KR101379646B1 - Film forming device for organic thin films, and method for forming film using organic materials - Google Patents

Abstract

The organic material supplied little by little into the evaporation tank 41 is heated in contact with the heating part 43, becomes a vapor, and is introduce | transduced into the buffer apparatus 50. As shown in FIG. The buffer part 50 which has a flow path is formed in the buffer apparatus 50, and the vapor which flows through a flow path collides with the buffer part 52, and adheres to the buffer part 52 as a solid organic material. If the surface of the buffer part 52 is covered with a solid organic material, the fluctuation | variation of the steam generation amount in the evaporation tank 41 will be eliminated by the buffer part 52, and the steam | emission discharge from the discharge device 12 will be stabilized. Until the vapor discharge from the discharge device 12 is stabilized, the vapor can be led to the trap device 60 and precipitated on the surface of the trap part 62, whereby it can be recovered and reused.

Description

FILM FORMING DEVICE FOR ORGANIC THIN FILMS, AND METHOD FOR FORMING FILM USING ORGANIC MATERIALS}

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a film forming apparatus for an organic thin film, and more particularly, to a film forming apparatus for heating a small amount of material and evaporating an organic material film forming method.

The organic thin film to which the luminescent material made of the organic substance is added emits light with the color of light corresponding to the kind of the luminescent material when a current flows in the film thickness direction. It is.

However, when a large amount of organic materials are heated, some of the organic materials during heating evaporate in a short time, but since most organic materials are heated for a long time, the organic materials are deteriorated and a high quality organic thin film cannot be obtained.

On the other hand, if a certain amount of organic material is supplied to the heating apparatus little by little for each substrate, and a small amount of organic material is heated to generate steam, the supply of a certain amount of organic material to one substrate is started until the end is completed. During the process, the supply amount is changed, and the film formation speed of the film forming target is also changed.

Particularly, when the light emitting layer is formed by bringing together the vapor of the organic material serving as the host and the vapor of the organic material serving as the luminescent material to the same film forming object, the optimum content rate is determined. If the speed varies, the content rate changes, and the content rate in the film thickness direction changes. When the part which does not become an optimal content rate for light emission is formed, the light emission amount of a light emitting layer will fall.

Moreover, since the vapor of the organic material which is not discharge | released toward the film-forming object conventionally was discarded, when the film-forming is not started until the amount of vapor discharge | emission from a discharge apparatus is stabilized, the problem that the useless organic material will increase also increases. have.

Japanese Unexamined Patent Publication No. 2002-249868

When the organic material used for film-forming is heated and evaporated little by little, the film-forming apparatus which provides the constant vapor amount of the organic material discharge | released from a discharge apparatus is provided.

Moreover, the film-forming apparatus which collect | recovers organic material from the vapor | steam which is not used for film-forming, and can reuse is provided.

MEANS TO SOLVE THE PROBLEM In order to solve the said subject, this invention has the film-forming tank in which the film-forming object is arrange | positioned, the steam generation apparatus which produces | generates the vapor | steam of organic material, and the discharge | release device to which the said steam produced | generated by the said steam generation apparatus is supplied, A film forming apparatus of an organic thin film in which the vapor is released into the film forming tank from a discharge port formed in the apparatus, wherein the steam generating apparatus includes a material supply device for supplying the organic material, and the organic material supply from the material supply device. And an evaporation apparatus for evaporating the organic material, a buffer portion for depositing and re-evaporating the vapor generated in the evaporation apparatus, and a temperature control device for a buffer controlling the temperature of the buffer portion. The supplied steam is supplied to the discharge device through the buffer unit, and the organic thin film is formed on the film forming object. It is a film-forming apparatus.

Moreover, this invention is a film-forming apparatus which has several said steam generating apparatus.

Moreover, this invention has a film thickness monitor which detects a part of vapor | steam which came out from the said buffer part, The said temperature control device for buffers forms the film which controls the temperature of the said buffer part based on the detection value of the said film thickness monitor. Device.

Moreover, this invention is the film-forming apparatus which the said material supply apparatus falls the said organic material to the said evaporation apparatus by rotating the shaft which has a spiral.

Moreover, this invention is a film-forming apparatus which has the material supply amount measuring means which measures the quantity of the said organic material supplied from the said material supply apparatus.

In addition, the present invention, the material supply amount measuring means has a housing member for accommodating the organic material supplied from the material supply device and a temperature measuring analyzer for calculating the supply amount of the organic material from the temperature change of the housing member. Film forming apparatus.

Moreover, this invention is the film-forming apparatus in which the said buffer part consists of several metal fine wires gathered together, the said metal fine wires partially overlap each other, and the flow path was formed by the clearance gap of the said metal fine wire and the said metal fine wire.

Moreover, this invention is the film-forming apparatus which the said buffer part consists of a some net | network, and the flow path was formed in the clearance gap of the net | network and the said net | network of the said net | network.

Moreover, in this invention, the number of meshes per unit area of a 1st net | network of a plurality of said net | networks is a mesh | unit per unit area of the 2nd net | network located downstream from the said 1st net | network of the said steam which flows in the said buffer part. It is a film-forming apparatus below the number.

Moreover, this invention is a film-forming apparatus with which the backflow prevention gas supply apparatus which supplies a backflow prevention gas is connected to the said material supply apparatus.

In addition, the present invention, the steam generating device, the switching of the traveling direction of the steam passing through the buffer portion between the first direction inside the discharge device and the second direction toward the outside of the discharge device; It is a film-forming apparatus which has a device.

Moreover, the said steam generating apparatus is a trap apparatus in which the said trap part which the said steam contact | connects is arrange | positioned inside, and the inside of the said trap tank is comprised so that a vacuum can be exhausted, and the said trap part is a trap whose temperature is lower than the said evaporation temperature. A low temperature device for cooling to a temperature, wherein the second direction is a film forming device inside the trap tank.

In addition, the present invention provides a discharge port formed in the discharge device having a film formation tank in which a film formation object is disposed, a vapor generation device in which steam of an organic material is generated, and a discharge device to which the steam generated in the steam generation device is supplied. The film forming apparatus of the organic thin film which discharge | releases the said vapor | steam in the said film-forming tank WHEREIN: The said vapor generating apparatus is evaporation which evaporates the said material supply apparatus which supplies the said organic material, and the said organic material supplied from the said material supply apparatus. A trap device in which the apparatus, the trap portion in contact with the steam is disposed inside the trap tank, the trap tank configured to be vacuum evacuated, a low temperature device for cooling the trap unit to a trap temperature lower than the evaporation temperature, and The traveling direction of the steam generated by the evaporation device is switched to either the discharge device or the trap part. Is a film-forming apparatus which has a switching device, generated by the evaporator and the vapor is supplied to the emitting device, the organic thin film formed on the film formation target.

