KR101363094B1 - Organic light emitting device - Google Patents

Abstract

The present invention provides a substrate, a display unit including a subpixel and a monitoring pixel, a first wiring to supply voltage to the subpixel and a monitoring pixel, a second wiring to supply DC power to the monitoring pixel, and a subpixel. The present invention provides an organic light emitting display device including a shield layer disposed above or below a third wiring and a second wiring for applying an electrical signal for displaying an image image.

Description

[0001] The present invention relates to an organic light emitting device,

1 is a plan view illustrating an organic light emitting display device according to a first embodiment of the present invention.

FIG. 2 is an enlarged view of a portion A of FIG. 1.

3 is a cross-sectional view taken along the line II ′ of FIG. 2.

4A is a circuit diagram illustrating a power supply method of a monitoring unit and a display unit of an organic light emitting display device according to an exemplary embodiment of the present invention.

4B is a driving timing diagram illustrating a power supply method of a monitoring unit and a display unit of an organic light emitting display device according to an exemplary embodiment of the present invention.

5 is an example of a subpixel circuit of an organic light emitting display device according to an embodiment of the present invention.

6 is another example of a subpixel circuit of an organic light emitting display device according to an embodiment of the present invention.

7 is a plan view illustrating an organic light emitting display device according to a second embodiment of the present invention.

FIG. 8 is an enlarged view of a portion B of FIG. 7.

FIG. 9 is a cross-sectional view taken along the line II-II 'of FIG. 8.

10 is a cross-sectional view illustrating an organic light emitting display device according to a third embodiment of the present invention.

The present invention relates to an organic light emitting display.

Among the flat panel display devices, the electroluminescent display is a self-luminous display that does not require a backlight, so it can be light and thin, simplify the process, can be manufactured at low temperatures, and has a response speed of 1 ms or less. As a result, it has a high response speed and exhibits characteristics such as low power consumption, wide viewing angle, and high contrast.

In particular, the organic light emitting display device includes a light emitting layer including an organic material between an anode and a cathode, and holes supplied from the anode and electrons received from the cathode combine in the organic light emitting layer to form an exciton, a hole-electron pair. The excitons emit light by the energy generated when they return to the ground state.

Since the organic light emitting display device includes a light emitting layer including an organic material, when the external moisture and oxygen penetrate into the display device, the organic light emitting display device is easily deteriorated. In addition, as the driving time of the organic light emitting display device increases, the light emitting layer is easily deteriorated by heat generated in the driving device.

In addition, since the light emitting layer has semiconductor characteristics, it is very easily influenced by external temperature. That is, the amount of current flowing through the light emitting diode is easily changed as the ambient temperature rises and falls.

Accordingly, the organic light emitting display device as described above has a disadvantage in that it is difficult to provide a screen of the same quality at all times because the amount of voltage to be applied to produce the same brightness may vary depending on the degree of degradation. Therefore, in order to compensate for the value of the voltage which varies with the degree of deterioration or the temperature of the organic light emitting display device, a monitoring pixel is formed in the non-light emitting area around the display unit.

The monitoring pixel includes a light emitting diode formed by the same process as a subpixel of the organic light emitting display device, and receives a DC power of a predetermined size for a predetermined time. In this case, by measuring the magnitude of the voltage applied to the monitoring pixel, and providing the measured voltage to the subpixels of the display unit, voltage compensation according to deterioration or temperature may be performed.

However, since the voltage measurement of the monitoring pixel is performed during the driving of the organic light emitting display device, there is a problem that a deviation occurs in the magnitude of the measured voltage. That is, since the signal applied to the monitoring pixel is a DC power supply, and the data signal applied to the subpixel is an AC signal, the wiring for transmitting the DC power to the monitoring pixel and the wiring for transmitting the data signal to the subpixel located adjacent to the monitoring pixel. Interference of the signal occurs between the measured voltage may vary. As a result, there is a problem in that it is impossible to transfer an accurate compensation voltage according to deterioration and temperature to the subpixel of the display unit.

Accordingly, the present invention provides an organic light emitting display device capable of providing a screen having a uniform quality by preventing interference between a wiring for transmitting DC power to a monitoring pixel and a wiring for transmitting a data signal to a subpixel adjacent to the monitoring pixel. Its purpose is to provide.

