KR101395043B1 - Camera adhesion transfer chamber - Google Patents

Camera adhesion transfer chamber Download PDF

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Publication number
KR101395043B1
KR101395043B1 KR1020120153282A KR20120153282A KR101395043B1 KR 101395043 B1 KR101395043 B1 KR 101395043B1 KR 1020120153282 A KR1020120153282 A KR 1020120153282A KR 20120153282 A KR20120153282 A KR 20120153282A KR 101395043 B1 KR101395043 B1 KR 101395043B1
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KR
South Korea
Prior art keywords
transfer chamber
viewport
chamber
camera
hole
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Application number
KR1020120153282A
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Korean (ko)
Inventor
박세운
황상욱
Original Assignee
주식회사 싸이맥스
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Priority to KR1020120153282A priority Critical patent/KR101395043B1/en
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Publication of KR101395043B1 publication Critical patent/KR101395043B1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67196—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the transfer chamber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber

Abstract

According to an aspect of the present invention, there is provided a transfer chamber for providing a transfer space for transferring wafers of semiconductor equipment, the transfer chamber including: a viewport including a through hole formed through a lower side of the transfer chamber; And an image capturing unit attached to a lower end of the viewport to seal the viewport and capture the interior of the viewport. According to the present invention, a camera for photographing the inside of the chamber is attached to the outer wall of the transfer chamber, thereby minimizing critical points and blind spots, and capturing the inside of the chamber on the outer wall capable of accurately grasping the position of the robot arm and the state of the wafer in the transfer chamber To the transfer chamber.

Figure R1020120153282

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a transfer chamber having a camera for photographing an inside of a chamber on an outer wall. [0002] CAMERA ADHESION TRANSFER CHAMBER [

The present invention relates to a transfer chamber to which a camera for photographing the inside of a chamber is attached to an outer wall. More particularly, the present invention relates to a transfer chamber with a camera for photographing the inside of the chamber on the outer wall of the transfer chamber, minimizing critical points and blind spots, To a transfer chamber having a camera for photographing the inside of a chamber on an outer wall capable of accurately grasping the position of a robot arm in the chamber and the state of the wafer.

The present invention relates to a transfer chamber.

Generally, a process of depositing material films on a semiconductor wafer or a process of etching material films formed on a wafer is performed in order to manufacture a semiconductor device.

The deposition process and the etching process are mostly performed in a processor chamber of a high vacuum atmosphere.

The wafer is temporarily stored in the load lock chamber before loading the wafer into the processor chamber.

The transfer chamber provides a transfer space for transferring wafers of semiconductor equipment into the processor chamber or load lock chamber.

1 is a plan view for explaining a transfer chamber.

Referring to FIG. 1, a transfer robot is disposed in the transfer chamber 100.

And transfers the wafer using the transfer robot.

A load lock chamber surrounding the transfer chamber and one or more processor modules are disposed.

And the wafer cassette 13 is located in the load lock chamber 11. [

The wafers 15 are mounted on the cassette 13.

Slit valves are located at the connection 19 between the transfer chamber 100 and the load lock chamber 11.

Likewise, a slit valve is located at the connection 19 of the transfer chamber 100 and the processor chamber 17. [ The transfer chamber 100 is opened or closed by opening and closing the slit valve.

The wafer 15 is aligned with the wafer cassette 13 disposed in the load lock chamber 11. [

The slit valve located at the connecting portion 19 of the load lock chamber 11 and the transfer chamber 100 is opened.

Subsequently, the transfer robot disposed in the transfer chamber 100 operates to transfer the wafer 15 in the load lock chamber 11 into the transfer chamber 100.

Subsequently, the slit valve is closed.

The wafer transferred into the transfer chamber 100 is transferred to the processor chamber 17 through the operation of the transfer robot.

In this case, a slit valve disposed in the transfer chamber (100) and the connecting portion (19) of the processor chamber (17) is operated.

Thus, the transfer chamber 100 is opened or closed.

However, since the transfer chamber 100 is made of an opaque material, it can not be confirmed whether the wafers are normally transferred from the load lock chamber 11 to the transfer chamber 100.

Particularly, when the wafers are being transferred from the load lock chamber 11 to the transfer chamber 100 by the transfer robot, wafers may be separated from the transfer robot.

