CN1902031A - Methods and systems for handling workpieces in a vacuum-based semiconductor handling system - Google Patents

Methods and systems for handling workpieces in a vacuum-based semiconductor handling system Download PDF

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CN1902031A
CN1902031A CN 200480040124 CN200480040124A CN1902031A CN 1902031 A CN1902031 A CN 1902031A CN 200480040124 CN200480040124 CN 200480040124 CN 200480040124 A CN200480040124 A CN 200480040124A CN 1902031 A CN1902031 A CN 1902031A
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system
arm
robot arm
method
processing
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CN 200480040124
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P·范德莫伊伦
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布卢希弗特科技公司
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Abstract

提供用于在基于真空的半导体处理系统中处理材料的方法和系统,包括用于从一个臂到另一个臂处理材料的方法和系统,目的是横穿线性处理系统。 Provide for linear traversing of the vacuum processing system based on a semiconductor processing system method and system for processing material comprising from one arm to another arm to material processing system and method, object Yes.

Description

用于处理基于真空的半导体处理系统中的工件的方法和系统 Method for processing a vacuum-based semiconductor workpiece processing system, and the system

背景技术 Background technique

1.技术领域本发明涉及半导体制造领域,尤其是涉及在真空处理系统中用于材料输送的机器。 1. Technical Field The present invention relates to semiconductor manufacture, and particularly relates to a machine for transporting material in a vacuum processing system.

2.相关技术的描述当前的半导体制造设备有几种不同的形式,其每个都具有显著的缺点。 2. Description of Related Art The semiconductor manufacturing apparatus of the present there are several different forms, each of which has significant disadvantages. 群集(cluster)工具是在中央机器人臂周围放射地布置一组半导体处理模块的机器、占用大量的空间、较慢并且依靠它们的结构限制于少量半导体处理模块,典型地最大值约为五或六。 Cluster (Cluster) around the central tool in the robot arm is arranged radially module a set of semiconductor processing machines, take up a lot of space, by virtue of their slow and limited to a small number of structures in semiconductor processing module, typically a maximum of about five or six . 线性工具,当比群集工具提供更大的灵活性和更大速度的潜能时,不很好地适合最当前的半导体制备装置的当前基础结构;而且,在半导体制造的典型真空环境内的设备组件的线性运动在当前线性系统中会产生问题,如由组件之间的摩擦产生的不可接受级的颗粒。 Linear tools, while providing greater flexibility and potential for greater speed than the cluster tool, is not well suited for most current semiconductor fabrication device current infrastructure; and, in a typical vacuum environment of the semiconductor manufacturing equipment components the linear movement may cause problems in the current linear system, such as an unacceptable level of particles produced by the friction between the components. 存在使用放射状处理模块布置和线性布置的组合的若干混合结构。 The presence of several hybrid structure using radial processing module arrangement and combination of the linearly arranged.

一种形式的线性系统使用轨道或轨迹,具有可以容纳由制造设备处理的零件的移动车。 One form of linear rail or track system, having a traveling vehicle can be accommodated by the production process of the apparatus part. 该车可或不可容纳装配到车上的可移动臂上的材料。 The car may or may not fit into the receiving material car movable arm. 在其它问题中轨道型线性系统难以包括真空内缓冲器,其需要使用更太空间的侧壁装配或其它结构。 Track type linear systems in other difficult problems include a vacuum in the buffer, which requires more side walls or other structures too fitting space. 而且,在轨道型系统中,在轨道上必需具有大量的车来保持生产量,其在系统可靠性和所处理材料的安全性方面是复杂的、昂贵的且高危险性的。 Further, in the track-type system, on the track must have a large number of vehicles to maintain production volume, which is complicated in terms of system reliability and safety of the processed material, costly and high risk. 此外,为了使材料从车移动到处理模块中,必需将一个或两个臂装配在车上,其会使该系统更复杂。 Further, in order to move the material from the vehicle to the processing module, it is necessary to assemble one or both arms in the car, which makes the system more complicated. 在没有断开线性电动机或轨道的前提下,利用轨道系统难以隔离真空系统的部分,其在技术上是非常复杂和昂贵的。 Under the premise of a linear motor is not disconnected or rails, the rail system is difficult to use the isolated portion of the vacuum system, which is technically very complex and expensive. 由于该臂建立了难以补偿的悬臂,所以如果车是机械浮动的,则装配到导轨系统上的车的臂可以具有显著的偏转问题。 Since the compensation of the arm is difficult to establish a cantilever, so if the car is mechanically floating, the vehicle is fitted to the arm rail system may have a significant deflection problems. 如果用物理导轨上的轮装配/绞合,则车会具有颗粒问题。 If guide wheel assembly on the physical / twisted, the vehicle will have a particle problem.

需要能够克服群集工具的固有限制、同时避免线性工具的问题的半导体制造设备。 We need to be able to overcome the inherent limitations of the cluster tool, while avoiding the problems of the semiconductor manufacturing equipment linear tool.

发明内容 SUMMARY

在此提供了用于材料输送的方法和系统,尤其是处理系统,如真空处理系统,其可以在很致密的底面积(footprint)中移动晶片或其它基板。 Provided herein are methods and systems for transporting materials, in particular the processing system, such as vacuum processing system which can (footprint of) a wafer or other substrate is moved in a very dense bottom area. 虽然所述方法和系统可以用于半导体制造,但应当理解的是,在此描述的方法和系统可以用于在有利于真空中处理材料的任何处理或工业中。 While the method and system may be used in semiconductor manufacturing, it should be understood that the methods and systems described herein may be used to facilitate any industrial process or a vacuum process material. 如在此所使用的,除了上下文表明不同的方式外,术语制造设备、处理系统、机器人处理系统、真空处理系统、半导体处理系统、半导体制造设备、晶片处理系统、制造系统等意指包含用于处理和制造零件如半导体晶片或其它零件的所有类型的系统、处理和设备。 As used herein, except where the context indicates that the outer different ways, the term manufacturing equipment, processing system, the robotic system, the vacuum processing system, a semiconductor processing system, semiconductor manufacturing equipment, a wafer processing system, comprising means for manufacturing systems the manufacture of parts and processing all types of systems, equipment and processing a semiconductor wafer or other parts.

提供了用于在制造工艺中处理零件的方法和系统,包括多个工艺模块,每个都用于执行对零件的处理,并且至少一个4链环机器人SCARA臂用于在工艺模块之间移动零件。 A method and a system for handling parts in a manufacturing process, comprising a plurality of process modules, each for performing processing on the parts, and at least a SCARA robot link arm 4 for moving the part between the process modules . 在实施例中,连同真空处理系统一起使用所述方法和系统。 In an embodiment, the vacuum processing system used in conjunction with the method and system together.

方法和系统包括多个工艺模块,每个都用于对零件和双机器人臂工具执行处理,其中双机器人臂工具包括顶臂和底臂,用于在工艺模块之间处理零件。 The methods and systems include a plurality of process modules, each for performing processing on the robot arm and two-part tool, wherein the tool comprises a double-arm robot top arm and a bottom arm, the part between the process for the processing module. 在实施例中,双机器人臂工具包括两个相对的4链环SCARA臂。 In an embodiment, the dual arm robot tool comprises two opposing links 4 SCARA arm.

方法和系统包括沿着轴以基本线性结构设置的多个工艺模块和用于将零件从一个工艺模块移动到另一工艺模块的至少一个处理工具,其中处理工具包括机器人臂。 The method and system include a plurality of process modules along the axis substantially linear configuration and arranged for moving the parts from one process to another process module at least one processing tool module, wherein the process tool comprises a robotic arm. 在实施例中,所述方法和系统包括真空制造工具。 In an embodiment, the method and system comprises a vacuum producing means. 在实施例中,机器人臂是单个或双SCARA臂。 In an embodiment, the robot arm is a single or double SCARA arm. 在实施例中,SCARA臂是4链环SCARA臂。 In an embodiment, a SCARA arm links 4 SCARA arm. 在实施例中,该臂是单个、双或跳跃蛙腿式臂。 In an embodiment, the arm is a single, double or jumping frog-leg arms. 在实施例中,SCARA臂具有多于或少于四个的链环。 In an embodiment, SCARA arm link having more or less than four.

方法和系统包括基本线性结构的制造设备,具有输入端和输出端,其中制造设备包括真空工具和回送工具,该回送工具在制造工艺期间在零件到达输出端之后用于将零件回送到输入端。 The method and system include manufacturing apparatus substantially linear structure, having an input and an output, wherein the manufacturing apparatus comprises a vacuum means and returning means, the loopback tool during the manufacturing process for the part back to the input terminal after the part reaches the output terminal. 在实施例中,制造设备包括多个工艺模块,其中通过机器人臂工具在工艺模块之间移动零件。 In an embodiment, the manufacturing apparatus comprises a plurality of process modules, wherein the tool is moved by the robot arm part between the process modules. 在实施例中,机器人臂工具是SCARA臂工具。 In an embodiment, the tool is a SCARA robotic arm tool arm. 在实施例中,SCARA臂工具包括4链环SCARA臂。 In an embodiment, the tool includes a SCARA arm links 4 SCARA arm. 在实施例中,SCARA臂工具包括双相对的4链环SCARA臂。 In an embodiment, the tool includes a SCARA arm 4 double link SCARA arm opposite. 在实施例中,回送工具是空气回送,同时工艺模块处于真空中。 In an embodiment, loopback loopback air tools, process modules at the same time in a vacuum.

在实施例中,存在沿着线性系统的若干输入和输出工具。 In an embodiment, there are a number of input and output of the tool along the linear system. 在实施例中,基于空气的抓具可以采取具有晶片的裁具并且将它放到在不同于初始入口点的点处的线性系统中,如下行线的半路处。 In an embodiment, the air based on the gripper may take the cutting tool having a wafer and place it in a linear system at a point different from the initial entry point in the row below the halfway line. 在实施例中,抓具可以在不同于末端出口点的位置移除材料,如在线的中点。 In an embodiment, the gripper may remove a position different from the material outlet end points, such as the midpoint of the line.

在实施例中,在此公开的方法和系统是曲线的,即,线性系统不必须处于直线结构。 In an embodiment, the method and system disclosed herein is curvilinear, i.e., the system must not be in a straight linear configuration.

在一个方面中,在此公开的系统包括多个工艺模块,也称为工艺模块,每个工艺模块都对工件进行一个以上的制造处理,该工艺模块设置用于以从第一工艺模块到最后工艺模块的序列顺序地处理工件;以及配置在第一工艺模块和最后工艺模块之间的中入口点,以给该序列增加工件或从中入口点处自该序列移除工件。 In one aspect, the system disclosed herein includes a plurality of process modules, process module also known, each process module of the workpiece one or more manufacturing process is provided for the process module to process module from the first to the last sequence of process modules sequentially process a workpiece; configuration and the entry point between the first process module and the last module of the process, to the sequence to increase from the inlet point of the workpiece or the sequence is removed from the workpiece.

该工件可在中入口点处进入该序列。 The workpiece can be entered at the entry point in the sequence. 该工件可在中入口点处退出该序列。 The workpiece may exit the sequence at the entry point. 该系统可进一步包括多个中入口点,每个中入口点都设置在多个处理模块中的两个之间。 The system may further comprise a plurality of entry points, each entry point are arranged between two of the plurality of processing modules. 该系统可进一步包括回送机构,该回送机构将工件移动到多个中入口点的第一个并且从多个中入口点的第二个取回工件。 The system may further comprise means loopback, loopback mechanism which moves the workpiece to the first entry point and the plurality of second workpieces retrieved from the plurality of inlet points. 可以以所选择的、顺序子组的多个处理模块处理该工件。 It may be the selected subset of the plurality of processing modules sequentially processing the workpiece. 依据将工件增加到该序列的中入口点或从该序列移除工件的中入口点中的至少一个,可布置处理模块以进行多个不同的制造工艺。 The workpiece according to the sequence added to the entry point, or removed from the workpiece in the sequence, at least one entry point, the processing module may be arranged to perform a plurality of different manufacturing processes. 中入口点可连接多个不同的制造工具。 Connecting a plurality of inlet points may different manufacturing tools. 制造工具可设置成保存空间。 Manufacturing tools can be set to save space. 两个制造工具由中入口点连接时是比分离时是更多节省空间的。 When two neutral manufacturing tool entry point is connected to more than the separation space-saving. 处理模块可在受控的环境下对工件操作。 The processing module may operate on the workpiece in a controlled environment. 受控的环境可包括真空、受控压力、受控温度、受控的空气纯度或受控的气体混合物中的至少一个。 It may include a vacuum controlled environment, a controlled pressure and controlled temperature, controlled air purity or controlled gas mixture at least one.

在另一方面中,如在此描述的用于处理工件的方法可包括顺序地设置多个处理模块,以对工件顺序地操作;经由中入口点连接两个处理模块;以及在中入口点将工件增加到该序列。 In another aspect, a method for processing a workpiece as described herein may include a plurality of processing modules arranged in sequence, to operate sequentially on the workpiece; two processing modules connected via the inlet point; in the inlet point and the sequence of the workpiece is increased. 在另一方面中,方法可包括顺序地设置多个处理模块以对工件顺序地操作;经由中入口点连接两个处理模块;以及在中入口点从该序列移除工件。 In another aspect, the method may comprise a plurality of sequentially arranged processing modules to sequentially operate on the workpiece; two processing modules connected via the inlet point; and removing the workpiece from the entry point in the sequence.

在此公开的方法可包括在装载端和出口端之间的基本线性轴周围提供多个基于真空的处理模块;以及提供中间的载荷锁定工具,用于将零件存放到装载端和出口端之间的基于真空的处理模块、或者从装载端和出口端之间的基于真空的处理模块移除零件。 The methods disclosed herein may include providing a plurality of vacuum-based processing modules around the substantially linear axis between the loading end and an outlet end; between the locking means and providing an intermediate load, the parts stored in a loading end and an outlet end parts removed based on the vacuum-based processing module between the vacuum processing module, or from a loading end and an outlet end.

该方法可进一步包括提供基于空气的运送系统,用于将零件运送到中间载荷锁定工具和从中间栽荷锁定工具运送零件。 The method may further comprise providing an air-based delivery system for transporting a load to the intermediate parts and the locking means the locking means from the intermediate plant charge transport component. 该方法可包括在中间载荷锁定点处引入零件。 The method may include a locking part is introduced at a point in the middle load. 该方法可进一步包括移除在中间载荷锁定点处的零件。 The method may further include removing the locking element at a point in the middle load. 该方法可包括沿着顺序处理提供多个中间载荷锁定点。 The method may include providing a plurality of points along the intermediate load lock sequential processing. 中间载荷锁定点中的每一个都设置在两个相邻的基于真空的处理模块之间。 Intermediate load lock points are each disposed between two adjacent vacuum-based processing module. 该方法可包括提供回送机构,用于将零件移动到多个中间载荷锁定点中的一个或从多个中间载荷锁定点中的一个移动零件。 The method may include providing a loopback mechanism for moving the plurality of components to a point intermediate the load lock or a locking point in the moving parts from a plurality of intermediate load. 可由在两个中间载荷锁定点之间的、所选择的、顺序子组的多个处理模块处理该工件。 , The selected subset of the plurality of processing modules in the sequence of processing the workpiece between the two points can be locked in an intermediate load. 可依据将工件增加到该序列的该多个中间载荷锁定点中的至少一个或者从该序列移除工件的多个中间载荷锁定点中的一个,来设置基于真空的处理模块以进行多个不同的制造工艺。 Lockable points according to the plurality of the workpieces intermediate load increase at least one of the sequence or removed from said workpiece loading locking sequence a plurality of intermediate points, to set the vacuum based processing module to perform a plurality of different manufacturing process. 该载荷锁定点可连接多个不同的制造工具。 The load lock may be connected to a plurality of different point of manufacturing tools. 可设置制造工具来保存空间。 Manufacturing tools can be set to save space. 多个制造工具中的两个由载荷锁定点连接时是比分离时更多节省空间的。 Is separated more than two space-saving when a plurality of tools manufactured by the load connected to the locking point. 基于真空的处理模块可在受控的环境对工件操作。 Work environment can be controlled based on the operation of the vacuum processing module. 受控的环境可包括真空、受控压力、受控温度、受控的空气纯度或受控的气体混合物中的至少一个。 It may include a vacuum controlled environment, a controlled pressure and controlled temperature, controlled air purity or controlled gas mixture at least one.

在此描述的系统可包括顺序设置的多个处理模块,以对工件顺序地操作;连接装置,其用于经由中入口点连接两个处理模块;以及增加装置,其用于在中入口点处将工件增加到该序列。 The system described herein may include a plurality of processing modules arranged in sequence, in order to operate the workpiece; connecting means for connecting the processing module via two entry points; and increasing means for at the entry point sequence added to the workpiece.

在此描述的系统可包括顺序设置的多个处理模块,以对工件顺序地操作;连接装置,其用于经由中入口点连接两个处理模块;以及移除装置,其用于在中入口点处移除工件至该序列。 The system described herein may include a plurality of processing modules arranged in sequence, in order to operate the workpiece; connecting means for connecting the processing module via two inlet points; and removing means, which is the entry point for the removing the workpiece to the sequence.

在另一方面中,在此描述的制造工具可包括用于处理零件的一系列基于真空的处理模块;以及一对载荷锁,用于将零件运送到一个以上的基于真空的处理模块和从一个以上的基于真空的处理模块取得零件,其中邻近一个以上的基于真空的处理模块垂直叠置设置载荷锁。 In another aspect, manufacturing tool described herein may include a series of vacuum-based processing means for processing part; and a pair of load locks, conveyed to the parts for more than one vacuum-based processing module and from a obtaining parts based on the above vacuum processing module, wherein adjacent to one or more vacuum-based processing module is arranged vertically stacked load lock.

该系统可进一步包括用于处理零件的一个以上的机器人臂。 The system may further comprise one or more parts of the robot arm for processing. 所述的一个以上的机器人臂可包括SCARA臂。 Or more of the robotic arm may comprise a SCARA arm. 所述的一个以上的机器人臂可包括四链环SCARA臂。 One or more of the robotic arm may comprise four link SCARA arm. 所述的一个以上的机器人臂可包括三链环SCARA臂。 Said one or more robot arm may include three links SCARA arm. 所述的一个以上的机器人臂可包括一对垂直叠置的四链环SCARA臂。 Said one or more robotic arm may comprise a pair of four links SCARA arm vertically stacked. 在实施例中臂是单个的、双或跳跃蛙腿式臂。 In an embodiment the arm is a single, double or jumping frog-leg arms. 该系统可在处理系统中的不同点处包括若干对垂直叠置的栽荷锁。 The system may be at different points in the processing system comprises a plurality of vertically stacked lock bearing plant. 不同点可包括半导体处理系统的入口点和出口点。 Different points may include an inlet and exit points of the semiconductor processing system. 不同点可包括半导体处理系统的中间点。 Different points may include an intermediate point of the semiconductor processing system.

在此描述的制造工具可包括机器人组件;工件;和传感器,该传感器用于监测由机器人组件对工件进行的处理。 Manufacturing tools described herein may include a robotic assembly; workpiece; and a sensor for monitoring the processing of the workpiece by the robot assembly. 该传感器可包括光传感器、接触传感器、邻近传感器、声波传感器、电容传感器和磁性传感器中的至少一种。 The sensor may include an optical sensor, a contact sensor adjacent to the at least one sensor, a sonic sensor, a capacitive sensor and a magnetic sensor. 该传感器可包括垂直邻近传感器。 The sensor may include a vertical proximity sensor. 该传感器可包括水平邻近传感器。 The level sensor may comprise a proximity sensor. 该系统可包括对角设置的多个传感器。 The system may comprise a plurality of sensors disposed diagonally. 该系统可包括在多个位置的多个邻近传感器。 The system may comprise a plurality of proximity sensors at a plurality of positions. 该传感器可包括用于检测工件、机器人组件或执行器臂中一个以上的运动的传感器。 The sensor may comprise a sensor for detecting the workpiece, the robot arm or actuator assembly in more than one motion. 该系统可包括用于确定机器人组件的位置的多个传感器。 The system may comprise a plurality of sensors for determining the position of the robot assembly. 该系统可包括设置以检测机器人组件的最后位置的多个传感器。 The system may comprise a plurality of sensors arranged to detect the final position of the robot assembly. 该最后的位置可以是伸展位置或缩进位置或者伸展位置和缩进位置之间的临时位置。 The final position may be a retracted position and an extended position between the extended position or retracted position or a temporary position. 该传感器可提供用于检验工件路径的信号。 The sensor may provide a signal path for testing the workpiece. 该传感器可检测移除位置的工件,可响应于来自工件移动出位置的传感器的信号停止制造工艺。 The sensor can detect the removal position of the workpiece, in response to a signal from the sensor position to stop the movement of the workpiece fabrication process. 机器人臂可将上件移动到安全位置。 On the robot arm can be moved to a safe position. 机器人臂可自动地移动工件。 The robot arm may be automatically moving the workpiece. 机器人臂可在用户控制下移动工件。 Work robot arm is movable under user control. 可使用传感器来防止机器人臂或工件中的至少一个与制造工具的碰撞。 Sensors may be used to prevent a collision with the at least one manufacturing tool or a workpiece in the robot arm.

该传感器可传达给发射器。 The sensor may be communicated to the transmitter. 发射器可包括无线发射器。 The transmitter may include a wireless transmitter. 无线发射器可将传感器信号从传感器传达给无线接收器。 The wireless transmitter may convey the sensor signal from the sensor to the wireless receiver. 无线接收器可连接至处理器。 The wireless receiver may be connected to the processor. 处理器可向用户表明传感器的位置。 The processor may indicate to a user the position sensor. 传感器信号可表明传感器的位置。 The sensor signals may indicate the location of the sensor. 该系统可包括提供能量给传感器的电池。 The system may include providing power to the battery sensor. 该系统可包括电池,该电池提供能量给耦接至传感器的发射器。 The system may include a battery that provides power to the sensor coupled to the transmitter. 可使用该传感器来训练该机器人组件。 The sensor may be used to train the robotic assembly. 可在真空中训练该机器人组件。 The robot assembly can be trained in vacuo. 该传感器可无线地耦接至外部接收器,由此防止排出真空到大气的需要,以及在暴露到大气条件之后烘焙出晶片制造系统的处理模块的湿气的需要。 The sensor may be wirelessly coupled to an external receiver, thereby preventing the need for the vacuum required to be discharged to the atmosphere, and after exposure to atmospheric conditions baking the wafer processing module manufacturing system of moisture. 传感器反馈可提供传感器的位置。 Sensor feedback position sensor may be provided. 该传感器可贴附到工件。 The sensor may be attached to the workpiece. 该传感器可放置在晶片制造系统的处理模块之内。 The sensor may be placed within a wafer processing module of the manufacturing system. 传感器可用在有害的环境中。 Sensors can be used in hazardous environments. 用户可基于传感器反馈控制机器人组件。 The user may be based on sensor feedback control of the robot assembly. 传感器可用于机器人组件的非碰撞训练。 Sensors may be used non-robotic assembly collision training. 非碰撞训练防止工件或机器人组件中的至少一个的碰撞。 Training non-collision or the workpiece to prevent the robotic assembly of at least one collision. 该传感器可提供机器人组件的位置,该机器人组件包括一个以上的机器人臂。 The sensor assembly may provide a position of the robot, the robot assembly comprises at least one robot arm. 该传感器可提供工件的位置,该工件包括半导体晶片。 The sensor may provide a position of the workpiece, the workpiece comprises a semiconductor wafer. 该传感器可提供工件的定向,该工件包括半导体晶片。 The sensor may provide the orientation of the workpiece, the workpiece comprises a semiconductor wafer. 该传感器可设置在晶片制造系统的处理模块之内。 The sensor may be disposed within the wafer processing module of the manufacturing system.

在另一方面中,如在此描述的用于仪器装备机器人晶片制造系统的方法可包括:提供机器人组件;提供工件;以及在机器人组件、工件、或围绕机器人组件和工件的处理模块的室中的至少一个上设置传感器,该传感器监测在工件上由机器人组件进行的制造工艺。 In another aspect, a method for manufacturing a wafer robotic instrumentation system described herein may include: providing a robotic assembly; providing a workpiece; and a robotic assembly in the chamber, the workpiece or the processing modules around the workpiece and robotic assembly disposed on at least one sensor that monitors the manufacturing process performed by the robot on the workpiece assembly. 另一方法可包括提供用于半导体制造工艺的机器人臂;以及提供多个传感器,该传感器用于监测在制造工艺的处理模块内的位置,该位置包括垂直位置和水平位置。 Another method may include providing a robotic arm for a semiconductor manufacturing process; and providing a plurality of sensors, the sensors for monitoring the position of the manufacturing process in the processing module, which includes a vertical position and horizontal positions.

该传感器可检测机器人臂的末端执行器的位置。 The sensor may detect the position of the end effector of the robot arm. 该传感器可检测机器人臂的位置。 The sensor may detect the position of the robot arm. 该传感器可检测由机器人臂的末端执行器夹持的工件的位置。 The sensor may detect the position sandwiched by the end effector of the robot arm of the workpiece. 该工件可以是晶片,并且当机器人臂缩进时可设置至少一个传感器以被晶片覆盖。 The workpiece may be a wafer, the robot arm is retracted and when the at least one sensor may be provided so as to be covered wafer. 该工件可以是晶片,并且至少一个传感器可放置在晶片半径的外部,以便在机器人臂的伸展和缩进位置之间的晶片移动期间传感器检测晶片的前沿和晶片的后沿。 The workpiece may be a wafer, and at least one sensor may be placed outside the radius of the wafer, so that the leading edge and the trailing edge of the wafer during wafer sensor for detecting the movement of wafer between the extended and retracted position of the robot arm. 使用前沿和后沿的检测来确定晶片是否以机器人臂的执行器为中心。 Use detecting leading and trailing edges of the wafer to determine whether to perform the robot arm as a center. 该传感器可包括光束分断传感器。 The sensor may include a beam breaking sensor. 至少两个传感器可彼此横跨真空室设置。 At least two sensors may be disposed to each other across the vacuum chamber. 可沿着真空室的对角设置传感器。 The sensor may be disposed along the diagonal of the vacuum chamber. 该方法可进一步包括提供镜以从真空室内的至少一个传感器引入束。 The method may further include providing a mirror to introduce the vacuum chamber from the at least one sensor beam. 该方法可进一步包括检测机器人臂的位置以训练机器人臂来执行半导体处理动作。 The method may further comprise detecting a position of the robot arm to train the robot arm to perform a semiconductor processing operation.

