KR101396762B1 - Receiving Device and Method for Manufacturing thereof - Google Patents

Abstract

The storage device according to an embodiment includes a mold frame including side walls for accommodating at least one of a liquid crystal panel and a backlight assembly; And a chassis coupled with sidewalls of the mold frame, wherein at least one of the sidewalls of at least one of the sidewalls of the chassis is inserted into at least one of the sidewalls of the sidewalls of the mold frame.

According to the embodiment, since a part of the chassis is inserted and fastened to the inside of the mold frame, the strength of the accommodating device can be improved.

Display device, mold frame, chassis

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a receiving device,

In the embodiment, a storage device and a manufacturing method thereof are disclosed.

BACKGROUND ART Liquid crystal displays (LCDs) display images using electrical and optical characteristics of liquid crystals. Since the liquid crystal display device is a light-receiving element that can not emit light, a backlight unit is required, and the performance of the liquid crystal display device depends largely on the performance of the backlight unit as well as the liquid crystal display device.

Such a backlight unit includes a backlight assembly including a reflection plate, a light guide plate, a prism sheet, a diffusion sheet and a protective sheet, a light source, and the like, and a mold frame and a chassis in which the backlight assembly is housed.

The mold frame is inserted and fixed by a backlight unit and an LCD panel. The chassis is fastened to the mold frame to reinforce the strength of the backlight unit, and is formed in a structure corresponding to the outer shape of the mold frame.

Therefore, the mold frame and the chassis are respectively manufactured and then fastened by mutual fitting.

Embodiments provide a receiving device capable of improving the strength of a receiving device by combining a mold frame and a chassis, and a method of manufacturing the same.

The storage device according to an embodiment includes a mold frame including side walls for accommodating at least one of a liquid crystal panel and a backlight assembly; And a chassis coupled with sidewalls of the mold frame, wherein at least one of the sidewalls of at least one of the sidewalls of the chassis is inserted into at least one of the sidewalls of the sidewalls of the mold frame.

According to another aspect of the present invention, there is provided a method of manufacturing a receiving apparatus, comprising: preparing a chassis including side walls; And providing a mold material to the chassis to form a mold frame coupled with the chassis, wherein at least a portion of at least one of the sidewalls of the chassis is inserted into the mold frame.

According to the accommodating apparatus and the method of manufacturing the same according to the embodiment, the mold frame and the chassis are formed by the injection molding method, and the bonding strength thereof is improved, thereby preventing breakage due to external flow and impact.

In addition, since a part of the side wall of the chassis is inserted into the mold frame and fastened, the strength of the accommodating device is improved.

Further, the sidewalls of the chassis are formed in a 180 ° folded structure, so that the present invention is applicable to a mold frame having a small thickness.

In addition, since the side walls of the chassis support the bottom, side, and inside of the mold frame, the contact area between the chassis and the mold frame is increased, thereby enhancing the strength of the accommodating apparatus.

Further, the chassis and the mold frame are formed as an insert injection mold frame by the injection molding method, thereby simplifying the process and reducing the process time.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A storage apparatus and a manufacturing method thereof according to embodiments will be described in detail with reference to the accompanying drawings.

1 is a perspective view illustrating a state in which a display device coupled to a storage device according to an embodiment is disassembled.

The display device includes a liquid crystal panel 10 and a backlight unit.

The liquid crystal panel 10 is formed by injecting a liquid crystal layer between a TFT substrate and a color filter substrate.

The backlight unit includes a mold frame 100 and a backlight assembly 20 including a light emitting portion 60, a light guide plate 40, an optical sheet 30, and a reflective sheet 50.

The light emitting unit 60 is formed by mounting a lamp 63 such as LED or CCFL on a flexible printed circuit board (FPCB) 61. A lamp 63, which is a plurality of light emitting diodes, is mounted on the back surface of the FPCB 61 of the light emitting unit 60 and is electrically connected to a main substrate (not shown).