There is a problem in that the productivity of the semiconductor devices is lowered because the detached wafers can not be placed on the transfer robot in a timely manner.

This problem also occurs when wafers are transported through the transfer chamber 100 and the processor chamber 17.

Accordingly, the transfer chamber and the connection portion connected to the processor chamber or the load lock chamber can not be identified, so that it is difficult to elucidate the cause and solution for the occurrence of a problem.

The conventional central observation port is formed on the upper side of the transfer chamber so that the inside can be observed with the naked eye. The transfer robot obscures the field of view and confirms the connection between the transfer chamber and the processor chamber or the load lock chamber It is impossible to precisely and precisely manipulate and set the image.

The technology of the background of the present invention is as disclosed in Korean Patent Registration No. 10-0850436.

However, Korean Patent Registration No. 10-0850436 does not provide a solution to the above-mentioned problems at all.

In order to solve the above problems, it is an object of the present invention to provide a camera for photographing the inside of a chamber on the outer wall of a transfer chamber, thereby minimizing critical points and blind spots, And a camera for photographing the inside of the chamber on an outer wall capable of accurately grasping the state of the transfer chamber.

It is another object of the present invention to provide a DVR system that records a process status in real time when a problem occurs during the process, thereby accurately determining a situation where a problem has occurred, And a transfer chamber to which a camera for photographing the inside of the chamber is attached.

It is still another object of the present invention to provide a transfer chamber having a camera for photographing the inside of a chamber on an outer wall which is more convenient for robots teaching because it can be confirmed in real time through a camera unit attached to an outer wall.

According to an aspect of the present invention, there is provided a transfer chamber for providing a transfer space for transferring wafers of semiconductor equipment, the transfer chamber including a through hole formed through a lower side of the transfer chamber, Included viewports; And an image capturing unit attached to a lower end of the viewport to seal the viewport and capture the interior of the viewport, wherein the image capturing unit is formed on the transfer chamber and is formed of a transparent transparent material, And a central observation port for allowing the user to observe the image, wherein the image capturing unit includes a camera unit insertion hole and a light source which is formed around the camera unit insertion hole and emits light toward the inside of the transfer chamber A light emitting portion including the light emitting portion; A camera unit for photographing the inside of the transfer chamber and inserted into the camera unit insertion hole; A bracket fixed to the light emitting unit and the camera unit and coupled to the viewport; And a transparent sealing part inserted into the mounting groove of the bracket and sealing the lower surface of the viewport, wherein the bracket is screwed with the viewport, and the first end ; A second end formed on the first end and fixing the light emitting portion; And a third end formed on the second end and fixing the camera unit, wherein the viewport has a screw hole at a portion where the first end is inserted and contacted, And an engaging portion formed at a lower end of the through hole and having an inner diameter equal to the outer diameter of the first end so as to be in contact with the outer diameter of the first end of the bracket, Wherein the first end is formed with a screw through hole at the same position as the screw engagement portion formed in the engagement portion and the bolt is screwed with the screw engagement portion through the screw through hole and fixed to the engagement portion Wherein the image capturing unit is screwed to the coupling unit so that the image capturing unit is connected to each connection, which is a blind spot of the visual field with respect to the inside of the transfer chamber, Wherein the transparent sealing part is attached to the front surface of the bracket and is made of a transparent material; A first O-ring attached to a front surface of the glass and formed between the viewport and the glass to maintain a vacuum state of the transfer chamber; And a second O-ring attached to a rear surface of the glass, the second O-ring being formed between the bracket and the glass.

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According to the present invention as described above, the camera for photographing the inside of the chamber is attached to the outer wall of the transfer chamber to minimize the critical points and the blind spot, so that the position of the robot arm in the transfer chamber and the state of the wafer can be accurately grasped. It is possible to provide a transfer chamber with a camera for photographing the interior of the transfer chamber.

In addition, according to the present invention, since a process situation is recorded in real time when a problem occurs during the process, it is possible to accurately determine the situation in which a problem has occurred, It is possible to provide a transfer chamber with a camera for photographing.

