KR101367307B1 - Apparatus for separating component from printed circuit board assembly - Google Patents

Abstract

An apparatus for separating a component attached to a printed circuit board from the printed circuit board, the apparatus comprising: a heating member for applying heat to the printed circuit board; A first rotating member provided in front of the heating member with respect to the transfer direction of the printed circuit board, and pressurizing a surface of the printed circuit board to transfer the printed circuit board or to weaken the coupling force between the component and the printed circuit board; And a second rotating member provided in front of the first rotating member with respect to a transfer direction of the printed circuit board, and separating the component from the printed circuit board. The printed circuit board may include a vertical direction or a vertical direction. Accordingly, there is provided a component separation device for a printed circuit board that is transferred from top to bottom. The present invention can reduce the time required for component separation and increase the component separation rate.

Description

Separation device for printed circuit boards {APPARATUS FOR SEPARATING COMPONENT FROM PRINTED CIRCUIT BOARD ASSEMBLY}

The present invention relates to a component separator of a printed circuit board, and more particularly, to a printed circuit board that separates a component from the surface of the printed circuit board while the printed circuit board is fed from top to bottom in the vertical or vertical direction. It relates to a component separation device.

Recently, as mass production and mass consumption of electrical / electronic products are made, a large amount of waste is generated. Also, such electrical / electronic products include printed circuit boards (PCBs) to signal processing of electronic circuits. Printed Circuit Board Assembly (PCBA) (hereinafter referred to as "Printed Circuit Board for convenience") is essentially used, and printed circuit boards are also generated in large quantities as waste.

The printed circuit board is composed of a board material and various electronic components mounted on the board. The components of the printed circuit board waste are generally polyethylene (PE), polypropylene (PP), polyester, and polycarbonate. It consists of about 30% of the plastic component, silica, alumina and about 40% of poorly soluble oxide of alkali-alkaline oxide, and consists of copper (Cu), iron (Fe), nickel (Ni), and tin (Sn). It contains about 30% of metals such as general metals such as lead (Pb), aluminum (Al), zinc (Zn) and precious metals such as gold (Au), silver (Ag) and palladium (Pd).

Printed circuit boards contain hundreds of milligrams of gold (Au) per kilogram, which is considerably higher than 10 mg / kg, the average amount of gold in the gold ore mined from a gold mine. Since these are classified as expensive metals or precious metals, techniques for effectively recovering and recycling these metals from printed circuit boards have been actively proposed.

Currently commercially available printed circuit board processing method is a method of recovering metals by melting and wet smelting by putting printed circuit boards together with concentrates in a high-temperature melting furnace of non-ferrous smelters, and by injecting printed circuit boards into incinerators to remove organic materials. The remaining metals are oxidatively decomposed or melted in a high temperature melting furnace, and there is a method of recovering valuable metals by a wet treatment method.

However, such a conventional method has a low content and recovery rate of recovered metal, and it is not possible to recover other special metals or rare metals except for gold, silver, copper, and palladium by slag, and in case of melting and incineration. The initial investment costs are huge.

In order to compensate for these drawbacks, recently, since the components containing special metals and rare metals are separated from the printed circuit boards, and then the printed circuit boards are processed, the mechanical and physical pretreatment techniques for maximizing the metal recovery rate are used. Attention has been paid to the development of component separation techniques and devices for separating components.

On the other hand, the conventional technology of separating the electronic components from the printed circuit board should be used limitedly because of the specifications of the printed circuit board, there is a hassle that a person must selectively separate the desired components using a computer and a CCD camera.

In addition, the conventional method of separating the electronic components attached to the printed circuit board by giving an impact or shear force in the infrared or heated state, the transfer line and the removal line must be configured separately, because the transfer of the printed circuit board in the horizontal direction There is a problem that the device is large. Moreover, there is a disadvantage in that an additional device for separately collecting the separated electronic components and the printed circuit board is required.

In addition, the conventional component separation technology has a disadvantage in that the components are separated only at the end surfaces, not at both sides of the printed circuit board.

The present invention provides a component separation device for a printed circuit board in which a transfer path is formed such that the printed circuit board is vertically transferred from the upper part (upper part) to the lower part (lower part).

