KR101373766B1 - Semiconductor chiller device that does not use coolant - Google Patents

Semiconductor chiller device that does not use coolant Download PDF

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Publication number
KR101373766B1
KR101373766B1 KR1020130018544A KR20130018544A KR101373766B1 KR 101373766 B1 KR101373766 B1 KR 101373766B1 KR 1020130018544 A KR1020130018544 A KR 1020130018544A KR 20130018544 A KR20130018544 A KR 20130018544A KR 101373766 B1 KR101373766 B1 KR 101373766B1
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South Korea
Prior art keywords
refrigerant
coolant
cooling
temperature
circuit
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KR1020130018544A
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Korean (ko)
Inventor
황학원
조용환
김제민
여태근
오대균
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(주)시나텍
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/2872—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation
    • G01R31/2874—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to temperature
    • G01R31/2877—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to temperature related to cooling

Abstract

The present invention relates to a chiller, and more particularly, to a cryogenic chiller for a semiconductor probe test that can linearly perform cooling / heating control of a coolant only by a coolant circuit without configuring a coolant circuit.
More specifically, the present invention, in the cooling device for the probe test of the semiconductor and LED (Light Emitting Diode), a refrigerator for cooling the refrigerant, a condenser for condensing and liquefying the vaporized refrigerant, in the condenser A refrigerant circuit for storing a liquefied refrigerant liquid, a multi-stage cooling heat exchanger for cooling the hot gas generated in the freezer and a refrigerant circuit formed of a controller capable of controlling the amount of hot or cold gas at the outlet of the freezer, A semiconductor probe which heat transfers the cooled refrigerant directly to a test chuck, and controls the temperature of the refrigerant by exchanging heat between the naturally occurring hot gas and the refrigerant having undergone condensation, multi-stage cooling, and expansion in the refrigerator. Provide cryogenic chillers for testing.

Description

Semiconductor chiller device without coolant {SEMICONDUCTOR CHILLER DEVICE THAT DOES NOT USE COOLANT}

The present invention relates to a chiller, and more particularly, to a cryogenic chiller for a semiconductor probe test that can linearly perform cooling / heating control of a coolant only by a coolant circuit without configuring a coolant circuit.

Currently, the cooling devices used in the semiconductor process perform a function of transferring heat by circulating heat transfer through the heat exchanger between the primary refrigerant and the secondary refrigerant to a local portion of the wafer chamber. It can be divided into cryogenic chiller for probe test.

First, the semiconductor process cooling apparatus functions to extract heat generated by a plasma source or the like during the processing of a wafer (ETCH, CVD process, etc.) by circulating the coolant.

The cooling device for a general semiconductor process is formed in a structure in which a refrigerator and a heater are operated at the same time because the control temperature range of the coolant sent out from the cooling device is broadly set to -20 ° C. to 20 ° C. according to the type of process.

On the other hand, the cryogenic chiller for the semiconductor probe test always maintains the coolant temperature at -80 ° C inside the chiller, and then cools the -80 ° C coolant in the probe after the high-temperature process test on the probe side. It functions to circulate.

In this process, when the temperature of the test chuck reaches -50 ℃ ~ -40 ℃, low temperature process test is performed.

That is, the cryogenic chiller for testing a semiconductor probe has a feature of cooling and maintaining the temperature of the coolant at -80 ° C to circulate and control the test chuck.

A conceptual diagram of a conventional cryogenic cooling apparatus 2000 is shown in FIG. 1, and a configuration diagram of a conventional cryogenic cooling apparatus 2000 is illustrated in FIG. 3.

The conventional cryogenic cooling device 2000 includes a refrigerant circuit 1100, as well as a separate coolant circuit 2100 for cooling the coolant.

The semiconductor probe test using the conventional cryogenic cooling device 2000 is divided into a high temperature and a low temperature process, and the test is performed through the interface communication between the prober and the cryogenic cooling device 2000 as follows.

