically stacked processing module one.At least one comprised vertically stacked in a plurality of vertically stacked processing modules more than two processing module.

Producing method of chip described here can comprise providing to have the operating temperature processing module more than environment temperature basically; Reception is incorporated into the wafer in the processing module, and this wafer has the temperature near environment temperature; And the temperature that wafer is heated to more close operating temperature.

Heated chip can be included in transfers to processing module heated chip in preheating platform before.Before this method can further be included in and remove wafer from the manufacturing process that comprises processing module, wafer is cooled to temperature near environment temperature.The cooling wafer can comprise wafer is cooled to prevent the temperature of condensing when wafer when manufacturing process removes wafer.This method can be included in preheating the material processed device before the material processed device processing wafer.Heated chip can comprise wafer is heated to the temperature that prevents that wafer surface is condensed when wafer is incorporated in the processing module.Heated chip can be included in the vacuum-evacuate heating wafer of processing module.Heated chip can comprise wafer is heated to the temperature that prevents that wafer surface is condensed during the acceleration vacuum-evacuate of processing module.Heated chip can comprise by heat to be used by preheating material processed device heated chip.This method can comprise the cooling of controlling wafer by the temperature of the material processed device of control processing wafer.

Wafer fabrication system described here can comprise having the operating temperature processing module more than environment temperature basically; Be incorporated into the wafer in the processing module, this wafer has the temperature near environment temperature; And heater, it is used for wafer is heated to the temperature of more close operating temperature.

In another aspect, wafer fabrication system described here can comprise having the operating temperature processing module more than environment temperature basically; And the material processed device, it was heated to wafer the temperature near operating temperature before wafer is incorporated into processing module.

Heated chip can be included in transfers to processing module heated chip in preheating platform before.This system can comprise cooling device, and it was used for before removing wafer from the manufacturing process that comprises processing module, wafer is cooled to the temperature of close environment temperature.The cooling wafer can comprise wafer is cooled to prevent the temperature of condensing when wafer when manufacturing process removes wafer.Can before handling wafer, preheat the material processed device.Wafer can be heated to the temperature that prevents that wafer surface is condensed when wafer is incorporated in the processing module.Can be at the vacuum-evacuate heating wafer of processing module.Wafer can be heated to the temperature that prevents that wafer surface is condensed during the acceleration vacuum-evacuate of processing module.Can use by pre-warmed material processed device heated chip by heat.In an embodiment, can come heated chip by the heater of heated chip itself.In the load lock that this heater can be installed or be contained in equally and wafer heater independently heats.One of this mode is control load lock chamber (its mainly influence and bleed during condense) and wafer preheats or the back cooling independently.This load lock will have a large amount of heat, only slowly be reflected at temperature desired thus and change.This wafer heater can produce very little heat, so that for example, a people can be set to 300 degrees centigrade with heater during finding time, and is set to 80 degrees centigrade between exhaust cycle.In an embodiment, can cool off wafer by the temperature of controlling the material processed device of handling wafer.

In another aspect, disclosed herein is a kind of semiconductor processing, and this method comprises and is provided for being transported to part based on the semiconductor processing system of vacuum or receiving from the load lock based on the part of the semiconductor processing system of vacuum; And add thermal force lock.This method can be included in the heating load lock of finding time of load lock.The load lock can be heated to about 50 degrees centigrade to about 100 degrees centigrade.The load lock can be heated between ten degrees centigrade and about 200 degrees centigrade.

Semiconductor processing system described here can comprise load lock, and it is used for being transported to part based on the semiconductor processing system of vacuum or receiving from the part based on the semiconductor processing system of vacuum; And heating element heater, it is used to add the thermal force lock.Can be at the heating load lock of finding time of load lock.The load lock can be heated to about 50 degrees centigrade to about 100 degrees centigrade.The load lock can be heated between ten degrees centigrade and about 200 degrees centigrade.

In another aspect, system described here can comprise the assembly that is used in the semiconductor fabrication processing material processed, and this assembly has the taper of setting up the non-homogeneous cross section that alleviates resonant transmission in the assembly.

Assembly can comprise end effector.The top surface of end effector can be smooth.The basal surface of end effector can be taper.End effector can be made by cast-molding material.Taper can be designed to foundry goods, and it is used to make employed cast-molding material to set up end effector.Assembly can be the robots arm.Assembly can be the robots arm of a chain link.This system can comprise a plurality of taper chain links, and when the taper chain link overlapped, at least two chain links reduced gradually in the mode of the thickness that minimizes the taper chain link.Assembly can comprise end effector and robots arm, and each among end effector and the robots arm all is taper.

In another aspect, semiconductor processing disclosed herein can comprise the end effector that is provided for process semiconductor wafers; And reduce the resonance that end effector reduces end effector gradually.This method can comprise the end effector of structure carbonization sial.

In another aspect, semiconductor processing described here can comprise provides the robots arm instrument; And the robots arm's instrument that reduces at least one chain link gradually is to suppress the vibration of robots arm's instrument.This method can comprise the robots arm by at least one chain link of carbonization sial structure.

Semiconductor processing disclosed herein can comprise: along axle a plurality of robots arms and a plurality of processing module are set; And by workpiece first from a plurality of robots arms being passed to second among a plurality of robots arms, travelling workpiece between a plurality of processing modules.

This can be linear.This can be a curve.This can form basic U-shaped.A plurality of robots arms can comprise the SCARA arm.A plurality of robots arms can comprise four chain link SCARA arms.A plurality of robots arms can comprise three chain link SCARA arms.A plurality of robots arms can comprise the many to the robots arm of link, and each links comprising two vertically disposed robots arms.

Semiconductor processing system can comprise as disclosed herein: along a plurality of robots arms and a plurality of processing module of axle setting; And transfer device, it is by passing to workpiece first from a plurality of robots arms second among a plurality of robots arms, travelling workpiece between a plurality of processing modules.

The method of semiconductor processes can comprise as disclosed herein: first robots arm who is provided for handling workpiece; And second robots arm is set, be used for handling workpiece in the position vertical substantially with respect to first robots arm.

This method can comprise first robots arm mechanically is coupled to second robots arm.This method can comprise makes first robots arm mechanically separate second robots arm.At least one can be the SCARA arm among first robots arm and second robots arm.At least one is four chain link SCARA arms among first robots arm and second robots arm.At least one is three chain link SCARA arms among first robots arm and second robots arm.

Semiconductor processing system described here can comprise: be used to handle first robots arm of workpiece, this robots arm is arranged within the processing module; And second robots arm who is used to handle workpiece, this second robots arm is arranged on respect in the processing module in the vertical substantially position of first robots arm.

First robots arm mechanically is coupled to second robots arm.First robots arm mechanically separates second robots arm.At least one can be the SCARA arm among first robots arm and second robots arm.At least one can be four chain link SCARA arms among first robots arm and second robots arm.At least one can be three chain link SCARA arms among first robots arm and second robots arm.

System disclosed herein can comprise: the robot driver; End effector is used to handle part; The robots arm, it is connected to end effector with robot driver mechanism, and this robots arm comprises the chain link more than four; Mechanically couple four more than one connectors each other, so that end effector moves on the direction at substantially linear under robot driver's the control with contrachain ring.

Each chain link all can have the length that selection comes optimization robots arm's extending range with containment ratio.Each chain link all can have the length of selecting to avoid with the adjacent assemblies collision of treatment system.This system can comprise the controller of control robot driver operation.Controller can be a remote controller.Controller can be integrated with visual software program.Controller can be controlled the robots arm more than.The chain link near the robots arm of end effector can comprise that the skew wrist is can make this arm folding.The robots arm can comprise at least one chain link, and this chain link has the otch that can fold at least one other chain link therein.At least two continuous chain links of robots arm can be stacked with the down suction, so that other chain link of at least one of robots arm can be folded in two perpendicular separations between the continuous chain link at least.This system can be included at least one the bypass tooth bar (bypass spline) between the chain link.

Method disclosed herein can comprise: the robot driver is provided, is used to handle the end effector of part and robot driver mechanism is connected to the robots arm of end effector, this robots arm comprises the chain link more than four; And the chain link more than four of interconnecting each other, so that end effector moves on the direction at substantially linear under robot driver's the control.

Each chain link all can have the length that selection comes optimization robots arm's extending range with containment ratio.Each chain link all can have the length of selecting to avoid with the adjacent assemblies collision of treatment system.This method can comprise the operation of controlling this robot driver with controller.Controller can be integrated with visual software program.Controller can be controlled the robots arm more than.The chain link near the robots arm of end effector can comprise that the skew wrist is can make this arm folding.The robots arm can comprise at least one chain link, and this chain link has the otch that can fold at least one other chain link therein.At least two continuous chain links of robots arm can be stacked with the down suction, so that other chain link of at least one of robots arm can be folded in two perpendicular separations between the continuous chain link at least.At least two continuous chain links of robots arm can be stacked with the down suction so that the robots arm can arrive predetermined transfer plane, and not with the collision of the assembly of treatment system.This method can comprise at least one the bypass tooth bar that is provided between the chain link.

System disclosed herein can comprise: be used for a plurality of processing modules of semiconductor fabrication process, it is arranged on around the track of substantial linear; Car, it is coupled to linear track movably and is provided with to such an extent that move along linear track; And the robots arm, it is provided with the workpiece that is used to onboard handle between a plurality of processing modules.

This robots arm can comprise the SCARA arm.This SCARA arm can comprise four chain link SCARA arms.This SCARA arm can comprise three chain link SCARA arms.

Semiconductor processing system described here can comprise: vacuum flush system, and it is arranged in the substantially linear structure with load terminal and port of export; And antivacuum send-back system, it is used for part is transmitted back to load terminal from the port of export.

Antivacuum send-back system can be arranged on the top of vacuum flush system.Antivacuum send-back system can be arranged on the below of vacuum flush system.Antivacuum send-back system can be arranged on the next door of vacuum flush system.Antivacuum send-back system can be arranged within the vacuum flush system.Antivacuum send-back system can comprise the load lock at the port of export, is used for part is moved to antivacuum send-back system from vacuum flush system.Antivacuum send-back system can comprise slide mechanism and the gripping apparatus that is used for part is moved to from the port of export load terminal.

Vacuum flush system can comprise a plurality of processing modules.Vacuum flush system can be included in one or more robots arms of mobile part between the processing module.The friendship system can comprise by part first from a plurality of robots arms being sent to second among a plurality of robots arms, a plurality of robots arms that come mobile part.A plurality of robots arms comprise the SCARA arm.A plurality of robots arms can comprise four chain link SCARA arms.A plurality of robots arms can comprise three chain link SCARA arms.A plurality of robots arms can comprise the robots arm of at least one pair of link of the setting that is perpendicular to one another.A plurality of processing modules can be at the factor that changes aspect the floor space more than 2 or 2.This system can comprise semiconductor manufacturing tool, this semiconductor manufacturing tool comprises a plurality of linear semiconductor treatment systems, these a plurality of linear semiconductor treatment systems are arranged side by side, so that the load terminal of a plurality of linear semiconductor treatment systems is towards the passage of semiconductor manufacturing tool.

