KR102448443B1 - Substrate processing method, substrate processing apparatus and substrate processing system - Google Patents

Abstract

The camera 70 acquires a captured image by continuously imaging the nozzle 30 which moves within processing section PS1. The reference image registration unit 90 stores first and second reference images RP1 and RP2 obtained by imaging the nozzles 30 in the first stage TE1 and the second stage TE2 of the processing section PS1. Register. With respect to the real image GP obtained by imaging the nozzle 30 moving in the processing section PS1 with a camera, the position shift detection part 91 is based on a predetermined determination rule, The said 1st stage and the said 2nd stage An image determination unit 910 that determines whether or not the image corresponds to each image, the first and second reference images RP1 and RP2, and the image determination unit 910 respectively and an image comparison unit 912 that compares the real image GP determined to be corresponding.

Description

Substrate processing method, substrate processing apparatus and substrate processing system

BACKGROUND OF THE INVENTION Field of the Invention The present invention relates to a technique for processing a substrate by discharging a processing liquid from a nozzle moving on the substrate, and more particularly to a technique for detecting displacement of a nozzle. The substrate to be treated includes, for example, a semiconductor substrate, a substrate for a flat panel display (FPD) such as a liquid crystal display device and an organic EL (Electroluminescence) display device, a substrate for an optical disk, a substrate for a magnetic disk, a substrate for a magneto-optical disk A substrate, a substrate for a photomask, a ceramic substrate, a substrate for a solar cell, a printed circuit board, and the like are included.

In the manufacturing process of a semiconductor device etc., substrate processing, such as a washing process and a resist coating process, is performed by supplying various processing liquids, such as pure water, a photoresist liquid, and an etching liquid, with respect to a board|substrate. As an apparatus for performing liquid processing using these processing liquids, a substrate processing apparatus that discharges the processing liquid from a nozzle to the surface of the substrate while rotating the substrate is sometimes used.

Patent Document 1 discloses a technique for detecting whether or not the nozzle is normally disposed at the treatment position in detecting whether the treatment liquid is discharged from the nozzle disposed at the treatment position.

Specifically, a reference image when the nozzle is precisely in the processing position is acquired in advance, and the image obtained when the nozzle is moved to the processing position for each recipe is compared with the previously acquired reference image. It is described that the nozzle is determined to be positional abnormal when the deviation from the processing position exceeds a predetermined threshold.

Japanese Laid-Open Patent Publication No. 2015-173148

However, in the case of the prior art, it was difficult to determine the position abnormality of the moving nozzle. In the case of the prior art, a positional abnormality in one reference image and one processing position is detected. The surface of the substrate may be liquid-treated by moving it on the substrate while discharging the processing liquid from the nozzle. At this time, the technique of detecting whether a nozzle is moving correctly in a predetermined|prescribed process section is desired.

However, when a moving nozzle is imaged, the shape and size change moment by moment on the image while the first position and the last position are moved. Therefore, when the image of the nozzle at a certain specific position is used as the reference image and the moving nozzle is matched with the captured image, since the shape of the nozzle changes on the image, the matching accuracy is lowered. For this reason, it was difficult to perform positional abnormality determination with high precision.

An object of the present invention is to provide a technique for detecting position shift of a moving nozzle with high accuracy.

In order to solve the above problem, a first aspect is a substrate processing method for processing a substrate, comprising the steps of (a) moving a nozzle within a predetermined processing section extending in the horizontal direction, (b) in the step (a) and (c) capturing the captured images obtained when the nozzles are at the first and second ends that are both ends of the processing section in the step (b). registering as first and second reference images; (d) moving the nozzle within the processing section; and (e) imaging the nozzle moving in the processing section by the step (d). and (f) image judgment for judging whether the plurality of captured images obtained by the step (e) are images corresponding to each of the first stage and the second stage, based on a predetermined decision rule; step (g) comparing the first and second reference images with the first and second real images determined to correspond to the first and second stages respectively by the step (f); In the step (d), a step of detecting a position shift of the nozzles disposed at both ends of the processing section is included.

A 2nd aspect is the substrate processing method of a 1st aspect, Comprising: (h) after the said process (c), and before the said process (d), it further includes the process of holding the board|substrate to be processed by the board|substrate holding part.

A third aspect is the substrate processing method of the first aspect or the second aspect, wherein the step (d) includes: (d1) moving the nozzle from a position near the first end toward the second end and the step (f) includes a step of (f1) determining whether the image corresponds to each of the first stage and the second stage based on the difference between the successive captured images.

A fourth aspect is the substrate processing method according to any one of the first to third aspects, wherein the step (c) includes: (c1) the nozzle moving in the middle of the processing section in the step (b) is imaged and registering an intermediate reference image obtained by performing the step (g), wherein the step (g) is obtained by imaging (g1) the intermediate reference image and the nozzle moving in the middle of the processing section in the step (e). and a step of detecting a position shift of the nozzle moving in the middle of the processing section in the step (d) based on the comparison of the intermediate real image.

A fifth aspect is the substrate processing method of the fourth aspect, wherein the step (g) includes (g2) detecting a displacement of the nozzle in a vertical direction based on the intermediate reference image and the intermediate real image. process includes.

A sixth aspect is the substrate processing method according to the fourth or fifth aspect, wherein (i) a trajectory of the nozzle moving in the processing section from a plurality of the intermediate reference images registered in the step (c1) is shown. Further comprising a step of generating reference trajectory information, wherein the step (g) includes: (g3) a step of detecting a displacement of the nozzle in a vertical direction based on the intermediate real image and the reference trajectory information includes

A seventh aspect is the substrate processing method according to any one of the fourth to sixth aspects, wherein the step (c1) includes: (c11) the nozzle moving in the middle of the processing section in the step (b) is imaged a step of registering one of the plurality of captured images obtained as a first intermediate reference image; and (c12) an image following the first intermediate reference image among the plurality of photographed images after the step (c11), and a step of registering, as a second intermediate reference image, a captured image whose degree of matching with one intermediate reference image is equal to or less than a predetermined threshold.

An eighth aspect is the substrate processing method according to any one of the first to seventh aspects, wherein the step (a) includes: (a1) a control signal for a control unit to move the nozzle from the first stage to the second stage is transmitted to the nozzle moving unit, and the step (b) includes the step of (b1) capturing the nozzle in response to transmission of the control signal to acquire a plurality of captured images.

A ninth aspect is the substrate processing method of the eighth aspect, wherein the step (b) comprises: (b2) causing control information indicated by the control signal to correspond to a plurality of captured images acquired by imaging according to the control signal; It further includes the process of recording.

A tenth aspect is the substrate processing method of the ninth aspect, wherein the step (c) includes (c2) a step of continuously displaying a series of captured images obtained by the step (b) on a display unit in the order in which they were acquired and the step (c2) includes: (c21) specifying the control information; and (c22) displaying a captured image corresponding to the control information specified by the step (c21) on the display unit. .

An eleventh aspect is a substrate processing apparatus for processing a substrate, comprising: a substrate holding unit for holding a substrate in a horizontal posture; a nozzle for supplying a processing liquid to a substrate held by the substrate holding unit; and a horizontal direction extending the nozzle a nozzle moving unit for moving within a predetermined processing section, a camera for acquiring a captured image by imaging the nozzle moving within the processing section, and the nozzles at first and second ends that are both ends of the processing section a reference image registration unit for registering first and second reference images obtained by the camera imaging of The position shift detection unit determines whether a real image obtained by imaging the nozzle moving in the processing section with the camera is an image corresponding to each of the first stage and the second stage based on a predetermined determination rule comparing the first and second reference images with the first and second real images determined to correspond to the first and second stages respectively by the image determining unit; An image comparison unit is provided.

A twelfth aspect is the substrate processing apparatus of the eleventh aspect, wherein the image determination unit comprises: a feature vector calculation unit for extracting a plurality of types of feature vectors from each of the plurality of captured images; , a classifier for classifying each of the plurality of captured images into classes corresponding to different positions of the nozzles, wherein the plurality of classes include classes corresponding to each of the first stage and the second stage.

A thirteenth aspect is a substrate processing system including a substrate processing apparatus for processing a substrate and a server for performing data communication with the substrate processing apparatus, the substrate processing apparatus comprising: a substrate holding unit for holding a substrate in a horizontal position; A nozzle for supplying a processing liquid to the substrate held by the substrate holding unit, a nozzle moving unit for moving the nozzle within a predetermined processing section extending in the horizontal direction, and the nozzle moving in the processing section are photographed by imaging A camera for acquiring an image; and a position shift detection unit configured to detect position shift of the nozzle in the second stage, and a communication unit configured to perform data communication with the server, wherein the position shift detection unit detects the nozzle moving in the processing section. an image determination unit that determines whether a real image obtained by imaging with a camera is an image corresponding to each of the first stage and the second stage, based on a predetermined determination rule, and the first and second stages; an image comparison unit for comparing a reference image with first and second real images determined to correspond to each of the first stage and the second stage by the image determination unit; , a feature vector calculating unit for extracting a plurality of types of feature vectors, and a classifier for classifying the plurality of captured images into a plurality of classes corresponding to different positions of the nozzles based on the plurality of types of feature vectors, The plurality of classes includes classes of images corresponding to each of the first stage and the second stage, and the server uses the plurality of captured images taught in any one of the plurality of classes as teacher data. A machine learning unit generating the classifier by machine learning is provided, wherein the classifier is provided from the server to the substrate processing apparatus.

According to the substrate processing method of a 1st aspect, the shift|offset|difference of the movement range of the nozzle in a processing section can be detected.

According to the substrate processing method of a 2nd aspect, when processing a board|substrate, the shift|offset|difference of the movement range of a nozzle can be detected.