在一个方面中,在此公开的处理方法可包括提供具有传感器的工件,该传感器用于检测接近于工件的条件;将工件设置在处理系统中;以及为了检测关于由处理系统处理工件的条件,从传感器接收数据。 In one aspect, the treatment methods disclosed herein may include providing a workpiece having a sensor, the sensor detecting a condition close to the workpiece; workpiece disposed in a processing system; and for detecting conditions on a workpiece by a processing system, receiving data from the sensors.

工件可以是半导体晶片。 The workpiece may be a semiconductor wafer. 工件可配置成半导体晶片的形状。 Workpiece may be configured in shape of the semiconductor wafer. 该传感器可以是邻近传感器、电容传感器、光学传感器、温度计、压力传感器、化学传感器、辐射检测器和磁性传感器中的至少一个。 The sensor may be a proximity sensor, a capacitive sensor, an optical sensor, a thermometer, a pressure sensor, a chemical sensor, a radiation detector and at least a magnetic sensor. 该方法可包括从传感器发射射频数据。 The method may comprise transmitting radio frequency data from the sensor. 该方法可包括从传感器将数据传送给处理系统。 The method may comprise transmitting data from the sensor to the processing system. 该方法可包括检测工件与处理系统部件的接近性。 The method may comprise detecting the proximity of a workpiece handling system components. 该方法可包括利用来自传感器的数据在半导体处理工艺中训练机器人臂。 The method may include using data from the sensor processing robot arm training process in a semiconductor. 该处理系统可以是半导体处理系统。 The processing system may be a semiconductor processing system.

在另一方面中,在此描述的系统可包括处理系统;设置在处理系统内的工件;以及连接至工件的传感器,该传感器检测邻近工件的条件,该传感器提供与该条件有关的信号。 In another aspect, the systems described herein may include a processing system; a workpiece disposed within the processing system; and a sensor coupled to the workpiece adjacent the workpiece sensor detects the condition, the sensor provides a signal related to the condition.

该工件可以是半导体晶片。 The workpiece may be a semiconductor wafer. 可以以半导体晶片的形状配置工件。 May be configured in the shape of the workpiece is a semiconductor wafer. 该传感器可以是邻近传感器、电容传感器、光学传感器、温度计、压力传感器、化学传感器、辐射检测器和磁性传感器中的至少一个。 The sensor may be a proximity sensor, a capacitive sensor, an optical sensor, a thermometer, a pressure sensor, a chemical sensor, a radiation detector and at least a magnetic sensor. 该系统可包括用于从传感器发射射频数据的发射器。 The system may comprise a radio frequency transmitter for transmitting data from the sensor. 该工件可具有至处理系统的数据连接。 The workpiece may have a connection to a data processing system. 该传感器可检测工件与处理系统部件的接近性。 The sensor may detect proximity of the workpiece handling system components. 可训练机器人臂以利用来自传感器的数据进行半导体处理工艺。 Robotic arm can be trained using data from the sensors to a semiconductor process technology. 该处理系统可以是半导体处理系统。 The processing system may be a semiconductor processing system.

在一个方面中,在此描述的系统可包括设置在保持于真空制造工艺的室中的真空中的机器人组件;以及用于激励机器人组件移动的一个以上的驱动器,所述的一个以上的驱动器包括真空外部的电动机驱动器硬件。 In one aspect, the system described herein may include a robotic assembly for a vacuum in the chamber is maintained at a vacuum of the manufacturing process; and for one or more drive excitation robotic assembly moves said at least one drive comprises outside the vacuum motor drive hardware.

电动机驱动器硬件可包括一个以上的电线。 Motor driver hardware may include more than one wire. 电动机驱动器硬件可包括一个以上的编码器。 Motor driver hardware may include more than one encoder. 该电动机驱动器硬件可包括一个以上的信号LED。 The motor driver hardware may include more than one signal LED. 电动机驱动硬件可包括一个以上的拾取器。 The motor drive hardware may comprise one or more pickup. 电动机驱动器硬件可包括一个以上的轴承。 Motor driver hardware may include more than one bearing. 电动机驱动器硬件可包括一个以上的磁体。 Motor driver hardware may include more than one magnet. 如利用唇形密封或铁磁流体密封,电动机驱动器硬件可密封真空。 The use of ferrofluid seals or lip seals, the motor drive hardware may be vacuum-sealed. 可存在最小排气的组件。 Minimum discharge assembly may exist. 该系统可包括提供快速真空下降的真空泵。 The system may include providing a fast decrease pump vacuum. 在没有释放处理模块中的真空的前提下,可通过接入电动机驱动器硬件提高电动机驱动器硬件的可服务性。 In vacuo premise processing module is not released, the motor drive can be improved by the access hardware motor driver hardware serviceability. 电动机驱动器硬件可包括机器人驱动器。 Motor driver hardware may include a robotic drive. 电动机驱动器硬件可在处理模块外部。 Motor drive hardware may be outside the processing module. 可设置电动机驱动器硬件以在真空中存在最小表面。 Drive motor may be provided with minimal hardware present on the surface in a vacuum. 可使用最小材料来最小化排气。 Minimal material may be used to minimize the exhaust gas. 在真空外部设置电动机驱动器硬件可提供较快的抽空。 Disposed outside the vacuum motor drive hardware may provide faster evacuation. 该系统可包括用于机器人组件的至少一个驱动器腔。 The system may comprise at least one drive chamber for the robot assembly. 真空可保持在驱动器腔中。 Vacuum can be maintained in the drive chamber. 该驱动器腔的体积可以是小的。 The volume of the drive chamber can be small.

如在此描述的用于在基于真空的半导体处理系统中驱动机器人的系统可包括驱动器卡盘,其提供旋转驱动力给机器人的驱动轴;和旋转密封单元,其中旋转密封单元密封真空外部的驱动器卡盘,同时驱动器轴设置在真空中。 As for the vacuum-based semiconductor processing system drive system of the robot may include a driver chuck drive shaft to provide rotational driving force to the robot described herein; seal outside the vacuum and rotation of the sealing unit, wherein the rotary seal unit driver chuck, while the drive shaft is disposed in a vacuum.

驱动器卡盘可包括一对驱动器卡盘,每个都具有集成的编码器、轴承和磁体。 Drive chuck may include a pair of drives chuck, each having an integrated encoder, and a magnet bearing. 旋转密封单元可以是同心的、多轴的旋转密封单元。 Rotary seal means may be a concentric, multi-axis rotation of the sealing unit. 该旋转密封单元可使用唇形密封。 The rotary seal unit may use a lip seal. 该旋转密封单元可使用铁磁密封。 The unit may use rotary seal ferroseal. 驱动器卡盘可移地和可代替地耦接至驱动器轴。 Drive chuck may be shifted and instead coupled to the drive shaft.

在一个方面中,在此描述的方法可包括将机器人组件设置在保持于真空制造工艺的室中的真空中;设置一个以上的驱动器,用于激励在真空外部的机器人组件的运动,所述一个以上的驱动器包括电动机驱动器硬件;以及经由基于真空的接口将机器人组件耦接至一个以上的驱动器。 In one aspect, the methods described herein may include a robotic assembly disposed in a vacuum chamber held in a manufacturing process in a vacuum; more than one drive is provided for movement of the external excitation vacuum robot assembly, the a the above driver includes a motor drive hardware; and one or more vacuum-based interface via the robot assembly is coupled to the drive.

电动机驱动器硬件可包括一个以上的电线、一以上的编码器、一个以上的信号LED、一个以上的拾取器、一个以上的轴承、和/或一个以上的磁体。 Motor driver hardware may include one or more wires, one or more encoders, one or more of the LED signal, more than one pickup, more than one bearing and / or at least one magnet. 如利用唇形密封或铁磁密封,电动机驱动器硬件可密封真空。 The use of a sealing lip or sealing ferromagnetic, the motor drive hardware may be vacuum-sealed. 可存在最小排气的组件。 Minimum discharge assembly may exist. 真空泵可包括提供快速真空抽空。 Vacuum pump may include providing a fast evacuation. 在没有释放处理模块中的真空的前提下,可通过接入电动机驱动器硬件提高电动机驱动器硬件的可服务性。 In vacuo premise processing module is not released, the motor drive can be improved by the access hardware motor driver hardware serviceability. 电动机驱动器硬件可包括机器人驱动器。 Motor driver hardware may include a robotic drive. 电动机驱动器硬件可在处理模块外部。 Motor drive hardware may be outside the processing module. 可设置电动机驱动器硬件以在真空中存在最小表面。 Drive motor may be provided with minimal hardware present on the surface in a vacuum. 可使用最小材料来获得最小的排气。 Minimum exhaust gas can be obtained using the minimum material. 可在真空外部设置电动机驱动器硬件以提供较快的抽空。 Motor drive hardware may be provided externally in vacuo to provide a rapid evacuation. 该方法可包括用于机器人组件的至少一个驱动器腔。 The method may comprise at least one drive chamber for the robot assembly. 真空可保持在驱动器腔中。 Vacuum can be maintained in the drive chamber. 该腔的体积可以是小的。 The volume of the chamber can be small.

在此描述的系统可包括机器人组件,其设置在保持于真空制造工艺的室的真空中;真空外部的电动机驱动器硬件的一个以上的组件;以及耦接装置,其用于将电动机驱动器硬件的一个以上的组件耦接至机器人组件。 The system described herein may include a robotic assembly, which is disposed in a vacuum chamber maintained at a vacuum of the manufacturing process; one or more components outside the vacuum motor driver hardware; and a coupling means for a motor drive hardware the above components coupled to robotic assembly.

在此公开的半导体制造系统可包括多个垂直叠置的装载台;以及多个垂直叠置的处理模块。 The semiconductor manufacturing system disclosed herein may include a plurality of vertically stacked load station; and a plurality of vertically stacked processing modules.

可提供四个以上的垂直叠置的处理载荷台。 Processing stations may provide a load vertically stacked more than four. 多个垂直叠置的装载台中的一个供给包括多个垂直叠置的处理模块中的一个以上的制造工艺。 A plurality of vertically stacked loading above the supply station comprises a plurality of vertically stacked processing modules in a manufacturing process. 可装载多个垂直叠置的装载台中的第二个,同时多个垂直叠置的装载台中的一个供给制造工艺。 Can carry a plurality of vertically stacked second loading station, while a plurality of vertically stacked load station feed manufacturing process. 可调整多个垂直叠置装载模块的装载以最小化等待时间。 A plurality of vertically stacked load adjustable loader module to minimize latency. 可设置多个垂直叠置的处理模块以减小系统的底面积。 The processing module may be provided a plurality of vertically stacked to reduce the bottom area of ​​the system. 至少一个机器人能够接入垂直叠置装载台中的任一个。 At least one robot is able to access any of a vertically stacked loading station. 该系统可包括多个垂直叠置的出口台。 The system may comprise a plurality of vertically stacked outlet station.

至少一个机器人组件能够接入垂直叠置出口台中的任一个。 At least one robot to access vertically stacked assembly of any of a station outlet. 至少一个机器人组件能够接入多于一个的垂直叠置处理模块。 At least one robot is able to access more than one component vertically stacked processing modules. 至少一个机器人组件能够接入多于一个的水平相邻的处理模块。 At least one robot is able to access more than one component of the horizontally adjacent processing module. 该系统可包括在两个水平相邻的处理模块之间的至少一个夹持台。 The system may include at least one between the two horizontally adjacent clamping table processing module. 该系统可包括一个以上的垂直叠置的中入口台。 The system may comprise one or more vertically stacked in the inlet station. 该系统可包括可以接入多于一个垂直叠置中入口台的至少一个机器人组件。 The system may include at least more than one robot can access a vertically stacked assembly inlet station. 工件可穿过相邻处理模块的多个不同路径移动。 The workpiece may move through a plurality of different paths of adjacent process modules. 多个垂直叠置的处理模块可包括一个以上的基于真空的处理模块。 A plurality of vertically stacked processing modules may comprise one or more vacuum-based processing module. 该系统可包括设置在与半导体制造工艺的入口点或出口点中至少一个邻近的多个垂直叠置的载荷锁。 The system may include a semiconductor manufacturing process at the entry point or the exit point of at least a plurality of adjacent vertically stacked load lock. 多个垂直叠置的处理模块可以基本线性的结构设置。 A plurality of vertically stacked processing modules may be disposed substantially linear structure. 该系统可包括在多个垂直叠置的处理模块之间移动工件的一个以上的机器人臂。 The system may comprise more than one robot arm to move the workpiece between a plurality of vertically stacked processing modules. 该系统可包括顶机器人臂组和底机器人臂组中的至少一个。 The system may comprise a top and a bottom set of the robot arm of the robot arm at least one group. 一个以上的机器人臂中的至少一个可垂直移动以接入多个垂直叠置的处理模块中一个的顶处理模块和多个垂直叠置处理模块中一个的底处理模块。 One or more robot arms at least one vertically movable to access a plurality of vertically stacked processing modules in a top and a plurality of processing modules in a vertically stacked processing modules of processing module substrate. 多个垂直叠置处理模块中的至少一个可包括垂直叠置的多于两个的处理模块。 A plurality of vertically stacked processing modules comprise at least one of more than two vertically stacked processing modules.

在此公开的是一种用于在半导体制造工艺中设置处理模块的方法,包括:提供多个处理模块;设置多个处理模块中的至少两个,以便它们水平相邻;以及设置多个处理模块中的至少两个以便它们垂直相邻。 Disclosed herein is a method for setting a processing module in a semiconductor manufacturing process, comprising: providing a plurality of processing modules; provided at least two of the plurality of processing modules, so that they are adjacent to the horizontal; and a plurality of processing so that they are at least two vertically adjacent modules.

可提供四个以上的垂直叠置装载台。 It provides four or more vertically stacked loading station. 多个垂直叠置的装载台中的一个供给包括多个垂直叠置的处理模块中的一个以上的制造工艺。 A plurality of vertically stacked loading above the supply station comprises a plurality of vertically stacked processing modules in a manufacturing process. 可装载多个垂直叠置的装载台中的第二个,同时多个垂直叠置的装载台中的一个供给制造工艺。 Can carry a plurality of vertically stacked second loading station, while a plurality of vertically stacked load station feed manufacturing process. 可调整多个垂直叠置装载模块的装载以最小化等待时间。 A plurality of vertically stacked load adjustable loader module to minimize latency. 可设置多个垂直叠置的处理模块来减小系统的底面积。 The processing module may be provided a plurality of vertically stacked to reduce the bottom area of ​​the system. 至少一个机器人组件能够接入多个垂直叠置装载台中的任一个。 At least one robot assembly can access any of a plurality of vertically stacked load station. 该方法可包括提供多个垂直叠置的出口台。 The method may include providing a plurality of vertically stacked outlet station. 至少一个机器人组件能够接入垂直叠置出口台中的任一个。 At least one robot to access vertically stacked assembly of any of a station outlet. 至少一个机器人组件能够接入多于一个垂直叠置的处理模块。 A robotic assembly at least capable of accessing more than a vertically stacked processing modules. 至少一个机器人组件可接入多于一个的水平相邻的处理模块。 At least one robot can access more than one component of the horizontally adjacent processing module.

该方法可包括提供在两个水平相邻处理模块之间的至少一个夹持台。 The method may include providing between horizontally adjacent two of the processing modules at least one clamping station. 该方法可包括提供一个以上的垂直叠置的中入口台。 The method may include providing a vertically stacked one above the inlet station. 至少一个机器人组件能够接入多于一个的垂直叠置的中入口台。 A robotic assembly at least capable of accessing more than one inlet of vertically stacked units. 工件可穿过相邻处理模块的多个不同路径移动。 The workpiece may move through a plurality of different paths of adjacent process modules. 多个垂直叠置的处理模块可包括一个以上的基于真空的处理模块。 A plurality of vertically stacked processing modules may comprise one or more vacuum-based processing module. 该方法可包括提供设置在与半导体制造工艺的入口点或出口点中至少一个邻近的多个垂直叠置的载荷锁。 The method may include providing a plurality of vertically stacked load lock is provided at the entry point or the exit point of the semiconductor fabrication process of the at least one neighboring. 多个垂直叠置的处理模块可以基本线性的结构设置。 A plurality of vertically stacked processing modules may be disposed substantially linear structure. 该方法可包括在多个垂直叠置的处理模块之间移动工件的一个以上的机器人臂。 The method may include more than one robot arm to move the workpiece between a plurality of vertically stacked processing modules. 一个以上的机器人臂可包括顶机器人臂组和底机器人臂组中的至少一个。 More than one robot arm may comprise a top end of a robot arm and the robot arm group at least one group. 一个以上的机器人臂中的至少一个可以垂直移动以接入多个垂直叠置处理模块中一个的顶处理模块和多个垂直叠置处理模块中一个的底处理模块。 At least one vertically movable above a robotic arm to access a plurality of vertically stacked processing modules of processing module and a plurality of vertically stacked processing modules in a substrate processing module top. 多个垂直叠置处理模块中的至少一个可包括垂直叠置的多于两个的处理模块。 A plurality of vertically stacked processing modules comprise at least one of more than two vertically stacked processing modules.

在此描述的晶片制造方法可包括提供具有操作温度基本上在环境温度以上的处理模块;接收引入到处理模块中的晶片,该晶片具有接近环境温度的温度;以及将晶片加热到更靠近操作温度的温度。 Wafer manufacturing method described herein can include providing a processing module has an operating temperature substantially above ambient temperature; introduced into the process module receives the wafer, the wafer having a temperature close to ambient temperature; and the wafer was heated to a temperature closer to the operation temperature.

加热晶片可包括在转移到处理模块之前在预加热台中加热晶片。 It may comprise heating the wafer processing module before transfer to heat the wafer in the preheating station. 该方法可进一步包括在从包括处理模块的制造工艺移除晶片之前,将晶片冷却到靠近环境温度的温度。 The method may further comprise including in the manufacturing process prior to removal from the wafer processing module, the wafer is cooled to a temperature close to ambient temperature. 冷却晶片可包括将晶片冷却到防止当从制造工艺移除晶片时晶片上凝结的温度。 Cooling the wafer may include the wafer is cooled to prevent condensation when the temperature of the wafer when the wafer is removed from the manufacturing process. 该方法可包括在用材料处理器处理晶片之前预加热材料处理器。 The method may include a pre-heating the material prior to the material for wafer handler processor. 加热晶片可包括将晶片加热到防止当晶片引入到处理模块中时晶片表面凝结的温度。 Heating the wafer may include heating the wafer to prevent the wafer when introduced to the processing module in a wafer surface condensation temperature. 加热晶片可包括在处理模块的真空抽空期间加热晶片。 Heating the wafer may include the wafer is heated during the vacuum evacuation processing module. 加热晶片可包括将晶片加热到防止在处理模块的加速真空抽空期间晶片表面凝结的温度。 It may include heating the wafer to prevent the wafer is heated in a vacuum to accelerate the evacuation of the processing module of the surface temperature of the wafer during the condensation. 加热晶片可包括通过热应用通过预加热材料处理器加热晶片。 Heating the wafer by heat application processor may comprise preheating the material by heating the wafer. 该方法可包括通过控制处理晶片的材料处理器的温度来控制晶片的冷却。 The method may include controlling the cooling temperature of the material of the wafer by wafer process control processor.

在此描述的晶片制造系统可包括具有操作温度基本上在环境温度以上的处理模块;引入到处理模块中的晶片,该晶片具有接近环境温度的温度;以及加热装置,其用于将晶片加热到更靠近操作温度的温度。 Wafer manufacturing system described herein may include an operating temperature substantially above ambient temperature, the processing module; introduced into the process module wafer, the wafer having a temperature close to ambient temperature; and a heating means for heating the wafer closer to the temperature of the operating temperature.

在另一方面中,在此描述的晶片制造系统可包括具有操作温度基本上在环境温度以上的处理模块;以及材料处理器,其在将晶片引入到处理模块之前将晶片加热到接近操作温度的温度。 In another aspect, the wafer fabrication system described herein may include a processing module operating temperature substantially above ambient temperature; and a material of a processor prior to introducing the wafer into the wafer processing module is heated to a temperature close to the operating temperature.

加热晶片可包括在转移到处理模块之前在预加热台中加热晶片。 It may comprise heating the wafer processing module before transfer to heat the wafer in the preheating station. 该系统可包括冷却装置,其用于在从包括处理模块的制造工艺移除晶片之前,将晶片冷却到靠近环境温度的温度。 The system may include a cooling means for including in the manufacturing process prior to removal from a wafer processing module, the wafer is cooled to a temperature close to ambient temperature. 冷却晶片可包括将晶片冷却到防止当从制造工艺移除晶片时晶片上凝结的温度。 Cooling the wafer may include the wafer is cooled to prevent condensation when the temperature of the wafer when the wafer is removed from the manufacturing process. 可在处理晶片之前预加热材料处理器。 The processor may be pre-heated before processing the wafer material. 可将晶片加热到防止当晶片引入到处理模块中时晶片表面凝结的温度。 It may be heated to prevent the wafer when the wafer is introduced into the processing module in a wafer surface condensation temperature. 可在处理模块的真空抽空期间加热晶片。 The wafer may be heated during the vacuum evacuation processing module. 可将晶片加热到防止在处理模块的加速真空抽空期间晶片表面凝结的温度。 The wafer may be heated to prevent condensation of the wafer surface during acceleration of the vacuum evacuation processing module temperature. 可通过热应用通过预加热的材料处理器加热晶片。 It can be heated by application of heat by the pre-heated material wafer processor. 在实施例中,可通过加热晶片本身的加热器来加热晶片。 In an embodiment, the wafer may be heated by a heater heating the wafer itself. 该加热器可以安装或容纳在同样与晶片加热器独立加热的载荷锁中。 The heater may be mounted or housed in the same load lock and wafer heater independently heated. 该方式一个可以独立地控制载荷锁定室(其主要影响抽气期间的凝结),和晶片预加热或后冷却。 This embodiment can be controlled independently a load lock chamber (which mainly affects the clotting during pumping), and after pre-heating or cooling the wafer. 该载荷锁将具有大量的热,由此仅慢慢反应在所希望的温度改变。 The load lock having a large amount of heat, thereby changing only slowly in the desired reaction temperature. 该晶片加热器可以产生很小的热量,以便,例如,一个人可以在抽空期间将加热器设定到300摄氏度,以及在排气期间设定到80摄氏度。 The wafer heater may generate a small amount of heat, so that, for example, a person can set the heater during the evacuation to 300 degrees C, and during the exhaust gas is set to 80 degrees Celsius. 在实施例中,可通过控制处理晶片的材料处理器的温度来冷却晶片。 In an embodiment, the wafer may be cooled by the temperature of the material of the wafer processor control process.

在另一方面中,在此公开的是一种半导体处理方法,该方法包括提供用于将零件运送到基于真空的半导体处理系统或接收来自基于真空的半导体处理系统的零件的载荷锁;以及加热载荷锁。 In another aspect, disclosed herein is a method of semiconductor processing, the method comprising providing a semiconductor-based processing system, or a vacuum load lock receiving part from a semiconductor processing system based on vacuum for delivery to the part; and heating load lock. 该方法可包括在载荷锁的抽空期间加热载荷锁。 The method may include heating load lock during evacuation of the load lock. 可将载荷锁加热到约五十摄氏度至约100摄氏度。 The load lock may be heated to about fifty degrees Celsius to about 100 degrees Celsius. 载荷锁可加热到十摄氏度和约200摄氏度之间。 A load lock may be heated to between ten degrees Celsius and about 200 degrees Celsius.

在此描述的半导体处理系统可包括载荷锁,其用于将零件运送到基于真空的半导体处理系统或接收来自基于真空的半导体处理系统的零件;以及加热元件,其用于加热载荷锁。 The semiconductor processing system described herein may include a load lock which is used to transport parts to a vacuum-based processing system, or semiconductor-based components received from the semiconductor processing system vacuum; and a heating element for heating a load lock. 可在载荷锁的抽空期间加热载荷锁。 Load lock may be heated during the evacuation of the load lock. 可将载荷锁加热到约五十摄氏度至约100摄氏度。 The load lock may be heated to about fifty degrees Celsius to about 100 degrees Celsius. 载荷锁可加热到十摄氏度和约200摄氏度之间。 A load lock may be heated to between ten degrees Celsius and about 200 degrees Celsius.

在另一方面中,在此描述的系统可包括用于在半导体制造处理中材料处理的组件,该组件具有建立减轻组件中谐振传播的非均一截面的锥形。 In another aspect, the systems described herein may include components for processing material in a semiconductor manufacturing process, the assembly having a non-uniform cross-section to establish resonance mitigation component propagating cone.