Semiconductor manufacturing tool described here can comprise at least one the upset gripping apparatus that is used to receive semiconductor wafer, this upset gripping apparatus comprises a pair of gripping apparatus module, wherein each gripping apparatus module all is configured to receive in the semiconductor wafer at pair of parallel edge one, in a single day wherein receiving each gripping apparatus module of semiconductor wafer a position all rotates, wherein the horizontal component of gripping apparatus module is in the horizontal plane supporting semiconductor wafers, and the vertical component of gripping apparatus module prevents that semiconductor wafer from moving at horizontal plane.

Method as process semiconductor wafers described here can comprise: the end effector that is provided for the clamping semiconductor wafer, wherein end effector comprises the receiving slit that is configured in the horizontal plane supporting semiconductor wafers, prevent that simultaneously semiconductor wafer from moving on horizontal plane, and wherein end effector comprises disposing and makes semiconductor wafer slide into slope in the receiving slit when be placed on semiconductor wafer on the end effector.

Can comprise a plurality of robots arms as semiconductor processing system described here, the actuator tool of at least two share common among these a plurality of robots arms.Among these a plurality of robots arms at least one is the SCARA arm.Among these a plurality of robots arms at least one is four chain link SCARA arms.Can work independently, perhaps can work relatively at least two among these a plurality of robots arms.

In another aspect, semiconductor processing system described here can comprise the robots arm with frog leg arm configuration, and this frog leg arm configuration comprises at least two pairs of frog leg arms.

As used in this, " robot " comprises any known robot or similar device or comprises machine capability and the instrument of control ability, it can comprise the combination of controller, processor, computer or similar instrument, one group of motor or similar instrument, more than one decomposer, encoder or similar instrument, more than one machinery or operation tool are as arm, wheel, leg chain link, pawl, extension rod, gripping apparatus, nozzle, sprayer, effector, driver etc. and above-mentioned any arbitrary combination.An embodiment is the robots arm.

" driver " comprises the actuator mechanism of arbitrary form or is used for the instrument of introducing effect as used in this.In an embodiment, it comprises the motor/encoder parts of robot.

As used in this, " axle " comprises motor or the driver that is mechanically connected to mechanical component such as arm member via chain link, band or similar instrument." N axle driver " comprises the driver that contains N axle; For example " 2 drivers " is the driver that contains two axles.

As used in this, " arm " comprises passive or (meaning is to comprise motor/encoder) linkage initiatively, and it can comprise more than one arm or leg member, bearing and the more than one end effector that is used for clamping or grasps material to be processed.

As used in this, " SCARA arm " refers to the selectivity that well known to a person skilled in the art more than one forms and obeys (SCARA) robots arm of assembly robots arm (Selectively CompliantAssembly Robot Arm), comprises by the more than one contrachain ring that is connected to driver, is connected to its more than one chain link and more than one arm of forming as the terminal units of end effector or driver down for the motor of a driver part via band or mechanism.

As used in this, " radius of gyration " refers to the radius that arm assembles when whole indentation.

As used in this, " stretching, extension " comprise, with respect to the robots arm, and the maximum extension that when arm all stretches, obtains.Usually mechanical constraint exceeds actual effectively stretching, extension, because easier control does not have fully whole arms (existing in a unmanageable left side/right singular point of four corner in an embodiment) that stretch.

As used in this, " containment (containment) " refers to when optimization ground indentation arm so that the situation imaginary circle can be plotted in around the arm/end effector/material of least radius the time.

As used in this, " extending range and containment ratio " refers to, and with respect to the robots arm, maximum stretches the ratio with minimum volume.

As used in this, " robot and robot " is apart from the horizontal range between the machine center axle of the rotation that comprises two different machines people drivers.

As used in this, " groove valve " comprises opening and closing so that the rectangular-shaped valve that the robots arm passes (as relative with vacuum (isolation) valve, it controls finding time of vacuum chamber).For example, SEMI E21.1-1296 standard (publishing standard that semiconductor is made), the groove valve of the 300mm wafer in some semiconductor fabrication processing module has the open height of the A/F of 336mm, 50mm and has the main valve thickness of the 60mm of the standard of also having specified rigging screw and alignment pin.

As used in this, " transfer plane " is included in this material passes to the processing module chamber from robot chamber via slit valve plane (highly).According to the SEMI E21.1-1296 standard that is used for semiconductor manufacturing facility, shifting the plane is the above 14mm of groove valve center line.

As used in this, " part " is included in the vacuum chamber that wherein has an above robot driver.But this is a repeat element minimum in the linear system.

As used in this, " chain link " is included in the robots arm's who is connected to another chain link, end effector or robot driver on the two ends mechanical component.

As used in this, " L1 ", " L2 ", " L3 " etc. comprise from driver and beginning to the numbering of the arm chain link of end effector.

As used in this, " end effector " is included in the element away from robots arm's drive end of robot driver and contiguous part, and the robots arm will take action above the part at this.End effector can be passive or be clamped in semiconductor technology on one's own initiative or be arranged in some other drivers on robots arm's end the hand of the robot of the material that will carry.

As used in this, term " SCARA arm " refers to and comprises one with the robots arm of contrachain ring and can comprise end effector, and what wherein arm can be linear under control moves, as the interlock object.The SCARA arm can have the chain link of various numbers, as 3,4 or more.As used in this, " 3 chain link SCARA arm " comprises having three members: the SCARA robots arm of chain link one (L1), chain link two (L2) and end effector.The driver that is used for 3-chain link SCARA arm generally has 3 motor: one is connected to L1, and one is connected to the band system, and it is connected to end effector via pulley successively, and Z (lifting) motor.A driver can be connected to end effector with the 4th motor, and it allows some unusual the moving that only can not realize with three motor.

As used in this, " two SCARA arm " comprises the combination of two the SCARA arms (as two 3 or 4 chain link SCARA arms (be typically referred to as and be decided to be A and B)) that randomly are connected to common driver.In an embodiment, two SCARA arms are fully independently or the chain ring element L1 of share common.The driver that is used for two independent SCARA arms generally has five motor: one is connected to L1-A, and one is connected to L1-B, a band system that is connected to arm A, a band system that is connected to arm B, and shared Z (lifting) motor.The driving machine that is used for the two SCARA of dependence arms generally has shared L1 chain link, be used for arm A and B, and generally contain four motor: one is connected to shared chain L1, and one is connected to the band system that is used for arm A, one is connected to the band system that is used for arm B, and shared Z (lifting) motor.

As used in this, " 4 chain link SCARA arm " comprises the arm with four member: L1, L2, L3 and end effectors.The driver that is used for 4 chain link SCARA arms can have four motor: one is connected to L1, a band system that is connected to L2 and L3, and one is connected to end effector and Z motor.In an embodiment, only need 3 motor: one is connected to L1, and one is connected to the band system that connects L2, L3 and end effector, and the Z motor.

As used in this, " frogleg arm " comprises the arm with five member: L1A, L1B, L2A, L3B and end effectors.The driver that is used for frog leg arm can have three motor, and one is connected to L1A, and L1A is mechanically connected to L1B by geared system etc., a rotating disk and a Z motor that is connected to the whole arm combined device of rotation.In an embodiment, this driver comprises three motor, and one is connected to L1A, and one is connected to L1B and Z motor, and has obtained desirable motion via the coordination between the motor.

As used in this, " two frogleg arm " comprises the arm with eight member L1A, L1B, L2A-1, L2A-2, L2B-1, L2B-2 and two end effectors.The second chain ring element L2A-1 and L2B-2 form single frogleg arm, and the second chain ring element L2A-2 and L2B-2 also form single frogleg arm, yet towards relative direction.Be used for two frog arms driver can be used for the same of single frog arm.

As used in this, " jump frogleg arm " comprises the arm with eight member L1A, L1B, L2A-1, L2A-2, L2B-1, L2B-2 and two end effectors.Each is connected to substantially a motor at they central authorities rather than their far-ends the first chain ring element L1A and L1B.The second chain ring element L2A-1 and L2B-1 form single frogleg arm, and the second chain ring element L2A 1 and L2B-2 also form single frogleg arm, yet towards identical direction.Be used for two frog arms driver can be used for the same of single frog arm.

To incorporate into here at all patents, patent application and other file of this reference by reference.

Brief description

Fig. 1 shows the device structure of multiple manufacturing equipment type.

Fig. 2 shows the conventional cluster-type structure that is used for parts processed in semiconductor fabrication process.

Fig. 3 A and 3B show a succession of cluster-type system that is used to hold between two and six processing modules.

Fig. 4 shows the high-level component of the linear process structure that is used for parts processed in manufacturing process.

Fig. 5 shows the top view of linear process system, as has the system of the structure similar to Fig. 4.

Fig. 6 shows 3 chain link SCARA arms and 4 chain link SCARA arms.

Fig. 7 shows the extending range and containment (reach andcontainment) characteristic of SCARA arm.

Fig. 8 shows the high-level component that is used for robot system.

Fig. 9 shows the assembly of the arm structure of the robots arm system that is used for treatment system.

Figure 10 shows the extending range and the containment ability of 4 chain link SCARA arms.

Figure 11 shows the interference characteristic of 4 chain link SCARA arms.

Figure 12 shows and utilizes the side view of band as one group of both arms, the 4 chain link SCARA arms of connecting gear.

Figure 13 shows and utilizes the side view of tooth bar chain link as one group of both arms, the 4 chain link SCARA arms of connecting gear.

Figure 14 shows the outside send-back system of the treatment system that is used to have linear structure.

Figure 14 a shows the U-shaped structure that is used for the linear process system.

Figure 15 shows some details of the outside send-back system of the treatment system that is used for Figure 14.

Figure 16 shows the other details of the outside send-back system of the treatment system that is used for Figure 14.

Figure 17 shows the motion of exporting carrier in the send-back system of Figure 14.

Figure 18 shows the processing of the send-back system hollow carrier of Figure 14.

Figure 19 shows unloaded tool the moving in the load lock position in the send-back system of Figure 14.

Figure 20 shows the unloaded tool and gripping apparatus the moving in the send-back system of Figure 14 of reducing and finding time.

Figure 21 shows when being fully loaded with tool emptied space-time carrier in the send-back system of Figure 14 and is receiving material.