In order to achieve the above object, the present invention provides a DC power supply to a substrate, a display unit including a subpixel and a monitoring pixel, a first wiring for supplying a voltage to the subpixel and a monitoring pixel, and a monitoring pixel. The organic light emitting diode includes a second wiring to be supplied, a third wiring for applying an electrical signal for displaying an image image to a subpixel, and a shield layer positioned above or below the second wiring and electrically connected to the first wiring. Provide a display device.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.

[First Embodiment]

1 is a plan view illustrating a structure of an organic light emitting display device according to a first embodiment of the present invention, and FIG. 2 is an enlarged view of portion A of FIG. 1.

1 and 2, the organic light emitting display device 100 according to the first embodiment of the present invention may be formed on a substrate 105, a display unit 110 disposed on the substrate, and an outer side of the display unit 110. It includes a monitoring unit 120 is located.

The display unit 110 is positioned in an area intersected by the scan line and the data line and includes a plurality of red, green, and blue subpixels 115 for displaying an image image. The monitoring unit 120 includes red, green, and blue monitoring pixels 125, and the red, green, and blue monitoring pixels 125 are arranged in a line for each color.

The subpixel 115 and the monitoring pixel 125 include a light emitting diode including at least a first electrode, a light emitting layer, and a second electrode. Here, the first electrode may be a transmissive electrode including a transparent conductive layer, and the second electrode may be a reflective electrode. Therefore, light generated in the light emitting layer is reflected by the second electrode and is emitted toward the rear surface of the substrate.

Hereinafter, the subpixel and the monitoring pixel of the organic light emitting display device according to the first embodiment of the present invention will be described in detail with reference to FIGS. 4A to 6.

4A is a circuit diagram illustrating a subpixel and a monitoring pixel of an organic light emitting display device according to a first embodiment of the present invention, and FIG. 4B is a subpixel and monitoring of an organic light emitting display device according to an embodiment of the present invention. 5 and 6 are circuit diagrams illustrating a subpixel circuit of an organic light emitting display device according to a first embodiment of the present invention.

Referring to FIG. 4A, a DC power supply Vi is connected to the monitoring pixel 125. The first switch SW1 is positioned between the monitoring pixel 125 and the DC power supply Vi, and DC power is supplied or stopped to the monitoring pixel 125 by turning on / off the first switch SW1.

The subpixel 115 is connected to the node A between the DC power supply Vi and the first switch SW1. The second switch SW2 is positioned between the subpixel 115 and the node A, and the capacitor C1 is positioned between the second switch SW2 and the subpixel 115. An amplifier Amp may be positioned between the capacitor C1 and the subpixel 115.

The monitoring pixel 125 may include at least a light emitting diode and may further include a thin film transistor although not shown. In addition, the subpixel 115 may include at least a light emitting diode and may have a structure shown in FIGS. 5 and 6.

Referring to FIG. 5, a subpixel may include a first transistor M1 transferring a data signal from a scan line Sn by a scan signal, a capacitor Cst storing a data signal, and a data signal stored in the capacitor Cst. The second transistor M2 may generate a driving current corresponding to the difference in the power supply voltage Vdd, and the light emitting diode OLED may emit light corresponding to the driving current.

As shown in FIG. 6, the subpixels include a first transistor T1 that transfers a data signal from the scan line Sn by a selection signal, a capacitor Cst, and a capacitor Cst that store the data signal. The second transistor T2 generates a driving current corresponding to the difference between the data signal stored in the power supply voltage and the power supply voltage, and the selection signal from the light emitting diode OLED emitting the light corresponding to the driving current and the erase line En. Accordingly, the third transistor T3 may erase the data signal stored in the capacitor.

In the pixel circuit shown in FIG. 6, when an organic light emitting display device is driven by a digital driving method in which one frame is divided into a plurality of subfields to express gray levels, an erase signal is applied to a subfield having a light emission time smaller than an address time. The light emission time can be adjusted by supplying. Therefore, there is an advantage that the minimum luminance of the organic light emitting display device can be lowered.

Next, referring to FIGS. 4A and 4B, the operation of the monitoring pixel 125 and the subpixel 115 will be described. When the first switch SW1 is turned on, the DC power is monitored from the DC power supply Vi. Supplied to the pixel 125. After that, when the second switch SW2 is turned on, the voltage applied to the monitoring pixel 125 by the supply of DC power is stored in the capacitor C1, and the stored voltage is amplified by the amplifier Amp to serve. It becomes a voltage supply source for driving the pixel 115. Next, when the second switch SW2 is turned off, the subpixel 115 is driven by the voltage stored in the capacitor C1 until the second switch SW2 is turned on again. That is, the monitoring pixel 125 is supplied with a DC power of a predetermined size for a predetermined time, and the subpixel 115 is provided with a voltage having the same size as the voltage applied to the monitoring pixel 125 by the DC power.