In addition, according to the present invention, it is possible to provide a transfer chamber equipped with a camera for photographing the inside of a chamber on an outer wall, which is more convenient to perform robotic teaching because it can be confirmed in real time through a camera unit attached to an outer wall.

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a plan view illustrating a transfer chamber with a camera for photographing the inside of a chamber on an outer wall according to an embodiment of the present invention;
2 is a perspective view showing a transfer chamber with a camera for photographing the inside of a chamber on an outer wall according to an embodiment of the present invention.
3 is a bottom perspective view showing the lower side of the transfer chamber according to the embodiment of the present invention.
FIG. 4 is an exploded perspective view showing the image capturing unit attached to the transfer chamber according to the embodiment of the present invention.
5 is a cross-sectional view illustrating an image capturing unit attached to a transfer chamber according to an embodiment of the present invention
6 to 7 are cross-sectional views illustrating a transfer chamber according to an embodiment of the present invention.
8 is a bottom view showing a transfer chamber with a camera for photographing the inside of a chamber on an outer wall according to an embodiment of the present invention.

BRIEF DESCRIPTION OF THE DRAWINGS The advantages and features of the present invention, and the manner of achieving them, will be apparent from and elucidated with reference to the embodiments described hereinafter in conjunction with the accompanying drawings. The present invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the invention to those skilled in the art. To fully disclose the scope of the invention to those skilled in the art, and the invention is only defined by the scope of the claims. Like reference numerals refer to like elements throughout the specification.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, the present invention will be described with reference to the accompanying drawings illustrating a transfer chamber having a camera for photographing the inside of a chamber on an outer wall according to embodiments of the present invention.

FIG. 1 is a plan view for explaining a transfer chamber with a camera for photographing the inside of a chamber on an outer wall according to an embodiment of the present invention. FIG. 2 is a cross- FIG. 3 is a bottom perspective view showing a transfer chamber according to an embodiment of the present invention, FIG. 4 is an exploded perspective view illustrating an image capturing unit attached to a transfer chamber according to an embodiment of the present invention, And FIG. 5 is a cross-sectional view illustrating an image capturing unit attached to a transfer chamber according to an embodiment of the present invention. FIGS. 6 to 7 are sectional views showing a transfer chamber according to an embodiment of the present invention, FIG. 5 is a bottom view showing a transfer chamber with a camera for photographing the inside of a chamber on an outer wall according to an embodiment of the present invention.

Referring to FIGS. 1 to 8, a transfer chamber 100 having a camera for photographing the inside of a chamber on the outer wall of the present invention includes a central observation port 120, a viewport 110, an image capturing unit 200, .

Here, the transfer chamber 100 is preferably a vacuum chamber, and is preferably formed of a transparent material for observing the inside of the transfer chamber 100. However, since the strength of the transparent material is lower than that of the metal, The proportion of the transparent material occupied by the transfer chamber 100 is reduced.

Therefore, a viewport 110 penetrating through one or more transfer chambers 100 is formed on the outside so that the inside of the transfer chamber can be observed with a minimum size, and the hole is sealed with a transparent material, do.

The central observation port 120 is formed on the upper side of the transfer chamber 100 and is made of a transparent material transmitting light.

However, the central observation port 120 is shielded from the visual field due to the transfer robot and can not confirm the transfer chamber 100 and the connection portion 19 connected to the processor chamber 17 or the load lock chamber 11, There is a limit.

Therefore, when the wafers 15 are detached from the transfer robot, since the detached wafers 15 can not be properly placed on the transfer robot, the productivity of the semiconductor devices is lowered. Therefore, The image capturing unit 200 captures an image of a subject on the side of the connection unit 19 that can not be recognized by the central observation port 120 and captures the image through the image capturing unit 200, And solutions can be easily obtained.

Therefore, the viewport 110 is connected to the transfer chamber 100 and the load lock chamber 11 or the processor chamber 17 in order to check the inside of the connection portion 19 that can not be observed at the central observation port 120 And the connecting portion 19 is observed in the vicinity of each connecting portion 19 to be observed.

Here, the viewport 110 is preferably formed at a predetermined distance from each connecting portion 19 formed in the transfer chamber 100, but it is not limited thereto. The viewport 110 may be formed at any position on the outer wall of the transfer chamber 100 I can form.

