JP6133129B2 - Temperature control device - Google Patents

Description

  The present invention relates to a temperature control device that controls the temperature of an object to be controlled to a desired temperature, and more particularly to a temperature control device capable of temperature control from a low temperature to a high temperature.

  Conventionally, a substrate on which a semiconductor wafer or an electronic component is mounted may be required to keep the temperature of the semiconductor wafer or substrate at a predetermined temperature in the manufacturing process or the inspection process. For example, in a temperature characteristic test or the like, a characteristic test is performed while changing the temperature of a semiconductor wafer or a substrate to each predetermined temperature in order to investigate the characteristic at a predetermined temperature.

  As a method for maintaining the temperature of the semiconductor wafer or substrate at a predetermined temperature, for example, by adjusting the temperature of the mounting table on which the semiconductor wafer or substrate is mounted, the temperature of the semiconductor wafer or substrate mounted on the mounting table is adjusted. Is maintained at a predetermined temperature.

As an apparatus for maintaining the temperature of a semiconductor wafer or a substrate at a predetermined temperature using such a method, for example, Patent Document 1 discloses a mounting table temperature control device that controls the temperature of a mounting table on which a substrate is mounted. A main flow path formed over the entire surface in the mounting table, and an auxiliary channel formed in a part of the surface of the mounting table spaced above the main flow path in the mounting table. The temperature control medium adjusted to a predetermined set temperature is supplied to the main flow path and circulated, and the temperature control medium is divided and further adjusted to a temperature higher or lower than the set temperature, and then the auxiliary flow path There is disclosed a mounting table temperature control device including a temperature control medium circulation mechanism that supplies and circulates the temperature to a substrate.

Thereby, only the desired site | part in a surface can be locally made higher or lower than preset temperature with respect to the preset temperature of the whole surface of a mounting base.

  Patent Document 2 discloses a wafer chuck temperature control method for a prober for controlling the temperature of a wafer chuck (a mounting table in the present invention). When the wafer chuck is brought to a high temperature state, a cooling liquid and When changing the temperature of the wafer chuck in a high temperature state to a low temperature state without flowing a cooling gas, the wafer chuck is cooled by flowing a cooling gas to the wafer chuck, and after the wafer chuck is below a predetermined temperature, A prober wafer chuck temperature control method is disclosed in which the flow of cooling gas to the wafer chuck is stopped and the cooling liquid is allowed to flow.

JP 2013-26387 A JP 2008-311483 A

  However, in the conventional temperature control device described in Patent Document 1, it is difficult to adjust the temperature in a wide temperature range. In addition, it is difficult for the conventional temperature control device to quickly change the temperature to a predetermined temperature, and in particular, it is difficult to quickly change the temperature from a high temperature state to a low temperature state.

  Further, in the case where the refrigerator is a general compression refrigerator using a chlorofluorocarbon refrigerant, the refrigerator is overloaded when the temperature of the temperature control medium (also referred to as circulating fluid) becomes high, and is generally used for the compression refrigerator. Since the compressor lubricating oil (ester / ether type refrigerating machine oil) used for thermal decomposition is thermally decomposed, continuous operation is difficult.

  In addition, in the conventional wafer chuck (mounting table in the present invention) temperature control method as described in Patent Document 2, two types of gas and cooling liquid are required as temperature control media. The route for this was also necessary and was expensive.

  In view of such circumstances, the present invention enables cooling and heating to keep the temperature constant even under a high temperature condition of the temperature control medium (circulating fluid), enables temperature adjustment in a wide temperature range, and has a predetermined temperature. It is an object of the present invention to provide a temperature control device that enables a single temperature control medium to quickly change the temperature.

The problems of the present invention can be solved by the following inventions.

That is, the temperature control device of the present invention is a temperature control device that controls the temperature of a temperature control object by means of a temperature-controlled temperature control medium, and a room temperature adjusting means for bringing the temperature of the temperature control medium close to room temperature. A cooling device for cooling the temperature control medium, a heater for heating the temperature control medium, a delivery unit for sending the temperature control medium to the temperature control object, and heat generated by the temperature control object. A receiving unit that receives the temperature-controlled medium that has been exchanged; and a pump that circulates the temperature-controlled medium to the room temperature setting means, the cooling device, the heater, the delivery unit, and the receiving unit. The main feature is the provision.

As a result, the heater load can be reduced when overheating from a low temperature state, and the refrigerator load can be reduced by cooling from a high temperature state. The temperature of the object can be adjusted to the set temperature in a very short time.

In addition, the temperature control device of the present invention is mainly characterized in that the temperature control device is piped so that only the temperature control medium that has passed through the room temperature adjusting means is supplied to the cooling device.

As a result, the temperature control medium brought close to the room temperature by the room temperature adjusting means is supplied to the cooling device, so that the refrigerator can be operated continuously, the load on the cooling device is reduced, and the operating power of the cooling device is reduced. Can be reduced.

Further, the temperature control device of the present invention is connected in series so that the temperature control medium flows in the order of the receiving portion, the room temperature-heating means, the cooling device, the heater, and the delivery portion, and the receiving portion and the The main feature is that a part or all of the temperature control medium is piped from a pipe connecting the room temperature adjusting means to a pipe connecting the cooling device and the heater.

As a result, the temperature control medium from the receiving unit and the temperature control medium from the cooling device are mixed, so that fine temperature adjustment is possible and the temperature control medium temperature is set to a temperature near room temperature. Even when it is kept constant, it can be kept highly accurate.

Furthermore, the temperature control device of the present invention is characterized in that the room temperature-heating means is a heat exchanger composed of a heat radiating plate and a fan.

Thereby, since the room temperature raising means has a simple configuration, the apparatus cost can be kept low, and the operating power during operation can be kept small because it is only a fan.

  In the temperature control device of the present invention, the cooling device includes a compressor that compresses the refrigerant, a condenser that condenses the refrigerant compressed by the compressor, and a pressure of the refrigerant condensed by the condenser. The main feature is that it is configured by a decompressor that performs evaporation, and an evaporator that evaporates the refrigerant decompressed by the decompressor.

Furthermore, in the temperature control device of the present invention, the condenser has a fan for releasing the heat of the compressed refrigerant to the outside air, and the fan makes the heat of the temperature control medium to the outside air in the room temperature-heating means. The main feature is that it is also used as a fan for discharge.

Thereby, since only one fan is required, the apparatus cost can be reduced and the operating power of the fan can also be reduced.

  The temperature can be adjusted in a wide temperature range, and the temperature can be quickly changed to a predetermined temperature.

