KR101361711B1 - Supporting unit for supporting a processing chamber and apparatus for processing a substrate including the same - Google Patents

Abstract

The present invention provides a process chamber including a chamber body including an upper wall, a side surface, and a lower wall, the space in which a substrate is processed, a support unit provided below the chamber body to support the chamber body, and the chamber. A plurality of fixing members for fixing the body to the support unit, a plurality of insertion grooves are formed in the upper portion of the support unit, the insertion groove is the first portion corresponding to the outer diameter of the fixing member and the It provides a substrate processing apparatus comprising at least one second portion extending on one side of the first portion.

Description

Supporting unit for supporting a processing chamber and apparatus for processing a substrate including the same}

The present invention relates to a support unit of a process chamber for generating a plasma in a chamber and performing a substrate surface treatment process, and a substrate processing apparatus including the same.

In general, in a device for manufacturing a semiconductor or a flat panel display, a substrate processing apparatus processes a substrate (semiconductor wafer, glass, etc.) in a vacuum process chamber.

Substrate processing apparatus of a flat panel display device manufacturing apparatus for manufacturing a flat panel display device is an in-line type and one in which a load-lock chamber and a process chamber are arranged in one direction. A cluster type in which a plurality of process chambers are disposed around the load lock chamber (or conveying chamber) is used. The cluster type substrate processing apparatus further includes a transfer chamber which is installed between the process chamber and the load lock chamber to serve as a stop for carrying the substrate into or out of the process chamber.

On the other hand, the process chamber, the load lock chamber, the conveying chamber is installed spaced apart from the ground by a predetermined distance, in this way, the support unit is required to separate the process chamber, load lock chamber, the conveying chamber from the ground by a predetermined distance or more.

The support unit is provided at the bottom of the process chamber, the load lock chamber, and the transfer chamber. That is, the process chamber, the load lock chamber and the transfer chamber are placed on the support unit.

Each chamber is fixed to the support unit through a fixing member or the like to prevent movement of the chamber during substrate processing or substrate transport. For example, each chamber is fixed to the support unit through a fixing member such as a pin.

Generation of high temperature plasma is required to process the substrate inside the process chamber. At this time, the high temperature plasma heats the process chamber and heat deformation may occur in the chamber body of the heated process chamber.

Recently, as the substrate is enlarged, the chamber body of the process chamber is enlarged, and accordingly, the thermal deformation of the chamber body of the process chamber due to the high temperature plasma is also increased.

For example, in the case of a process chamber for processing an 8th generation substrate, the temperature of the chamber body is increased to 120 ° C. during substrate processing, and the displacement due to thermal deformation of the chamber body occurs at most 8 mm. It is fixed to the upper part of the support unit of the lower wall of the chamber body through a fixing member. When this thermal deformation occurs, the side wall and the upper wall of the chamber body are expanded by thermal deformation, but in the case of the lower wall of the chamber body, it is fixed by the fixing member. Deformation is limited. In this case, there is a risk that the fixing member is broken by thermal deformation of the lower wall of the chamber body and the fixing between the chamber body and the support unit is released.

The present invention has been made to solve the above-described problem, and in the case where the heat deformation of the chamber body of the process chamber occurs, the support unit of the process chamber that can be stably maintained the fixing of the support unit and the chamber body and includes the same An object of the present invention is to provide a substrate treating apparatus.

In order to achieve the above object, the present invention provides a process chamber including a chamber body including an upper wall, a side surface, and a lower wall to form a space in which a substrate is processed, and provided at a lower portion of the chamber body. A support unit for supporting, a plurality of fixing members for fixing the chamber body to the support unit, a plurality of insertion grooves are formed in the upper portion of the support unit, the insertion groove is formed in the outer diameter of the fixing member It provides a substrate processing apparatus comprising a corresponding first portion and at least one second portion extending on one side of the first portion.

A lower wall of the chamber body may be provided with a plurality of fixing grooves into which the fixing member is inserted.

The support unit may include a top plate and a pedestal provided on the top plate, and the insertion groove may be formed on an upper portion of the pedestal.

Preferably, two pedestals are provided on one side and the other side of the upper plate.