In addition, the present invention, the steam generating device has a film thickness sensor, a portion of the steam generated by the steam generating device, before reaching the switching device is guided to the film thickness sensor, the film thickness sensor It is a film-forming apparatus comprised so that the said organic thin film may grow on it.

Moreover, this invention is a film-forming apparatus which has several said steam generating apparatus connected to the said said discharge apparatus.

Moreover, this invention is a film-forming apparatus in which the said organic material of a different chemical structure is each arrange | positioned at the said material supply apparatus of several said steam generating apparatus.

Moreover, this invention is the film-forming apparatus in which the said organic material arrange | positioned at the said material supply apparatus of several said steam generating apparatus differs in content rate in the said organic thin film formed.

Moreover, in this invention, the said evaporation apparatus is connected with the evaporation container in which the submaterial which is an organic compound contained in a small quantity is contained in the said organic thin film, and the vapor of the said submaterial is smaller than the vapor | steam of the said organic material. And a deposition device configured to be introduced into the discharge device at an introduction speed.

In addition, the present invention has a boot wrap device in which a trap part in which the vapor of the submaterial is in contact with the trap tank is disposed, and the trap tank inside is configured to be evacuated, and the vapor of the submaterial generated in the evaporation container is provided. Is a film forming apparatus configured to be switched to the release apparatus and the boot wrap apparatus and introduced.

In addition, the present invention supplies the organic material to the heating unit at a rate of a predetermined amount, generates steam, introduces the steam into the buffer unit, precipitates it in the buffer unit, and precipitates the organic material in the buffer unit. Is a method of forming an organic material by re-evaporating the vaporized vapor and releasing the vaporized vapor on the substrate.

Moreover, this invention is the organic material film-forming method which measures a part of vapor | bulb derived from the said buffer part, and controls the temperature of the said buffer part based on the measured value.

In addition, the present invention is to lower the temperature of the buffer portion than the evaporation temperature of the organic material to precipitate the vapor in the buffer portion when the substrate is replaced, the precipitated in the buffer portion when the film formation on the substrate The organic material film-forming method of making the temperature of the said buffer part higher than the evaporation temperature of the said organic material so that organic material may evaporate again.

According to the present application, it is possible to evaporate by heating in a short time while supplying the required amount of raw materials, and to stabilize the film formation rate.

According to this invention, the composition of the film thickness direction of the organic thin film in which the several kind of organic material was mixed can be made constant.

When the organic thin film is formed of a single organic material, an organic thin film having a constant quality in the film thickness direction can be obtained.

In addition, since the steam which was conventionally discarded can be individually recovered for each type of organic material by the trap device, it can be reused.

1 is an internal side view for explaining a film forming apparatus of a first example of the present invention.
2 is a view for explaining the positional relationship of a plurality of steam generating apparatuses of the film forming apparatus.
3 is an internal side view for explaining a film forming apparatus of a second example of the present invention.
4 is an internal side view for explaining a film forming apparatus of a third example of the present invention.

<Constitution of the whole>

1 and 2 denote the film forming apparatus of the first example of the present invention.

FIG. 1: is sectional drawing when this film forming apparatus 2 is seen from the side, and FIG. 2 is a layout view of the inside seen from the upper side. As shown in FIG. 1, this film forming apparatus 2 has a film forming tank 11 and a discharge device 12. As shown in FIG. 2, a plurality of vapor generating devices are provided in the same discharge device 12. 13a and 13b (two in FIG. 1) are connected.

The steam generators 13a and 13b have the same internal structure here, and the insides of the two steam generators 13a and 13b are shown together by the steam generator shown by the reference numeral 13 in FIG.

In FIG. 2, although the steam generating apparatuses 13a and 13b are connected to the edge part of the same side in the longitudinal direction of the discharge | release device 12, they may be connected to the same edge part, and one and the other may be connected to the edge part on the opposite side.

The film formation tank 11 is provided with the delivery opening 81 and the delivery opening 82 which open and close when carrying in and carrying out the film-forming object 15.

First, the inlet 81, the outlet 82, and the division valve 29 mentioned later are operated, the vacuum exhaust system 19 is operated, and the inside of the film formation tank 11 is evacuated to make a vacuum atmosphere. . The vacuum exhaust system 19 is continuously operated to evacuate the inside of the film formation tank 11.

The discharge device 12 has a main body portion 35 and a discharge plate 36 that closes the opening of the main body portion 35. The discharge plate 36 is provided with a plurality of discharge ports 37.

The discharge device 12 is disposed in the film formation tank 11, and the inside of the discharge device 12 is evacuated by the vacuum exhaust system 19 via the discharge port 37.

In each steam generating apparatus 13a, 13b, the organic material of the same or different chemical structure is arrange | positioned.

In the case of different chemical structures, for example, one is an organic compound of the base material (material constituting the organic thin film) of the organic thin film, and the other is a dopant (eg, a light emitting material) contained in the organic thin film of the base material. ), And the content rate (weight percentage) in the organic thin film formed is different, and the organic compound of a base material and the organic compound of a dopant have more base materials than each dopant in each vapor generating apparatus 13a, 13b. In this case, the vapor generating devices 13a and 13b can be operated simultaneously to co-deposit the base material and the dopant. Alternatively, different materials may be arranged in the steam generating apparatuses 13a and 13b and operated separately to form a laminated film.

Each steam generator 13a, 13b is comprised so that the vapor | steam of the organic material arrange | positioned is produced | generated and may supply to the same discharge apparatus 12, respectively.

The discharge device 12 is configured to discharge the steam supplied from each of the steam generators 13a and 13b into the film formation tank 11 from the discharge port 37 which is different for each type of organic material, respectively, or the main body. A cavity is formed in the part 35, and the steam which each steam generating apparatus 13a, 13b produced | generated is supplied to the same cavity, it mixes in the cavity, and the film formation tank 11 from each discharge port 37 is carried out. It is configured to be released in the interior of the.

In this example, in the discharge device 12, the main body 35 and the discharge plate 36 are arranged inside the film forming tank 11. If the airtightness of the film forming tank 11 is maintained, a discharge plate ( A part or all of the main body part 35 may be arrange | positioned outside the film formation tank 11, positioning 36 inside the film formation tank 11. As shown in FIG.