It is a block diagram of the temperature control apparatus of 1st Embodiment of this invention. It is a block diagram of the temperature control apparatus of 2nd Embodiment of this invention. It is a block diagram of the prototype temperature control apparatus of this invention. It is a block diagram of the temperature control apparatus of 3rd Embodiment of this invention. It is a block diagram of the temperature control apparatus of 4th Embodiment of this invention. It is a block diagram of the temperature control apparatus of 5th Embodiment of this invention. It is a block diagram of the temperature control apparatus of 6th Embodiment of this invention. It is a block diagram of the temperature control apparatus of 7th Embodiment of this invention. It is a block diagram of the temperature control apparatus of 8th Embodiment of this invention. It is a block diagram of the temperature control apparatus of 9th Embodiment of this invention. It is an operation comparison table when the temperature is constant at 150 ° C. and when the temperature is changed from 150 ° C. to 80 ° C. It is an operation | movement comparison table | surface when temperature is changed from 150 degreeC to 25 degreeC, 25 degreeC constant, and temperature change from 25 degreeC to 150 degreeC. It is a graph which shows the evaluation and simulation result of temperature control medium temperature when the temperature control medium temperature of the temperature control apparatus of 3rd Embodiment of this invention and a prototype temperature control apparatus is changed from 150 degreeC to 25 degreeC.

  Hereinafter, embodiments for carrying out the present invention will be described in detail with reference to the accompanying drawings. Here, in the drawing, portions indicated by the same symbols are similar elements having similar functions. In the present invention, when the range of values is expressed using “to”, the values of both the boundaries are included in the range.

<First Embodiment>

(1) Configuration of the first embodiment

A first embodiment of a temperature control device of the present invention will be described with reference to the drawings. FIG. 1 is a block diagram of a temperature control apparatus according to a first embodiment of the present invention. As shown in FIG. 1, the temperature control device 100 receives a temperature control medium returned from the temperature control object 5 and a sending unit 10 for sending the temperature control medium whose temperature is controlled to the temperature control object 5. Receiving unit 12 for receiving the temperature adjusting means 14 for bringing the temperature of the temperature adjusting medium received by the receiving unit 12 close to room temperature, and cooling for cooling the temperature adjusting medium brought close to room temperature by the room temperature adjusting means 14 The apparatus 16 mainly includes a heater 18 for heating the temperature control medium, and a pump 19 for circulating the temperature control medium.

  As the temperature control medium, a material that is stable in a wide temperature range is desirable. For example, hydrofluoroether (HFE) or hydrofluoropolyether (HFPE) can be suitably used. Specifically, Galden (Solvay Solexis) Is more preferable. By using this, it becomes possible to perform temperature control of the temperature control object in a temperature range from a high temperature range exceeding 100 ° C. to a low temperature range lower than 0 ° C.

  The sending unit 10 is a part for sending the temperature-controlled medium to the temperature control object 5, for example, a pipe connection connector for sending the temperature control medium 5 to the temperature control object 5. good.

  The temperature control object 5 may be anything as long as it requires temperature control. For example, there is a mounting table for a temperature characteristic test apparatus for a semiconductor wafer. The temperature of the semiconductor wafer mounted on the mounting table is also adjusted by flowing the temperature-controlled medium on the mounting table and adjusting the temperature. Thereby, the temperature characteristic test of the semiconductor wafer can be performed at a desired temperature adjusted temperature.

  The receiving unit 12 is a part for receiving the temperature control medium returned after the temperature control of the temperature control object 5, for example, a pipe connection connector for sending the temperature control medium from the temperature control object 5. It may be.

  The temperature control medium received by the receiving unit is sent to the room temperature setting means 14 by the pump 19. Here, in FIG. 1, the pump 19 is installed between the receiving unit 12 and the room temperature raising means 14, but is not limited to this position. The pump 19 circulates a temperature control medium in a circuit constituted by the receiving unit 12, the room temperature raising means 14, the cooling device 16, the heater 18, the delivery unit 10, and the temperature control object 5. Any position may be used as long as the purpose can be achieved.

  The room temperature raising means 14 is an apparatus for bringing the temperature of the temperature adjustment medium close to room temperature by performing heat exchange. The temperature of the temperature control medium sent to the room temperature adjusting means 14 varies depending on the set temperature of the temperature control object 5, or the amount of heat generated and the amount of heat absorbed by the temperature control object 5, and may be higher than room temperature. It may be lower than room temperature. In any case, the temperature adjustment medium is brought close to room temperature by the room temperature adjusting means 14, so that the temperature adjustment medium can be changed more efficiently by cooling or heating the temperature adjustment medium by the cooling device 16 or the heater 18. Can be performed.

  Here, depending on the set temperature of the temperature control medium and the temperature of the temperature control medium flowing into the room temperature setting means 14, the room temperature setting means 14 stops the operation and stops the temperature control medium from approaching the room temperature. You can also. For example, in such a case, when the temperature of the temperature adjusting medium that has flowed into the room temperature adjusting unit 14 at a temperature higher than room temperature is adjusted to be higher, or when the temperature of the temperature adjusting medium flows below the room temperature, it flows into the room temperature setting unit 14. In some cases, the temperature of the temperature control medium that has come is adjusted to be lower.

  In such a case, the temperature measuring means for measuring the temperature of the temperature adjusting medium flowing into the room temperature adjusting means 14 and the operation of the room temperature adjusting means 14 are turned on / off from the temperature of the temperature adjusting medium and the set temperature of the temperature adjusting medium. By providing the control means for controlling, the operating state of the room temperature raising means 14 can be switched according to the situation. Thereby, consumption of unnecessary energy can be suppressed and the temperature adjustment medium temperature can be reached to a desired temperature in a short time.

  Any device that can bring the temperature of the temperature control medium close to room temperature (for example, 25 ° C.) can be adopted as the room temperature adjusting means, but it has good thermal conductivity from the viewpoint of energy saving, cost, and the like. It is preferable to use a fin-tube heat exchanger in which a temperature control medium channel formed of a material and fins for exchanging heat with the atmosphere are attached to the outside of the channel and in contact with the atmosphere. In order to efficiently perform heat exchange with the atmosphere, the fin tube heat exchanger can be configured to be attached with a blower and forcibly blow air to the fins of the fin tube heat exchanger.

  However, the room temperature raising means is not limited to such a finned tube heat exchanger, and employs liquid cooling such as a water cooling method to heat the heat of the temperature control medium and the air through the liquid. An apparatus configured to be replaced may be used.