The unloaded tool that Figure 22 shows and be parked in clip position in the send-back system of Figure 14, begins newly to return circulation.

Figure 23 shows the structure of the handling implement that is used for manufacturing process, has two arm robot system and send-back system in linear structure.

Figure 24 shows the optional embodiment of the overall system architecture that is used for processing method of the present invention and system.

The floor space that Figure 25 shows linear system is compared the comparison of conventional group system.

Figure 26 shows the linear structure that disposes super-huge processing module in the treatment system according to the embodiment of the invention.

Figure 27 shows the back export structure that is used for according to the treatment system of the embodiment of the invention.

Figure 28 shows the various layout possibilities of employing according to the fabrication tool of the linear process system of various embodiments of the invention.

Figure 29 shows one embodiment of the present of invention, and wherein robot can comprise some drivers and/or some controllers.

Figure 30 shows the transfer plane of the relevant embodiment of the invention and the characteristic of groove valve (slot valve).

Figure 31 shows the upset gripping apparatus (tumble gripper) that is used for the wafer centering.

Figure 32 shows the passive slide ramp that is used for the wafer centering.

Figure 33 example comprise in the fabrication tool of inlet instrument.

Figure 34 example from top view comprises the fabrication tool of inlet instrument.

Figure 35 example comprise and place the fabrication tool be used to detect according to the optical pickocff of the robots arm position of the embodiment of the invention and material.

Figure 36 example the fabrication tool of the side cross-sectional view of beam path and optional beam path is shown.

Figure 37 example how to use optical pickocff to determine the center of the material handled by the robots arm.

Figure 38 shows 3 conventional robotic vacuum activation configurations.

Figure 39 shows the new 3 robotic vacuum activation configurations according to the embodiment of the invention.

Figure 40 A example according to the vertically arranged load locked component of the embodiment of the invention.

Figure 40 B example at vertically arranged load locked component according to the wafer fabrication tools both sides of the embodiment of the invention.

Figure 41 shows vertically arranged load lock and the vertically stacked processing module according to the embodiment of the invention.

Figure 42 show according to embodiments of the invention have in side cross-sectional view vertically stacked processing module linear arrangement, the bi-level treatment structure.

Figure 43 shows the processing layout of Figure 42 with top view.

Figure 44 shows to have sensor according to embodiments of the invention and detects measurement object on the robots arm of object of adjacent objects.

Figure 45 example sensor how above target, move and can make the robots arm detect its position with respect to barrier.

Figure 46 shows the measurement object and how to use the radio communication in the vacuum environment that the position is conveyed to central controller.

Figure 47 example the output of a succession of sensor along with the function of position.

Figure 48 example heating element heater can how to be placed in the load lock and to be used for the heat treatment of object according to an embodiment of the invention.

Figure 49 shows the end effector of bidimensional taper, and it has reduced the active vibration mode in the end effector.

Figure 50 shows not to be influenced under the prerequisite of vertically stacked height significantly, and how the robots arm's element that is used for the vertical taper of the plane arm of robot is used to reduce the vibration that arm is provided with.

Figure 51 example two independently SCARA robots arms.

Figure 52 example the two-phase SCARA robots arm of closing.

Figure 53 example the robots arm of frog leg shape.

Figure 54 example the robots arm of both legs formulas.

Figure 55 A example be assemblied in 4 chain link SCARA arms on the removable car, and be assemblied in 4 chain link SCARA arms on the removable car of upset.

Figure 55 B example the top view of Figure 55 A.

Figure 56 example use 3 chain link lists or two SCARA arm machine system to pass wafer along the axle of substantially linear.

Figure 57 example 2 grades of application of vacuum machine systems, wherein can insert the top and bottom processing module by the vertical axis among the robots arm.

Figure 58 A shows the bi-level treatment instrument, and wherein the substantially linear axle in the two-stage passes substrate.

Figure 58 B example the variation of Figure 58 a, wherein from the rear portion moving substrate of system.

Figure 59 A shows the fabrication tool that holds very big processing module on the axle of substantially linear.Preparation effective service space is used to insert the inside of processing module.

Figure 59 B example the finer and close layout of 4 big processing modules and a little processing module.

Figure 60 example have two frogleg robot mechanical arms of the substrate on system the same side.

The specific embodiment

Fig. 1 shows the device structure 1000 that is used for various manufacturing equipment types.Every type manufacturing equipment is parts processed all, as the semiconductor wafer between various processing such as chemical vapor deposition processing, etch processes etc.Because semiconductor fabrication processing is generally extremely responsive to pollutant such as particulate and VOC, so these processing generally all occur in the vacuum environment, is exclusively used in one or more processing modules of particular procedure.Between various processing, move semiconductor wafer to make final products, as chip by treatment system.There are various structures 1000 to be used for treatment system.General system is a cluster tool 1002, wherein processing module be positioned at radially central processing system such as robots arm around.In other embodiments, treatment system is rotating part flatly, as in embodiment 1004.An important aspect of every type of instrument be " floor space " (footprint) or equipment region occupied in semiconductor manufacturing tool.Floor space is big more, and the space that holds a plurality of machinery requirements in fabrication tool is just big more.And bigger floor space generally needs bigger vacuum system, and its increase along with size has increased cost widely.Part in structure 1004 rotation " rotating disc " instruments.Structure 1006 moves into part processing module and shifts out processing module, wherein processing module setting adjacent one another are.Structure 1008 is positioned processing module in similar to 1002 the trooping, and difference is that central robot is handled two wafers side by side.Along with increasing wafer moves past system, in these systems each all has the challenge of many cluster tools, comprise when wafer move into given processing module neutralization shift out again the remarkable swap time during given module postpone and quite difficult keep the cleannes of vacuum environment of given processing module.

Fig. 2 shows the conventional cluster-type structure 2000 that is used in the semiconductor fabrication process parts processed.Robots arm 2004 moves part, as the wafer between the various processing modules 2002 in the trooping around being arranged at robots arm 2004.In case processing finishes, atmosphere processing substrate minienvironment chamber 2008 just receives the material that is used to handle and holds material by this equipment.How difficult note adding more processing module 2002 has.When more than one module 2002 probably was fit to, practical structure was restricted to five processing modules 2002.Increasing by six modules can influence the availability of equipment significantly, and especially the robots arm 2004.

Fig. 3 A and 3B show the cluster tool module, i.e. atmosphere minienvironment process chamber, vacuum processing chamber and be used for other assembly 3000 based on the flexible structure system of the manufacturing process of vacuum.Different modules can be assembled together so that the manufacturing of desired technology.For example, given chip need different chemical constituent (for example, titanium nitride, tungsten etc.) and the etchings in other processing module of chemical vapor deposition in the different disposal module.Processing sequence in the different disposal module obtains unique final products.Suppose the complexity that has increased semiconductor subassembly, general hope has the flexible structure that can make manufacturer increase more multiprocessing module.Yet cluster tool described above is the restricted quarter; Therefore, can not increase more processing module, mean, manufacturing must be moved to second cluster tool in order to finish more complicated semiconductor wafer.As among Fig. 3 A and Fig. 3 B see that cluster tool can comprise the structure of two 3002, three 3004, four 3006, five 3008,3010 or six 3012 processing modules with segmentation vacuum insulation.Can provide other assembly together with this equipment.

Fig. 4 shows the high-level component that is used in the linear process structure 4000 of manufacturing process parts processed.This structure is used the plural stationary machines people 4002 who arranges with linear mode.Robot 4002 can or be assemblied in the bottom of system or hangs downwards or assemble simultaneously with the two from chamber cap.Linear system is used the vacuum chamber 4012 around the robot.This system can be made up of the vacuum chamber 4012 of a plurality of connections, and each with vacuum chamber 4012 all comprises himself the robot that arranges with linear mode.In an embodiment, a single controller part or many parts to handle this structure can be set.Can expand vacuum chamber 4012 parts in an embodiment; That is, manufacturer can easily increase other part/chamber 4012 and increase technological ability thus, and is easier than cluster structure.Because each part is all used independently robot driver 4004 and arm 4002, so output can keep highly when increasing other part and robot thus.By contrast, in cluster tool, when manufacturer increased process chamber 2002, this system had increased the load that is used for the individual machine people, even robot is equipped with both arms, the speed of final robot also can become limiting factor.In an embodiment, system handles this problem by other robots arm 4002 is increased to single driver.Other manufacturer uses 4 robots with two complete independent arms, as two SCARA or two frog robot leg.Linear system disclosed herein is not subjected to the restriction of robot capability, and this is because each part 4012 all comprises robot, so each part 4012 can both the more substantial material of delivery ratio cluster tool.

In an embodiment, the assembly of this system can be controlled by software controller, and this software controller can be each central controller in the Control Component in an embodiment.In an embodiment, assembly is formed on the linked treatment system under the software control, and wherein each robot of this software control perhaps hands in the buffer that is picked up by next robot material is transferred to another robot.In an embodiment, this software control system identification can be added New Parent, as processing module or robot, when that assembly is inserted in this system, as the assembly on the recognition network, as USB, Ethernet, live line, bluetooth, 802.11a, 802.11a, 802.11g or other network.In such an embodiment, next robot, processing module or other assembly one are inserted into the software program machine that is used for processed material such as flow of wafers, just can ressemble automatically, so that material is sent on the new chain link in the system.In an embodiment, the software program machine is based on backbone network, and perhaps it can be regular basic program stack.In an embodiment, processing module can make them self know this network, has connected which type of new processing module, robot or other assembly so that software controller is known.When being inserted into new processing module in the sky face, this system can discern it and it is arranged in the flow process of material processed.

In an embodiment, these software systems can comprise the interface that allows the simulation of user's operational system.Link and structure that this interface allows user to watch various chain links, robots arm and other assembly are with optimization structure (as by via various assembly mobile material streams, mobile processing module, mobile robot etc.) with definitely obtain which type of structure from the supplier.In an embodiment, interface can be a network interface.

Method and system disclosed herein can use the optional buffer stand 4010 between the robot driver.Robot can directly transfer each other, but this more is difficult to optimization technically, and will take two robots, because they two all must obtain simultaneously to transfer, other robot can pick up when being ready to can stack virtual location 4010 between them and limit more such as fruit for this.Buffer 4010 can also be realized higher output, is because this system needn't wait for that two robots become available.In addition, the chance that buffer 4010 also can provide is carried out some the little treatment steps on the wafer, as heating, cool off, aim at, check, measure, test or cleaning.