The plurality of insertion grooves may include a first type insertion groove including at least one second portion extending in parallel with the first line and a plurality of second portions extending in parallel with the first line and the second line, respectively. And a second type insertion groove, wherein the first line and the second line are substantially vertical, and the first line is a straight line parallel to a straight line connecting a process chamber and a center of a transfer chamber provided at one side of the process chamber. Can be.

The first type insertion groove is preferably provided at a position adjacent to the conveying chamber.

In addition, the present invention, in the support unit for supporting the process chamber for processing the substrate in the interior space, a plurality of inserts in which a plurality of fixing members for fixing the process chamber to the support unit is inserted in the upper portion of the support unit The groove is formed, and the insertion groove provides a supporting unit of the process chamber, characterized in that it comprises a first portion corresponding to the outer diameter of the fixing member and at least one second portion extending on one side of the first portion.

In this case, the plurality of insertion grooves may include a first type insertion groove including at least one second portion extending in parallel with the first line and a plurality of second portions extending in parallel with the first line and the second line, respectively. And a second type insertion groove, wherein the first line and the second line are substantially vertical, and the first type insertion groove is disposed at a position adjacent to the gate provided in the process chamber.

The present invention has the advantage that the fixing of the support unit and the chamber body can be stably maintained when the heat deformation of the chamber body of the process chamber occurs.

1 is a view schematically showing the configuration of a substrate processing apparatus.
2 is a cross-sectional view schematically showing the configuration of the process chamber.
3 is a plan view of the support unit.
4 is a view showing the configuration of the insertion groove.
5 is a view schematically showing the configuration of the process chamber and the transfer chamber.
6 is a plan view showing the support unit of the process chamber and the transfer chamber.
7 is a view showing another embodiment of a second type insertion groove.

Hereinafter, preferred embodiments of the present invention will be described with reference to the drawings.

First, a substrate processing apparatus of a flat panel display device manufacturing apparatus for manufacturing a flat panel display device includes an in-line type in which a load lock chamber and a process chamber are arranged in one direction; A cluster type in which a plurality of process chambers are disposed around one load lock chamber (or conveying chamber) is used. Hereinafter, the present invention will be described taking a cluster type substrate processing apparatus as an example.

A schematic configuration of a substrate processing apparatus will be described with reference to FIG. 1.

The cluster type substrate processing apparatus may be configured such that one load lock chamber 30 and two or more process chambers 10 are connected to process a substrate.

Referring to FIG. 1, the substrate processing apparatus includes a load lock chamber 30 that receives an unprocessed substrate from the outside and stores the processed substrate or leaves the processed substrate to the outside. In addition, the substrate loaded from the load lock chamber 30 further includes a process chamber 10 (Process Chamber) for processing the substrate, such as performing a surface treatment using a plasma or the like in a vacuum state. In addition, the transfer chamber 20 which is installed between the process chamber 10 and the load lock chamber 30 and serves as a waypoint in bringing the substrate into the process chamber 10 or vice versa, It may further include.

Here, a transport robot (not shown) for transporting the substrate to the load lock chamber 30 and the process chamber 10 is installed in the transport chamber 20.

On the other hand, between the process chamber 10 and the transfer chamber 20 is provided with a gate device 40 for selectively opening and closing the gate during the loading or unloading of the substrate.

Referring to Figure 2, the process chamber and the support unit will be described.

The process chamber 10 includes a chamber body 110 forming a space in which a substrate is processed. In addition, the chamber body 110 may include an upper electrode 120 provided on the upper portion of the space formed by the chamber body 110 and a lower electrode 130 provided on the lower portion. In addition, it may include a lifting module (not shown) for raising and lowering the substrate (S) placed on the lower electrode 130.

The chamber body 110 includes an upper wall 111, a side wall 112, and a lower wall 113, and the upper wall 111, the side wall 112, and the lower wall 113 are combined to process a substrate therein. To form a space. The upper wall 111 and the lower wall 113 are spaced apart from each other, and a sidewall 112 is provided between the upper wall 111 and the lower wall 113. The side wall 112 is provided at both ends of the upper wall 111 and the lower wall 113. In addition, the upper wall 111, the side wall 112 and the lower wall 113 may be formed of at least two parts, or may be integrally formed. Alternatively, the upper body 111 and a portion of the sidewall 112 may be integrally formed in the form of an upper body and the lower body 113 and the lower portion of the sidewall 112 integrally formed.