The present invention provides a component separation device of a printed circuit board that can be formed in a plurality of stages or multiple stages to increase the component separation rate.

The present invention provides a component separation device for a printed circuit board that can separate components from both sides of the printed circuit board in one transfer process.

According to an aspect of the present invention, there is provided a component separating apparatus for a printed circuit board, the apparatus for separating a component attached to a printed circuit board from the printed circuit board, wherein the heat is applied to the printed circuit board. A heating member to be applied; A first rotating member provided in front of the heating member with respect to the transfer direction of the printed circuit board, and pressurizing a surface of the printed circuit board to transfer the printed circuit board or to weaken the coupling force between the component and the printed circuit board; ; And a second rotating member provided in front of the first rotating member with respect to a transfer direction of the printed circuit board, and separating the component from the printed circuit board. The printed circuit board includes a vertical direction or a vertical direction. From top to bottom along the way.

As described above, since the printed circuit board is transferred vertically from the top to the bottom, the parts are separated from the printed circuit board, thereby increasing the speed of separating parts and making the size of the device compact.

A third rotating member provided in front of the second rotating member with respect to a transfer direction of the printed circuit board, and pressing the surface of the printed circuit board to transfer the printed circuit board or to separate the component from the printed circuit board; It may include.

And an auxiliary heating member provided in front of the heating member with respect to the transfer direction of the printed circuit board to apply heat to the printed circuit board, wherein at least one auxiliary heating member is formed along the transfer direction of the printed circuit board. Can be.

The shortest distance between the heating member and the printed circuit board may be shorter than the shortest distance between the auxiliary heating member and the printed circuit board.

The first rotating member or the third rotating member may include a rotating shaft intersecting with a transfer direction of the printed circuit board and crossing the surface of the printed circuit board and a plurality of rotating gears formed on the rotating shaft.

The second rotating member may include a rotating shaft crossing the transfer direction of the printed circuit board and crossing the surface of the printed circuit board and a brush formed along the rotating shaft.

The heating member, the auxiliary heating member, the first rotating member, the second rotating member or the third rotating member may be formed to face both sides of the printed circuit board.

The heating member, the auxiliary heating member, the first rotating member, the second rotating member or the third rotating member may be formed on both sides of the printed circuit board to be symmetrical with respect to the printed circuit board.

The first rotating member or the third rotating member may be formed to alternate between the rotating gear provided on the upper surface side of the printed circuit board and the rotating gear provided on the lower surface side.

The teeth of the rotary gear provided on the upper surface side of the printed circuit board and the teeth of the rotary gear provided on the lower surface side may be formed to overlap each other.

The first rotating member or the third rotating member may be formed to have a clearance that can move along the thickness direction of the printed circuit board.

The printed circuit board maintains a conveying direction between at least one of the heating member and the first rotating member, between the first rotating member and the second rotating member, or between the second rotating member and the third rotating member. A conveying guide may be formed to guide it.

The transfer guide may be formed to have a play that can move along the thickness direction of the printed circuit board.

A mesh member may be formed in front of the third rotating member in the transfer direction of the printed circuit board to pass the component separated from the printed circuit board but not to pass the printed circuit board.

The lower part of the mesh member may be provided with a container for receiving the component.

The heating member, the first rotating member, the second rotating member, and the third rotating member may form a component separation unit, and the component separation unit may be disposed in plural along the transport direction of the printed circuit board.

As described above, the component separation device of the printed circuit board according to the present invention forms a transport path so that the printed circuit board is vertically transferred from the top (upper) to the bottom (lower), thereby reducing the space required for installing the device. The device can be compactly formed.

Since the component separation device of the printed circuit board according to the present invention may be arranged or formed in multiple stages or multiple stages, the component separation rate may be increased.

The component separation device of the printed circuit board according to the present invention can increase the part recovery rate because the components can be separated from both sides of the printed circuit board in a single transfer process, and the printed circuit board to process the surface from which the parts are not separated. This eliminates the hassle of having to re-inject it.

The component separation device of the printed circuit board according to the present invention can reduce the time required for component separation because the process of transferring the printed circuit board in the vertical direction and the process of separating the parts from the printed circuit board occur in one transfer line at the same time. have.

