KR101356726B1 - Method of preparing capacitance type touch panel and capacitance type touch panel prepared by the same - Google Patents

Abstract

The present invention relates to a method of manufacturing a capacitive touch panel and a touch panel manufactured by the same, comprising a first substrate and a first substrate including a first transparent electrostatic electrode pattern, a first lead wire and a connecting electrode pattern on a first transparent insulator film Preparing a second substrate including a second transmissive electrostatic electrode pattern, a second lead wire, and a connecting electrode pattern on the second transmissive insulator film; Coupling the first substrate and the second substrate to each other so that the transmissive electrostatic electrodes of both substrates face each other by an interlayer adhesive, excluding at least the connection electrode portion; Cutting part or all of the edges of the connection electrode pattern portion to which the interlayer adhesive is not added in a thickness direction; And inserting a circuit board between the connection electrodes without the interlayer adhesive, and a touch panel manufactured by the method.

This reduces the amount of expensive adhesive layer attached to the upper part of the ITO layer in order to reduce the reactivity with the ITO, can be manufactured through a simpler process than the existing process, and the bonding force of the circuit board connected to the touch panel It can increase and durability can be increased.

Capacitive, Touch Panel, ITO

Description

Method of manufacturing capacitive touch panel and touch panel manufactured by the same {METHOD OF PREPARING CAPACITANCE TYPE TOUCH PANEL AND CAPACITANCE TYPE TOUCH PANEL PREPARED BY THE SAME}

The present invention relates to a method for manufacturing a capacitive touch panel and a touch panel manufactured thereby, which can reduce the amount of the expensive adhesive layer attached to the upper part of the ITO layer in order to reduce the reactivity with the ITO, more than the conventional process The present invention relates to a method of manufacturing a capacitive touch panel that can be manufactured through a simple process and that can increase durability by increasing a bonding force of a circuit board connected to the touch panel, and a touch panel manufactured thereby.

Generally, a touch panel is an input device that can be easily used by anyone by touching a button with a finger to operate a computer interactively or intuitively. When the touch panel is integrated with a display, the touch panel is contacted with a finger As shown in Fig.

As described above, the touch panel has a resistive film type, a capacitive type film, an infrared type film, an ultrasonic type film, and the like, and a resistive film type is being used. The use of capacitive schemes which are advantageous for the properties will be increased.

The capacitive touch panel, in particular, the laminated structure of the touch screen is a transparent electrostatic electrode (TCO, etc.) made of a transparent conductor (TCO, etc.) on an insulator film having a light transmissive property such as PET or glass, and the edge of the transparent electrostatic electrode A pad made of lead wire such as silver paste is laminated up and down by adding an adhesive layer or an insulator layer, and a specific example thereof is as shown in FIG. 1.

In other words, a transparent electrostatic electrode made of a transparent conductor (TCO, etc.) on the insulator film and a pad made of lead wire such as silver paste at the edge of the transparent electrostatic electrode are used as upper pads and lower pads, respectively, and the ITO is placed on the upper side. It has a structure of two-ply stacked as it is positioned, in this case, a separate drilling operation is required for the electrical connection between the upper pad and the lower pad, a) between the pad to be laminated and b) As each OCA (adhesive layer) inserted between the upper pad and the window has a structure in contact with TCO, in particular ITO, the OCA used here is expensive OCA without residual acid to prevent damage to ITO Must be used, FPCB bonding is not easy to the bonded panel structure, there is a problem that the bonding is not solid.

Therefore, the structure of the capacitive touch panel that can solve this problem must be developed.

In order to solve the above problems, the present invention can reduce the amount of expensive adhesive layer attached to the ITO layer in order to reduce the reactivity with ITO, can be manufactured through a simpler process than the existing process, touch An object of the present invention is to provide a method of manufacturing a capacitive touch panel capable of increasing durability by increasing the bonding force of a circuit board connected to the panel, and a touch panel manufactured thereby.

In order to achieve the above object,

The first transparent electrostatic electrode pattern on the first transparent insulator film, the first substrate including the first lead wire-connecting electrode pattern and the second transparent electrostatic electrode pattern and the second lead wire-connected electrode pattern on the second transparent insulator film Preparing a second substrate comprising a;

Coupling the first substrate and the second substrate to each other so that the transmissive electrostatic electrodes of both substrates face each other by an interlayer adhesive, excluding at least the connection electrode portion;

Cutting part or all of the edges of the connection electrode pattern portion to which the interlayer adhesive is not added in a thickness direction; And

It provides a method of manufacturing a capacitive touch panel comprising the step of connecting by inserting a circuit board between the connection electrodes without the interlayer adhesive.

