CN114628273A - Semiconductor processing equipment and semiconductor processing monitoring method - Google Patents
Semiconductor processing equipment and semiconductor processing monitoring method Download PDFInfo
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- CN114628273A CN114628273A CN202011436731.2A CN202011436731A CN114628273A CN 114628273 A CN114628273 A CN 114628273A CN 202011436731 A CN202011436731 A CN 202011436731A CN 114628273 A CN114628273 A CN 114628273A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/10—Measuring as part of the manufacturing process
- H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
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Abstract
The application belongs to the technical field of semiconductor processing, and particularly relates to semiconductor processing equipment and a semiconductor processing monitoring method, wherein the semiconductor processing equipment comprises: the loading platform is used for loading a wafer boat containing wafers; the camera device is arranged in the semiconductor processing equipment, and a camera area covers the wafer boat and is used for shooting a wafer image; and the controller is electrically connected with the camera device and is used for receiving the wafer image shot by the camera device, analyzing the wafer image and controlling the semiconductor processing equipment to take counter measures. According to the semiconductor processing equipment, the image pick-up device for shooting the wafer image is arranged in the semiconductor processing equipment, so that the controller of the semiconductor processing equipment can judge whether the wafer is damaged or not according to the shot wafer image, and after the wafer is damaged, the controller can control the semiconductor processing equipment to take countermeasures.
Description
Technical Field
The application belongs to the technical field of semiconductor processing, and particularly relates to semiconductor processing equipment and a semiconductor processing monitoring method.
Background
This section provides background information related to the present disclosure only and is not necessarily prior art.
When the wafer is processed by using the infiltration diffusion equipment, the wafer stored in the wafer boat can cause the wafer damage phenomenon due to edge damage and the wafer separation phenomenon due to vibration after the processing is finished. After the wafer is damaged and separated from the wafer boat, the wafer may interfere with the wafer transfer device when the wafer is taken out of the infiltration diffusion apparatus, the wafer transfer device may push down the wafer boat during the interference with the wafer, and the wafer boat may drop the normal wafer from the wafer boat when pushed down.
In order to reduce the interference between the wafer transfer device and the damaged wafer, the conventional wafer transfer device detects whether the wafer is damaged or not and whether the wafer is detached from the wafer transfer device during the wafer transfer process. However, the wafer transfer device can only detect whether the wafer is damaged or not and whether the wafer is separated from the wafer in the transfer direction, and when the wafer on the back side of the wafer transfer device in the wafer boat is damaged, the wafer transfer device cannot effectively detect that the wafer is damaged, so that the wafer transfer device still grabs the damaged wafer, and finally the wafer boat is pushed and the wafer falls off.
Disclosure of Invention
A first aspect of the present application provides a semiconductor processing apparatus comprising:
the loading platform is used for loading a wafer boat containing wafers; the camera device is arranged in the semiconductor processing equipment, and a camera area covers the wafer boat and is used for shooting a wafer image; and the controller is electrically connected with the camera device and is used for receiving and analyzing the wafer image shot by the camera device and controlling the semiconductor processing equipment to take counter measures.
The second aspect of the present application also provides a semiconductor process monitoring method, including:
pre-storing a standard image of a wafer before the wafer is placed in semiconductor processing equipment;
after the semiconductor processing equipment processes the wafers in the wafer boat, shooting a first wafer image through a camera device;
judging whether the wafers in the wafer boat are damaged or not by comparing the first wafer image with the standard image;
when the wafer is damaged, an alarm signal is sent out through the player.
Drawings
Various additional advantages and benefits will become apparent to those of ordinary skill in the art upon reading the following detailed description of the specific embodiments. The drawings are only for purposes of illustrating the particular embodiments and are not to be construed as limiting the application. Also, like parts are designated by like reference numerals throughout the drawings. Wherein:
FIG. 1 is a schematic structural diagram of a semiconductor processing apparatus according to an embodiment of the present application;
fig. 2 is a schematic flow chart of a semiconductor process monitoring method according to an embodiment of the present application.
Reference numerals:
100. semiconductor processing equipment; 101. a loading table;
10. a diffusion processing chamber;
20. a wafer boat;
30. a wafer;
41. a first camera; 42. a second camera;
50. a vacuum chamber;
60. and a mechanical arm.