In an embodiment, method and system disclosed herein uses vacuum separation valve 4006 optional between robot district/part 4012.Each part 4012 can be isolated fully with arbitrary other part 4012.If robot handles super cleaning and responsive material (for example wafer) in its part 4012, part 4012 is isolated with the remainder of this system can prevent rubbish part 4012 cross pollution cleaning parts 4012.And now manufacturer can be under different pressure operation part 4012.Manufacturer can have the vacuum level of substep, and vacuum enters into machine with becoming better and better.Utilize the big advantage of the vacuum separation valve 4006 between the part 4012 to be: in entering the other parts system of isolation ward part 4012, can handle automatic clean wafers (under the prerequisite that is not subjected to environmental pollution, after cleaning step, make and conveying need be between processing module) under the prerequisite of the gas of not removing material or wafer.

In an embodiment, can be the vacuum insulation between the robot, as the material that between robot, cushions as use buffer module 4010, small-sized processing module or inspection module 4010.

Fig. 5 shows the top view of linear process system 4000, as has the system of the linear structure identical with Fig. 4.

Multi-form robot can be used in the semiconductor manufacturing facility, as disclosed cluster tool in Figure 4 and 5 or linear process machine.

Fig. 6 shows 3 chain link SCARA arms 6002 and 4 chain link SCARA arms 6004.3 chain links or 4 chain link arms 6002,6004 are driven by the robot driver.3 chain link arms 6002 generally are used in the industry.When using 3 chain link SCARA arms 6002, this system does not have optimised, and reason is that extending range and containment are fine than not.Therefore, vacuum chamber needs bigger, and owing to the size of cost along with vacuum chamber sharply raises, so have the cost of 3 chain link SCARA arms, 6002 meeting increase systems.And the total floor space with system of 3 chain link SCARA arms 6002 becomes bigger.And the extending range of 3 chain link SCARA arms 6002 is less than 4 chain link arms 6004.In some cases, manufacturer wishes to obtain the earth, hands in the processing module dearly, and 4 chain link arms 6004 arrive farther its containment ratio that surpassed.This has advantage in some non--SEMI-standard processing modules.Also have when manufacturer think between the cover part big apart from the time advantage.

4 chain link arms 6004 are favourable, because it is folding to compare than 3 chain link SCARA arms, 6002 littler containments, but arrive fartherly for identical restriction diameter than 3 conventional chain link SCARA6002.Combine with the ability with second driver and the 24 chain link arm 6004 on being assemblied in this system top, it allows material exchange fast in processing module.For example, can on the top of as directed fixed drive or providing the transmission that rotatablely moves with the top of the locomotive of excitation arm and band on assembling 4 chain link SCARA arms 6004.In either case, 4 chain link arms 6004 randomly with the 24 chain link arm 6004, can provide fine and close, the long arm that stretches, and this arm can pass little opening under the prerequisite of not colliding edge of opening.

Fig. 7 shows the extending range and the containment characteristic of 4 chain link SCARA arms 7004.In an embodiment, it is long recently not suppress 4 chain link SCARA arms, 7004 chain links by optimization extending range and containment, as in other systems at some.Optimization extending range and containment second arm member more oversize than causing.When arm passes the actual groove valve of placing near the minimum limit diameter, this second arm member can with the inward flange collision of groove valve.Therefore can be based on the narrow size of meeting valve to calculate second (with the 3rd) chain link of avoiding the break-through of impingement designed arm.This can cause ratios very different between L1, L2 and the L3.The length of L2 can retrain the length of L3.The equation that is used for the optimization arm lengths can be 4 power equation formulas that are subjected to the iterative solution effect.

Fig. 8 shows the high-level component that is used for robot system 8002, comprises controller 8004, driver/motor 8008, arm 8010, end effector 8012 and material to be processed 8014.

Fig. 9 shows the assembly of both arms 9002 structures of the robots arm system that is used for treatment system.Arm 9004 assemblings, and 9008 assemblings of another arm from the top from the bottom.Two all is 4 chain link SCARA arms in an embodiment.Assembling second arm is favourable on the top.At some in other the system, arm has been connected to the driver via the top assembling of chamber, but lower and upper driver routinely machinery couple.In an embodiment, there is not mechanical connection between two drivers in Fig. 4 and the disclosed linear system of Fig. 5; Instead, can in software systems or controller, cooperate two arms (in order to prevent collision).If owing to the output reason is necessary, then can randomly only comprise second (top) arm 9008.

As the SCARA arm of routine, another feature is only to need that two motor drive 4 chain link arms.But the band keeping parallelism in the arm.For example, utilize parallel bar to replace band, also can obtain motion parallel or that other is reciprocity.Usually, only use two motor that the advantage of significant cost can be provided.Simultaneously, three motor can provide functional advantage, be because last (L4) chain link can be handled independently, yet other band, supporting, connection, axle and motor can make system become more expensive.In addition, too much band can increase significant thickness to arm mechanism, makes to be difficult to pass arm by (SEMI standard) groove valve.And, use less motor generally can simplify relevant control software.

But another feature of 4 chain link SCARA arms disclosed herein is the wrist disalignment.Because the bottom 9004 that ideal system has ceiling hold 9008 and assembles 4 chain link arms, so if the SEMI standard also must be observed by manufacturer, then the vertical setting of arm member is difficult to bonding.In brief, these standards have been specified size and have been passed through groove valve 4006 to the demand of handling in the module.They have also specified the horizontal plane of the center line top of necessary loaded with wafers in the above.Many existing processing modules satisfy this standard.In ungratified system, although determining of opening size and transmission plane is slightly different, the narrow valve 4006 that meets is made by similar shapes very.The restriction of SEMI standard scale needs the arm of very fine and close encapsulation.Utilize skew, wrist can make top arm 9008 and end arm 9004 be close together, and it is easier to make them pass the narrow valve 4006 that meets.If wrist does not depart from, then arm need vertically stop fartherly, and wafer exchange can take the more time, and is more because driver needs to move in vertical direction.The top arm design of proposing does not need the wrist skew, but wrist is offset the advantageously radius of turn of reduction system, and allows better mechanical arm layout, exists so disturb.

Figure 10 shows the extending range and the containment ability of 4 chain link SCARA arms 6004.

Figure 11 shows the interference characteristic 1102 of 4 chain link SCARA arms 6004.The wrist skew helps to make arm folding in than the little space of possible alternate manner.

Figure 12 shows the side view of one group of both arms, 4 chain link SCARA arms 6004.Especially because the constraint of top arm encapsulation must be constructed the arm with some unique features.In an embodiment, based on a chain ring part of indentation enter otch in another arm chain link.Band can be arranged to double, rather than single band, so that one is with 12004 above otch, is with 12008 below otch for one.Do not rely on the solution that this is the 4 chain link arm facts, make L2 low significantly by 12002, have vertical gap with L1, so that L3 and L4 can be in folded inside.Reduce L2 12002 and can make L3 and L4 arrive correct transfer plane, and can obtain containment ratio preferably.Owing to shift the qualification on plane, need to reduce L2 12002.

Figure 13 shows the embodiment that wherein uses the combination of band and connecting rod.Can finish the transmission of process L1 13002 and L3 13006 by single band or biobelt structure.On the contrary, the transmission among the L2 13004 can be finished by mechanical linkage (tooth bar) 13010.The advantage of this structure is to use closed joint, and it has reduced the vertical dimension of the arm assembling of the easier SEMI of the passing standard cell of permission arm valve.

Figure 14 shows the outside send-back system of the treatment system that is used to have linear structure 14000.Loopback mechanism randomly is positioned on the top of linear vacuum chamber.In the vacuum flush system of routine, loop-back path is generally passed the zone identical with ingress path.This has opened the possibility of cross pollution, and this occurs when the residue that is entered system at the clean wafer that moves between the treatment step from the dirty wafer that also is not cleaned pollutes.Also make for robot 4002 and must to handle that material enters and material is gone out, and feasiblely more be difficult to control vacuum environment.By withdraw from vacuum system at the rear portion and in air duct 14012 mobile wafer on the top of back to front, have some significant advantages: implementing the air loopback can be relatively inexpensive; The air loopback can discharge vacuum robot 4002, goes out because they may not handle material; And the air loopback makes the material finished break away from the zone of introducing to keep clean, reduced the danger of cross pollution thus.Adopt little load lock (load lock) 14010 can increase some costs at the rear portion, therefore can be air duct 14012, therefore in short and vacuum level and cross pollution are not so important system, the air loopback can have less value, but in having the long system of many integrated treatment steps, above-mentioned system air loopback can have significant advantage.Send-back system can also be the vacuum loopback, but more expensive more complicated with enforcement.Should be appreciated that load lock 14010 can be arranged on the linear system end in certain embodiments, describe that load lock 14010 can be arranged on Anywhere, as the centre in system as Figure 14.In such an embodiment, finished parts can enter or log off in another such some place in system, as system is fallen back in the air loopback.The advantage of middle system outlet point can be under the situation of partial system failure, can recover material or wafer.The advantage of middle system entry point can be that wafer can be inserted into the some positions in the system, can realize more significant handling flexibly flow process.In fact, middle system entry or exit position effect have been eliminated the EFEM position effectively as two machines that linked together by middle alliance.It is also understood that no matter what form manufacturer wishes, as being fit to the structure of fabrication tool, when the embodiment of Figure 14 and figure subsequently was rectilinear system, linear system can be a curve; That is, this system can have curve, U or V-arrangement, S shape or these combination or any other curved path.In each case, this system all randomly include stomion and from the entrance to the exit point of downgoing line (although randomly not being straight line).Randomly, the air loopback is delivered to the entrance with part from exit point.Randomly, this system can comprise more than one exit point.In each case, robots arm described here can help part is shifted to the center effectively, and does not have the problem of other linear system.Figure 14 shows the example of U-shaped linear system.

Still with reference to Figure 14, the embodiment of this system uses two carrier mechanisms 14008, so as the wafer of finishing soon loopback give the front of system, and so that can place unloaded tool 14008 in the position that has removed fully loaded tool just.In an embodiment, the air loopback comprises loopback the carrier 14008 of N wafer.Can be according to output and cost demand optimization N.In an embodiment, air loopback mechanism can comprise unloaded tool 14008 with box lunch when vacuum load lock 14010 removes fully loaded tool 14018, can place the new unloaded tool 14008 and the load of can turning lock 14010 immediately to receive more materials.In an embodiment, air loopback machine can be shifted to wafer the front of system.Can use vertical hoisting machine 14004 that carrier is reduced to the horizontal plane that EFEM (front equipment end module) robot can arrive at drop point.At load lock point, vertical hoisting machine 14004 can reduce to pick up unloaded tool 14008 from the load lock.