According to the substrate processing method of the third aspect, by taking the difference between successive captured images, it can be detected that the nozzle is stopped at the first end and the second end of the processing section. Thereby, it is possible to easily specify the real image corresponding to the first end and the second end of the processing section.

According to the substrate processing method of a 4th aspect, the position shift of the nozzle which moves in the middle of a processing section can be detected.

According to the substrate processing method of a 5th aspect, a position shift in a vertical direction can be detected.

According to the substrate processing method of the sixth aspect, it is possible to detect the displacement of the nozzle in the vertical direction from the reference trajectory information.

According to the substrate processing method of the seventh aspect, it is possible to automatically register an intermediate reference image. For this reason, it is possible to efficiently register a large number of reference images.

According to the substrate processing method of the eighth aspect, imaging of the nozzle is performed according to a control signal for moving the nozzle. For this reason, it is possible to automatically acquire a reference image indicating a reference position of a moving nozzle.

According to the substrate processing method of the ninth aspect, it is possible to easily find a target captured image by designating control information.

According to the substrate processing method of the tenth aspect, when there are a plurality of control signals and a series of reference images corresponding to each control signal, the target reference image can be displayed on the display unit by designating the control information. Thereby, the operator can efficiently designate a reference image to be registered among a plurality of captured images.

According to the substrate processing apparatus of the 11th aspect, the shift|offset|difference of the movement range of the nozzle in a process section can be detected.

According to the substrate processing apparatus of the twelfth aspect, the real image corresponding to each of the first stage and the second stage of the processing section PS1 can be specified by the classifier.

According to the substrate processing system of a thirteenth aspect, the shift|offset|difference of the movement range of the nozzle in a processing section can be detected. Further, the real image corresponding to each of the first and second stages of the processing section PS1 can be specified by a classifier provided from the server.

1 : is a figure which shows the whole structure of the substrate processing apparatus 100 of 1st Embodiment.
2 is a plan view of the cleaning processing unit 1 of the first embodiment.
3 is a longitudinal sectional view of the cleaning processing unit 1 of the first embodiment.
4 : is a figure which shows the positional relationship of the camera 70 and the nozzle 30. As shown in FIG.
5 is a block diagram of the camera 70 and the control unit 9 .
6 : is a flowchart which shows the procedure of the preliminary preparation for the detection process by the position shift detection part 91. As shown in FIG.
7 : is a flowchart which shows the procedure of the detection process by the position shift detection part 91. As shown in FIG.
8 : is a figure which shows an example of the image obtained by the camera 70 imaging the imaging area|region PA containing the front-end|tip of the nozzle 30 in processing section PS1.
9 is a diagram conceptually illustrating a registration process of the reference image RP.
FIG. 10 is a diagram conceptually illustrating a state in which the real image GP corresponding to the reference image RP is specified.
11 is a diagram conceptually illustrating reference trajectory information ST1.
12 : is a time chart which shows a mode that the nozzle 30 is imaged continuously.
Fig. 13 is a diagram showing a registration screen W1 for registering the reference image RP.
14 : is a figure which shows the control part 9A of 2nd Embodiment.
15 is a diagram conceptually illustrating the classifier K2.

EMBODIMENT OF THE INVENTION Hereinafter, embodiment of this invention is described, referring an accompanying drawing. In addition, the component described in this embodiment is an illustration to the last, and it is not the meaning of limiting the scope of the present invention only to them. In the drawings, in some cases, the dimensions and numbers of each part are exaggerated or simplified as necessary for easy understanding.

Expressions indicating that they are in an equivalent state (for example, "same", "equivalent", "homogeneous", etc.), unless otherwise specified, not only indicate a quantitatively and strictly equivalent state, but also have tolerances or differences in which the same degree of function is obtained. It shall also indicate the state of In addition, unless otherwise indicated, the "image of to" includes cases where two elements are in contact with each other, as well as cases in which two elements are separated from each other.

<1. First embodiment>

1 : is a figure which shows the whole structure of the substrate processing apparatus 100 of 1st Embodiment. The substrate processing apparatus 100 is a single-wafer processing apparatus which processes the board|substrate W which is a process object one by one. Here, the substrate processing apparatus 100 performs a drying process after washing|cleaning process using rinse liquids, such as a chemical|medical solution and pure water, with respect to the board|substrate W which is a circular thin-plate-shaped silicon substrate. As the chemical solution, for example, SC1 (ammonia-hydrogen peroxide mixture: ammonia hydrogen peroxide solution), SC2 (hydrochloric hydrogen peroxide mixed water solution: hydrochloric acid hydrogen peroxide mixed aqueous solution), DHF solution (dilute hydrofluoric acid), etc. are used. In the following description, the term "processing liquid" refers to a chemical liquid and a rinse liquid as a generic term. In addition to the cleaning process, a coating liquid such as a photoresist liquid for a film forming process, a chemical liquid for removing an unnecessary film, a chemical liquid for etching, and the like are included in the "processing liquid".

The substrate processing apparatus 100 includes a plurality of cleaning processing units 1 , an indexer 102 , and a main transport robot 103 .

The indexer 102 conveys the processing target substrate W received from outside the apparatus into the apparatus, and carries out the processed substrate W on which the cleaning process has been completed to the outside of the apparatus. The indexer 102 is equipped with a transfer robot (not shown) while mounting a plurality of carriers (not shown). As the carrier, a FOUP (Front Opening Unified Pod) or SMIF (Standard Mechanical InterFace) pod that accommodates the substrate W in an enclosed space, or an OC (Open Cassette) that exposes the substrate W to the outside air may be employed. . The transfer robot transfers the substrate W between the carrier and the main transfer robot 103 .

The cleaning processing unit 1 performs liquid processing and drying processing on one substrate W. In the substrate processing apparatus 100 , 12 cleaning processing units 1 are arranged. Specifically, four towers each including three washing processing units 1 stacked in the vertical direction are arranged so as to surround the periphery of the main transport robot 103 . In Fig. 1, one of the washing processing units 1 stacked in three stages is schematically shown. In addition, the quantity of the washing|cleaning processing unit 1 in the substrate processing apparatus 100 is not limited to 12 pieces, You may change suitably.

The main transport robot 103 is installed in the center of four towers on which the washing processing units 1 are stacked. The main transport robot 103 carries the substrate W to be processed received from the indexer 102 into each cleaning processing unit 1 . In addition, the main transport robot 103 transports the processed substrate W from each cleaning processing unit 1 and delivers it to the indexer 102 .

Hereinafter, it will be described as one of the 12 cleaning processing units 1 mounted in the substrate processing apparatus 100, but also for the other cleaning processing units 1, except that the arrangement relationship of the nozzles 30, 60, 65 is different, have the same configuration. 2 is a plan view of the cleaning processing unit 1 of the first embodiment. 3 is a longitudinal sectional view of the cleaning processing unit 1 of the first embodiment. FIG. 2 shows a state in which the substrate W is not held by the spin chuck 20 , and FIG. 3 shows a state in which the substrate W is held by the spin chuck 20 .

The cleaning processing unit 1 includes, in the chamber 10 , a spin chuck 20 for holding the substrate W in a horizontal posture (a posture in which the normal line of the surface of the substrate W follows a vertical direction), and a spin chuck ( three nozzles 30 , 60 , 65 for supplying a processing liquid to the upper surface of the substrate W held by 20 , a processing cup 40 surrounding the spin chuck 20 , and a spin chuck ( 20) The camera 70 which images the upper space is provided. Further, around the processing cup 40 in the chamber 10 , a partition plate 15 dividing the inner space of the chamber 10 up and down is formed.

The chamber 10 has a side wall 11 that surrounds all directions along the vertical direction, a ceiling wall 12 that blocks the upper side of the side wall 11, and a floor wall 13 that blocks the lower side of the side wall 11 . ) is provided. A space surrounded by the side wall 11 , the ceiling wall 12 , and the floor wall 13 becomes a processing space for the substrate W . In addition, in a part of the side wall 11 of the chamber 10, a carry-out port for the main transfer robot 103 to carry the substrate W into and out of the chamber 10 and a shutter for opening and closing the carrying-out port are formed. (all omitted).

On the ceiling wall 12 of the chamber 10 , a fan filter unit (FFU) 14 for further purifying air in the clean room in which the substrate processing apparatus 100 is installed and supplying it to the processing space in the chamber 10 . this is fitted The FFU 14 is equipped with a fan and a filter (for example, a HEPA filter) for introducing the air in the clean room into the chamber 10 . The FFU 14 forms a downflow of clean air in the processing space within the chamber 10 . In order to uniformly disperse the clean air supplied from the FFU 14 , a punching plate formed by punching a large number of blowing holes may be formed just below the ceiling wall 12 .

The spin chuck 20 includes a spin base 21 , a spin motor 22 , a cover member 23 , and a rotation shaft 24 . The spin base 21 has a disk shape and is being fixed to an upper end of a rotation shaft 24 extending in the vertical direction in a horizontal posture. The spin motor 22 is provided below the spin base 21 and rotates the rotating shaft 24 . The spin motor 22 rotates the spin base 21 in a horizontal plane via a rotation shaft 24 . The cover member 23 has a cylinder surrounding the spin motor 22 and the rotation shaft 24 .

The outer diameter of the disk-shaped spin base 21 is slightly larger than the diameter of the circular substrate W held by the spin chuck 20 . Accordingly, the spin base 21 has a holding surface 21a opposite to the entire surface of the lower surface of the substrate W to be held.