1 is a perspective view illustrating an appearance of an apparatus for separating parts of a printed circuit board according to an exemplary embodiment of the present invention.
FIG. 2 is a side view schematically illustrating an interior of a component separation device of a printed circuit board according to FIG. 1.
FIG. 3 is a front view schematically showing the inside of a component separation device of the printed circuit board according to FIG. 1.
4 is a plan view and a side view illustrating a first or third rotating member applied to a component separation device of a printed circuit board according to FIG. 1.
5 is a cross-sectional view of the second rotating member applied to the component separating apparatus of the printed circuit board of FIG.
6 is a view illustrating a mesh member and a container applied to a component separation device of a printed circuit board according to FIG. 1.
FIG. 7 is a view illustrating a transfer guide applied to an apparatus for separating parts of a printed circuit board according to FIG. 1.
8 is a view showing a modification of the component separation device of the printed circuit board according to an embodiment of the present invention.

Hereinafter, embodiments according to the present invention will be described in detail with reference to the accompanying drawings. However, the present invention is not limited to or limited by the embodiments. Like reference symbols in the drawings denote like elements.

1 is a perspective view showing the appearance of a component separator of a printed circuit board according to an embodiment of the present invention, Figure 2 is a side view schematically showing the inside of the component separator of the printed circuit board according to Figure 1, Figure 3 1 is a front view schematically showing the inside of a component separator of a printed circuit board according to FIG. 1, FIG. 4 is a plan view showing a first or third rotating member applied to the component separator of a printed circuit board according to FIG. 5 is a cross-sectional view of the second rotating member applied to the component separating apparatus of the printed circuit board according to FIG. 1, and FIG. 6 illustrates a mesh member and a container applied to the component separating apparatus of the printed circuit board according to FIG. 1. 7 is a view showing a transport guide applied to the component separation device of the printed circuit board according to Figure 1, Figure 8 shows a modification of the component separation device of the printed circuit board according to an embodiment of the present invention drawing to be.

1 to 3, the component separating apparatus 100 of a printed circuit board according to an embodiment of the present invention is a device for separating a component attached to a printed circuit board (PCB) from a printed circuit board (PCB). The heating member 110 which heats the printed circuit board PCB is provided in front of the heating member 110 with respect to the transfer direction PD of the printed circuit board PCB, and the surface of the printed circuit board PCB. A first rotation with respect to the conveying direction PD of the first rotating member 130 and the printed circuit board PCB, which presses to transfer the printed circuit board PCB or weakens the coupling force between the component and the printed circuit board PCB. It may include a second rotating member 150 provided in front of the member 130 to separate the component from the printed circuit board (PCB).

At this time, the printed circuit board (PCB) is transferred from top to bottom in the vertical direction or vertical direction. As described above, since the printed circuit board (PCB) is transferred vertically from the top to the bottom to separate the component from the printed circuit board, the component separation speed can be increased and the size of the device can be compactly formed.

The printed circuit board (PCB) includes not only a general printed circuit board but also a printed circuit board (PCBA). Hereinafter, for convenience of description, it is called a printed circuit board. In addition, the component attached to the printed circuit board includes all electronic components detachable from or attached to the printed circuit board by mechanical means or solder, although not specifically illustrated in the drawings.

As shown in FIG. 1, the component separating apparatus 100 of the printed circuit board according to the exemplary embodiment of the present invention is provided with various components inside the case 101, and a control panel (1) is provided at one side of the case 101. 300 may be provided. In Figure 1, the case 101 has a substantially "b" shape, of course, the shape of the case can be variously designed.

On the other hand, at the upper end of the case 101, the inlet for inserting the printed circuit board (PCB) into the case 101 in order to transfer the printed circuit board (PCB) from the upper (upper) to the lower (lower) in the vertical direction 102 can be formed.

2 and 3 schematically show the internal structure of the component separation device 100 of the printed circuit board. Figure 2 is a view from the side, Figure 3 is a view from the front.

The printed circuit board (PCB) enters into the case 101 through the inlet 102 formed at the top of the case 101. In the component separation apparatus 100 according to the exemplary embodiment of the present invention, a transfer direction or a transfer line of a printed circuit board (PCB) is formed in a vertical direction or a vertical direction, and a printed circuit board (PCB) is transferred from top to bottom. .