The light guide plate 40 receives light emitted from the light emitting portion 60 and uniformly disperses the light into the entire light emitting region of the backlight.

The optical sheet 30 is attached on the light guide plate 40 and selectively includes a lens sheet, a diffusion sheet, a protective sheet, and the like.

The reflective sheet 50 is attached to the lower portion of the light guide plate 40 and reflects light leaking backward in the light guide plate 40 toward the light emitting area.

The liquid crystal panel 10 and the backlight assembly 20 should be housed and fixed. For this, the mold frame 100 and the chassis 200 are used.

FIG. 2 is a perspective view showing a state in which the mold frame and the chassis are separated, and FIG. 3 is a sectional view taken along the line A-A 'in FIG.

2, the mold frame 100 is formed in a shape corresponding to the outer shape of the liquid crystal panel 10 and the backlight assembly 20 so that the liquid crystal panel 10 or the backlight assembly 20 is accommodated therein .

The sidewalls of the mold frame 100 may be formed in a rectangular frame shape, for example, four. Hereinafter, the four sidewalls will be referred to as a first sidewall 110, a second sidewall 120, a third sidewall 130 and a fourth sidewall 140, respectively.

The first sidewall 110 and the third sidewall 130 are disposed to face each other and the second sidewall 120 and the fourth sidewall 140 are disposed to face each other and the first sidewall 110, ) Are connected in a closed loop configuration. Accordingly, the first to fourth sidewalls 110, 120, 130, and 140 have a rectangular frame shape when viewed in a plan view.

For example, the mold frame 100 may be formed using a synthetic resin such as polycarbonate resin, styrene resin, polyvinyl chloride or polypropylene.

The lamp housing part 150 may be formed in the fourth side wall 140 so that the light emitting part 60 can be received.

The lamp housing part 150 includes a receiving groove 151 for receiving the lamp 63 and a receiving part 153 for receiving the FPCB 61 on which the lamp 63 is mounted.

The lamp housing part 150 may have a thickness smaller than that of the side wall 140 to accommodate the light emitting part 60.

The thickness T2 of the lamp housing part 150 is formed to be thinner than the thickness T1 of the fourth side wall 140 so that a step is formed between the fourth side wall 140 and the lamp housing part 150 .

The lamp 63 of the light emitting unit 60 is inserted into the receiving groove 151 and the FPCB 61 is inserted into the receiving unit 153 ).

Therefore, even if the light emitting portion 60 is housed in the lamp housing portion 150 formed to have a thickness smaller than that of the fourth side wall 140, due to the stepped portion between the fourth side wall 140 and the lamp housing portion 150 The overall thickness of the backlight unit is not affected, so that the display device can be made slimmer.

The chassis 200 is coupled to the outer circumferential surface of the mold frame 100 to improve the rigidity of the mold frame 100.

The chassis 200 includes side walls to enclose the side walls of the mold frame 100.

The sidewalls of the chassis 200 may have a rectangular frame shape, for example, four sidewalls. Hereinafter, the sidewalls are referred to as a first sidewall 210, a second sidewall 220, a third sidewall 230, and a fourth sidewall 240.

The chassis 200 may be formed of a metal material. For example, the chassis 200 may be formed of at least one of stainless steel, iron, aluminum, aluminum alloy, and copper.

The first to third side walls 210, 220 and 230 of the chassis 200 are engaged with the first to third side walls 110, 120 and 130 of the mold frame 100, 240 are engaged with the fourth side wall 140 of the mold frame 100.

The first to third sidewalls 210, 220 and 230 of the chassis 200 include a first support 211 coupled to a lower surface of the first to third sidewalls 110, 120 and 130 of the mold frame 100, A second support 212 coupled to an outer surface of the first to third sidewalls 110, 120 and 130 and a third support 213 coupled to an upper surface of the first to third sidewalls 110, 120 and 130. That is, the cross-section of the first to third sidewalls 210, 220 and 230 of the chassis 200 may be formed in a 'C' shape by the first to third supports 211, 212 and 213.