A plurality of (four in this embodiment) chuck pins 26 are formed upright on the peripheral edge of the holding surface 21a of the spin base 21 . The plurality of chuck pins 26 are arranged at equal intervals along the circumference corresponding to the outer diameter of the outer circumferential circle of the circular substrate W. As shown in FIG. In the present embodiment, four chuck pins 26 are formed at intervals of 90°. The plurality of chuck pins 26 are driven in association with a link mechanism (not shown) accommodated in the spin base 21 . The spin chuck 20 holds the substrate W by bringing each of the plurality of chuck pins 26 into contact with the outer peripheral end of the substrate W, thereby holding the substrate W from above the spin base 21 . It maintains in a horizontal attitude|position close to the holding surface 21a (refer FIG. 3). In addition, the spin chuck 20 releases the grip of the substrate W by separating each of the plurality of chuck pins 26 from the outer peripheral end of the substrate W .

The lower end of the cover member 23 covering the spin motor 22 is fixed to the floor wall 13 of the chamber 10 , and the upper end reaches just below the spin base 21 . At the upper end of the cover member 23, a flange-like member 25 that extends substantially horizontally outward from the cover member 23 and is bent downwardly is formed. In a state where the spin chuck 20 holds the substrate W by gripping by the plurality of chuck pins 26 , the spin motor 22 rotates the rotation shaft 24 , thereby passing the center of the substrate W It is possible to rotate the substrate W about the rotation axis CX along the vertical direction. Further, the driving of the spin motor 22 is controlled by the control unit 9 .

The nozzle 30 is configured by attaching a discharge head 31 to the tip of the nozzle arm 32 . The proximal end side of the nozzle arm 32 is fixed to the nozzle base 33 and is connected. It is rotatable around the axis along the vertical direction by the motor 332 (nozzle moving part) provided in the nozzle base 33. As shown in FIG.

As the nozzle base 33 rotates, as indicated by arrow AR34 in FIG. 2 , the nozzle 30 moves horizontally between the position above the spin chuck 20 and the standby position outside the processing cup 40 . move in a circular arc. By rotation of the nozzle base 33 , the nozzle 30 swings above the holding surface 21a of the spin base 21 . Specifically, above the spin base 21, the predetermined processing section PS1 extending in the horizontal direction is moved. In addition, moving the nozzle 30 within the processing section PS1 has the same meaning as moving the distal discharge head 31 within the processing section PS1.

The nozzle 30 is configured to supply a plurality of types of processing liquids (including at least pure water), and the plurality of types of processing liquids can be discharged from the discharge head 31 . In addition, a plurality of discharge heads 31 may be provided at the tip of the nozzle 30 , and the same or different processing liquids may be individually discharged from each. The nozzle 30 (specifically, the discharge head 31 ) discharges the processing liquid while moving the processing section PS1 extending in an arc shape in the horizontal direction. The processing liquid discharged from the nozzle 30 lands on the upper surface of the substrate W held by the spin chuck 20 .

In the washing processing unit 1 of this embodiment, in addition to the said nozzle 30, two nozzles 60 and 65 are provided. The nozzles 60 and 65 of the present embodiment have the same configuration as the nozzle 30 described above. That is, the nozzle 60 is configured by attaching a discharge head to the tip of the nozzle arm 62 , and is a spin chuck, as indicated by arrow AR64, by a nozzle base 63 connected to the proximal end side of the nozzle arm 62 . It moves in an arc shape between the upper processing position of (20) and the standby position outside the processing cup (40). Similarly, the nozzle 65 is configured by attaching a discharge head to the tip of the nozzle arm 67, and is rotated by a nozzle base 68 connected to the proximal end of the nozzle arm 67 as indicated by arrow AR69. It moves in an arc shape between the processing position above the chuck 20 and the standby position outside the processing cup 40 .

The nozzles 60 and 65 are also configured to supply a plurality of types of processing liquids including at least pure water, and the processing liquids are discharged to the upper surface of the substrate W held by the spin chuck 20 at the processing position. In addition, at least one of the nozzles 60 and 65 mixes a cleaning liquid such as pure water and a pressurized gas to generate droplets, and a two-fluid body that injects a mixed fluid of the droplets and the gas onto the substrate W A nozzle may be sufficient. Moreover, the number of nozzles provided in the washing|cleaning processing unit 1 is not limited to three, What is necessary is just one or more.

It is not essential to move each of the nozzles 30, 60, 65 in arc shape. For example, you may make a nozzle linearly move by providing a straight drive part.

A processing liquid nozzle 28 is formed on a lower surface along the vertical direction so as to be inserted through the inner side of the rotating shaft 24 . The upper end opening of the lower surface treatment liquid nozzle 28 is formed at a position opposite to the center of the lower surface of the substrate W held by the spin chuck 20 . A plurality of types of treatment liquids are also supplied to the lower surface treatment liquid nozzle 28 . The treatment liquid discharged from the lower surface treatment liquid nozzle 28 lands on the lower surface of the substrate W held by the spin chuck 20 .

The processing cup 40 surrounding the spin chuck 20 includes an inner cup 41 , a middle cup 42 , and an outer cup 43 that can be raised and lowered independently of each other. The inner cup 41 surrounds the spin chuck 20 and has a shape that is substantially rotationally symmetric with respect to a rotation axis CX passing through the center of the substrate W held by the spin chuck 20 . The inner cup 41 has an annular bottom portion 44 in plan view, a cylindrical inner wall portion 45 that rises upward from the inner peripheral edge of the bottom portion 44, and an outer peripheral edge of the bottom portion 44. A cylindrical outer wall portion 46 that rises upward, and a substrate that rises between the inner wall portion 45 and the outer wall portion 46, and is held at the center side (spin chuck 20) with the upper end forming a smooth arc. A first guide portion 47 extending obliquely upwardly in a direction approaching the rotation axis CX of W), and a cylindrical middle that stands up between the first guide portion 47 and the outer wall portion 46 . The wall portion 48 is integrally provided.

The inner wall portion 45 is formed with a length to be accommodated while maintaining an appropriate gap between the cover member 23 and the flange-like member 25 in the state in which the inner cup 41 is most raised. The middle wall portion 48 maintains an appropriate gap between the processing liquid separation wall 53 and the second guide portion 52 of the middle cup 42 , which will be described later, in a state where the inner cup 41 and the middle cup 42 are closest to each other. It is formed to a length that can be accommodated.

The first guide portion 47 has an upper end portion 47b extending obliquely upward on the center side (direction approaching the rotation axis CX of the substrate W) while drawing a smooth arc. Moreover, between the inner wall part 45 and the 1st guide part 47, it becomes the waste groove 49 for collecting and discarding the used processing liquid. Between the first guide part 47 and the middle wall part 48, an annular inner recovery groove 50 for collecting and recovering the used treatment liquid is formed. In addition, between the middle wall portion 48 and the outer wall portion 46 is an annular outer recovery groove 51 for collecting and recovering a treatment liquid different in kind from the inner recovery groove 50 .

An exhaust liquid mechanism (not shown) for discharging the processing liquid collected in the waste groove 49 and forcibly evacuating the inside of the waste groove 49 is connected to the waste groove 49 . Four exhaust liquid mechanisms are formed at equal intervals along the circumferential direction of the waste groove 49, for example. In addition, in the inner recovery groove 50 and the outer recovery groove 51 , the processing liquid collected in the inner recovery groove 50 and the outer recovery groove 51, respectively, is collected in a recovery tank formed outside the substrate processing apparatus 100 . A recovery mechanism (not shown in all) is connected. In addition, the bottom of the inner recovery groove 50 and the outer recovery groove 51 is inclined by a small angle with respect to the horizontal direction, and the recovery mechanism is connected to the lowest position. As a result, the processing liquid flowing into the inner recovery groove 50 and the outer recovery groove 51 is smoothly recovered.

The middle cup 42 surrounds the spin chuck 20 and has a shape that is substantially rotationally symmetric with respect to a rotation axis CX passing through the center of the substrate W held by the spin chuck 20 . The middle cup 42 has a second guide portion 52 and a cylindrical treatment liquid separation wall 53 connected to the second guide portion 52 .

The second guide portion 52 includes a lower end portion 52a coaxially cylindrical with the lower end portion of the first guide portion 47 on the outside of the first guide portion 47 of the inner cup 41, and a lower end portion 52a. Formed by folding the tip of the upper end portion 52b and the upper end portion 52b downward and extending obliquely upward from the center side (direction closer to the rotation axis CX of the substrate W) while drawing a smooth arc from the upper end of the It has a folding part 52c which becomes The lower end portion 52a is accommodated in the inner recovery groove 50 while maintaining an appropriate gap between the first guide portion 47 and the middle wall portion 48 in a state where the inner cup 41 and the middle cup 42 are closest to each other. . In addition, the upper end portion 52b is formed so as to overlap the upper end portion 47b of the first guide portion 47 of the inner cup 41 in the vertical direction, and in the state where the inner cup 41 and the middle cup 42 are closest to each other, 1 The guide portion 47 approaches the upper end portion 47b while keeping a very minute distance. In the state where the inner cup 41 and the middle cup 42 are closest to each other, the folded portion 52c horizontally overlaps the tip of the upper end portion 47b of the first guide portion 47 in the folded portion 52c.

The upper end part 52b of the 2nd guide part 52 is formed so that thickness may become thicker as it goes downward. The processing liquid separation wall 53 has a cylindrical shape formed so as to extend downward from the lower end outer peripheral edge of the upper end portion 52b. The treatment liquid separation wall 53 is accommodated in the outer recovery groove 51 while maintaining an appropriate gap between the middle wall portion 48 and the outer cup 43 in a state where the inner cup 41 and the middle cup 42 are closest to each other. .