In the upper part of the case 101, a component separation unit (refer to I of FIG. 8) for transferring the printed circuit board (PCB) downward or separating a part from the printed circuit board (PCB) is formed, and in the lower part of the inner case A mesh member 160 and a container 170 may be formed to separate and separate a component separated from a circuit board (PCB) and a printed circuit board (PCB) from which the component is separated.

A heating member 110 may be formed at the lower portion of the inlet 102 to increase the temperature of the printed circuit board by applying heat to the printed circuit board (PCB) introduced into the case 101. An infrared heater or the like may be used as the heating member 110. The heating member 110 is a printed circuit board (PCB) until a solder that couples the component to the printed circuit board (PCB) is melted so that the component is separated from or at least easily separated from the printed circuit board (PCB). ) Can be heated. At this time, the heating member 110 is heated to the melting point of the solder so that the solder is melted, but it is preferable that the printed circuit board (PCB) is heated to a temperature that does not burn or damage. For example, the heating member 110 may be heated to 300 ℃ ~ 350 ℃. The heating member 110 may be controlled to maintain a temperature at which the solder melting point or more, and damage of the printed circuit board (PCB) can be prevented. On the other hand, the case 101 may be provided with a blowing means or cooling means (not shown) for preventing the temperature is excessively increased by the heating member 110.

In FIG. 2, reference numeral 103 denotes an input guide and 105 denotes an exhaust guide.

Pressing the surface of the printed circuit board (PCB) in front of the heating member 110 with respect to the transfer direction (PD) of the printed circuit board (PCB) to transfer the printed circuit board (PCB) or parts and printed circuit board (PCB) The first rotating member 130 to weaken the coupling force of the may be provided.

The first rotating member 130 is positioned below the heating member 110, and is also a conveying member which sends the printed circuit board (PCB) downward and is also a shredding member that separates components from the printed circuit board (PCB). The first rotating member 130 may send the printed circuit board (PCB) downward while rotating while contacting or pressing the surface of the printed circuit board (PCB). In this case, the solder may be melted by the heating member 110, so that the component having a weak bonding force with the PCB may be separated from the substrate. In addition, a component mechanically coupled to the printed circuit board (PCB) may also be separated from the printed circuit board (PCB) by the rotational force of the first rotating member 130.

As shown in FIGS. 3 and 4, the first rotating member 130 intersects the feed direction PD of the printed circuit board and crosses the surface of the printed circuit board PCB and the rotating shaft 132. It may include a plurality of rotating gear 133 formed on the). The tooth 134 formed at the end of the rotary gear 133 can transport the substrate while getting stuck or scratched the surface of the printed circuit board (PCB), and the tooth 134 of the rotating gear 133 rotates. The component may be separated from the printed circuit board (PCB).

One end of the rotating shaft 132 of the first rotating member 130 is provided with a bearing 135, the other end may be connected to the first driving unit (M1).

The second rotating member 150 may be provided in front of the first rotating member 130 with respect to the transfer direction PD of the printed circuit board PCB to separate the component from the printed circuit board PCB. The second rotating member 150 has no function of pressurizing the printed circuit board (PCB) or transferring the printed circuit board (PCB), and detaching the weakened component from the printed circuit board (PCB) or printing the printed circuit board (PCB). It can function to sweep the small parts remaining on the surface of the printed circuit board (PCB).

As shown in FIGS. 3 and 5, the second rotating member 150 crosses the feeding direction PD of the printed circuit board PCB and rotates across the surface of the printed circuit board PCB. It may include a brush 154 formed along the rotation axis 152. The brush 154 may be formed directly on the rotating shaft 152 or may be formed on the outer surface of the cylindrical portion 153 formed on the rotating shaft 152 to rotate together with the rotating shaft 152. Since the brush 154 sweeps the surface of the printed circuit board (PCB), even a small part may be separated or detached from the printed circuit board (PCB).

One end of the rotation shaft 152 of the second rotating member 150 may be provided with a bearing 155 and the other end may be connected to the second driving unit M2.