Also,

A first substrate comprising a first transparent electrostatic electrode pattern and a first lead-connection electrode pattern on the first transparent insulator film;

A second substrate including a second transmissive electrostatic electrode pattern and a second lead wire-connecting electrode pattern on a second transmissive insulator film and facing the first substrate in a symmetrical stacking relationship; And

An interlayer adhesive layer disposed between the first substrate and the second substrate and joining the two substrates, except at least the connection electrode portion;

The first substrate or the second substrate provides a capacitive touch panel, characterized in that the cut portion for cutting in the thickness direction of the edge of the connecting electrode pattern portion is not added to the interlayer adhesive.

According to the method of manufacturing the capacitive touch panel of the present invention and the touch panel manufactured thereby, the structure of ITO faces each other, and since only expensive OCAs need to be used therebetween, it is attached to the upper part of the ITO layer to reduce reactivity with ITO. It is possible to reduce the amount of expensive adhesive layer that is used, and do not require a punching operation for the electrical connection between the upper pad and the lower pad, and can be manufactured by a simpler process than the existing process, and a circuit connected to the touch panel. As the substrate FPCB is sandwiched between the two pads, the bonding force may be increased to increase durability.

Hereinafter, the present invention will be described in detail with reference to the drawings.

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of manufacturing a capacitive touch panel, comprising: a first transmissive electrostatic electrode pattern 14 and a first lead wire-connecting electrode pattern 16 and 18 on a first transmissive insulator film 12. Preparing the second substrate 20 including the second transparent electrostatic electrode pattern 24 and the second lead wire-connecting electrode patterns 26 and 28 on the first substrate 10 and the second transparent insulator film 22. step; The transmissive electrostatic electrodes 14, 24 of both substrates are separated from each other by the interlayer adhesive 30, except at least a portion of the connecting electrodes 18, 28. Combining oppositely; Cutting part or all of the edges of the connection electrode pattern portions (18, 28) to which the interlayer adhesive (30) is not added in the thickness direction; And inserting and connecting the circuit board 50 between the connection electrodes 18 and 28 having no interlayer adhesive 30 therebetween.

That is, as shown in FIG. 2 to FIG. 8, a first transparent electrostatic electrode pattern 14 and a first lead wire-connecting electrode pattern 16 are formed on the first transparent insulator film 12. And a first substrate 10 including 18, and including a second transparent electrostatic electrode pattern 24 and a second lead wire-connecting electrode pattern 26 and 28 on the second transparent insulator film 22. A second substrate 20 is prepared.

Each substrate is formed by depositing ITO (T), such as ITO, on a light-transmitting insulator film such as PET or glass by a known method such as sputtering, and then partially etching the same to form an electrostatic electrode pattern, wherein a metal such as copper is formed thereon. After depositing (M) by a known method such as sputtering, it may be partially etched again to form a lead wire-connecting electrode pattern corresponding to the lead wire and the connecting electrode, thereby preparing the lead wire or the connecting electrode using a silver paste ( It is also possible to fabricate this by applying a paste such as P), and in addition, by depositing ITO and copper on top of PET, respectively, or by etching them together to form an electrostatic electrode pattern and a lead wire-connecting electrode pattern to form each substrate. You can also prepare. Specific examples thereof are as shown in FIGS. 2 and 3. In particular, when the two substrates are stacked to face each other, as shown in the present invention, the step difference caused by the overlap with the lead wire pattern generated at the upper end of the electrostatic electrode is also faced with each other, so the step difference between them is doubled, Preferably, in order to make the absolute value of the step small, the transparent electrostatic electrode patterns 14 and 24 are an ITO layer T, and the lead wire-connecting electrode patterns 16, 18, 26 and 28 are the transparent electrostatic charges. It is preferable that it is a laminated structure which consists of the ITO layer T which continues the ITO layer T which comprises the electrode patterns 14 and 24, and the metal layer M laminated | stacked on the upper surface.