The sidewall 130 may be provided with a gate 112a for carrying in or taking out a substrate. In addition, the outer side of the side wall 112 may be provided with a gate device 40 for opening and closing the gate (112a).

The upper electrode 120 is provided inside the process chamber 10. The upper electrode 120 is connected to an RF power applying unit (not shown) for applying high frequency power to the upper electrode 120. The upper electrode 120 and the lower electrode 130 are spaced apart from each other, and are preferably installed to face each other. A gas supply path 140 for supplying a reaction gas into the chamber is provided on the upper electrode 120. The gas supply passage 140 is preferably provided with a mass flow controller (MFC) (not shown) for controlling the supply of the reaction gas.

The reaction gas supplied between the upper electrode 120 and the lower electrode 130 is converted into plasma by the high frequency power applied to the upper electrode, and the surface of the substrate is processed by the plasma.

The support unit 200 is provided below the process chamber 10 to support the process chamber 10. The process chamber 10 may be spaced apart from the ground by the support unit 200. The support unit 200 is provided below the chamber body 110 of the process chamber 10 to support the chamber body 110.

The support unit 200 includes a main body 201, an upper plate 202 provided at an upper portion of the main body 201, and a pedestal 210 provided at an upper portion of the upper plate 202. The pedestal 210 is provided above the top plate 202, it is preferably provided near the edge of the top plate 202. The top plate 202 and the main body 201 may be integrally provided. In addition, the top plate 202 and the pedestal 210 may be provided integrally. In addition, the top plate 202, the main body 201 and the pedestal 210 may be provided integrally.

The support unit 200 and the chamber body 110 are coupled by a plurality of fixing members 204. That is, the fixing member 204 is fixed to the chamber body 110 to the support unit 200 to be coupled. A plurality of insertion grooves 220 into which the fixing member 204 is inserted are formed on the support unit 200. (See FIG. 3) More specifically, the insertion grooves 220 are formed on the pedestal 210. It is preferred to be provided. The insertion groove 220 will be described later.

On the other hand, the lower wall 113 of the chamber body 110 is preferably provided with a fixing groove 113a is inserted into the fixing member 204. Therefore, the upper portion of the fixing member 204 is inserted into the insertion groove 220 is installed, the lower portion is inserted into the fixing groove 113a is installed. Therefore, the chamber body 110 may be fixedly installed to the support unit 200. The fixing member 204 may be a screw or a pin.

In addition, it is preferable that a support leg 205 for supporting the main body 201 is provided below the main body 201.

Referring to FIG. 3, a plurality of pedestals 210 are provided on the upper plate 202. Four pedestals 210 may be provided, but are not necessarily limited thereto. The pedestal 210 has a predetermined width and thickness, and is preferably provided at the edge of the upper plate 202. In addition, the pedestal 210 is preferably provided near the edge of the top plate 202. Inserting grooves 220 are provided in each of the plurality of pedestals 210. The fixing member 204 is inserted into the insertion groove 220 is installed.

Referring to FIG. 4, the insertion groove 220 may include a first part 221 corresponding to an outer diameter of the fixing member 204 and at least one second part extending on one side of the first part 221. 223).

The first portion 221 corresponds to the outer diameter of the fixing member 204. The second part 223 is a space extended to one side of the first part 221. The shape of the second portion 223 corresponds to the shape of the edge of the first portion 221. That is, the shape of the second portion 223 corresponds to the size formed additionally when the first portion 221 is moved to one side. For example, when the fixing member 204 is a circular pin, the first portion 221 corresponds to the outer diameter of the pin and has a circular shape. The second part 223 may correspond to a newly formed space when the first part 221 is moved to one side, and may have a crescent shape.

At least one second portion 223 may be formed at one side of the first portion 221. For example, the second portion 223 may be formed on at least one of the left side, the right side, the upper side, and the lower side of the first portion 221.

(A) of FIG. 4 is a 1st type insertion groove, (b) is a 2nd type insertion groove.

Referring to FIG. 4, the insertion groove 220 includes a first type insertion groove 220a having a second portion 223 formed on at least one of an upper side and a lower side of the first portion 221, or at least one of a left side and a right side. ) And the second portion 223 may be divided into at least one of the upper side and the lower side of the first portion 221 and the second type insertion groove 220b formed in at least one of the left side and the right side.