Meanwhile, referring to FIGS. 2 and 3, the surface of the printed circuit board PCB is pressed in front of the second rotating member 150 with respect to the transfer direction PD of the printed circuit board PCB. The third rotating member 140 may be provided to transfer the PCB or separate the component from the printed circuit board (PCB). When parts not separated from the printed circuit board (PCB) remain even by the first rotating member 130 and the second rotating member 150, they may be removed or separated by the third rotating member. In addition, the third rotating member 140 functions to apply rotational force to the printed circuit board (PCB) so that the printed circuit board (PCB) from which the parts are separated is discharged from the component separation unit. Since the second rotating member 150 has no force for forcibly transferring the printed circuit board (PCB), if there is no third rotating member 140 and only the second rotating member 150, the printed circuit board (PCB) This transfer line may not be maintained.

The third rotating member 140 has the same structure as the first rotating member 130. That is, the third rotating member 140 may be formed on the rotating shaft 142 and the rotating shaft 142 crossing the surface of the printed circuit board PCB and crossing the conveying direction PD of the printed circuit board PCB. It includes a rotary gear 143, a plurality of teeth 144 may be formed at the end of the rotary gear 143. In addition, one end of the rotating shaft 142 of the second rotating member 140 may be provided with a bearing 145 and the other end may be connected to the third driving unit M3.

The first to third driving units M1, M2, and M3 allow the first to third rotating members 130, 140, and 150 to rotate at the same angular velocity, and the first to third driving units M1, M2, and M3 are independently provided. It may be formed to interlock with each other. When the first to third driving units M1, M2, and M3 interlock with each other, they may be connected to each other by a chain or a belt. For example, the first driving part may be formed of a motor, and the second driving part and the third driving part may be formed of a chain or a belt connected to the first driving part, and may be linked with one motor. At this time, in some cases, a reducer (not shown) or an accelerator (not shown) may be further provided.

On the other hand, referring to Figures 2 and 3, the component separation device 100 of the printed circuit board according to an embodiment of the present invention is more than the heating member 110 with respect to the transport direction (PD) of the printed circuit board (PCB). It may include an auxiliary heating member (112, 114) provided on the front to apply heat to the printed circuit board (PCB). Here, at least one auxiliary heating member (112, 114) may be formed along the transport direction (PD) of the printed circuit board (PCB).

In order to maintain the molten state of the solder until the printed circuit board (PCB) passes through the third rotating member 140, a plurality of auxiliary heating members (112, 114) along the transport direction (PD) of the printed circuit board (PCB) It can be provided. The auxiliary heating members 112 and 114 may also use infrared heaters.

The shortest distance between the heating member 110 and the printed circuit board PCB may be shorter than the shortest distance between the auxiliary heating members 112 and 114 and the printed circuit board PCB. Referring to FIG. 2, the heating member 110 is located close to the printed circuit board (PCB), but the auxiliary heating members 112 and 114 are preferably located farther from the printed circuit board (PCB) than the heating member 110. Since the heating member 110 primarily heats the printed circuit board (PCB) to be inserted into the case 101, the heating member 110 is located relatively close to the printed circuit board (PCB) in order to apply a large amount of heat to the printed circuit board (PCB). Good to do. On the other hand, since the auxiliary heating members 112 and 114 heat the printed circuit board (PCB) once heated by the heating member 110 secondly, it is preferable that the auxiliary heating members 112 and 114 fall from the printed circuit board (PCB) rather than the heating member 110. Do. If the auxiliary heating members 112 and 114 and the heating member 110 are located at the same distance from the PCB, the PCB may be burned by the auxiliary heating member 114 at the bottom thereof. It may be damaged.

On the other hand, the heating member 110 and the auxiliary heating member 112 is located near the upper portion of the transfer line of the printed circuit board (PCB), it is preferable that only the auxiliary heating member 114 is located alone. This is because the lower side of the transfer line heats the already heated PCB, so there is no need to apply more heat than the upper side.

The heating member 110, the auxiliary heating members 112 and 114, the first rotating member 130, the second rotating member 150 or the third rotating member 140 may be formed to face both sides of the printed circuit board (PCB). Can be. In other words, as shown in FIG. 2, the heating member 110, the auxiliary heating members 112 and 114, the first rotating member 130, the second rotating member 150 or the third rotating member 140 may be a printed circuit board. It may be formed on both sides of the PCB so as to be symmetrical with respect to the PCB.