Each substrate prepared as described above is coupled to the first substrate 10 and the second substrate 20 such that the transmissive electrostatic electrodes 14 and 24 of both substrates face each other, as shown in FIG. 2. The adhesive is added between them for bonding, and the adhesive is generally inserted into an adhesive layer such as OCA, and the OCA has no residual acid to prevent damage to ITO. Expensive OCA is used. (However, the window-side OCA 60 inserted between the first substrate 10 and the window 70 can use an inexpensive OCA.)

Here, as shown in the specific example of FIG. 3, the interlayer adhesive 30 has to be opened for insertion of a circuit board, such as a FPCB, so that at least a portion of the interlayer adhesive 30 may be bonded. It is distributed between the substrate and the second substrate.

After the adhesion is made by the interlayer adhesive as described above, a laminate having a structure as shown in FIG. 4 is shown. In this case, the interlayer adhesive such as OCA is indicated by a dotted blue line. Here, the connection electrodes may be in the form of facing each other as shown in Fig. 4, preferably, in order to reduce the thickness, it is preferable to have a displaced arrangement as shown in the specific example in Fig. 8 (a).

Next, in order to facilitate the insertion of a circuit board such as an FPCB, a step of cutting part or all of the edges of the connection electrode pattern portions 18 and 28 to which the interlayer adhesive 30 is not added is performed in the thickness direction. . That is, the cutting is performed to the portion indicated by the red line in FIG. Here, the cut amount may be partially (only the first substrate as shown in FIG. 5 (a) or only the second substrate as shown in FIG. 5A) or all of them (as shown in FIG. 5 (b)). This can be done for both substrates).

In addition, as shown by a red line in FIG. 6, the cutting may be performed by cutting and removing both the edge and the side of the connection electrode pattern portion. This may be easier to insert or other processes such as FPCB because all of the sides are removed to leave only the connecting electrode portion.

Since a part of the substrate may be opened through the cutting, as shown in FIG. 7 and FIG. 8A, the connection electrode 18 may be opened without the interlayer adhesive 30. A circuit board 50 such as an FPCB is inserted between the electrodes 28 to allow electrical connection between the connecting electrode and the circuit board 50. On the other hand, in FIG. 8B, since the connection electrodes are separately arranged, the circuit board connection work becomes more complicated.

In addition, the present invention provides a touch panel which is driven by a capacitive method manufactured by the above method, which includes a first transparent electrostatic electrode pattern 14 and a first lead wire-on the first transparent insulator film 12. A first substrate 10 including connection electrode patterns 16 and 18; The second transparent electrostatic electrode pattern 24 and the second lead wire-connecting electrode patterns 26 and 28 are formed on the second transparent insulator film 22, and the stacking relationship of the first substrate 10 is symmetrically opposite. Seeing second substrate 20; And an interlayer adhesive layer 30 disposed between the first substrate 10 and the second substrate 20 to join the two substrates, except at least the connection electrode portions 18 and 28. The first substrate 10 or the second substrate 20 has a structure having a cutout portion 40 to cut in the thickness direction the edge of the connection electrode pattern portion to which the interlayer adhesive 30 is not added.

Specific examples thereof are as shown in FIGS. 4 to 6, and the structure of each substrate is as described above, and the application region or the OCA insertion region of the interlayer adhesive is also illustrated in FIG. 3. 5, 7 and 8, the cutout may cut only the first substrate, cut only the second substrate, or cut both the first substrate and the second substrate. Can be.

Alternatively, as shown in the specific example of FIG. 6, both sides of the connecting electrode may be removed with respect to both the first substrate and the second substrate, leaving only the connecting electrode portion and removing the remaining portions. have. That is, the cutout may be formed by cutting the edges and side surfaces of the connection electrode pattern portion.

This may be selected depending on the device integrated structure and the thickness of the circuit board to be inserted.

The cutout formed touch panel may further have a circuit board inserted thereto. That is, the electronic device may further include a circuit board 50 inserted between the connection electrodes 18 and 28 without the interlayer adhesive 30 and electrically connected thereto, and specific examples thereof will be described with reference to FIGS. As shown in a), the circuit board is preferably FPCB because it can reduce the thickness of the circuit board.

Here, each of the components of the substrate may have an ITO layer that is continuous with the ITO layer that forms the transmissive electrostatic electrode pattern, and the transmissive electrostatic electrode pattern is an ITO layer, as described above, to reduce the step. It is preferable that it is a laminated structure which consists of a metal layer laminated | stacked on the upper surface. In this case, the metal layer is formed by a known method such as sputtering, and is formed in the form of a thin plate as possible, thereby reducing the step difference of the overlap portion formed at the end of the electrostatic electrode, thereby reducing the adhesion failure and pore generation between the laminated layers. It is preferable.