组件可包括末端执行器。 Can comprise an end effector assembly. 末端执行器的顶表面可以是平坦的。 The top surface of the end effector may be flat. 末端执行器的底表面可以是锥形的。 The bottom surface of the end effector may be tapered. 末端执行器可由铸塑材料制成。 The end effector may be molded from plastic material. 锥形可设计成铸件,其用于使所使用的铸塑材料建立末端执行器。 Castings may be designed to taper, so that the casting material used for establishing the end effector. 组件可以是机器人臂。 Component may be a robotic arm. 组件可以是一个链环的机器人臂。 Component may be a robotic arm link. 该系统可包括多个锥形链环,当锥形链环交叠时,至少两个链环以最小化锥形链环的厚度的方式逐渐减小。 The system may comprise a plurality of tapered links, when the links tapered overlapping manner at least two links to the thickness of the tapered link minimize gradually decreases. 组件可包括末端执行器和机器人臂,末端执行器和机器人臂中的每一个都是锥形的。 Assembly may include a robotic arm and end effector, the end effector and the robot arm are each tapered.

在另一方面中,在此公开的半导体处理方法可包括提供用于处理半导体晶片的末端执行器;以及逐渐减小末端执行器来减小末端执行器的谐振。 In another aspect, a semiconductor processing method disclosed herein may include providing an end effector for processing semiconductor wafers; end and is gradually reduced to decrease the resonant end effector. 该方法可包括构造碳化硅铝的末端执行器。 The method may comprise an end effector configured aluminum carbide.

在另一方面中,在此描述的半导体处理方法可包括提供机器人臂工具;以及逐渐减小至少一个链环的机器人臂工具以抑制机器人臂工具的振动。 In another aspect, a semiconductor processing method described herein can include providing a robotic arm tool; and a vibration tool of the robot arm is gradually reduced at least to inhibit a link of the robotic arm tool. 该方法可包括由碳化硅铝构造的至少一个链环的机器人臂。 The method may comprise at least one robotic arm link constructed of silicon carbide of aluminum.

在此公开的半导体处理方法可包括:沿着轴设置多个机器人臂和多个处理模块;以及通过将工件从多个机器人臂中的第一个传递给多个机器人臂中的第二个,在多个处理模块之间移动工件。 The semiconductor processing method disclosed herein may comprise: a plurality of processing modules and a plurality of the robot arm along the shaft; and a workpiece by the robot is transmitted to the second plurality of arms from a first plurality of robot arms, moving the workpiece between a plurality of processing modules.

该轴可以是线性的。 The shaft may be linear. 该轴可以是曲线的。 The shaft may be curved. 该轴可形成基本U形的。 The shaft may be substantially U-shaped form. 多个机器人臂可包括SCARA臂。 SCARA robotic arm may comprise a plurality of arms. 多个机器人臂可包括四链环SCARA臂。 Robotic arm may comprise a plurality of four links SCARA arm. 多个机器人臂可包括三链环SCARA臂。 Three robotic arm may comprise a plurality of links SCARA arm 多个机器人臂可包括链接的多对机器人臂,每个链接对包括两个垂直设置的机器人臂。 The robot arm may comprise a plurality of links to a plurality of robot arms, each robot arm comprises two links arranged vertically.

如在此公开的半导体处理系统可包括:沿着轴设置的多个机器人臂和多个处理模块;以及传递装置,其通过将工件从多个机器人臂中的第一个传递给多个机器人臂中的第二个,在多个处理模块之间移动工件。 The semiconductor processing system disclosed herein may include: a plurality of robot arms disposed along the axis and a plurality of processing modules; and a transfer device, by which the workpiece is transferred from a first plurality of the plurality of robotic arms to the robot arm the second, moving the workpiece between a plurality of processing modules.

如在此公开的半导体处理的方法可包括:提供用于处理工件的第一机器人臂;以及设置第二机器人臂,用于在相对于第一机器人臂基本垂直的位置中处理工件。 The semiconductor processing method disclosed herein may comprise: providing a first workpiece handling robot arm; and a second robot arm is provided for processing with respect to the first robot arm in a substantially vertical position the workpiece.

该方法可包括将第一机器人臂机械地耦接至第二机器人臂。 The method may comprise a first robotic arm mechanically coupled to the second robot arm. 该方法可包括使第一机器人臂机械地拆离第二机器人臂。 The method comprises a first robot arm can be mechanically removed from the second robot arm. 第一机器人臂和第二机器人臂中至少一个可以是SCARA臂。 A first robotic arm and second robotic arm may be at least a SCARA arm. 第一机器人臂和第二机器人臂中至少一个是四链环SCARA臂。 A first robot arm and a second robot arm is at least four link SCARA arm. 第一机器人臂和第二机器人臂中至少一个是三链环SCARA臂。 A first robot arm and a second robot arm at least three link SCARA arm.

在此描述的半导体处理系统可包括:用于处理工件的第一机器人臂,该机器人臂设置在处理模块之内;以及用于处理工件的第二机器人臂,该第二机器人臂设置在相对于第一机器人臂基本垂直的位置中的处理模块内。 The semiconductor processing system described herein may include: a first robot arm for processing a workpiece, the robot arm is provided within the processing module; and a second robot arm for workpiece processing, the second robot arm provided with respect to a first processing module of the robot arm in a substantially vertical position.

第一机器人臂可机械地耦接至第二机器人臂。 The first robotic arm mechanically coupled to the second robot arm. 第一机器人臂可机械地拆离第二机器人臂。 The first robot arm can be mechanically removed from the second robot arm. 第一机器人臂和第二机器人臂中至少一个可以是SCARA臂。 A first robotic arm and second robotic arm may be at least a SCARA arm. 第一机器人臂和第二机器人臂中至少一个可以是四链环SCARA臂。 A first robot arm and a second robot arm may be at least four links SCARA arm. 第一机器人臂和第二机器人臂中至少一个可以是三链环SCARA臂。 A first robot arm and at least a second robot arm may be three links SCARA arm.

在此公开的系统可包括:机器人驱动器;末端执行器,用于操纵零件;机器人臂,其将机器人驱动器机构连接至末端执行器,该机器人臂包括四个以上的链环;彼此机械地耦接四个以上链环的一个以上的连接器,以便末端执行器在机器人驱动器的控制下在基本线性的方向上移动。 The disclosed system may include: a robot drive; end effector for actuating parts; a robot arm, which connects the robot drive mechanism to the end effector, the robot arm comprises four or more links; mechanically coupled to each other at least one connector link of four or more, so that the end effector is moved in a substantially linear direction under the control of the robot drive.

每个链环都可具有选择来最优化机器人臂的伸展范围与可容度比的长度。 Each link may have selected to optimize the length of the stretch of the robot arm with the containment ratio. 每个链环都可具有选择来避免与处理系统的邻近组件碰撞的长度。 Each link may have a length selected to prevent adjacent components of the processing system collision. 该系统可包括控制机器人驱动器操作的控制器。 The system may comprise a controller to control the operation of the robot drive. 控制器可以是遥控控制器。 The controller may be a remote controller. 控制器可集成有可视化的软件程序。 The controller may be integrated with a visualization software program. 控制器可控制多于一个的机器人臂。 The controller may control more than one robot arm. 最接近末端执行器的机器人臂的链环可包括偏移腕以能够使该臂折叠。 Closest to the end link of the robot arm, the actuator may include an offset arm to enable the arm folded. 机器人臂可包括至少一个链环,该链环具有在其中可以折叠至少一个其它链环的切口。 Robotic arm may comprise at least one link, the link may be folded has at least one cut wherein the other link. 机器人臂的至少两个连续链环可叠置有垂直间隙,以便机器人臂的至少一个其它链环可以折叠在至少两个连续链环之间的垂直间隔中。 At least two consecutive links of the robot arm can be vertically stacked with a gap, so that at least one further link may be folded vertical separation between the at least two consecutive links of the robot arm. 该系统可包括在链环之间的至少一个旁路齿条(bypass spline)。 The system may include a link between the at least one rack bypass (bypass spline).

在此公开的方法可包括:提供机器人驱动器、用于操纵零件的末端执行器、和将机器人驱动器机构连接至末端执行器的机器人臂,该机器人臂包括四个以上的链环;以及彼此互连四个以上的链环,以便末端执行器在机器人驱动器的控制下在基本线性的方向上移动。 The method disclosed herein may include: providing a robot driver for actuating the end effector part, and the drive mechanism connected to the robot arm of the robot end effector, the robot arm comprises four or more links; interconnected with each other and four or more links, so that the end effector is moved in a substantially linear direction under the control of the robot drive.

每个链环都可具有选择来最优化机器人臂的伸展范围与可容度比的长度。 Each link may have selected to optimize the length of the stretch of the robot arm with the containment ratio. 每个链环都可具有选择来避免与处理系统的邻近组件碰撞的长度。 Each link may have a length selected to prevent adjacent components of the processing system collision. 该方法可包括用控制器控制该机器人驱动器的操作。 The method may include using the robot controller controls the operation of the drive. 控制器可集成有可视化的软件程序。 The controller may be integrated with a visualization software program. 控制器可控制多于一个的机器人臂。 The controller may control more than one robot arm. 最接近末端执行器的机器人臂的链环可包括偏移腕以能够使该臂折叠。 Closest to the end link of the robot arm, the actuator may include an offset arm to enable the arm folded. 机器人臂可包括至少一个链环,该链环具有在其中可以折叠至少一个其它链环的切口。 Robotic arm may comprise at least one link, the link may be folded has at least one cut wherein the other link. 机器人臂的至少两个连续链环可叠置有垂直间隙,以便机器人臂的至少一个其它链环可以折叠在至少两个连续链环之间的垂直间隔中。 At least two consecutive links of the robot arm can be vertically stacked with a gap, so that at least one further link may be folded vertical separation between the at least two consecutive links of the robot arm. 机器人臂的至少两个连续链环可叠置有垂直间隙,以便机器人臂能够到达预定的转移平面,而不与处理系统的组件碰撞。 At least two consecutive links of the robot arm can be vertically stacked with a gap, so that the robot arm can reach a predetermined transfer plane, without colliding with components of the processing system. 该方法可包括提供在链环之间的至少一个旁路齿条。 The method may include providing at least one bypass rack between link.

在此公开的系统可包括:用于半导体制造工艺的多个处理模块,其设置在基本上线性的轨迹周围;车,其可移动地耦接至线性轨迹并且设置得沿着线性轨迹移动;以及机器人臂,其设置在车上用于操纵在多个处理模块之间的工件。 The disclosed system may comprise: a plurality of processing modules for a semiconductor manufacturing process, which is provided around a substantially linear trajectory; car movably coupled to a linear track and moved along a linear trajectory set; and robot arm, which is provided in the vehicle for maneuvering a workpiece between a plurality of processing modules.

该机器人臂可包括SCARA臂。 The robotic arm can include a SCARA arm. 该SCARA臂可包括四链环SCARA臂。 The SCARA arm may comprise four link SCARA arm. 该SCARA臂可包括三链环SCARA臂。 The SCARA arm may include three links SCARA arm.

在此描述的半导体处理系统可包括:真空处理系统,其设置在具有装载端和出口端的基本线性结构中;以及非真空回送系统,其用于将零件从出口端回送到装载端。 The semiconductor processing system described herein may include: a vacuum processing system, which is provided at a substantially linear structure having a loading end and an outlet end; and a non-return vacuum pumping system, for the part from the outlet end back to the loading end.

非真空回送系统可设置在真空处理系统的上方。 Loopback may be a non-vacuum system disposed above the vacuum processing system. 非真空回送系统可设置在真空处理系统的下方。 Loopback non-vacuum system may be disposed below the vacuum processing system. 非真空回送系统可设置在真空处理系统的旁边。 Loopback non-vacuum system may be disposed beside the vacuum processing system. 非真空回送系统可设置在真空处理系统之内。 Non-Loopback vacuum system may be disposed inside the vacuum processing system. 非真空回送系统可在出口端包括载荷锁,用于将零件从真空处理系统移动到非真空回送系统。 Non-vacuum system may include a loopback load lock at the outlet end, for moving the parts from the vacuum processing system to a non-return vacuum pumping system. 非真空回送系统可包括用于将零件从出口端移动到装载端的滑动机构和抓具。 Loopback non-vacuum system may comprise means for moving the parts from the outlet end of the loading end to the slide mechanism and the gripper.

真空处理系统可包括多个处理模块。 Vacuum processing system may include a plurality of processing modules. 真空处理系统可包括在处理模块之间移动零件的一个或多个机器人臂。 Vacuum processing system may comprise one or more moving parts of the robot arm between the processing modules. 谊系统可包括通过将零件从多个机器人臂中的第一个传送到多个机器人臂中的第二个,来移动零件的多个机器人臂。 The system may include a Yi transmitted from the part by a first plurality of the plurality of robotic arms to the robot arm in the second, to a plurality of moving parts of the robot arm. 多个机器人臂包括SCARA臂。 SCARA robot arm comprises a plurality of arms. 多个机器人臂可包括四链环SCARA臂。 Robotic arm may comprise a plurality of four links SCARA arm. 多个机器人臂可包括三链环SCARA臂。 Three robotic arm may comprise a plurality of links SCARA arm. 多个机器人臂可包括彼此垂直设置的至少一对链接的机器人臂。 Robotic arm may comprise a plurality of at least one robotic arm disposed perpendicular to the link with each other. 多个处理模块可在底面积方面改变2或2以上的因数。 A plurality of processing modules may vary by a factor of 2 or more in terms of area bottom. 该系统可包括半导体制造工具,该半导体制造工具包括多个线性半导体处理系统,该多个线性半导体处理系统并排设置,以便多个线性半导体处理系统的装载端面向半导体制造工具的通道。 The system may include a semiconductor manufacturing tool, the semiconductor manufacturing tool comprises a plurality of linear semiconductor processing system, the plurality of linear semiconductor processing system arranged side by side, a plurality of linear loading end to a semiconductor processing system for semiconductor manufacturing tool channel.

在此描述的半导体制造工具可包括用于接收半导体晶片的至少一个翻转抓具,该翻转抓具包括一对抓具模块,其中每个抓具模块都配置成接收一对平行边缘的半导体晶片中的一个,其中一旦在一个位置接收到半导体晶片每个抓具模块都旋转,其中抓具模块的水平部分在水平面支撑半导体晶片,并且抓具模块的垂直部分防止半导体晶片在水平面移动。 The semiconductor manufacturing tools described herein can include means for receiving a semiconductor wafer at least one reversing gripper, the gripper comprising a pair of reversing gripper modules, each gripper module configured to receive a pair of parallel edges of a semiconductor wafer a, wherein upon receiving the semiconductor wafer at a position of each rotary gripper module, wherein the horizontal portion of the gripper modules of the semiconductor wafer is supported in a horizontal plane, and vertical grip portion with the semiconductor wafer to prevent movement of the module in a horizontal plane.

如在此描述的处理半导体晶片的方法可包括:提供用于夹持半导体晶片的末端执行器,其中末端执行器包括配置成在水平面支撑半导体晶片的接收槽,同时防止半导体晶片在水平面上移动,并且其中末端执行器包括当将半导体晶片放置在末端执行器上时配置使半导体晶片滑动到接收槽中的斜坡。 The method of processing a semiconductor wafer described herein may include: providing an end effector for holding a semiconductor wafer, wherein the end effector comprises a groove configured to receive the support in a horizontal plane of the semiconductor wafer, the semiconductor wafer while preventing movement in a horizontal plane, and wherein when the end effector comprises a semiconductor wafer is placed on the end effector is configured to slide the semiconductor wafer receiving slot of the ramp.

如在此描述的半导体处理系统可包括多个机器人臂,该多个机器人臂中的至少两个共用共同的驱动器工具。 The semiconductor processing system described herein may include a plurality of robot arms, at least two share a common driver tool of the plurality of robotic arms. 该多个机器人臂中的至少一个是SCARA臂。 The plurality of the robot arm and at least one SCARA arm. 该多个机器人臂中的至少一个是四链环SCARA臂。 The plurality of the robot arm and at least a four-link SCARA arm. 该多个机器人臂中的至少两个可独立地工作,或者可相关地工作。 The plurality of at least two robotic arms can work independently, or may be related to the work.

在另一方面中,在此描述的半导体处理系统可包括具有蛙腿臂结构的机器人臂,该蛙腿臂结构包括至少两对蛙腿臂。 In another aspect, a semiconductor processing system described herein may include a frog leg arm structure of the robot arm, which arm structure frog legs frog legs comprises at least two arms.

如在此所使用的,“机器人”包括任何一种公知的机器人或相似的器件或包括机械能力和控制能力的工具,其可包括控制器、处理器、计算机或相似工具的组合,一组电动机或相似工具,一个以上的分解器、编码器或相似工具,一个以上的机械或操作工具,如臂、轮、腿链环、爪、延伸杆、抓具、喷嘴、喷雾器、效应器、激励器等以及上述任一个的任一组合。 As used herein, a "robot" includes any known robot device or the like includes a mechanical or power and control capability of the tool, which may include a controller, a processor, computer, or similar tool combination, a set of motor or similar tool, at least a resolver, an encoder, or similar tool, more than one machine or operation tool, such as the arms, wheels, leg link, pawl extension rod gripper, a nozzle, sprayer, effectors, actuators and any other combination of any of the above. 一个实施例是机器人臂。 One embodiment is a robotic arm.

如在此所使用的“驱动器”包括任一形式的驱动器机构或用于引入作用的工具。 As used herein "drive" includes a drive mechanism or any form of action of the introduction tool. 在实施例中,其包括机器人的电动机/编码器部件。 In an embodiment, which includes a motor / encoder component of the robot.

如在此所使用的,“轴”包括经由链环、带或相似的工具机械地连接至机械构件如臂构件的电动机或驱动器。 As used herein, "axis" via link includes the tool is mechanically connected to a belt or similar mechanical member, such as a motor or actuator arm member. “N轴驱动器”包括含N个轴的驱动器;例如“2轴驱动器”是含两个轴的驱动器。 "N drive shaft" includes a driver having N axes; for example, "2-axis drive" containing two drive shafts.

如在此所使用的,“臂”包括被动或主动的(意思是包含电动机/编码器)联动装置,其可包括一个以上的臂或腿构件、轴承、和用于夹持或抓取要处理的材料的一个以上的末端执行器。 As used herein, "arms" includes active or passive linkage (means includes a motor / encoder), which may include more than one arm or leg members, bearings, and means for clamping or gripping be processed end of one or more materials.

如在此所使用的,“SCARA臂”指的是本领域技术人员公知的一种以上形式的选择性服从组件机器人臂(Selectively CompliantAssembly Robot Arm)(SCARA)机器人臂,包括由连接至驱动器的一个以上的上链环、经由带或机构连接至其为驱动器一部分的电动机的一个以上的下链环、以及一个以上的如末端执行器或激励器的末端单元组成的臂。 As used herein, "a SCARA arm" refers to more than one form of the skilled person known to selectively obey assembly robot arm (Selectively CompliantAssembly Robot Arm) (SCARA) robotic arm, comprises a connection to a drive above the link, or via a mechanism with which the motor is to drive more than one part of the link, and the arm end, such as one or more effector or actuator terminal units.

如在此所使用的,“转动半径”指的是当全部缩进时臂装配好的半径。 As used herein, "turning radius" as used herein refers to a fully retracted when the arm is assembled radius.

如在此所使用的,“伸展”包括,相对于机器人臂,当臂全部伸展时获得的最大伸展。 As used herein, "stretching" includes, with respect to the robot arm, the maximum extension when all extension arms obtained. 通常机械限制超出实际有效伸展一些,因为更容易控制没有完全地全部伸展的臂(在实施例中存在在全部范围难以控制的左/右奇点)。 Mechanical limitations typically extending beyond the effective practical, because there is no easier to control the entire fully extended arm (left / right singular point is difficult to control the entire range of the present embodiment).

如在此所使用的,“可容度(containment)”指的是当最优化地缩进臂以便可以将虚圆绘制在最小半径的臂/末端执行器/材料周围时的情形。 As used herein, "containment (of containment)" means that when optimally so that the arms may be retracted imaginary circle drawn around the case when the smallest radius arm / end / material.

如在此所使用的,“伸展范围与可容度比”指的是,相对于机器人臂,最大值伸展与最小容积的比。 E.g., "and can accommodate the stretch ratio" refers, with respect to the robot arm, the maximum stretch ratio with the minimum volume as used herein.

如在此所使用的,“机器人与机器人”距离包括两个不同机器人驱动器的旋转的机械中心轴之间的水平距离。 The horizontal distance between the center axis of the machine as described in "Robot robot" used herein includes from two different robot drives.

如在此所使用的,“槽阀”包括打开和关闭以使机器人臂穿过的矩形状阀(如与真空(隔离)阀相对的,其控制真空室的抽空)。 As used herein, a "slot valve" comprises opening and closing the valve so that the robot arm through a rectangular shape (e.g., the vacuum (isolation) opposite the valve, which controls the evacuation of the vacuum chamber). 例如,SEMI E21.1-1296标准(半导体制造的公布标准),在某些半导体制造处理模块中的300mm晶片的槽阀具有336mm的开口宽度、50mm的开口高度、和具有还指定了装配螺钉和对准销的标准的60mm的总阀厚度。 For example, SEMI E21.1-1296 standards (published standard semiconductor manufacturing), the valve groove in some semiconductor fabrication processing module 300mm width 336mm wafer having an opening, the opening height of 50mm, and has also specified a mounting screw and the total 60mm thickness of the valve pin alignment criteria.

如在此所使用的,“转移平面”包括在此材料经由狭缝阀从机器人室传递给处理模块室的平面(高度)。 As used herein, "transfer plane" included in the material transferred from the robot chamber to the plane of the processing module chamber (height) via a slit valve. 根据用于半导体制造设备的SEMI E21.1-1296标准,转移平面是槽阀中心线以上14mm。 The SEMI E21.1-1296 standards for semiconductor manufacturing equipment, the transfer valve is a plane above the centerline of groove 14mm.

如在此所使用的,“部分”包括在其中具有一个以上机器人驱动器的真空室。 As used herein, "portion" which includes a vacuum chamber having one or more of the robot drives. 这是线性系统中最小的可重复元件。 This is a linear system, the smallest repeatable elements.

如在此所使用的,“链环”包括在两端上连接至另一链环、末端执行器或机器人驱动器的机器人臂的机械构件。 As used herein, "link" includes a link connected to the other on both ends, the mechanical components of the robot arm or a robot end effector drive.

如在此所使用的,“L1”、“L2”、“L3”等包括从驱动器开始到末端执行器的臂链环的编号。 As used herein Number, "L1", "L2", "L3" and the like include the drive start to the end effector arm link.

如在此所使用的,“末端执行器”包括在远离机器人驱动器和邻近零件的机器人臂主动端的元件,机器人臂将在该零件上面行动。 As used herein, "end" of the robot comprises a robot arm remote from the drive and the adjacent part of the active end of the element, the robot arm in the part above action. 末端执行器可以是被动或主动地夹持在半导体工艺或设置在机器人臂末端上的一些其它激励器中将输送的材料的机器人的手。 The end effector may be passive or active hand clamped in a semiconductor process robot or some other actuator disposed on the robot arm end of the conveyed material.

如在此所使用的,术语“SCARA臂”指的是包括一个以上链环的机器人臂且可包括末端执行器,其中臂在控制下可以线性的移动,如咬合物体。 As used herein, the term "a SCARA arm" as used herein is intended to include one or more robotic arm link and may include an end effector, wherein the linear movement may be under the control of the arm, such as bite objects. SCARA臂可具有各种数目的链环,如3、4或更多。 SCARA arm may have various numbers of links, such as 3, 4, or more. 如在此所使用的,“3链环SCARA臂”包括具有三个构件:链环一(L1)、链环二(L2)和末端执行器的SCARA机器人臂。 As used herein, "SCARA arm link 3" includes three members: a SCARA robot arm link (L1), two links (L2) and the end effector. 用于3-链环SCARA臂的驱动器一般具有3个电动机:一个连接至L1,一个连接至带系统,其依次经由滑轮连接至末端执行器,和Z(起重)电动机。 3- SCARA arm link for the drive motor typically has three: one is connected to L1, is connected to a belt system, which in turn is connected via a pulley to the end effector, and Z (lifting) of the motor. 一个驱动器可以将第四电动机连接至末端执行器,其允许一些仅用三个电动机不可能实现的不平常移动。 A fourth motor drive can be connected to the end effector, which allows some movement of the motor is not unusual with only three impossible.

如在此所使用的,“双SCARA臂”包括任选地连接至共用驱动器的两个SCARA臂(如两个3或4链环SCARA臂(典型地指定为A和B))的组合。 As used herein, "double SCARA arm" includes optionally connected to a common drive two SCARA arms (such as cyclic SCARA arm (typically designated as A and B) two chains 3 or 4) combinations thereof. 在实施例中,两个SCARA臂是完全独立的或共用共同的链环构件L1。 In an embodiment, two SCARA arms are completely independent or share a common link member L1. 用于双独立SCARA臂的驱动器一般具有五个电动机:一个连接至L1-A,一个连接至L1-B,一个连接至臂A的带系统,一个连接至臂B的带系统,以及共用的Z(起重)电动机。 Z a is connected to the L1-A, connected to the L1-B, a belt system coupled to the arm A, a belt system coupled to the arm B, and a common: dual independent drive for SCARA arm typically has five motor (lifting) electric motor. 用于双依靠SCARA臂的驱动机一般具有共用的L1链环,用于臂A和B,并且一般含有四个电动机:一个连接至共用链L1,一个连接至用于臂A的带系统,一个连接至用于臂B的带系统,以及共用的Z(起重)电动机。 Rely on a double SCARA arm machines generally have a common drive link L1 for the arms A and B, and generally contains four motors: a chain connected to a common L1, coupled to a belt system for arm A, a connected to a belt system for arm B, and a common Z (lifting) of the motor.

如在此所使用的,“4链环SCARA臂”包括具有四个构件:L1、L2、L3和末端执行器的臂。 As used herein, "4 SCARA arm link" includes four components: L1, L2, L3 and the end effector arm. 用于4链环SCARA臂的驱动器可以具有四个电动机:一个连接至L1,一个连接至L2和L3的带系统,一个连接至末端执行器以及Z电动机。 Drives for SCARA arm link 4 may have four motors: one is connected to L1, L2 and L3 is connected to a belt system, connected to the end effector and a Z motor. 在实施例中,仅需要3个电动机:一个连接至L1,一个连接至连接L2、L3和末端执行器的带系统,以及Z电动机。 In an embodiment, the motor 3 need only: a connection to L1, is connected to a connector L2, L3 and the end of the belt system, and a Z motor.