The component separation apparatus 100 of the printed circuit board according to the exemplary embodiment of the present invention may include the heating members 110, the auxiliary heating members 112 and 114, and the first rotating member 130 to face both sides of the printed circuit board (PCB), respectively. ), By forming the second rotating member 150 or the third rotating member 140, the vertical transfer of the printed circuit board (PCB) and the removal of the components occurs at the same time in one transfer line. Therefore, the apparatus 100 according to an embodiment of the present invention separates the components from the upper surface of the printed circuit board (PCB) and then turns the same substrate upside down to separate the components from the lower surface of the printed circuit board (PCB). Since there is no need to repeat, the parts can be separated quickly and the yield of the closed printed circuit board from which the parts are separated can be significantly increased.

The first rotating member 130, the second rotating member 150, and the third rotating member 140 which face each other based on the PCB are rotated in opposite directions, respectively. The first to third driving units M1, M2, and M3 should also be provided on both sides of the printed circuit board PCB.

Referring to FIG. 4, each of the first rotating members 130 positioned on both sides of a printed circuit board (PCB) may include a rotating gear 133 provided on an upper surface side of a printed circuit board (PCB) and a rotating gear wheel provided on a lower surface side thereof. 133 ') may be staggered. That is, each of the rotary gears 133 and 133 'may be formed on the rotation shafts 132 and 132' such that the teeth 134 and 134 'are not positioned on the same line. As such, the teeth 134 and 134 'of the rotary gears 133 and 133' located on both sides of the printed circuit board PCB are not on the same line or deviated from each other. This can be prevented from being damaged.

In addition, the teeth 134 of the rotary gear 133 provided on the upper surface side of the printed circuit board (PCB) and the teeth 134 ′ of the rotary gear 134 provided on the lower surface side may be formed to overlap each other. As a result, the printed circuit board (PCB) is somewhat bent between the teeth (134, 134 ') of both teeth, thereby preventing the printed circuit board (PCB) from slipping between the rotating gears (133,133'). Can be.

Similarly, the third rotary member 140 may have a rotation gear provided on the upper surface side of the printed circuit board (PCB) and a rotation gear provided on the lower surface side of each other, and the rotation teeth provided on the upper surface side of the printed circuit board (PCB). The teeth of the wheel and the teeth of the rotary gear provided on the lower surface side may be formed to overlap each other.

On the other hand, when both ends of the rotating shafts 132 and 142 of the first rotating member 130 or the third rotating member 140 formed on both sides of the printed circuit board (PCB) are fixed, the thick printed circuit board (PCB) is inserted The first and third rotating members 130 and 140 may be damaged or the printed circuit board may not be transferred. As such, the first rotating member 130 or the third rotating member 140 may move along the thickness direction of the printed circuit board (PCB) in order to smoothly transport the printed circuit board (PCB) having various thicknesses. It may be formed to have.

Referring to FIG. 5, the brushes 154 facing from both sides of the printed circuit board (PCB) are preferably formed to overlap each other at a portion where the printed circuit board (PCB) passes.

1 and 2, between the heating member 110 and the first rotating member 130, between the first rotating member 130 and the second rotating member 150 or the second rotating member 150. And at least one of the guides 121, 123, and 125 may be formed to guide the printed circuit board (PCB) to maintain the transfer direction between at least one of the and the third rotating members 140. The transfer guides 121, 123, and 125 may prevent the printed circuit board (PCB), which is transferred from the top to the bottom in the vertical direction, not to enter the first to third rotating members 130, 140, and 150 facing each other by leaving the transfer path. have.

In order to smoothly guide a printed circuit board (PCB) having various thicknesses, the transfer guides 121, 123, and 125 may be formed to have a play that may move along the thickness direction of the printed circuit board (PCB). Referring to FIG. 7, the upper and lower ends of the transfer guide 121 may have an extended form than the center portion so that the printed circuit board (PCB) can easily pass through the transfer guide 121. In addition, the spring 180 for elastically supporting the transfer guide 121 and one end of the spring 180 are fixed so that the transfer guide 121 can move elastically to some extent along the thickness direction of the printed circuit board (PCB). It may also include a piece 186.