The outer cup 43 has a shape that is substantially rotationally symmetric with respect to a rotation axis CX passing through the center of the substrate W held by the spin chuck 20 . The outer cup 43 surrounds the spin chuck 20 outside the second guide portion 52 of the middle cup 42 . This outer cup 43 has a function as a 3rd guide part. The outer cup 43 has a lower end 43a coaxially cylindrical with the lower end 52a of the second guide portion 52, and a center side (of the substrate W) while drawing a smooth arc from the upper end of the lower end portion 43a. It has an upper end part 43b extending obliquely upward (direction approaching rotation axis line CX), and a return part 43c formed by folding back the front-end|tip of the upper end part 43b downward.

The lower end portion 43a maintains an appropriate gap between the processing liquid separation wall 53 of the middle cup 42 and the outer wall portion 46 of the inner cup 41 in a state where the inner cup 41 and the outer cup 43 are closest to each other. And is accommodated in the outer recovery groove (51). The upper end portion 43b is formed to overlap the second guide portion 52 of the middle cup 42 in the vertical direction, and in a state where the middle cup 42 and the outer cup 43 are closest to each other, the second guide portion 52 With respect to the upper end portion 52b, it is closely spaced and kept very small. In the state in which the middle cup 42 and the outer cup 43 are closest to each other, the folding part 43c overlaps the folding part 52c of the second guide part 52 in the horizontal direction.

The inner cup 41, the middle cup 42, and the outer cup 43 can be raised and lowered independently of each other. That is, each of the inner cup 41 , the middle cup 42 , and the outer cup 43 is individually provided with a lifting mechanism (not shown), and is thereby independently raised and lowered. As such a raising/lowering mechanism, well-known various mechanisms, such as a ball screw mechanism and an air cylinder, can be employ|adopted, for example.

The partition plate 15 is formed so as to divide the inner space of the chamber 10 up and down around the processing cup 40 . The partition plate 15 may be one plate-shaped member which surrounds the processing cup 40, and may be what connected the some plate-shaped member. Moreover, the partition plate 15 may be provided with the through-hole or a notch which penetrates in the thickness direction, In this embodiment, for supporting the nozzle bases 33, 63, 68 of the nozzles 30, 60, 65. A through hole for passing through the support shaft is formed.

The outer peripheral end of the partition plate 15 is connected to the side wall 11 of the chamber 10 . Moreover, the edge part which surrounds the processing cup 40 of the partition plate 15 is formed so that it may become circular shape with a diameter larger than the outer diameter of the outer cup 43. As shown in FIG. Therefore, the partition plate 15 does not become an obstacle to raising/lowering of the outer cup 43.

Moreover, as a part of the side wall 11 of the chamber 10, the exhaust duct 18 is formed in the vicinity of the floor wall 13. As shown in FIG. The exhaust duct 18 is communicatingly connected to an exhaust mechanism (not shown). Of the clean air supplied from the FFU 14 and flowing in the chamber 10 , the air that has passed between the processing cup 40 and the partition plate 15 is discharged from the exhaust duct 18 to the outside of the apparatus.

4 : is a figure which shows the positional relationship of the camera 70 and the nozzle 30. As shown in FIG. The camera 70 is located in the chamber 10 and is provided above the partition plate 15 . The camera 70 is equipped with optical systems, such as a CCD which is one of solid-state imaging elements, and an electronic shutter, a lens, for example. The nozzle 30 is disposed above the processing section PS1 (a dotted line position in FIG. 4 ) and the processing cup 40 above the substrate W held by the spin chuck 20 by driving the nozzle base 33 . It reciprocates between the stand-by positions (solid line positions in FIG. 4) of the outside. The processing section PS1 is a section in which a cleaning process is performed by discharging a processing liquid from the nozzle 30 to the upper surface of the substrate W held by the spin chuck 20 . Here, the processing section PS1 extends from the first end TE1 near the edge of one side of the substrate W held by the spin chuck 20 to the second end near the edge of the opposite side ( It is a section extending in the horizontal direction up to TE2). The standby position is a position where the nozzle 30 stops discharging the processing liquid and waits when the cleaning process is not performed. At the standby position, a standby pod for accommodating the discharge head 31 of the nozzle 30 may be provided.

The camera 70 is provided at a position including, in other words, the vicinity of the discharge head 31 so that at least the tip of the nozzle 30 in the processing section PS1 is included in the imaging field of view. In this embodiment, as shown in FIG. 4, the camera 70 is provided in the position which images the nozzle 30 in process section PS1 from front upper direction. Therefore, the camera 70 can image the imaging area including the front-end|tip of the nozzle 30 in process section PS1. Similarly, the camera 70 can image the imaging area including the front-end|tip of the nozzles 60 and 65 in each processing section. In addition, when the camera 70 is installed at the position shown in FIG. 2 and FIG. 4, with respect to the nozzles 30 and 60, since it moves in the lateral direction within the imaging field of the camera 70, each processing section Although the movement in the vicinity can be appropriately imaged, since it moves in the depth direction within the imaging field of the camera 70 about the nozzle 65, there exists a possibility that the movement amount in the vicinity of a processing section cannot be imaged appropriately. In this case, you may provide the camera which images the nozzle 65 separately from the camera 70.

As shown in FIG. 3 , the lighting unit 71 is provided in the chamber 10 and at a position above the partition plate 15 . When the inside of the chamber 10 is a dark room, the control unit 9 controls the illumination unit 71 so that the illumination unit 71 irradiates light to the nozzles 30, 60, 65 in the vicinity of the processing position when the camera 70 performs imaging. ) can be controlled.

5 is a block diagram of the camera 70 and the control unit 9 . The configuration as hardware of the control unit 9 formed in the substrate processing apparatus 100 is the same as that of a general computer. That is, the control unit 9 includes a CPU that performs various arithmetic processing, a ROM that is a read/output memory that stores basic programs, a RAM that is a freely read/write memory that stores various types of information, and software and data for control. A magnetic disk or the like to be stored is provided. When the CPU of the control unit 9 executes a predetermined processing program, each operation mechanism of the substrate processing apparatus 100 is controlled by the control unit 9 , and the processing in the substrate processing apparatus 100 proceeds.

The reference image registration unit 90 , the position shift detection unit 91 , and the command transmission unit 92 shown in FIG. 5 are function processing units realized in the control unit 9 when the CPU of the control unit 9 executes a predetermined processing program.

The reference image registration unit 90 registers a photographed image obtained by imaging the nozzle 30 at a correct position as the reference image RP. The position shift detection part 91 detects the position shift of the vertical direction or the horizontal direction of the nozzle 30 in the judgment position which is the position of a judgment object. It includes an image determination unit 910 and an image comparison unit 912 . The image determination unit 910 determines a position shift of the nozzle 30 with respect to the real image GP obtained by photographing the nozzle 30 that is the determination target based on a predetermined determination rule. It is determined whether the image is in the first stage TE1 and the second stage TE2). The predetermined judgment rule will be described in detail later. The image comparison unit 912 performs pattern matching processing for comparing the real image GP determined to be in the determination position by the image determination unit 910 with a reference image RP indicating the correct nozzle 30 position. Conduct. This pattern matching process will also be described in detail later.

The command transmission unit 92 operates each element of the cleaning processing unit 1 by outputting a command (control information) according to a recipe in which various conditions for processing the substrate W are described. Specifically, the command transmission unit 92 outputs a command to the nozzles 30 , 60 , 65 , and operates a drive source (motor) incorporated in the nozzle bases 33 , 63 , 68 . For example, when the command transmission unit 92 transmits a command to move the nozzle 30 to the first stage TE1 of the processing section PS1, the nozzle 30 moves from the standby position to the first stage TE1. move to Further, when the command transmission unit 92 transmits a command for moving the nozzle 30 to the second stage TE2 of the processing section PS1, the nozzle 30 moves from the first stage TE1 to the second stage ( Move to TE2). The discharge of the processing liquid from the nozzle 30 may also be performed in accordance with the command transmission from the command transmission unit 92 .

The control part 9 is comprised by the said RAM or a magnetic disk, and is provided with the memory|storage part 94 which memorize|stores the data of the image picked up by the camera 70, an input value, etc. A display unit 95 and an input unit 96 are connected to the control unit 9 . The display unit 95 displays various types of information according to the image signal from the control unit 9 . The input unit 96 is constituted by input devices such as a keyboard and a mouse connected to the control unit 9 , and receives an input operation performed by the operator with respect to the control unit 9 .

<Operation Description>

In the normal processing of the substrate W in the substrate processing apparatus 100 , the main transport robot 103 sequentially transfers the processing target substrate W received from the indexer 102 to each cleaning processing unit 1 . ), a step in which the cleaning processing unit 1 performs a cleaning treatment on the substrate W, and the main transport robot 103 unloads the processed substrate W from the cleaning processing unit 1 and returning to the indexer 102 . An outline of a typical cleaning treatment procedure of the substrate W in each cleaning treatment unit 1 is to supply a chemical solution to the surface of the substrate W to perform a predetermined chemical treatment, then supply pure water to perform a pure water rinse treatment The pure water is shaken off by rotating the board|substrate W at high speed after that, and, thereby, the board|substrate W is dried.

When the cleaning processing unit 1 processes the substrate W, the processing cup 40 raises and lowers the substrate W while holding the substrate W on the spin chuck 20 . When the washing processing unit 1 performs the chemical treatment, for example, only the outer cup 43 rises, and the upper end 43b of the outer cup 43 and the upper end of the second guide 52 of the middle cup 42 ( 52b), an opening surrounding the periphery of the substrate W held by the spin chuck 20 is formed. In this state, the substrate W is rotated together with the spin chuck 20 , and chemical liquid is supplied to the upper and lower surfaces of the substrate W from the nozzle 30 and the lower surface treatment liquid nozzle 28 . The supplied chemical flows along the upper and lower surfaces of the substrate W by the centrifugal force caused by the rotation of the substrate W, and eventually scatters laterally from the end edge of the substrate W. Thereby, the chemical|medical solution process of the board|substrate W advances. The chemical liquid scattered from the edge of the rotating substrate W is received by the upper end 43b of the outer cup 43 , flows down along the inner surface of the outer cup 43 , and is collected in the outer recovery groove 51 . .