  As described above, in the temperature control device 100 of the present invention, even if the temperature of the temperature adjustment medium is received in the receiving unit 12 in a state that is considerably higher than the atmospheric temperature, or the temperature of the temperature adjustment medium is considerably higher than the atmospheric temperature. Even if it is received in a low state, the temperature adjustment medium 14 brings the temperature of the temperature adjustment medium close to room temperature (atmospheric temperature), so that the temperature adjustment by the cooling device 16 and the heater 18 becomes easy.

  The cooling device 16 is a device for cooling the temperature control medium. Any device can be used as the cooling device 16 as long as it can cool the temperature control medium. For example, a compression refrigerator using a chlorofluorocarbon refrigerant is generally used, but cooling using a Peltier element is used. An apparatus, an absorption refrigerator using water-lithium bromide, ammonia-water, or the like, an adsorption refrigerator using zeolite, silica gel, or the like can also be suitably used.

  The heater 18 is a heating device for heating the temperature control medium, and any heater may be used as long as the temperature control medium can be heated. For example, a resistance heater using a heating wire, or a fluorocarbon refrigerant is used. The compression heater, the high frequency induction heating heater, the high frequency dielectric heating heater, etc. that are used can be suitably used. From the viewpoint of cost, size, etc., a resistance heater using a heating wire is more preferable.

(2) Operation of the first embodiment

Next, the operation of the first embodiment will be described with reference to FIG. The temperature control medium returned from the temperature control object 5 is received by the receiving unit 12 and sent to the room temperature setting means 14. Here, when the temperature control object is at a high temperature setting (for example, 150 ° C.), the temperature control medium (circulating fluid) sent from the delivery unit 10 also needs to be at a high temperature. When the heat is received, the temperature adjustment medium (circulating fluid) that returns to the receiving unit 12 is further heated.

In this case, in the case where the cooling device 16 is a compression type refrigerator using a chlorofluorocarbon refrigerant, the temperature and pressure of the refrigerant of the compression type chiller using the chlorofluorocarbon refrigerant will rise excessively if a high-temperature temperature control medium exceeding the allowable amount flows. As a result, the compressor was overloaded, and the operation of the refrigerator safety device stopped the operation of the refrigerator.

However, in the present invention, the high-temperature temperature control medium can be brought close to the room temperature by the room temperature adjusting means 14, so that the cooling device 16 can be operated continuously.

  Next, a case where the set temperature of the temperature control object 5 is changed from a high temperature to a low temperature will be described. Since the temperature has been set so far, the temperature of the temperature control medium received by the receiving unit 12 is high. In a conventional temperature control device that does not have the room temperature-imparting means 14, since a high-temperature temperature control medium directly flows into the cooling device, the cooling device 16 is a general compression refrigerator using a chlorofluorocarbon refrigerant. For the reasons described above, it has been difficult to operate the cooling device 16 continuously.

  In the temperature control device of the present invention, the high-temperature temperature control medium flows into the room temperature-heating means 14 and the temperature can be lowered to near room temperature here, so that the cooling device 16 can be operated continuously.

  In the prototype of the present invention described later (see FIG. 3), two circuits are used to solve this problem. Even if a high-temperature temperature control medium (circulating fluid) returns to the cooling-side circuit, A large amount of temperature control medium is required for the reserve tank 24 so that the temperature control medium does not become high temperature. In this circuit, the temperature control medium of the reserve tank 24 is kept at a low temperature and discharged when it is necessary to cool down, thereby shortening the cooling time and enabling operation even when the temperature control medium is set to a high temperature. When changing the temperature of an object from a high temperature to a low temperature (for example, changing from 150 ° C. to 25 ° C.), after the liquid in the reserve tank 24 and the return temperature control medium are mixed and in an equilibrium state, the inside of the reserve tank 24 Since it is necessary to cool down all the temperature control media containing this liquid and to lower the temperature, it takes time to cool the temperature control media after the equilibrium state.

  When the set temperature is changed from a low temperature to a high temperature, the temperature adjustment medium temperature flowing into the receiving unit 12 is a low temperature. Therefore, in a conventional temperature control device that does not have the room temperature setting means 14, the low temperature adjustment medium is a heater. 18 flows directly. The heater 18 needs to illuminate a low-temperature temperature control medium to a set high temperature, which takes time and requires a lot of energy.

  In the temperature control apparatus 100 of the present invention, the low-temperature temperature adjusting medium is heated to near room temperature by the room temperature adjusting means 14. Thereby, since the temperature control medium which flows into the heater 18 is a temperature close to room temperature, it can be set to a predetermined high temperature in a short time. Therefore, much energy is not required.

Second Embodiment

Next, a second embodiment of the present invention will be described with reference to the drawings. FIG. 2 is a block diagram of a temperature control apparatus according to the second embodiment of the present invention. In the description of the second embodiment, the description of the same parts as those in the first embodiment will be omitted, and only different parts will be described. Further, a second embodiment of the present invention will be described in comparison with the prototype temperature control apparatus of the present invention. FIG. 3 is a block diagram of the prototype temperature control apparatus of the present invention.

  As shown in FIG. 2, a temperature control device 200 according to the second embodiment of the present invention includes a temperature sensor 22 that measures the temperature of the temperature control medium, and a temperature control medium in the configuration of the temperature control device 100 according to the first embodiment. And a reserve tank 24 for replenishing the air and venting the air in the piping.

The temperature sensor 22 is a sensor for measuring the temperature of the temperature adjustment medium sent from the sending unit 10, and based on the temperature adjustment medium temperature measured by this sensor, the temperature adjustment medium becomes a predetermined temperature. The operations of the heater 18, the cooling device 16, and the room temperature raising means 14 can be controlled.

  In addition, the temperature sensor 22 is preferably installed at one location in the vicinity of the sending unit 10 which is the foremost side for sending the temperature control medium 5 to the temperature control object 5, and controls the temperature of the temperature control medium. The heater 18, the cooling device 16, and the room temperature raising means 14 may be individually installed in the vicinity of the discharge unit.

  The reserve tank 24 is a tank in which a spare temperature control medium is stored, and is connected in parallel to the circuit of the temperature control device 200 that circulates the temperature control medium. As a result, only the shortage of the temperature control medium is supplied to the circuit of the temperature control device 200. Normally, the temperature control medium does not pass through the reserve tank when the temperature control medium moves in the circuit. The temperature control medium (circulating fluid) in the reserve tank 24 is not subject to temperature control, and less energy is required for temperature control, and the temperature of the temperature control medium can be changed quickly.