The time at which the monitoring pixel 125 is supplied with the DC power may be determined to adjust the degree of deterioration due to the driving of the subpixel 115 and the monitoring pixel 125 to substantially the same level. Accordingly, since the monitoring pixel 125 may reflect not only the ambient temperature but also the degree of deterioration of the subpixel 115, the monitoring pixel 125 may provide the subpixel 115 with a compensation voltage according to temperature and deterioration. The voltage measurement of the monitoring pixel 125 may be performed every frame or may be performed every few frames.

Meanwhile, referring back to FIGS. 1 and 2, the driver 160 for applying an electrical signal to the display unit 110 or the monitoring unit 120 is positioned on the substrate. The driver 160 may include a scan driver or a data driver that applies a scan signal or a data signal to the display unit 110.

The pad unit 170 may be positioned at one end of the substrate 105. Although not shown, the pad unit 170 may be connected to a printed circuit board or a connection part on which a printed circuit board is formed. The printed circuit board may include a memory unit, a time controller, and a power supply unit. As a result, the pad unit 170 transmits an electrical signal from the printed circuit board to the driving unit, or the display unit 110 or the monitoring unit 120. ) Can be powered.

One end of the wires is connected to the display unit 110 and the monitoring unit 120. The wires are electrically connected to the first wiring 135b for supplying power to the display unit 110 and the monitoring unit 120, the second wiring 135c for supplying DC power to the monitoring pixel 125, and the subpixel 115. It includes a third wiring (135d) for applying the.

The first line 135b may be a reference voltage supply line for supplying a reference voltage to the display unit 110 and the monitoring unit 120, and the other end of the first line 135b may be connected to the pad unit 170. The second wiring 135c may be a DC power supply wiring for supplying DC power to the monitoring pixel 125, and the other end of the second wiring 135c may be connected to the driving unit 160. The third wiring 135d may be a data line for supplying a data signal to the subpixel 115, and the other end of the third wiring 135d may be connected to the driver 160. Therefore, a voltage having a constant magnitude is always applied to the first wiring 135b, a DC signal is applied to the second wiring 135c, and an AC signal for representing an image image is applied to the third wiring 135d.

In the first embodiment of the present invention, it is assumed that the DC power supply unit supplying the DC power to the monitoring pixel 125 is located in the driving unit 160, and the other end of the second wiring 135c is connected to the driving unit 160. Although illustrated, when the DC power supply unit is located in the printed circuit board, the other end of the second wiring 135c may be connected to the pad unit 170.

The shield layer 141b may be positioned on the second wiring 135c. The shield layer 141b may be a conductive layer, and an insulating layer may be positioned between the second wiring 135c and the shield layer 141b. The shield layer 141b is electrically connected to the first wiring 135b through the insulating layer.

Therefore, the organic light emitting display device according to the first embodiment of the present invention includes a shield layer 141b on the upper portion of the second wiring 135c for supplying DC power to the monitoring unit 120 and the shield layer 141b. Is electrically connected to the first wiring 135b through the via hole 138. Therefore, a reference voltage is applied to the shield layer 141b.

As a result, the third wiring 135d positioned adjacent to the second wiring 135c forms a capacitance with the shield layer 141b. As a result, signal interference between the second wiring 135c and the third wiring 135d, which has occurred conventionally, is prevented, and the second wiring 135c can supply an accurate DC power supply to the monitoring unit.

3 is a cross-sectional view taken along the line II ′ of FIG. 2. Hereinafter, a cross-sectional structure of an organic light emitting display device according to a first embodiment of the present invention will be described in detail with reference to FIGS. 1 to 3.

1 to 3, the buffer layer 105 is positioned on the substrate 100. The buffer layer 105 is formed to protect the thin film transistor formed in a subsequent process from impurities such as alkali ions flowing out of the substrate 100, and selectively using silicon oxide (SiO ₂ ), silicon nitride (SiNx), or the like. To form.

The semiconductor layer 131 is positioned on the buffer layer 105. The semiconductor layer 131 may include amorphous silicon or polycrystalline silicon obtained by crystallizing the same. Although not illustrated here, the semiconductor layer 131 may include a channel region, a source region, and a drain region, and the source region and the drain region may be doped with P-type or N-type impurities.