When the cleaning processing unit 1 performs the pure water rinse treatment, for example, the inner cup 41 , the middle cup 42 , and the outer cup 43 all rise and the substrate W held by the spin chuck 20 . is surrounded by the first guide portion 47 of the inner cup 41 . In this state, the substrate W is rotated together with the spin chuck 20 , and pure water is supplied to the upper and lower surfaces of the substrate W from the nozzle 30 and the lower surface treatment liquid nozzle 28 . The supplied pure water flows along the upper and lower surfaces of the substrate W by the centrifugal force caused by the rotation of the substrate W, and eventually scatters from the edge of the substrate W laterally. Thereby, the pure water rinse process of the board|substrate W advances. The pure water scattered from the edge portion of the rotating substrate W flows down along the inner wall of the first guide portion 47 , and is discharged from the waste groove 49 . In addition, when the pure water is recovered by a path different from that of the chemical solution, the middle cup 42 and the outer cup 43 are raised, and the upper end portion 52b of the second guide portion 52 of the middle cup 42 and the inner cup 41 . You may make it form the opening surrounding the periphery of the board|substrate W held by the spin chuck 20 between the upper end part 47b of the 1st guide part 47 of FIG.

When the washing processing unit 1 shakes off water to perform the drying treatment, all of the inner cup 41 , the middle cup 42 , and the outer cup 43 are lowered, and the upper end of the first guide portion 47 of the inner cup 41 is lowered. 47b, the upper end 52b of the second guide portion 52 of the middle cup 42, and the upper end 43b of the outer cup 43 are all located below the substrate W held by the spin chuck 20 . In this state, the substrate W is rotated at a high speed together with the spin chuck 20, water droplets adhering to the substrate W are removed by centrifugal force, and drying treatment is performed.

In the present embodiment, when the processing liquid is discharged from the nozzle 30 to the upper surface of the substrate W, the camera 70 images the nozzle 30 moving the processing section PS1. And the position shift detection part 91 detects the position shift of the nozzle 30 by comparing the series of captured images obtained by imaging with the reference image acquired previously. Hereinafter, the technique will be described in detail. In addition, although the technique which detects the position shift of the nozzle 30 is demonstrated below, it is applicable also to the other nozzles 60 and 65. As shown in FIG.

6 : is a flowchart which shows the procedure of the preliminary preparation for the detection process by the position shift detection part 91. As shown in FIG. 7 : is a flowchart which shows the procedure of the detection process by the position shift detection part 91. As shown in FIG. FIG. 6 shows a procedure of preliminary preparation for the position shift detection process, and FIG. 7 shows a sequence of determination processing performed when the substrate W to be processed is loaded into the cleaning processing unit 1 . The preliminary preparation which shows the procedure in FIG. 6 is performed prior to the processing process of the board|substrate W used as an actual processing object, and may be implemented at the time of the start of the substrate processing apparatus 100, or a maintenance operation, for example.

First, when teaching the nozzle 30, the nozzle 30 is moved to the teaching position (step S11). Teaching is an operation in which the nozzle 30 is taught an appropriate operation, and the stop position of the nozzle 30 in the processing section PS1 is corrected to an appropriate position (teaching position). Accordingly, when the nozzle 30 is moved to the teaching position during teaching, the nozzle 30 is accurately moved in the appropriate processing section PS1. In addition, the appropriate processing section PS1 is a section in which the requested substrate processing can be performed by discharging the processing liquid from the nozzle 30 in the processing section PS1.

The processing section PS1 is a region defined above the substrate W held by the spin chuck 20 and is a movement range of the nozzle 30 extending in the horizontal direction. Both ends of the processing section PS1 are a first stage TE1 and a second stage TE2. When the control unit 9 controls the nozzle base 33 , the nozzle 30 moves from the first stage TE1 to the second stage TE2 in the processing section PS1 .

When the nozzle 30 moves through the appropriate processing section PS1, the camera 70 continuously images the imaging area PA including the tip of the nozzle 30 (step S12). Continuous imaging means continuously imaging the imaging area PA at fixed intervals. For example, the camera 70 performs continuous imaging at intervals of 33 milliseconds. In this way, a captured image of 30 frames per second is acquired. The camera 70 shoots a moving picture until the nozzle 30 reaches the second stage TE2 after reaching the first stage TE1 of the processing section PS1 from the standby position.

8 : is a figure which shows an example of the image obtained by the camera 70 imaging the imaging area|region PA containing the front-end|tip of the nozzle 30 in processing section PS1. The tip of the nozzle 30 located in the middle of the processing section PS1 above the substrate W held by the spin chuck 20 is included in the imaging area PA. In the example shown in FIG. 8, although the board|substrate W is contained in imaging area|region PA, this is not essential. For example, there is a case where the substrate W is not held by the spin chuck 20 during maintenance. In such a case, imaging is performed in a state where the substrate W is not included in the imaging area PA. may be As shown in FIG. 8, the shape of the nozzle 30 on the picked-up image which image|photographs the nozzle 30 which moves processing section PS1 with the camera 70 fixed to the fixed position changes gradually . In the example shown in FIG. 8, the width|variety of the horizontal direction of the nozzle 30 gradually becomes large from 1st stage TE1, and becomes small gradually as it goes toward 2nd stage TE2 from the middle. In addition, the shape change of the nozzle 30 in a captured image is not limited to such thing.

Next, a reference image is registered from the plurality of captured images obtained in step S12 (step S13). In step S12, the nozzle 30 accurately moves from the first stage TE1 to the second stage TE2 in the appropriate processing section PS1 by teaching. Therefore, the captured image obtained by the camera 70 in step S12 becomes a reference image which shows the proper position of the nozzle 30. As shown in FIG. In step S13 , the reference image registration unit 90 registers a part of the plurality of captured images in the storage unit 94 as the reference image RP for detecting the displacement of the nozzle 30 .

The reference image RP turns into an image cut out so that the front-end|tip part of the nozzle 30 might be included from a captured image, as shown in FIG. Image cropping may be performed by manually designating an area by an operator, or cutting may be performed automatically. In the latter case, for example, a part (tip) of the nozzle 30 is detected by image recognition, and the area including the tip of the nozzle 30 may be cut out on the basis of the position. The cut out reference image RP is stored in the storage unit 94 together with the positional information in the imaging area PA. Usually, in the chamber 10 initially set, cutting is performed manually. As for the other chambers 10 set thereafter, if the configuration between the chambers 10 is the same, cutting may be performed using the cutting information of the chamber 10 set initially as it is, or cutting may be performed by appropriately adjusting. do.

In the present embodiment, as the reference image RP to be registered, the nozzle 30 is the first reference image RP1 when it is in the first stage TE1, and the second when it is in the second stage TE2. The reference picture RP2 and the intermediate reference picture RPM when moving the middle of the processing section PS1 (the region between the first stage TE1 and the second stage TE2) are included.

9 is a diagram conceptually illustrating a registration process of the reference image RP. The first registration process shown in FIG. 9 is a process in which the reference image registration unit 90 automatically registers a plurality of reference images RP. The captured image of the nozzle 30 shown in the upper side in FIG. 9 is an image obtained by continuously imaging the nozzle 30 moving from the 1st stage TE1 of the processing section PS1 toward the 2nd stage TE2. . As explained in FIG. 8 , in the captured image obtained by continuous imaging, the shape of the nozzle 30 changes while the nozzle 30 moves through the processing section PS1. In the registration processing shown in FIG. 9 , the reference image registration unit 90 registers the reference image RP in accordance with the shape change of the nozzle 30 .

First, it is assumed that the captured image of the nozzle 30 of the first stage TE1 is registered as the first reference image RP1. In this state, the reference image registration unit 90 performs pattern matching processing for calculating the degree of matching by sequentially comparing the first reference image RP1 and the captured images successive to the first reference image RP1. As described above, on the captured image, since the shape of the nozzle 30 is gradually changed, the degree of matching with the first reference image RP is gradually decreased. The reference image registration unit 90 registers, as a new reference image RP, a captured image whose degree of matching is equal to or less than a predetermined threshold value. Specifically, the reference image registration unit 90 takes the difference between the first reference image RP1 and the captured image to be compared, and when the difference exceeds a predetermined threshold value, the captured image is converted into a new reference image ( Register as RP). The reference picture RP registered based on the comparison with the first reference picture RP1 is the first intermediate reference picture RPM1 corresponding to the first intermediate reference picture RPM.

Subsequently, the reference image registration unit 90 compares the newly registered first intermediate reference image RPM1 with the captured images successive after the captured image corresponding to the first intermediate reference image RPM1 . Then, the reference image registration unit 90 registers the captured image whose matching degree is equal to or less than a predetermined threshold as the second intermediate reference image RPM2 corresponding to the second intermediate reference image RPM. The reference image registration unit 90 registers a plurality of intermediate reference images RPM by repeatedly performing such registration processing until the target of the pattern matching processing becomes the captured image of the second stage TE2.

Returning to Fig. 6 , when the registration of the plurality of reference images RP is completed, the operator sets the threshold value of the position shift determination (step S14). The threshold value set here is a parameter used for the determination process (step S25 shown in FIG. 7) of the position shift of the nozzle 30 mentioned later. The said threshold value is the threshold value of the shift|offset|difference of the reference image RP registered in step S13, and the position of the nozzle 30 in the picked-up image obtained by imaging|photographing the nozzle 30 of judgment object. The lower the threshold value set in step S14, the stricter the determination criteria. That is, even if the amount of displacement from the correct position of the nozzle 30 to be determined is small, it is determined that the displacement has occurred. The threshold value set in step S14 is stored in the storage unit 94 .