Detailed Description
Hereinafter, embodiments of the present disclosure will be described with reference to the accompanying drawings. It should be understood that the description is illustrative only and is not intended to limit the scope of the present disclosure. Moreover, in the following description, descriptions of well-known structures and techniques are omitted so as to not unnecessarily obscure the concepts of the present disclosure.
Various structural schematics according to embodiments of the present disclosure are shown in the figures. The figures are not drawn to scale, wherein certain details are exaggerated and possibly omitted for clarity of presentation. The shapes of various regions, layers, and relative sizes and positional relationships therebetween shown in the drawings are merely exemplary, and deviations may occur in practice due to manufacturing tolerances or technical limitations, and a person skilled in the art may additionally design regions/layers having different shapes, sizes, relative positions, as actually required.
In the context of the present disclosure, when a layer/element is referred to as being "on" another layer/element, it can be directly on the other layer/element or intervening layers/elements may be present. In addition, if a layer/element is "on" another layer/element in one orientation, then that layer/element may be "under" the other layer/element when the orientation is reversed.
As shown in fig. 1, an embodiment of the present application provides a semiconductor processing apparatus 100, the semiconductor processing apparatus 100 includes a loading table 101, an image capturing device (described in detail below) and a controller (described in detail below), the loading table 101 is used for loading a wafer boat 20 containing a wafer 30, the image capturing device is disposed in the semiconductor processing apparatus 100 and covers the wafer boat 20 with an image capturing area for capturing an image of the wafer, and the controller is electrically connected with the image capturing device and is used for receiving and analyzing the image captured by the image capturing device and controlling the semiconductor processing apparatus 100 to take measures.
Specifically, the semiconductor manufacturing process mainly includes a photolithography process, an etching process, a film formation process, and the like performed a plurality of times in the semiconductor processing apparatus 100, thereby forming semiconductor devices of various structures on the semiconductor wafer 30. Taking a thermal oxidation process of a semiconductor as an example, the semiconductor processing equipment 100 includes a diffusion processing chamber 10, the loading table 101 is disposed in the diffusion processing chamber 10, when performing thermal oxidation processing on the wafer 30, firstly, a reaction gas is introduced into the diffusion processing chamber 10, so that the reaction gas generates a chemical reaction in the diffusion processing chamber 10, then a layer of thin film is deposited on the surface of the wafer 30, then, the wafer 30 is taken out from the diffusion processing chamber 10 for natural cooling, and after the natural cooling, the wafer 30 is conveyed back to the wafer box.
Further, the semiconductor processing apparatus 100 further includes a vacuum chamber 50 communicated with the diffusion processing chamber 10, the semiconductor processing apparatus 100 further includes a robot arm 60 disposed in the vacuum chamber 50, the robot arm 60 is used for grabbing the wafers 30 on the wafer boat 20 of the diffusion processing chamber 10, and the wafer boat 20 is a container having a plurality of slots for placing the wafers 30 and disposed in the semiconductor processing apparatus 100. When the wafer 30 is taken out from the wafer boat 20 of the semiconductor processing apparatus 100, the wafer 30 is taken out from the wafer boat 20 by the gripper of the robot arm 60, and if the wafer 30 is damaged or inserted obliquely on the wafer boat 20, the gripper of the robot arm 60 may interfere with the damaged or inserted obliquely wafer 30 and collide with the damaged or inserted obliquely wafer 30 during the process of gripping the wafer 30, which may cause the wafer 30 to be crushed, further affect the wafer 30 with good condition in the wafer boat 20, and damage the gripper of the robot arm 60.