First, all of the coolant in the external pipe and the test chuck 3000 are recovered to the coolant tank 230 of the cooling apparatus 2000 by using dry air, and the temperature is 120 ° C. through the heater 220 under the test chuck 3000. There is a high temperature process test to test by transferring heat to the wafer by raising the temperature to about 150 ° C., and when the high temperature process test is finished, the heater 220 is turned off and the temperature of the test chuck 3000 becomes about 50 ° C. or less. Naturally cooled until.

The coolant recovered in the coolant tank 230 during the high temperature process test is cooled and maintained at −80 ° C., and when the temperature of the test chuck 3000 is about 50 ° C. or less, the coolant at −80 ° C. cools the tank 230. Coolant circulation pump 240, 241, the external coolant supply line, the test chuck 3000, the external coolant return line and the coolant tank 230 in the order of gradually lowering the temperature of the test chuck 3000 to -80 ℃ There is a low temperature process test to be done.

However, the conventional cryogenic cooling apparatus 2000 has a problem in that heat exchange loss occurs due to heat exchange between the primary refrigerant of the refrigerant circuit 1100 and the secondary refrigerant of the refrigerant circuit 2100, and thus, it is impossible to perform efficient cooling.

In addition, due to the configuration of the coolant circuit 2100 for additional cooling of the coolant, additional components such as a heater 220, various pumps, a coolant tank 230, a coolant line, and the like, which are applied thereto, increase costs. There is another problem.

In addition, due to the volume occupied by the coolant circuit 2100, the size of the equipment is increased, so there is a difficulty in manufacturing the device.

SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned problems of the prior art, and provides a cryogenic chiller for a semiconductor probe test having a more efficient temperature control function by removing a coolant circuit using a secondary refrigerant from a chiller. have.

In addition, the present invention provides a cryogenic cooling device for semiconductor probe test that can easily arrange the configuration, simplify the manufacturing method, and reduce the manufacturing cost by removing unnecessary components such as heaters, various pumps, coolant tanks and coolant lines. There is another purpose.

The technical objects to be achieved by the present invention are not limited to the above-mentioned technical problems, and other technical subjects which are not mentioned can be clearly understood by those skilled in the art from the description of the present invention .

According to the present invention for solving the above-mentioned problems of the prior art, in the cooling device for probe test of semiconductor and LED (Light Emitting Diode), a refrigerator for cooling the refrigerant, a condenser to condense and liquefy the vaporized refrigerant, the A refrigerant circuit configured to include a receiver for storing the refrigerant liquid liquefied in a condenser, a multi-stage cooling heat exchanger for cooling the hot gas generated in the freezer, and a controller capable of controlling the amount of hot or cold gas at the outlet of the freezer. And directly controlling the temperature of the refrigerant by heat-transferring the cooled refrigerant directly to a test chuck and exchanging heat between the naturally occurring hot gas in the refrigerator and the refrigerant having undergone condensation, multi-stage cooling, and expansion. Provides cryogenic chillers for semiconductor probe testing.

In the present invention, the refrigerant is preferably any one selected from methane refrigerant, ethane refrigerant, propane refrigerant, azeotropic mixed refrigerant, azeotropic mixed refrigerant, organic compound refrigerant, inorganic compound refrigerant or unsaturated organic compound refrigerant.

In the present invention, the refrigerant circuit preferably further includes a pressure sensor capable of sensing the pressure of the refrigerant and a temperature sensor capable of sensing the temperature of the refrigerant.

Preferably, at least one of a proportional control motor valve, a proportional control automatic expander, or a control heat exchanger is mounted to the discharge portion of the refrigerator to control the temperature of the refrigerant circuit.

In the present invention, the refrigerant circuit preferably further includes a motor valve for opening and closing to vacuum the heat exchange line in the outer pipe and the chamber.

In the present invention, the refrigerant circuit is preferably configured to further include a vacuum pump that can remove the moisture of the heat exchange line in the outer pipe and the chamber.