Preliminary preparation with respect to the nozzle 30 is performed as mentioned above. The same preliminary preparations as those shown in steps S11 to S14 are also performed for the other nozzles 60 and 65 (step S15). In addition, when the nozzles other than the nozzle 30 are configured to discharge the processing liquid while being stopped at a predetermined processing position on the substrate W, in step S11, the nozzle is moved to the processing position and , in step S12, the nozzle in a stopped state may be photographed at the processing position. And in step S13, what is necessary is just to use the captured image acquired by step S12 as a reference image.

The preliminary preparation shown in FIG. 6 is sufficient if it is performed in advance when teaching is performed, and once it is implemented, it is not necessary to perform it again until the teaching position is changed. In addition, with respect to the fixed lower surface treatment liquid nozzle 28, it is not necessary to perform the above preparatory process.

Next, the procedure of the detection process of position shift of the nozzle 30 is demonstrated, referring FIG. The main transport robot 103 carries the substrate W to be processed into the cleaning processing unit 1 (step S21). The loaded substrate W is held in a horizontal posture by the spin chuck 20 . At the same time, the raising/lowering operation is performed so that the processing cup 40 may reach a predetermined height position.

After the substrate W as a new processing target is held by the spin chuck 20, the nozzle 30 starts moving from the standby position toward the first end TE1 of the processing section PS1 (step S22). . The movement of the nozzle 30 is performed by the control part 9 controlling the nozzle base 33 according to a preset recipe. In the recipe, conditions for processing to be performed on the object are described in a predetermined data format. Specifically, the processing sequence or processing contents (treatment time, temperature, pressure or supply amount) and the like are described. After the nozzle 30 reaches the first stage TE1 of the processing section PS1 and is stopped, the substrate W is rotated under the control of the control unit 9 , and the processing liquid is discharged from the nozzle 30 . This is initiated. Then, the nozzle 30 starts moving from the first stage TE1 to the second stage TE2 in the processing section PS1 while discharging the processing liquid, and then stops at the second stage TE2. do.

In step S22, according to the movement of the nozzle 30, the position shift detection part 91 makes the camera 70 start imaging (step S23). The camera 70 continuously images the imaging area PA at intervals of, for example, 33 milliseconds. That is, the camera 70 causes the spin chuck 20 to hold the new substrate W to be processed and the nozzle 30 to move from the standby position toward the first end TE1 of the processing section PS1. Continuous imaging is started at the starting time point. At the time when the camera 70 started continuous imaging, since it is also the time when the nozzle 30 started moving from a standby position, the nozzle 30 has not reached|attained imaging area PA.

After the camera 70 starts continuous imaging, the position shift detection part 91 specifies the real image GP corresponding to a determination position (step S24). Specifically, the image determination unit 910 of the position shift detection unit 91 registers the plurality of standards in step S13 ( FIG. 6 ) of the preliminary preparation among the plurality of real images GP which are the images obtained in step S23 . The real image GP corresponding to the determination position indicated by each image RP is specified.

FIG. 10 is a diagram conceptually illustrating a state in which the real image GP corresponding to the reference image RP is specified. In the example shown in FIG. 10, the real image GP corresponding to the reference image RP is specified by comparing the reference image RP and the real image GP. For this comparison, a known method of pattern matching may be applied.

For example, among the plurality of real images GP, the real image GP with the highest degree of matching (smallest difference) with the first reference image RP1 corresponding to the first stage TE1 by pattern matching is It becomes a 1st real image when the nozzle 30 is in the 1st stage TE1. In addition, the real image GP with the highest degree of matching with the second reference image RP2 corresponding to the second stage TE2 becomes the second real image when the nozzle 30 is in the second stage TE2. . Each of the plurality of intermediate reference images RPM and each of the real images GP having the greatest degree of agreement are each intermediate reference image RPM in the middle of the processing section PS1 by the nozzle 30 (for example, , which includes the first and second intermediate reference images RPM1 and RPM2 shown in Fig. 9 ).

<Stop Judgment>

In the description of FIG. 10 , as a determination rule, it is determined whether or not each real image GP is an image corresponding to each determination position on the basis of the degree of agreement with the reference image RP. However, the determination rule is not limited to this. For example, with respect to the real image GP corresponding to each position of the first stage TE1 and the second stage TE2 of the processing section PS1, even if it is specified as a determination rule that the nozzle 30 is stopped do.

Specifically, the determination of the stop of the movement of the nozzle 30 may be performed by calculating the difference between two successive real images GP and GP, and based on whether the difference is equal to or less than a predetermined threshold value. . The difference between two successive real images GP and GP refers to a difference image indicating the difference between one real image GP and the next real image GP. In addition, calculating the difference means finding the sum total of the absolute values of the gradation values of all the pixels in the difference image.

For example, after the nozzle 30 moves toward the first stage TE1 from the standby position, it temporarily stops at the first stage TE1. Between the continuous real images GP and GP when the nozzle 30 is moving toward the first stage TE1, the image of the nozzle 30 tends to remain in their difference images. For this reason, the total of the absolute values of the gradation values in the difference image becomes a relatively large value. On the other hand, between the successive real images GP and GP after the nozzle 30 stops at the first stage TE1, the positions of the nozzles 30 become the same, so that the nozzles 30 in their difference images ) is removed. For this reason, the sum of the absolute values of the gradation values in the difference image becomes a relatively small value. Based on such a principle, by appropriately setting the threshold value, it is possible to easily and accurately detect that the nozzle 30 has stopped at the first stage TE1. The image determination unit 910 may also detect the stop of the nozzle 30 in the second stage TE2 based on the same principle as the stop of the nozzle 30 in the first stage TE1 .

In addition, in order to prevent erroneous detection due to noise or the like, for example, the image determination unit 910 may calculate a difference between three or more consecutive real images. Then, the image determination unit 910 may determine that the nozzle 30 has stopped, when all the obtained differences are equal to or less than a threshold value.

The processes from step S21 to step S24 are processes executed each time the substrate W to be processed is loaded into the cleaning processing unit 1 . That is, in the present embodiment, each time the spin chuck 20 holds the substrate W to be processed loaded into the cleaning processing unit 1 and the nozzle 30 moves the processing section PS1, a plurality of A real image corresponding to each of the reference images RP of is specified.

After step S24, the image comparison unit 912 of the position shift detection unit 91 compares the plurality of reference images RP with the real images corresponding to each of the reference images RP, and determines each of the nozzles 30 A position shift in the position is detected (step S25). The reference image RP is an image acquired by the camera 70 imaging the imaging area PA when the nozzle 30 is located correctly at each determination position of the processing section PS1 at the time of teaching. In addition, the real image identified in step S24 is captured by the camera 70 in the imaging area ( It is a real image acquired by imaging PA), and is a captured image corresponding to each reference image RP (that is, with a high degree of matching). Therefore, by comparing each reference image RP with the corresponding real image, above the substrate W, whether the nozzle 30 has moved to an appropriate position, and whether the nozzle 30 has stopped at an appropriate position It can be determined whether

Specifically, the image comparison unit 912 compares each of the plurality of reference images RP registered in step S13 with the corresponding real image GP specified in step S24. And the difference (position shift) of the coordinates of the nozzle 30 in both images is calculated. For this comparison, a known method of pattern matching may be applied. When the positional shift of the nozzle 30 calculated by pattern matching is equal to or greater than the threshold value determined in step S14, the image comparison unit 912 determines that the actual position of the nozzle 30 at the determined position is shifted. judged to be When the position shift of the nozzle 30 is detected, what is necessary is just to implement the predetermined|prescribed abnormality correspondence process by the control part 9. The abnormality-corresponding processing includes, for example, a warning issuance (display of a warning on the display unit 95, lighting of a lamp not shown, output of a warning sound from a speaker not shown, etc.) or cleaning processing unit 1 , for example. stop operation, etc. When the calculated displacement of the nozzle 30 is smaller than the threshold value determined in step S14 , it is determined that the displacement has not occurred in the actual position of the nozzle 30 . In addition, in step S25, it not only performs determination of position shift based on a threshold value, but the specific position shift amount may be displayed on the display part 95, for example.

Even if the shape of the nozzle 30 on the reference image RP and the shape of the nozzle 30 on the real image GP coincide with each other, the nozzle 30 obtained from the positional information of each image ) may be shifted in the horizontal direction or the vertical direction. In the present embodiment, when the nozzle 30 is out of position in the horizontal direction on the real image GP, it is determined that there is a possibility that the nozzle 30 is out of position in the horizontal direction. Moreover, in the case where the nozzle 30 is displaced in the vertical direction on the real image GP, it is determined that there is a possibility that the nozzle 30 is displaced in the vertical direction. The method of "shape base pattern matching" can be used for the search of the nozzle 30. Specifically, a region matching the edge information of the nozzle 30 in the cut out reference image RP is searched for in the real image GP, and the coordinate values of the found regions are determined as the coordinate values of the reference image RP. By comparing with , it is determined whether or not a positional shift has occurred.

The above was the description of the detection process of the displacement with respect to the nozzle 30, but also about the nozzles 60 and 65 other than the nozzle 30, the displacement can be detected in the same procedure as the flow shown in FIG. . In addition, when the nozzles other than the nozzle 30 are configured to discharge the processing liquid while being stopped at a fixed processing position on the substrate W, as described above, in step S13 which is a preliminary preparation, An image of the nozzle 30 in a state of being properly stopped at the processing position is registered as the reference image RP. For this reason, in step S24, the real image GP corresponding to the processing position is specified as an image corresponding to the reference image RP by matching or stop determination, and in step S25, these reference images RP and the real image What is necessary is just to determine the position shift of another nozzle based on the comparison of (GP).