In order to reduce the possibility that the robot arm 60 may feel a collision accident during the process of picking up the damaged wafer 30, the embodiment of the present application is provided with an image pickup device for picking up an image of the wafer in the semiconductor processing apparatus 100, and the image pickup device for picking up an image of the wafer is provided in the semiconductor processing apparatus 100. Specifically, the embodiment of the present application needs to pre-store the standard image of the wafer 30 before the wafer 30 is placed in the semiconductor processing apparatus 100, the pitch between the multi-layered wafers 30 and the shape and state of the multi-layered wafers 30 can be obtained through the standard image of the wafer 30, before the wafer 30 is placed in the semiconductor processing apparatus 100 for processing, the second wafer image is captured by the camera device, and whether the wafer 30 in the boat 20 is damaged or not is determined through the second wafer image. After the semiconductor processing equipment 100 processes the wafers 30 in the wafer boat 20, the first wafer image is captured by the image capturing device, and whether the wafers 30 in the wafer boat 20 are damaged or not is determined by the first wafer image, so that the controller of the semiconductor processing equipment 100 can determine whether the wafers 30 are damaged or not according to the captured wafer image. After the wafer 30 is damaged, the controller can control the semiconductor processing apparatus 100 to take measures, for example, control the robot arm 60 to stop grabbing the wafer 30, so as to reduce the occurrence of interference collision accidents during the grabbing of the wafer 30 by the robot arm 60. In addition, according to an embodiment of the present invention, the semiconductor processing apparatus 100 further includes a player electrically connected to the controller for playing the analysis result of the wafer image by the controller, for example, when the wafer 30 is damaged, the controller can send an alarm signal through the player, so that a user can know the condition of the wafer 30 being damaged in time.
Specifically, according to an embodiment of the present invention, the controller includes a counting unit and a processing unit, the counting unit is connected to the image capturing device and configured to count the wafers in the wafer boat 20 according to the wafer images captured by the image capturing device and acquire the distance between the adjacent wafers 30 according to the counting time interval, the processing unit is connected to the counting unit and configured to calculate the distance between the adjacent wafers 30 according to the time interval between two adjacent counts of the counting unit, and the processing unit determines whether the wafer 30 is damaged according to the number of the wafers 30 and the distance between the adjacent wafers 30.
Specifically, according to an embodiment of the present invention, the front end of the robot 60 is provided with a light emitting sensor and a receiving sensor corresponding to the light emitting sensor, before the wafer 30 is picked from the wafer boat 20, the robot 60 is used to scan all the wafers 30 from top to bottom, and the arrangement of the wafers 30 in the wafer boat 20 is sensed by the light emitting sensor and the receiving sensor while scanning, so as to further confirm whether the wafers 30 in the wafer boat 20 have the phenomena of lamination, cracking or falling off.
Specifically, according to an embodiment of the present invention, the image capturing device includes at least two cameras, the at least two cameras are respectively disposed on two sides of the boat 20, and the camera heights of the at least two cameras are not lower than the height of the boat 20, for example, the at least two cameras include a first camera 41 and a second camera 42, the first camera 41 and the second camera 42 are respectively disposed on two opposite sides of the boat 20, so that the at least two cameras can capture the whole image of the wafer 30, and the controller can determine whether the wafer 30 is damaged according to the whole image of the wafer 30.
Further, since the interior of the semiconductor processing apparatus 100 is generally a high-temperature environment, in order to reduce the risk of the image pickup device being damaged in the high-temperature environment, the semiconductor processing apparatus 100 according to the embodiment of the present invention further includes a cooling cover, the cooling cover is disposed outside the image pickup device and is used for cooling the image pickup device, so as to reduce the risk of the image pickup device being burned out in the high-temperature environment, the cooling cover is a transparent cover body made of a high-temperature resistant material, and the cooling cover is communicated with the vacuum pumping device, so that air and water vapor in the cooling cover are pumped by the vacuum pumping device, so as to reduce influence of the air and water vapor in the cooling cover on the shooting definition of the image pickup device.
The present application further provides a semiconductor process monitoring method, which is described in detail below with reference to fig. 1 with reference to fig. 2, and includes:
a standard image of the wafer 30 is pre-stored before the wafer 30 is placed in the semiconductor processing apparatus 100, and specifically, the wafer 30 is stored in a cassette of a storage chamber before being placed in the semiconductor processing apparatus 100, and when it is required to process the wafer 30, the wafer 30 is placed in the semiconductor processing apparatus 100 by the robot arm 60 in the vacuum chamber 50. When the number and arrangement of the wafers 30 in the wafer cassette are the same, the standard image of the wafer 30 is the standard image of the wafer 30 in the wafer cassette, and the pitch between the multi-layered wafers 30 and the shape and state of the multi-layered wafers 30 can be obtained from the standard image of the wafer 30.
Before the wafer 30 is placed in the semiconductor processing apparatus 100 for processing, the camera device captures a second wafer image, and the second wafer image is used to determine whether the wafer 30 in the boat 20 is damaged, specifically, the second wafer image is compared with a standard image of the wafer 30, so as to determine whether the wafer 30 is damaged during the transmission process, and when the wafer 30 is damaged, the player sends an alarm signal.