The moving device 17 is disposed above the discharge device 12 in the film forming tank 11. Inside the film formation tank 11, the film formation object 15 in which the substrate or the substrate and the mask are integrated into the holder 16 is carried in from the outside of the film formation tank 11 via the carrying-in port 81, The moving device 17 moves the holder 16 and the film-forming object 15 carried in together, stops at a position immediately above the discharge device 12 to form a film, and then forms the film formation tank from the discharge port 82. 11) It is configured to carry out outside.

An injection ejection chamber (not shown) or another vacuum processing chamber (not shown) is connected to the exterior of the delivery port 81 and the delivery port 82, and the carrying-in of the film forming object 15 from the delivery port 81 is performed. At the time of carrying out the film-forming object 15 from the delivery outlet 82, the vacuum atmosphere in the film-forming tank 11 is maintained.

The film formation surface forming the organic thin film of the film formation object 15 faces the emission device 12, is located directly above the emission device 12, and once in a state facing the emission plate 36 of the emission device 12. When it stops and discharge | releases the vapor | steam of organic material from the discharge port 37 of the discharge | release device 12, steam will arrive uniformly on a film-forming surface, and an organic thin film will be formed in a film-forming surface. The film forming object 15 may be formed by passing the position immediately above the discharge device 12 without stopping the film forming object 15.

Vapors of different organic materials are supplied to the discharge device 12 from the plurality of vapor generating devices 13a and 13b, and are discharged from the discharge device 12 so that the vapor of each organic material reaches the film forming surface of the film forming object 15. In this case, a gas in which the vapors of plural kinds of organic materials are uniformly mixed arrives to form an organic thin film.

The configuration of the steam generators 13a and 13b will be described.

Each steam generator 13a, 13b has the exchange apparatus 30, the material supply apparatus 20, the evaporation apparatus 40, the buffer apparatus 50, and the trap apparatus 60, respectively.

The exchange device 30 is connected to the material supply device 20, the material supply device 20 is connected to the evaporator 40, the evaporator 40 is connected to the buffer device 50, and the buffer device ( 50 is connected to the switching device 10. The switching device 10 is connected to the trap device 60 and the discharge device 12.

<Material supply device>

The material supply apparatus 20 has the storage container 21, the hollow normal part 23, and the linear rod-shaped body 25. The accumulating container 21 is inclined to the funnel lower part, and the opening is formed in the lower end of the funnel part. The normal part 23 is connected to the storage container 21 by the inside communicating with the opening of the lower end. The rod-shaped body 25 is vertically inserted into the inside of the normal part 23 and the storage container 21. The upper part of the rod-shaped body 25 is located above the funnel part of the accumulation container 21, and the lower part is located in the normal part 23. As shown in FIG.

In the rod-like body 25, a spiral projection 26 extending in the vertical direction while rotating is formed. In the storage container 21, the organic material of powder is arrange | positioned. In the normal part 23, the distance between the outer circumference of the protrusion 26 and the inner circumferential surface of the normal part 23 is formed to be narrower than the size of the particles of the organic material, and the organic material is formed between the protrusion 26 and the normal part 23. It is configured not to fall past the gap.

Moreover, when powder-like organic material is arrange | positioned in the storage container 21, organic material is comprised so that it may rise on the processus | protrusion 26, The spiral inclination of the processus | protrusion 26 is a state in which the rod-shaped body 25 was stopped. In the organic material, since the organic material is formed at an angle that does not slide or roll down on the projections 26, the organic material inside the storage container 21 is normally formed in the state where the rod-shaped body 25 is stopped. ) It does not fall past the inside of the projection (26).

The evaporation apparatus 40 has the evaporation tank 41, the through-hole is formed in the ceiling of the evaporation tank 41, and the lower end of the normal part 23 is airtightly inserted in the evaporation tank 41 from the through-hole. . The lower end of the normal part 23 is formed in a funnel, and the dropping port 24 is formed in the front-end | tip, The internal space of the normal part 23 and the internal space of the evaporation tank 41 are the falling-out port 24 It is connected by. Here, the evaporation tank 41 is arrange | positioned inside the film-forming tank 11.

The space between the projection 26 and the projection 26 has an upper end connected to the inner space of the storage container 21, and the lower end via the inner space of the normal part 23 and the dropping opening 24. 41) is connected to the internal space.

The rotating device 28 is connected to the rod-shaped body 25, and the rod-shaped body 25 is able to rotate about the perpendicular center axis line.

When the rod-shaped body 25 rotates in a predetermined direction, the organic material located on the protrusions 26 is extruded, falls from the lower end of the gap between the protrusions 26 and the protrusions 26, passes through the normal part 23, It enters inside the evaporation tank 41 from the dropping port 24. As shown in FIG.

In the state where the organic material is arranged in the storage container 21, the fall amount is proportional to the amount of rotation, and the relationship between the amount of fall and the amount of rotation is calculated in advance. When forming a thin film in one film-forming object, the rod-shaped object 25 rotates slowly by the rotation amount which an amount of organic material falls with respect to one film-forming object. Therefore, a small amount of organic material falls from the material supply apparatus 20 to the evaporation apparatus 40, and is supplied.

In this example, in the storage containers 21 of the steam generating apparatuses 13a and 13b, the chemical structures are different from each other, and for example, organic materials of the base material of the organic thin film and organic materials of the coloring agent are disposed separately. do. Content in an organic thin film is largely different in a base material and a coloring material.

<Exchange device>

The exchange apparatus 30 has the exchange chamber 31 which is a vacuum tank, and the exchange chamber 31 is arrange | positioned at the ceiling of the film-forming tank 11.

A partition valve 29 is formed between the exchange chamber 31 and the film formation tank 11, and the atmosphere in the exchange chamber 31 and the atmosphere in the film formation tank 11 can be connected via the partition valve 29. It is.

A storage device is formed in the storage container 21, and the storage container 21 is configured to be able to move up and down together with the normal part 23 and the rod-shaped body 25.

At the time of the film forming operation, the storage container 21 is disposed in the film forming tank 11, located directly under the compartment valve 29, and in the state where the compartment valve 29 is closed, the inside of the film forming tank 11 is in an atmospheric atmosphere. The vacuum exhaust system 19 which is separated from the film forming tank 11 and connected to the film forming tank 11 can be operated to bring the inside of the film forming tank 11 into a vacuum atmosphere.

The door 32 is formed in the exchange room 31, and when the door 32 is opened, the exchange room 31 can be connected to an atmospheric atmosphere.