  As shown in FIG. 2, in the second embodiment, the cooling device 16 includes a compressor 26 that compresses the refrigerant, a condenser 27 that condenses the refrigerant compressed by the compressor, and a condenser that condenses the refrigerant. This is a compression type refrigerator using a refrigeration cycle that includes a decompressor 28 that decompresses the pressure of the refrigerant and an evaporator 29 that evaporates the refrigerant decompressed by the decompressor.

  The temperature control medium brought close to the room temperature by the room temperature means 14 exchanges heat with the refrigerant of the cooling device 16 in the evaporator 29 of the cooling device 16. In the evaporator 29, the refrigerant evaporates by taking heat from the temperature control medium, and the temperature control medium is cooled by taking heat from the refrigerant. The refrigerant evaporated in the evaporator 29 is compressed by the compressor 26 and becomes a high-temperature and high-pressure gas. The refrigerant converted into high-temperature and high-pressure gas by the compressor 26 is cooled in the condenser 27 and liquefied, and the refrigerant is depressurized in the decompressor 28 and evaporated in the evaporator 29 to repeatedly take heat from the temperature control medium.

  Here, in FIG. 4, the condenser 27 of the cooling device 16 has a fan drawn and is described as an air-cooled condenser, but the condenser 27 is not limited to the air-cooled type, but is water-cooled. It may be.

  The room temperature adjusting means 14 is a fin tube in which a flow path of a temperature control medium formed of a material having good thermal conductivity and fins for exchanging heat with the atmosphere are attached to the outside of the flow path and in contact with the atmosphere. It is a heat exchanger comprised from the type heat exchanger and the air blower for blowing air | atmosphere on a fin. Thereby, the heat of the temperature control medium exchanges heat with the atmosphere via the flow path and the fins, so that the temperature of the temperature control medium can be efficiently brought close to room temperature with a simple configuration.

  Here, the prototype of the present invention will be described. FIG. 3 is a block diagram of the prototype temperature control apparatus of the present invention. In order to solve the problems of the conventional temperature control apparatus as described in Patent Document 1 as described above, the prototype temperature control apparatus of the present invention prevents the temperature adjustment medium (circulating fluid) from becoming high temperature. Two circuits are provided, a cooling circuit for this purpose and a circulation circuit for the temperature control object.

  However, in this prototype temperature control device, a certain amount or more of temperature control medium (circulating fluid) is required in the reserve tank 24, and a large amount of temperature control medium (circulating fluid) is required. Moreover, it took time to change the temperature from high temperature to low temperature. The temperature control apparatus of the present invention solves not only the problems of the conventional temperature control apparatus but also the problems of this prototype temperature control apparatus.

  Here, the temperature control device 300 of the prototype of the present invention and the second embodiment of the present invention are largely different from each other in (1) the prototype is a sub-circuit for cooling the temperature control medium (circulating fluid) and the temperature control medium. There are two circuits, the main circuit that circulates the temperature control target 5 to the temperature control object 5, whereas the second embodiment is one circuit, and (2) the prototype does not include the room temperature means 14. In the second embodiment, the room temperature adjusting means 14 is provided. (3) In the prototype, the reserve tank 24 is connected in series in the flow path in the sub circuit, and the temperature control medium (circulating fluid) in the reserve tank 24 is provided. However, in the second embodiment, the reserve tank 24 is connected in parallel to the circuit, and the temperature control medium in the reserve tank 24 is not subject to temperature control. .

  The prototype temperature control device 300 of the present invention receives the temperature control medium returned from the temperature control object 5 at the receiving unit, mixes it with the temperature control medium cooled by the cooling device 16 and the mixing tank 34, and adjusts the temperature. If necessary, the temperature of the temperature control object 5 is controlled by adjusting the heating temperature with the heater 18 and sending it out from the delivery unit 10 to the temperature control object 5.

  Here, the cooled temperature control medium sent to the mixing tank 34 is a temperature control medium that is sent from the reserve tank 24 to the cooling device 16 that is a compression type refrigerator using a chlorofluorocarbon refrigerant and cooled by the pump 31. is there. More specifically, the temperature control medium in the reserve tank 24 is cooled by the cooling device 16 and returned to the reserve tank 24. When the cooled temperature control medium is required, the three-way control valve 36 is used. Thus, all or part of the temperature control medium cooled by the cooling device 16 is sent to the mixing tank 34.

  A case where the temperature of the temperature control object 5 is changed from a high temperature state to a low temperature state will be described. At this time, the temperature control medium cooled by the three-way control valve 36 is sent to the mixing tank 34 in order to lower the temperature control object 5. At that time, in order to lower the temperature of the temperature control object 5 earlier, it is necessary to control the three-way control valve 36 so that all the temperature control medium flowing through the three-way control valve 36 flows into the mixing tank 34.

  In order to change the temperature control object 5 from the high temperature state to the low temperature state quickly, it is advantageous to keep the temperature of the reserve tank 24 lower. Further, as described above, in order to make the temperature change faster, all of the temperature control medium flowing through the three-way control valve 36 is allowed to flow into the mixing tank 34. At that time, the reserve tank 24 is supplied with the temperature control object 5 from More high-temperature liquid flows in. Then, the temperature of the temperature control medium in the mixing tank 34 rapidly increases, and the temperature of the reserve tank 24 when the high-temperature temperature control medium in the main circuit returns to the reserve tank 24 is maximized.

  When the amount of liquid in the reserve tank 24 is small, when the temperature of the reserve tank 24 becomes maximum, that is, when the high-temperature temperature control medium in the main circuit returns to the reserve tank 24 once, the reserve tank 24 The temperature of becomes higher.

  Thus, when the temperature of the temperature control medium (circulating fluid) flowing into the evaporator 29 becomes too high, the temperature and pressure of the refrigerant of the compression refrigerator are excessively increased and the compressor is overloaded. The cooling device 16 is stopped by the action of the safety device. Therefore, when it is desired to continuously operate the cooling device 16, the amount of liquid in the reserve tank 24 needs to be a certain amount or more.

  Further, even when the initial temperature in the reserve tank 24 is high, the temperature when the temperature of the reserve tank 24 becomes maximum becomes higher as in the case where the amount of liquid in the reserve tank 24 is small.

  As described above, when the temperature of the temperature control medium (circulating fluid) flowing into the evaporator 29 becomes too high, the temperature and pressure of the refrigerant in the compression refrigerator are excessively increased and the compressor is overloaded. The cooling device 16 is stopped by the operation of the device. Therefore, when it is desired to continuously operate the cooling device 16, the inside of the reserve tank 24 must always be kept at a constant temperature or lower.