In the present invention, the refrigerant circuit preferably further includes a refrigerant bypass circuit for lowering the temperature of the refrigerant.

In the present invention, the refrigerant bypass circuit is preferably operated until the temperature of the refrigerant is cooled to -80 ℃.

The present invention has the effect that the cooling / heating control can be performed linearly without using a heater having a high power consumption by removing the coolant circuit using the unnecessary secondary refrigerant in the cooling device.

In addition, by directly circulating the low-temperature refrigerant controlled temperature in the cooling device using only the primary refrigerant to the test chuck has the effect of reducing the heat exchange loss than the cooling device used to the secondary refrigerant.

In addition, as the need for the configuration of a heater, various pumps, a coolant tank, and a coolant line necessary for forming the coolant circuit is eliminated, cost is reduced, the size of the cooler is reduced, and energy is saved accordingly.

1 is a conceptual diagram of a conventional cryogenic cooling device.
2 is a conceptual diagram of a cryogenic cooling apparatus according to an embodiment of the present invention.
3 is a block diagram of a conventional cryogenic cooling device.
4 is a block diagram of a cryogenic cooling apparatus according to an embodiment of the present invention.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.

2 is a conceptual diagram of a cryogenic cooling apparatus 1000 according to an embodiment of the present invention, Figure 4 is a block diagram of a cryogenic cooling apparatus 1000 according to an embodiment of the present invention.

First, referring to FIG. 2, unlike the cooling apparatus 2000 including the refrigerant circuit 1100 and the refrigerant circuit 2100, the cooling apparatus 1000 including only the refrigerant circuit 1100 is implemented. That is, the present invention has an object to implement a more efficient cooling device 1000 by removing the coolant circuit 2100 using the secondary refrigerant, and transfers heat to the test chuck 3000 using only the primary refrigerant.

The present invention having the above object in the cooling device 1000 for the process or probe test of the semiconductor and LED (Light Emitting Diode), the refrigerant for cooling the refrigerant (11), connected to the freezer, in the freezer A condenser 21 for condensing and liquefying the vaporized refrigerant, a condenser connected to the condenser, a receiver 91 storing a refrigerant liquid liquefied in the condenser, and connected to the freezer and cooling the hot gas generated in the freezer. And a refrigerant circuit (1100) connected to the multi-stage cooling heat exchanger (135) to be connected to the refrigerator and formed of a controller (111) capable of controlling the amount of hot gas or low temperature gas at the outlet of the freezer. Direct heat transfer to the test chuck (3000), by the heat exchange between the hot gas naturally generated in the freezer and the refrigerant after condensation, multi-stage cooling and expansion It characterized in that the temperature of the refrigerant is controlled.

The refrigerator 11 refers to a machine that cools or freezes a liquid by obtaining a low temperature by a refrigerant, and a main part includes four parts of a compressor, a condenser, an expansion valve, and an evaporator. Depending on the method of conveying the refrigerant, it can be divided into compression type (reciprocating, rotary, centrifugal freezer) and absorption type.

The condenser 21 refers to a device that condenses and changes steam by cooling steam to deprive heat. Cooling methods include water cooling, air cooling, evaporation, etc., and condensers having various structures exist according to the purpose of use, and when steam is steam, it is also called a condenser.

The condenser 21 may be divided into a surface condenser in which steam and a coolant are indirectly contacted with a pipe wall therebetween, and a contact condenser in direct contact with both. The former is mainly used to recover the condensate because the condensate and the coolant are not mixed.

That is, the refrigerator 11 performs a process of cooling the refrigerant vapor compressed at high pressure and high temperature with the condenser 21 and removing the heat of condensation to liquefy.

On the other hand, the receiver 91 is installed between the condenser 21 and the proportional control expansion valve 31 to temporarily store the high-temperature, high-pressure refrigerant liquid liquefied in the condenser 21, less than 3/4 There is a characteristic to be charged. Corresponds to a container for restoring the refrigerating device or collecting and storing the refrigerant.