When the plurality of second portions 223 are provided in the first type insertion groove 220a, the plurality of second portions 223 are positioned in a straight line. At least one pair of the plurality of second portions 223 that are not disposed in a straight line of the second type insertion groove 220b is present.

In FIG. 4, although the second portion 223 is provided on the upper side of the first portion 221 in the first type insertion groove 220a, only the lower side may be provided on both the upper side and the lower side. In addition, although the second portion 223 is provided on the upper side and the right side of the first portion 221 of the second type insertion groove 220b, the upper and lower left and right, the upper side, the lower side and the right side, or the lower side and the right side Two parts 223 may be provided. That is, the second type insertion groove 220b may be provided with at least a pair of second portions 223 not positioned on the same line.

Referring to FIG. 5, a transfer chamber 20 is provided at one side of the process chamber 10. A gate device 40 is provided between the process chamber 10 and the transfer chamber 20, and the process chamber 10 is provided. Gates 112a and 20a are provided on the sidewalls 112 of the sidewalls and the sidewalls of the transfer chamber 20 facing the sidewalls 112. The substrate having a substrate processing process in the process chamber 10 through the gate 112a of the process chamber 10 is transferred to the transfer chamber 20 through the gate 112a, or an untreated substrate is transferred to the transfer chamber 20. ) Is supplied to the process chamber 10.

The support unit 200 of the process chamber 10 is provided below the process chamber 10, and the support unit 21 of the transport chamber 20 is provided below the transport chamber 20.

6 is a plan view showing the support unit of the process chamber and the transfer chamber.

Referring to FIG. 6, the support unit 200 of the process chamber 10 has four pedestals 211, 212, 213, 214, and each pedestal 211, 212, 213, 214. ) Is provided with insertion grooves (220a, 220b).

In this case, the plurality of pedestals 211, 212, 213, and 214 are first pedestals 212 and 214 disposed in a position adjacent to the gate device 40 between the process chamber 10 and the transfer chamber 20. ) And second pedestals 211 and 213 disposed on the other side of the first pedestal 210. That is, the first pedestals 212 and 214 are disposed adjacent to the gate 112a or the gate device 40 of the process chamber 10, and the second pedestals 211 and 213 are arranged on the first pedestal ( 212) 214 is disposed on the other side of the position where it is installed. The first pedestals 212 and 214 are provided on one side of the top plate 202, and the second pedestals 211 and 213 are provided on the other side of the top plate 202. In this case, the first pedestals 212 and 214 are provided at positions adjacent to the gate 112a or the gate device 40.

The first pedestals 212 and 214 are provided with first type insertion grooves 220a. In addition, the second support members 211 and 213 are provided with a second type insertion groove 220b.

In this case, the first type insertion groove 220a provided in the first pedestal 212 and 214 includes at least one second portion 223 extending in parallel with the second line. In addition, the second type insertion groove 220b provided in the second support 211 and 213 includes a plurality of second portions 223 extending in parallel with the first line and the second line. Here, the first line and the second line are preferably substantially vertical. That is, the first line and the second line are approximately orthogonal. More specifically, the crossing angle between the first line and the second line may be 50 ° to 90 °, and preferably 70 ° to 90 °. Here, the first line means a straight line parallel to a straight line connecting the center of the process chamber 10 and the center of the transfer chamber 20. Alternatively, the first line may mean a straight line parallel to a straight line connecting the gate 112a or the gate device 40 provided at the center of the process chamber 10 and the sidewall of the process chamber 10.

The first type insertion groove 220a provided in the first pedestals 212 and 214 has at least one second portion 223 extending in parallel with the second line. That is, the first type insertion groove 220a positioned adjacent to the conveying chamber 20 has at least one second portion 223 extending in parallel with the second line.

The second type insertion groove 220b provided in the second support 211 and 213 has a plurality of second portions 223 extending in parallel with the first line and the second line. That is, the second type insertion groove 220b positioned opposite to the transfer chamber 20 has a plurality of second portions 223 extending in parallel with the first line and the second line, respectively.

At this time, it is preferable that the second portion 223 of the first type insertion groove 220a and the second type insertion groove 220b is provided in an outer direction of the support unit 200. That is, the second portion 223 of the first type insertion groove 220a and the second type insertion groove 220b is provided to extend in the direction toward the outside of the support unit 200 from the inside of the support unit 200. It is preferable.