如在此所使用的,“蛙腿式臂”包括具有五个构件:L1A、L1B、L2A、L3B和末端执行器的臂。 As used herein, a "frog-leg arms" includes five members: L1A, L1B, L2A, L3B and the end effector arm. 用于蛙腿臂的驱动器可以具有三个电动机,一个连接至L1A,L1A借助齿轮装置等机械地连接至L1B,一个连接至旋转整个臂组合装置的转盘,和Z电动机。 Frog legs for the drive arm may have three motor, connected to L1A, L1A device or the like by means of a gear mechanically connected to the L1B, a connecting arm assembly to rotate the entire apparatus of the turntable, and a Z motor. 在实施例中,该驱动器包含三个电动机,一个连接至L1A,一个连接至L1B和Z电动机,并且经由电动机之间的协调获得了所希望的运动。 In an embodiment, the actuator comprises three motors, connected to a LlA, Z and L1B is connected to a motor, and the desired movement is obtained through coordination between the motor.

如在此所使用的,“双蛙腿式臂”包括具有八个构件L1A、L1B、L2A-1、L2A-2、L2B-1、L2B-2和两个末端执行器的臂。 As used herein, a "frog-leg double arm" includes eight member L1A, L1B, L2A-1, L2A-2, L2B-1, L2B-2 and two end effector arm. 第二链环构件L2A-1和L2B-2形成单蛙腿式臂,而第二链环构件L2A-2和L2B-2也形成单蛙腿式臂,然而面向相对的方向。 The second link member L2A-1 and L2B-2 forms a single frog-leg arms, the second link member L2A-2 and L2B-2 also form a single frog-leg arms, but facing opposite directions. 用于双蛙臂的驱动器可以与用于单蛙臂的一样。 Frog for a dual arm drive may be used as a single frog arm.

如在此所使用的,“跳跃蛙腿式臂”包括具有八个构件L1A、L1B、L2A-1、L2A-2、L2B-1、L2B-2和两个末端执行器的臂。 As used herein, a "frog-leg arms jump" comprising, L1B, L2A-1, L2A-2, L2B-1, L2B-2 and two end effector arm member having eight L1A. 第一链环构件L1A和L1B每个都连接至基本在它们中央、而不是它们远端的一个电动机。 A first link member L1A and L1B are each connected to substantially the center thereof, a motor rather than their distal ends. 第二链环构件L2A-1和L2B-1形成单蛙腿式臂,而第二链环构件L2A一2和L2B-2也形成单蛙腿式臂,然而面向相同的方向。 The second link member L2A-1 and L2B-1 forms a single frog-leg arms, and a second link member L2A and L2B-2 2 can also form a single frog-leg arms, but facing the same direction. 用于双蛙臂的驱动器可以与用于单蛙臂的一样。 Frog for a dual arm drive may be used as a single frog arm.

通过参考将在此参考的所有专利、专利申请和其它文件并入这里。 Herein by reference All patents, patent applications and other documents are incorporated herein.

附图简介图1示出了多种制造设备类型的设备结构。 BRIEF DESCRIPTION Figure 1 illustrates various types of manufacturing equipment device configuration.

图2示出了在半导体制造工艺中用于处理零件的常规群集型结构。 FIG 2 shows a conventional cluster structure for processing part in a semiconductor manufacturing process.

图3A和3B示出了用于容纳两个和六个处理模块之间的一连串群集型系统。 Figures 3A and 3B show a series of cluster systems for receiving between two and six processing modules.

图4示出了在制造工艺中用于处理零件的线性处理结构的高级组件。 FIG. 4 shows a high linear processing assembly for processing parts of the structure in the manufacturing process.

图5示出了线性处理系统的顶视图,如具有与图4相似的结构的系统。 FIG. 5 shows a top view of a linear processing system, such as system configuration similar to the FIG.

图6示出了3链环SCARA臂和4链环SCARA臂。 FIG 6 shows a link SCARA arm 3 and link 4 SCARA arm.

图7示出了SCARA臂的伸展范围和可容度(reach andcontainment)特性。 Figure 7 shows a SCARA arm extension range and containment (reach andcontainment) characteristics.

图8示出了用于机器人系统的高级组件。 FIG 8 illustrates a high-level assembly for a robotic system.

图9示出了用于处理系统中的机器人臂系统的双臂结构的组件。 Figure 9 shows an assembly structure for a dual-arm robot arm system of the processing system.

图10示出了4链环SCARA臂的伸展范围和可容度能力。 Figure 10 shows a stretch of the chain 4 and containment capability ring SCARA arm.

图11示出了4链环SCARA臂的干扰特性。 FIG 11 shows four chain loop interference characteristics SCARA arm.

图12示出了利用带作为传送机构的一组双臂4链环SCARA臂的侧视图。 FIG 12 shows a side view with the use of a set of link arms SCARA arm 4 as the transmission mechanism.

图13示出了利用齿条链环作为传送机构的一组双臂4链环SCARA臂的侧视图。 Figure 13 shows a side view by the rack transfer mechanism of the link as a set of link arms 4 SCARA arm.

图14示出了用于具有线性结构的处理系统的外部回送系统。 FIG 14 shows an external loopback processing system for a system having a linear structure.

图14a示出了用于线性处理系统的U形结构。 Figure 14a shows a U-shaped configuration for linear processing system.

图15示出了用于图14的处理系统的外部回送系统的某些细节。 FIG 15 shows an external processing system of FIG. 14 for returning some of the details of the system.

图16示出了用于图14的处理系统的外部回送系统的另外细节。 FIG 16 shows further details of the system for external loopback processing system 14 of FIG.

图17示出了图14的回送系统中输出载具的运动。 FIG 17 illustrates loopback motion system 14 of the output carrier.

图18示出了图14的回送系统中空载具的处理。 18 illustrates loopback processing system of FIG. 14 with the load.

图19示出了图14的回送系统中的空载具到载荷锁位置中的移动。 Figure 19 shows a load with loopback in the system of Figure 14 to move the load lock position.

图20示出了降低和抽空的空载具及抓具在图14的回送系统中的移动。 FIG 20 shows a decrease and grab evacuated and unloaded with a mobile system having a loopback 14 in FIG.

图21示出了当满载具在图14的回送系统中被倒空时空载具在接收材料。 FIG 21 shows that when full load is emptied with temporal loopback system of FIG. 14 in the carrier receiving material.

图22示出了在图14的回送系统中停在夹持位置、开始新返回循环的空载具。 22 shows a system of stop in the loopback FIG. 14 in the clamping position, to return to start a new cycle with no load.

图23示出了用于制造工艺的处理工具的结构,在线性结构中具有双臂机器人系统和回送系统。 FIG. 23 shows the structure of the processing tool for the manufacturing process, having a linear structure and a dual-arm robot system loopback system.

图24示出了用于本发明的处理方法和系统的总系统结构的可选实施例。 FIG 24 shows an alternative configuration of a total system for processing method and system of the present embodiment of the invention.

图25示出了线性系统的底面积相比常规集群系统的比较。 Figure 25 shows a comparison of the bottom area of ​​the system compared to a conventional linear cluster system.

图26示出了在根据本发明实施例的处理系统中配置有特大型处理模块的线性结构。 26 shows a configuration of a processing system in accordance with an embodiment of the present invention, the processing module has large linear structure.

图27示出了用于根据本发明实施例的处理系统的后出口结构。 FIG 27 shows a rear outlet structure for a processing system according to embodiments of the present invention.

图28示出了采用根据本发明各种实施例的线性处理系统的制造工具的各种布局可能性。 Figure 28 shows a tool for producing the possibility of introducing various layouts linear processing system in accordance with various embodiments of the present invention.

图29示出了本发明的一个实施例,其中机器人可包括若干驱动器和/或若干控制器。 FIG 29 shows an embodiment of the present invention, where the robot may include a plurality of drive and / or several controllers.

图30示出了有关本发明实施例的转移平面和槽阀(slot valve)的特性。 Figure 30 shows the transfer plane and about the valve slot embodiment of the present invention (slot valve) characteristics.

图31示出了用于将晶片置于中心的翻转抓具(tumble gripper)。 Figure 31 shows a wafer at the center of the reversing gripper (tumble gripper).

图32示出了用于将晶片置于中心的被动滑动斜坡。 32 shows a passive sliding ramp at the center of the wafer.

图33示例了包括中入口工具的制造工具。 Figure 33 illustrates a manufacturing tool comprising a tool inlet.

图34示例了从顶视图包括中入口工具的制造工具。 FIG 34 illustrates a top perspective view of the manufacturing tool comprises a tool inlet.

图35示例了包括放置用于检测根据本发明实施例的机器人臂位置和材料的光学传感器的制造工具。 FIG. 35 illustrates the manufacturing comprises placing a tool for detecting the optical sensor robot arm position and the material embodiment of the present invention.

图36示例了示出光束路径和可选光束路径的截面侧视图的制造工具。 36 shows an example of the manufacturing tools FIG beam path and optionally a cross-sectional side view of the beam path.

图37示例了如何使用光学传感器来确定由机器人臂处理的材料的中心。 Figure 37 illustrates how to use optical sensors to determine the center of the material processed by the robot arm.

图38示出了常规的3轴机器人真空驱动器结构。 FIG 38 illustrates a conventional 3-axis robotic vacuum drive configuration.

图39示出了根据本发明实施例的新3轴机器人真空驱动器结构。 FIG 39 shows a new 3-axis robotic vacuum drive configuration according to embodiments of the present invention.

图40A示例了根据本发明实施例的垂直布置的载荷锁定组件。 FIG 40A illustrates a vertical locking arrangement according to an embodiment of the present invention, the loading assembly.

图40B示例了在根据本发明实施例的晶片制造工具两侧的垂直布置的载荷锁定组件。 FIG 40B illustrates locking assembly in a vertical arrangement on both sides of the wafer fabrication tools embodiment of the present invention the load.

图41示出了根据本发明实施例的垂直布置的载荷锁和垂直叠置处理模块。 FIG 41 shows a vertical load lock arrangement of the present invention and embodiments of vertically stacked processing modules.

图42示出了根据本发明的实施例在截面侧视图具有垂直叠置的处理模块的线性布置的、两级处理结构。 FIG 42 shows, two handling structure according to an embodiment of the present invention is a side view of a vertically stacked processing modules arranged in linear cross section.

图43以顶视图示出了图42的处理布局。 FIG 43 illustrates a top view of the layout process of FIG. 42.

图44示出了根据本发明的实施例具有传感器检测邻近目标的物体的机器人臂上的测量物体。 FIG 44 shows the measurement object with the robot arm adjacent to the target object detection sensor according to an embodiment of the present invention.

图45示例了传感器如何在目标上方移动可以使机器人臂检测其相对于障碍物的位置。 Figure 45 illustrates how the sensor can be moved over the target in the robot arm with respect to the detected position of the obstacle.

图46示出了测量物体如何使用真空环境中的射频通信将位置传达给中央控制器。 FIG. 46 shows how the measurement object using radio frequency communications in a vacuum environment to a position communicated to a central controller.

图47示例了一连串传感器的输出随着位置的函数。 Figure 47 illustrates a series of sensor output as a function of position.

图48示例了加热元件可以如何放置在载荷锁中用于根据本发明的实施例的物体的热处理。 Figure 48 illustrates how the heating element may be placed in the load lock objects for heat treatment according to an embodiment of the present invention.

图49示出了两维锥形的末端执行器,其减少了末端执行器中的活性振动模式。 49 shows a two-dimensional tapered end, which reduces the active vibration mode of the end effector.

图50示出了在没有显著地影响垂直叠置高度的前提下,用于机器人平面状臂的垂直锥形的机器人臂元件如何用于减少臂设置中的振动。 FIG. 50 shows not significantly affect the height of the vertically stacked under the premise of the robot arm member for vertical planar tapered robot arm how to reduce the vibration arm is provided.

图51示例了双独立的SCARA机器人臂。 Figure 51 illustrates a dual independent arm of the SCARA robot.

图52示例了双相关的SCARA机器人臂。 FIG SCARA robot arm 52 an example of a double correlation.

图53示例了蛙腿形的机器人臂。 FIG 53 illustrates a frog leg type robot arms.

图54示例了双腿式的机器人臂。 Figure 54 illustrates a two-legged robot arm.

图55A示例了装配在可移动车上的4链环SCARA臂,以及装配在翻转的可移动车上的4链环SCARA臂。 FIG 55A illustrates a SCARA arm link assembly 4 is movable in the car, and the link 4 is mounted in the inverted SCARA arm movable car.

图55B示例了图55A的顶视图。 FIG 55B illustrates a top view of FIG. 55A.

图56示例了沿着基本线性的轴使用3链环单或双SCARA臂机器系统来穿过晶片。 Figure 56 illustrates the use of the shaft 3 along a substantially linear single or dual link system SCARA arm machine through the wafer.

图57示例了2级真空处理机器系统,其中借助机器人臂中的垂直轴可接入顶和底处理模块。 FIG 57 illustrates a 2-stage vacuum processing system of the machine, wherein the robot arm by means of a vertical shaft in the top and bottom access processing module.

图58A示出了两级处理工具,其中沿着两级中的一个上的基本线性轴穿过基板。 FIG 58A shows a two-stage processing tool, wherein the substantially linear along the two axes on the substrate through a.

图58B示例了图58a的变化,其中从系统的后部移动基板。 FIG 58B illustrates a variation of FIG. 58a, wherein the movement of the substrate from the rear of the system.

图59A示出了在基本线性的轴上容纳很大处理模块的制造工具。 FIG 59A shows a tool for producing substantially linear shaft receiving large processing module. 准备有效的服务空间用于接入处理模块的内部。 Preparation effective service access space for internal processing module.

图59B示例了4个大处理模块和一个小处理模块的更致密的布局。 FIG 59B illustrates a denser four large and a small processing module processing module layout.

图60示例了具有系统同一侧上的基板的双蛙腿式机器人机械手。 FIG 60 illustrates a double frog-leg robot manipulator having a substrate on the same side of the system.

具体实施方式 detailed description

图1示出了用于各种制造设备类型的设备结构1000。 FIG 1 illustrates various types of manufacturing apparatus 1000 for device configuration. 每种类型的制造设备都处理零件,如在各种处理如化学汽相沉积处理、蚀刻处理等之间的半导体晶片。 Each type of manufacturing process equipment parts, various processes such as chemical vapor deposition process, a semiconductor wafer between the etching process and the like. 由于半导体制造处理一般对污染物如微粒和挥发性有机化合物极其敏感,所以这些处理一般都发生在真空环境中,专用于特定处理的一个或多个处理模块中。 Since the semiconductor manufacturing process is generally extremely sensitive to contaminants such as particulates and volatile organic compounds, these process typically occurs in a vacuum environment, dedicated to one or more processing modules in a particular process. 在各种处理之间通过处理系统移动半导体晶片以制造最终产品,如芯片。 Between the various processes by moving the semiconductor wafer processing system to produce the final product, such as chips. 有各种结构1000用于处理系统。 Various structures system 1000 for processing. 一般的系统是群集工具1002,其中处理模块放射状地位于中央处理系统如机器人臂的周围。 Typical cluster tool system 1002, wherein the processing module is positioned radially around the central processing system such as a robotic arm. 在其它实施例中,处理系统可以水平地旋转零件,如在实施例1004中。 In other embodiments, the processing system may be horizontally rotating parts, as in the embodiment in Example 1004. 每种类型工具的一个重要的方面是“底面积”(footprint)或者设备在半导体制造工具中占用的区域。 An important aspect of each type of instrument is the "bottom area" (footprint of) occupied by the device or tool in a semiconductor manufacturing area. 底面积越大,在制造工具中容纳多个机器需要的空间就越大。 The larger bottom area, the space accommodating a plurality of machine tools required for manufacturing the greater. 而且,较大的底面积一般需要较大的真空系统,其随着尺寸的增加大大地增加了成本。 Moreover, the larger base area generally require a large vacuum system, which increases as the size of the greatly increased cost. 结构1004旋转“旋转盘”工具中的零件。 1004 Structure rotating parts of the tool "rotating disk." 结构1006将零件移入处理模块和移出处理模块,其中处理模块彼此相邻设置。 Structure parts into the processing module 1006 and out of the processing module, wherein the processing module is disposed adjacent to one another. 结构1008将处理模块定位于与1002相似的群集中,区别是中央机器人并排处理两个晶片。 The structure of the processing module 1008 and 1002 positioned on a centralized group of similar, except that two central wafer handling robot in parallel. 随着越来越多的晶片移过系统,这些系统中的每一个都有许多群集工具的复杂问题,包括当一个晶片移入所给定的处理模块中和再移出所给定的模块时的显著交换时间延迟、以及相当困难地保持所给定处理模块的真空环境的清洁度。 As more wafers move through the system, there are many complex issues each of these cluster tool system, comprising a wafer when given into the processing module and then out of the module given a significant switching delay time, and a considerable difficulty to maintain constant processing module to a vacuum environment cleanliness.

图2示出了用于在半导体制造工艺中处理零件的常规群集型结构2000。 FIG 2 shows a conventional cluster structure for processing part 2000 in the semiconductor manufacturing process. 机器人臂2004移动零件,如在设置于机器人臂2004周围的群集中的各种处理模块2002之间的晶片。 Moving parts of the robot arm 2004, such as a wafer provided in the group between the arms 2002 around the robot 2004 set various processing modules. 一旦处理结束,大气基板处理小型环境室2008就通过该设备接收用于处理的材料并且容纳材料。 Once processing is finished, the substrate material processing atmosphere to the mini-environment chamber 2008 for processing by the receiving apparatus and receiving material. 注意加入更多的处理模块2002有多困难。 Note that adding more processing modules 2002 how difficult it is. 当一个以上的模块2002大概适合时,实际的结构限制到五个处理模块2002。 When more than one module 2002 is probably appropriate, the actual structure is limited to five processing module 2002. 增加六个模块会显著地影响设备的可用性,尤其是机器人臂2004。 Six modules will increase significantly affect the availability of equipment, in particular robot arm 2004.

图3A和3B示出了群集工具模块,即大气小型环境处理室、真空处理室和用于基于真空的制造工艺的柔性结构系统的其它组件3000。 Figures 3A and 3B show a cluster tool module, i.e., the mini-environment atmosphere processing chamber, and a vacuum processing chamber based on other components of the flexible structure of the vacuum system of the manufacturing process 3000. 不同的模块可以装配在一起以便于所希望工艺技术的制造。 Different modules can be assembled together in order to produce the desired technology. 例如,给定的芯片需要在不同处理模块中化学汽相沉积不同的化学组分(例如,氮化钛、钨等)以及在其它处理模块中的蚀刻。 For example, a given chemical vapor deposition chips require different chemical composition (e.g., titanium nitride, tungsten, etc.) and other etching process modules in different process modules. 在不同处理模块中的处理顺序得到唯一的最终产品。 In the processing sequence of various processing modules only the final product obtained. 假定增加了半导体组件的复杂性,一般希望具有能够使制造商增加更多处理模块的柔性结构。 Assumed that increases the complexity of the semiconductor element, it is generally desirable to enable manufacturers to have to add more processing modules flexible structure. 然而,以上描述的群集工具是限制空间的;因此,不能够增加更多的处理模块,意味着为了完成更复杂的半导体晶片,必须将制造移动到第二群集工具。 However, the cluster tools described above are space constraints; therefore, not possible to add more processing modules, means to perform more complex semiconductor wafer must be moved to the second cluster tool manufacturing. 如图3A和图3B中所看到的,群集工具可以包括具有分段真空隔离的两个3002、三个3004、四个3006、五个3008、3010或六个3012处理模块的结构。 3A and 3B, as seen, the cluster tool 3004 may include three four 3006, the vacuum insulation structure having two segments 3002, 3008,3010 five or six processing module 3012. 可以连同该设备一起提供其它组件。 Other components may be provided along with the device.

图4示出了用于在制造工艺中处理零件的线性处理结构4000的高级组件。 FIG. 4 shows a high-level components of the linear processing structure processing part 4000 in the manufacturing process. 该结构使用以线性方式布置的两个以上的固定机器人4002。 This structure uses two or more fixing robots arranged in 4002 in a linear manner. 机器人4002可以或者装配在系统的底部或者从室盖向下悬挂或以二者同时装配。 4002 or the robot can be fitted in the bottom of the system, or suspended downwardly from chamber lid assembly or to both simultaneously. 线性系统使用机器人周围的真空室4012。 Linear systems around the robot using a vacuum chamber 4012. 该系统可由多个连接的真空室4012组成,具有真空室4012的每一个都包含以线性方式布置的其自身的机器人。 The vacuum chamber system may be composed of a plurality of connections 4012, 4012 each having a vacuum chamber contains its own robot arranged in a linear manner. 在实施例中,可设置单个控制器以处理该结构的一部分或多部分。 In an embodiment, a single controller may be provided to process one or more parts of the structure. 在实施例中可扩展真空室4012部分;即,制造商可以容易地增加另外的部分/室4012并且由此增加工艺能力,比群集结构更容易。 In an embodiment, the vacuum chamber may be extended portion 4012; i.e., the manufacturer can easily add additional portion / chamber 4012 and thereby increase the process capability, more easily than the cluster structure. 由于每个部分都使用独立的机器人驱动器4004和臂4002,所以当增加另外的部分和由此的机器人时生产量可保持得高。 Since each part using a separate robot arm drive 4004 and 4002, when the additional portion and thereby increases the production of the robot can be kept high. 相比之下,在群集工具中,当制造商增加处理室2002时,该系统增加了用于单个机器人的载荷,即使机器人装配有双臂,最终机器人的速度也会成为限制因素。 In contrast, in a cluster tool, the process chamber when adding a manufacturer 2002, the system increases the load for a single robot, even if the robot is equipped with arms, the speed of the robot will eventually become a limiting factor. 在实施例中,系统通过将另外的机器人臂4002增加到单个驱动器来处理该问题。 In an embodiment, the system by the robot arm 4002 further increased to a single driver to handle this. 其它的制造商使用具有两个完全独立臂的4轴机器人,如双SCARA或双蛙腿机器人。 Other manufacturers use, such as double or dual SCARA robot having a frog leg completely separate two-axis robot arm 4. 在此公开的线性系统没有受到机器人能力的限制,这是因为每个部分4012都包含机器人,所以每个部分4012都能够输送比群集工具更大量的材料。 Linear system disclosed herein is not limited by the ability of the robot, this is because part of each robot 4012 contains, in each section 4012 is more than the amount of material can be conveyed cluster tool.

在实施例中,该系统的组件可以由软件控制器控制,该软件控制器在实施例中可以是控制组件中每一个的中央控制器。 In an embodiment, components of the system may be controlled by the software controller, the software controller in the embodiment may be a central controller of each of the control assembly. 在实施例中,组件形成在软件控制之下的可链接处理系统,其中该软件控制每个机器人以将材料移交给另一机器人,或者移交到由下一个机器人拾取的缓冲器中。 In an embodiment, the assembly forming a processing system linked under software control, wherein the software control of each robot to another robot to the transfer material, or transfer to a robot picked up by the buffer. 在实施例中,该软件控制系统识别可添加新组件,如处理模块或机器人,当那个组件插到该系统中时,如识别网络上的组件,如USB、以太网、带电线、蓝牙、802.11a、802.11a、802.11g或其它网络。 In an embodiment, the control system identifies the software to add new components, such as a robot or a processing module, when the assembly is inserted into the system, such as the recognition component on the network, such as USB, Ethernet, wire band, Bluetooth, 802.11 a, 802.11a, 802.11g, or other network. 在这种实施例中,下一个机器人、处理模块或其它组件一插入到用于将被处理的材料如晶片流的软件程序机中,就可以自动重新装配,以便将材料发送到系统中的新链环上。 In such embodiments, the next robot, or other components of a process module for insertion into the material to be treated as a software program stream wafer machine, can automatically re-assembly, so as to transmit the material to the new system chain ring. 在实施例中,软件程序机基于中枢网,或者其可以是规则基程序机。 In an embodiment, the software program based on central network unit, or it may be a rule-based scheduler. 在实施例中,处理模块可以使它们自身知道这种网络,以便软件控制器知道已连接了什么样的新的处理模块、机器人或其它组件。 In an embodiment, the processing module can be made aware of such networks themselves, so that the software controller has been connected to know what the new processing module, the robot or other components. 当将新的处理模块插入到空面中时,该系统可以识别它并且使它安排到材料处理的流程中。 When a new process module is inserted into an empty surface, the system may recognize it and to arrange it in the material handling process.

在实施例中,该软件系统可包括允许用户运行系统模拟的接口。 In an embodiment, the software system may include a user interface to allow the system to run the simulation. 该接口允许用户观看各种链环、机器人臂和其它组件的链接和结构,以最优化结构(如通过经由各种组件移动材料流、移动处理模块、移动机器人等)和确定从供应者取得什么样的结构。 The interface allows the user to view a variety of links and link structure of the robot arm and other components, to optimize the structure (e.g., via the various components of the mobile material flow, motion processing module, a mobile robot, etc.) and what is obtained from the suppliers determined like structure. 在实施例中,接口可以是网状接口。 In an embodiment, the interface may be a web interface.