  On the other hand, since the temperature control device 200 according to the second embodiment of the present invention includes the room temperature setting unit 14, even if a high-temperature temperature control medium enters from the receiving unit, the temperature control unit 200 approaches the room temperature. Therefore, the temperature control medium exceeding the allowable temperature of the cooling device 16 can be controlled so as not to flow into the cooling device 16.

  The case where the temperature control object 5 changes temperature from a high temperature state to a low temperature state will be described. Unlike the prototype, the reserve tank 24 is connected in parallel in the circuit of the flow path, so that the cooling device 16 can be operated even with a small amount of liquid. Further, since the temperature adjusting medium (circulating liquid) flowing into the evaporator 29 is lowered to a temperature at which the cooling device 16 can be operated by the room temperature adjusting means 14, continuous operation is possible.

  At this time, since the reserve tank 24 is connected in parallel in the circuit of the flow path, unlike the prototype, there is no need to lower the temperature of all the temperature control media in the reserve tank 24. The temperature of the temperature control medium can be lowered to

  In the prototype temperature control device 300 shown in FIG. 3, the temperature sensor 37 measures the temperature of the mixing tank 34 and feeds back the control of the cooling device 16 and the heater 18. The prototype temperature control device 300 includes a pump 32 for moving the temperature control medium in the circuit of the receiving unit 12 → mixing tank 34 → heater 18 → sending unit 10, and reserve tank 24 → cooling device 16 → three-way control. Two pumps, that is, a pump 31 for moving the temperature control medium by a circuit called a valve 36, are required. In the temperature control device 200 of the present invention, only one pump is required.

<Third Embodiment>

Next, a third embodiment of the present invention will be described with reference to FIG. FIG. 4 is a block diagram of a temperature control apparatus according to the third embodiment of the present invention. In the description of the third embodiment, the description of the parts overlapping with the first embodiment and the second embodiment is omitted, and only different parts will be described.

  As shown in FIG. 4, a temperature control device 400 according to the third embodiment of the present invention further includes a mixing tank 42 and a three-way control valve 43 in addition to the temperature control device 200 of the second embodiment. . The mixing tank 42 is for mixing the temperature control medium that has passed through the room temperature adjusting means 14 and the cooling device 16 with the temperature control medium that has just been received by the receiving unit 12.

  The three-way control valve 43 is a control valve for controlling the temperature adjustment medium amount flowing into the room temperature adjusting means 14 and the temperature adjustment medium amount flowing into the mixing tank 42 among the temperature adjustment media received by the receiving unit 12. It is.

  A temperature control device 400 according to the third embodiment of the present invention includes a mixing tank 42, a temperature control medium that has returned from the temperature control object 5, and a temperature control medium that has passed through the room temperature setting means 14 and the cooling device 16. Are mixed in the mixing tank 42 to adjust the temperature, so that useless energy consumption such as cooling more than necessary and heating with a heater can be suppressed.

  When the cooling device 16 is a general compression type refrigerator using a chlorofluorocarbon refrigerant and there is no branch circuit, the coolant always passes through the refrigerator, so that even if it is desired to control the temperature control object to 150 ° C., the liquid temperature is once set to 80 ° C. It is necessary to set the temperature to about 150 ° C. and then reheat to 150 ° C. with a heater.

  If there is a branch circuit, the mixing tank tank 42 can be adjusted to 150 ° C. by adjusting the flow rate of the coolant returned at 150 ° C. or higher and the coolant flow rate of about 80 ° C. The temperature of can be adjusted. Such control cannot be performed in the first and second embodiments, but is possible in the third embodiment.

  The mixing tank 42 may be provided with a temperature sensor 44 for measuring the temperature of the mixed temperature control medium. The three-way control valve 43 is controlled according to the temperature control medium temperature in the mixing tank 42 measured by the temperature sensor 44, and the amount of the temperature control medium heading to the mixing tank 42 and the temperature control medium heading to the room temperature adjusting means 14. By controlling the amount, the temperature can be controlled with high accuracy and precision. The temperature sensor 44 may be installed near the discharge portion of the mixing tank 42 or between the mixing tank 42 and the heater 18. Although it is better to control only one temperature sensor 22 in terms of cost, it becomes difficult to control the temperature of the temperature control medium.

<Fourth embodiment>

Next, a fourth embodiment of the present invention will be described with reference to FIG. FIG. 5 is a block diagram of a temperature control apparatus according to the fourth embodiment of the present invention. In the description of the fourth embodiment, the description of the parts overlapping with those of the third embodiment is omitted, and only different parts are described.

  As shown in FIG. 5, the temperature control device 500 according to the fourth embodiment of the present invention is configured by either one or both of a valve 54 and a valve 55 instead of the three-way control valve 43 of the third embodiment of FIG. 4. Is installed. Both the valve 54 and the valve 55 may be a two-way control valve or an electromagnetic valve. However, since the two-way control valve can control the flow rate more precisely, the temperature can be finely adjusted. Become.

  The valve 54 is a valve for controlling the amount of the temperature adjusting medium flowing into the room temperature adjusting means 14, and the valve 55 is a valve for controlling the amount of the temperature adjusting medium flowing into the mixing tank 42.

  Although only one of the valve 54 and the valve 55 may be provided, it is preferable to provide both. This is because the temperature control performance of the temperature control medium is improved when both are provided rather than either one.

  As in the third embodiment, it is better to control both the flow rate of the temperature control medium to the room temperature adjusting means 14 and the flow rate of the temperature control medium to the mixing tank 42 by using one three-way control valve. Since the temperature control of the temperature control medium can be performed by controlling one valve, the control is easy. However, in terms of cost, it is better to provide the valve 54 and the valve 55 as in the fourth embodiment. It may be advantageous. This is because the three-way control valve is expensive.

<Fifth Embodiment>

Next, a fifth embodiment of the present invention will be described with reference to FIG. FIG. 6 is a block diagram of a temperature control apparatus according to the fifth embodiment of the present invention. In the description of the fifth embodiment, the description of the parts overlapping with those of the fourth embodiment will be omitted, and only different parts will be described.

  As shown in FIG. 6, the temperature control apparatus 600 according to the fifth embodiment of the present invention is such that the room temperature-heating means 14 and the condenser 27 are cooled by the same fan 62 in the fourth embodiment of FIG. 5. It is configured. As a result, since only one fan is required, the apparatus cost can be reduced and the operating power of the fan can also be reduced.

<Sixth Embodiment>

Next, a sixth embodiment of the present invention will be described with reference to FIG. FIG. 7 is a block diagram of a temperature control apparatus according to the sixth embodiment of the present invention. In the description of the sixth embodiment, the description of the parts overlapping with those of the third embodiment will be omitted, and only different parts will be described.