In an embodiment, air loopback mechanism can be used as the storage area 14014 of unloaded tool 14008, probably is placed on least significant end and back that load is locked 14010 positions.Reason to this is that when load lock 14010 discharged carrier 14018, gripping apparatus 14004 can grasp carrier 14018 and it is slightly moved forward.Gripping apparatus 14004 can discharge fully loaded tool 14018, a road and retracts and fetch unloaded tool 14008 then, and it is placed on the load lock 14010.Can withdraw from load lock 14010 at this some place.Gripping apparatus 14004 can be got back to fully loaded tool 14018 and now with its one tunnel front of shifting to system.In case carrier 14018 is turned by EFEM, it just can be transmitted back to the back side of waiting for next circulation.

Crane can also be put into to plant to be better than in the lotus lock and utilize moving both vertically in the gripping apparatus, but will be more expensive.Also with less slightly pliability.Manufacturer wishes that carrier 14018 moves both vertically in a few locations, and it is put into will be more economical in the gripping apparatus 14004, because manufacturer only needs a vertical mechanism.

Figure 15 shows some other details of the outside send-back system of the treatment system that is used for Figure 14.

Figure 16 shows the other details of the outside send-back system of the treatment system that is used for Figure 14.

Figure 17 shows the motion of the output carrier 14018 in the loopback channel 14012 of Figure 14.

Figure 18 shows the processing of the unloaded tool 14008 in the send-back system 14012 of Figure 14.

The unloaded tool 14008 that Figure 19 shows in the loopback channel 14012 of Figure 14 is locked moving in 14010 positions to load.

Figure 20 shows the unloaded tool 14008 and gripping apparatus 14004 the moving in the send-back system of Figure 14 of reducing and withdrawing from.

Figure 21 shows when being fully loaded with tool 14018 emptied space-time carrier 14008 in the loopback channel 14012 of Figure 14 and is receiving material.

The unloaded tool 14008 that Figure 22 shows and be parked in clip position in the loopback channel 14012 of Figure 14, begins newly to return circulation.

Figure 23 shows the structure of the handling implement that is used for manufacturing process, has two arm robot system 23002 and send-back system in linear structure.

Figure 24 shows the optional embodiment of the overall system architecture that is used for processing method of the present invention and system.

The floor space that Figure 25 shows linear system 25002 is compared the comparison of conventional group system 25004.Notice that about linear system 25002 this machine with other module can easily stretch in manufacturer, and can not influence system throughput.

Figure 26 shows the linear structure that disposes super-huge processing module 26002 in the treatment system according to the embodiment of the invention.

Figure 27 shows the back export structure that is used for according to the treatment system of the embodiment of the invention.

Figure 28 shows the various layout possibilities of employing according to the fabrication tool of the linear process system of various embodiments of the invention.

Figure 29 shows one embodiment of the present of invention, and wherein robot 29002 can comprise some drivers 29004 and/or some controllers 29008.Controller 29008 can be controlled some drivers 29004 and other peripheral components such as groove valve, vacuum measurer in an embodiment, and robot 29002 can be the some controllers 29008 that have a controller 29008 of some drivers 29004 or have some drivers 29004 thus.

Figure 30 shows the transfer plane 30002 of the relevant embodiment of the invention and the characteristic of groove valve 30004.

Figure 31 shows the upset gripping apparatus 31002 that is used for the wafer centering.The advantage of the upset gripping apparatus 31002 in Figure 32 above passive center gripping apparatus 32002 is between the back side of turner 31004 and wafer 31008 less physical activities to be arranged.Turner 31004 can touch the wafer 31008 that is centered on the end effector gradually, along with its move down supported on both sides it.In certain manufacturing process, wish with wafer 31008 centerings, as in vacuum environment.As when at the terminal employing of robots arm actuator, upset gripping apparatus 31004 can be handled very frangible wafer 31008, and this is because the two ends of its supporting wafers during handling.

Figure 32 shows the passive center end actuator 32002 that is used for holding chip 31008.When end effector rose (or wafer 31008 reduces), wafer 31008 generally slightly departed from the center.This can cause wafer 31008 to the slope lower slider and fall into otch 32004.This can cause wafer 31008 to plunk down or move, otherwise it can produce particle.

Method and system disclosed herein is providing many advantages aspect the processing of material or part during manufacturing process.In the middle of other things, can be the vacuum insulation between the robot, and the buffering of the material between the robot.Manufacturer can be transmitted back to the wafer of finishing the over top of system, and do not experience vacuum, it is very important advantage, only needs half essential treatment step, has eliminated the cross pollution between the material that finish and uncompleted and has kept and existing clean space design coexistence.When manufacturer has dirty relatively wafer when entering system, when manufacturer wishes they are cleaned and the remainder of machine keep apart the first step during it is normally handled.Material that maintenance is finished or that partly finish is favourable away from the cleaning part of machine.

Other advantage can be provided by method and system disclosed herein.Both arms (top assembling and bottom assembling) can mode arranged side by side be worked, and can realize very fast material exchange.No matter actual arm design (3 chain links, 4 chain links etc.), the assembling arm is favourable in the lid of the arm in not being mechanically connected to the bottom.Chain ring length at these 4 chain link SCARA arms that provide can be very favourable, does not resemble conventional arm, and they limit definite by the machinery of groove valve and chamber radius.4 chain link SCARA arms disclosed herein also are favourable, because they can use two motor for chain link, together with the Z motor, rather than three motor add the Z motor.

The linear vacuum system that material withdraws from the rear portion can provide a lot of benefits.Can carry out another implements to have the entrance system that passes two relative walls installations and to go out port system.

4 chain link SCARA arms disclosed herein can also make chain link L3 swing to chain link L2 its top that neutralizes to be used for the top robot driver.This is not easy to carry out to utilize 3 chain link SCARA, does not also have the distortion of 4 chain link SCARA arms, because they have wrong chain ring length.

The gripping apparatus and the some carriers position that are used for carrier in linear system also can provide many benefits aspect the material processed of linear manufacturing structure.Comprise in the gripping apparatus and/or the rear portion plants moving both vertically in the lotus lock and also can provide benefit.

Though described the present invention together with some preferred embodiment, those skilled in the art will recognize that, comprise other embodiment at this.

Figure 33 example comprise in the fabrication tool of entrance 33022.In an embodiment, fabrication tool can comprise that the load that wherein can take out or add wafer 31008 flows 33002 in locking.For this system, there is significant advantage, comprises two disposal abilities handling implement of (for example, connect two machines in back each other, but only need to use an EFBM) is provided.In an embodiment, air send-back system 14012 also can be delivered to new wafer 31008 at mid point 33022 and make wafer 31008 enter into the there.

Figure 34 example have several top views of the fabrication tool of middle entrance 33022.This figure also example the combination of middle entrance how to be used for eliminating one of EFEM34002 effectively.

Figure 35 example comprise the fabrication tool of a series of sensors 35002.In many fabrication tools, be used for test material 35104 as this sensor 35002 and whether still be present in robots arm 35018.This sensor 35002 generally can be placed on each vacuum chamber 4012 place of ingress and egress point.This sensor 35002 can be made up of vertical light beam, or adopts transmitter and detector, or adopts the combination of transmitter/detector and reflector.In the application of vacuum instrument, the exercise of robot platform is jointly finished by skilled operator, and this operator watches robots arm's position and material, and the adjustment robot location is deposited on correct position to guarantee material 35014.Yet these positions often are very difficult to observe, and there are significant obstacle in parallax and other optical problem when training machine robot system rightly.Therefore train operation can consume many hours equipment downtime.

Developed the application of several automatic training, but they can comprise the robots arm is gone in physical obstacle such as wall or the edge.This mode has significant downward trend: for example utilize ceramic material frangible but that can tolerate very high chip temperature to construct many end effector of robot, make robot physics contact barrier diminish the danger of pseudo-machine people or barrier.The object that very frangible and easy damage similarly, are arranged in many processing modules inside.In addition, can not adopt these to have some material as being present in the automatic training program of the wafer 31008 on the end effector of robot.And, determine that the upright position is more difficult, because cause that by clobber the power up or down to arm more is difficult to detect.

In system described herein, a series of sensor 35002-35010 can comprise horizon sensor 35004-35010 and vertical reference 35002.This combination of sensor 35002-35010 can test example be split as the light beam that passes end effector of robot, arm or jug object.When robots arm 35018 was in retracted position, vertical reference 35002 can be placed on the slightly outer portion in wafer 31008 zones.When robot was fully retracted, vertical reference 35002 can also or instead be placed on the position as the point 35012 in the wafer that places inlet opening front center and covered by wafer.Can tell the robot controller that successfully picks up wafer 31008 from peripheral module at this position sensor.

Also can advantageously adopt horizon sensor 35004-35010.In the vacuum cluster tool, because the major diameter of vacuum chamber, horizon sensor 35004-35010 can not carry out sometimes, and it can make aligning horizon sensor 35004-35010 more complicated.In system described above, can reduce the size of chamber significantly, make it comprise that more than one horizon sensor 35004-35010 is practicable thus.

Figure 36 example other possible position of horizon sensor 35004-35010 and vertical reference 35002, as chamber (36002 and 36008) and/or pass the straight line crosspoint of the mirror 36006 that is placed on vacuum system inside.

Figure 37 example when the robots arm is fully retracted sensor 35002 be placed on the possible advantage of the slightly outer portion of wafer 35002 radiuses.Between indentation moving period, sensor 35002 detects the forward position of wafers 37001 and detects the back edge of wafers 37001 at point " b " 37004 at point " a " 37002.These results show and have successfully fetched wafer 37001, but give encoder, decomposer or other position element that is present among the robot driver by contact sensor 35002 signals, sensor can also calculate with respect to end effector wafer 37001 centering whether.Because the circular geometry of wafer 37001, the mid point of line segment " a-b " 3700237004 should be corresponding to the center of end effector.If wafer 37001 slides on the end effector, inconsistent linear measure longimetry can be showed slip.

In addition, in subsequently rotation with between moving period, when slowly moving through sensor along the limit, wafer 37001 can detect second line segment " c-d " 37,008 37010.Have, the mid point between " c " 37008 and " d " 37010 should meet with the center of end effector again, and can realize the measurement or the affirmation of wafer centering.

Above method can make robot detect wafer 37001 and confirm whether wafer 37001 departs from endways desirable position on the actuator.

The combination of level and vertical reference 35002-35010 utilizes the noncontact method can make system very fast: under the prerequisite that does not need machinery to contact, but optical detection machine people's arm and end effector.In addition, during wafer 37001 is handled in real time, can use light beam to verify that wafer 37001 is in correct position during 37001 processing of each wafer are moved.