The vacuum exhaust system 33 is connected to the exchange chamber 31, and vacuum exchanges the inside of the exchange chamber 31 by the vacuum exhaust system 33 with the compartment valve 29 and the door 32 closed, and the exchange chamber 31. When the vacuum atmosphere of the same degree as this film forming tank 11 is set, the storage container 21 located just below the partition valve 29 is moved upward with the normal part 23 and the rod-shaped body 25, and it partitions. The valve 29 is passed through, and the storage container 21 is loaded into the exchange chamber 31 together with the normal portion 23 and the rod-shaped body 25.

Subsequently, the compartment valve 29 is closed to remove the inside of the film formation tank 11 from the exchange chamber 31, and the vacuum exhaust system 33 is removed from the exchange chamber 31, and then air is introduced into the exchange chamber 31 to exchange the atmosphere. (31) The atmosphere is at atmospheric pressure. At this time, the vacuum atmosphere in the film formation tank 11 is maintained.

In that state, the door 32 is opened, and the inside of the storage container 21 and the atmospheric atmosphere are connected by the door 32, and the organic material is thrown into the storage container 21 in the atmospheric atmosphere. At this time, as described above, the organic material introduced into the storage container 21 does not slip or fall on the projections 26.

After the organic material is disposed in the storage container 21, the door 32 is closed to evacuate the inside of the exchange chamber 31 by the vacuum exhaust system 33, and the inside of the exchange chamber 31 is about the same as the film formation tank 11. Evacuate to pressure. At this time, the inside of the storage container 21 and the inside of the normal part 23 are also evacuated.

After the inside of the exchange chamber 31 is evacuated, the compartment valve 29 is opened to move the accumulation container 21 into the film formation tank 11 together with the normal part 23 and the rod-shaped body 25, so that the compartment valve 29 is closed. When located below, the compartment valve 29 is closed.

<Evaporator>

The above-described drop port 24 is located above the bottom of the evaporation tank 41, and the organic material dropped from the drop port 24 of the material supply device 20 is the evaporation tank 41. It collides with the bottom surface and stops on the bottom surface in contact with the bottom surface.

The evaporation heating device 42 which heats the evaporation tank 41 is formed around the evaporation tank 41. The heating device 42 for evaporation, such as a resistance heating element, is connected to the heating power supply 44, and when it is energized by the heating power supply 44, it generates heat and heats the evaporation tank 41. FIG.

Therefore, in the evaporation apparatus 40, since the bottom face of the evaporation tank 41 is heated by the evaporation heating apparatus 42, the bottom face of the evaporation tank 41 supplies the organic material supplied from the material supply apparatus 20. FIG. Heating section 43 for heating the organic material in contact with the.

Since the organic material has an evaporation temperature which is a temperature at which evaporation is started and does not immediately evaporate when heated to the evaporation temperature when heated, the organic material is heated to a higher temperature than the evaporation temperature. The higher the temperature, the faster the evaporation rate, but the higher the temperature, the greater the amount of decomposition.

The heat generation of the heating device 42 for evaporation is controlled according to the energization amount of the power supply 44 for heating, and the heating part 43 becomes the steam generation temperature which is higher than the evaporation temperature of the organic material arrange | positioned at the surface. have. The vapor formation temperature is so hot that decomposition of organic materials does not occur. The organic material on the heating part 43 is heated up to the steam generation temperature and evaporated, and steam of the organic material is generated.

Further, the heating member is disposed on the bottom surface of the evaporation tank 41, and the heating member is brought into contact with the heating member 42 by bringing the organic material supplied from the material supply device 20 into contact with the heating member. When it heats, the heating member turns into the heating part 43, and vapor | steam generate | occur | produces.

Moreover, in the evaporation tank 41, you may provide the material supply amount measuring means 100 which measures the mass of the organic material which fell from the fall port 24. FIG. For example, the material supply amount measuring means 100 includes a material accommodating member 101 and a temperature measuring analyzer 102. The temperature measurement analyzer 102 measures the temperature of the material accommodating member 101. The material accommodating member 101 is heated to a constant temperature by the heating device 42 for evaporation, but when the organic material falls, the temperature temporarily decreases due to the heat capacity of the organic material and the heat of vaporization. The correspondence table is prepared by measuring the fall amount and temperature change of material beforehand. The temperature measurement analyzer 102 calculates the fall amount of the organic material from the temperature of the material accommodating member 101 and the correspondence table.

The evaporation tank 41 and the discharge device 12 are connected by connecting pipes 45 (45 ₁ to 45 ₃ ), and a buffer device 50 is formed therein.

Moreover, the switching device 10 which consists of a three-way valve is formed in the connection pipe 45 between the buffer device 50 and the discharge device 12. The trap tank 61 of the trap apparatus 60 mentioned later is connected to the switching device 10, and according to the operation | movement of the switching device 10, the buffer apparatus 50 is a discharge apparatus 12 and a trap apparatus ( It is comprised so that it may be connected to either one of 60). The buffer device 50 may not be connected to either.

The trap tank 61 is connected to the inside of the film formation tank 11 or the vacuum exhaust system 19. Here, the inside of the film formation tank 11 is connected.

At the time of film formation, the film formation tank 11 is continuously evacuated by the vacuum exhaust system 19 connected to the film formation tank 11, and the buffer device is provided if the buffer device 50 is connected to the discharge device 12. The 50 and the evaporation tank 41 are evacuated by the vacuum exhaust system 19 via the discharge device 12. When the buffer device 50 is connected to the trap device 60, the buffer device 50 is evacuated through the trap device 60.

In the material supply apparatus 20, the rod-shaped object 25 rotates slowly, and the quantity of organic material supplied with respect to one film-forming object is supplied to the heating part 43 little by little.

The organic material in contact with the heating part 43 is evaporated in a short time, and the organic material located on the heating part 43 does not increase. As a result, in the evaporation tank 41, the organic material is maintained at a constant evaporation rate. Steam of material is generated.

The reverse flow prevention gas supply system 49 is connected to the normal part 23, and the reverse flow prevention gas is introduced so that the steam generated in the evaporation tank 41 does not enter the accumulation container 21. Moreover, the backflow prevention gas suppresses the rise of the temperature of the normal part 23, and prevents the organic material in the normal part 23 from dissolving or subliming. The backflow preventing gas in the evaporator 41 is heated to a temperature approximately equal to the temperature in the evaporator 41. The backflow preventing gas is a rare gas such as argon.

Since the pressure in the evaporation tank 41 and the pressure in the film formation tank 11 are low in the film formation tank 11, steam flows out in the film formation tank 11 direction together with the backflow preventing gas.