The gate insulating layer 133 is positioned on the substrate 105 including the semiconductor layer 131. The gate insulating layer 133 may be selectively formed using silicon oxide (SiO ₂ ), silicon nitride (SiNx), or the like.

The gate electrode 135a is positioned on the gate insulating layer 133 to correspond to a predetermined region of the semiconductor layer 131, that is, to correspond to the channel region. The first wiring 135b for supplying a reference voltage to the display unit 110 and the monitoring unit 120 and the second wiring for supplying DC power to the monitoring unit 120 on the wiring region of the gate insulating layer 133. 135c) and a third wiring 135d for applying an electrical signal to display the image image on the display unit 110.

The gate electrode 135a and the first to third interconnections 135b, 135c, and 135d may be formed of aluminum (Al), aluminum alloy (Al alloy), titanium (Ti), silver (Ag), molybdenum (Mo), and molybdenum alloy ( Mo alloy), tungsten (W) and tungsten silicide (WSi ₂ ).

An interlayer insulating layer 139 is disposed on the substrate 105 including the gate electrode 135a and the first to third wirings 135b, 135c, and 135d. The interlayer insulating film 139 may be an organic film or an inorganic film, or a composite film thereof. have. When the interlayer insulating layer 139 is an inorganic layer, it may include silicon oxide (SiO ₂ ), silicon nitride (SiNx), or SOG (silicate on glass), and in the case of an organic layer, acrylic resin, polyimide resin, or benzocyclobutene It may include a (benzocyclobutene, BCB) resin. First and second contact holes 137a and 137b exposing portions of the semiconductor layer 131 may be disposed in the interlayer insulating layer 139 and the gate insulating layer 133, and the interlayer insulating layer 139 may have a first wiring. It may include a via hole 138 exposing a portion of the (135b).

The first electrode 141a and the shield layer 141b are positioned on the interlayer insulating film. The first electrode may be an anode and may include a transparent conductive layer such as indium tin oxide (ITO) or indium zinc oxide (IZO). Alternatively, the first electrode 141a may have a stacked structure such as ITO / Ag / ITO. The shield layer 141b is electrically connected to the first wiring 135b through the via hole 138 and is positioned on an area corresponding to the second wiring 135c. That is, the shield layer 141b includes the same material as the first electrode 141a and is patterned by the same process.

Source and drain electrodes 143a and 143b are disposed on the interlayer insulating layer 139. The source and drain electrodes 143a and 143b are electrically connected to the semiconductor layer 131 through the first and second contact holes 137a and 137b, and a part of the drain electrode 143b is the first electrode 141a. Positioned on the substrate, the first electrode 141a is electrically connected to the first electrode 141a.

The source and drain electrodes 143a and 143b may include a low resistance material to reduce wiring resistance, and may include a multilayer film made of molybdenum tungsten (MoW), titanium (Ti), aluminum (Al), or an aluminum alloy (Al alloy). Can be. As the multilayer film, a laminated structure of titanium / aluminum / titanium (Ti / Al / Ti) or molybdenum tungsten / aluminum / molybdenum tungsten (MoW / Al / MoW) may be used.

The bank layer 145 exposing a part of the first electrode 141a is disposed on the first electrode 141a. The bank layer 145 may include an organic material such as benzocyclobutene (BCB) -based resin, acrylic resin, or polyimide resin.

The emission layer 147 is positioned on the exposed first electrode 141a. The emission layer 147 may include an organic material. Although not shown, a hole injection layer and a hole transport layer may be formed between the first electrode 141a and the organic emission layer 147, and the electrons may be formed on the organic emission layer 147. A transport layer and an electron injection layer can be formed.

The second electrode 149 is positioned on the emission layer 147. The second electrode 149 may be a cathode for supplying electrons to the light emitting layer 147, and may include magnesium (Mg), silver (Ag), calcium (Ca), aluminum (Al), or an alloy thereof. . The first electrode 141a, the light emitting layer 147, and the second electrode 149 form the light emitting diode 150.

As described above, in the organic light emitting display device according to the first embodiment of the present invention, a shield layer is positioned on a second wiring for supplying DC power to the monitoring unit. The shield layer is electrically connected to the first line for supplying a reference voltage to form capacitance with the third line, thereby preventing signal interference between the third and second wires for supplying an electrical signal to the display unit. Therefore, the organic light emitting display device according to an embodiment of the present invention can transmit the correct voltage from the monitoring unit to the display unit, so that the luminance is uniform and the screen quality can be improved.