The multi-stage cooling heat exchanger (135) is a device capable of conducting heat without mixing fluid from a high temperature fluid to a low temperature fluid, and performs a function of transferring heat from one fluid to another with a heat transfer surface interposed therebetween. do.

In the present invention, the refrigerant can be cooled in multiple stages in order to exchange heat with the hot gas naturally generated in the refrigerator 11, and the refrigerant is cooled through two or more stages.

The heat exchanger is devised in various types and forms according to its use, it can be divided into tubular and plate shape in the structure, it can be selectively applied as necessary.

In addition, the controller 111 serves to control the amount of hot gas or low temperature gas at the outlet of the freezer 11, and if the temperature is to be increased, the amount of low temperature gas is controlled so that the amount of low temperature gas is large, When the temperature is to be lowered, the amount of low temperature gas is controlled so that the amount of low temperature gas is small.

Through the control of the controller 111 it is possible to adjust the temperature in the refrigerant circuit 1100 to a desired degree.

In addition, the present invention is to remove the coolant circuit (2100) using the secondary refrigerant by directly heat transfer the cooled primary refrigerant to the test chuck (3000) to perform a low temperature process test, naturally in the freezer (11) The generated hot gas and the refrigerant having undergone condensation, multi-stage cooling, and expansion are heat-exchanged with each other to control the temperature of the refrigerant.

In the present invention, the refrigerant may be any one selected from methane refrigerant, ethane refrigerant, propane refrigerant, azeotropic mixed refrigerant, azeotropic mixed refrigerant, organic compound refrigerant, inorganic compound refrigerant or unsaturated organic compound refrigerant.

Refrigerant refers to all substances that cause cooling in a broad sense. Especially, the refrigerant absorbs heat from the surroundings by evaporating from the low temperature part (evaporator) while circulating inside a cycle of a refrigerating device, a heat pump, an air conditioner, and a heat energy using engine. Working fluid that releases heat from the condenser).

In general, a refrigerant absorbing or releasing heat through a phase change process of evaporation or condensation is referred to as a primary refrigerant, and a refrigerant that exchanges heat through a thermal heat transfer in a single phase state is referred to as a secondary refrigerant.

Air, helium, hydrogen, and the like applied to the gas cycle are classified as primary refrigerants, and main secondary refrigerants include brine and antifreeze.

The refrigerant may be one of four kinds of compounds, such as halocarbon, hydrocarbon, organic compound, and inorganic compound, and it is complicated and inconvenient to use the chemical name when describing the refrigerant, and according to the method defined by the International Organization for Standardization (ISO) In the form of 'R + number' after the initial letter of the refrigerant.

The methane refrigerants, ethane refrigerants, propane refrigerants, azeotropic mixed refrigerants, azeotropic mixed refrigerants, organic compound refrigerants, inorganic compound refrigerants or unsaturated organic compound refrigerants are included. + is represented by three digits of xyz, x is the number of carbon atoms minus one, y is the number of hydrogen atoms plus one, and z is the number of fluorine atoms.

The azeotropic mixed refrigerants 400 units, the azeotropic mixed refrigerants 500 units, the organic compound refrigerants 600 units, the inorganic compound refrigerants 700 units, unsaturated organic compound refrigerants are displayed as 1000 units.

Meanwhile, the coolant circuit 1100 of the present invention may further include pressure sensors 151 and 153 capable of sensing the pressure of the coolant and temperature sensors 155 and 157 capable of sensing the temperature of the coolant.

The pressure sensors 151 and 153 are devices and devices for detecting the pressure of a liquid or gas, converting them into electrical signals that are easy to use for measurement or control, and may be used in a broad sense as a pressure transducer.

This is one of the four sensors that support process automation, and the pressure range can range from 10 5 atmosphere units of artificial diamond synthesis to 10 -10 Torr of mass spectrometers or electron microscopes.