2 and 3, the parts separated from the printed circuit board (PCB) pass in front of the third rotating member 140 with respect to the transfer direction (PD) of the printed circuit board (PCB) and the printed circuit board ( The PCB) may be provided with a mesh member 160 that does not pass through, and a container 170 for accommodating parts may be provided under the mesh member 160. As shown in FIG. 7, the component may pass through the hole of the mesh member 160, but the printed circuit board (PCB) from which the component is separated may not pass. Therefore, the parts are collected in the container 170 through the holes of the mesh member 160, and the printed circuit board (PCB) is caught by the mesh member 160, thereby separating the parts separated from the printed circuit board (PCB). There is no need to do anything.

Here, the mesh member 160 may be formed in a conveyor type to discharge only a printed circuit board (PCB) from which components are separated.

The container 170 may be separated from the case 101, and various parts separated from the printed circuit board (PCB) are bounced off by the rotational force of the first to third rotating members 130, 140, and 150, and then the inner surface of the case 101. Collide with the container 170.

On the other hand, the modified example 200 of the component separation device of the printed circuit board according to an embodiment of the present invention, the heating member 210, the first rotating member 230, the second rotating member 250 and the third rotation The member 240 may form the component separation unit I, and the component separation unit may be disposed in a plurality (I, II) along the transport direction PD of the printed circuit board PCB.

8 illustrates a case in which the component separation units I and II are arranged in two or two stages. By arranging the component separation units in multiple or multiple stages, the separation rate according to the size of the components can be increased and the removal efficiency of the components or impurities remaining on the PCB can be improved. For example, in FIG. 8, the upper component separation unit I separates a relatively large component from a printed circuit board (PCB), and the heating member 216, the first rotating member 236, and the second rotating member 256. ) And the lower part separating unit (II) having the third rotating member 246 can separate a relatively small part from the printed circuit board (PCB). At this time, the mesh member 160 and the container 170 are positioned below the lower part separation unit II.

In FIG. 8, reference numerals 212 and 214 denote auxiliary heating members, 221, 223, 225, 227, 228 and 229 are transfer guides, 203 are input guides, and 205 are discharge guides.

[Table 1] is a part according to the rotational speed and the temperature of the device of the first rotation member 130 and the third rotation member 140 of the component separation device 100 of the printed circuit board according to an embodiment of the present invention Experimental results for the separation rate.

Processing speed
(RPH) 1st part separation unit Stage 2 Part Separation Unit 300 ° C 325 ℃ 350 ℃ 300 ° C 325 ℃ 350 ℃ 50 24.3% 31.5% 51.1% 28.7% 47.1% 82.8% 100 17.5% 31.2% 40.6% 20.6% 44.4% 70.1% 150 13.1% 29.5% 33.5% 14.5% 40.6% 63.3% 200 136.% 23.0% 30.4% 13.2% 41.5% 50.2% 250 128.% 19.8% 30.1% 13.8% 39.7% 45.1%

The slower the rotational speed of the first and third rotary members 130 and 140 and the higher the temperature in the apparatus, the higher the component separation rate, and the component separation rate was about 83% at 50 RPH (Revolution Per Hour) and 350 ° C. In the component separation unit I of the first stage, large parts were mainly separated, and electronic components that did not fall in the first stage were observed to be separated in the component separation unit II of the second stage. At high temperatures of 350 ° C, large and small parts were found to separate from the printed circuit board.

As described above, since the component separating apparatus of the printed circuit board according to the exemplary embodiment of the present invention can effectively separate the electronic components attached to the substrate from the printed circuit board, each of the separated electronic components and the printed circuit board It is possible to recover the metal, so that the recovery rate of metal can be higher than in the case of a printed circuit board in which parts are not separated.

While the present invention has been described in connection with what is presently considered to be practical exemplary embodiments, it is to be understood that the invention is not limited to the disclosed embodiments, but, on the contrary, It will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention as defined by the appended claims. Accordingly, the spirit of the present invention should not be construed as being limited to the embodiments described, and all of the equivalents or equivalents of the claims, as well as the following claims, belong to the scope of the present invention .