  As shown in FIG. 7, the temperature control device 700 according to the sixth embodiment of the present invention changes the position of the heater 18 between the three-way control valve 43 and the mixing tank 42 in the third embodiment of FIG. 4. Is. That is, in the third embodiment, the temperature control medium that has flowed out of the mixing tank 42 is sent to the delivery unit 10 through the heater 18, but in the sixth embodiment, from the three-way control valve 43. The temperature control medium that has come through flows into the mixing tank 42 through the heater 18 and is sent from the mixing tank 42 to the delivery unit 10.

  In the third embodiment, the temperature adjustment medium mixed in the mixing tank 42 passes through the heater 18 and is finally adjusted in temperature by the heater 18 when heating is necessary. In the sixth embodiment, the temperature adjustment medium is mixed. Since the final temperature adjustment is performed in the tank 42, the heater 18 and the room temperature are set based on the temperature sensor 44 or the measured value of the temperature sensor 22 so that the temperature is mixed in the mixing tank 42 and reaches a predetermined temperature. The means 14 and the cooling device 16 are controlled. One of the temperature sensor 22 and the temperature sensor 44 may be provided.

  In addition to this, the heater 18 is installed between the receiving portion 12 and the three-way control valve 43, between the three-way control valve 43 and the room temperature raising means 14, and between the room temperature raising means 14 and the cooling device 16. It is possible to control the room temperature setting means 14, the heater 18, and the cooling device 16 so that the temperature of the temperature adjustment medium in the delivery unit 10 becomes a predetermined temperature regardless of the installation location.

<Seventh embodiment>
Next, a seventh embodiment of the present invention will be described with reference to FIG. FIG. 8 is a block diagram of a temperature control apparatus according to the seventh embodiment of the present invention. In the description of the seventh embodiment, the description of the parts overlapping with those of the third embodiment will be omitted, and only different parts will be described.

  As shown in FIG. 8, the temperature control apparatus 800 according to the seventh embodiment of the present invention is a mixing tank that combines the heater 18 and the mixing tank 42 instead of the heater 18 and the mixing tank 42 in the third embodiment of FIG. 4. The dual heater 82 is installed at the position of the mixing tank 42. The rest is the same as in the third embodiment, and a description thereof will be omitted.

<Eighth Embodiment>

Next, an eighth embodiment of the present invention will be described with reference to FIG. FIG. 9 is a block diagram of a temperature control apparatus according to the eighth embodiment of the present invention. In the description of the eighth embodiment, the description of the parts overlapping with those of the third embodiment is omitted, and only different parts are described.

  As shown in FIG. 9, the temperature control apparatus 900 according to the eighth embodiment of the present invention changes the heat exchanger and the condenser 27 of the room temperature adjusting means 14 from air cooling to water cooling in the third embodiment of FIG. It is a thing. Since other than that is the same as 3rd Embodiment, description is abbreviate | omitted.

<Ninth Embodiment>

Next, a ninth embodiment of the present invention will be described with reference to FIG. FIG. 10 is a block diagram of a temperature control device 804 according to the ninth embodiment of the present invention. In the description of the ninth embodiment, the description of the same parts as those in the third embodiment is omitted, and only different parts are described. In the ninth embodiment, a flow path opening / closing valve 84 and a flow path opening / closing valve 85 are attached to the third embodiment.

  The advantageous effect obtained in the ninth embodiment described below is that the channel on / off valve 84 and the channel on / off valve 85 are added to the embodiments of the present invention other than the prototype (the first to eighth embodiments). It can be obtained in the same manner by additionally mounting. Below, the effect by attaching the flow-path on-off valve 84 and the flow-path on-off valve 85 is demonstrated.

  In the case where the cooling device 16 is a compression type refrigerator using a chlorofluorocarbon refrigerant, the temperature of the temperature adjusting medium (circulating liquid) passing through the evaporator 29 cannot generally be 120 ° C. or higher. This is because the lubricating oil of the compressor that is circulated in the refrigerator (referred to as refrigeration oil and circulated in the circuit of the refrigerator together with the refrigerant) starts thermal decomposition at about 120 ° C.

  However, when the temperature control object is as high as about 150 ° C., it is easier to control the temperature in the mixing tank 42 when the temperature adjusting medium (circulating fluid) flowing through the circuit passing through the cooling device 16 is set to about 120 ° C. There is (fine temperature control is possible). At that time, the evaporator 29 can be bypassed by closing the flow path opening / closing valve 84 and opening the flow path opening / closing valve 85. Also, the above two solenoid valves can be used as a protection mechanism for the refrigerator. Thereby, thermal decomposition of refrigerating machine oil can be prevented.

  In order to make this control and mechanism effective, it is necessary to add a temperature sensor 802 in the vicinity of the outlet of the room temperature setting means 14. By installing the temperature sensor 802 in the vicinity of the outlet of the room temperature adjusting means 14, the temperature of the temperature adjusting medium that has come out from the room temperature adjusting means 14 can be monitored, so that the temperature of the temperature adjusting medium damages the cooling device 16. At the given temperature, by closing the flow path opening / closing valve 84 and opening the flow path opening / closing valve 85, the flow of the temperature control medium to the cooling device 16 can be prevented, and damage to the cooling device 16 can be prevented.

<Operation comparison>

The operation of the temperature control device according to the third embodiment of the present invention and the prototype temperature control device will be compared and described.

(1) When temperature control medium temperature is constant 150 ° C

The operation of the temperature control device according to the third embodiment and the prototype temperature control device when the temperature control medium temperature is kept constant at 150 ° C. will be described with reference to FIG. FIG. 11 is an operation comparison table when the temperature control medium temperature is constant at 150 ° C. and when the temperature control medium temperature is changed from 150 ° C. to 80 ° C. With reference to FIG. 4 and FIG. 11 (A), when the temperature control medium temperature is kept constant at 150 ° C., the temperature control device according to the third embodiment of the present invention turns off the cooling device 16 to bring it to room temperature. The fan of the means 14 is operated at a low rotational speed, and the three-way control valve 43 is operated with the flow rate at the room temperature means 14 side being small, the flow rate at the mixing tank 42 side being large, and the output of the heater 18 being small.