在此公开的方法和系统可以使用在机器人驱动器之间的任选缓冲器台4010。 In the method and system disclosed herein may be used between the robot's drive optionally a buffer table 4010. 机器人可以彼此直接移交,但这在技术上更难以最优化,并且将占用两个机器人,因为它们两个都将必须获得同时移交,这比如果当准备好时其它机器人可以拾取的它们之间可以堆放虚拟位置4010是更加限制的。 The robot can be transferred directly between each other, but it is technically more difficult to optimize, and will occupy two robots, because they will have to get both at the same time transfer, which can be picked up than if other robots when they are ready 4010 virtual stacking position is more limited. 缓冲器4010还能够实现较高的生产量,是因为该系统不必等待两个机器人变成可用。 Buffer 4010 also enables higher production, because the system does not have to wait for two robots become available. 此外,缓冲器4010还可提供好的机会来执行晶片上的一些小处理步骤,如加热、冷却、对准、检查、测量、测试或清洗。 Further, the buffer 4010 may provide a good opportunity to perform some step of the process a small wafer, such as heating, cooling, alignment inspection, measurement, testing or cleaning.

在实施例中,在此公开的方法和系统使用在机器人区/部分4012之间任选的真空隔离阀4006。 In an embodiment, the method and system disclosed herein is used in the area between the robot / part 4012 optionally vacuum isolation valve 4006. 每个部分4012都可以与任一其它的部分4012完全隔离。 Each portion 4012 may be associated with any other portion 4012 completely isolated. 如果机器人处理在其部分4012中的超清洁且敏感的材料(例如晶片),则使部分4012与该系统的其余部分隔离可防止垃圾部分4012交叉污染清洁部分4012。 If the robot in the processing section 4012 of its super-clean and sensitive material (e.g. a wafer), so that part of the 4012 can be prevented and isolated from the rest of the system to clean trash portion 4012 portion 4012 of cross-contamination. 而且现在制造商可以在不同的压力下操作部分4012。 And now the manufacturer can operate in the portion 4012 at different pressures. 制造商可以具有分步的真空级,真空越来越好地进入到机器中。 Manufacturers may have vacuum level stepwise in vacuo increasingly well into the machine. 利用部分4012之间的真空隔离阀4006的大优点可以是:在进入隔离室部分4012的其它部分系统中,在没有除去材料或晶片的气体的前提下可以进行处理自动清洗晶片(在没有受到环境污染的前提下,在清洗步骤之后制造的且需要在处理模块之间的输送)。 Great advantage of using a vacuum isolation valve 4012 between the portions 4006 may be: in the rest of the system into the isolation chamber portion 4012, the premise is not removed in the gas material or wafer may be processed automatically clean the wafer (not subject to the environment contamination under the premise of being fabricated after the washing step needs to be delivered, and between the processing modules).

在实施例中,可以是机器人之间的真空隔离,如同在如使用缓冲器模块4010、小型处理模块或检查模块4010的机器人之间缓冲的材料。 In an embodiment, it may be a vacuum insulation between the robot, such as between the robot using a buffer module 4010, a small check processing module or modules 4010 cushioning material.

图5示出了线性处理系统4000的顶视图,如具有与图4相同的线性结构的系统。 FIG. 5 shows a top view of a linear processing system 4000, such as a linear system having the same structure of Figure 4.

不同形式的机器人可以用在半导体制造设备中,如在图4和5中公开的群集工具或线性处理机器。 Different forms of robots used in semiconductor manufacturing equipment, a cluster tool as in FIGS. 4 and 5 or the linear processing machine disclosed.

图6示出了3链环SCARA臂6002和4链环SCARA臂6004。3链环或4链环臂6002、6004由机器人驱动器驱动。 FIG 6 shows a SCARA arm 6002 link 3 and link 4 6004.3 SCARA arm link or links 4 are driven by the robot arm driver 6002,6004. 3链环臂6002一般用在工业中。 3 link arm 6002 is generally used in the industry. 当使用3链环SCARA臂6002时,该系统没有被优化,原因在于伸展范围与可容度比不是很好。 When using a SCARA arm 6002 link 3, the system is not optimized, because the stretch ratio of the containment is not very good. 因此,真空室需要更大,并且由于成本随着真空室的尺寸急剧升高,所以具有3链环SCARA臂6002会增加系统的成本。 Thus, the need for greater vacuum chamber, with the size of the vacuum chamber and because of the sharp increase in costs, so the cost of having 3 link SCARA arm 6002 increases system. 而且具有3链环SCARA臂6002的系统的总底面积变得更大。 The total area and having a bottom 3 chain ring SCARA arm 6002 becomes larger. 而且,3链环SCARA臂6002的伸展范围小于4链环臂6004的。 Further, the stretch 3 chain ring SCARA arm 6002 link arm 4 is less than 6004. 在一些情况下,制造商希望获得大地、深深地移交到处理模块中,并且4链环臂6004到达更远超过了其可容度比。 In some cases, manufacturers want the earth, the transfer deeply into the process module, and the link arm 4 reaches greater than 6004 which can accommodate ratio. 这在一些非-SEMI-标准处理模块中具有优点。 This has the advantage -SEMI- In some non-standard processing module. 还具有当制造商想覆盖部分之间的大距离时的优点。 When the manufacturer also has to cover a large distance between like portions of advantages.

4链环臂6004是有利的,因为其以比3链环SCARA臂6002更小的可容度比折叠,但对于相同的限制直径比常规的3链环SCARA6002到达得更远。 4 link arm 6004 is advantageous, because it is smaller than 3 to link the containment SCARA arm 6002 may be folded over, but for the same confinement diameter reaches further than the conventional 3 link SCARA6002. 与装配在该系统顶部上的具有第二驱动器和第二4链环臂6004的能力结合,它允许在处理模块中快的材料交换。 The ability to bind and fitted on top of the system with a second driver and a second link arm 4 6004, which allows quick exchange of materials in the processing module. 例如,可在如所示的固定驱动器的顶部上、或者在提供旋转运动的传输以激励臂和带的移动车的顶部上装配4链环SCARA臂6004。 For example, it may be fixed on top of the drive as shown, or to provide rotational movement to transfer excitation mounting links 4 SCARA arm 6004 on top of the dolly arm and the band. 在任一情况下,4链环臂6004,任选地与第二4链环臂6004一起,可提供致密的、长伸展的臂,该臂在没有碰撞开口边缘的前提下可以穿过小开口。 In either case, the link arm 6004 4, 4, optionally with a second link arm 6004, offer a compact, long-extending arm which is provided in the opening edge without collision may pass through a small opening.

图7示出了4链环SCARA臂7004的伸展范围和可容度特性。 FIG 7 shows four chain ring stretch SCARA arm 7004 and containment characteristics. 在实施例中,没有通过最优化伸展范围与可容度比来抑制4链环SCARA臂7004链环长,如在一些其它的系统中那样。 In an embodiment, no more than 4 is suppressed SCARA arm 7004 link by link length and stretch of the containment optimized, as in some other systems. 最优化伸展范围与可容度比会导致太长的第二臂构件。 Optimization can accommodate the stretch ratio leads to a too long second arm member. 当臂穿过实际接近最小限制直径放置的槽阀时,该第二臂构件会与槽阀的内边缘碰撞。 When the actual arm passes close to the minimum diameter of the valve restriction positioned grooves, the second arm member will collide with the inner edge of the slot valve. 因此可基于避免碰撞设计臂穿通的狭逢阀来计算第二(和第三)链环的尺寸。 Thus avoid collision based on the size of the design of the arm through every slit valve calculating a second (and third) link. 这会导致L1、L2和L3之间很不同的比率。 This can lead to very different between L1, L2 and L3 ratio. L2的长度可约束L3的长度。 The length L2 may constraint length L3. 用于最优化臂长度的方程式可以是受迭代解作用的4次幂方程式。 The equation for optimizing the length of the arms may be affected by the fourth power equation photolysis iteration.

图8示出了用于机器人系统8002的高级组件,包括控制器8004、驱动器/电动机8008、臂8010、末端执行器8012和要处理的材料8014。 FIG 8 illustrates a high-level assembly for a robotic system 8002 includes a controller 8004, the drive / motor 8008, an arm 8010, the material 8014 and the end effector 8012 to be processed.

图9示出了用于处理系统中的机器人臂系统的双臂9002结构的组件。 Figure 9 shows a robotic arm assembly for a system of arms in the processing system 9002 configuration. 一个臂从底部9004装配,而另一个臂从顶部9008装配。 An arm 9004 from the bottom of the assembly, while the other arm assembly 9008 from the top. 在实施例中两个都是4链环SCARA臂。 In Example 4 are two links SCARA arm. 在顶部上装配第二臂是有利的。 Fitted on top of the second arm is advantageous. 在一些其它的系统中,臂已连接至经由室的顶部装配的驱动器,但是下和上驱动器常规地机械耦接。 In some other systems, the drive arm connected to the chamber via the top of the assembly, but the upper and lower drives are conventionally mechanically coupled. 在实施例中,在图4和图5公开的线性系统中的两个驱动器之间不存在机械连接;代替地,可在软件系统或控制器中配合两个臂(为了防止碰撞)。 In an embodiment, the mechanical connection exists between FIG. 4 and FIG. 5 linear system disclosed in the two drives; instead, the two arms can be fitted in a software system or a controller (in order to prevent a collision). 如果由于生产量原因有必要的话,则可任选地仅包括第二(顶)臂9008。 If necessary because of production reasons, it may optionally comprise only the second (top) arm 9008.

正如常规的SCARA臂一样,另一特征是可需要仅两个电动机来驱动4链环臂。 As a conventional SCARA arm, as may be further characterized in that only two motors to drive link arm 4. 臂中的带可保持平行。 The arms can remain parallel with. 例如,利用平行杆代替带,还可获得平行或其它对等的运动。 For example, instead of using a band parallel rods, or other movement may also be obtained parallel to the like. 通常,仅使用两个电动机可提供巨大成本的优点。 Typically, only two motors may provide the advantage of substantial cost. 同时,三个电动机可提供功能性优点,是因为最后的(L4)链环可独立地操纵,然而另外的带、支承、连接、轴和电动机会使系统变得更昂贵。 Meanwhile, the motor may be provided three functional advantages, since the last (L4) link can be manipulated independently, but with additional support, connect, and the motor shaft cause the system to become more expensive. 另外,过多的带会给臂机构增加显著的厚度,使得难以穿过臂通过(SEMI标准)槽阀。 Further, excessive belt arm mechanism will add significant thickness, making it difficult to pass through the arm (SEMI standard) tank valve. 而且,使用较少的电动机一般会简化相关的控制软件。 Further, the motor will generally use less simplified related control software.

在此公开的4链环SCARA臂的另一特征是腕可偏离中心线。 Another feature of the disclosed link SCARA arm 4 is offset from the centerline of the wrist can. 由于理想的系统具有顶支架9008以及装配4链环臂的底部9004,所以如果制造商还必须遵守SEMI标准的话,则臂构件的垂直设置难以粘接。 Since the ideal system 9008 having a top and a bottom mounting bracket 4 link arm 9004, if the manufacturer also must comply with the SEMI standard, then the arm member vertically disposed difficult to bond. 简言之,这些标准指定了尺寸并且通过槽阀4006到处理模块中的需求。 Briefly, these standards specify the size and needs of the valve through the slot 4006 to the processing module. 它们还指定了在上面必须装载晶片的中心线上方的水平面。 They also specified level above the centerline of the wafer must be loaded in the above. 许多现有的处理模块满足这种标准。 Many existing processing modules meet this criterion. 在不满足的系统中,尽管开口尺寸以及传送面的确定略有不同,但狭逢阀4006由很相似的形状制成。 System is not satisfied, although the opening size is determined as well as the transfer surface is slightly different, but every slit valve 4006 is made of a very similar shape. SEMI标准尺度限制需要非常致密封装的臂。 SEMI standard size limitations require very dense packaging arm. 利用偏移,腕能够使顶臂9008和底臂9004更靠近在一起,使得它们穿过狭逢阀4006更容易。 Using an offset, the wrist can be made top arm and bottom arm 9008 9004 closer together, so that they pass through the slit valve 4006 is closed more easily. 如果腕没有偏离,则臂需要垂直地停留得更远,并且晶片交换会占用更多时间,因为驱动器需要在垂直方向上移动更多。 If there is no deviation from the wrist, the arm needs to stay farther vertically, and the wafer exchange takes more time, because the drive needs to move more in the vertical direction. 提议的顶臂设计不需要有腕偏移,但腕偏移会有利地缩小系统的转弯半径,并且允许更好的机械臂布局,所以没有干扰存在。 The proposed design does not require a top arm with a wrist offset, the offset will advantageously wrist turning radius reduction system, and the robotic arm allows a better distribution, so there is no interference is present.

图10示出了4链环SCARA臂6004的伸展范围和可容度能力。 Figure 10 shows a stretch of the chain 4 and containment capability ring 6004 SCARA arm.

图11示出了4链环SCARA臂6004的干扰特性1102。 FIG 11 shows disturbance characteristics link SCARA arm 4 6004 1102. 腕偏移有助于使臂在比可能的其它方式小的空间中折叠。 Wrist helps to offset arm folded smaller than otherwise possible space.

图12示出了一组双臂4链环SCARA臂6004的侧视图。 FIG 12 shows a side view of the ring 6004 SCARA arm 4 arms chain group. 尤其是由于顶臂封装的约束,必需构造具有一些唯一特征的臂。 In particular, since the package top arm restraint, the arm necessary to have some structure unique features. 在实施例中,基于缩进的一个链环部分地进入另一臂链环中的切口。 In an embodiment, the other arm enters the cutout in the link based on a link indented partially. 带可以设置成双份,而不是单个带,以便一个带12004在切口上方,一个带12008在切口下方。 May be provided with a double rather than a single strip, to a band above the cut-in 12004, 12008 with a notch in the bottom. 不依赖于这是4链环臂事实的一个解决方案,使L2显著地低12002,与L1具有垂直的间隙,以便L3和L4可以在内部折叠。 4 which is not dependent on the fact that a link arm solution that L2 is significantly lower 12002, and having a vertical gap L1 to L3 and L4 may be folded inside. 降低L2 12002可使L3和L4到达正确的转移平面,并且可获得较好的可容度比。 Reduction of L3 and L4 L2 12002 reach the correct transfer plane, and obtain better containment than. 由于转移平面的限定,需要降低L2 12002。 Since the transfer plane is defined, it is necessary to reduce L2 12002.

图13示出了其中使用带和连杆的组合的实施例。 FIG 13 illustrates an embodiment wherein a combination is used with the link. 可通过单个带或双带结构完成经过L1 13002和L3 13006的传动。 After completion of the drive may be L1 13002 and L3 13006 by a single band or dual band structure. 相反,L2 13004中的传动可通过机械连杆(齿条)13010完成。 In contrast, L2 13004 in a transmission can be accomplished by a mechanical linkage (rack) 13010. 这种结构的优点是可以使用封闭接头,其减小了允许臂更容易穿过SEMI标准槽阀的臂装配的垂直尺度。 The advantage of this configuration is a closed joint can be used, which allows the arm is reduced more easily pass through the valve grooves SEMI standard vertical scale arm assembly.

图14示出了用于具有线性结构14000的处理系统的外部回送系统。 FIG 14 shows an external loopback processing system for a system having a linear structure of 14000. 回送机构任选地位于线性真空室的顶部上。 Optionally loopback mechanism positioned on top of the vacuum chamber is linear. 在常规的真空处理系统中,回送路径一般穿过与入口路径相同的区域。 In conventional vacuum processing system, the loopback path passes through the inlet path generally the same area. 这打开了交叉污染的可能性,这当在处理步骤之间移动的清洁晶片被从还没有被清洗的脏晶片进入系统的残留物污染时出现。 This opens up the possibility of cross-contamination, which occurs when moving between the cleaning process step the wafer is not yet cleaned from dirty wafer residual contamination into the system. 对于机器人4002还使得必需处理材料进入以及材料出去,并且使得更难以控制真空环境。 For further robot 4002 enters such necessary materials and process materials out, and makes it difficult to control a vacuum environment. 通过在后部退出真空系统以及在空气通道14012中前后倒置的顶部上移动晶片,存在一些显著的优点:实施空气回送可相对廉价;空气回送可释放真空机器人4002,因为它们未必必须处理材料出去;以及空气回送使完成的材料脱离引入的区域保持清洁,由此降低了交叉污染的危险性。 By the rear exit vacuum system, and on the front and rear air passage 14,012 in the inverted top of moving the wafer, there are some significant advantages: embodiment air loopback may be relatively inexpensive; air loopback releasably vacuum robot 4002, since they do not necessarily have to process material out; and an area air loopback complete detachment of the material introduced to keep clean, thereby reducing the risk of cross-contamination. 在后部采用小载荷锁(load lock)14010会增加一些成本,因此可以是空气通道14012,因此在短且真空级和交叉污染不是这么重要的系统中,空气回送可具有较小价值,但在具有许多集成处理步骤的长系统中,上述的系统空气回送可具有显著的优点。 In the rear portion of a small load lock (load lock) 14010 add some cost, and therefore the air channel can be 14012, and therefore shorter and the vacuum level and cross-contamination is not so critical systems, air loopback may have a smaller value, but long integration processing system having a plurality of steps, the system described above may have air loopback significant advantages. 回送系统还可以是真空回送,但是更昂贵和实施更复杂。 Loopback vacuum system may also be sent back, but more expensive and more complicated embodiment. 应当理解,当在一些实施例中载荷锁14010可设置在线性系统末端,如图14所描绘的,载荷锁14010可以设置在任何地方,如在系统的中间。 It should be appreciated that, when, as an intermediate in the embodiment of the system may be provided online 14010 load lock system terminal, as depicted in FIG. 14, the load lock may be disposed anywhere 14010 number. 在这种实施例中,制造零件可以在系统中这样的另一点处进入或退出系统,如使系统退到空气回送中。 In such an embodiment, the manufacturing system parts can enter or exit the system at this point to another, such that the program returns the loopback in the air. 中系统出口点的优点可以是,在部分系统故障的情况下,可以恢复材料或晶片。 Advantage exit point in the system may be, in the case of a partial system failure, or wafer material can be recovered. 中系统入口点的优点可以是,晶片可以插入到系统中的若干位置,能够实现更显著的柔性处理流程。 The system advantages may be the entry point, the wafer may be inserted into several locations in the system can be achieved more remarkably flexible processes. 实际上,中系统入口或出口位置作用就象由中系统位置连接在一起的两个机器一样,有效地消除了EFEM位置。 In fact, the position of the inlet or outlet of the system acts like neutral position of two machine systems connected together as, effectively eliminating the EFEM position. 还应当理解,无论制造商希望什么形式,如适合制造工具的结构,当图14和随后的图的实施例是直线系统时,线性系统可以是曲线的;即,该系统可具有曲线、U或V形、S形或这些的组合或任何其它的曲线路径。 It should also be appreciated that, regardless of manufacturers like to form, such as a structure suitable for manufacturing the tool, as in FIG. 14 and the embodiment subsequent figures are in-line system, the linear system may be curvilinear; i.e., the system may have a curved, U, or V-shaped, S-shaped, or any combination of these or other curvilinear path. 在每种情况下,该系统都任选地包括入口点和从入口点向下行线路(尽管任选地不是直线)的出口点。 In each case, the systems optionally include an entry point from the entry point and the down line (although not straight optionally) exit point. 任选地,空气回送将零件从出口点送到入口点。 Optionally, the part of air returning from the exit point to the entry point. 任选地,该系统可以包括一个以上的出口点。 Optionally, the system may comprise more than one exit point. 在每种情况下,在此描述的机器人臂可以有效地帮助将零件移向中心,而没有其它线性系统的问题。 In each case, the robot arm described herein can effectively help the part toward the center, while the other linear system without problems. 图14示出了U形线性系统的实例。 FIG 14 shows an example of U-linear system.

仍参考图14,该系统的实施例使用双载具机构14008,以便完成的晶片可以很快地回送给系统的前面,而且以便可以在恰好移除了满载具的位置放置空载具14008。 Still referring to FIG 14, embodiments of the system using the two carrier means 14008, in order to complete the wafer can be quickly back to the front of the system, and so can be removed with a full load position with 14,008 placed in exactly. 在实施例中,空气回送将回送包含N个晶片的载具14008。 In an embodiment, the air loopback loopback carrier comprising N of 14,008 wafers. 可以根据生产量和成本需求最优化N。 N. can be optimized based on production volume and cost requirements 在实施例中,空气回送机构可包含空载具14008以便当从真空载荷锁14010移除满载具14018时,可以立即放置新的空载具14008并且可以倒空载荷锁14010以接收更多材料。 In an embodiment, the air feeding mechanism may comprise a return load with 14008 so that when the load is removed from the vacuum lock 14010 with 14018 when full, may be placed immediately with the new load 14008 and may be emptied to receive more load lock 14010 material. 在实施例中,空气回送机器能够将晶片移向系统的前面。 In an embodiment, the air can be sent back to the wafer toward the front of the machine system. 在下降点可使用垂直起重机14004将载具降低到EFEM(设备前端模块)机器人可以到达的水平面。 Drop point may be used in the vertical crane 14004 The carrier level is reduced to the EFEM (equipment front end module) of the robot can reach. 在载荷锁点,垂直起重机14004可以降低以从载荷锁拾取空载具14008。 The load lock point, perpendicular to the crane can be lowered to 14004 from the load lock load pickup device 14008.

在实施例中,空气回送机构可用作空载具14008的存储区域14014,大概放置在载荷锁14010位置的最末端和后面。 In an embodiment, air is used as a loopback mechanism having a load storage area of ​​14008 14014, and most probably placed at the end position of the rear load lock 14010. 对此的原因是,当载荷锁14010释放载具14018时,抓具14004可以抓取载具14018并且将它略向前移动。 The reason for this is that when the load lock 14010 14018 release carrier, the gripper carrier 14018 14004 can grab it and move slightly forward. 然后抓具14004可以释放满载具14018,一路移回和取回空载具14008,将它放置在载荷锁14010上。 The gripper is then loaded with 14018 14004 can be released, moved back all the way to retrieve and load with 14008, and place it on the load lock 14010. 在该点处可以撤出载荷锁14010。 At this point the load lock 14010 can be withdrawn. 抓具14004现在可以回到满载具14018并且将它一路移向系统的前面。 The gripper can now return to full 14004 14018 and with it all the way toward the front of the system. 一旦载具14018被EFEM倒空,它就可以回送到等待下一个循环的背面。 Once the carrier is EFEM 14018 emptied, it can return the back to wait for the next cycle.

还能够将起重机放到栽荷锁中胜于利用抓具中的垂直运动,但是将更昂贵。 The crane can also be charged into the plant rather than using a lock of a vertical movement of the gripper, but will be more expensive. 还将略少柔韧性。 It will be slightly less flexibility. 制造商希望载具14018在少数位置垂直运动,并且将它放到抓具14004中将是更经济的,因为制造商仅需要一个垂直机构。 Vehicle manufacturers want vertical movement in a few positions 14018 and place it in the gripper 14004 is more economical, because the manufacturer need only a vertical means.

图15示出了用于图14的处理系统的外部回送系统的某些另外的细节。 FIG 15 shows an external processing system of FIG. 14 for loopback certain additional details of the system.

图16示出了用于图14的处理系统的外部回送系统的另外细节。 FIG 16 shows further details of the system for external loopback processing system 14 of FIG.

图17示出了图14的回送通道14012中的输出载具14018的运动。 FIG 17 shows a back channel output 14012 of FIG. 14 14018 movement carrier.

图18示出了图14的回送系统14012中的空载具14008的处理。 18 illustrates loopback processing system 14012 in FIG. 14 with a load of 14,008.

图19示出了图14的回送通道14012中的空载具14008到载荷锁14010位置中的移动。 14012 FIG return path 19 in FIG. 14 shows a load in the load lock to the mobile device 14008 14010 position.

图20示出了降低和撤出的空载具14008及抓具14004在图14的回送系统中的移动。 FIG 20 shows a load reduction and withdrawal movement of the gripper with 14008 and 14004 in the return pumping system 14 in FIG.

图21示出了当满载具14018在图14的回送通道14012中被倒空时空载具14008在接收材料。 FIG 21 shows that when loaded with 14,018 hourly space is emptied back channel 14012 in FIG. 14 in the carrier receiving material 14008.

图22示出了在图14的回送通道14012中停在夹持位置、开始新返回循环的空载具14008。 22 shows a stop in the return path in FIG. 14 14012 in the clamping position, to return to start a new cycle with no load 14008.

图23示出了用于制造工艺的处理工具的结构,在线性结构中具有双臂机器人系统23002和回送系统。 FIG. 23 shows the structure of the processing tool for the manufacturing process, having a linear structure and a dual-arm robot system 23002 loopback system.

图24示出了用于本发明的处理方法和系统的总系统结构的可选实施例。 FIG 24 shows an alternative configuration of a total system for processing method and system of the present embodiment of the invention.

图25示出了线性系统25002的底面积相比常规集群系统25004的比较。 FIG 25 shows a linear bottom area of ​​the system compared to more conventional 25002 25004 of the cluster system. 注意到关于线性系统25002,制造商可以容易地伸展具有另外模块的该机器,而不会影响系统生产量。 Noting Linear Systems 25002, manufacturers can easily be extended with additional modules of the machine, without affecting the production system.

图26示出了在根据本发明实施例的处理系统中配置有特大型处理模块26002的线性结构。 FIG 26 shows a configuration with a large linear structure processing module 26002 in the processing system according to embodiments of the present invention.

图27示出了用于根据本发明实施例的处理系统的后出口结构。 FIG 27 shows a rear outlet structure for a processing system according to embodiments of the present invention.

图28示出了采用根据本发明各种实施例的线性处理系统的制造工具的各种布局可能性。 Figure 28 shows a tool for producing the possibility of introducing various layouts linear processing system in accordance with various embodiments of the present invention.