Further, the viewport 110 is formed so as to pass through the lower outer wall of the transfer chamber 100.

The viewport 110 is formed at the lower end and has an engaging portion 112 to which the image capturing unit 200 is inserted and to be threadedly engaged and a through hole 112 formed at an upper end thereof and passing through the transfer chamber 100, And the image capturing unit 200 is screwed to the coupling unit 112 so that a square of the visual field with respect to the inside of the transfer chamber 100, which is generated upon observation through the central observation port 120, So that the user can take a picture of each connecting portion 19 as a zone.

The through hole 114 of the viewport 110 is preferably formed to be slightly smaller than the inner diameter of the seating groove 2321 of the bracket 230 of the image capturing unit 200, 112 may be formed to have the same size as the outer diameter of the bracket 230 of the image capturing unit 200. The image capturing unit 200 may be screwed to the coupling unit 112, ) Of the transfer chamber 100, which is a blind spot of the visual field with respect to the inside of the transfer chamber 100,
The engaging portion 112 is formed with a threaded hole at a portion where the first end 232 is inserted and contacted and is formed at a lower end of the through hole 114 larger than an inner diameter of the through hole 114 And an inner diameter of the same size as the outer diameter of the first end 232 so as to be in close contact with the outer diameter of the first end 232 of the bracket 230.
The first end 232 is formed with a threaded through hole at the same position as the threaded portion formed in the coupling portion 112, and the bolt penetrates the threaded through hole and is screwed with the threaded portion, And is fixed to the engaging portion 112.

One or more viewports 110 are formed on the outer wall of the transfer chamber 100 and the image pickup unit 200 is coupled to each viewport 110 so that the inside of the transfer chamber 100 It is preferable to take a photograph.

The image capturing unit 200 is attached to the lower end of the viewport 110 to seal the viewport 110 and capture the inside of the viewport 110.

Here, the image capturing unit 200 includes a light emitting unit 210, a camera unit 220, a bracket 230, and a transparent sealing unit 240.

The light emitting unit 210 includes a camera unit insertion hole 214 and a light source 212 formed around the camera unit insertion hole 214 and emitting light toward the transfer chamber.

Here, the inner diameter of the insertion hole of the camera unit 220 is formed to be the same as the outer diameter of the camera unit 220, so that the camera unit 220 can be inserted.

The camera unit 220 captures the inside of the transfer chamber 100 and is inserted into the insertion hole of the camera unit 220 formed at the center of the light emitting unit 210.

The bracket 230 fixes the light emitting unit 210 and the camera unit 220 and is coupled to the viewport 110.

The bracket 230 includes a first end 232, a second end 234 and a third end 236. The first end 232 is threadably engaged with the viewport 110, The second end 234 formed on the upper portion of the first end 232 fixes the light emitting portion 210 and the third end 236 formed on the upper portion of the second end 234, Thereby fixing the portion 220.

The image capturing unit 200 further includes a transparent enclosure 240. The transparent enclosure 240 includes a glass 242, a first O-ring 244a, and a second O-ring 244b.

The glass 242 is inserted into the seating groove 2321 of the bracket 130 and is formed of a transparent material capable of withstanding the pressure change inside the transfer chamber 100.

A first O-ring 244a is attached to the front surface of the glass 242 and is formed between the viewport 110 and the glass 242 to maintain a vacuum inside the transfer chamber 100. [

The second O-ring 244b is attached to the rear surface of the glass 242 and is formed between the bracket 230 and the glass 242 to prevent friction between the glass 242 and the bracket, .

When the light emitting unit 210 and the camera unit 220 are inserted into the viewport 110 after the bracket 230 is inserted into the transparent enclosure 240, Thereby sealing the viewport 110 and the bracket 230 by engagement.

The image captured by the camera unit 220 may be wirelessly transmitted to the administrator terminal through the wireless communication unit built in the camera unit 220 or may be transmitted to the administrator terminal through the connection line formed on the rear surface of the camera unit 220. [ .