  When the temperature control medium temperature is considerably higher than room temperature, such as 150 ° C., and the heat input from the temperature control object 5 is small, only the cooling of the room temperature means 14 is required to keep the high temperature 150 ° C. constant. It is possible enough. At this time, the rotation speed of the fan of the room temperature raising means 14 may be low. This is because, when the temperature is kept constant, the flow rate on the side of the room temperature raising means 14 is smaller, and the greater the difference between the temperature control medium temperature and the room temperature, the higher the efficiency of the room temperature raising means 14.

  Therefore, even if the temperature control medium of 150 ° C. is supplied to the temperature control object 5 and the temperature control medium temperature becomes 150 ° C. or more due to the heat generated from the temperature control object 5 and returns to the receiving unit 12, the room temperature setting means This can be dealt with by increasing the 14-side flow rate and increasing the fan speed. If sufficient cooling is possible in these measures, the cooling device 16 does not require operation. As described above, in order to keep the temperature control medium temperature constant at 150 ° C., the cooling device 16 is turned off, that is, the compressor of the cooling device 16 with large power consumption is stopped, and only the air-cooling room temperature means 14 is operated. Therefore, it is possible to adjust the temperature with very little energy consumption.

  Next, with reference to FIG. 3 and FIG. 11 (A), an operation in the case where the prototype temperature control device keeps the temperature control medium temperature constant at 150 ° C. will be described. In the prototype temperature control device, since only the cooling device 16 has a means for cooling the temperature control medium, the cooling device is in the ON state. The three-way control valve 36 has a large flow rate on the reserve tank 24 side and a small flow rate on the mixing tank 34 side. The heater 18 has a small output.

  In this way, in the prototype temperature control device, the temperature control medium temperature in the reserve tank 24 gradually rises and cannot be cooled unless the cooling device 16 is operated, so that the cooling device 16 is always operated. As compared with the temperature control device of the third embodiment of the present invention, the energy consumption for temperature adjustment increases.

(2) Temperature control medium temperature changed from 150 ° C to 80 ° C

The operation of the temperature control device according to the third embodiment and the prototype temperature control device when the temperature control medium temperature is changed from 150 ° C. to 80 ° C. will be described with reference to FIG. With reference to FIG. 4 and FIG. 11 (B), when changing the temperature control medium temperature from 150 ° C. to 80 ° C., the temperature control device according to the third embodiment of the present invention turns off the cooling device 16, The fan of the room temperature setting means 14 is operated at a high rotation speed, and the three-way control valve 43 is operated with the flow rate at the room temperature setting means 14 side set to the full amount, the mixing tank 42 side flow rate set to 0, and the heater 18 output set to 0.

  In this case, the temperature of the temperature control medium (150 ° C.) is considerably higher than room temperature, that is, the atmospheric temperature, and the temperature control medium temperature after change is also 80 ° C., which is higher than the atmospheric temperature. And the temperature of the temperature control medium can be sufficiently lowered only by the room temperature-imparting means 14 that exchanges heat with the atmosphere by air cooling. Therefore, since the compressor of the cooling device 16 with high power consumption can be stopped, the temperature adjustment medium temperature can be adjusted with low power consumption.

  On the other hand, in the prototype temperature control device, it is necessary to turn on the cooling device 16 and cool the temperature control medium temperature from 150 ° C. to 80 ° C. only by the cooling device. Therefore, since the compressor of the cooling device 16 with high power consumption is always operated, a large amount of power is required for temperature adjustment of the temperature control medium.

(3) Temperature control medium temperature changed from 150 ° C to 25 ° C

The operation of the temperature control device according to the third embodiment and the prototype temperature control device when the temperature control medium temperature is changed from 150 ° C. to 25 ° C. will be described with reference to FIG. FIG. 12 is an operation comparison table when the temperature is changed from 150 ° C. to 25 ° C., constant at 25 ° C., and changed from 25 ° C. to 150 ° C.
With reference to FIG. 4 and FIG. 12C, when the temperature adjustment medium temperature is changed from 150 ° C. to 25 ° C., the temperature control device according to the third embodiment of the present invention turns on the cooling device 16 halfway. Then, the fan of the room temperature setting means 14 is operated at a high rotational speed, and the three-way control valve 43 is operated with the flow rate at the room temperature setting means 14 side set to the full amount, the mixing tank 42 side flow rate set to 0, and the heater 18 output set to 0.

  The cooling device 16 is operated when the temperature control medium temperature flowing into the evaporator 29 of the cooling device 16 becomes 80 ° C. or less. As described above, the temperature control apparatus according to the third embodiment of the present invention has only the room temperature adjusting means 14 with high cooling efficiency and low power consumption in the range from 150 ° C. to 80 ° C. where the temperature adjustment medium temperature is higher than the atmospheric temperature. Since the temperature adjustment medium is cooled, the temperature adjustment of the temperature adjustment medium can be performed with low power consumption.

  In addition, since the cooling device 16 is operated after the temperature control medium temperature becomes a sufficiently low temperature of 80 ° C. or less, it is possible to prevent the compressor 26 from being stopped due to overload. Here, the inflow temperature of the cooling device 16 can be set to 80 ° C. or lower in any state by increasing the size of the room temperature raising means 14 and improving the performance of the fan. In this case, since the cooling device 16 can be operated from the beginning, the target temperature can be reached earlier.

  Further, since the reserve tank 24 is connected in parallel to the circuit through which the temperature adjustment medium flows, the amount of the temperature adjustment medium to be cooled is small. As described above, since the amount of the temperature control medium to be cooled is small, the time until the temperature control medium temperature reaches 25 ° C. is shortened.

  On the other hand, in the prototype temperature control device (see FIGS. 3 and 12C), the temperature of the liquid (temperature control medium) in the reserve tank 24 is kept cooled to, for example, 0 ° C. It discharges to the mixing tank 34 and tries to lower the temperature of the temperature control medium.

  However, since the high-temperature temperature control medium enters the reserve tank, the temperature control medium temperature in the reserve tank 24 increases. After the temperature adjustment medium temperature in the reserve tank 24 rises, it is necessary to cool all the temperature adjustment medium in the reserve tank 24, and since cooling is performed only by the cooling device, the temperature adjustment medium temperature is 25 ° C. The time to reach is considerably longer than that of the temperature control device of the third embodiment of the present invention.

  FIG. 13 shows the temperature control medium temperature evaluation and simulation results when the temperature control medium temperature of the third embodiment of the present invention and the prototype temperature control apparatus are changed from 150 ° C. to 25 ° C.

  In FIG. 13, the vertical axis represents the temperature control medium temperature, and the horizontal axis represents the elapsed time. Also, the alternate long and short dash line represents the temperature control medium temperature (actual measurement value) at the outlet of the heater 18 of the prototype temperature control device, and the broken line represents the temperature control medium temperature (measurement value) in the reserve tank 24 of the prototype temperature control device. The solid line represents the temperature control medium temperature (calculated value) at the outlet of the heater 18 of the temperature control device of the third embodiment of the present invention.