Figure 38 example have two rotating shafts 38020 with 38018 with vertical (Z) axle conventional vacuum driver of 38004.Bellows 38016 can carry out 38002 motions of vertical Z axle.The thin metal cylinder 38024 that is fixed to bellows 18016 bottoms can provide the rotor of motor 38010 and 38014 and the vacuum between the stator to stop.Many assemblies that vacuum was placed in this structure needed: electric wire and break-through, encoder, signal LED and pickup 38008, bearing 38012 and magnet 38006.Magnet 38006, bearing 38012, lead and connector and encoder are subject to be present in the influence of the residual treatment gas in the vacuum environment.In addition, when withdrawing from because gas must be followed the first class footpath 38022 of circling round, so be difficult to remove the gas that is trapped in cylinder 38024 bottoms.

Figure 39 example can use the vacuum robot driver of system described here.Can provide rotating driver power by two motor chucks (cartridge) 39004 and 39006.Each chuck all can have complete encoder 39008, bearing 39018 and magnet 39020.Some or all of these assemblies all can be arranged on the outside of vacuum casting.For example, utilize lip packing or ferrofluid seal, the vacuum insulation that concentric twin shaft rotatory sealing unit 39016 can be provided for rotatablely moving.This mode can reduce the quantity at the assembly of vacuum system inside.Under the prerequisite of not destroying vacuum, can also serve motor 39004,39006 and encoder 39008, increase the serviceability of actuator unit thus.

Figure 40 shows and is used for making material to enter the stacked vacuum load lock 14008,40004 of vacuum environment.The limiting factor that wafer 31008 is brought in the vacuum system is the speed that the load lock can be extracted into high vacuum.If it is too fast that the load lock is bled, then can occur in the air in planting the lotus lock chamber condensing, cause nucleon in wafer 31008 lip-deep depositions, it can cause particle and can cause defective or the device performance of difference.Cluster tool can adopt two load lock side by side, its each all alternately withdraw from.Can reduce the speed of evacuation of each load lock thus, thereby cause system's augmented performance.Utilize two load of vertically stacked to lock 4,008 40004, it is very little that the equipment floor space keeps, but keep the advantage of the extraction speed of reduction.In an embodiment, can increase load lock 40004 as selecting.In an embodiment robots arm 4004 and 40006 each can insert two load and lock in 4,008 40004 each.In an embodiment, remaining transfer module 7008 can be that single-stage is transferred module.

Figure 40 B shows another load lock layout.In the figure, wafer 31008 can enter and can two levels on the arbitrary limit of system withdraw from, but remaining shared stage also is same in system.

How Figure 41 has described in detail in whole process and also can implement stacked load by stacked two processing modules 41006,41008 and lock 4,008 40004 above-mentioned principle.Although this module does not meet the SEMI standard, this structure can provide significant advantage aspect equipment floor space and the output.

Figure 42 shows has two systems that handle level 4008,40004,4010,42004: can utilize top chain link 40006 or end chain link 4004 to transport wafer independently between module.Randomly, each is handled level and all can have two and plant the lotus lock so that the advantage of the above-mentioned extraction speed that reduces to be provided.Also plan to have four by the description that provides at this thus and imported load lock, two processing levels and four optional systems that export the load lock, as had the system that level is locked and handled to other load.

Figure 43 shows the top view of the system of Figure 42.

Figure 44 has described the object 44014 of a special equipment, as wafer.More than one sensor 44010 can be integrated in the object 44014, and can inspected object 44014 environmental factor on every side.Sensor 44010 can comprise proximity sense, as the proximity sense of capacitive, optics or magnetic.Sensor 44010 can be connected to amplifier/transmitter 44012, and it can use battery supply so that radio frequency or other sensor signal are transferred to receiver 44004 as the signal that meets the 802.11b standard.

In many cases, be difficult to maybe equipment to be placed on the object 44014 that is used for image training robot, because the environment that need provide power supply and the lead that conveys to instrument and sensor can disturb correct robot motion or robot to move through.By adopting the wireless connections object, can solve the connectivity problem of lead and object.

Object 44014 can be equipped with many sensors of the favourable pattern with dissimilar and different geometries.In this example, equal the radius placement sensor 1 to 6 (44010) of target object 44088 with radius.In an embodiment, these sensors are proximity senses.By relatively from sensor 44010 transient signal of sensor 1 and sensor 6 for example, can determine object 44014 whether with correct orientation near target 44088.If target 44008 is correctly approaching, then in two sensors 44010 demonstrates early stage triggering.By monitoring some sensors 44010, this system can determine before influence is transferred object 44010 whether correctly the center above target 44008.For example according to the efficient of signal analysis or any other constraint, can be with many pattern setting sensors 44010.Also handle radiofrequency signals advantageously under vacuum environment.

Figure 45 shows with example will measure the system of Figure 44 of side positioning that object 44014 is directed to the noncontact character of target 44008.Sensor 44010 can comprise the character that is used for measurement target 44008 such as other sensor of temperature.

Figure 46 has described to have the radio communication of one or more sensors.Radio frequency sensor signal 44016 can send the antenna 46002 in the vacuum to.Suitably the wavelength of selecting can improve the signal propagation with whole metal vacuum shells.Use can provide significant advantage with the sensor of outside receiver and controller radio communication.For example, this technology can reduce as finding the required time of operation of target's center, and can adopt from the information of sensor so that visual feedback is offered the operator, or utilizes some operation of robots arm's automation.In addition, use one or more sensors indoorly to measure and physically to check this chamber with what open needing in addition to discharge vacuum.This can be avoided in the inside of condition process chamber as decompression and consumption wealth or step consuming time when curing (evicting moisture or water vapour from).

Figure 47 example the function that moves along with robot of the output of some sensors 44010.When robot was mobile above target 44008, if sensor is a proximity sense, then this athletic meeting caused sensor to provide about for example arriving the range information of target 44008.Can be independently or jointly analytic signal to determine the position of target 44008 with respect to sensor.Do not having under the prerequisite of contact target 44008 physically, can on different directions, decompose position or shape with monitors sensor signal by movable sensor on two different directions.

Figure 48 has described to be used for inserting and removing from vacuum system the technology of wafer 48008.Can be independently or adopt one or more heating element heaters in combination, as one group of heating element heater 48002,48004 and 48006, so that chamber 4008 and baseplate material 48008 are heated to 50 ℃ to the high temperature more than 400 ℃.This increase of cranking temperature can alleviate condense of appearance along with the reduction of the pressure in the chamber in addition, and allows bleeding sooner of downward sequence to set up vacuum.When the wafer 48008 of heating moves to load when locking 4008 by robots arm 4002, their comparable shelfs 48004,48006 are warm a lot, so that shelf 48004,48006 can be by contact cooling wafer.Heating source can be adjusted the heat that offers shelf 48004,48006, to keep shelf and/or wafer temperature desired.The suitable material selection that is used for shelf 48004,48006 can cause the very fast arrival heating source of system to change, cause for the different temperature of different condition setting, for example chamber 4008 to higher temperature being set during the lower pumping and lower temperature being set between the exhaust cycle of chamber 4008.

Preheat wafer 48008 and can reduce to condense and particle, reduced the processing time simultaneously.Simultaneously, wafer 48008 can be awfully hot when logging off, so that they show the material of safe risk or melt process and support such as plastics.The internal temperature of about 80 to 100 ℃ of degree and about 50 ℃ of external temperatures below the degree for example can satisfy these general relations.

Figure 49 example end effector of robot 49002.Can reduce end effector of robot 49002 gradually, so that make it have the thickness of non-homogeneous by one or more axles.For example, when when a side or top are seen, end effector 49002 has taper.Taper can alleviate along the resonance of actuator 49002.Simultaneously, narrow relatively cross section profile (when when a side is seen) can make motor-driven easier between the wafer.Can be by grinding or process or obtaining the side view taper by processing with awl casting actuator 49002.Material such as carbon silicated aluminum (AlSiC9) can advantageously be cast as this shape, with avoid subsequently processing or other completing steps.Casting is handled and to be provided at the other advantage that wafer support material 49004 during the casting technique can be cast as mold, has reduced the quantity of the assembly that needs the physics assembling thus.

As shown in figure 50, similar technology can be applied to robots arm's part 50002 and 50004.Can obtain decay resonance in the aforesaid arm portion 5000250004 of identical depression effect.Can utilize various known technologies to obtain conical in shape, and can be implemented in the mobile faster and more accurate control in robots arm's part top that obtains.

Figure 51 shows the two independent SCARA arm that adopts five motor 51014.Can encourage each underarm 51002 and 51008 independently by motor 51014.Be connected described arm at upper arm 51004 with 51010 far-end.Except a bit stretching, extension of restriction, this structure has provided relatively little indentation radius.

Figure 52 shows the two independent SCARA arm that adopts 4 motor 52010.Chain link 52002 and 52004 can be shared for end effector 52006 and 52008.With during the stretching routine of underarm 52002, the desired end actuator (such as, 52008) be extensible in the processing module, and inactive end effector (such as, 52006) can point to this mode away from processing module, motor 52010 can be controlled end effector 52006 and 52008.

Figure 53 shows the robots arm of frogleg.Can use this arm together with various embodiment described here, as realizing the transfer of workpiece such as semiconductor wafer arm and arm in a series of this arms, as travelling workpiece between the semiconductor processes module.

Figure 54 shows two frog leg arms that can adopt in plane robot system, as the linearity in the disclosure, described, in arm and the arm system one.

Figure 55 A example 4 chain link SCARA arms as in the disclosure, describing, be assembled to car 55004.This car can move with linear mode by guide rail or magnetic suspension track 55008, and is driven by internal system or outside motor 55002.4 chain link SCARA arms have it are folded into than the advantage in the little indentation radius of 3 chain link SCARA arms, obtain the big stretching, extension in peripheral module such as processing module simultaneously, avoid the collision with the opening of arm that must break-through always.Can use counter-rotating car 55006 above car 55004, to transmit substrate.

Figure 55 B shows the top view of the system of describing among Figure 55 A.

Figure 56 example the utilization in the disclosure, described two independently with the linear system of single SCARA robots arm's combination.This system can be the same not intensive with the system of the 4 chain link SCARA arm robot systems of employing.

The demonstrated treatment system of the vertically stacked that adopts 4 chain link SCARA robots arms of Figure 57, wherein this arm can arrive any and all peripheral processes modules 5002.By rotating about 45 degree of processing module in top 57004 and with top component assembling level chamber, plane 57002 on earth, each processing module of top and bottom all can keep exposing and be used for service and insert and be used for load module, as pump, electrode, gas line etc.The layout that proposes can make up seven processing modules 5002 in very fine and close space.

Figure 58 A example the distortion of Figure 57, wherein the end level 58002 of this system by as a plurality of robot systems of in the disclosure, describing forms, and top level system 58004 employings are to become the processing module 5002 of miter angle orientation with the main system axle.The layout that proposes can make up nine processing modules 5002 in very fine and close space.