图29示出了本发明的一个实施例,其中机器人29002可包括若干驱动器29004和/或若干控制器29008。 FIG 29 illustrates an embodiment of the present invention, where the robot may include a plurality of driver 29002, and 29004/29008 or several controllers. 在实施例中控制器29008可控制若干驱动器29004以及其它外围器件如槽阀、真空量具,由此机器人29002可以是具有若干驱动器29004的一个控制器29008或具有若干驱动器29004的若干控制器29008。 In an embodiment, the controller may control several 29008 29004 drives and other peripheral devices, such as slot valve, vacuum gage, whereby the robot controller 29002 may have a plurality of drive controllers 29004 to 29008 or 29008 having a plurality of a plurality of driver 29004.

图30示出了有关本发明实施例的转移平面30002和槽阀30004的特性。 FIG 30 shows the characteristic of the present invention is related to a transfer plane of the embodiment of the valve 30002 and 30004 of the grooves.

图31示出了用于将晶片置于中心的翻转抓具31002。 FIG 31 illustrates the wafer at the center of the reversing gripper for 31002. 在图32中在被动中心抓具32002上方的翻转抓具31002的优点是,在翻转器31004和晶片31008的背面之间有较少运动。 FIG advantage flip gripper 32 is above the center of the passive gripper 32002 31002 that between the back surface of the wafer tumbler 31004 and 31008 have little motion. 翻转器31004可逐渐轻触定中心于末端执行器上的晶片31008,随着其向下移动在两侧支撑它。 Turner 31004 may gradually tap 31008 centered wafer on the end effector, supporting it as it moves downwardly on both sides. 在某个制造工艺中,希望将晶片31008置于中心,如在真空环境中。 In a manufacturing process, at the center of the wafer is desirable to 31008, as in a vacuum environment. 如当在机器人臂末端采用执行器时,翻转抓具31004能够处理非常易碎的晶片31008,这是因为其在处理期间支撑晶片的两端。 When employed as an actuator in the end of the robot arm, the gripper 31 004 Flip able to handle very fragile wafer 31008, because it is supported at both ends of the wafer during processing.

图32示出了用于夹持晶片31008的被动中心末端执行器32002。 32 shows passive end effector 32002 Center for holding the wafer 31008. 当末端执行器升起(或晶片31008降低)时,晶片31008一般略偏离中心。 When the end effector is raised (or lowered 31008 wafer), the wafer is typically slightly offset from the center 31008. 这会导致晶片31008向斜坡下滑动并且落入切口32004中。 This causes the wafer to slide down the slope 31 008 and 32 004 fall within the cutout. 这会导致晶片31008突然落下或移动,其反之会产生颗粒。 This causes a sudden falling or moving the wafer 31008, which generate particulate and vice versa.

在此公开的方法和系统在制造工艺期间在材料或零件的处理方面提供了许多优点。 In the methods and systems disclosed herein provide a number of advantages in handling the material or components during the manufacturing process. 在其它事物当中,可以是机器人之间的真空隔离,以及机器人之间的材料缓冲。 Among other things, it may be a vacuum insulation between the robot, the robot and the material between the buffer. 制造商可以将完成的晶片回送到系统的顶部上方,而没有经历真空,其是很重要的优点,仅需要一半必需的处理步骤,消除了完成的和未完成的材料之间的交叉污染并且保持了与现有的清洁空间设计共存。 Manufacturers finished wafer may be returned to the system over the top, but not subjected to vacuum, which is an important advantage, half of the processing steps require only necessary to eliminate cross-contamination between the finished and unfinished material and holding with existing clean space design coexist. 当制造商具有相对脏的晶片进入系统时,制造商希望使它们被清洗时与机器的其余部分隔离开,其通常是处理中的第一步骤。 When the wafer manufacturer with a relatively dirty entry system, manufacturers want them with the rest of the machine when washing isolate, which is usually the first step in the process. 保持完成的或部分完成的材料远离机器的清洗部分是有利的。 Holding completion or partial completion of the washing material away from the machine part is advantageous.

可通过在此公开的方法和系统提供其它的优点。 By the methods and systems disclosed herein provide additional advantages. 双臂(顶部装配和底部装配)可以并列的方式工作,能够实现很快的材料交换。 Working arms (top and bottom mounting assembly) may be parallel, it is possible to achieve very fast switching material. 不管实际的臂设计(3链环、4链环等),在没有机械地连接到底部中的臂的盖中装配臂是有利的。 Regardless of the actual design of the arm (link 3, link 4, etc.), without mechanically connected in the end cap in the arm mounting arm portion is advantageous. 在此提供的4链环SCARA臂的链环长度可以是很有利的,不象常规的臂,它们由槽阀和室半径的机械限定确定。 Link length of the link SCARA arm 4 provided herein may be advantageous, unlike the conventional arm, are determined by the mechanical valve and the tank chamber defined radius. 在此公开的4链环SCARA臂也是有利的,因为对于链环它们可以使用两个电动机,连同Z电动机一起,而不是三个电动机加上Z电动机。 The disclosed link SCARA arm 4 is also advantageous, because they can be used to link two motors, the motor together with Z, Z plus motor instead of three motors.

材料在后部退出的线性真空系统可提供很多好处。 The vacuum system of linear material may be provided at the rear exit of the many benefits. 可进行另一实施以具有穿过两个相对墙安装的入口系统和出口系统。 Another embodiment may be an inlet and an outlet system through a system having two opposing walls of the installation.

在此公开的4链环SCARA臂还能够使链环L3摆动到链环L2中和其上方用于顶部机器人驱动器。 4 disclosed herein link SCARA arm further enables the swing link to link L3 and L2 over which the robot for a top drive. 利用3链环SCARA这不容易进行,也不存在4链环SCARA臂的变形,因为它们具有错的链环长度。 3 using this link SCARA is not easy, there is no deformation of the link SCARA arm 4, since they have the wrong link length.

在线性系统中用于载具的抓具和若干载具位置还可在线性制造结构中的材料处理方面提供许多好处。 The line system for the gripper carrier and several materials handling vehicle position may also be manufactured in the linear structure provides many benefits. 包括抓具中和/或后部栽荷锁中的垂直运动也可提供好处。 Comprising a gripper and / or planting bearing lock rear vertical movement may also provide benefits.

虽然已连同某些优选实施例描述了本发明,但本领域技术人员将认识到,在此包括其它的实施例。 While there has been described in connection with certain preferred embodiments of the present invention, those skilled in the art will recognize that in other embodiments included herein.

图33示例了包括中入口点33022的制造工具。 Figure 33 illustrates a manufacturing tool comprises inlet points of 33,022. 在实施例中,制造工具可包括其中可以取出或加入晶片31008的载荷锁定中流33002。 In an embodiment, the manufacturing tool can include those in which the wafer can be removed or added to the load lock 31008 33002 flows. 对于这种系统来说存在显著的优点,包括提供提供双处理能力(例如,在彼此后面连接两个机器,但仅需要使用一个EFBM)的处理工具。 There is a significant advantage for such a system, the process comprising providing provides dual capabilities (e.g., two machines are connected behind each other, but only requires the use of a EFBM) processing tools. 在实施例中,空气回送系统14012也可以将新的晶片31008送到中点33022以及使晶片31008进入到那里。 In an embodiment, the air system loopback 31008 14012 also may be a new wafer to the wafer midpoint 33022 and 31008 to enter there.

图34示例了具有中入口点33022的制造工具的几个顶视图。 FIG 34 illustrates a top view with several entry points 33022 manufacturing tool. 该图还示例了中入口点的组合如何有效地用于消除EFEM34002中之一。 The figure also illustrates the combination of the entry point for how to effectively eliminate one of the EFEM34002.

图35示例了包括一系列传感器35002的制造工具。 Figure 35 illustrates a manufacturing tool comprises a series of sensors 35002. 在许多制造工具中,如这种传感器35002一般用于检测材料35104是否仍存在于机器人臂35018上。 In many manufacturing tools, such as a sensor for detecting whether a material is generally 35002 35104 35018 still present on the robot arm. 这种传感器35002一般可放置在入口和出口点的每个真空室4012处。 At each vacuum chamber such sensors may be placed generally 35002 entry and exit points of 4012. 这种传感器35002可由垂直的光束组成,或采用发射器和检测器,或采用发射器/检测器和反射器的组合。 Such a sensor may be a vertical beam component 35002, or the use of emitter and detector, or using a combination emitter / detector and a reflector. 在真空处理工具中,机器人台的练习由熟练操作员共同地完成,该操作员观看机器人臂的位置和材料,并且调整机器人位置以确保材料35014沉积在正确的位置。 In the vacuum processing tool, the robot station common practice done by a skilled operator, the operator viewing the position of the robot arm and the material, and adjusts the position of the robot to ensure that the material is deposited in the correct position 35014. 然而,这些位置经常非常难以观察,并且视差和其它光学问题在恰当地训练机器人系统时存在显著的障碍。 However, these positions are often very difficult to observe, and the parallax optical problems and other significant obstacles in properly training the robot system. 因此训练工序会消耗许多小时的设备停机时间。 Therefore, the training process can consume many hours of equipment downtime.

已发展了几种自动训练的应用,但它们可包括使机器人臂跑到物理障碍如墙或边缘中。 Several applications have been developed for automatic training, but they may include the robot arm went to physical barriers such as walls or edges. 这种方式具有显著的下降趋势:例如利用易碎的但能够耐受很高晶片温度的陶瓷材料来构造许多机器人末端执行器,使机器人物理接触障碍物有损伤机器人或障碍物的危险。 In this manner a significant decreasing trend: using e.g. fragile but able to withstand high temperature ceramic material wafer constructed of many robotic end effector, the robot has a risk of damaging physical contact with an obstacle or obstacles the robot. 同样地,在许多处理模块内部有很易碎且容易损伤的物体。 Similarly, many of the processes within the module object is brittle and easily damaged. 此外,不能够采用这些具有某些材料如存在于机器人末端执行器上的晶片31008的自动训练程序。 Furthermore, these can not be employed with certain materials, such as automatic training program is present on the robot end effector of wafer 31008. 而且,确定垂直位置更难,因为由撞上障碍物引起对臂的向上或向下的力是更难以检测的。 Also, determine the vertical position is more difficult, because the cause of the hit an obstacle to the upward or downward force of the arm is more difficult to detect.

在在此所描述的系统中,一系列传感器35002-35010可包括水平传感器35004-35010和垂直传感器35002。 In the system described herein, a series of sensors 35002-35010 35004-35010 sensor may include a horizontal and vertical sensor 35002. 传感器35002-35010的这种组合能够检测例如穿过机器人末端执行器、臂或有把手物体的光束裂开。 This combination of sensors capable of detecting, for example, through 35002-35010 robotic end effector, a handle arm or the object beam split. 当机器人臂35018处于缩进位置时,垂直传感器35002可放置在晶片31008区域的略靠外部。 35018 When the robot arm in the retracted position, may be placed in vertical sensor 35002 31008 slightly to the outside region of the wafer. 当机器人完全缩进时,垂直传感器35002还可以或代替地放置在如置于入口开口前面中心且被晶片覆盖的晶片内的点35012的位置。 When the robot is fully retracted, the vertical sensor 35002 may also or instead be placed at the point within the wafer, such as 35012 is placed in front of the inlet opening and the center of the wafer is covered. 在该位置传感器能够告诉已从外围模块成功拾取晶片31008的机器人控制器。 In this position sensor can tell from the peripheral module 31008 successfully picked up the wafer robot controller.

还可有利地采用水平传感器35004-35010。 Level sensor may also be advantageously employed 35004-35010. 在真空群集工具中,由于真空室的大直径,水平传感器35004-35010有时不能实行,其会使对准水平传感器35004-35010更复杂。 In the vacuum cluster tool, since the large diameter of the vacuum chamber, the level sensor may not be implemented 35004-35010, 35004-35010 level sensor which would align more complex. 在以上描述的系统中,可显著地减小室的尺寸,由此使得它包括一个以上的水平传感器35004-35010可实行。 In the system described above, it can significantly reduce the size of the chamber, thereby making it comprises more than one level sensor may be implemented 35004-35010.

图36示例了水平传感器35004-35010和垂直传感器35002的其它可能的位置,如室(36002和36008)和/或穿过放置在真空系统内部的镜36006的直线交叉点。 Figure 36 illustrates a level sensor 35004-35010 and other possible positions of the vertical sensor 35002, such as the chamber (36002 and 36008), and / or a straight line passing through the intersection 36006 mirror placed inside the vacuum system.

图37示例了当机器人臂完全缩进时传感器35002放置在晶片35002半径略靠外部的可能优点。 Figure 37 illustrates a fully retracted robot arm when the sensor is placed in the wafer 35002 35002 radius slightly to the outside of the possible advantages. 在缩进运动期间,传感器35002在点“a”37002检测晶片37001的前沿和在点“b”37004检测晶片37001的后沿。 During the retraction movement, the leading edge sensor 35002 in the points "a" 37002 37001 wafer and detected at point "b" 37004 37001 detects the trailing edge of the wafer. 这些结果表明成功地取回了晶片37001,但通过联系传感器35002信号给存在于机器人驱动器中的编码器、分解器或其它位置元件,传感器还可以计算相对于末端执行器晶片37001是否置于中心。 These results indicate that the retrieved successfully wafer 37001, but by contacting the sensor signal to the 35002 is present in the robot drives an encoder, a resolver, or other position element, the sensor may also be calculated relative to the end effector 37001 whether the wafer at the center. 因为晶片37001的圆形几何形状,线段“ab”3700237004的中点应当对应于末端执行器的中心。 Because of the circular geometry of the wafer 37001, segment "ab" 3700237004 midpoint of the center should correspond to the end effector. 如果晶片37001滑到末端执行器上,不一致的长度测量可展示滑动。 If the wafer on the end effector 37 001 slide, measure the length of the slide show may be inconsistent.

另外,在随后的旋转和运动期间,当晶片37001沿边慢慢移动穿过传感器时可检测第二线段“cd”37008 37010。 Further, during subsequent movement of rotation and, when the wafer is slowly moved through 37001 edgewise sensor may detect a second line segment "cd" 37008 37010. 再有,“c”37008和“d”37010之间的中点应当与末端执行器的中心符合,并且能够实现晶片置于中心的测量或确认。 Further, "c" 37008 and "d" should conform to the midpoint between the 37010 and the center of the end effector, and measurement can be realized at the center of the wafer or confirm.

以上方法能够使机器人检测晶片37001以及确认晶片37001是否偏离在末端执行器上所希望的位置。 The above method enables the detection of the robot wafer 37001 and 37001 to confirm whether the wafer on the end effector departing from the desired position.

水平和垂直传感器35002-35010的组合利用非接触法能够使系统很快:在不需要机械接触的前提下,可光学检测机器人臂和末端执行器。 Horizontal and vertical sensor using a combination of a non-contact method of the system can be quickly 35002-35010: premise without mechanical contact, optical detection may be robot arm and the end effector. 此外,在实时晶片37001处理期间可以使用光束来验证在每个晶片37001处理移动期间晶片37001处于正确的位置。 In addition, real-time during wafer processing 37001 may be verified using a beam in each wafer movement during wafer processing 37001 37001 in the correct position.

图38示例了具有两个旋转轴38020和38018和垂直(Z)轴38004的常规真空驱动器。 Figure 38 illustrates a rotating shaft having two 38020 and 38018 and vertical (Z) axis of a conventional vacuum actuator to 38,004. 波纹管38016能够进行垂直的Z轴38002运动。 38016 bellows capable of movement perpendicular to the Z-axis 38002. 固定到波纹管18016底部的薄金属圆柱体38024可提供电动机38010和38014的转子和定子之间的真空阻挡。 The bellows is fixed to the bottom of a thin metal cylinder 18016 38024 provides a vacuum barrier between the rotor and the stator of the motor of the 38010 and 38014. 该结构需要内真空放置的许多组件:电线和穿通、编码器、信号LED和捡拾器38008、轴承38012和磁体38006。 This structure requires many components within the vacuum placement: wire and through the encoder, and the LED signal pickup 38 008, 38 012 and a magnet bearing 38006. 磁体38006、轴承38012、导线和连接器、以及编码器易受存在于真空环境中的残留处理气体的影响。 Magnet 38006, 38012 bearings, wires and connectors, and an encoder in a vacuum environment susceptible to the presence of residual process gas. 此外,当撤出时由于气体必须跟随回旋状路径38022,所以难以移除俘获在圆柱体38024底部中的气体。 Further, when the gas withdrawn must follow a convoluted path 38022, it is difficult to remove trapped in the bottom of the cylinder 38024 of the gas.

图39示例了可使用在此描述的系统的真空机器人驱动器。 Figure 39 illustrates a vacuum robot can be used in the drive system described herein. 可由两个电动机卡盘(cartridge)39004和39006提供旋转驱动器力。 By two motors chucks (cartridge) 39004 and 39006 provide a rotary drive force. 每个卡盘都可具有完整的编码器39008、轴承39018和磁体39020。 Each cartridge can have a complete encoder 39008, and a magnet 39020 39018 bearings. 这些组件的一些或全部都可设置在真空外壳的外部。 Some or all of these components can be arranged outside the vacuum housing. 例如,利用唇形密封或铁磁流体密封,同心双轴旋转密封单元39016可提供用于旋转运动的真空隔离。 For example, the use of ferrofluid seals or lip seals, the sealing unit 39016 concentric biaxial rotation may provide a vacuum insulation for rotational movement. 该方式可减小在真空系统内部的组件的数量。 This embodiment may reduce the number of components inside the vacuum system. 在不破坏真空的前提下还能够服务电动机39004、39006和编码器39008,由此增加了驱动器单元的可服务性。 Without breaking the vacuum can also service the motor and encoder 39008 39004,39006, thereby increasing the serviceability of the drive unit.

图40示出了用于使材料进入真空环境中的叠置真空载荷锁14008、40004。 FIG 40 shows for the material into the vacuum load lock 14008,40004 stacked in a vacuum environment. 将晶片31008带入真空系统中的一个限制因素是可以将载荷锁抽到高真空的速度。 31008 a limiting factor to the wafer into the vacuum system is pumped to the load lock may be high speed vacuum. 如果载荷锁抽气太快,则在栽荷锁定室中的空气中会出现凝结,导致核子在晶片31008表面上的沉积,其会导致颗粒并且会导致缺陷或差的器件性能。 If the load lock pumping too fast, it will appear in the air lock chamber Netherlands condensed planting, resulting in nuclear 31008 deposited on the surface of the wafer, and particles which can cause defects or lead to poor device performance. 群集工具可采用并排的两个载荷锁,其每个都交替地撤出。 Two load locks cluster tool can be used side by side, each of which alternately withdrawn. 由此可以降低每个载荷锁的抽气速度,从而导致系统提高的性能。 Thereby reducing the pumping speed of each load lock, causing the system to improve performance. 利用垂直叠置的两个载荷锁4008 40004,设备底面积保持很小,但保持降低的抽取速度的优点。 Using two vertically stacked load lock 400,840,004, the bottom area of ​​the device kept small, but the advantage of maintaining a reduced extraction rate. 在实施例中,作为选择可以增加载荷锁40004。 In an embodiment, the load locks may be added as an option 40004. 在实施例中机器人臂4004和40006每个都可以接入两个载荷锁4008 40004中的每一个。 In an embodiment of the robot arm 4004 and 40006 may each access to each of the two load locks 400,840,004. 在实施例中,剩余的移交模块7008可以是单级移交模块。 In an embodiment, the remaining handover module 7008 may be a single-stage handover module.

图40B示出了另一载荷锁布局。 FIG 40B shows another layout of the load lock. 在该图中,晶片31008可以进入且可以在系统任一边上的两个水平级退出,但在系统中其余的共用级也是同样的。 In the figure, a wafer into and 31008 can be any one of the two horizontal level in the system exit side, but in the rest of the system is the same common level.

图41详述了在整个过程中如何通过叠置两个处理模块41006、41008也可以实施叠置载荷锁4008 40004的上述原理。 Figure 41 details how the whole process by stacking the two processing modules may also be implemented 41006,41008 above principles of the stacked load lock 400,840,004. 尽管这种模块不符合SEMI标准,但这种结构可在设备底面积和生产量方面提供显著的优点。 While this module does not meet the SEMI standard, but this arrangement can provide significant advantages in the bottom area of ​​the equipment and production aspects.

图42示出了具有两个处理级4008、40004、4010、42004的系统:可利用顶链环40006或底链环4004在模块之间独立地运输晶片。 FIG 42 shows a system having two processing stages 4008,40004,4010,42004: availability top strand or bottom strand cyclic ring 40006 4004 transported independently of the wafer between the modules. 任选地,每个处理级都可具有两个栽荷锁以提供以上提到的减小的抽取速度的优点。 Optionally, each may have a two-stage processing plant charge lock to provide advantages of reduced extraction rate referred to above. 由此通过在此提供的描述还计划了具有四个输入载荷锁、两个处理级、和任选的四个输出载荷锁的系统,如具有另外的载荷锁和处理级的系统。 Thus the description provided herein also planned load lock having four inputs, two processing stages, and optionally four output load lock systems, such as those having additional load lock and processing stage system.

图43示出了图42的系统的顶视图。 FIG 43 shows a top view of the system 42 of FIG.

图44描绘了一个专用设备的物体44014,如晶片。 Figure 44 depicts a dedicated device 44014 object, such as a wafer. 一个以上的传感器44010可集成到物体44014中,并且能够检测物体44014周围的环境因素。 One or more sensors may be integrated into the object 44010 44014, 44014 and environmental factors capable of detecting surrounding objects. 传感器44010可包括邻近传感器,如电容性的、光学或磁性的邻近传感器。 44010 proximity sensor may include a sensor, such as an optical or magnetic capacitive proximity sensor. 传感器44010可连接至放大器/发射器44012,其可使用电池电源以将射频或其它传感器信号如符合802.11b标准的信号传输给接收器44004。 Sensor 44010 may be connected to an amplifier / transmitter 44 012, which may use battery power to the radio frequency transmission or other sensor signals such as conforming to the 802.11b standard 44004 to the receiver.

在许多情况下,很难或不能够将设备放置在用于训练机器人的物体44014上,因为需要提供电源和传达给工具和传感器的导线会干扰正确的机器人运动或机器人移动穿过的环境。 In many cases, difficult or not possible to place the device on an object used for training robots 44014, because of the need to provide power leads and communicated to interfere with the correct tools and sensors of the robot or robot moves through an environment. 通过采用无线连接物体,可解决导线与物体的连接问题。 By using a wireless connection object, solve the problems connected to the wire with an object.

物体44014可以装备有具有不同类型和不同几何形状的有利图案的许多传感器。 Objects 44014 may be equipped with a number of sensors having different types and patterns of different advantageous geometries. 在本实例中,以半径等于目标物体44088的半径布置传感器1至6(44010)。 In the present example, with a radius equal to the radius of the target object 44 088 1-6 sensor arrangement (44,010). 在实施例中,这些传感器是邻近传感器。 In an embodiment, the sensor is a proximity sensor. 通过比较来自传感器44010例如传感器1和传感器6的瞬态信号,可以确定物体44014是否以正确的定向接近目标44088。 By comparing the signals from the sensors 44 010, for example, transient sensors 1 and 6, the object may be determined whether the correct orientation 44014 close to the target 44088. 如果目标44008没有正确地接近,则两个传感器44010中的一个显示出早期触发。 If the target is not properly close 44008, 44010 of the one of the two sensors exhibit early trigger. 通过监测若干传感器44010,该系统可确定在影响移交之前物体44010是否正确地中心定于目标44008的上方。 By monitoring the number of sensors 44010, the system may determine the impact of the object before the handover 44010 is correctly set above the center of the target 44008. 例如根据信号分析或任何其它约束的效率,可以以许多图案设置传感器44010。 For example, the efficiency of signal analysis or any other constraint, the sensor may be provided in a number of 44,010 pattern. 也在真空环境下有利地操作射频信号。 Advantageously, the RF signal is also operating under vacuum.

图45示出了以示例将测量物体44014定向到目标44008的非接触性质的侧定向的图44的系统。 FIG 45 shows an example of the measuring object to 44014 directed to the non-contact nature of the system side of the target 44008 of the orientation of FIG. 44. 传感器44010可包括用于测量目标44008的性质如温度的其它传感器。 44010 may include a sensor for measuring other properties of the target 44008 as a temperature sensor.

图46描绘了具有一个或多个传感器的射频通信。 Figure 46 depicts a radio frequency communication with one or more sensors. 射频传感器信号44016可传送给真空内的天线46002。 RF sensor signal may be transmitted to the antenna 44 016 inside the vacuum 46002. 适当选择的波长可用全部金属真空外壳提高信号传播。 Suitably selected wavelengths can be used to improve all the metal vacuum envelope signal propagation. 使用与外部接收器和控制器无线通信的传感器可提供显著的优点。 Using wireless communication with an external receiver and the sensor controller may provide significant advantages. 例如,该技术可减小如发现目标中心的操作所需的时间,并且可采用来自传感器的信息以将视觉反馈提供给操作者,或利用机器人臂自动化某些操作。 For example, the techniques may reduce the time required for the operation, such as found in the center of the target, and the information from the sensors may be used to provide visual feedback to the operator, or by the robot arm automate some operations. 此外,使用一个或多个传感器可在另外需要释放真空以打开的室内进行测量和物理地检查该室。 Further, using one or more sensors may measure and physically inspect the chamber to be released in the vacuum chamber to further open. 这可避免在条件处理室的内部如减压和烘焙(逐出潮气或水蒸汽)时耗财或耗时的步骤。 This step Choi consumption when the internal condition such as the processing chamber pressure and baking (expulsion of moisture or water vapor) may be avoided or time-consuming.