<Buffer device>

The buffer device 50 has a buffer tank 51, and the other end of the connection pipe 45 ₁ , one end of which is connected to the opening 48 of the evaporation tank 41, has the other end of the buffer tank 51. It is connected to the opening 53, and steam moves inside the connection pipe 45 ₁ toward the buffer tank 51. As shown in FIG.

Further, the connection pipe 45 (45 ₁ to 45 _3), the thermostat (46) is wound, and is heat by energization from the insulating power source 47 for a connection pipe (45), a steam generating device (13 It heats up to the temperature more than the evaporation temperature of the organic material arrange | positioned at

The buffer part 52 which has several thin flow paths through which gas flows is arrange | positioned inside the buffer tank 51, When a vapor flows in a flow path, steam will collide with the wall surface of the flow path in the buffer part 52. As shown in FIG.

In the example, the buffer part 52 partially overlaps with a metal fine wire, the clearance gap of a metal fine wire becomes a flow path, and specifically, it can also be comprised by laminating a plurality of metal nets.

The buffer temperature control device 55 is provided around the buffer tank 51, and when the buffer power supply 56 is energized by the buffer temperature control device 55, the buffer temperature control device 55 generates heat. The buffer tank 51 and the buffer part 52 are heated.

The temperature of the buffer temperature control device 55 is controllable in accordance with the energization amount of the buffer power supply 56. In addition, the temperature controller 55 for buffers may have a means for cooling the buffer part 52. When the temperature of the buffer layer 51 is lower than the evaporation temperature of the organic material by the temperature controller 55 for buffers, the organic material precipitates in the buffer layer 51 and accumulates in the buffer portion 52.

When the temperature of the buffer layer 51 is made higher than the evaporation temperature of the organic material by the temperature controller 55 for buffers, the organic material is re-evaporated in the buffer layer 51 and discharged from the buffer layer 51. In addition, the buffer temperature control apparatus 55 is controlled by the detection value of the film thickness sensor 86 mentioned later.

Specifically, when the detected value of the film thickness sensor 86 is smaller than the desired value, the temperature of the buffer unit 52 is increased, and when it is larger than the desired value, the temperature of the buffer unit 52 is lowered. The opening 53 for the gas inflow of the buffer tank 51 is covered by the buffer part 52, and in the buffer part 52, the gap where the net and the net overlap or the part where the net overlaps, the vapor and the backflow prevention gas It becomes a flow path, and steam flows through the buffer part 52.

Buffer container (51) is formed at the outlet opening (57) for, and one end of a connecting pipe (45 ₂₎ connected to the opening 57, and the other end is connected to a switching device 10.

In addition, the switching device 10 are connected to the trap tank 61 of the main body portion 35 and the trap apparatus 60, the discharge device 12 by a connecting pipe (45 _3, 69).

The switching device 10 is configured to connect the buffer device 50 to one of the discharge device 12 and the trap device 60, and when the buffer device 50 is connected to the discharge device 12. The steam flowing out of the buffer tank 51 is introduced into the main body portion 35 of the discharge device 12, and in the trap tank 61 of the trap device 60 when it is connected to the trap device 60. Is introduced.

In the case where the organic material is dropped and evaporated to generate steam of the organic material, the amount of steam generated may fluctuate depending on the variation of the drop speed of the material. In particular, since the organic material is powder, it is difficult to drop a certain amount at the same speed. However, if it accumulates once in the buffer device 50 and evaporates it again, control of the evaporation rate is easy and a certain amount of steam can be supplied. Moreover, if the organic material is accumulated at a temperature close to the evaporation temperature below the evaporation temperature, the buffer device 50 can be quickly heated up above the evaporation temperature. Moreover, since the time for accumulating the organic material in the buffer device 50 is a short time, the organic material does not deteriorate.

Specifically, while exchanging the film forming object 15, organic materials are accumulated in the buffer device 50, and control is performed so that steam is released from the buffer device 50 during film formation.

At the time of accumulation, steam is supplied from the evaporation device 40, the buffer device 50 is set to the evaporation temperature or less, and the buffer device 50 is connected to the trap tank 61 by the switching device 10. In order to control the amount accumulated in the buffer device 50, the rotation speed of the rotating device 28 is controlled based on the measurement result of the material supply amount measuring means 100.

At the start of film formation, when the buffer device 50 is set to the evaporation temperature or more and the detection value of the film thickness sensor 86 becomes constant, the buffer device 50 is switched from the switching device 10 to the discharge device 12. Connect. In film formation, in order to control the temperature of the buffer device 50, the buffer temperature control device 55 is controlled according to the detection value of the film thickness sensor 86 described later. At the time of film formation, steam may be supplied to the buffer device 50 from the evaporation device 40 at a supply amount slower than the film formation speed, or the vapor from the evaporation device 40 may be stopped. When it is detected that the film formation of the specified thickness is completed in accordance with the detection value of the film thickness sensor 86, the connection destination of the switching device 10 is switched to the trap tank 61, and the temperature of the buffer device 50 is lower than the evaporation temperature. Lower it.

<Trap device>

When the switching device 10 connects the buffer device 50 to the trap device 60, the vapor discharged from the buffer device 50 is introduced into the trap tank 61.

Inside the trap tank 61, it has the metal trap part 62 which the steam introduce | transduced in the trap tank 61 contacts.

A cooling medium pipe 63 is wound around the trap tank 61, and a liquid cooling medium cooled in the circulation device 66 is supplied to the cooling medium pipe 63, and the trap tank 61 and the trap part 62 are provided. ) Is cooled to a trap temperature that is lower than the evaporation temperature of the organic material that generated the steam supplied to the trap device 60. The cooling medium flowing through the cooling medium pipe 63 returns to the circulation device 66, is cooled in the circulation device 66, and is supplied to the cooling medium pipe 63 again.

One end of the waste pipe 68 is connected to the trap tank 61, and the discharge port 67, which is the other end of the waste pipe 68, is disposed in the film forming tank 11.

Vapor in contact with the surface of the trap part 62 in the trap tank 61 is precipitated on the surface of the trap part 62 and removed from the gas flowing in the trap tank 61. Therefore, the gas discharged from the discharge port 67 contains almost no vapor of the organic material, and most of the gas introduced as the backflow prevention gas is evacuated by the vacuum exhaust of the vacuum exhaust system 19.

The organic material precipitated in the trap part 62 can be collect | recovered by taking out the trap part 62 from the inside of the trap tank 61, and peeling or re-evaporating.