2 and 3, a fourth side wall 240 of the chassis 200 includes a first support 211 coupled to a lower surface of a fourth sidewall 140 of the mold frame 100, And a horizontal portion 215 inserted into the fourth side wall 140 of the frame 100.

Although not shown, the first through third sidewalls 210, 220 and 230 of the chassis 200 may have the same structure as that of the fourth sidewall 240 of the chassis 200.

The horizontal portion 215 of the fourth sidewall 240 of the chassis 200 extends from the edge of the first support 211 and is bent 180 ° so that the first support 211 and the horizontal 215 They have a parallel structure. That is, the first support 211 and the horizontal portion 215 of the fourth sidewall 240 of the chassis 200 are folded to face each other.

The first support 211 of the fourth sidewall 240 of the chassis 200 is engaged with the lower surface of the fourth sidewall 140 of the mold frame 100, And inserted into the outer side surface of the fourth side wall 140 of the mold frame 100.

When the chassis 200 is coupled to the mold frame 100, the first to third sidewalls 210, 220, and 230 of the chassis 200 surround the outer peripheral surfaces of the first to third sidewalls 110, 120, and 130 of the mold frame 100, Structure.

The first support 211 of the fourth sidewall 240 of the chassis 200 is engaged with the lower surface of the fourth sidewall 140 of the mold frame 100, 4 side wall 140, it is possible to improve the strength of the mold frame 100 without being affected by the thickness of the mold frame 100.

This is because the horizontal portion 215 of the chassis 200 is coupled to the fourth side wall 140 of the mold frame 100 in a state where the horizontal portion 215 of the chassis 200 is folded 180 ° with respect to the first support 211, And also to the lamp receiving portion 153 of the fourth side wall 140 of the mold frame 100.

Even in the area where the chassis is not hamming due to the constraining conditions of the banding process, it is possible to produce a chassis effect twice as thin as the thickness of the thin chassis 200 by immediately hamming processing as in the embodiment. In addition, even when the chassis 200 is folded 180 degrees, there is a slight physical space, so that the coupling between the mold frame 100 and the chassis 200 can be more firmly maintained when the insert mold is injected. In addition, even when the chassis 200 is folded 180 degrees, there is a space to be coupled with the mold frame 100, so that the strength of the mold frame 100 can be improved. Even when the support base 211 and the horizontal portion 215 are completely in close contact with each other and the joint space with the mold frame 100 can not be obtained, the support frame 211 supports the mold frame 100 due to the horizontal portion 215 of the chassis 200 The strength can be improved.

The chassis 200 is coupled to the first to third sidewalls 110, 120 and 130 of the mold frame 100 in a 'C' shape to reinforce the strength of the mold frame 100, The fourth side wall 140 of the mold frame 100 is coupled to the inside of the fourth side wall 140 to reinforce the strength of the mold frame 100.

The mold frame 100 and the chassis 200 may be coupled by injection mold injection molding.

Referring to Fig. 4, the insert mold injection molding method comprises installing the chassis 200 including the first to fourth sidewalls on a mold frame 80 of an injection molding apparatus (not shown). 4 is a sectional view of a mold frame 80 having a fourth side wall 240 of the chassis 200 installed therein.

Reference numeral 90 is a raw material injector.

The first support 211 and the horizontal portion 215 of the fourth sidewall 240 of the chassis 200 may be formed by a hamming operation. For example, the horizontal part 215 extending from the edge of the first support 211 of the chassis 200 may be bent 180 ° so that the first support 211 and the horizontal part are folded.

When an injection molding process is performed in which a synthetic resin as a raw material of the mold frame 100 is injected into a mold frame 80 provided with the chassis 200 to heat and cure the mold frame 80, 100) are integrated.

Therefore, since the chassis 200 and the mold frame 100 are coupled by injection molding, the bonding strength can be improved.