  As shown in FIG. 13, the prototype is slightly more advantageous when compared with arrival times from 150 ° C. to 80 ° C. In the prototype, this is made possible by releasing the low temperature liquid in the reserve tank 24 at once. The third embodiment is more advantageous for temperature changes that lower the temperature of the temperature control medium from 150 ° C. to 50 ° C. or less, and the third embodiment is much more advantageous for temperature changes up to 25 ° C. .

  Specifically, it takes 12 minutes for the temperature control medium temperature at the outlet of the heater 18 to reach 25 ° C. in the prototype temperature control device, whereas in the temperature control device according to the third embodiment of the present invention. Only 7 minutes are required. Thus, it can be seen that the temperature control apparatus of the third embodiment of the present invention quickly reaches the predetermined temperature as compared with the prototype.

(4) Temperature control medium temperature is constant at 25 ° C

The operation of the temperature control device according to the third embodiment and the prototype temperature control device when the temperature control medium temperature is kept constant at 25 ° C. will be described with reference to FIG.

  With reference to FIG. 4 and FIG. 12 (D), when the temperature control medium temperature is kept constant at 25 ° C., the temperature control device according to the third embodiment of the present invention turns on the cooling device 16 and sets the room temperature 14 is stopped, the three-way control valve 43 is operated with a small flow rate on the room temperature means 14 side, a large flow rate on the mixing tank 42 side, and a small heater 18 output.

  As described above, when the temperature control medium temperature is kept at a temperature close to room temperature, the room temperature setting means 14 may be turned off. Further, the three-way control valve 43 adjusts the flow rate on the side of the room temperature raising means 14 and the flow rate on the side of the mixing tank 34, and adjusts the temperature of the temperature control medium by the mixing tank 34. Temperature can be adjusted accurately and stably even at ℃.

  Also in the prototype temperature control device, the temperature of 25 ° C. is adjusted by adjusting the flow rate on the reserve tank 24 side and the flow rate on the mixing tank 34 side by the three-way control valve 36.

(5) Temperature control medium temperature changed from 25 ° C to 150 ° C

The operation of the temperature control device according to the third embodiment and the prototype temperature control device when the temperature control medium temperature is changed from 25 ° C. to 150 ° C. will be described with reference to FIG.

  With reference to FIG. 4 and FIG. 12 (E), when the temperature adjustment medium temperature is changed from 25 ° C. to 150 ° C., the temperature control device according to the third embodiment of the present invention turns off the cooling device 16, The fan of the room temperature raising means 14 is stopped, the three-way control valve 43 is operated with the room temperature raising means 14 side flow rate set to 0, the mixing tank 42 side flow rate set to the full amount, and the heater 18 output increased.

  Since only the temperature control medium temperature is raised, the cooling device 16 does not need to be operated, and the fan of the room temperature adjusting means 14 does not need to be operated. Therefore, since both the cooling device 16 and the fan of the room temperature raising means 14 are stopped, there is no power consumption for them.

  On the other hand, the prototype temperature control device (see FIG. 3) does not maintain the temperature adjustment medium temperature in the reserve tank 24 at a low temperature even when only raising the temperature adjustment medium temperature. When it becomes necessary to adjust the temperature of the temperature control medium to be low, it is impossible to quickly respond. Therefore, since it is necessary to always operate the cooling device 16, even in this case, a large amount of power is consumed.

  As described above, it can be seen that the temperature control device according to the third embodiment of the present invention has the same or better performance in all aspects as compared with the prototype temperature control device. In addition, the above-described advantages over the prototype of the temperature control device of the present invention are also advantages over the conventional temperature control device.

5 ... temperature control object 10 ... sending part 12 ... receiving part 14 ... room temperature setting means 16 ... cooling device 18 ... heater 19 ... pump 22 ... temperature sensor 24 ... reserve tank 26 ... compressor 27 ... condenser 28 ... pressure reducer 29 ... Evaporator 31 ... Pump 32 ... Pump 34 ... Mixing tank 36 ... Three-way control valve 37 ... Temperature sensor 42 ... Mixing tank 43 ... Three-way control valve 44 ... Temperature sensor 54 ... Valve 55 ... Valve 62 ... Fan 82 ... Mixing tank heater 84 ... Channel open / close valve 85 ... Channel open / close valve 92 ... Cooling water circulation facility 100 ... Temperature controller 200 ... Temperature controller 300 ... Temperature controller 400 ... Temperature controller 500 ... Temperature controller 600 ... Temperature controller 700 ... Temperature Control device 800 ... temperature control device 802 ... temperature sensor 804 ... temperature control device 900 ... temperature control device

Claims (5)

A temperature control device that controls the temperature of a temperature control object using a temperature-controlled temperature controlled medium,
A room temperature adjusting means for bringing the temperature of the temperature control medium close to room temperature;
A cooling device for cooling the temperature control medium;
A heater for heating the temperature control medium;
A delivery section for delivering the temperature control medium to the temperature control object;
A receiving unit for receiving the temperature control medium heat-exchanged with the temperature control object;
A pump for circulating the temperature control medium to the room temperature-heating means, the cooling device, the heater, the delivery unit, and the receiving unit ,
Piped in series so that the temperature control medium flows in the order of the receiving part, the room temperature means, the cooling device, the heater, the delivery part,
A temperature control device in which a part or all of the temperature control medium is piped from a pipe connecting the receiving portion and the room temperature-heating means to a mixing tank connected to a pipe connecting the cooling device and the heater. .   The temperature control device according to claim 1, wherein the temperature control device is piped so that only the temperature control medium that has passed through the room temperature-heating means is supplied to the cooling device. The temperature control device according to claim 1 or 2 , wherein the room temperature raising means is a heat exchanger configured of a heat radiating plate and a fan. The cooling device includes a compressor that compresses the refrigerant, a condenser that condenses the refrigerant compressed by the compressor, a decompressor that decompresses the pressure of the refrigerant condensed by the condenser, and a decompression performed by the decompressor. The temperature control apparatus of any one of Claim 1 to 3 comprised by the evaporator which evaporates the made refrigerant | coolant. The condenser has a fan for releasing the heat of the compressed refrigerant to the outside air, and the fan is also used as a fan for releasing the heat of the temperature control medium to the outside air in the room temperature-heating means. Item 5. The temperature control device according to Item 4 .