In addition, as shown in FIG. 3, the film-forming apparatus 3 of this invention does not form the trap apparatus 60, but the switching apparatus 10 releases the discharge apparatus 12 of the buffer apparatus 50, The connection between the waste pipes 68 is switched, and the discharge port 67 at the tip of the waste pipe 68 is disposed at a position different from the lower side of the film formation object 15 of the film forming tank 11, or the discharge port is vacuumed. It is also possible to connect to the exhaust device (second example). The other structure is the same as that of the film-forming apparatus 2 of FIG.

The trap part 62 is spaced apart from each other, and the gap is formed of a plurality of metal plates through which steam or a backflow prevention gas flows. The trap part 62 may be formed by stacking a collection of metal fibers or a plurality of metal nets. do. In addition, these may not be metal.

<Film thickness sensor>

In the film forming apparatus (2, 3) of the present invention, the buffer device 50 and the switching device 10, the sampling device 84 in the path (in this case, the connection pipe (45 _2)), the steam flowing between the mounted, the sampling device From the pores 85 formed in the 84, the vapor before passing through the buffer unit 52 and reaching the switching device 10 is extracted together with the backflow preventing gas, and the film forming object 15 in the film forming tank 11 is formed. At a position different from the passing position of, part of the connection pipe 45 ₂ is discharged.

The film thickness sensor 86 is arrange | positioned in the position which faces the pore 85, and the gas discharged | emitted from the pore 85 into the film formation tank 11 reaches the film thickness sensor 86, and it reaches | attains the reaching gas. The organic thin film is formed on the surface of the film thickness sensor 86 by the vapor of the organic material therein.

The relationship between the film thickness of the organic thin film growing on the surface of the film thickness sensor 86 and the film thickness of the organic thin film held by the holder 16 and grown on the film forming object 15 located on the emitting device 12 are The film thickness sensor 86 is measured by the measurement device 87 to which the film thickness sensor 86 is connected even though the vapor emitted from the buffer device 50 is guided to the trap device 60. ) From the film thickness of the organic thin film formed on the surface, the film thickness of the organic thin film when the vapor induced by the trap device 60 reaches the film forming target 15 can be obtained. The film-forming speed on the film-forming object 15 surface can also be calculated | required by the film thickness sensor 86 and the measurement apparatus 87 from the film-forming time. Based on the detected value of the film thickness sensor 86, the temperature of the temperature controller 55 for buffers is controlled, and the amount of re-evaporation from the buffer device 50 is controlled. Moreover, based on the detection value of the film thickness sensor 86, the time of film-forming completion is detected.

<Film formation work>

When the film forming operation is started, after the buffer device 50 is connected to the discharge device 12 by the switching device 10, one film formation object 15 is held in the holder 16 to release the device 12. ) Is located above.

The composition and film thickness of the organic thin film formed on the film forming object 15 are determined, and are necessary for the formation of the organic thin film of one film forming object 15, and are evaporated in the plurality of vapor generating devices 13a and 13b. The required amount of each organic material is known, and the required amount of the organic material disposed in each of the steam generating devices 13a and 13b is determined from the material supply device 20 at a constant supply rate rate (feed rate rate = required amount / deposition time). ) Into the evaporation tank 41 to generate steam by the heating section 43.

Here, by rotating device 28, rod-shaped body 25 is rotated so that supply speed becomes a fixed value, and organic material on spiral protrusion 26 moves from upper part to lower part in normal part 23, and The organic material falls in the evaporation tank 41 from the dropping port 24 at the bottom of the ordinary portion 23. The supply speed is a value according to the rotation speed, and the rotation speed is a value according to the required amount.

The generated vapor of each organic material is temporarily accumulated and re-evaporated in the buffer device 50, and is supplied to the discharge device 12 at a stable supply rate. When the film is discharged from the discharge port 37 into the film forming tank 11 at a predetermined discharge rate (the amount of vapor released per unit time), the composition has a predetermined value on the surface of the film forming object 15 at a predetermined film thickness in the film thickness direction. As a result, a constant organic thin film is formed.

The heater 38 is provided, and the discharge | release device 12 heats when it is energized by the power supply 39, and heats the main-body part 35 and the discharge plate 36. FIG. When the vapors of the plurality of organic materials are supplied, the discharge device 12 is heated to a temperature equal to or higher than the highest evaporation temperature among the vaporization temperatures of the supplied vapors.

After the organic thin film of predetermined film thickness is formed, the film-forming object 15 on the emission device 12 is moved on the emission device 12, and the film-forming object of a film formation is arrange | positioned on the emission device 12. As shown in FIG.

When the supply of the required amount of the organic material is completed, the rotation of the rod-shaped body 25 is stopped. Therefore, when the film forming object 15 is not positioned on the discharge device 12, the organic material is heated on the heating part 43. Are not placed and no futile steam is produced.

However, while the film forming target 15 is not disposed on the discharge device 12, the buffer device 50 may be connected to the trap device 60 by the switching device 10.

In addition, in the film-forming apparatuses 2 and 3 of the 1st, 2nd example, although the structure of the some steam generating apparatuses 13a and 13b which each film-forming apparatuses 2 and 3 have is the same, you may differ. For example, in the film-forming apparatus 4 shown in FIG. 4, the organic compound used as a base material is the steam generating apparatus of the same structure as the steam generating apparatus 13a, 13b of the film-forming apparatuses 2 and 3 of a 1st, 2nd example. The steam generator 14 which has the evaporation container 71 in which the organic compound 72 which is a dopant material is arrange | positioned is connected to the same discharge apparatus 12 while connecting 13c to the discharge apparatus 12. It is.

The organic compound 72 which is a dopant material of this steam generator 14 is arrange | positioned in the evaporation container 71 with the quantity with respect to several sheets of board | substrate.

Around the evaporation container 71, a heating device 78 for evaporation such as a resistance heating element is wound, and the evaporation container 71 is connected to the discharge device 12 by a connection pipe 45 ₅ . . In this case, is connected to the first, the second example a film-forming device (2, 3) connected to connecting the steam-generating device (13a, 13b) switching device 10 and discharge device 12 of the pipe shown in (45 ₃₎ have.

Then, the heating power source 79 for heating evaporates and heats the heating device 78 for evaporation, thereby heating the evaporation container 71. When the internal organic compound 72 reaches a temperature equal to or higher than the evaporation temperature, the organic compound vapor is generated inside the evaporation container 71.

(Here, the middle of a connection pipe (45 _5)), evaporation vessel 71 and the discharge device (12) for between is provided with a switching device 70 comprising a three-way valve is formed.