At this time, even when the first support 211 and the horizontal 215 of the chassis 200 are folded 180 degrees, there is a physical space between the first support 211 and the horizontal 215, The molding material penetrates between the support table 211 and the horizontal portion 215 to firmly fix the chassis 200 and the mold frame 100, so that the bonding strength of the chassis 200 is increased.

Since the first support 211 and the horizontal portion 215 of the chassis 200 are overlapped by the hamming operation, the present invention can be applied to the side wall of the mold frame 100 requiring a thin thickness, .

FIG. 5 is a plan view showing a state in which another type of chassis is coupled to the mold frame, and FIG. 6 is a sectional view taken along line B-B 'of FIG. 7 is a plan view showing a chassis coupled to the lamp housing portion of the mold frame.

Referring to FIGS. 5 and 6, the chassis 300 is formed in a shape corresponding to the outer shape of the mold frame shown in FIG. 2, and is configured to surround the first to fourth sidewalls 110, 120, 130 and 140 of the mold frame 100 .

The sidewalls of the chassis 300 may be formed of, for example, four rectangular frames.

The chassis 300 may be formed of a metal material. For example, the chassis 300 may be formed of at least one of stainless steel, iron, aluminum, aluminum alloy, and copper.

The chassis 300 includes a first support 311 coupled to a lower surface of the sidewalls of the mold frame 100 and a second support 311 extending from an edge of the first support 311 and bent in a vertical direction, A second support 312 extending from an edge of the second support 312 and bent in a horizontal direction and inserted into the side walls of the mold frame 100; (313).

The first support 311 and the third support 313 may have a structure parallel to each other by the second support 312.

The sidewalls of the chassis 300 may have a "C" -shaped cross-section by the first to third supports 311, 312, 313. The thickness T4 of the sidewall of the chassis 300 may be less than the thickness T3 of the mold frame 100 and may be inserted into the side wall of the mold frame 100. [

When the chassis 300 and the mold frame 100 are coupled to each other, the first support 311 of the chassis 300 supports the first to fourth sidewalls 110, 120, 130 and 140 of the mold frame 100, And the third support 313 is coupled to the outer surface of the first to fourth sidewalls 110, 120, 130 and 140. The third support 313 is coupled to the outer surface of the first to fourth sidewalls 110, 120, Is inserted into the inside of the side surface.

Although not shown, the structure of the first to third sidewalls 310, 320, and 330 of the chassis 300 is the same as that of the first to third sidewalls 210, 220, and 230 of the chassis 200 of FIG. 120, and 130 of the first and second side walls 100 and 100, respectively.

Referring to FIG. 7, the chassis 300 coupled to the fourth side wall 140 of the mold frame 100 may be selectively exposed.

The upper surface of the third support part 313 of the chassis 300 coupled to the lamp receiving part 150 is exposed through the exposed part of the lamp housing part 150, .

That is, the third support part 313 of the chassis 300 is bent in the horizontal direction at the edge of the second support part 312 based on the thickness of the lamp housing part 150.

Since the edge of the fourth side wall 140 of the mold frame 100 has a thickness larger than that of the lamp housing part 150, And the remaining area is positioned above the lamp housing part 150 and exposed.

In addition, the second support 312 of the chassis 300 and the lamp housing 150 may have the same surface height.

Since the thickness T4 of the second support part 312 of the chassis 300 and the thickness T3 of the lamp housing part 150 have the same thickness, the third support part 312 extending from the second support part 312 313 and the lamp receiving portion 150 may be located on the same plane.

Therefore, when the light emitting portion 60 is positioned above the lamp housing portion 150 and the third support portion 313 having a flat structure, the FPCB 61 can be held flat without protruding.

Which can be formed by using the above-described insert mold injection molding process.

In addition, since the chassis 300 is disposed in such a structure as to surround the first to fourth side walls 110, 120, 130 and 140 of the mold frame 100, particularly, the lamp housing part 150 having a small thickness, The entirety of the mold frame 100 can be supported in the same shape without the cut-off region of the mold frame 100, so that the strength of the mold frame 100 can be improved.