It will be understood by those skilled in the art that the present invention may be embodied in other specific forms without departing from the spirit or essential characteristics thereof. It is therefore to be understood that the above-described embodiments are illustrative in all aspects and not restrictive. The scope of the present invention is defined by the appended claims rather than the foregoing detailed description, and all changes or modifications derived from the meaning and scope of the claims and the equivalents thereof are included in the scope of the present invention Should be interpreted.

7: Loadlock Module 9: Processor Module
11: load lock chamber 13: wafer cassette
15: wafer 17: processor chamber
19: connection part 100: transfer chamber
110: viewport 112:
114: Through hole 120: Central observation port
200: image capturing unit 210:
212: light source 214: camera unit insertion hole
220: camera part 230: bracket
232: first end 2321: seat groove
234: second stage 236: third stage
240: transparent sealing part 242: glass
244a: first o-ring 244b: second o-ring

Claims (6)

A transfer chamber for providing a moving space for transferring wafers of semiconductor equipment,
A viewport including a through hole formed through a lower side of the transfer chamber; And
And an image photographing unit attached to a lower end of the viewport to close the viewport and photograph the inside of the viewport,
And a central observation port formed at the upper side of the transfer chamber and formed of a transparent material transmitting light so that the inside of the transfer chamber can be observed.
The image capturing unit includes:
A light emitting unit including a camera unit insertion hole and a light source formed around the camera unit insertion hole and emitting light toward the transfer chamber;
A camera unit for photographing the inside of the transfer chamber and inserted into the camera unit insertion hole;
A bracket fixed to the light emitting unit and the camera unit and coupled to the viewport; And
And a transparent hermetically sealed portion inserted into the mounting groove of the bracket and sealing the lower surface of the viewport,
The bracket
A first end threaded with the viewport and having the seating groove formed therein;
A second end formed on the first end and fixing the light emitting portion; And
And a third end formed on the second end and fixing the camera unit,
The viewport includes:
Wherein a through hole is formed at a lower end of the through hole and is formed to be larger than an inner diameter of the through hole, and the outer diameter of the first end And an engaging portion formed with an inner diameter of the same size as the engaging portion,
Wherein the first stage comprises:
A screw through hole is formed at the same position as the screw coupling portion formed in the coupling portion, and a bolt is screwed to the screw coupling portion through the screw through hole and fixed to the coupling portion,
Wherein the image capturing unit is formed to be able to capture each connection part which is a blind spot of the view of the inside of the transfer chamber, which is generated when the image capturing unit is screwed to the coupling unit and observed through the central observation port,
The transparent sealing portion
A glass attached to a front surface of the bracket and formed of a transparent material;
A first O-ring attached to a front surface of the glass and formed between the viewport and the glass to maintain a vacuum state of the transfer chamber; And
And a second O-ring attached to the rear surface of the glass, the second O-ring being formed between the bracket and the glass, wherein the camera captures the interior of the chamber.

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KR1020120153282A 2012-12-26 2012-12-26 Camera adhesion transfer chamber KR101395043B1 (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN117144322A (en) * 2023-08-28 2023-12-01 上海陛通半导体能源科技股份有限公司 Cavity cover structure, semiconductor process equipment and use method thereof

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003264214A (en) * 2002-03-07 2003-09-19 Hitachi High-Technologies Corp Vacuum treatment device and vacuum treatment method
KR20070044725A (en) * 2005-10-25 2007-04-30 삼성전자주식회사 Transfer chamber having transparent lid
KR100783072B1 (en) 2006-12-27 2007-12-07 세메스 주식회사 Apparatus for processing a substrate
JP2010171302A (en) * 2009-01-26 2010-08-05 Panasonic Corp Plasma processing apparatus

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003264214A (en) * 2002-03-07 2003-09-19 Hitachi High-Technologies Corp Vacuum treatment device and vacuum treatment method
KR20070044725A (en) * 2005-10-25 2007-04-30 삼성전자주식회사 Transfer chamber having transparent lid
KR100783072B1 (en) 2006-12-27 2007-12-07 세메스 주식회사 Apparatus for processing a substrate
JP2010171302A (en) * 2009-01-26 2010-08-05 Panasonic Corp Plasma processing apparatus

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN117144322A (en) * 2023-08-28 2023-12-01 上海陛通半导体能源科技股份有限公司 Cavity cover structure, semiconductor process equipment and use method thereof

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