When thermal expansion occurs in the chamber body 110, the lower wall 113 is expanded to the outside of the support unit 200. Therefore, the fixing member 204 inserted into the fixing groove 113a provided in the lower wall 113 also moves in the outward direction of the support unit 200. Therefore, it is preferable that the second portion 223 of the first type insertion groove 220a and the second type insertion groove 220b is provided in the outward direction of the support unit 200.

The first type insertion groove 220a has a second portion 223 extending in parallel with the second line, and the second portion 223 is preferably provided in an outer direction of the support unit 200. That is, the first type insertion grooves 220a provided in the upper pedestal 212 of the first pedestals 212 and 214 provided in the first type insertion grooves 220a may be formed only on the upper side of the first portion 221. It is preferable that two parts 223 are provided. In addition, the first type insertion groove 220a provided in the lower pedestal 214 of the first pedestal 212 and 214 is preferably provided with a second portion 223 only under the first portion 221. . However, the present invention is not limited thereto, and the second portion 223 of the first type insertion groove 220a may be provided at both the upper side and the lower side of the first portion 221.

The fixing member 204 by thermal expansion of the chamber body 110 by extending the second portion 223 of the first type insertion groove 220a provided in the first support 212 and 214 in parallel with the second line. In the case where movement of) occurs, the fixing member 204 moves only in a direction parallel to the second line. When the fixing member 204 moves from the process chamber 10 toward the conveying chamber 20, the position of the conveying chamber 20 may be moved, and the coupling between the process chamber 10 and the conveying chamber 20 is damaged. Can be. In addition, damage to the coupling of the load lock chamber provided on one side of the transfer chamber 20 can be damaged. Therefore, the second part 223 of the first type insertion groove 220a provided in the first pedestal 212 and 214 extends in parallel with the second line to move each chamber by the movement of the fixing member 204. The bond between them can be prevented from being damaged.

The second type insertion groove 220b includes at least one second portion 223 extending in parallel with the first line and at least one second portion 223 extending in parallel with the second line. The second portion 223 of the second type insertion groove 220b is also provided in the outer direction of the support unit 200 similarly to the first type insertion portion 220a.

Specifically, the second type insertion groove 220b provided in the upper pedestal 211 of the second pedestal 211 and 213 is provided with the second portion 223 on the upper side and the right side of the first portion 221. It is preferable. In addition, the second type insertion groove 220b provided in the lower pedestal 213 of the second pedestal 211 and 213 is provided with a second portion 223 on the lower side and the right side of the first portion 221. desirable.

As such, when the second type insertion groove 220b of the second support 211 and 213 is provided, when the movement of the fixing member 204 occurs due to thermal expansion of the chamber body 110, the second type insertion groove is generated. The fixing member 204 inserted into the 220b may move along the directions of the first line and the second line.

Meanwhile, in the above-described exemplary embodiment, four pedestals 210 are provided, but the number of pedestals 210 may vary depending on the production environment. That is, three, five, or six or more pedestals 210 may be provided on the upper plate 202 of the support unit 200. Even in this case, the pedestal 210 is preferably arranged to be symmetrical. In addition, it is preferable that the first type insertion groove 220a is disposed in the pedestal 210 disposed at the position closest to the transfer chamber 20.

In addition, in the above-described embodiment, the insertion groove 220 in which the fixing member 204 is inserted is formed in the pedestal 210, but the insertion groove 220 is formed in the upper plate 202 of the support unit 200. Of course it can be. That is, it may be provided in the insertion groove 220 at the position where the pedestal 210 is provided, without providing the pedestal 210. At this time, the plurality of insertion grooves are the first type insertion groove 220a and the first type insertion groove 220a which are disposed at a position adjacent to the gate device 40 between the process chamber 10 and the transfer chamber 20. It includes a second type insertion groove 220b disposed on the other side of the. That is, the first type insertion groove 220a is disposed adjacent to the gate 112a of the process chamber 10, and the second type insertion groove 220b is provided at the position where the first type insertion groove 220a is provided. It is disposed on the other side of the. For example, the first type insertion groove 220a is provided at one side of the top plate 202, and the second type insertion groove 220b is provided at the other side of the top plate 202. In this case, the first type insertion groove 220a is provided at a position adjacent to the gate 112a.

