KR101358783B1 - 구조화된 열 전사 도너 - Google Patents

구조화된 열 전사 도너 Download PDF

Info

Publication number
KR101358783B1
KR101358783B1 KR1020097008557A KR20097008557A KR101358783B1 KR 101358783 B1 KR101358783 B1 KR 101358783B1 KR 1020097008557 A KR1020097008557 A KR 1020097008557A KR 20097008557 A KR20097008557 A KR 20097008557A KR 101358783 B1 KR101358783 B1 KR 101358783B1
Authority
KR
South Korea
Prior art keywords
transfer layer
layer
transfer
microstructured
donor film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
KR1020097008557A
Other languages
English (en)
Korean (ko)
Other versions
KR20090077928A (ko
Inventor
존 이. 팟츠
마틴 비. 월크
Original Assignee
삼성디스플레이 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 삼성디스플레이 주식회사 filed Critical 삼성디스플레이 주식회사
Publication of KR20090077928A publication Critical patent/KR20090077928A/ko
Application granted granted Critical
Publication of KR101358783B1 publication Critical patent/KR101358783B1/ko
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
    • B41M5/00—Duplicating or marking methods; Sheet materials for use therein
    • B41M5/26—Thermography ; Marking by high energetic means, e.g. laser otherwise than by burning, and characterised by the material used
    • B41M5/40—Thermography ; Marking by high energetic means, e.g. laser otherwise than by burning, and characterised by the material used characterised by the base backcoat, intermediate, or covering layers, e.g. for thermal transfer dye-donor or dye-receiver sheets; Heat, radiation filtering or absorbing means or layers; combined with other image registration layers or compositions; Special originals for reproduction by thermography
    • B41M5/42—Intermediate, backcoat, or covering layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/10—Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
    • H10D62/117—Shapes of semiconductor bodies
    • H10D62/118—Nanostructure semiconductor bodies
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/18—Deposition of organic active material using non-liquid printing techniques, e.g. thermal transfer printing from a donor sheet
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
    • B41M2205/00—Printing methods or features related to printing methods; Location or type of the layers
    • B41M2205/02—Dye diffusion thermal transfer printing (D2T2)
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
    • B41M2205/00—Printing methods or features related to printing methods; Location or type of the layers
    • B41M2205/38—Intermediate layers; Layers between substrate and imaging layer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy
    • Y02E10/549—Organic PV cells
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Electroluminescent Light Sources (AREA)
  • Thermal Transfer Or Thermal Recording In General (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)
  • Laminated Bodies (AREA)
  • Optical Filters (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Decoration By Transfer Pictures (AREA)
KR1020097008557A 2006-10-20 2007-10-15 구조화된 열 전사 도너 Active KR101358783B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US11/551,276 US7419757B2 (en) 2006-10-20 2006-10-20 Structured thermal transfer donors
US11/551,276 2006-10-20
PCT/US2007/081336 WO2008048913A1 (en) 2006-10-20 2007-10-15 Structured thermal transfer donors

Publications (2)

Publication Number Publication Date
KR20090077928A KR20090077928A (ko) 2009-07-16
KR101358783B1 true KR101358783B1 (ko) 2014-02-07

Family

ID=39314353

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020097008557A Active KR101358783B1 (ko) 2006-10-20 2007-10-15 구조화된 열 전사 도너

Country Status (5)