<Effect>

As described above, in the substrate processing apparatus 100 of the present embodiment, the positional shift of the nozzle 30 that discharges the processing liquid while moving the processing section PS1 can be detected. In particular, since a position shift of the nozzle 30 in the first stage TE1 and the second stage TE2 can be detected, the nozzle 30 moves between both ends of the processing section PS1 to be moved. You can check that you are moving correctly. Thereby, the liquid process using the moving nozzle 30 can be performed appropriately.

It can be determined whether the nozzle 30 moving in the middle of processing section PS1 is moving the correct position in the correct vertical direction. Accordingly, it can be determined whether the processing liquid discharged from the nozzle 30 is being supplied from the substrate W at an appropriate height. Thereby, the liquid process using the moving nozzle 30 can be performed appropriately.

Judgment of the position shift in each determination position of the nozzle 30 is performed based on the comparison of the reference image RP and the real image GP of each determination position. For this reason, even if the shape of the nozzle 30 is changed by moving the processing section PS1, the real image GP can be accurately specified according to the shape of the nozzle 30 at each determination position. Therefore, the position shift of the nozzle 30 in each determination position can be detected with high precision.

<Position shift detection using reference trajectory information>

In the above description, the positional shift of the nozzle 30 is detected by comparing the reference image RP and the real image GP by pattern matching. However, the positional shift of the nozzle 30 may be detected using information on the trajectory (path) of the nozzle 30 that moves in the processing section PS1.

11 is a diagram conceptually illustrating reference trajectory information ST1. The reference trajectory information ST1 is information indicating the path of the nozzle 30 when the nozzle 30 correctly moves from the first stage TE1 to the second stage TE2 in the processing section PS1. The reference trajectory information ST1 can be generated from, for example, a plurality of reference images RP.

The reference trajectory information ST1 may be generated when the position shift detection unit 91 specifies the position of the nozzle 30 from the reference image RP. Specifically, as shown in FIG. 11 , the tip positions of the nozzles 30 are specified from the first and second reference images RP1 and RP2 and the plurality of intermediate reference images RPM, and these tip positions are , , may be connected to each other by a known interpolation process to generate the reference trajectory information ST1. The generation of the reference trajectory information ST1 may be performed at an appropriate timing after step S13. In addition, the reference trajectory information ST1 may be generated using not only the plurality of reference images RP registered in step S13 but also a series of captured images obtained by continuous imaging in step S12 . In this case, the reference trajectory information ST1 indicating the precise trajectory of the nozzle 30 can be generated.

In step S25, when the displacement detection unit 91 detects the displacement of the nozzle 30 using the reference trajectory information ST1, The vertical position is calculated|required and the position shift of the vertical direction of the nozzle 30 is detected by comparing with the vertical position calculated|required from reference trajectory information ST1.

<Other registration processing of reference image (RP)>

In FIG. 9 , the reference image registration unit 90 automatically registers a plurality of reference images RP by pattern matching processing. However, the reference image registration unit 90 may register the captured image designated by the operator as the reference image RP.

12 : is a time chart which shows a mode that the nozzle 30 is imaged continuously. As described above, when the command transmission unit 92 outputs a command to the nozzles 30, 60, 65, the nozzle bases 33, 63, and 68 are operated. At this time, in accordance with the command transmission by the command transmission unit 92 , the camera 70 continuously images the imaging area PA.

In the command, information indicating any one of the nozzles 30 , 60 , and 65 and information indicating the position of the moving destination of the discharge head of each of the nozzles 30 , 60 , 65 are recorded. As shown in FIG. 12 , the captured images of the moving nozzles 30 , 60 , 65 are acquired by performing continuous imaging in accordance with the transmission of the commands C1-C4 .

In step S11 shown in FIG. 6 , when a command is transmitted to the nozzle base 33 , the nozzle 30 is moved from the standby position to the first stage TE1 . And when a command is further sent to the nozzle base 33, the nozzle 30 moves from 1st stage TE1 to 2nd stage TE2. Moreover, continuous imaging of the nozzle 30 of step S12 is implemented according to these command transmission.

A series of captured images acquired by continuous imaging executed in accordance with a command is stored in correspondence with the command that triggered the continuous imaging. For example, a series of captured images acquired according to the command C1 is stored in the storage unit 94 in correspondence with the command C1. Accordingly, by designating the command (C1), it is possible to call a series of captured images corresponding to the command (C1).

Fig. 13 is a diagram showing a registration screen W1 for registering the reference image RP. The registration screen W1 is a screen that the reference image registration unit 90 displays on the display unit 95 . The registration screen W1 has an image display area WR2, a nozzle/position selection area WR4, a display control area WR6, and a registration decision button BT4.

The image display area WR2 is an area in which a series of captured images are continuously displayed in the order in which they were acquired. The nozzle/position selection area WR4 is an area that accepts an operation for selecting any one of the plurality of nozzles 30 , 60 , 65 and an operation for selecting a moving destination of the selected nozzle.

The display control area WR6 is an area that accepts an operation for controlling image display in the image display area WR2. A skip button BT2 is provided in the display control area WR6. The skip button BT2 accepts an operation for selecting a series of captured images displayed in the image display area WR2. Specifically, the operator further operates the skip button BT2 while selecting a specific nozzle and a moving destination of the nozzle in the nozzle/position selection area WR4. Then, the reference image registration unit 90 displays in the image display area WR2 the first image in the series of captured images corresponding to the command corresponding to the selected nozzle and the moving destination. In this way, by operating the nozzle/position selection area WR4 and the skip button BT2 in combination, the operator first searches for the captured image of the target nozzle among all the captured images captured between one recipe, It is displayed on the display area WR2.

The registration decision button BT4 accepts an operation for registering the captured image displayed in the image display area WR2 as the reference image RP. The operator displays a desired captured image in the image display area WR2 by performing an operation in the display control area WR6, and operates the registration decision button BT4 in that state. Thereby, the captured image displayed in the image display area WR2 is registered as the reference image RP.

According to the registration screen W1, the operator can designate the command to be transmitted by the command transmission unit 92 by operating the nozzle/position selection area WR4. Thereby, a series of captured images corresponding to the command are selectively displayed in the image display area WR2. Therefore, the operator can efficiently display and confirm a series of captured images which show the mode that the nozzle which is the registration object of the reference image RP moves. For this reason, the operator can efficiently register the reference image RP by operating the registration decision button BT4.

In addition, in this embodiment, although the nozzle 30 is equipped with the single discharge head 31, it may be provided with the some discharge head 31. As shown in FIG. In this case, the command transmission unit 92 transmits the command to the nozzle base 33 so that the target discharge head among the plurality of discharge heads is moved to the predetermined position. This command may include not only information indicating the nozzle 30 but also information indicating any one of the plurality of discharge heads. In addition, in the nozzle/position selection area WR4, by accepting an operation for designating a specific discharge head, a command may be designated.

<2. Second embodiment>

Next, the second embodiment will be described. In addition, in the following description, about the element which has the same function as the element already demonstrated, the same code|symbol or the code|symbol added with an alphabetic character may be attached|subjected, and detailed description may be abbreviate|omitted.

14 : is a figure which shows the control part 9A of 2nd Embodiment. The control part 9A of this embodiment differs from the control part 9 in the point provided with the position shift detection part 91A. Although the position shift detection part 91A is provided with the function of detecting the position shift of the nozzle 30 similarly to the position shift detection part 91, since it is provided with the image determination part 910A, the position shift detection part 91 different from

The image determination unit 910A includes a feature vector calculation unit 9102 and a classifier K2. The feature vector calculation unit 9102 calculates a feature vector that is an arrangement of a plurality of types of feature quantities from each of the real images GP acquired by the continuous imaging of step S23 . The items of the feature amount are, for example, the sum total of pixel values in the gray scale of each real image GP, the sum total of luminance, standard deviation of pixel values, standard deviation of luminance, and the like. The classifier K2 classifies the real image GP into classes based on the feature vector calculated by the feature vector calculating unit 9102 . Here, a plurality of classes corresponding to different positions of the nozzle 30 on the substrate W are defined.

More specifically, each determination position of the nozzle 30 corresponding to each of the reference images RP registered by the reference image registration unit 90 is defined as a class. For example, two classes corresponding to each of the first stage TE1 and the second stage TE2 are defined. In addition, a plurality of classes corresponding to different determination positions in the middle of the processing section PS1 are defined.

The image determination part 910A performs image determination processing in step S24 shown in FIG. 7 similarly to the image determination part 910. Specifically, the image determination unit 910A is configured to, when a real image GP is classified into a specific class by the classifier K2, the real image GP is in a determination position corresponding to the specific class. judged to be an image of For example, when the classifier K2 classifies the real image GP into a class corresponding to the first stage TE1, the image determination unit 910A divides the real image GP into the second stage TE1. It is judged that it is an image when it is located in the 1st stage (TE1).

As shown in FIG. 14 , a communication unit 97 is connected to the control unit 9A. The communication unit 97 is formed so that the control unit 9A performs data communication with the server 8 . The substrate processing apparatus 100 , the communication unit 97 , and the server 8 constitute a substrate processing system. The classifier K2 described above is generated by the server 8 by machine learning, and is provided from the server 8 to the control unit 9A.

The server 8 is provided with a machine learning unit 82 . The machine learning unit 82 generates the classifier K2 by machine learning. As machine learning, well-known methods, such as a neural network, a decision tree, a support vector machine (SVM), and discriminant analysis, can be employ|adopted. In addition, the teacher data used for machine learning includes a feature vector of a captured image obtained by photographing the nozzle 30 at a specific determination position with the camera 70, and a class label which is information indicating a class corresponding to the specific determination position. includes Teacher data is prepared for each class corresponding to each of a plurality of determination positions.