Figure 58 B example utilize rear portion outlet load locking tool to remove the distortion of Figure 58 A of substrate such as semiconductor wafer from system.

Figure 59 A shows the linear process system that holds large substrates processing module 59004, also allows service entrance 59002 and the position that two standard-sized processing modules 5002 also are provided simultaneously simultaneously.

Figure 59 B has demonstrated and has held the system layout of four big processing modules 59004 and standard size processing module 59002, also allows service to insert the inside of processing module 59002 simultaneously.

Figure 60 shows the two frog robot legs with basic arm on robot driven unit the same side.Couple to underarm 60002 supported mechanical two groups of upper arm 60004 of motor unit 54010.

Described several exemplary embodiment thus, recognize, various to those skilled in the art replacements, improvement and raising all will be to occur easily.This replacement, improvement and raising mean a part that forms the disclosure, and mean within the spirit and scope of the disclosure.Though comprise the particular combinations of function or structural detail at some examples of this proposition, should be understood that, can otherwise make up those functions and element according to the present invention, to finish identical or different purpose.Especially, behavior, element and the feature of discussing about embodiment do not mean eliminating identical in other embodiments or other role.Therefore, describe the preceding and accompanying drawing only by example, and do not mean restriction.

Claims (162)

1, a kind of semiconductor processing comprises:

Along the axle a plurality of robots arms in location and a plurality of processing module based on the treatment system of vacuum; And

By making workpiece first from these a plurality of robots arms pass among these a plurality of robots arms second, come travelling workpiece between these a plurality of processing modules.

2. method as claimed in claim 1, wherein treatment system is the linear process system.

3. method as claimed in claim 2, wherein workpiece enters and withdraws from the opposite end of linear treatment system.

4. method as claimed in claim 2, wherein the linear process system has the send-back system based on air.

5. method as claimed in claim 2, wherein workpiece withdraws from the midpoint of linear treatment system.

6. wherein there are at least two hand-off points in method as claimed in claim 1 between corresponding machine people arm.

7. method as claimed in claim 1, wherein the robots arm comprises at least one four chain link SCARA arm.

8. method as claimed in claim 1, wherein the robots arm comprises the SCARA arm that at least one pair of is vertically opposite.

9. method as claimed in claim 1 is wherein advanced in the passageway of workpiece between technical module.

10. method as claimed in claim 9, wherein this passageway and technical module are separated.

11. method as claimed in claim 1, wherein the robots arm is included in the ability of vertical travelling workpiece in the treatment system.

12. as the method for claim 11, wherein treatment system comprises the technical module by the vertically stacked of robots arm's service.

13. as the method for claim 11, wherein treatment system comprises the load lock by the vertically stacked of robots arm's service.

14. method as claimed in claim 1, its axis is linear.

15. method as claimed in claim 1, its axis is a curve.

16. method as claimed in claim 1, its axis form U-shaped shape basically.

17. method as claimed in claim 1, wherein these a plurality of robots arms comprise the SCARA arm.

18. method as claimed in claim 1, wherein these a plurality of robots arms comprise four chain link SCARA arms.

19. method as claimed in claim 1, wherein these a plurality of robots arms comprise three chain link SCARA arms.

20. method as claimed in claim 1, wherein the robots arm comprises frog robot leg arm.

21. method as claimed in claim 1, wherein the robots arm comprises two SCARA arms.

22. method as claimed in claim 1, wherein the robots arm comprises two frog arms.

23. method as claimed in claim 1, wherein the robots arm comprises four chain link SCARA arms.

24. method as claimed in claim 1, wherein the robots arm comprises the disymmetry arm of the coupler that has between a plurality of chain links, driven tool and the chain link.

25. method as claimed in claim 1, wherein these a plurality of robots arms are with manyly the providing the robots arm of link, and each link to all comprising two vertically disposed robots arms.

26. a semiconductor processing system comprises:

Along a plurality of processing modules that are provided with based on the axle in the treatment system of vacuum; And

A plurality of robots arms are used for coming conveying work pieces between these a plurality of processing modules by making workpiece pass to these a plurality of robots arms at least the second from first of this a plurality of robots arms.

27. as the system of claim 26, wherein treatment system is the linear process system.

28. as the system of claim 27, wherein workpiece enters and withdraws from the opposite end of linear treatment system.

29. as the system of claim 27, wherein the linear process system has the send-back system based on air.

30. as the system of claim 27, wherein workpiece withdraws from the midpoint of linear treatment system.

31., wherein between corresponding machine people arm, have at least two hand-off points as the system of claim 26.

32. as the system of claim 26, wherein the robots arm comprises at least one four chain link SCARA arm.

33. as the system of claim 26, wherein the robots arm comprises the SCARA arm that at least one pair of is vertically opposite.

34., wherein advance in the passageway of workpiece between technical module as the system of claim 26.

35. as the system of claim 34, wherein this passageway and technical module are separated.

36. as the system of claim 26, wherein the robots arm is included in the ability of vertical travelling workpiece in the treatment system.

37. as the system of claim 36, wherein treatment system comprises the technical module by the vertically stacked of robots arm's service.

38. as the system of claim 36, wherein treatment system comprises the load lock by the vertically stacked of robots arm's service.

39. a semiconductor processing comprises:

First robots arm is provided, is used to handle workpiece; And

Second robots arm is set, is used at the position science and engineering part vertical substantially with respect to first robots arm.

40., further comprise first robots arm mechanically is coupled to second robots arm as the method for claim 39.

41., further comprise making first robots arm mechanically separate second robots arm as the method for claim 39.

42. as the method for claim 39, wherein at least one is the SCARA arm among first robots arm and second robots arm.

43. as the method for claim 39, wherein at least one is four chain link SCARA arms among first robots arm and second robots arm.

44. as the method for claim 39, wherein at least one is three chain link SCARA arms among first robots arm and second robots arm.

45. as the method for claim 39, wherein the robots arm comprises frog robot leg arm.

46. as the method for claim 39, wherein the robots arm comprises two SCARA arms.

47. as the method for claim 39, wherein the robots arm comprises two frog arms.

48. as the method for claim 39, wherein the robots arm comprises four chain link SCARA arms.

49. as the method for claim 39, wherein the robots arm comprises the disymmetry arm of the coupler that has between a plurality of chain links, driven tool and the chain link.

50. a semiconductor processing system comprises:

First robots arm is used to handle workpiece, the contiguous technical module setting of this robots arm; And

Second robots arm is used to handle workpiece, and this second robots arm is arranged in the processing module of the position vertical substantially with respect to first robots arm.

51. as the system of claim 50, wherein first robots arm mechanically is coupled to second robots arm.

52. as the system of claim 50, wherein first robots arm mechanically separates second robots arm.

53. as the system of claim 50, wherein at least one is the SCARA arm among first robots arm and second robots arm.

54. as the system of claim 50, wherein at least one is four chain link SCARA arms among first robots arm and second robots arm.

55. as the system of claim 50, wherein at least one is three chain link SCARA arms among first robots arm and second robots arm.

56. as the system of claim 50, wherein at least one robots arm is the four chain link SCARA arms that linear movement is provided by end effector.

57. a system comprises:

The robot driver;

End effector is used to handle part; And

The robots arm, it is connected to end effector with robot driver mechanism, and this robots arm comprises four or more chain link and is used for the instrument of aligned end actuator.

58. as the system of claim 57, wherein alignment tools comprises one or more connector of four or more chain link that mechanically is coupled to each other, so that end effector moves on the direction at substantially linear under robot driver's the control.

59. as the system of claim 57, wherein alignment tools comprises motor.

60. as the system of claim 59, wherein alignment tools comprises and is used to stretch and the motor of the end effector of withdrawing and be used to rotate the motor of end effector.

61. as the system of claim 57, wherein each chain link all has the length of the extending range that is selected to the optimization robots arm and containment ratio.

62., wherein when the robots arm is stretched and withdraws, design the edge that described chain link is avoided the groove valve as the system of claim 57.

63. as the system of claim 57, wherein robots arm's chain link has that to be different from the length ratio be 1: 2: 1 ratio.

64., further comprise the controller of control robot driver operation as the system of claim 57.

65. as the system of claim 64, its middle controller is a remote controller.

66. as the system of claim 64, its middle controller is integrated with visual software program.

67. as the system of claim 64, its middle controller is controlled more than one robots arm.

68. as the system of claim 57, wherein the robots arm's of adjacent end actuator chain link comprises that the skew wrist is can make this arm folding.

69. as the system of claim 57, wherein the robots arm comprises at least one chain link, this chain link has the otch that can fold at least one other chain link therein.

70. as the system of claim 57, wherein the robots arm's at least two continuous chain links are stacked and the down suction is arranged, so that other chain link of at least one of robots arm can be folded in these two perpendicular separations between the continuous chain link at least.

71., further be included at least one the bypass tooth bar between the chain link as the system of claim 57.

72. a method comprises:

The robot driver is provided, is used to handle the end effector of part and robot driver mechanism is connected to the robots arm of end effector, this robots arm comprises four or more chain link; And

Interconnect each other four or more chain link, so that end effector moves on the direction at substantially linear under robot driver's the control, this robots arm comprises four or more chain link and is used for the instrument of aligned end actuator.

73. as the method for claim 72, wherein alignment tools comprises four the one or more connectors with contrachain ring that mechanically are coupled to each other, so that end effector moves on the direction at substantially linear under robot driver's the control.

74. as the method for claim 72, wherein alignment tools comprises motor.

75. as the method for claim 72, wherein alignment tools comprises and is used to stretch and the motor of the end effector of withdrawing and be used to rotate the motor of end effector.

76. as the method for claim 72, wherein each chain link all has the length of the extending range that is selected to the optimization robots arm and containment ratio.

77., wherein when the robots arm is stretched and withdraws, design the edge that described chain link is avoided the groove valve as the method for claim 72.

78. as the method for claim 72, wherein robots arm's chain link has that to be different from the length ratio be 1: 2: 1 ratio.

79., further comprise operation with controller control robot driver as the method for claim 72.

80. as the method for claim 79, its middle controller is integrated with visual software program.

81. as the method for claim 79, its middle controller is controlled more than one robots arm.

82. as the method for claim 72, wherein the robots arm's of adjacent end actuator chain link comprises that the skew wrist is can make this arm folding.

83. as the method for claim 72, wherein the robots arm comprises at least one chain link, this chain link has the otch that can fold at least one other chain link therein.

84. as the method for claim 72, wherein the robots arm's at least two continuous chain links are stacked and the down suction is arranged, so that other chain link of at least one of robots arm can be folded in these two perpendicular separations between the continuous chain link at least.