100: component separation device of the printed circuit board
101: case 102: slot
110: heating member 112, 114: auxiliary heating member
121,123,125: transfer guide 130: the first rotating member
140: third rotating member 150: third rotating member
160: mesh member 170: container
I, II: Component Separation Unit

Claims (16)

An apparatus for separating a component attached to a printed circuit board from the printed circuit board,
A heating member applying heat to the printed circuit board;
A first rotating member provided in front of the heating member with respect to the transfer direction of the printed circuit board, and pressurizing a surface of the printed circuit board to transfer the printed circuit board or to weaken the coupling force between the component and the printed circuit board; ; And
And a second rotating member provided in front of the first rotating member with respect to a transfer direction of the printed circuit board, and separating the component from the printed circuit board.
The printed circuit board is transferred from top to bottom in the vertical direction or vertical direction,
The heating member, the first rotating member and the second rotating member are formed to face both sides of the printed circuit board,
The first rotating member includes a rotating shaft intersecting the conveying direction of the printed circuit board and intersecting the surface of the printed circuit board and a plurality of rotating gears formed on the rotating shaft, the rotation provided on an upper surface side of the printed circuit board. Separating device for a printed circuit board, wherein the cogwheel and the rotating cogwheel provided on the lower surface are alternately formed.
The method of claim 1,
A third rotating member provided in front of the second rotating member with respect to a transfer direction of the printed circuit board, and pressing the surface of the printed circuit board to transfer the printed circuit board or to separate the component from the printed circuit board; Included, the component separation device of the printed circuit board.
3. The method of claim 2,
And an auxiliary heating member provided in front of the heating member with respect to the transfer direction of the printed circuit board to apply heat to the printed circuit board, wherein at least one auxiliary heating member is formed along the transfer direction of the printed circuit board. Part separation device of a printed circuit board.
The method of claim 3,
And the shortest distance between the heating member and the printed circuit board is shorter than the shortest distance between the auxiliary heating member and the printed circuit board.
The method of claim 3,
The third rotating member,
And a rotating shaft intersecting the conveying direction of the printed circuit board and crossing the surface of the printed circuit board and a plurality of rotating gears formed on the rotating shaft.
The method of claim 5,
The second rotating member,
And a brush formed along the rotation axis and a rotation axis intersecting the conveying direction of the printed circuit board and across the surface of the printed circuit board.
The method according to claim 3 or 5,
The auxiliary heating member or the third rotating member is formed so as to face both sides of the printed circuit board, component separation device of a printed circuit board.
The method according to claim 3 or 5,
The heating member, the auxiliary heating member, the first rotating member, the second rotating member or the third rotating member are formed on both sides of the printed circuit board to be symmetrical with respect to the printed circuit board. Component Separation Device.
The method of claim 7, wherein
The third rotating member is a rotation gear wheel provided on the upper surface side of the printed circuit board and the rotating gear provided on the lower surface side is formed, the component separation device of the printed circuit board.
10. The method of claim 9,
The teeth of the rotary gear provided on the upper surface side of the printed circuit board and the teeth of the rotary gear provided on the lower surface side is formed so as to overlap each other.
10. The method of claim 9,
The first rotating member or the third rotating member is formed to have a play that can move along the thickness direction of the printed circuit board, component separation device of a printed circuit board.
9. The method of claim 8,
The printed circuit board maintains a conveying direction between at least one of the heating member and the first rotating member, between the first rotating member and the second rotating member, or between the second rotating member and the third rotating member. Separating device for a printed circuit board, the transfer guide is formed to guide.
The method of claim 12,
The conveying guide is formed to have a play that can move along the thickness direction of the printed circuit board, the component separation device of the printed circuit board.
9. The method of claim 8,
In the separation direction of the printed circuit board, a mesh member which passes through the component separated from the printed circuit board, but does not pass through the printed circuit board is formed in front of the third rotating member relative to the transfer direction of the printed circuit board. .
15. The method of claim 14,
The lower part of the mesh member is provided with a container for receiving the component, part separation device of a printed circuit board.
9. The method of claim 8,
The heating member, the first rotating member, the second rotating member and the third rotating member form a component separation unit,
The component separation unit is a plurality of parts separation device of the printed circuit board, which is arranged along the transfer direction of the printed circuit board.

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