The temperature sensors 155 and 157 may use suitable materials according to the purpose of use in terms of detection temperature range, detection accuracy, temperature characteristics, mass production reliability, and the like. Thermocouples, temperature measuring resistors, thermistors (NTCs), and metallic Thermometers, thermistors (NTC, PTC, CTR), thermal ferrite, NQR (nuclear quadrupole resonance), ultrasonic, optical fiber, gas thermometer, glass double tube thermometer, crystal thermometer, platinum temperature measuring resistor or platinum-platinum rhodium thermocouple Can be.

At least one of the pressure sensors 151 and 153 and the temperature sensors 155 and 157 may be mounted to the refrigerant circuit 1100 of the present invention, and the rear end of the control heat exchanger 133 and the refrigerant supply valve ( 95) or the refrigerant return valve 97 is preferably disposed.

According to the present invention, the refrigerant circuit 1100 is mounted by discharging at least one of the proportional control motor valves 101 and 102, the proportional control automatic expansion device 103, and the control heat exchanger 133 to the discharge part of the refrigerator 11. ) Temperature can be controlled.

The proportional control motor valves 101 and 102 are valves that are relatively adjusted according to pressure, temperature, flow rate, etc. of the primary side and secondary side, and have a feature capable of fine and fine control.

In the present invention, the proportional control motor valves 101 and 102 may be adjusted according to pressure or temperature, more preferably temperature.

The proportional control automatic expander 103 corresponds to a device that can automatically expand the gas to obtain a low temperature, and serves to cool the evaporated refrigerant.

The control heat exchanger 133 is a heat exchanger for controlling the temperature of the refrigerant, and corresponds to an apparatus for exchanging heat between two fluids as mentioned above.

By arranging the above components in the discharge section of the refrigerator 11, it is possible to more efficiently control the temperature of the refrigerant passing through the refrigerator.

The refrigerant circuit 1100 of the present invention further includes an opening and closing motor valve (41, 81) capable of vacuuming the heat exchange lines in the outer pipes (195, 197) and the chamber, and a vacuum pump (51) capable of removing moisture. It may include.

The opening and closing motor valves 41 and 81 serve to vacuum the external pipes 195 and 197 and the pipes in the chamber for several minutes before the high temperature process test is performed after the low temperature process test. High temperature process tests are performed.

Likewise, the vacuum pump 51 removes moisture from the external pipes 195 and 197 and the heat exchange line in the chamber before the high temperature process test is performed after the low temperature process test, and the high temperature process test is performed after removing the moisture. do.

Finally, the refrigerant circuit 1100 may further include a refrigerant bypass circuit (not shown) for lowering the temperature of the refrigerant.

The refrigerant bypass circuit (not shown) refers to a path for branching all or part of the fluid as needed in the hydraulic circuit of the hydraulic device. The refrigerant bypass circuit (not shown) in the present invention refers to a circuit forming a path through which the refrigerant can be bypassed, and may operate until the temperature of the refrigerant becomes −80 ° C. for a low temperature process test.

If necessary, the refrigerant may be operated until the temperature becomes -90 ° C to -50 ° C, but it is preferable to operate only until the set low temperature process test temperature is -80 ° C.

On the other hand, the test chuck 3000 shown in the drawing is an accessory device for holding the workpiece by mounting the end of the main shaft of one of the machine tools, there is a normal chuck, air chuck, collet chuck and the like. There are three or four claws, each of which can be moved by a handle to hold the workpiece. In addition, a magnet chuck installed by the action of a magnet may be used.

Referring to the operation principle of the present invention having the configuration as described above are as follows.

Cryogenic Chiller Shipped

After the test is completed, when the solenoid valves 61, 75, 77 are closed by operating the refrigerator 11, the refrigerant is stored in the receiver 91, and the refrigerator 11 is stopped when the pressure sensors 151, 153 are about 0 bar. And the refrigerant recovery is stopped. When moving after the completion of recovery, the motor valves 41 and 81 for opening and closing are closed by safety devices.