图47示例了若干传感器44010的输出随着机器人移动的函数。 Figure 47 illustrates the output of several sensors 44 010 as a function of the movement of the robot. 当机器人在目标44008的上方移动时,如果传感器是邻近传感器,则该运动会导致传感器提供关于例如到目标44008的距离信息。 When the robot moves over the target 44008, if the sensor is a proximity sensor, the motion causes the sensor to provide a distance information about the target, for example, 44,008. 可以独立地或共同地分析信号以确定目标44008相对于传感器的位置。 It may be independently or collectively analyze the signals to determine the target relative to the position sensor 44008. 在没有物理地接触目标44008的前提下,可通过在两个不同方向上移动传感器和监测传感器信号在不同的方向上分解位置或形状。 Premise without physically contacting the target 44008, by moving the sensor and the sensor monitoring the position or shape of the signal into different directions in two different directions.

图48描绘了用于从真空系统插入和移除晶片48008的技术。 Figure 48 depicts a technique for insertion and removal from the vacuum system of wafer 48008. 可独立地或组合地采用一个或多个加热元件,如一组加热元件48002、48004和48006,以将室4008和基板材料48008加热到50℃至400℃以上的高温。 It may be employed independently or in combination with one or more heating elements, such as a group of heating elements 48002,48004 and 48006, to the chamber 4008 and the substrate material is heated to above 50 ℃ 48 008 to 400 deg.] C high temperature. 起动温度的这种增加可减轻另外随着室中的压力降低而出现的凝结,并且允许向下序列的更快抽气来建立真空。 This starting temperature is increased further reduce condensation as the pressure chamber is reduced and occurring, and allows for a faster pumping down sequence to create a vacuum. 当加热的晶片48008由机器人臂4002移动到载荷锁4008时,它们可比架子48004、48006暖和很多,以便架子48004、48006可通过接触冷却晶片。 When the wafer is heated by the moving robot arm 48008 load lock 4008 to 4002, they are much warmer than the shelf 48004,48006, 48004,48006 rack so that the wafer may be cooled by contact. 加热源可调整提供给架子48004、48006的热量,以保持架子和/或晶片所希望的温度。 Heating source to heat the adjustable shelves 48004,48006 provided to maintain the shelf and / or the desired wafer temperature. 用于架子48004、48006的适当材料选择会导致系统很快到达加热源改变,导致对于不同的条件设置不同的温度,例如在室4008的向下抽气期间设置较高的温度和在室4008的排气期间设置较低的温度。 Suitable materials for the rack 48004,48006 selection will cause the system to quickly change Daga heat, resulting in different conditions for different temperature settings, for example higher temperatures and is provided in the chamber during the downward suction chamber 4008 of the 4008 setting a lower temperature during the exhaust.

预加热晶片48008可减小凝结和颗粒,同时减少了处理时间。 48008 preheating the wafer can be reduced, and coagulation of particles, while reducing the processing time. 同时,当退出系统时晶片48008可以很热,以便它们表现出安全的冒险或熔融处理并且支撑诸如塑料的材料。 Meanwhile, when the wafer 48008 may exit the system very hot, so that they exhibit a safety risk or melting process and the support material such as plastic. 约80至100℃度的内部温度和约50℃度以下的外部温度例如可满足这些一般的关系。 An internal temperature of about 80 to about 100 degrees deg.] C external temperature 50 ℃ degrees or less, for example, to meet these general relationships.

图49示例了机器人末端执行器49002。 FIG 49 illustrates a robot end effector 49002. 可逐渐减小机器人末端执行器49002,以便通过一个或多个轴使它具有非均一的厚度。 It may be gradually reduced robotic end effector 49002, so that it has a non-uniform thickness by one or more axes. 例如,当从一侧或顶部看时,末端执行器49002具有锥形。 For example, when viewed from the side or the top, having a tapered end effector 49002. 锥形可减轻沿着执行器49002的谐振。 Tapered along the actuator can reduce the resonant 49002. 同时,相对窄的截面轮廓(当从一侧看时)可使晶片之间的机动更容易。 At the same time, relatively narrow cross-sectional profile (when viewed from one side) between the wafer can easier to maneuver. 可通过研磨或加工、或通过用锥铸造执行器49002的处理来获得侧视图锥形。 By grinding or machining, casting or treatment cone 49002 actuator be obtained by the tapered side. 材料如碳硅化铝(AlSiC9)可有利地铸造成这种形状,以避免随后的加工或其它的完成步骤。 Carbon materials such as aluminum silicide (AlSiC9) may advantageously be cast such a shape in order to avoid subsequent machining or other steps to complete. 铸造处理提供在铸造工艺期间晶片支撑材料49004可以铸造成铸模的另外优点,由此减少了需要物理装配的组件的数量。 Further advantages of the casting process provides a wafer support during the casting process the material may be cast into a mold 49004, thereby reducing the number of components required physical assembly.

如图50所示,可将相似的技术应用到机器人臂部分50002和50004。 As shown, the application may be similar to the robot arm portion 50002 and 5000450 techniques. 可获得相同的抑制效应来衰减如上所述的臂部分5000250004中的谐振。 To obtain the same effect of attenuating the resonance suppressing arm portion as described above in 5,000,250,004. 可利用各种公知的工艺来获得锥形形状,并且能够实现在得到的机器人臂部分上方更快的移动和更精确的控制。 It may employ various well-known process to obtain a tapered shape, and can be implemented in a faster robot arm portion obtained above and more precise control of movement.

图51示出了采用五个电动机51014的双独立SCARA臂。 FIG 51 shows a motor using five dual independent SCARA arms of 51,014. 可以由电动机51014独立地激励每个下臂51002和51008。 It can be activated independently of each lower arm 51002 and 51008 51014 by the electric motor. 在上臂51004和51010的远端连接所述臂。 51004 and 51010 at the distal end of the upper arm is connected to the arm. 除了有点限制的伸展,该结构给出了相对小的缩进半径。 In addition to limiting the extension bit, which gives the structure a relatively small radius of indentation.

图52示出了采用4个电动机52010的双独立SCARA臂。 52 shows a motor with four independent dual 52010 SCARA arm. 链环52002和52004对于末端执行器52006和52008可以是共用的。 52004 to 52002 and a link end 52006 and 52008 may be shared. 以在下臂52002的伸展运动期间,所希望的末端执行器(比如说,52008)可伸展到处理模块中,而不活动的末端执行器(比如说,52006)可指向远离处理模块的这种方式,电动机52010可控制末端执行器52006和52008。 In stretching during the lower arm 52002, the desired end effector (for example, 52008) can be extended to the processing module, without the end effector activities (for example, 52006) in this manner can be directed away from the processing module , the motor may control the end effector 52010 52006 and 52008.

图53示出了蛙腿式的机器人臂。 FIG 53 shows a frog-leg robot arm. 可以连同在此描述的各种实施例使用该臂,如能够实现工件如半导体晶片在一系列这种臂中臂与臂的转移,如在半导体处理模块之间移动工件。 The embodiments may be used along with various arms described herein, can be realized as a semiconductor wafer as a workpiece transfer arm in a series of such arm and arm movement as between the semiconductor workpiece processing module.

图54示出了可以在平面状机器人系统中采用的双蛙腿臂,如在该公开中描述的线性的、臂与臂系统中的一个。 FIG 54 illustrates a dual arm frog legs may be employed in the planar robotic system, such as the disclosure described in the linear, arm and one arm system.

图55A示例了如在该公开中描述的、装配到车55004的4链环SCARA臂。 FIG 55A illustrates as described in this disclosure, the link 4 is fitted to the vehicle SCARA arms of 55,004. 这种车可通过导轨或磁性悬浮轨道55008以线性方式移动,且由系统内部或外部的电动机55002驱动。 Such vehicles may or magnetic levitation guide rail 55008 in a linear manner is moved and driven by an internal or external motor system 55002 through. 4链环SCARA臂具有将它折叠到比3链环SCARA臂小的缩进半径中的优点,同时获得在外围模块如处理模块中的大伸展,一直避免与必须穿通的臂的开口的碰撞。 4 link SCARA arm having a collision it is folded advantages over the ring SCARA arm small 3 chain retracted radius, while in peripheral module such as a processing module of a large extend, has avoided the need to punch through the arm opening. 可以使用反转车55006在车55004上方传送基板。 55006 can reverse the vehicle above the vehicle transmission substrate 55004.

图55B示出了图55A中描述的系统的顶视图。 FIG 55B shows a top view of the system described in FIG. 55A.

图56示例了在该公开中描述的利用双独立的和单个SCARA机器人臂的组合的线性系统。 Figure 56 illustrates the disclosed system is described by linear combination of double and single independent arm of the SCARA robot. 这种系统可以不与采用4链环SCARA臂机器人系统的系统一样密集。 Such a system can not be employed with the link 4 SCARA robotic arm system as a system dense.

图57示范了采用4链环SCARA机器人臂的垂直叠置的处理系统,其中该臂可以到达任一个和所有的外围处理模块5002。 FIG exemplary processing system 57 uses the vertical link SCARA robot arm 4 is stacked, wherein the arm can reach any and all of the peripheral processing module 5002. 通过旋转顶级57004中的处理模块约45度和将顶级组件装配到底级平面室57002,顶和底的每个处理模块都可保持暴露出用于服务接入以及用于装配组件,如泵、电极、气体线等。 The top level components are assembled in the end plane chamber 57002, the top and bottom of each processing module can be maintained for a service is exposed for access and mounting assembly by rotating the top 57 004 about 45 degrees and the processing module, such as a pump, an electrode the gas lines. 提出的布局可在很致密的空间中组合七个处理模块5002。 The proposed layout can be combined seven processing module 5002 in a very compact space.

图58A示例了图57的变形,其中该系统的底级58002由如在该公开中描述的多个机器人系统组成,并且顶级系统58004采用以与主系统轴成45度角定向的处理模块5002。 FIG 58A illustrates a modification of FIG. 57, wherein the bottom level of the system by a plurality of 58,002 robotic system as described in this disclosure the composition, and the top level system 58004 uses a 45 degree angle to the orientation axis of the main system processing module 5002. 提出的布局能够在很致密的空间中组合九个处理模块5002。 Nine proposed layout can be combined in the processing module 5002 in a very compact space.

图58B示例了利用后部出口载荷锁定工具从系统移除基板如半导体晶片的图58A的变形。 FIG 58B illustrates a rear exit load lock using the tool to remove deformation of the substrate such as a semiconductor wafer of FIG. 58A from the system.

图59A示出了容纳大基板处理模块59004的线性处理系统,同时还允许服务入口59002,以及同时还提供两个标准尺寸的处理模块5002的位置。 FIG 59A shows a large substrate receiving processing module 59004 is a linear processing system, while also allowing the service inlet 59002, and also provides a standard size two position processing module 5002.

图59B示范了容纳四个大处理模块59004和标准尺寸处理模块59002的系统布局,同时还允许服务接入处理模块59002的内部。 FIG. 59B demonstrates four receiving processing module 59004 and the large size of the standard 59002 system layout of a processing module, while also allowing the interior of the service access processing module 59002.

图60示出了具有基本在机器人驱动组件同一侧上的臂的双蛙腿机器人。 FIG 60 shows a substantially double frog legs on the same side of the robot arm of the robot drive assembly. 下臂60002支撑机械地耦接电动机组54010的两组上臂60004。 The lower support arm 60 002 mechanically coupled to the motor unit 54010 sets the upper arm 60004.

由此描述了几个示例性实施例,要意识到,对于本领域技术人员来说各种替换、改进和提高都将是容易出现的。 Thus described several exemplary embodiments, it is appreciated that the skilled person that various alterations, improvements and enhancements will be prone. 这种替换、改进和提高意指形成该公开的一部分,并且意指在该公开的精神和范围之内。 Such alternatives, modifications and improved means forming part of this disclosure, and means within the spirit and scope of the disclosure. 虽然在此提出的一些实例包含功能或结构元件的特定组合,但应当理解的是,根据本发明可以其它方式组合那些功能和元件,以完成相同或不同的目的。 While some examples presented herein contain specific combinations of functions or structural elements, it should be understood that those functions and elements may be combined in accordance with another embodiment of the present invention to accomplish the same or different purposes. 尤其是,有关一个实施例论述的行为、元件和特征不意指排除在其它实施例中相同的或其它的角色。 In particular, about one case discussed embodiment acts, elements and features is not intended to exclude other embodiments in the same or other roles. 因此,在前的描述和附图仅借助实例,并且不意指限制。 Accordingly, the preceding description and drawings are by way of example only, and are not intended to be limiting.

Claims (162)