After the semiconductor processing equipment 100 processes the wafers 30 in the wafer boat 20, the camera device captures a first wafer image, and the first wafer image is used to determine whether the wafers 30 in the wafer boat 20 are damaged, specifically, the first wafer image is compared with a standard image of the wafers 30 to determine whether the wafers 30 are damaged during the processing process, when the wafers 30 are damaged, the player sends an alarm signal, and the robot arm 60 is controlled to stop grabbing the wafers 30 in the wafer boat 20, so as to reduce accidents occurring during the grabbing of the damaged wafers 30 by the robot arm 60, and when the wafers 30 are not damaged, the robot arm 60 is controlled to take the wafers 30 in the wafer boat 20 out of the semiconductor processing equipment 100.
It should be noted that the semiconductor processing apparatus 100 and the process monitoring method thereof according to the embodiment of the present application can be applied to semiconductor devices, displays, memories, processors, and semiconductor apparatuses.
The embodiments of the present disclosure have been described above. However, these examples are for illustrative purposes only and are not intended to limit the scope of the present disclosure. Those skilled in the art can also devise methods that are not exactly the same as those described above in order to achieve the same objectives. The scope of the disclosure is defined by the appended claims and equivalents thereof. Various alternatives and modifications can be devised by those skilled in the art without departing from the scope of the present disclosure, and such alternatives and modifications are intended to be within the scope of the present disclosure.
Claims (9)
1. A semiconductor processing apparatus, comprising:
the loading platform is used for loading a wafer boat containing wafers;
the camera device is arranged in the semiconductor processing equipment, and a camera area covers the wafer boat and is used for shooting a wafer image;
the controller is electrically connected with the camera device and is used for receiving and analyzing the wafer image shot by the camera device and controlling the semiconductor processing equipment to take counter measures.
2. The semiconductor processing equipment according to claim 1, wherein the camera device comprises at least two cameras, the at least two cameras are respectively arranged at two sides of the wafer boat, and the camera heights of the at least two cameras are not lower than the height of the wafer boat.
3. The semiconductor processing apparatus of claim 1, wherein the semiconductor processing apparatus comprises a diffusion processing chamber, the loading station being disposed within the diffusion processing chamber.
4. The semiconductor processing apparatus of claim 3, further comprising a vacuum chamber in communication with the diffusion processing chamber, the semiconductor processing apparatus further comprising a robot arm disposed within the vacuum chamber, the robot arm configured to grasp the wafers in the wafer boat.
5. The semiconductor processing apparatus of claim 1, further comprising a player electrically connected to the controller for playing the results of the analysis of the wafer image by the controller.
6. The semiconductor processing apparatus according to claim 1, further comprising a cooling jacket disposed outside the imaging device for cooling the imaging device.
7. A semiconductor process monitoring method, comprising:
pre-storing a standard image of a wafer before the wafer is placed in semiconductor processing equipment;
after the semiconductor processing equipment processes the wafers in the wafer boat, shooting a first wafer image through a camera device;
judging whether the wafers in the wafer boat are damaged or not by comparing the first wafer image with the standard image;
and when the wafer is damaged, sending an alarm signal through the player.
8. The semiconductor process monitoring method of claim 7, wherein the step of sending an alarm signal by the player when the wafer is broken further comprises:
and controlling the mechanical arm to stop grabbing the wafers in the wafer boat.
9. The semiconductor process monitoring method of claim 7, further comprising:
before the wafer is placed in the semiconductor processing equipment for processing, shooting a second wafer image through the camera device;
and judging whether the wafers in the wafer boat are damaged before processing according to the comparison result of the second wafer image and the standard image.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011436731.2A CN114628273A (en) | 2020-12-11 | 2020-12-11 | Semiconductor processing equipment and semiconductor processing monitoring method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011436731.2A CN114628273A (en) | 2020-12-11 | 2020-12-11 | Semiconductor processing equipment and semiconductor processing monitoring method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN114628273A true CN114628273A (en) | 2022-06-14 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202011436731.2A Pending CN114628273A (en) | 2020-12-11 | 2020-12-11 | Semiconductor processing equipment and semiconductor processing monitoring method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN114628273A (en) |
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2020
- 2020-12-11 CN CN202011436731.2A patent/CN114628273A/en active Pending
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