85., further be included at least one bypass tooth bar be provided between the chain link as the method for claim 72.

86. a system comprises:

The a plurality of technical modules that are used for semiconductor fabrication process, it is arranged on around the track of substantial linear;

Car, it is coupled to linear track movably and is provided with to such an extent that move along linear track; And

The robots arm, it is provided with and is used for workpiece manipulation between these a plurality of technical modules onboard.

87. as the system of claim 86, wherein the robots arm comprises the SCARA arm.

88. as the system of claim 87, wherein the SCARA arm comprises four chain link SCARA arms.

89. as the system of claim 87, wherein the SCARA arm comprises three chain link SCARA arms.

90. a method comprises:

Provide be arranged on the substantial linear track around, be used for a plurality of processing modules of semiconductor fabrication process;

Provide be coupled to linear track movably and be provided with the car that moves along linear track; And

The robots arm is set onboard, is used for workpiece manipulation between these a plurality of technical modules.

91. as the method for claim 90, wherein the robots arm comprises the SCARA arm.

92. as the method for claim 91, wherein the SCARA arm comprises four chain link SCARA arms.

93. as the method for claim 91, wherein the SCARA arm comprises three chain link SCARA arms.

94. a semiconductor processing system comprises:

Vacuum flush system, it is arranged in the structure of the substantially linear with load terminal and port of export; And

Antivacuum send-back system, it is used for part is transmitted back to load terminal from the port of export.

95. as the system of claim 94, wherein antivacuum send-back system is arranged on the top of vacuum flush system.

96. as the system of claim 94, wherein antivacuum send-back system is arranged on the below of vacuum flush system.

97. as the system of claim 94, wherein antivacuum send-back system is arranged on the next door of vacuum flush system.

98. as the system of claim 94, wherein antivacuum send-back system is arranged on the inside of vacuum flush system.

99. as the system of claim 94, wherein send-back system is connected to the middle entrance of vacuum flush system.

100. as the system of claim 94, wherein antivacuum send-back system comprises the load lock at the port of export, is used for part is moved to antivacuum send-back system from vacuum flush system.

101. as the system of claim 94, wherein antivacuum send-back system comprises slide mechanism and the gripping apparatus that is used for part is moved to from the port of export load terminal.

102. as the system of claim 94, wherein vacuum flush system comprises a plurality of processing modules.

103. as the system of claim 102, wherein vacuum flush system is included in one or more robots arms of mobile part between the processing module.

104., further comprise by part first from these a plurality of robots arms being sent to second a plurality of robots arm that come mobile part among these a plurality of robots arms as the system of claim 103.

105. as the system of claim 104, wherein these a plurality of robots arms comprise the SCARA arm.

106. as the system of claim 104, wherein these a plurality of robots arms comprise four chain link SCARA arms.

107. as the system of claim 104, wherein these a plurality of robots arms comprise three chain link SCARA arms.

108. as the system of claim 104, wherein these a plurality of robots arms comprise the robots arm of the link of at least one pair of setting that is perpendicular to one another.

109. as the system of claim 104, wherein these a plurality of processing modules are at the factor that changes aspect the floor space more than two or two.

110. system as claim 94, further comprise semiconductor manufacturing tool, this semiconductor manufacturing tool comprises a plurality of linear semiconductor treatment systems, these a plurality of linear semiconductor treatment systems are arranged side by side, so that the load terminal of these a plurality of linear semiconductor treatment systems is towards the passage of semiconductor manufacturing tool.

111. semiconductor manufacturing tool, this semiconductor manufacturing tool comprises a plurality of linear semiconductor treatment systems, these a plurality of linear semiconductor treatment systems are arranged side by side, so that the load terminal of these a plurality of linear semiconductor treatment systems is towards the passage of semiconductor manufacturing tool.

112. a semiconductor manufacturing tool, this semiconductor manufacturing tool comprise a plurality of linear semiconductor treatment systems, these a plurality of linear semiconductor treatment systems are provided with end to endly, so that this system forms linear process system ring.

113. semiconductor manufacturing tool, it comprises at least one the upset gripping apparatus that is used to receive semiconductor wafer, this upset gripping apparatus comprises a pair of gripping apparatus module, wherein each gripping apparatus module all is configured to receive in the semiconductor wafer at pair of parallel edge one, wherein in a single day receive each gripping apparatus module rotation of semiconductor wafer a position, wherein the horizontal component of gripping apparatus module is in the horizontal plane supporting semiconductor wafers, and the vertical component of gripping apparatus module prevents that semiconductor wafer from moving at horizontal plane.

114. the method for a process semiconductor wafers comprises:

Be provided for keeping the end effector of semiconductor wafer, wherein end effector comprises and is configured to prevent the receiving slit that semiconductor wafer moves simultaneously at horizontal plane upper support semiconductor wafer in horizontal plane, and wherein end effector comprises disposing when be placed on semiconductor wafer on the end effector and makes semiconductor wafer slide into slope in the receiving slit.

115. a semiconductor processing system comprises a plurality of robots arms, the actuator tool of at least two share common among these a plurality of robots arms.

116. as the system of claim 115, wherein at least one among these a plurality of robots arms is the SCARA arm.

117. as the system of claim 115, wherein at least one among these a plurality of robots arms is four chain link SCARA arms.

118. as the system of claim 115, wherein at least two among these a plurality of robots arms work independently.

119. as the system of claim 115, wherein at least two among these a plurality of robots arms work relatively.

120. a semiconductor processing system comprises the robots arm with frog leg arm configuration, this frog leg arm configuration comprises at least two pairs of frog leg arms.

121. a material processing method comprises:

Be provided for handling the robots arm of material, this robots arm has at least three chain links, connects this chain link so that they can rotate relative to one another in the plane of substantially parallel motion; And

Joint is provided between at least two contiguous links, and wherein this joint has been set up the space between the vertical plane of the motion of contiguous links, so that the 3rd chain link can be folded in the plane of movement between the plane of movement of contiguous links.

122. as the method for claim 121, wherein this robots arm is arranged in the vacuum flush system.

123. as the method for claim 121, wherein this robots arm is among a plurality of robots arms one, and wherein the robots arm passes to another arm with material from an arm.

124. a material handling system comprises:

Be used to handle the robots arm of material, this robots arm has at least three chain links, connects this chain link so that they can rotate relative to one another in substantially parallel plane of movement; And

Joint between at least two adjacent chain links, wherein this joint is set up the space between the vertical plane of contiguous links motion, so that the 3rd chain link can be folded in the plane of movement between the plane of movement of contiguous links.

125. as the system of claim 124, wherein the robots arm is arranged in the vacuum flush system.

126. as the system of claim 124, wherein the robots arm be among a plurality of robots arms one and wherein the robots arm material is passed to another arm from an arm.

127. a method of handling material comprises:

Four chain link SCARA robots arms are provided; And

Four chain link SCARA robots arms four chain link SCARA robots arms are set, so that can handle material in vacuum flush system in vacuum flush system.

128. as the method for claim 127, wherein four chain link SCARA robots arms pass to a plurality of SCARA arms of another arm one with material from an arm between the processing module of semiconductor fabrication process.

129. as the method for claim 127, wherein processing method is linear.

130. as the method for claim 127, wherein processing method has the load terminal and the port of export, wherein this port of export is away from load terminal.

131. as the method for claim 127, wherein processing method be have based on air send-back system based on vacuum.

132. as the method for claim 127, wherein processing method has the load locking tool that is arranged on mid point.

133., four chain link SCARA robots arms wherein are set to avoid interference groove valve based on the treatment system of vacuum as the method for claim 127.

134. as the method for claim 127, wherein processing method comprises two four vertically opposite chain link SCARA robots arms.

135. as the method for claim 127, wherein processing method comprises a plurality of processing modules that are used for semiconductor fabrication process.

136. as the method for claim 127, wherein at least two processing modules are arranged on the different vertical position with respect to the linear direction of material processing method.

137. as the method for claim 127, wherein material processing method comprises the stretching, extension load locking tool that is used to load.

138. as the method for claim 127, wherein the robots arm is included in the ability that moves perpendicular on the vertical direction of the linear direction of handling, so that a robots arm can serve the processing module that is arranged in Different Plane.

139. as the method for claim 138, wherein this method comprises a plurality of robots arms.

140. as the method for claim 127, wherein this processing is multistage.

141. as the method for claim 127, wherein this processing comprises the technical module that is provided with the irregular angle with respect to linear direction.

142. as the method for claim 141, wherein this irregular angle is between 90 and 180 degree.

143. as the method for claim 127, wherein at least one technical module is oversized technical module.

144. as the method for claim 143, wherein this oversized processing module comprises and is used for the swivelling cover that the top by technical module provides access.

145. a system that is used to handle material comprises:

Four chain link SCARA robots arms are arranged in the vacuum flush system, so that four chain link SCARA robots arms can handle material in vacuum flush system.

146. as the system of claim 145, wherein four chain link SCARA robots arms pass to a plurality of SCARA arms of another arm one with material from an arm between the technical module of semiconductor fabrication process.

147. as the system of claim 145, wherein treatment system is the linear process system.

148. as the system of claim 145, wherein treatment system has the load terminal and the port of export, wherein this port of export is away from load terminal.

149. as the system of claim 145, wherein treatment system has based on the treatment system of vacuum with based on the send-back system of air.

150. as the system of claim 145, wherein treatment system has the load locking tool that is arranged on the treatment system midpoint.

151., wherein dispose four chain link SCARA robots arms to avoid interference groove valve based on the treatment system of vacuum as the system of claim 145.

152. as the system of claim 145, wherein treatment system comprises two four vertically opposite chain link SCARA robots arms.

153. as the system of claim 145, wherein treatment system comprises a plurality of processing modules that are used for semiconductor fabrication process.

154. as the system of claim 145, wherein at least two processing modules are arranged in the different vertical position with respect to the linear direction of material handling system.

155. as the system of claim 145, wherein material handling system comprises the stretching, extension load locking ability that is used to load treatment system.

156. as the system of claim 145, wherein the robots arm is included in the ability that moves on the vertical direction vertical with the linear direction of treatment system, so that a robots arm can serve the technical module that is arranged in the treatment system Different Plane.

157. as the system of claim 156, wherein this system comprises a plurality of robots arms.

158. as the system of claim 145, wherein treatment system is the multistep treatment system.

159. as the system of claim 145, wherein this treatment system comprises the technical module that is provided with the irregular angle with respect to the linear direction of treatment system.

160. as the system of claim 159, wherein this irregular angle is between 90 and 180 degree.

161. as the system of claim 145, wherein at least one technical module is oversized technical module.

162. as the system of claim 161, wherein this oversized technical module comprises and is used for the swivelling cover that the top by technical module provides access.

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