The present invention described above is not limited to the above-described embodiment and the accompanying drawings, and various modifications and changes made by those skilled in the art without departing from the spirit and scope of the present invention described in the claims below. Changes are also included within the scope of the invention.

1 is a view schematically showing an embodiment of a pad stacking structure of a conventional capacitive touch panel.

2 is a view schematically showing an embodiment of a pad stack structure of the capacitive touch panel of the present invention.

3 is a diagram schematically illustrating a plan view of a first substrate, an interlayer adhesive, and a second substrate, which may be applied to the method of manufacturing a capacitive touch panel of the present invention, respectively.

4 is a plan view illustrating a case where the first substrate, the interlayer adhesive, and the second substrate illustrated in FIG. 3 are stacked, a plan view thereof, and a cross-sectional view thereof.

FIG. 5 is a cross-sectional view showing two examples of a cross section when the incision is made in the cross section shown in FIG.

FIG. 6 is a diagram illustrating a lamination plan view and another cutting method thereof in which the first substrate, the interlayer adhesive, and the second substrate illustrated in FIG. 3 are stacked.

FIG. 7 is a cross-sectional view illustrating two embodiments of a cross section when the circuit board is inserted in FIG. 5.

FIG. 8 is a cross-sectional view illustrating another example of a cross section of the case (a) when the circuit board is inserted into the touch panel of the present invention and an example of the cross section of the conventional case (b).

Description of the Related Art [0002]

10: first substrate 12: first insulator film

14: first transparent electrostatic electrode pattern 16: first lead wire pattern

18: first connection electrode pattern 20: second substrate

22: second insulator film 24: second transparent electrostatic electrode pattern

26: second lead wire pattern 28: second connection electrode pattern

30: interlayer adhesive 40: incision

50: circuit board 60: window side OCA

70: Windows 72: barrier

T: ITO layer M: metal layer

P: paste layer

Claims (7)

The first transparent electrostatic electrode pattern on the first transparent insulator film, the first substrate including the first lead wire-connecting electrode pattern and the second transparent electrostatic electrode pattern and the second lead wire-connected electrode pattern on the second transparent insulator film Preparing a second substrate comprising a; Coupling the first substrate and the second substrate to each other so that the transmissive electrostatic electrodes of both substrates face each other by an interlayer adhesive, excluding at least the connection electrode portion; Cutting part or all of the edges of the connection electrode pattern portion to which the interlayer adhesive is not added in a thickness direction; And And inserting and connecting a circuit board between the connection electrodes without the interlayer adhesive. The method of claim 1, The transmissive electrostatic electrode pattern is an ITO layer, And the lead wire-connecting electrode pattern has a laminated structure including an ITO layer continuous with the ITO layer constituting the transmissive electrostatic electrode pattern and a metal layer stacked on the upper surface thereof. The method of claim 1, Wherein the cutting is a method of manufacturing a capacitive touch panel, characterized in that by removing all the edges and side surfaces of the connection electrode pattern portion. A first substrate comprising a first transparent electrostatic electrode pattern and a first lead wire-connecting electrode pattern on the first transparent insulator film; A second substrate including a second transmissive electrostatic electrode pattern and a second lead wire-connecting electrode pattern on a second transmissive insulator film and facing the first substrate in a symmetrical stacking relationship; And An interlayer adhesive layer disposed between the first substrate and the second substrate and joining the two substrates, except at least the connection electrode portion; The first substrate or the second substrate has a capacitive touch panel, characterized in that having a cut portion for cutting in the thickness direction of the edge of the connecting electrode pattern portion is not added to the interlayer adhesive. 5. The method of claim 4, And a circuit board inserted between the connection electrodes without the interlayer adhesive and electrically connected thereto. The method according to claim 4 or 5, The transmissive electrostatic electrode pattern is an ITO layer, The lead wire-connecting electrode pattern is a capacitive touch panel, characterized in that the laminated structure consisting of the ITO layer and the metal layer laminated on the upper surface of the ITO layer constituting the transparent electrostatic electrode pattern. 5. The method of claim 4, The cutout capacitive touch panel, characterized in that for cutting both the edge and the side of the connecting electrode pattern portion.

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