In addition, since the contact area of the chassis 300 with the mold frame 100 is increased by the 'C' structure of the chassis 300, the strength of the mold frame 100 can be reinforced.

As described above, according to the present invention, in the region where the FPCB and the LED FPCB are exposed in the liquid crystal display device, there is a step in the region where the mold frame and the chassis are combined, Was not very high. However, by applying the structure and the method in which the chassis is inserted into the mold frame as in the present invention, the step is eliminated, and the strength of the chassis is improved more than twice. That is, the strength of the insert is improved by the insert molding structure, but the chassis also has a 'C' hammer and the step between the mold frame and the chassis is eliminated.

In addition, the limitation of the 'C' banding hamming of the chassis is limited, and even if the 'C' hamming constraint is satisfied, the shape of the mold frame can be realized by appropriately lowering the 'C' banding height .

Especially, it is possible to apply it anywhere by adjusting the condition of Hamming of 'c' of the chassis, and thereby the strength is greatly improved.

Also, since the thickness of the mold frame can be reduced by using the 'C' hamming process of the chassis, it is possible to make the accommodating device slimmer.

While the present invention has been described with reference to exemplary embodiments, it is to be understood that the invention is not limited to the disclosed embodiments, but, on the contrary, is intended to cover various modifications and equivalent arrangements included within the spirit and scope of the appended claims. It can be seen that the modification and application of branches are possible. For example, each component specifically shown in the embodiments can be modified and implemented. It is to be understood that such variations and applications are to be construed as being included within the scope of the embodiments defined in the appended claims.

1 is a perspective view showing a state in which a storage device and a display device according to an embodiment are disassembled.

FIG. 2 is a perspective view showing a state in which the storage device shown in FIG. 1 is separated. FIG.

3 is a sectional view taken along the line A-A 'in Fig.

4 is a cross-sectional view illustrating a method of joining the mold frame and the chassis.

FIG. 5 is a perspective view showing a state where another type of chassis is coupled to the mold frame of the accommodating apparatus according to the embodiment.

6 is a cross-sectional view taken along the line B-B 'in FIG.

7 is an enlarged plan view of a partial area of FIG.

Claims (10)

A mold frame including side walls for accommodating at least one of a liquid crystal panel and a backlight assembly; And And a chassis coupled with sidewalls of the mold frame, At least one of the sidewalls of the chassis is inserted into at least one of the sidewalls of the mold frame, And at least one of the sidewalls of the mold frame includes a lamp accommodating portion formed to be thinner than a side wall of the mold frame so as to accommodate the light emitting portion of the backlight assembly. delete delete The method according to claim 1, At least one sidewall of the sidewalls of the chassis includes a first support disposed below the sidewalls of the mold frame, a second support extending from the first support and disposed on an outer circumferential surface of the sidewalls of the mold frame, And a third support extending from the support and at least partly inserted into the inside of the side wall of the mold frame. 5. The method of claim 4, Wherein at least one of the sidewalls of the mold frame is formed with a lamp accommodating portion formed to have a thickness thinner than a side wall of the mold frame so as to accommodate the light emitting portion of the backlight assembly, And the third support of the chassis coupled to the side wall of the mold frame having the lamp housing part is exposed. 6. The method of claim 5, Wherein the second support of the chassis and the lamp housing part have the same height. Preparing a chassis including sidewalls; Providing a mold material to the chassis to form a mold frame associated with the chassis, A part of at least one of the sidewalls of the chassis is inserted into the inside of the mold frame, The side walls of the chassis include a first support having a flat surface, a second support vertically bent at the first support, and a third support vertically bent at the second support, A mold material is injected into the inside and the top of at least one of the side walls to form a side wall of the mold frame, Wherein a mold material is injected into at least one side wall of the side walls to form a lamp housing portion of the mold frame. delete delete 8. The method of claim 7, Wherein the third support and the lamp housing are formed to have the same surface height.

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