)와 제2라인 방향의 변위벡터(

)를 합한 방향(

)으로 연장된 제2부(223)를 포함할 수 있다. 이 경우, 도 7의 (a)를 참조하면, 상판(202)의 상부에 배치되는 제2형 삽입홈(220b)은 우상방향으로 연장된 제2부(223)를 가질 수 있다. 또한, 도 7의 (b)를 참조하면, 상판(202)의 하부에 배치되는 제2형 삽입홈(220b)은 우하방향으로 연장된 제2부(223)를 가질 수 있다.
In addition, referring to FIG. 7, the second type insertion part 220b may include only one second part 223 in the diagonal direction of the first part 221. That is, when the fixing member 204 is moved by thermal expansion, the second type inserting portion 220b may have a displacement vector (1) in the first line direction.

) And the displacement vector (in the direction of the second line)

) Sum of directions (

It may include a second portion 223 extended to). In this case, referring to FIG. 7A, the second type insertion groove 220b disposed on the upper plate 202 may have a second portion 223 extending in the upper right direction. In addition, referring to FIG. 7B, the second type insertion groove 220b disposed below the upper plate 202 may have a second portion 223 extending in the lower right direction.

The foregoing description is merely illustrative of the technical idea of the present invention, and various changes and modifications may be made by those skilled in the art without departing from the essential characteristics of the present invention. Therefore, the embodiments described in the present invention are not intended to limit the technical idea of the present invention but to explain, and the technical idea of the present invention is not limited by these embodiments. The scope of protection of the present invention should be construed according to the following claims, and all technical ideas within the scope of equivalents thereof should be construed as being included in the scope of the present invention.

10 Process Chamber 20 Transfer Chamber
30 Load Lock Chamber 40 Gate Device
110 Chamber Body 111 Upper Wall, 112 Sidewall, 113 Lower Wall
113a 112a gate
120 Upper Electrode 130 Lower Electrode
140 gas supply 200 support unit
201 main body 202 top
204 Fixing member 205 Support leg
210 Pedestal 212, 214 First pedestal
211, 213 2nd base 220 Insertion groove
220a Type 1 Insertion Groove, 220b Type 2 Insertion Groove
221 part 1 223 part 2

Claims (7)

A process chamber forming a space in which the substrate is processed and including a chamber body including an upper wall, a side surface, and a lower wall;
A support unit provided below the chamber body to support the chamber body; And
Includes; a plurality of fixing member for fixing the chamber body to the support unit,
A plurality of insertion grooves into which the fixing member is inserted is formed at an upper portion of the support unit, and the insertion groove includes a first portion corresponding to an outer diameter of the fixing member and at least one second portion extending at one side of the first portion. Including,
The plurality of insertion grooves,
A first type insertion groove including at least one second portion extending in parallel with the first line, and a second type insertion groove including a plurality of second portions extending in parallel with the first line and the second line, respectively. and,
The first line and the second line is vertical,
And the first line is a straight line parallel to a straight line connecting a process chamber and a center of a transfer chamber provided at one side of the process chamber. The method of claim 1,
Substrate processing apparatus, characterized in that the lower wall of the chamber body is provided with a plurality of fixing grooves for the fixing member is inserted. The method of claim 1,
The support unit includes a top plate and a pedestal provided on the top plate, characterized in that the insertion groove is formed in the upper portion of the substrate processing apparatus. delete The method of claim 1,
And the first type insertion groove is provided at a position adjacent to the transfer chamber. A support unit for supporting a process chamber for processing a substrate in an interior space,
In the upper portion of the support unit, a plurality of insertion grooves are formed is inserted into which a plurality of fixing members for fixing the process chamber to the support unit,
The insertion groove includes a first portion corresponding to the outer diameter of the fixing member and at least one second portion extending on one side of the first portion,
The plurality of insertion grooves,
A first type insertion groove including at least one second portion extending in parallel with the first line, and a second type insertion groove including a plurality of second portions extending in parallel with the first line and the second line, respectively. and,
The first line and the second line is vertical,
The first type insertion groove is disposed in a position adjacent to the gate provided in the process chamber support unit of the process chamber. delete

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