[Second Embodiment]

FIG. 7 is a plan view illustrating an organic light emitting display device according to a second exemplary embodiment of the present invention, FIG. 8 is an enlarged view of a portion B of FIG. 7, and FIG. 9 is cut along the line II-II ′ of FIG. 8. As a cross-sectional view, a planar structure and a cross-sectional structure of an organic light emitting display device according to a second embodiment of the present invention will be described below. In the second embodiment of the present invention, description of the same parts as in the first embodiment of the present invention will be omitted.

7 to 9, an organic light emitting display device 200 according to a second exemplary embodiment of the present invention includes a buffer layer 205 disposed on a substrate 200 and a semiconductor layer disposed on a buffer layer 205. 231a and a shield layer 231b. The shield layer 231b includes the same material as the semiconductor layer 231a and is patterned by the same mask process.

The gate insulating layer 233 is positioned on the semiconductor layer 231a and the shield layer 231b, and the via hole 234 exposing a part of the shield layer 231b is positioned in the gate insulating layer 233.

The gate electrode 235a is positioned on the gate insulating layer 233 so as to correspond to a predetermined region of the semiconductor layer 231a, and a first wiring for supplying a reference voltage to the display unit 210 and the monitoring unit 220 on the wiring region. In operation 235b, the second wiring 235c for supplying DC power to the monitoring unit 220 and the third wiring 235d for applying an electrical signal to display the image image on the display unit 210 are positioned. The first wiring 235b is connected to the shield layer 231b through the via hole 234.

An interlayer insulating film 239 is disposed on the substrate 205 including the gate electrode 235a and the first to third wirings 235b, 235c, and 235d. The interlayer insulating film 239 and the gate insulating film 233 include first and second contact holes 237a and 237b exposing portions of the semiconductor layer 231a.

The first electrode 241 is positioned on the interlayer insulating layer, and the source and drain electrodes 243a and 243b are positioned on the interlayer insulating layer 239. The source and drain electrodes 243a and 243b are electrically connected to the semiconductor layer 231a through the first and second contact holes 237a and 237b, and a part of the drain electrode 243b is the first electrode 241. It is positioned on the top and electrically connected to the first electrode 241.

The bank layer 245 exposing a part of the first electrode 241a is disposed on the first electrode 241, and the emission layer 247 including the organic material is disposed on the exposed first electrode 241.

The second electrode 249 is positioned on the emission layer 247, and the first electrode 241, the emission layer 247, and the second electrode 249 form the light emitting diode 250.

 As described above, in the organic light emitting display device according to the second embodiment of the present invention, the shield layer is positioned under the second wiring for supplying the DC power to the monitoring unit. The shield layer is electrically connected to the first line for supplying a reference voltage to prevent signal interference between the third and second wires for supplying an electrical signal to the display unit. Therefore, the organic light emitting display device according to an embodiment of the present invention can transmit the correct voltage from the monitoring unit to the display unit, so that the luminance is uniform and the screen quality can be improved.

[Third Embodiment]

10 is a cross-sectional view illustrating an organic light emitting display device according to a third embodiment of the present invention. The organic light emitting display device according to the third embodiment of the present invention includes a first shield layer patterned simultaneously with the semiconductor layer and a second shield layer patterned simultaneously with the first electrode.

Referring to FIG. 10, a buffer layer 305 is positioned on a substrate 300, and a semiconductor layer 331a and a first shield layer 331b are positioned on the buffer layer 305. The shield layer 331b includes the same material as the semiconductor layer 231a and is patterned by the same mask process.

The gate insulating layer 333 including the first via hole 334 is positioned on the semiconductor layer 331a and the first shield layer 331b.

The gate electrode 335a is positioned on the gate insulating layer 333 so as to correspond to a predetermined region of the semiconductor layer 331a, and a first wiring for supplying a reference voltage to the display unit 310 and the monitoring unit 320 on the wiring region. In operation 335b, the second wiring 335c for supplying DC power to the monitoring unit 320 and the third wiring 335d for applying an electrical signal to display the image image on the display unit 310 are positioned. The first wiring 335b is connected to the first shield layer 331b through the via hole 334.

An interlayer insulating film 339 is disposed on the substrate 305 including the gate electrode 335a and the first to third wirings 335b, 335c, and 335d. First and second contact holes 337a and 337b exposing portions of the semiconductor layer 331a are disposed in the interlayer insulating film 339 and the gate insulating film 333, and the first wiring (in the interlayer insulating film 339). A second via hole 338 exposing a portion of 335b is located.