Country Link
US (2) US7419757B2 (enExample)
JP (2) JP5496673B2 (enExample)
KR (1) KR101358783B1 (enExample)
TW (1) TWI474756B (enExample)
WO (1) WO2008048913A1 (enExample)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7419757B2 (en) * 2006-10-20 2008-09-02 3M Innovative Properties Company Structured thermal transfer donors
US20080233404A1 (en) * 2007-03-22 2008-09-25 3M Innovative Properties Company Microreplication tools and patterns using laser induced thermal embossing
US8182633B2 (en) * 2008-04-29 2012-05-22 Samsung Electronics Co., Ltd. Method of fabricating a flexible display device
JP5982146B2 (ja) * 2011-06-16 2016-08-31 三星ディスプレイ株式會社Ｓａｍｓｕｎｇ Ｄｉｓｐｌａｙ Ｃｏ．，Ｌｔｄ． 有機発光構造物、有機発光構造物の製造方法、有機発光表示装置、及び有機発光表示製造方法
KR101803724B1 (ko) * 2011-06-16 2017-12-04 삼성디스플레이 주식회사 유기 발광 구조물, 유기 발광 구조물의 제조 방법, 유기 발광 표시 장치 및 유기 발광 표시 제조 방법
US9780335B2 (en) * 2012-07-20 2017-10-03 3M Innovative Properties Company Structured lamination transfer films and methods
KR20150012530A (ko) 2013-07-25 2015-02-04 삼성디스플레이 주식회사 전사용 도너 기판 및 유기 발광 표시 장치의 제조 방법
JP6016754B2 (ja) 2013-11-15 2016-10-26 オムロンオートモーティブエレクトロニクス株式会社 組電池電圧検出装置
DE102014210798A1 (de) 2014-06-05 2015-12-17 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Formwerkzeug, Verfahren zur seiner Herstellung und Verwendung sowie Kunststofffolie und Kunststoffbauteil
WO2022130085A1 (en) * 2020-12-18 2022-06-23 3M Innovative Properties Company Optical construction including lens film and mask

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6770337B2 (en) * 1999-11-30 2004-08-03 3M Innovative Properties Company Thermal transfer of microstructured layers

Family Cites Families (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5949919B2 (ja) * 1979-03-13 1984-12-05 東洋メタライジング株式会社 模様を有する転写シ−ト
KR100314563B1 (ko) 1993-10-29 2002-04-24 스프레이그 로버트 월터 미세구조표면을갖는압감접착제
US5882774A (en) 1993-12-21 1999-03-16 Minnesota Mining And Manufacturing Company Optical film
US5725989A (en) 1996-04-15 1998-03-10 Chang; Jeffrey C. Laser addressable thermal transfer imaging element with an interlayer
US6197397B1 (en) 1996-12-31 2001-03-06 3M Innovative Properties Company Adhesives having a microreplicated topography and methods of making and using same
JPH11142633A (ja) * 1997-11-05 1999-05-28 Alps Electric Co Ltd カラーフィルタの製造方法
US6114088A (en) 1999-01-15 2000-09-05 3M Innovative Properties Company Thermal transfer element for forming multilayer devices
JP2000255015A (ja) * 1999-03-10 2000-09-19 Mitsubishi Polyester Film Copp ドライフィルムレジスト用カバーフィルム
US6524675B1 (en) 1999-05-13 2003-02-25 3M Innovative Properties Company Adhesive-back articles
US6560215B1 (en) * 1999-08-24 2003-05-06 Motorola, Inc. Method and apparatus for updating a timing offset in a communication device
JP4590663B2 (ja) 1999-10-29 2010-12-01 セイコーエプソン株式会社 カラーフィルタの製造方法
US6228555B1 (en) * 1999-12-28 2001-05-08 3M Innovative Properties Company Thermal mass transfer donor element
US6284425B1 (en) 1999-12-28 2001-09-04 3M Innovative Properties Thermal transfer donor element having a heat management underlayer
US6855384B1 (en) 2000-09-15 2005-02-15 3M Innovative Properties Company Selective thermal transfer of light emitting polymer blends
JP2003168559A (ja) * 2001-11-30 2003-06-13 Sharp Corp 有機ｌｅｄ用ドナーフィルムと基板、及び、それらを用いた有機ｌｅｄ表示パネルとその製造方法
JP5022552B2 (ja) * 2002-09-26 2012-09-12 セイコーエプソン株式会社 電気光学装置の製造方法及び電気光学装置
US20040067302A1 (en) * 2002-10-08 2004-04-08 Eastman Kodak Company Laser thermal transfer gap control for oled manufacturing
KR100552964B1 (ko) 2003-08-28 2006-02-15 삼성에스디아이 주식회사 평판표시소자용 도너필름 및 그를 이용한유기전계발광소자의 제조방법
KR100635057B1 (ko) 2004-02-20 2006-10-17 삼성에스디아이 주식회사 평판 표시 소자용 도너 필름의 제조 방법 및 이를 이용한유기 전계 발광 소자의 제조 방법
KR20060020030A (ko) * 2004-08-30 2006-03-06 삼성에스디아이 주식회사 도너 기판의 제조방법
KR100793355B1 (ko) 2004-10-05 2008-01-11 삼성에스디아이 주식회사 도너 기판의 제조방법 및 유기전계발광표시장치의 제조방법
KR20060089838A (ko) 2005-02-04 2006-08-09 삼성에스디아이 주식회사 박막전사용 도너 필름
US7419757B2 (en) * 2006-10-20 2008-09-02 3M Innovative Properties Company Structured thermal transfer donors