A trap device 90 is connected to the switching device 70, and the steam generated in the evaporation container 71 by switching of the switching device 70 is a discharge device 12 and a trap device 90. ) Can be supplied to either side. It is possible to prevent the evaporation container 71 from being connected to either by the switching device 70.

When the evaporation container 71 is connected to the discharge device 12, the vapor of the organic compound 72 generated inside the evaporation container 71 is supplied to the discharge device 12. At this time, if the organic compound vapor generated in the evaporation tank 41 is supplied from the buffer device 50 to the discharge device 12, the vapor generated in the evaporation container 71 is supplied to the discharge device 12. And both of the steam generated in the evaporation tank 41 are introduced into the discharge device 12.

The carrier gas supply system 73 is connected to the evaporation container 71, and vapor generated in the evaporation container 71 is supplied to the discharge device 12 along with the carrier gas through the carrier gas flow. It is configured to be.

When the vapor supply from the evaporation container 71 to the discharge device 12 is stopped, the evaporation container 71 is blocked by the switching device 70 between the discharge device 12 and the evaporation container 71. ) Can be connected to the trap device 90.

The trap apparatus 90 has the trap tank 77, The inside is connected to the inside of the film-forming tank 11, and is comprised so that it may vacuum-exhaust by the vacuum exhaust system 19. As shown in FIG.

The trap part 96 which vapor | steam contacts is formed in the inside of the trap tank 77, and the cooling medium pipe 93 is wound around the trap tank 77. As shown in FIG.

The cooling medium pipe 93 is connected to the circulation device 92, and the liquid cooling medium cooled from the circulation device 92 is supplied to flow in the cooling medium pipe 93.

The temperature of the trap tank 77 and the trap part 96 is cooled by the cooling medium which flows in the cooling medium pipe 93 to the trap temperature lower than the evaporation temperature of the vapor which flows in the trap tank 77, have. In each cooling medium pipe | tube 63 and 93 and each circulation apparatus 66 and 92, a low temperature apparatus is comprised, respectively.

In the state where the trap part 96 is cooled by the trap temperature, the vapor of the organic compound 72 flows toward the trap apparatus 90 from the evaporation container 71 toward the trap apparatus 90 by itself or with a carrier gas. When introduced into the vapor, the vapor contacts the trap portion 96 and adheres to the surface of the trap portion 96.

Since the inside of the film forming tank 11 is evacuated by the vacuum exhaust system 19, the carrier gas discharged from the trap device 90 and the vapor of the extremely small amount of organic compound are transferred to the vacuum exhaust of the vacuum exhaust system 19. By exhaust.

The organic compound attached to the trap parts 62 and 96 can be recovered and reused.

Further, the connection between the pipe (45 ₅₎ conversion unit 70 and the evaporation vessel (71) for the, fitted with a sampling device 75, and facing in close proximity with the orifice (95) formed in the sampling device 75 The film thickness sensor 76 is arrange | positioned at the position. The film thickness sensor 76 is connected to the measuring device 74.

The sampling device 75 and the film thickness sensor 76 are the same as the sampling device 84 between the buffer device 50 and the switching device 10, and the film thickness sensor 86 facing the same. A portion of the steam flowing in the connecting pipe 45 ₅ is discharged from the pores 95 of the sampling device 75 into the film formation tank 11 alone or in a state where it flows into the trap device 90 together with the carrier gas. It reaches the film thickness sensor 76, and forms a thin film on the surface. The thickness of the formed film thickness is measured by the measuring apparatus 74, and the film-forming speed is calculated | required from the formed time.

When the obtained film formation rate becomes a predetermined value, the vapor of the dopant can be supplied to the discharge device 12 from the evaporation container 71.

When the film formation rate by the dopant and the film formation rate obtained by the film thickness sensor 86 by the steam supplied from the buffer device 50 to the discharge device 12 are both predetermined values, the film forming object ( It becomes the state which can form a thin film on the surface of 15).

At this time, the vapor which flowed in into the trap apparatuses 60 and 90 from the evaporation container 71 and the buffer apparatus 50, respectively, with the carrier gas by the switching apparatuses 10 and 70 is discharge | release apparatus 12 The organic thin film to which the dopant is added is formed on the surface of the film forming object 15 when it is switched to be supplied to the film, and the discharge device 12 and the film forming object 15 are stopped or moved to face each other.

Even during the formation of the organic thin film on the surface of the film forming object 15, the film formation rate is measured by the film thickness sensor 76 and the measuring device 74, and the heating power source 79 is the evaporation container 71. It controls the amount of evaporation heating devices 78 for the ambient and so that the vapor pressure in the connecting pipe (45 ₅₎ constant, and controlling the steam generation rate in the evaporation vessel 71 for.

In addition, in the third example, the dopant is not disposed in the storage container 21 but is disposed in the evaporation container 71. The organic compound of the base material and the organic compound of the dopant are mixed without forming the evaporation container. It can also arrange | position in the storage container 21. However, it is easy to arrange | position separately to the storage container 21 and the evaporation container 71, and to manage the evaporation rate.

Since the dopant is less evaporation than the base material, there is a case where back flow of vapor of the base material in the connecting pipe (45 _3), connecting pipe (45 ₅₎ from. The pressure in the connecting pipe (45 _3), connecting pipe (45 ₅₎ from the can to prevent a back flow by forming a non-return baffles 110 within, the connection pipe (45 ₅₎ Since the molecular flow region.

<Others>

In each of the above embodiments, two steam generators 13a and 13b are connected to one discharge device 12, but three or more steam generators may be connected to one discharge device 12.

The steam generation temperature between the plurality of steam generating apparatuses is different for each steam generating apparatus according to the type of organic material, and the optimum steam generation is stabilized without decomposition depending on the type (chemical structure) of the organic material and the composition of the organic thin film. It is set to a value.

In addition, the adsorptive desorption temperature between the plurality of steam generating apparatuses is also different for each steam generating apparatus depending on the type of organic material, and the optimum value that can uniformize fluctuations in steam generation according to the type (chemical structure) of the organic material. Is set.

In addition, one vapor generating device may be connected to one discharge device 12. In this case, since the organic thin film is formed by the buffer device 50 at a constant film formation rate, the film quality is uniform in the film thickness direction. An organic thin film can be formed. Moreover, the organic material by the trap apparatus 60 can also be collect | recovered.