The first electrode 341a and the second shield layer 341b are positioned on the interlayer insulating layer, and the source and drain electrodes 343a and 343b are positioned on the interlayer insulating layer 339. The source electrode and the drain electrode 343a and 343b are electrically connected to the semiconductor layer 331a through the first and second contact holes 337a and 337b, and part of the drain electrode 343b is the first electrode 341. And is electrically connected to the first electrode 341. The second shield layer 341b is electrically connected to the first wiring 335b through the second via hole 338.

The bank layer 345 exposing a part of the first electrode 341a is disposed on the first electrode 341, and the emission layer 347 including the organic material is disposed on the exposed first electrode 341.

The second electrode 249 is positioned on the emission layer 247, and the first electrode 241, the emission layer 247, and the second electrode 249 form the light emitting diode 250.

 As described above, in the organic light emitting display device according to the third embodiment of the present invention, the first shield layer is positioned under the second wiring for supplying DC power to the monitoring unit, and the second shield layer is positioned on the upper portion. do. The first and second shield layers are electrically connected to the first line for supplying a reference voltage to prevent signal interference between the third and second wires for supplying an electrical signal to the display unit. Therefore, the organic light emitting display device according to the embodiment of the present invention can transmit the correct voltage from the monitoring unit to the display unit by the shield layer formed without an additional mask process, so that the luminance is uniform and the screen quality can be improved. have.

As described above, the present invention has the effect of improving the quality of the screen of the organic light emitting display device.

Claims (16)

Board; A display unit on the substrate, the display unit including a subpixel and a monitoring unit including a monitoring pixel; A driving unit for applying a driving signal to the display unit; A pad unit for transmitting an electric signal from the outside and power required for driving to the driving unit and the display unit; A first wiring connected to the pad part to supply a reference voltage to the subpixel and the monitoring pixel; A second wiring connected to the driving unit to supply DC power to the monitoring pixel; A third wiring connected to the driving unit to apply an electrical signal for displaying an image image to the subpixel; And Located on the upper or lower portion of the second wiring, includes a shield layer electrically connected to the first wiring, And the third wiring line is adjacent to the second wiring line and forms a capacitance with the shield layer. delete The method of claim 1, The subpixel or the monitoring pixel may include a semiconductor layer, a gate insulating layer on the semiconductor layer, a gate electrode positioned to correspond to the semiconductor layer, a source electrode and a drain electrode electrically connected to the semiconductor layer, And a thin film transistor having an interlayer insulating film insulating the gate electrode, the source electrode, and the drain electrode. The method of claim 3, The subpixel or the monitoring pixel includes a light emitting diode electrically connected to the thin film transistor and having a first electrode, an organic light emitting layer, and a second electrode. 5. The method of claim 4, The first to third wirings include the same material as the gate electrode. The method of claim 5, The shield layer includes the same material as the semiconductor layer, and is electrically connected to the first wiring through the gate insulating layer. The method of claim 5, The shield layer includes the same material as the first electrode and is electrically connected to the first wiring through the interlayer insulating layer. The method of claim 5, The shield layer includes a first shield layer and a second shield layer, The first shield layer includes the same material as the semiconductor layer, and the second shield layer includes the same material as the first electrode. delete delete The method of claim 1, An organic light emitting display device connected to the pad unit, the organic light emitting display device further comprising a connection unit having a printed circuit board. 12. The method of claim 11, And a DC power supply unit for supplying DC power to the monitoring pixel, wherein the DC power supply unit is located in the driving unit or the connection unit. The method of claim 1, The signal applied to the subpixel through the third wiring is an AC signal. 14. The method of claim 13, And a signal applied to the monitoring pixel through the second wiring is a direct current signal. The method of claim 1, The subpixel emits a light corresponding to the driving current and a first transistor for transmitting a data signal in response to a scan signal, a capacitor for storing the data signal, a second transistor for generating a driving current corresponding to the data signal, and a light corresponding to the driving current. An organic light emitting display device comprising a light emitting diode. The method of claim 1, The subpixel may include a first transistor for transmitting a data signal in response to a scan signal, a capacitor for storing the data signal, a second transistor for generating a driving current corresponding to the data signal, and erasing a data signal stored in the capacitor. An organic light emitting display device comprising a light emitting diode emitting light corresponding to a driving current generated by the third transistor and the second transistor.

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