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6770337B2 (en) * 1999-11-30 2004-08-03 3M Innovative Properties Company Thermal transfer of microstructured layers

Also Published As

Publication number Publication date
US7592120B2 (en) 2009-09-22
KR20090077928A (ko) 2009-07-16
JP2010506771A (ja) 2010-03-04
US20080096124A1 (en) 2008-04-24
TWI474756B (zh) 2015-02-21
US20080286681A1 (en) 2008-11-20
JP5496673B2 (ja) 2014-05-21
TW200836582A (en) 2008-09-01
WO2008048913A1 (en) 2008-04-24
JP5662514B2 (ja) 2015-01-28
JP2013237268A (ja) 2013-11-28
US7419757B2 (en) 2008-09-02

Similar Documents

Publication Publication Date Title
KR101358783B1 (ko) 구조화된 열 전사 도너
TWI432921B (zh) 具有圖案指向層之施體膜
JP5475474B2 (ja) レーザー誘起熱エンボス加工を使用する微細複製工具及びパターン
US7259106B2 (en) Method of making a microelectronic and/or optoelectronic circuitry sheet
US20110207328A1 (en) Methods and apparatus for the manufacture of microstructures
CN104425219A (zh) 制造金属掩模的方法及使用该方法形成的金属掩模
KR20060113734A (ko) 색 전환 소자를 포함하는 전기발광 장치 및 전기발광장치의 제조 방법
WO2013089138A1 (ja) 蒸着マスク及び蒸着マスクの製造方法
JP3890921B2 (ja) 素子の配列方法及び画像表示装置の製造方法
US8486586B2 (en) Laser irradiation device and method of fabricating organic light emitting display device using the same
EP3199987B1 (en) Pattern structure and method of manufacturing the same
TWI808833B (zh) 保持基板及顯示裝置之製造方法
KR100570996B1 (ko) 평판표시소자용 도너필름
JP2003297748A5 (enExample)

Legal Events

Date Code Title Description
PA0105 International application

St.27 status event code: A-0-1-A10-A15-nap-PA0105

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

N231 Notification of change of applicant
PN2301 Change of applicant

St.27 status event code: A-3-3-R10-R13-asn-PN2301

St.27 status event code: A-3-3-R10-R11-asn-PN2301

N231 Notification of change of applicant
PN2301 Change of applicant

St.27 status event code: A-3-3-R10-R13-asn-PN2301

St.27 status event code: A-3-3-R10-R11-asn-PN2301

A201 Request for examination
PA0201 Request for examination

St.27 status event code: A-1-2-D10-D11-exm-PA0201

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-PE0902

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

E701 Decision to grant or registration of patent right
PE0701 Decision of registration

St.27 status event code: A-1-2-D10-D22-exm-PE0701

GRNT Written decision to grant
PR0701 Registration of establishment

St.27 status event code: A-2-4-F10-F11-exm-PR0701

PR1002 Payment of registration fee

St.27 status event code: A-2-2-U10-U12-oth-PR1002

Fee payment year number: 1

PG1601 Publication of registration

St.27 status event code: A-4-4-Q10-Q13-nap-PG1601

R18-X000 Changes to party contact information recorded

St.27 status event code: A-5-5-R10-R18-oth-X000

FPAY Annual fee payment

Payment date: 20170102

Year of fee payment: 4

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 4

FPAY Annual fee payment

Payment date: 20180102

Year of fee payment: 5

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 5

FPAY Annual fee payment

Payment date: 20190102

Year of fee payment: 6

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 6

R18-X000 Changes to party contact information recorded

St.27 status event code: A-5-5-R10-R18-oth-X000

FPAY Annual fee payment

Payment date: 20191223

Year of fee payment: 7

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 7

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 8

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 9

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 10

P22-X000 Classification modified

St.27 status event code: A-4-4-P10-P22-nap-X000

P22-X000 Classification modified

St.27 status event code: A-4-4-P10-P22-nap-X000

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 11

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 12

P22-X000 Classification modified

St.27 status event code: A-4-4-P10-P22-nap-X000

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 13