It is not essential that the substrate processing apparatus 100 is connected to the server 8 . For example, the substrate processing apparatus 100 may include the machine learning unit 82 . In this case, the classifier K2 can be generated in the substrate processing apparatus 100 .

In addition, although the real image GP when the nozzle 30 is in the determination position is determined by the classifier K2, similarly, also with respect to the other nozzles 60 and 65, between classes corresponding to different positions. A classifier to classify in , may be prepared, and the real image GP at the time of determination may be specified by the classifier.

15 is a diagram conceptually illustrating the classifier K2. The classifier K2 shown in FIG. 15 is constructed by the neural network NN1. The neural network NN1 includes an input layer, an intermediate layer, and an output layer, and a plurality of types of feature quantities of an image to be classified (real image GP to be inspected) are input to the input layer. Moreover, a plurality of classes are defined for each different determination position of the nozzle 30, and in the output layer, the real image GP is classified into a certain class. In addition, when the real image GP is not classified into any class, the classifier K2 outputs the classification impossible. In FIG. 15, although the classifier K2 is provided with one intermediate|middle layer, it may be equipped with several intermediate|middle layer.

In the classifier K2 shown in FIG. 15, the feature vector is computed from the whole image which is the imaging area PA of the camera 70, and the classifier K2 classifies based on the feature vector. However, the classifier K2 may be generated by the machine learning unit 82 learning by using, as teacher data, an image cut out in part from the entire image so that the tip portion of the nozzle 30 is included.

Thus, according to this embodiment, the real image GP corresponding to a determination position can be specified with high precision by classification by the classifier K2 generated by machine learning. Therefore, by comparing the reference image RP and the real image GP, the position shift of the nozzle 30 in the determination position can be appropriately detected.

Although the present invention has been described in detail, the above description is, in all respects, an illustration, and the present invention is not limited thereto. It is to be understood that numerous modifications not illustrated can be made without departing from the scope of the present invention. Each structure demonstrated in each said embodiment and each modified example can be combined suitably or abbreviate|omitted unless mutually contradictory.

100 substrate processing unit
1 cleaning treatment unit
10 chamber
20 spin chuck
21 spin base
21a Retaining surface
22 spin motor
30, 60, 65 nozzles
31 discharge head
70 camera
71 lighting
8 servers
82 Machine Learning Department
9, 9A control unit
90 standard image register
91, 91A position shift detection unit
910, 910A image judgment unit
9102 Feature Vector Calculator
912 image comparison unit
92 command transmitter
95 display
96 input
97 Ministry of Communications
C1-C4 command (control information)
GP real picture
K2 classifier
PA imaging area
PS1 processing section
RP reference image
RP1 first reference picture
RP2 2nd reference image
RPM medium reference image
RPM1 first intermediate reference image
RPM2 2nd intermediate reference image
ST1 reference trajectory information
TE1 Stage 1
TE2 Stage 2
W board
W1 registration screen

Claims (17)

A substrate processing method for processing a substrate, comprising:
(a) moving the nozzle within a predetermined treatment section extending in the horizontal direction;
(b) the step of imaging the nozzle moving in the processing section by the step (a);
(c) registering, as first and second reference images, the captured images obtained in the step (b) when the nozzles are at the first and second stages, which are both ends of the processing section;
(d) moving the nozzle within the processing section;
(e) imaging the nozzle moving in the processing section by the step (d);
(f) an image determination step of determining whether the plurality of captured images obtained in the step (e) are images corresponding to each of the first stage and the second stage based on a predetermined determination rule;
(g) comparing the first and second reference images with the first and second real images determined to correspond to each of the first stage and the second stage by the step (f), and the step ( The substrate processing method according to d) including the step of detecting a position shift of the nozzles disposed at both ends of the processing section. The method of claim 1,
(h) after the step (c) and before the step (d), further comprising a step of holding the substrate to be treated in a substrate holding unit. 3. The method of claim 1 or 2,
The step (d) is,
(d1) moving the nozzle from a position near the first end toward the second end;
The step (f) is,
and (f1) determining whether the image corresponds to each of the first stage and the second stage based on a difference between successive captured images. 3. The method of claim 1 or 2,
The step (c) is,
(c1) registering an intermediate reference image obtained by imaging the nozzle moving in the middle of the processing section in the step (b);
The step (g) is,
(g1) based on the comparison of the intermediate reference image and the intermediate real image obtained by imaging the nozzle moving in the middle of the processing section in the step (e), the middle of the processing section in the step (d) A substrate processing method comprising the step of detecting a position shift of the nozzle moving the . 5. The method of claim 4,
The step (g) is,
(g2) The substrate processing method including the process of detecting the position shift of the said nozzle in a vertical direction based on the said intermediate|middle reference image and the said intermediate|middle real image. 5. The method of claim 4,
(i) further comprising a step of generating, from the plurality of intermediate reference images registered in the step (c1), reference trajectory information indicating the trajectory of the nozzle moving in the processing section;
The step (g) is,
(g3) The substrate processing method including the process of detecting the position shift of the said nozzle in a vertical direction based on the said intermediate real image and the said reference|standard trajectory information. 5. The method of claim 4,
The step (c1) is,
(c11) registering one of the plurality of captured images obtained by imaging the nozzle moving in the middle of the processing section in the step (b) as a first intermediate reference image;
(c12) After the step (c11), a captured image that follows the first intermediate reference image from among the plurality of captured images and whose degree of coincidence with the first intermediate reference image is equal to or less than a predetermined threshold is selected as a second intermediate image A substrate processing method comprising a step of registering as a reference image. 3. The method of claim 1 or 2,
The step (a) is,
(a1) a control unit transmitting a control signal for moving the nozzle from the first stage to the second stage to the nozzle moving unit;
The step (b) is,
(b1) The substrate processing method including the process of imaging the said nozzle in response to transmission of the said control signal, and acquiring a some captured image. 9. The method of claim 8,
The step (b) is,
(b2) The substrate processing method further comprising the step of recording the control information indicated by the control signal in association with a plurality of captured images acquired by imaging according to the control signal. 10. The method of claim 9,
The step (c) is,
(c2) displaying the series of captured images obtained by the step (b) on a display unit in succession in the order in which they were acquired;
The step (c2) is
(c21) designating the control information;
and (c22) displaying a captured image corresponding to the control information specified in the step (c21) on the display unit. The method of claim 1,
The processing section is disposed above the substrate. 12. The method of claim 11,
The processing section is a section in which processing is performed by discharging a processing liquid from the nozzle to the upper surface of the substrate. A substrate processing apparatus for processing a substrate, comprising:
a substrate holding unit for holding the substrate in a horizontal position;
a nozzle for supplying a processing liquid to the substrate held by the substrate holding unit;
a nozzle moving unit for moving the nozzle within a predetermined processing section extending in the horizontal direction;
a camera that acquires a photographed image by imaging the nozzle moving within the processing section;
a reference image registration unit for registering first and second reference images obtained by the camera imaging the nozzles at the first and second stages, which are both ends of the processing section;
a position shift detection unit configured to detect position shift of the nozzles in the first stage and the second stage;
The position shift detection unit,
An image plate for determining whether or not a real image obtained by imaging the nozzle moving in the processing section with the camera is an image corresponding to each of the first stage and the second stage, based on a predetermined determination rule government and
and an image comparison unit for comparing the first and second reference images with the first and second real images determined to correspond to the first and second stages, respectively, by the image determination unit; Device. 14. The method of claim 13,
The image determination unit,
a feature vector calculating unit for extracting a plurality of types of feature vectors from each of the plurality of captured images;
a classifier for classifying each of the plurality of captured images into classes corresponding to different positions of the nozzles according to the plurality of types of feature vectors;
The plurality of classes includes a class corresponding to each of the first stage and the second stage. 14. The method of claim 13,
The processing section is disposed above the substrate. 16. The method of claim 15
The processing section is a section in which the processing is performed by discharging the processing liquid from the nozzle to the upper surface of the substrate. A substrate processing system comprising: a substrate processing apparatus for processing a substrate; and a server for performing data communication with the substrate processing apparatus, the substrate processing apparatus comprising:
The substrate processing apparatus,
a substrate holding unit for holding the substrate in a horizontal position;
a nozzle for supplying a processing liquid to the substrate held by the substrate holding unit;
a nozzle moving unit for moving the nozzle within a predetermined processing section extending in the horizontal direction;
a camera that acquires a photographed image by imaging the nozzle moving within the processing section;
a reference image registration unit for registering first and second reference images obtained by the camera imaging the nozzles at the first and second stages, which are both ends of the processing section;
a position shift detection unit for detecting position shift of the nozzles in the first stage and the second stage;
and a communication unit for performing data communication with the server;
The position shift detection unit,
An image plate for determining whether or not a real image obtained by imaging the nozzle moving in the processing section with the camera is an image corresponding to each of the first stage and the second stage, based on a predetermined determination rule government and
an image comparison unit for comparing the first and second reference images with the first and second real images determined to correspond to the first stage and the second stage respectively by the image determination unit;
The image determination unit,
a feature vector calculating unit for extracting a plurality of types of feature vectors from the captured image;
a classifier for classifying the plurality of captured images into a plurality of classes corresponding to different positions of the nozzles based on the plurality of types of feature vectors;
The plurality of classes include classes of images corresponding to each of the first stage and the second stage,
the server includes a machine learning unit that generates the classifier by machine learning using the plurality of captured images taught in any one of the plurality of classes as teacher data;
The classifier is provided from the server to the substrate processing apparatus.

Images