When moving and installing the chiller site

The refrigerant is supplied, and all the pipes are connected to the external pipes 195 and 197 and the test chuck 3000 on the basis of the refrigerant return valve 97, and then water is removed from the pipe using the vacuum pump 51. At this time, the pressure sensors 151 and 153 are used.

After the solenoid valves 61, 75, 77 are opened and the opening / closing motor valves 41, 81 are opened, the refrigerator 11 operates after a few seconds, and is bypassed and operated until the temperature of the refrigerant reaches -80 ° C. do. At this time, the opening and closing motor valves 41 and 81 are closed.

Low temperature process test

In the state where the refrigerator 11 is continuously turned on, the opening and closing motor valves 41 and 81 are opened to discharge the refrigerant to be circulated to all the pipes to the external pipes 195 and 197.

At this time, the temperature of the external test chuck 3000 is also rapidly lowered and the low temperature process test is performed when the temperature is about -50 ° C.

High temperature process test

At the same time as the low temperature process test is completed, the solenoid valves 61, 75, 77 are closed to store the refrigerant in the receiver 91. At this time, the suction pressure of the refrigerator 11 is lowered, the refrigerator 11 is stopped at about -0.2 bar, and the refrigerant recovery is stopped.

Thereafter, the external line and the pipe in the test chuck 3000 are vacuumed.

When the test chuck 3000 reaches the high temperature set value, the high temperature process test is performed.

The present invention has the advantage that it is possible to efficiently perform the cooling / heating control without using a heater 220 that consumes a lot of power by using the cooling device 1000 to remove the separate coolant circuit 2100 using the secondary refrigerant have.

In addition, by directly circulating the low-temperature refrigerant controlled temperature in the cooling apparatus 1000 using only the primary refrigerant to the test chuck 3000, heat exchange loss can be significantly reduced than the cooling apparatus 2000 used up to the secondary refrigerant. There is an advantage.

In addition, as the heater 220, various pumps, the coolant tank 230, and the coolant line required for the formation of the coolant circuit 2100 need not be provided, cost is reduced and the size of the cooler 1000 is reduced. As a result, there is an advantage that energy is saved.

While the present invention has been described with reference to the specific embodiments, it is to be understood that the invention is not limited thereto. Those skilled in the art can change or modify the described embodiments without departing from the scope of the present invention, and within the equivalent scope of the technical spirit of the present invention and the claims to be described below. Various modifications and variations are possible.

11: freezer
21: Condenser
31: proportional control expansion valve
41, 81: motor valve for opening and closing
51: vacuum pump
61, 75, 77: solenoid valve
64, 67, 68: check valve
91: receiver
95 and 260: refrigerant supply valve
97 and 270: refrigerant return valve
101, 102: proportional control motor valve
103: proportional control automatic expander
111: controller
121: local heat exchanger
133: control heat exchanger
135: multi-stage cooling heat exchanger
151, 153, 250: pressure sensor
155, 157: temperature sensor
195, 197: external piping
210: evaporator
220: heater
230: coolant tank
240, 241: coolant circulation pump
1000, 2000: chiller
1100: refrigerant circuit
2100: coolant circuit
3000: test chuck

Claims (8)