  1. 1.一种半导体处理方法,包括:沿着基于真空的处理系统的轴定位多个机器人臂和多个处理模块;以及通过使工件从该多个机器人臂中的第一个传给该多个机器人臂中的第二个,来在该多个处理模块之间移动工件。 1. A semiconductor processing method, comprising: positioning a plurality of the plurality of processing modules and a robot arm along the axis of the vacuum-based processing system; and passed through the workpiece from the first one of the plurality of plurality of robot arms the second robot arm to move the workpiece between the plurality of processing modules.
  2. 2.如权利要求1的方法,其中处理系统是线性处理系统。 2. The method as claimed in claim 1, wherein the processing system is a linear processing system.
  3. 3.如权利要求2的方法,其中工件在线性处理系统的相对端进入和退出。 3. The method as claimed in claim 2, wherein the opposite ends of the workpiece-line processing system entry and exit.
  4. 4.如权利要求2的方法,其中线性处理系统具有基于空气的回送系统。 4. A method as claimed in claim 2, wherein the processing system having a linear echo based on the air system.
  5. 5.如权利要求2的方法,其中工件在线性处理系统的中点处退出。 5. A method as claimed in claim 2, wherein the midpoint of the line of the workpiece at the exit of the processing system.
  6. 6.如权利要求1的方法,其中在相应机器人臂之间存在至少两个移交点。 6. The method as claimed in claim 1, wherein there are at least two transfer points between the respective robot arm.
  7. 7.如权利要求1的方法,其中机器人臂包括至少一个四链环SCARA臂。 7. The method of claim 1, wherein the robot arm comprises at least a four-link SCARA arm.
  8. 8.如权利要求1的方法,其中机器人臂包括至少一对垂直相对的SCARA臂。 8. The method as claimed in claim 1, wherein the robot arm comprises at least a pair of vertically opposed SCARA arm.
  9. 9.如权利要求1的方法,其中工件在工艺模块之间的过道中行进。 9. The method as claimed in claim 1, wherein the workpiece travels down the aisle between the process modules.
  10. 10.如权利要求9的方法,其中该过道与工艺模块分离开。 10. The method of claim 9, wherein the passageway is separated from the process module.
  11. 11.如权利要求1的方法,其中机器人臂包括在处理系统内垂直移动工件的能力。 11. The method of claim 1, wherein the robot arm comprises the ability to move the workpiece in the vertical processing system.
  12. 12.如权利要求11的方法,其中处理系统包括由机器人臂服务的垂直叠置的工艺模块。 12. The method of claim 11, wherein the processing system comprises a robotic arm vertically stacked process modules and services.
  13. 13.如权利要求11的方法,其中处理系统包括由机器人臂服务的垂直叠置的载荷锁。 13. The method of claim 11, wherein the processing system comprises a vertically stacked load lock by the robotic arm and services.
  14. 14.如权利要求1的方法,其中轴是线性的。 14. The method of claim 1, wherein the shaft is linear.
  15. 15.如权利要求1的方法,其中轴是曲线的。 15. The method of claim 1, wherein the shaft is curved.
  16. 16.如权利要求1的方法,其中轴形成基本上U形状。 16. The method of claim 1, wherein the shaft is formed substantially U-shaped.
  17. 17.如权利要求1的方法,其中该多个机器人臂包括SCARA臂。 17. The method of claim 1, wherein the robot arm comprises a plurality of SCARA arm.
  18. 18.如权利要求1的方法,其中该多个机器人臂包括四链环SCARA臂。 18. The method of claim 1, wherein the robot arm comprises a plurality of four-chain loop SCARA arm.
  19. 19.如权利要求1的方法,其中该多个机器人臂包括三链环SCARA臂。 19. The method of claim 1, wherein the plurality of robotic arm SCARA arm comprises three links.
  20. 20.如权利要求1的方法,其中机器人臂包括蛙腿机器人臂。 20. The method as claimed in claim 1, wherein the robot arm comprises a robot arm frog legs.
  21. 21.如权利要求1的方法,其中机器人臂包括双SCARA臂。 21. The method as claimed in claim 1, wherein the robot arm comprises a double SCARA arm.
  22. 22.如权利要求1的方法,其中机器人臂包括双蛙臂。 22. The method as claimed in claim 1, wherein the robot arm comprises a double frog arm.
  23. 23.如权利要求1的方法,其中机器人臂包括四链环SCARA臂。 23. The method as claimed in claim 1, wherein the robot arm comprises four links SCARA arm.
  24. 24.如权利要求1的方法,其中机器人臂包括具有多个链环、驱动工具和链环之间的耦合器的双对称臂。 24. The method of claim 1, wherein the robot arm comprises a plurality of links, a symmetrical double arm drive coupling between the tool and the link.
  25. 25.如权利要求1的方法,其中该多个机器人臂以链接的多对机器人臂提供,并且每个链接的对都包括两个垂直设置的机器人臂。 25. The method of claim 1, wherein the plurality of pairs of the robotic arm to provide a robot arm link, and each link of the robot arm comprises two vertically disposed.
  26. 26.一种半导体处理系统,包括:沿着基于真空的处理系统中的轴设置的多个处理模块;以及多个机器人臂,用于通过使工件从该多个机器人臂中的第一个传给该多个机器人臂中的至少第二个,来在该多个处理模块之间传送工件。 26. A semiconductor processing system, comprising: a plurality of processing modules along a vacuum-based processing system arranged in the shaft; and a plurality of robotic arms, for a first pass through the workpiece from the plurality of robotic arms to at least a second of the plurality of robotic arms to transfer the workpiece between the plurality of processing modules.
  27. 27.如权利要求26的系统,其中处理系统是线性处理系统。 27. The system as claimed in claim 26, wherein the processing system is a linear processing system.
  28. 28.如权利要求27的系统,其中工件在线性处理系统的相对端进入和退出。 28. The system as claimed in claim 27, wherein the opposite ends of the workpiece-line processing system entry and exit.
  29. 29.如权利要求27的系统,其中线性处理系统具有基于空气的回送系统。 29. The system of claim 27, wherein the processing system having a linear echo based air system.
  30. 30.如权利要求27的系统,其中工件在线性处理系统的中点处退出。 30. The system as claimed in claim 27, wherein the midpoint of the line of the workpiece at the exit of the processing system.
  31. 31.如权利要求26的系统,其中在相应机器人臂之间存在至少两个移交点。 31. The system as claimed in claim 26, wherein there are at least two transfer points between the respective robot arm.
  32. 32.如权利要求26的系统,其中机器人臂包括至少一个四链环SCARA臂。 32. The system as claimed in claim 26, wherein the robot arm comprises at least a four-link SCARA arm.
  33. 33.如权利要求26的系统,其中机器人臂包括至少一对垂直相对的SCARA臂。 33. The system as claimed in claim 26, wherein the robot arm comprises at least a pair of vertically opposed SCARA arm.
  34. 34.如权利要求26的系统,其中工件在工艺模块之间的过道中行进。 34. The system as claimed in claim 26, wherein the workpiece travels down the aisle between the process modules.
  35. 35.如权利要求34的系统,其中该过道与工艺模块分离开。 35. The system as claimed in claim 34, wherein the passageway is separated from the process module.
  36. 36.如权利要求26的系统,其中机器人臂包括在处理系统内垂直移动工件的能力。 36. The system as claimed in claim 26, wherein the robot arm comprises the ability to move the workpiece in the vertical processing system.
  37. 37.如权利要求36的系统,其中处理系统包括由机器人臂服务的垂直叠置的工艺模块。 37. The system of claim 36, wherein the processing system comprises a robotic arm vertically stacked process modules and services.
  38. 38.如权利要求36的系统,其中处理系统包括由机器人臂服务的垂直叠置的载荷锁。 38. The system as claimed in claim 36, wherein the processing system comprises a vertically stacked load lock by the robotic arm and services.
  39. 39.一种半导体处理方法,包括:提供第一机器人臂,用于处理工件;以及设置第二机器人臂,用于在相对于第一机器人臂基本垂直的位置处理工件。 39. A semiconductor processing method, comprising: providing a first robot arm for processing the workpiece; and a second robot arm, a robot arm relative to the first substantially vertical position of the workpiece processing.
  40. 40.如权利要求39的方法,进一步包括将第一机器人臂机械地耦接至第二机器人臂。 40. The method of claim 39, further comprising a first robotic arm mechanically coupled to the second robot arm.
  41. 41.如权利要求39的方法,进一步包括使第一机器人臂机械地拆离第二机器人臂。 41. The method of claim 39, further comprising a first robot arm is mechanically removed from the second robot arm.
  42. 42.如权利要求39的方法,其中第一机器人臂和第二机器人臂中至少一个是SCARA臂。 42. The method as claimed in claim 39, wherein the first robotic arm and second robotic arm is at least a SCARA arm.
  43. 43.如权利要求39的方法,其中第一机器人臂和第二机器人臂中至少一个是四链环SCARA臂。 43. The method as claimed in claim 39, wherein the first robot arm and a second robot arm is at least four link SCARA arm.
  44. 44.如权利要求39的方法,其中第一机器人臂和第二机器人臂中至少一个是三链环SCARA臂。 44. The method as claimed in claim 39, wherein the first robot arm and a second robot arm at least three link SCARA arm.
  45. 45.如权利要求39的方法,其中机器人臂包括蛙腿机器人臂。 45. The method as claimed in claim 39, wherein the robot arm comprises a robot arm frog legs.
  46. 46.如权利要求39的方法,其中机器人臂包括双SCARA臂。 46. ​​The method as claimed in claim 39, wherein the robot arm comprises a double SCARA arm.
  47. 47.如权利要求39的方法,其中机器人臂包括双蛙臂。 47. The method as claimed in claim 39, wherein the robot arm comprises a double frog arm.
  48. 48.如权利要求39的方法,其中机器人臂包括四链环SCARA臂。 48. The method as claimed in claim 39, wherein the robot arm comprises four links SCARA arm.
  49. 49.如权利要求39的方法,其中机器人臂包括具有多个链环、驱动工具和链环之间的耦合器的双对称臂。 49. The method of claim 39, wherein the robot arm comprises a plurality of links, a symmetrical double arm drive coupling between the tool and the link.
  50. 50.一种半导体处理系统,包括:第一机器人臂,用于处理工件,该机器人臂邻近工艺模块设置;以及第二机器人臂,用于处理工件,该第二机器人臂设置在相对于第一机器人臂基本垂直的位置的处理模块内。 50. A semiconductor processing system, comprising: a first robot arm for processing a workpiece, the robot arm is disposed adjacent to the process module; and a second robot arm, for processing a workpiece, which second robot arm is disposed relative to the first processing module within the robot arm in a substantially vertical position.
  51. 51.如权利要求50的系统,其中第一机器人臂机械地耦接至第二机器人臂。 51. The system of claim 50, wherein a first robotic arm mechanically coupled to the second robot arm.
  52. 52.如权利要求50的系统,其中第一机器人臂机械地拆离第二机器人臂。 52. The system of claim 50, wherein the first robot arm is mechanically removed from the second robot arm.
  53. 53.如权利要求50的系统,其中第一机器人臂和第二机器人臂中至少一个是SCARA臂。 53. The system of claim 50, wherein the first robotic arm and second robotic arm is at least a SCARA arm.
  54. 54.如权利要求50的系统,其中第一机器人臂和第二机器人臂中至少一个是四链环SCARA臂。 54. The system of claim 50, wherein the first robot arm and a second robot arm is at least four link SCARA arm.
  55. 55.如权利要求50的系统,其中第一机器人臂和第二机器人臂中至少一个是三链环SCARA臂。 55. The system of claim 50, wherein the first robot arm and a second robot arm at least three link SCARA arm.
  56. 56.如权利要求50的系统,其中至少一个机器人臂是由末端执行器提供线性运动的四链环SCARA臂。 56. The system of claim 50, wherein the at least one robot arm to provide four links SCARA arm by linear motion of the end effector.
  57. 57.一种系统,包括:机器人驱动器;末端执行器,用于操纵零件;以及机器人臂,其将机器人驱动器机构连接至末端执行器,该机器人臂包括四个或四个以上的链环和用于对准末端执行器的工具。 57. A system, comprising: a robot drive; end effector for actuating part; and a robot arm, which connects the drive mechanism of the robot to the end effector, the robot arm comprises four or more links and with to align the end of the tool.
  58. 58.如权利要求57的系统,其中对准工具包括机械地彼此耦接四个或四个以上链环的一个或多个的连接器,以便末端执行器在机器人驱动器的控制下在基本线性的方向上移动。 58. The system of claim 57, wherein the alignment tool comprises a connector mechanically coupled to one or more of four or more links to one another, so that the end effector of the robot under control of the driver in a substantially linear the direction of movement.
  59. 59.如权利要求57的系统,其中对准工具包括电动机。 59. A system as claimed in claim 57, wherein the alignment tool comprises an electric motor.
  60. 60.如权利要求59的系统,其中对准工具包括用于伸展和缩回末端执行器的电动机和用于旋转末端执行器的电动机。 59 60. The system as claimed in claim, wherein the alignment means includes means for extending and retracting the end effector of a motor and a motor for rotating the end effector.
  61. 61.如权利要求57的系统,其中每个链环都具有被选择来最优化机器人臂的伸展范围与可容度比的长度。 61. The system as claimed in claim 57, wherein each link has a length selected to optimize the robot arm and the containment stretch ratio.
  62. 62.如权利要求57的系统,其中当机器人臂被伸展和缩回时设计所述链环来避免槽阀的边缘。 62. The system as claimed in claim 57, wherein said links when designing the robot arm is extended and retracted to avoid edge groove of the valve.
  63. 63.如权利要求57的系统,其中机器人臂的链环具有不同于长度比为1∶2∶1的比率。 63. The system as claimed in claim 57, wherein the robot arm link has a different length than the ratio of 1:2:1.
  64. 64.如权利要求57的系统,进一步包括控制机器人驱动器操作的控制器。 64. The system as claimed in claim 57, further comprising a controller controlling the robot drive operations.
  65. 65.如权利要求64的系统,其中控制器是遥控控制器。 65. The system as claimed in claim 64, wherein the controller is a remote controller.
  66. 66.如权利要求64的系统,其中控制器集成有可视化的软件程序。 66. The system as claimed in claim 64, wherein the controller integrated visualization software program.
  67. 67.如权利要求64的系统,其中控制器控制一个以上的机器人臂。 67. The system as claimed in claim 64, wherein the controller controls at least one robot arm.
  68. 68.如权利要求57的系统,其中邻近末端执行器的机器人臂的链环包括偏移腕以能够使该臂折叠。 68. The system of claim 57, wherein the chain link adjacent the end effector of the robot arm includes an offset arm to enable the arm folded.
  69. 69.如权利要求57的系统,其中机器人臂包括至少一个链环,该链环具有在其中可以折叠至少一个其它链环的切口。 69. The system as claimed in claim 57, wherein the robot arm comprises at least one link, the link may be folded has at least one cut wherein the other link.
  70. 70.如权利要求57的系统,其中机器人臂的至少两个连续链环叠置并有垂直间隙,以便机器人臂的至少一个其它链环可以折叠在该至少两个连续链环之间的垂直间隔中。 70. The system of claim 57, wherein the at least two consecutive links of the robot arm and stacked vertical gap, that at least one other link can fold the vertical spacing between the at least two consecutive links of the robot arm in.
  71. 71.如权利要求57的系统,进一步包括在链环之间的至少一个旁路齿条。 71. The system of claim 57, further comprising at least one bypass rack between the chain link.
  72. 72.一种方法,包括:提供机器人驱动器、用于操纵零件的末端执行器、和将机器人驱动器机构连接至末端执行器的机器人臂,该机器人臂包括四个或四个以上的链环;以及彼此互连四个或四个以上的链环,以便末端执行器在机器人驱动器的控制下在基本线性的方向上移动,该机器人臂包括四个或四个以上的链环和用于对准末端执行器的工具。 72. A method, comprising: providing a robot driver for actuating the end effector part, and the drive mechanism connected to the robot arm of the robot end effector, the robot arm comprises four or more links; and interconnected with each other four or more than four links, so that the end effector is moved in a substantially linear direction under the drive control of the robot, which robot arm comprising four or more rings and for aligning the end of chain tool actuator.
  73. 73.如权利要求72的方法,其中对准工具包括机械地彼此耦接四个以上链环的一个或多个连接器,以便末端执行器在机器人驱动器的控制下在基本线性的方向上移动。 73. The method of claim 72, wherein the alignment tool comprises mechanically coupled to one or more of four or more connectors link to each other, so that the end effector is moved in a substantially linear direction under the control of the robot drive.
  74. 74.如权利要求72的方法,其中对准工具包括电动机。 74. The method of claim 72, wherein the alignment tool comprises an electric motor.
  75. 75.如权利要求72的方法,其中对准工具包括用于伸展和缩回末端执行器的电动机和用于旋转末端执行器的电动机。 75. The method of claim 72, wherein the alignment means includes means for extending and retracting the end effector of a motor and a motor for rotating the end effector.
  76. 76.如权利要求72的方法,其中每个链环都具有被选择来最优化机器人臂的伸展范围与可容度比的长度。 76. The method of claim 72, wherein each link has a length selected to optimize the robot arm and the containment stretch ratio.
  77. 77.如权利要求72的方法,其中当机器人臂被伸展和缩回时设计所述链环来避免槽阀的边缘。 77. The method of claim 72, wherein when the robot arm is extended and retracted the link designed to avoid edge groove of the valve.
  78. 78.如权利要求72的方法,其中机器人臂的链环具有不同于长度比为1∶2∶1的比率。 78. The method of claim 72, wherein the robot arm link has a different length than the ratio of 1:2:1.
  79. 79.如权利要求72的方法,进一步包括用控制器控制机器人驱动器的操作。 79. The method of claim 72, further comprising a drive controller controls the robot operation.
  80. 80.如权利要求79的方法,其中控制器集成有可视化的软件程序。 80. The method as claimed in claim 79, wherein the controller integrated visualization software program.
  81. 81.如权利要求79的方法,其中控制器控制一个以上的机器人臂。 81. The method of claim 79, wherein the controller controls at least one robot arm.
  82. 82.如权利要求72的方法,其中邻近末端执行器的机器人臂的链环包括偏移腕以能够使该臂折叠。 82. The method as claimed in claim 72, wherein the chain link adjacent the end effector of the robot arm includes an offset arm to enable the arm folded.
  83. 83.如权利要求72的方法,其中机器人臂包括至少一个链环,该链环具有在其中可以折叠至少一个其它链环的切口。 83. The method as claimed in claim 72, wherein the robot arm comprises at least one link, the link may be folded has at least one cut wherein the other link.
  84. 84.如权利要求72的方法,其中机器人臂的至少两个连续链环叠置并有垂直间隙,以便机器人臂的至少一个其它链环可以折叠在该至少两个连续链环之间的垂直间隔中。 84. The method of claim 72, wherein the at least two consecutive links of the robot arm and stacked vertical gap, that at least one other link can fold the vertical spacing between the at least two consecutive links of the robot arm in.
  85. 85.如权利要求72的方法,进一步包括在链环之间提供至少一个旁路齿条。 85. The method as claimed in claim 72, further comprising providing at least one bypass link between the rack.
  86. 86.一种系统,包括:用于半导体制造工艺的多个工艺模块,其设置在基本上线性的轨迹周围;车,其可移动地耦接至线性轨迹并且设置得沿着线性轨迹移动;以及机器人臂,其设置在车上用于在该多个工艺模块之间操纵工件。 86. A system, comprising: a semiconductor manufacturing process for a plurality of process modules arranged around a substantially linear trajectory; car movably coupled to a linear track and moved along the linear trajectory set; and robot arm, which is provided in the vehicle for maneuvering a workpiece between the plurality of process modules.
  87. 87.如权利要求86的系统,其中机器人臂包括SCARA臂。 87. The system as claimed in claim 86, wherein the robot arm comprises a SCARA arm.
  88. 88.如权利要求87的系统,其中SCARA臂包括四链环SCARA臂。 88. The system as claimed in claim 87, wherein the arm comprises four links SCARA SCARA arm.
  89. 89.如权利要求87的系统,其中SCARA臂包括三链环SCARA臂。 89. The system as claimed in claim 87, wherein the arm comprises three links SCARA SCARA arm.
  90. 90.一种方法,包括:提供设置在基本上线性轨迹的周围、用于半导体制造工艺的多个处理模块;提供可移动地耦接至线性轨迹并且设置得沿着线性轨迹移动的车;以及在车上设置机器人臂,用于在该多个工艺模块之间操纵工件。 90. A method, comprising: providing a substantially disposed around the linear trajectory, a plurality of processing modules for a semiconductor manufacturing process; provided movably coupled to a linear track and moved along a set linear trajectory vehicle; and the robot arm is provided in the car, for manipulating a workpiece between the plurality of process modules.
  91. 91.如权利要求90的方法,其中机器人臂包括SCARA臂。 91. The method as claimed in claim 90, wherein the robot arm comprises a SCARA arm.
  92. 92.如权利要求91的方法,其中SCARA臂包括四链环SCARA臂。 92. The method of claim 91, wherein the arm comprises four links SCARA SCARA arm.
  93. 93.如权利要求91的方法,其中SCARA臂包括三链环SCARA臂。 93. The method of claim 91, wherein the arm comprises three links SCARA SCARA arm.
  94. 94.一种半导体处理系统,包括:真空处理系统,其设置在具有装载端和出口端的基本线性的结构中;以及非真空回送系统,其用于将零件从出口端回送到装载端。 94. A semiconductor processing system, comprising: a vacuum processing system, which is provided with a substantially linear loading end and an outlet end of the structure; and a non-return vacuum pumping system, for the part from the outlet end back to the loading end.
  95. 95.如权利要求94的系统,其中非真空回送系统设置在真空处理系统的上方。 95. The system of claim 94, wherein the non-return vacuum pumping system is provided above the vacuum processing system.
  96. 96.如权利要求94的系统,其中非真空回送系统设置在真空处理系统的下方。 96. The system of claim 94, wherein the non-return vacuum pumping system is provided below the vacuum processing system.
  97. 97.如权利要求94的系统,其中非真空回送系统设置在真空处理系统的旁边。 97. The system of claim 94, wherein the non-return vacuum pumping system is provided beside the vacuum processing system.
  98. 98.如权利要求94的系统,其中非真空回送系统设置在真空处理系统的内部。 98. The system of claim 94, wherein the non-return vacuum pumping system is provided inside the vacuum processing system.
  99. 99.如权利要求94的系统,其中回送系统连接至真空处理系统的中入口点。 99. The system of entry point of claim 94, wherein the loopback processing system connected to a vacuum system.
  100. 100.如权利要求94的系统,其中非真空回送系统在出口端包括载荷锁,用于将零件从真空处理系统移动到非真空回送系统。 100. The system of claim 94, wherein the non-vacuum system comprising a load lock loopback at the outlet end, for moving the parts from the vacuum processing system to a non-return vacuum pumping system.
  101. 101.如权利要求94的系统,其中非真空回送系统包括用于将零件从出口端移动到装载端的滑动机构和抓具。 101. The system of claim 94, wherein the non-loopback vacuum system comprises means for moving the parts from the outlet end of the loading end to the slide mechanism and the gripper.
  102. 102.如权利要求94的系统,其中真空处理系统包括多个处理模块。 102. The system of claim 94, wherein the vacuum processing system comprises a plurality of processing modules.
  103. 103.如权利要求102的系统,其中真空处理系统包括在处理模块之间移动零件的一个或多个机器人臂。 103. The system of claim 102, wherein the vacuum processing system comprises a moving part or a plurality of processing modules between the robot arm.
  104. 104.如权利要求103的系统,进一步包括通过将零件从该多个机器人臂中的第一个传送到该多个机器人臂中的第二个来移动零件的多个机器人臂。 104. The system of claim 103, further comprising transmitting from the first part by a plurality of the robot arm to the second robot arm in the plurality of moving parts to a plurality of the robot arm.
  105. 105.如权利要求104的系统,其中该多个机器人臂包括SCARA臂。 105. The system of claim 104, wherein the robot arm comprises a plurality of SCARA arm.
  106. 106.如权利要求104的系统,其中该多个机器人臂包括四链环SCARA臂。 106. The system of claim 104, wherein the robot arm comprises a plurality of four-chain loop SCARA arm.
  107. 107.如权利要求104的系统,其中该多个机器人臂包括三链环SCARA臂。 107. The system of claim 104, wherein the plurality of robotic arm SCARA arm comprises three links.
  108. 108.如权利要求104的系统,其中该多个机器人臂包括至少一对彼此垂直设置的链接的机器人臂。 108. The system of claim 104, wherein the robot arm comprises at least one plurality of links arranged perpendicular to one another robotic arm.
  109. 109.如权利要求104的系统,其中该多个处理模块在底面积方面改变二或二以上的因数。 109. The system of claim 104, wherein the plurality of processing modules change more than a factor of two or bottom two terms of area.
  110. 110.如权利要求94的系统,进一步包括半导体制造工具,该半导体制造工具包括多个线性半导体处理系统,该多个线性半导体处理系统并排设置,以便该多个线性半导体处理系统的装载端面向半导体制造工具的通道。 110. The system of claim 94, further comprising a semiconductor manufacturing tool, the semiconductor manufacturing tool comprises a plurality of linear semiconductor processing system, the plurality of linear semiconductor processing system arranged side by side, so that the semiconductor loading end of the plurality of linear semiconductor processing system for channel manufacturing tools.
  111. 111.一种半导体制造工具,该半导体制造工具包括多个线性半导体处理系统,该多个线性半导体处理系统并排设置,以便该多个线性半导体处理系统的装载端面向半导体制造工具的通道。 111. A semiconductor manufacturing tool, the semiconductor manufacturing tool comprises a plurality of linear semiconductor processing system, the plurality of linear semiconductor processing system arranged side by side, so that the loading end of the plurality of linear semiconductor processing system for semiconductor manufacturing tool channel.
  112. 112.一种半导体制造工具,该半导体制造工具包括多个线性半导体处理系统,该多个线性半导体处理系统设置得首尾相接,以便该系统形成线性处理系统环。 112. A semiconductor manufacturing tool, the semiconductor manufacturing tool comprises a plurality of linear semiconductor processing system, the plurality of linear semiconductor processing system set end to end to form a linear processing system, which ring system.
  113. 113.一种半导体制造工具,其包括用于接收半导体晶片的至少一个翻转抓具,该翻转抓具包括一对抓具模块,其中每个抓具模块都配置成接收一对平行边缘的半导体晶片中的一个,其中一旦在一个位置接收到半导体晶片每个抓具模块旋转,其中抓具模块的水平部分在水平面支撑半导体晶片,并且抓具模块的垂直部分防止半导体晶片在水平面移动。 113. A semiconductor manufacturing tool, which for receiving a semiconductor wafer comprising at least one reversing gripper, the gripper comprising a pair of reversing gripper modules, each gripper module configured to receive a pair of parallel edges of the semiconductor wafer a, wherein upon receiving a position of the semiconductor wafer in each rotary gripper module, wherein the horizontal portion of the gripper modules of the semiconductor wafer is supported in a horizontal plane, and vertical grip portion with the semiconductor wafer to prevent movement of the module in a horizontal plane.
  114. 114.一种处理半导体晶片的方法,包括:提供用于保持半导体晶片的末端执行器,其中末端执行器包括配置成在水平面上支撑半导体晶片同时防止半导体晶片在水平面中移动的接收槽,并且其中末端执行器包括当将半导体晶片放置在末端执行器上时配置使半导体晶片滑动到接收槽中的斜坡。 114. A method of processing a semiconductor wafer, comprising: providing an end effector for holding a semiconductor wafer, wherein the end effector includes is configured to support the semiconductor wafer in which the end of the horizontal surface of the semiconductor wafer while preventing movement of the receiving groove in a horizontal plane, and when the actuator comprises a semiconductor wafer is placed on the end effector is configured to slide the semiconductor wafer receiving slot of the ramp.
  115. 115.一种半导体处理系统,包括多个机器人臂,该多个机器人臂中的至少两个共用共同的驱动器工具。 115. A semiconductor processing system comprising a plurality of robot arms, the plurality of the robot arm at least two share a common driver tool.
  116. 116.如权利要求115的系统,其中该多个机器人臂中的至少一个是SCARA臂。 116. The system of claim 115, wherein the plurality of robotic arms is at least a SCARA arm.
  117. 117.如权利要求115的系统,其中该多个机器人臂中的至少一个是四链环SCARA臂。 117. The system of claim 115, wherein the plurality of the robot arm and at least a four-link SCARA arm.
  118. 118.如权利要求115的系统,其中该多个机器人臂中的至少两个独立地工作。 118. The system of claim 115, wherein the plurality of robotic arms operate independently at least two.
  119. 119.如权利要求115的系统,其中该多个机器人臂中的至少两个相关地工作。 119. The system of claim 115, wherein the plurality of at least two of the robot arm in relation to the work.
  120. 120.一种半导体处理系统,包括具有蛙腿臂结构的机器人臂,该蛙腿臂结构包括至少两对蛙腿臂。 120. A semiconductor processing system, comprising a robot arm having a frog leg arm structure, the frog arm leg structure comprises at least two pairs of arms frog legs.
  121. 121.一种材料处理方法,包括:提供用于处理材料的机器人臂,该机器人臂具有至少三个链环,连接该链环以便它们可以在基本平行运动的平面内彼此相对旋转;以及在至少两个相邻链环之间提供接头,其中该接头在相邻链环的运动的垂直平面之间建立了空间,以便第三链环可以折叠在相邻链环的运动平面之间的运动平面中。 121. A material processing method, comprising: providing a robotic arm to handle material, the robotic arm having at least three links, the connecting link so that they are rotatable relative to one another in a plane substantially parallel to the movement; and at least providing a joint between two adjacent links, wherein the joint between the vertical plane of movement of the adjacent links established space, so that the third fold link can move between the plane of movement of the plane of the adjacent links in.
  122. 122.如权利要求121的方法,其中该机器人臂设置在真空处理系统中。 122. The method of claim 121, wherein the robot arm is disposed in a vacuum processing system.
  123. 123.如权利要求121的方法,其中该机器人臂是多个机器人臂中的一个,并且其中机器人臂将材料从一个臂传递给另一个臂。 123. The method of claim 121, wherein the robot arm is a plurality of robotic arms, wherein the robot arm and the material from one arm to another arm.
  124. 124.一种材料处理系统,包括:用于处理材料的机器人臂,该机器人臂具有至少三个链环,连接该链环以便它们可以在基本平行的运动平面内彼此相对旋转;以及在至少两个相邻的链环之间的接头,其中该接头在相邻链环运动的垂直平面之间建立空间,以便第三链环可以折叠在相邻链环的运动平面之间的运动平面内。 124. A material handling system, comprising: a robot arm for handling material, the robotic arm having at least three links, the connecting link so that they are rotatable relative to each other within a plane substantially parallel to the movement; and at least two joints between adjacent links, wherein the vertical joint plane between adjacent links established movement space, so that the third link can be folded between a plane of motion in the plane of movement of the adjacent links.
  125. 125.如权利要求124的系统,其中机器人臂设置在真空处理系统中。 125. The system of claim 124, wherein the robot arm is disposed in a vacuum processing system.
  126. 126.如权利要求124的系统,其中机器人臂是多个机器人臂中的一个并且其中机器人臂将材料从一个臂传递给另一个臂。 126. The system of claim 124, wherein the plurality of the robot arm is a robot arm in the robot arm and wherein the material is passed from one arm to another arm.
  127. 127.一种处理材料的方法,包括:提供四链环SCARA机器人臂;以及在真空处理系统中设置四链环SCARA机器人臂,以便四链环SCARA机器人臂可以在真空处理系统中处理材料。 127. A method of processing material, comprising: providing four link SCARA robot arm; and a four link SCARA robotic arm in a vacuum processing system, the SCARA robot to four link arms can be processed in a vacuum processing system material.
  128. 128.如权利要求127的方法,其中四链环SCARA机器人臂是在半导体制造工艺的处理模块之间将材料从一个臂传递给另一个臂的多个SCARA臂中的一个。 128. The method of claim 127, wherein the four links between the SCARA robot arm is a semiconductor manufacturing process the material from the processing module to a plurality of arm SCARA arms of the other arm.
  129. 129.如权利要求127的方法,其中处理方法是线性的。 129. The method of claim 127, wherein the processing method is linear.
  130. 130.如权利要求127的方法,其中处理方法具有装载端和出口端,其中该出口端远离装载端。 130. The method of claim 127, wherein the processing method having a loading end and an outlet end, wherein the outlet end remote from the loading end.
  131. 131.如权利要求127的方法,其中处理方法是具有基于空气的的回送系统的基于真空的。 131. The method of claim 127, wherein the processing method is a vacuum-based system based on the loopback of air.
  132. 132.如权利要求127的方法,其中处理方法具有设置在中点的载荷锁定工具。 132. The method of claim 127, wherein the processing method having a load at the midpoint of the locking means.
  133. 133.如权利要求127的方法,其中设置四链环SCARA机器人臂以避免干扰基于真空的处理系统的槽阀。 133. The method of claim 127, wherein a four link SCARA robotic arm to avoid interference with the vacuum valve grooves on a processing system.
  134. 134.如权利要求127的方法,其中处理方法包括双垂直相对的四链环SCARA机器人臂。 134. The method of claim 127, wherein the process includes four link SCARA robot arm opposing dual vertical.
  135. 135.如权利要求127的方法,其中处理方法包括用于半导体制造工艺的多个处理模块。 135. The method of claim 127, wherein the processing method comprises a plurality of processing modules for a semiconductor manufacturing process.
  136. 136.如权利要求127的方法,其中至少两个处理模块设置在相对于材料处理方法的线性方向的不同垂直位置处。 136. The method of claim 127, wherein the at least two processing modules disposed at different vertical positions with respect to the linear direction of material processing method.
  137. 137.如权利要求127的方法,其中材料处理方法包括用于装载的伸展载荷锁定工具。 137. The method of claim 127, wherein the material processing method comprising a locking means extending load loading.
  138. 138.如权利要求127的方法,其中机器人臂包括在垂直于处理的线性方向的垂直方向上移动的能力,以便一个机器人臂可以服务位于不同平面中的处理模块。 138. The method of claim 127, wherein the robot arm comprises the ability to move linearly in the vertical direction perpendicular to the processing direction, so a robot arm may be located in different planes of the service processing module.
  139. 139.如权利要求138的方法,其中该方法包括多个机器人臂。 139. The method of claim 138, wherein the method comprises a plurality of robotic arms.
  140. 140.如权利要求127的方法,其中该处理是多级的。 140. The method of claim 127, wherein the process is a multi-stage.
  141. 141.如权利要求127的方法,其中该处理包括以相对于线性方向的不规则角度设置的工艺模块。 141. The method of claim 127, wherein the process comprises a process module with respect to the linear direction of the irregular angular setting.
  142. 142.如权利要求141的方法,其中该不规则角度在九十和一百八十度之间。 142. The method of claim 141, wherein between ninety and one hundred eighty degrees of the irregular angle.
  143. 143.如权利要求127的方法,其中至少一个工艺模块是特大型的工艺模块。 143. The method of claim 127, wherein the at least one process module to process module is large.
  144. 144.如权利要求143的方法,其中该特大型的处理模块包括用于通过工艺模块的顶部提供入口的旋转盖。 144. The method of claim 143, wherein the processing module comprises a large rotating process for providing an inlet through the top cover of the module.
  145. 145.一种用于处理材料的系统,包括:四链环SCARA机器人臂,设置在真空处理系统中,以便四链环SCARA机器人臂可以在真空处理系统中处理材料。 145. A system for processing material, comprising: four links SCARA robot arm, is provided in a vacuum processing system, the SCARA robot to four link arms can be processed in a vacuum processing system material.
  146. 146.如权利要求145的系统,其中四链环SCARA机器人臂是在半导体制造工艺的工艺模块之间将材料从一个臂传递给另一个臂的多个SCARA臂中的一个。 146. The system of claim 145, wherein the four links between the SCARA robot arm is a semiconductor manufacturing process module process material from a plurality of SCARA arm to arm in the other arm.
  147. 147.如权利要求145的系统,其中处理系统是线性处理系统。 147. The system of claim 145, wherein the processing system is a linear processing system.
  148. 148.如权利要求145的系统,其中处理系统具有装载端和出口端,其中该出口端远离装载端。 148. The system of claim 145, wherein the processing system having a loading end and an outlet end, wherein the outlet end remote from the loading end.
  149. 149.如权利要求145的系统,其中处理系统具有基于真空的处理系统和基于空气的回送系统。 149. The system of claim 145, wherein the processing system has a vacuum-based processing system and the air system based loopback.
  150. 150.如权利要求145的系统,其中处理系统具有设置在处理系统中点处的载荷锁定工具。 150. The system of claim 145, wherein the processing system having a load handling system is provided at the midpoint of the locking means.
  151. 151.如权利要求145的系统,其中配置四链环SCARA机器人臂以避免干扰基于真空的处理系统的槽阀。 151. The system of claim 145, wherein configuring the SCARA robot four link arms to avoid interference with the groove on the valve of a vacuum processing system.
  152. 152.如权利要求145的系统,其中处理系统包括双垂直相对的四链环SCARA机器人臂。 152. The system of claim 145, wherein the processing system comprises four links SCARA robot arm opposing dual vertical.
  153. 153.如权利要求145的系统,其中处理系统包括用于半导体制造工艺的多个处理模块。 153. The system of claim 145, wherein the processing system comprises a plurality of processing modules for a semiconductor manufacturing process.
  154. 154.如权利要求145的系统,其中至少两个处理模块设置在相对于材料处理系统的线性方向的不同垂直位置中。 154. The system of claim 145, wherein the at least two processing modules disposed at different vertical positions with respect to the linear direction of the material handling system.
  155. 155.如权利要求145的系统,其中材料处理系统包括用于装载处理系统的伸展载荷锁定能力。 155. The system of claim 145, wherein the material handling system includes a load handling system loads extending locking capability.
  156. 156.如权利要求145的系统,其中机器人臂包括在与处理系统的线性方向垂直的垂直方向上移动的能力,以便一个机器人臂可以服务于位于处理系统不同平面中的工艺模块。 156. The system of claim 145, wherein the robot arm comprises the ability to move in a vertical direction perpendicular to the linear direction of the process system to a robot arm located within the process module may serve different planes of the processing system.
  157. 157.如权利要求156的系统,其中该系统包括多个机器人臂。 157. The system of claim 156, wherein the system comprises a plurality of robot arms.
  158. 158.如权利要求145的系统,其中处理系统是多级处理系统。 158. The system of claim 145, wherein the processing system is a multistage treatment system.
  159. 159.如权利要求145的系统,其中该处理系统包括以相对于处理系统的线性方向的不规则角度设置的工艺模块。 159. The system of claim 145, wherein the processing system including a process module with respect to the processing of irregular linear direction angle setting system.
  160. 160.如权利要求159的系统,其中该不规则角度位于九十和一百八十度之间。 160. The system of claim 159, wherein the irregular angle between ninety and located one hundred eighty degrees.
  161. 161.如权利要求145的系统,其中至少一个工艺模块是特大型的工艺模块。 161. The system of claim 145, wherein the at least one process module to process module is large.
  162. 162.如权利要求161的系统,其中该特大型的工艺模块包括用于通过工艺模块的顶部提供入口的旋转盖。 162. The system of claim 161, wherein the process module comprises a large rotation of the cap for providing an inlet through the top of process modules.
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