In addition, in the buffer tank 51, when comparing the meshes of the nets from which the distance from the opening 53 into which steam flows is different, the number per mesh area of the meshes of the laminated nets is closer to the opening 53. It is the same in the net of the far side and a lot of the net of the far side. This arrangement can prevent the interior from being blocked at the time of accumulation in the buffer device 50.

2 to 5: film forming apparatus
10, 70: switching device
11: Tabernacle
12: release device
13a, 13b: steam generating device
15: object of the tabernacle
21: accumulation vessel
41: evaporator
43: heating unit
45, 45 ₁ to 45 ₅ : connection pipe
50: buffer device
52: buffer part
60, 90: trap device
71: evaporation container

Claims (22)

The deposition tank in which the deposition object is placed,
A steam generator for generating steam of an organic material,
Has a discharge device to which the steam generated in the steam generating device is supplied;
A film forming apparatus of an organic thin film in which the vapor is discharged into the film forming tank from a discharge port formed in the emitting device,
The steam generator includes a material supply device for supplying the organic material;
An evaporation device for supplying the organic material from the material supply device to evaporate the organic material;
A buffer unit for depositing and re-evaporating the steam generated in the evaporation apparatus;
It has a temperature control apparatus for buffers which controls the temperature of the said buffer part,
The vapor generated in the evaporation device is supplied to the discharge device through the buffer portion, the organic thin film is formed on the film forming object. The method of claim 1,
A film forming apparatus having a plurality of the vapor generating devices. 3. The method according to claim 1 or 2,
It has a film thickness monitor for detecting a part of the vapor from the buffer portion,
The film forming apparatus, wherein the temperature controller for buffer controls the temperature of the buffer unit based on a detection value of the film thickness monitor. 3. The method according to claim 1 or 2,
The material supply apparatus is a film forming apparatus that rotates an axis having a spiral to drop the organic material onto the evaporator. 3. The method according to claim 1 or 2,
The said evaporation apparatus is a film-forming apparatus which has a material supply amount measuring means which measures the quantity of the said organic material supplied from the said material supply apparatus. The method of claim 5, wherein
The material supply amount measuring means includes a housing member for accommodating the organic material supplied from the material supply device and a temperature measuring analyzer for calculating the supply amount of the organic material from a temperature change of the housing member. 3. The method according to claim 1 or 2,
The film forming apparatus, wherein the buffer part is formed by collecting a plurality of fine metal wires, the fine metal wires partially overlap each other, and a flow path is formed by a gap between the fine metal wires and the fine metal wires. 3. The method according to claim 1 or 2,
The buffer unit is composed of a plurality of nets,
A film forming apparatus, wherein a flow path is formed in a gap between the mesh of the net and the mesh. The method of claim 8,
Among the plurality of nets, the number of meshes per unit area of the first net is equal to or less than the number of meshes per unit area of the second net located downstream from the first net of the steam flowing in the buffer part. Deposition device. 3. The method according to claim 1 or 2,
The film-forming apparatus with which the backflow prevention gas supply apparatus which supplies a backflow prevention gas is connected to the said material supply apparatus. 3. The method according to claim 1 or 2,
The said vapor generating apparatus has a film-forming apparatus which has a switching device which changes the advancing direction of the steam which passed the said buffer part between a 1st direction which is inside the said discharge apparatus, and a 2nd direction which goes outside the inside of the said discharge apparatus. . The method of claim 11,
The steam generating device,
A trap device in which the steam is in contact with the trap unit, the trap unit being configured to be evacuated by vacuum;
It has a low temperature apparatus which cools the said trap part to the trap temperature lower than the said evaporation temperature,
The film forming apparatus, wherein the second direction is inside the trap tank. The deposition tank in which the deposition object is placed,
A steam generator for generating steam of an organic material,
Has a discharge device to which the steam generated in the steam generating device is supplied;
A film forming apparatus of an organic thin film in which the vapor is discharged into the film forming tank from a discharge port formed in the emitting device,
The steam generating device,
A material supply device for supplying the organic material;
An evaporation device for evaporating the organic material supplied from the material supply device,
A trap device in which the steam is in contact with the trap unit, the trap unit configured to be evacuated in the trap tank;
A low temperature device for cooling the trap portion to a trap temperature lower than the evaporation temperature;
It has a switching device which changes the advancing direction of the said steam produced | generated by the said evaporation apparatus to either one of the said discharge apparatus and the said trap part,
And the vapor is supplied to the discharge device so that the organic thin film is formed on the film forming object. 14. The method of claim 13,
The steam generating device has a film thickness sensor,
A portion of the steam generated in the steam generating device and before reaching the switching device is led to the film thickness sensor,
And the organic thin film is grown on the film thickness sensor. The method according to claim 13 or 14,
A film forming apparatus having a plurality of the steam generating devices connected to the same discharge device. The method of claim 15,
A film forming apparatus, wherein organic materials having different chemical structures are disposed in each of the material supply apparatuses of the plurality of steam generating apparatuses. The method of claim 15,
The film-forming apparatus in which the organic material which has the chemical structure different from each other arrange | positioned at the said material supply apparatus of several said steam generating apparatus differs in content rate in the said organic thin film formed. 3. The method according to claim 1 or 2,
The said evaporation apparatus is connected with the evaporation container in which the submaterial which is an organic compound contained in a small quantity rather than the said organic material is arrange | positioned in the said organic thin film, and the vapor | steam of the said submaterial is discharge | released at the introduction rate smaller than the vapor | steam of the said organic material. A film forming apparatus, configured to be introduced into the film. The method of claim 18,
The trap part which the vapor | steam of the said material contacts is arrange | positioned in the inside of a trap tank, and the inside of the said trap tank has a boot wrap apparatus comprised so that vacuum exhaust was possible,
And the vapor of the subsidiary material generated in the evaporation container is configured to be introduced into the discharge device and the boot wrap device and introduced. The organic material is supplied to the heating unit at a rate determined according to the required amount to generate steam,
The vapor is introduced into the buffer portion to precipitate in the buffer portion,
Evaporating the organic material precipitated in the buffer unit,
An organic material film-forming method wherein the re-evaporated vapor is released to a substrate to form a film. 21. The method of claim 20,
Measure a portion of the vapor derived from the buffer unit,
The organic material film-forming method of controlling the temperature of the said buffer part based on the measured value. 22. The method according to claim 20 or 21,
The temperature of the buffer portion is lower than the evaporation temperature of the organic material to precipitate the vapor in the buffer portion when the substrate is replaced,
And the temperature of the buffer portion is higher than the evaporation temperature of the organic material so that the organic material precipitated in the buffer portion is evaporated again during the film formation on the substrate.

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