In the cooling device for the process or probe test of semiconductor and LED (Light Emitting Diode),
A refrigerator for cooling the refrigerant;
A condenser connected to the freezer and condensing the refrigerant evaporated in the freezer;
A receiver connected to the condenser and storing a refrigerant liquid liquefied in the condenser;
A multistage cooling heat exchanger connected to the refrigerator and cooling the hot gas generated in the refrigerator; And
A controller connected to the freezer and capable of controlling the amount of hot gas or cold gas at the outlet of the freezer; Including a refrigerant circuit formed of,
Direct heat transfer of the cooled refrigerant to a test chuck,
The cooler does not use a coolant, characterized in that by controlling the temperature of the refrigerant by the heat exchange between the hot gas naturally generated in the refrigerator and the refrigerant having undergone condensation, multi-stage cooling and expansion.
The method of claim 1,
The refrigerant may be any one selected from methane refrigerant, ethane refrigerant, propane refrigerant, azeotropic mixed refrigerant, azeotropic mixed refrigerant, organic compound refrigerant, inorganic compound refrigerant or unsaturated organic compound refrigerant. Semiconductor chiller device which does not.
The method of claim 1,
The coolant circuit is a semiconductor chiller device not using a coolant, characterized in that it further comprises a pressure sensor for sensing the pressure of the refrigerant and a temperature sensor for sensing the temperature of the refrigerant.
The method of claim 1,
And at least one of a proportional control motor valve, a proportional control automatic expansion device, and a control heat exchanger is mounted on the discharge part of the refrigerator to control the temperature of the refrigerant circuit.
The method of claim 1,
The coolant circuit is a semiconductor chiller device using no coolant, characterized in that it further comprises an opening and closing motor valve for vacuuming the heat exchange line in the outer pipe and the chamber.
The method of claim 1,
The coolant circuit is a semiconductor chiller device that does not use a coolant, characterized in that it further comprises a vacuum pump capable of removing moisture in the heat exchange line in the outer pipe and the chamber.
The method of claim 1,
And the coolant circuit further comprises a coolant bypass circuit for lowering the temperature of the coolant.
8. The method of claim 7,
And the coolant bypass circuit operates until the coolant is cooled to -80 ° C.
KR1020130018544A 2013-02-21 2013-02-21 Semiconductor chiller device that does not use coolant KR101373766B1 (en)

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Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101611351B1 (en) * 2015-07-28 2016-04-12 한화탈레스 주식회사 Liquid cooled cold plate module manufactured by 3D print
KR101829909B1 (en) 2017-04-17 2018-02-19 (주)디이에스 Control system for a semiconductor wafer chuck
KR102527898B1 (en) * 2021-12-02 2023-04-28 김태현 Valve system for controlling temperature
CN117192324A (en) * 2023-11-07 2023-12-08 深圳市森美协尔科技有限公司 Probe detection table
KR102654974B1 (en) * 2023-01-12 2024-04-08 크라이오에이치앤아이(주) Temperature controlling apparatus for semiconductor manufacturing apparatus

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009064830A (en) * 2007-09-04 2009-03-26 Tokyo Electron Ltd Prober
JP2009109050A (en) * 2007-10-29 2009-05-21 Panasonic Corp Heat pump device
JP2009204288A (en) * 2008-02-29 2009-09-10 Nishiyama Corp Cooling device
KR20100016738A (en) * 2008-08-05 2010-02-16 양성철 Heat and cold chuck system capable of prevention condensation

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009064830A (en) * 2007-09-04 2009-03-26 Tokyo Electron Ltd Prober
JP2009109050A (en) * 2007-10-29 2009-05-21 Panasonic Corp Heat pump device
JP2009204288A (en) * 2008-02-29 2009-09-10 Nishiyama Corp Cooling device
KR20100016738A (en) * 2008-08-05 2010-02-16 양성철 Heat and cold chuck system capable of prevention condensation

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101611351B1 (en) * 2015-07-28 2016-04-12 한화탈레스 주식회사 Liquid cooled cold plate module manufactured by 3D print
KR101829909B1 (en) 2017-04-17 2018-02-19 (주)디이에스 Control system for a semiconductor wafer chuck
KR102527898B1 (en) * 2021-12-02 2023-04-28 김태현 Valve system for controlling temperature
KR102654974B1 (en) * 2023-01-12 2024-04-08 크라이오에이치앤아이(주) Temperature controlling apparatus for semiconductor manufacturing apparatus
CN117192324A (en) * 2023-11-07 2023-12-08 深圳市森美协尔科技有限公司 Probe detection table
CN117192324B (en) * 2023-11-07 2024-02-06 深圳市森美协尔科技有限公司 Probe detection table

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